WO2012122731A1 - 具有散热结构的pcb板及其加工方法 - Google Patents

具有散热结构的pcb板及其加工方法 Download PDF

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Publication number
WO2012122731A1
WO2012122731A1 PCT/CN2011/073826 CN2011073826W WO2012122731A1 WO 2012122731 A1 WO2012122731 A1 WO 2012122731A1 CN 2011073826 W CN2011073826 W CN 2011073826W WO 2012122731 A1 WO2012122731 A1 WO 2012122731A1
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Prior art keywords
heat
pcb
porous
layer
conductive layer
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English (en)
French (fr)
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张田
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/025—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of glass or ceramic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/04—Ceramic interlayers
    • C04B2237/06—Oxidic interlayers
    • C04B2237/062—Oxidic interlayers based on silica or silicates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/343—Alumina or aluminates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/365—Silicon carbide
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Definitions

  • the present invention relates to PCB (PrintedCircuitBoard)
  • PCB printedCircuitBoard
  • the technical field of printed circuit boards in particular, relates to a PCB board having a heat dissipation structure and a processing method thereof.
  • the LEDs are assembled on a PCB.
  • the PCB board In addition to the role of the LED module structure, the PCB board, on the other hand, with the higher output power of the LED, PCB The board must also act as a heat sink to pass the heat generated by the LEDs.
  • the board includes a carrier (ie, a carrier layer) and a conductive layer, and a thermally conductive insulating layer is generally disposed between the conductive layer and the carrier; the carrier is usually a thermally conductive metal having a heat dissipation effect.
  • the heat dissipation speed of the carrier board is relatively slow, and other heat sinks are required to complete the heat dissipation during the electrical connection process.
  • the PCB board is usually specially processed, for example, on the PCB.
  • MCPCB Metal Core PCB
  • the Lightbar (light bar) placed on the PCB is mounted on other heat sinks, because of the PCB
  • the existing practice is in the PCB. Increase the pressure on the contact interface of the board or apply thermal conductive tape or thermal conductive adhesive, thermal conductive silicone ester, thermal conductive adhesive, phase change material, etc., in order to reduce the effect of air on the contact interface on heat transfer.
  • the existing solutions increase the number of processes, which not only have poor heat dissipation, complicated installation, but also increase cost, and are not easy to carry and repair.
  • the main object of the present invention is to provide a PCB having a heat dissipation structure with simple structure, low cost, and good heat dissipation effect.
  • the board also provides a method of processing a PCB having a heat dissipation structure.
  • the present invention provides a PCB having a heat dissipation structure, including a conductive layer and a PCB carrier layer, the PCB
  • the carrier layer is a porous heat conductive layer, and the porous heat conductive layer is filled with a heat conductive liquid or a solid liquid phase heat conductive material; the conductive layer is disposed on the first surface of the porous heat conductive layer, and the porous heat conductive layer is The two sides are the contact interface with the external medium.
  • the porous heat conductive layer is a porous material obtained by mixing and sintering a metal powder and a binder.
  • an insulating layer is further disposed between the conductive layer and the porous thermally conductive layer; and upper and lower sides of the insulating layer are respectively bonded to the conductive layer and the porous thermally conductive layer.
  • the metal powder includes at least one of aluminum, copper, and tungsten.
  • the porous thermally conductive layer is a porous material obtained by mixing and sintering an insulating thermally conductive material powder with a binder.
  • the insulating thermally conductive material powder comprises at least Al2O3, BeO, ALC or SiC One of the powders.
  • the binder comprises at least a CaO-Al2O3-SiO2 system solution, a Mg-Al2O3-SiO2 system solution, One of MnO-MgO-Al2O3-SiO2 system solutions.
  • the thermally conductive liquid is a thermally conductive ink.
  • the invention also provides a PCB processing method with a heat dissipation structure, comprising:
  • the PCB substrate is placed in a high temperature furnace and sintered into a porous material
  • a conductive layer is bonded to the first surface of the porous heat conductive layer, and a heat conductive liquid or a solid liquid phase heat conductive material is infiltrated on the second surface thereof by vacuum or capillary action.
  • the method before the bonding the conductive layer on the first surface of the porous thermally conductive layer, the method further comprises:
  • An insulating layer is bonded to the first surface of the porous thermally conductive layer.
  • the carrier layer of the plate is a porous heat conductive layer made of a porous material having good heat conductivity, and a heat conductive liquid such as a heat conductive ink or a solid liquid phase heat conductive material is infiltrated into the pores of the porous heat conductive layer, when the PCB When the plate becomes hot, the thermal conductivity ink is precipitated from the porous material due to the inconsistent expansion coefficient of the porous material and the thermal conductive ink, and the deposited thermal conductive ink is on the PCB.
  • a heat conductive liquid such as a heat conductive ink or a solid liquid phase heat conductive material
  • the air gap between the contact interface and the external medium is filled by capillary phenomenon, thereby greatly reducing the thermal resistance from the LED to the contact interface, and greatly improving the PCB.
  • the internal thermal conductivity of the board is low in cost, simple in structure and easy to install.
  • FIG. 1 is a cross-sectional view of a first embodiment of a PCB board having a heat dissipation structure of the present invention
  • Figure 2 is a cross-sectional view showing a second embodiment of the PCB having the heat dissipation structure of the present invention
  • FIG. 3 is a schematic flow chart of a method for processing a PCB with a heat dissipation structure shown in FIG. 1;
  • FIG. 4 is a schematic flow chart of a method for processing a PCB having a heat dissipation structure as shown in FIG. 2.
  • the carrier layer of the board is made of a porous heat conducting layer having insulating heat conduction or conductive heat conduction, and a heat conductive liquid such as a heat conductive ink or a solid liquid phase heat conductive material is injected into the hole of the porous heat conductive layer to reduce the LED to the PCB.
  • the thermal resistance between the contact interfaces of the board improves the thermal conductivity of the PCB.
  • a PCB having a heat dissipation structure includes a conductive layer 101 and a PCB carrier layer. 102.
  • the PCB carrier layer 102 is a porous heat conduction layer made of a porous material having good heat conductivity.
  • the hole of the porous heat conduction layer is filled with a heat conductive liquid such as a heat conductive ink or a solid liquid phase heat conductive material.
  • the porous heat conducting layer comprises a first surface (not shown) and a second surface 1021 opposite to the first surface, the conductive layer 101
  • the first surface of the porous thermally conductive layer is disposed and bonded to the first surface of the porous thermally conductive layer, and the conductive layer 101 is provided with a plurality of LEDs.
  • the second side 1021 of the porous thermally conductive layer is a contact interface with the external medium.
  • thermal ink when the PCB is due to LED When the luminescence is heated, the thermal conductivity ink is precipitated from the porous material due to the inconsistent expansion coefficient of the porous material constituting the porous thermal conductive layer and the thermal conductive ink, and the deposited thermal conductive ink is on the PCB.
  • the contact interface of the board fills the air gap between the contact interface and the external medium by capillary phenomenon, thereby greatly reducing the thermal resistance from the LED to the contact interface and improving the internal thermal conductivity of the PCB.
  • the porous thermally conductive layer may be a porous material having insulating and thermally conductive properties obtained by mixing and sintering an insulating thermally conductive material powder with a binder.
  • the insulating thermally conductive material powder may be Al2O3, BeO, ALC or SiC One of the powders, or a mixture of any two or more thereof, and the like.
  • the binder may be a CaO-Al2O3-SiO2 system solution, a Mg-Al2O3-SiO2 system solution or One of MnO-MgO-Al2O3-SiO2 system solutions, or a mixed liquid of any two or any two or more thereof.
  • Insulating thermally conductive material powders and binders such as Al2O3, BeO, ALC or SiC ( CaO-Al2O3-SiO2 system solution, Mg-Al2O3-SiO2 system solution or MnO-MgO-Al2O3-SiO2
  • the solution is mixed and formed into an initial shape by a process such as module pressing, mold injection, extrusion or rolling, and then sintered in a high temperature furnace to form a porous material having a certain strength and hardness. Then, the porous material is subjected to a process such as processing and shaping to form a porous heat conductive layer.
  • the above-mentioned heat-conductive PCB is formed by infiltrating a heat-conducting liquid by vacuum or capillary action (or infiltrating a solid-liquid phase heat-conducting material by the above two methods at a certain temperature).
  • the present embodiment is made of a porous heat conductive layer made of a porous material having good heat conductivity as a PCB.
  • a carrier layer of the plate and a thermal conductive liquid such as a thermal conductive ink or a solid-liquid phase heat conductive material is infiltrated into the pores of the porous thermally conductive layer, when the PCB
  • the thermal conductivity ink is precipitated from the porous material due to the inconsistent expansion coefficient of the porous material and the heat transfer oil, and the deposited thermal conductive ink is on the PCB.
  • the air gap between the contact interface and the external medium is filled by capillary phenomenon, which greatly reduces the thermal resistance from the LED to the contact interface, and improves the PCB.
  • the internal thermal conductivity of the board, and the cost of the embodiment is low, the installation is convenient and fast, and the carrier layer of the PCB board is evenly pressed, so that the temperature of the LED is more easily controlled.
  • a PCB having a heat dissipation structure according to a second embodiment of the present invention
  • the plate is similar to the first embodiment described above, except that the porous thermally conductive layer 202 is made of a conductive and thermally conductive porous material, and an insulating layer is disposed between the conductive layer 201 and the porous thermally conductive layer 202.
  • the upper and lower surfaces of the insulating layer 203 (not shown) are bonded to the conductive layer 201 and the porous heat conductive layer 202, respectively.
  • This structural design is mainly for increasing the insulation between the conductive layer 201 and the porous thermally conductive layer 202, and at the same time, due to the conductive layer 201.
  • An insulating layer 203 is added between the porous thermally conductive layer 202 and, therefore, the porous thermally conductive layer 202 in this embodiment. It is also possible to press and sinter the porous powder of the metal powder and the binder to form a porous material having electrical and thermal conductivity.
  • the metal powder may be aluminum, copper or tungsten or the like.
  • Metal powder and binder such as aluminum, copper or tungsten (CaO-Al2O3-SiO2 system solution, Mg-Al2O3-SiO2) System solution or MnO-MgO-Al2O3-SiO2
  • the solution is mixed and formed into an initial shape by a process such as module pressing, mold injection, extrusion or rolling, and then sintered in a high temperature furnace to form a porous material having a certain strength and hardness. Then, the porous material is processed and shaped to form a porous heat conductive layer. 202.
  • the first surface of the processed porous thermally conductive layer 202 is coated with an insulating layer 203 and a conductive layer 201 from the inside to the outside to form the PCB shown in FIG. Board structure.
  • the second side of the porous heat conducting layer 202 is 2021
  • the above-mentioned heat-conductive PCB is formed by infiltrating a heat-conducting liquid by vacuum or capillary action (or infiltrating a solid-liquid phase heat-conducting material by the above two methods at a certain temperature).
  • an embodiment of the present invention provides a PCB having a heat dissipation structure for the PCB having the heat dissipation structure illustrated in FIG. 1 .
  • a method of processing a board which includes:
  • Step S101 mixing the insulating and thermally conductive material powder with the adhesive, and pressing the module, mold injection, extrusion or rolling into a PCB Substrate
  • Step S102 the PCB substrate is placed in a high temperature furnace and sintered into a porous material
  • Step S103 shaping the porous material to form a porous heat conducting layer
  • Step S104 The conductive layer is adhered to the first surface of the porous heat conductive layer, and the heat conductive liquid or the solid liquid phase heat conductive material is infiltrated by vacuum or capillary action on the second surface thereof.
  • the insulating thermally conductive material powder in this embodiment may be Al2O3, BeO, ALC or SiC. Any one of powders, or a mixture of any two or more kinds, and the like.
  • the binder may be a CaO-Al2O3-SiO2 system solution, a Mg-Al2O3-SiO2 system solution or A MnO-MgO-Al2O3-SiO2 system solution, or a mixed liquid of any two or more of them.
  • FIG. 4 another embodiment of the present invention provides a heat dissipation structure for the PCB board having the heat dissipation structure illustrated in FIG. 2 .
  • a method of processing a PCB which includes:
  • Step S201 mixing the metal powder with the adhesive, and pressing into a PCB substrate by module pressing, mold injection, extrusion or rolling;
  • Step S202 the PCB substrate is placed in a high temperature furnace and sintered into a porous material
  • Step S203 shaping the porous material to form a porous heat conducting layer
  • Step S204 bonding the first surface of the porous heat conductive layer to the first surface of the insulating layer
  • Step S205 The conductive layer is bonded to the second surface of the insulating layer, and the heat conductive liquid or the solid liquid phase heat conductive material is infiltrated by vacuum or capillary action on the second surface of the porous heat conductive layer.
  • the metal powder may be any one of aluminum, copper or tungsten, or a mixture of any two or more thereof.
  • the binder can be CaO-Al2O3-SiO2 system solution, Mg-Al2O3-SiO2 system solution or MnO-MgO-Al2O3-SiO2 A solution, or a mixed liquid of any two or more of them.
  • the carrier layer of the plate is a porous heat conductive layer made of a porous material having good heat conductivity, and a heat conductive liquid such as a heat conductive ink or a solid liquid phase heat conductive material is infiltrated into the pores of the porous heat conductive layer, when the PCB When the plate becomes hot, the thermal conductivity ink is precipitated from the porous material due to the inconsistent expansion coefficient of the porous material and the thermal conductive ink, and the deposited thermal conductive ink is on the PCB.
  • a heat conductive liquid such as a heat conductive ink or a solid liquid phase heat conductive material
  • the air gap between the contact interface and the external medium is filled by capillary phenomenon, thereby greatly reducing the thermal resistance from the LED to the contact interface, and greatly improving the PCB.
  • the internal thermal conductivity of the board is low in cost, simple in structure and easy to install.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
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Description

具有散热结构的PCB板及其加工方法
技术领域
本发明涉及 PCB （ PrintedCircuitBoard ，印制电路板）技术领域，尤其涉及一种具有散热结构的 PCB 板及其加工方法。
背景技术
现有的 LED （ Light Emitting Diode ，发光二极管）产品应用中，通常需要将多个 LED 组装在一块 PCB 板上。 PCB 板除了扮演承载 LED模块 结构的角色外，另一方面，随着 LED 输出 功率 越来越高， PCB 板还必须扮演散热的角色，以将 LED 产生的热量传递出去。
传统的用于 LED 的 PCB 板包括载板（即载体层）和导电层，在导电层和载板之间通常设有导热绝缘层；载板通常为具有导热散热作用的导热金属。但是载板的散热速度相对较慢，在电器连接过程中还需依靠其他的散热装置来完成散热。
为了解决 LED 散热的问题，通常会对 PCB 板作特殊处理，比如，在 PCB 板上设置可导热散热的散热鳍片或其它散热部件，或者在 FR4 PCB 上钻孔灌铜，采用 Metal Core PCB （金属基印制板， MCPCB ）等等。但是当把设置在 PCB 板上的 Lightbar （灯条）装到其他散热部件上时，因为 PCB 板与散热部件的接触界面之间通常会存在很多的沟壑或空隙，形成很薄的空气层，由于空气是热的不良导体，热阻较大，导致 LED 不容易通过 PCB 和散热部件进行散热。为了解决传热界面上的热阻问题，现有的做法有在 PCB 板接触界面上加大压力或者贴导热胶带或者涂导热胶、导热硅酯、导热黏合剂、相转变材料等，以此来减少接触界面上的空气对传热的减弱作用。但是，现有的解决办法增加了工序，不仅散热效果不佳、安装复杂，而且提高了成本，同时也不便于携带和修复。
发明内容
本发明的主要目的在于提供一种结构简单、成本低且散热效果好的具有散热结构的 PCB 板，同时还提供一种具有散热结构的 PCB 板的加工方法。
为了达到上述目的，本发明提出一种具有散热结构的 PCB 板，包括导电层及 PCB 载体层，所述 PCB 载体层为多孔导热层，所述多孔导热层的孔内注有导热液体或固液相变导热材料；所述导电层设置在所述多孔导热层的第一面，所述多孔导热层的第二面为与外界介质的接触界面。
优选地，所述多孔导热层为金属粉末与粘结剂混合后压制烧结而成的多孔材料。
优选地，还包括绝缘层，位于所述导电层与所述多孔导热层之间；所述绝缘层的上下两面分别与所述导电层与所述多孔导热层粘接。
优选地，所述金属粉末至少包括铝、铜、钨中的一种。
优选地，所述多孔导热层为绝缘导热材料粉末与粘结剂混合后压制烧结而成的多孔材料。
优选地，所述绝缘导热材料粉末至少包括 Al2O3 、 BeO 、 ALC 或 SiC 粉末中的一种。
优选地，所述粘结剂至少包括 CaO-Al2O3-SiO2 系溶液、 Mg-Al2O3-SiO2 系溶液、 MnO-MgO- Al2O3-SiO2 系溶液中的一种。
优选地，所述导热液体为导热油墨。
本发明还提出一种具有散热结构的 PCB 板加工方法，包括：
将金属粉末或绝缘导热材料粉末与粘接剂混合，通过模组压制、模具注射、挤压或轧制成 PCB 基材；
将所述 PCB 基材放入高温炉中烧结成多孔材料；
对所述多孔材料进行整形加工，形成多孔导热层；
在所述多孔导热层的第一面粘接导电层，在其第二面通过真空或毛细作用渗入导热液体或固液相变导热材料。
优选地，所述在多孔导热层的第一面粘接导电层之前还包括：
在所述多孔导热层的第一面粘接绝缘层。
本发明提出的一种具有散热结构的 PCB 板及其加工方法， PCB 板的载体层为导热良好的多孔材料制成的多孔导热层，并在多孔导热层的孔中渗入导热油墨等导热液体或固液相变导热材料，当 PCB 板变热时，由于多孔材料和导热油墨的膨胀系数不一致，导热油墨从多孔材料中析出，析出的导热油墨在 PCB 板的接触界面中通过毛细现象填充了接触界面与外界介质的空气间隙，从而大大降低了从 LED 到接触界面的热阻，大大提高了 PCB 板的内部导热性，而且成本低，结构简单，安装方便。
附图说明
图 1 是本发明具有散热结构的 PCB 板的第一实施例的截面剖视图；
图 2 是本发明具有散热结构的 PCB 板的第二实施例的截面剖视图；
图 3 是图 1 所示的具有散热结构的 PCB 板加工方法的流程示意图；
图 4 是图 2 所示的具有散热结构的 PCB 板加工方法的流程示意图。
本发明目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
具体实施方式
本发明技术方案总体思路是：将 PCB 板的载体层制成具有绝缘导热或导电导热的多孔导热层，并在多孔导热层的孔内注有导热油墨等导热液体或固液相变导热材料，以减少 LED 到 PCB 板的接触界面之间的热阻，提高 PCB 板的导热效果。
以下将结合附图及实施例，对实现发明目的的技术方案作详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
请参照图 1 ，本发明第一实施例提出的具有散热结构的 PCB 板，包括导电层 101 及 PCB 载体层 102 ， PCB 载体层 102 是由导热良好的多孔材料制成的多孔导热层，多孔导热层的孔内注有导热油墨等导热液体或固液相变导热材料。
其中，多孔导热层包括第一面（图中未示出）以及与第一面相对的第二面 1021 ，导电层 101 设置在多孔导热层的第一面并与多孔导热层的第一面粘接，导电层 101 上设有多个 LED 。该多孔导热层的第二面 1021 为与外界介质接触的接触界面。
以导热油墨为例，当 PCB 板由于 LED 的发光而变热时，由于构成多孔导热层的多孔材料和导热油墨的膨胀系数不一致，导热油墨从多孔材料中析出，析出的导热油墨在 PCB 板的接触界面中通过毛细现象填充了接触界面与外界介质的空气间隙，从而大大降低了从 LED 到接触界面的热阻，提高了 PCB 板的内部导热性。
在本实施例中，多孔导热层可以为绝缘导热材料粉末与粘结剂混合后压制烧结而成的具有绝缘导热性能的多孔材料等。
绝缘导热材料粉末可以是 Al2O3 、 BeO 、 ALC 或 SiC 粉末中的一种，或其中任意两种或两种以上的混合物等。
粘结剂可以是 CaO-Al2O3-SiO2 系溶液、 Mg-Al2O3-SiO2 系溶液或 MnO-MgO- Al2O3-SiO2 系溶液中的一种，或其中任意两种或任意两种以上的混合液体等。
本实施例 PCB 板的具体制作过程为：
采用 Al2O3 、 BeO 、 ALC 或 SiC 等绝缘导热材料粉末与粘结剂（ CaO-Al2O3-SiO2 系溶液、 Mg-Al2O3-SiO2 系溶液或 MnO-MgO- Al2O3-SiO2 系溶液）混在一起，通过模组压制，模具注射，挤压或者轧制等工序制成初始形状，然后放入高温炉中烧结形成具有一定强度和硬度的多孔材料。然后对多孔材料进行加工整形等工序形成多孔导热层。把加工整形好的多孔导热层的第一面铺上导电层 101 ，形成图 1 中所示的 PCB 板结构。最后把多孔导热层的第二面 1021 通过真空或者毛细作用渗入导热液体（或者在一定温度下通过以上两种方法渗入固液相变导热材料），形成上述的导热良好的 PCB 板。
相比现有技术，本实施例由导热良好的多孔材料制成多孔导热层作为 PCB 板的载体层，并在多孔导热层的孔中渗入导热油墨等导热液体或固液相变导热材料，当 PCB 板变热时，由于多孔材料和导热油的膨胀系数不一致，导热油墨从多孔材料中析出，析出的导热油墨在 PCB 板的接触界面中通过毛细现象填充了接触界面与外界介质的空气间隙，大大降低了从 LED 到接触界面的热阻，提高了 PCB 板的内部导热性，而且本实施例成本低，安装方便快速， PCB 板的载体层受压均匀，使得 LED 的温度更容易控制。
请参照图 2 ，本发明第二实施例提出的具有散热结构的 PCB 板与上述第一实施例相似，其不同之处在于：本实施例中多孔导热层 202 为导电导热的多孔材料制成，在导电层 201 与多孔导热层 202 之间设置有绝缘层 203 ，绝缘层 203 的上下两面（图中未标出）分别与导电层 201 与多孔导热层 202 粘接。
此种结构设计主要是为了增加导电层 201 与多孔导热层 202 之间的绝缘性，同时，由于在导电层 201 与多孔导热层 202 之间增设了绝缘层 203 ，因此，本实施例中的多孔导热层 202 还可以为金属粉末与粘结剂混合后压制烧结而成的具有导电导热性能的多孔材料。该金属粉末可以是铝、铜或钨等。本实施例 PCB 板的具体制作过程为：
采用铝、铜或钨等金属粉末与粘结剂（ CaO-Al2O3-SiO2 系溶液、 Mg-Al2O3-SiO2 系溶液或 MnO-MgO- Al2O3-SiO2 系溶液）混在一起，通过模组压制，模具注射，挤压或者轧制等工序制成初始形状，然后放入高温炉中烧结形成具有一定强度和硬度的多孔材料。然后对多孔材料进行加工整形等工序形成多孔导热层 202 。把加工整形好的多孔导热层 202 的第一面由内到外分别铺上一层绝缘层 203 和导电层 201 ，形成图 2 中所示的 PCB 板结构。最后把多孔导热层 202 的第二面 2021 通过真空或者毛细作用渗入导热液体（或者在一定温度下通过以上两种方法渗入固液相变导热材料），形成上述的导热良好的 PCB 板。
请参照图 3 ，针对图 1 所示的具有散热结构的 PCB 板，本发明一实施例提出一种具有散热结构的 PCB 板的加工方法，其包括：
步骤 S101 ，将绝缘导热材料粉末与粘接剂混合，通过模组压制、模具注射、挤压或轧制成 PCB 基材；
步骤 S102 ，将 PCB 基材放入高温炉中烧结成多孔材料；
步骤 S103 ，对多孔材料进行整形加工，形成多孔导热层；
步骤 S104 ，在多孔导热层的第一面粘接导电层，在其第二面通过真空或毛细作用渗入导热液体或固液相变导热材料。
本实施例中绝缘导热材料粉末可以是 Al2O3 、 BeO 、 ALC 或 SiC 粉末中任意一种，或任意两种或两种以上的混合物等。
粘结剂可以是 CaO-Al2O3-SiO2 系溶液、 Mg-Al2O3-SiO2 系溶液或 MnO-MgO- Al2O3-SiO2 系溶液，或其中任意两种或两种以上的混合液体等。
请参照图 4 ，针对图 2 所示的具有散热结构的 PCB 板，本发明另一实施例提出一种具有散热结构的 PCB 板的加工方法，其包括：
步骤 S201 ，将金属粉末与粘接剂混合，通过模组压制、模具注射、挤压或轧制成 PCB 基材；
步骤 S202 ，将 PCB 基材放入高温炉中烧结成多孔材料；
步骤 S203 ，对多孔材料进行整形加工，形成多孔导热层；
步骤 S204 ，将多孔导热层的第一面与绝缘层的第一面粘接；
步骤 S205 ，在绝缘层的第二面粘接导电层，在多孔导热层的第二面通过真空或毛细作用渗入导热液体或固液相变导热材料。
本实施例中该金属粉末可以是铝、铜或钨中任意一种，或其中任意两种或两种以上的混合物等。粘结剂可以是 CaO-Al2O3-SiO2 系溶液、 Mg-Al2O3-SiO2 系溶液或 MnO-MgO- Al2O3-SiO2 系溶液，或者其中任意两种或两种以上的混合液体等。
本发明实施例具有散热结构的 PCB 板及其加工方法， PCB 板的载体层为导热良好的多孔材料制成的多孔导热层，并在多孔导热层的孔中渗入导热油墨等导热液体或固液相变导热材料，当 PCB 板变热时，由于多孔材料和导热油墨的膨胀系数不一致，导热油墨从多孔材料中析出，析出的导热油墨在 PCB 板的接触界面中通过毛细现象填充了接触界面与外界介质的空气间隙，从而大大降低了从 LED 到接触界面的热阻，大大提高了 PCB 板的内部导热性，而且成本低，结构简单，安装方便。
以上所述仅为本发明的优选实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (10)

  1. 一种具有散热结构的PCB板，包括导电层及PCB载体层，其特征在于，所述PCB载体层为多孔导热层，所述多孔导热层的孔内注有导热液体或固液相变导热材料；所述导电层设置在所述多孔导热层的第一面，所述多孔导热层的第二面为与外界介质的接触界面。
  2. 根据权利要求1所述的PCB板，其特征在于，所述多孔导热层为金属粉末与粘结剂混合后压制烧结而成的多孔材料。
  3. 根据权利要求2所述的PCB板，其特征在于，还包括绝缘层，位于所述导电层与所述多孔导热层之间；所述绝缘层的上下两面分别与所述导电层与所述多孔导热层粘接。
  4. 根据权利要求2所述的PCB板，其特征在于，所述金属粉末至少包括铝、铜、钨中的一种。
  5. 根据权利要求1所述的PCB板，其特征在于，所述多孔导热层为绝缘导热材料粉末与粘结剂混合后压制烧结而成的多孔材料。
  6. 根据权利要求5所述的PCB板，其特征在于，所述绝缘导热材料粉末至少包括Al2O3、BeO、ALC、SiC粉末中的一种。
  7. 根据权利要求2-6中任一项所述的PCB板，其特征在于，所述粘结剂至少包括CaO-Al2O3-SiO2系溶液、Mg-Al2O3-SiO2系溶液、MnO-MgO- Al2O3-SiO2系溶液中的一种。
  8. 根据权利要求1-6中任一项所述的PCB板，其特征在于，所述导热液体为导热油墨。
  9. 一种具有散热结构的PCB板加工方法，其特征在于，包括：
    将金属粉末或绝缘导热材料粉末与粘接剂混合，通过模组压制、模具注射、挤压或轧制成PCB基材；
    将所述PCB基材放入高温炉中烧结成多孔材料；
    对所述多孔材料进行整形加工，形成多孔导热层；
    在所述多孔导热层的第一面粘接导电层，在其第二面通过真空或毛细作用渗入导热液体或固液相变导热材料。
  10. 根据权利要求9所述的方法，其特征在于，所述在多孔导热层的第一面粘接导电层之前还包括：
    在所述多孔导热层的第一面粘接绝缘层。
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