WO2012096460A1

WO2012096460A1 - Variable led package and led package arrangement using the same, and variable led package assembly

Info

Publication number: WO2012096460A1
Application number: PCT/KR2011/010142
Authority: WO
Inventors: Zun Kim
Original assignee: Lumexbio Pharm Co., Ltd.
Priority date: 2011-01-11
Filing date: 2011-12-27
Publication date: 2012-07-19
Also published as: KR101066471B1

Abstract

Disclosed are a variable LED package and an LED illumination arrangement using LED semiconductor devices. The present invention provides a variable LED package, a variable LED package assembly, an assembly, and an LED illumination arrangement which realize a new type of band-shaped LED illumination arrangement which can be bent in an arc-like shape while including a plurality of LED devices while increasing an efficiency related to use of light and being widely applied for various purposes such as a security light or a safety light, and realize a new type of illumination device where a plurality of band-shaped LED illumination units and a cylindrical support unit are combined while increasing a utility of the illumination device using LEDs as light sources and widening application fields as illumination devices.

Description

VARIABLE LED PACKAGE AND LED PACKAGE ARRANGEMENT USING THE SAME, AND VARIABLE LED PACKAGE ASSEMBLY

The present invention relates to a variable LED package and an LED package arrangement using the same, and more particularly to an LED light source easily detachably mounted and applicable to generally widely produced illumination apparatuses.

In general, light emitting diodes (LEDs) are semiconductor devices adapted to emit light when a voltage is applied thereto in a forward direction. Such LEDs use a field emission effect and are being used for various purposes until now. The LEDs are expected to replace fluorescent lights and light bulbs in the future.

The LEDs have advantages of low power consumption, a semi-permanent life span, impact-resistance, and high precision. In addition, they hardly cause environmental contamination since they do not use mercury or discharge gases. Further, since they do not require time for preheating, they can achieve a quick response.

Despite the above advantages, their use has been very limited to some display fields for stock price boards, electronic displays of the subway, and display screens of various electric/electronic devices, due to their lack of variety in colors and low brightness as compared with other illumination apparatuses.

After intensive research for improving the brightness of LEDs, power LEDs having high brightness are now being used for traffic lights, interior illuminations and brake lamps of vehicles, direction lamps, backlight illuminations for mobile phones and PDAs, and other decorative illuminations. In particular, with the development of blue and white LEDs, they can be used in full color and as a result their applications can be expanded to large-sized outdoor electronic displays or various illuminations.

With the steady and gradual improvement in the LED technology, various high-brightness LEDs have been developed one after another, and technologies for applying LEDs to lamp apparatuses are being studied continuously.

For example, discharge lamps such as fluorescent lights, light bulbs, or halogen lamps are being widely used as light sources of interior illuminations for homes or offices, or light sources of outdoor illuminations such as street lamps or security lights. However, since such discharge lamps consume much energy due to their high drive voltages and a voltage boost of electric power and discharge gases such as mercury harmful to human bodies or environments when disposed.

Accordingly, a demand for studies and developments of new illumination apparatuses which can replace illumination apparatuses such as currently used fluorescent lights is rising. In this regard, many illumination apparatuses employing LEDs as light sources have been recently suggested to lower their power consumption, increase illumination level, and enhance durability.

However, most illumination apparatuses employing conventional LEDs have a simple form where a plurality of LED devices are arranged on a plane, so there is a limit in increasing efficiency in relation to use of light. Further, due to a limit in a form of a planar structure, they are advantageous in the aspects of utility and applications.

In recent years, many LED illumination products have been manufactured and used, and economical efficiency is being highly emphasized when practicality and efficiency are evaluated.

The backlights of lamps are rarely suitable for direct use of illuminations, but may be received in illumination apparatuses so that distribution of backlights can be converted to a form suitable for illuminations, creating the best interior atmosphere. However, in spite of that, it is very important to design their optical functions.

While it is actually very difficult and costly to improve an efficiency of a product by more than 10% through development of LED chips with the current technology, it is relatively easy and inexpensive to improve the efficiency by more than 10% through development of LEDs by designing an optical shape of a reflective plate using a low-efficiency LED chip.

An overall efficiency including a life span, a total amount of light, color rendering, and an optical efficiency is the most important issue for illuminations using current LEDs.

Companies developing and producing LED chips are continuing to develop LED chips having high optical efficiencies for LED light sources most suitable for the issue of such LED illuminations.

Meanwhile, in order to generally maximize an efficiency of a reflective plate, one or more phenomena are complexly accompanied among optical phenomena if electromagnetic waves are radiated and introduced into the reflective plate.

It is important to develop LED light sources matched with such reflective plates using the phenomena, in which case reflection, absorption, penetration, selective reflection, wave change, refraction, polarization, etc., of light should be considered.

While a reflective plate of an LED light source usually reflects, collects, and distributes light through a design of a prism or a lens, double costs are generated through a design of a separate reflective plate or lens and there is a limit in applying the reflective plate to a generally widely used illumination apparatus.

Most illumination apparatuses are designed to have an arc-like shape or a spherical shape, and are used by using specular reflection, diffusive reflection, and spread reflection, which is a type of specular reflection.

LED illumination packages suitable for general illumination apparatuses whose lamp efficiencies are maximized though an improved reflection efficiency have been developed to achieve a better optical efficiency in LEDs showing straight propagation of light through attachment of a lens on a front surface of the LED packages and expansion of light sources. However, although light sources showing straight propagation of light may be expanded, it is difficult to mount the light sources to a generally used illumination apparatus.

It is apparent that a 360 degree light source may be used to maximize the efficiency of a reflective plate in manufacturing an LED package.

General methods of obtaining a 360 degree light source to be used an illumination light source using an LED include a method disclosed in Korean Patent No. 10-0883327 and a method disclosed in Korean Patent Application Publication No. 10-2007-0117692.

However, the method disclosed in Korean Patent No. 10-0883327 has the following disadvantages.

First, it is difficult to completely fix a metallic LED package in a 360 degree circular shape without using a heat-dissipating member at an upper end of the apparatus.

Second, the apparatus cannot achieve a high optical efficiency due to a wide gap between metallic packages, and it is difficult to achieve a high reflection efficiency of diffused light due to dotted light sources in a 360 degree form.

Third, since the apparatus has a predetermined pattern using a reflective plate at an upper portion thereof, it is disadvantageous in an aspect of maximizing a reflection efficiency.

Fourth, there is a limit in mounting a general illumination device due to a disadvantage of maintaining a cylindrical rear surface for exposure of a semicircular shape and a support unit having a large volume.

In addition, the method disclosed in Korean Patent Application Publication No. 10-2007-0117692 has the following disadvantages.

First, although a material of a PCB has not been suggested clearly, for example, when an FR4 material is used, a PCB substrate having a minimum thickness of 0.2 mm or more is flexible but cannot be bent in a perfect circular rod-like shape having at least 13 mm.

Here, when an LED is wire-bonded onto another material, i.e. an amine-based flexible substrate, it may be bonded but requires a circular rod as in Korean Patent No. 10-0883327 due to a heat dissipation problem

Second, an system may be used for the purpose of a general black light or a surface light source, but there is a limit in using it as a general LED light source for illumination having a high reflection efficiency.

In addition, there exists a method of using an LED package body using side surface light as a pole and a plurality of LED chips are directly wire-bonded to a side surface of the LED package through leads. However, according to the method, productivity is remarkably lowered due to an inconvenience of wire-bonding the LED chips while rotating them. Further, its manufacturing costs are high.

For example, since after the lead chips for wire-bonding are attached and dried while their surfaces are rotated, the surfaces are manually wire-bonded and a cylindrical cap formed of epoxy or silicon may be attached and dried, much time and high costs are required.

Therefore, the present invention has been made in view of the above-mentioned problems, and the present invention provides a package for achieving a 360 degree side surface light source, considering that it is very difficult to achieve a reflection efficiency of a general illumination due to a very low optical efficiency caused by a linear property and radiation of light.

When a 360 degree side surface light source is secured and an efficiency of a reflective plate is used in a conventional illumination, an optical efficiency of 100 to 150% can be obtained. Thus, an LED package of a 360 degree light source using a reflective plate and an illumination arrangement using the same are required.

In particular, the present invention also provides a variable LED package and an LED package arrangement which can improve an efficiency related to use of light and can be widely used for various purposes such as a security light or a safety light, by realizing a new band-shaped LED illumination arrangement equipped with a plurality of LED devices, which can be bent in an arc-like shape.

The present invention also provides a variable LED package and an LED package arrangement which can increase a utility of an illumination device using an LED as a light source and widen an application field for various illumination devices, by realizing a new illumination device where a plurality of band-shaped LED illumination units are combined with a cylindrical support unit.

Meanwhile, the present invention also provides a variable LED package assembly for achieving a highly efficient light source, considering the disadvantages of a general illumination, for example, a low efficiency of a widely used reflective plate and a difficulty in installing the reflective plate in a general illumination device other than an LED dedicated illumination device.

The present invention also provides an LED package which can be easily applied to an illumination arrangement and can achieve a high efficiency at low cost using a reflective plate of a general illumination device, by manufacturing an LED package which can be easily bent or deformed in a circular, linear, or semicircular shape, considering the disadvantages of the LED package depending on the linearity.

The present invention also provides an LED package assembly which can achieve improved productivity at low cost, for example, by allowing the LED package to achieve mass-production and uniform quality through a smooth production process due to a package design where wire-bonding is easily accomplished to radiate heat by themselves.

That is, the present invention provides an LED package assembly which can be manufactured in a circular shape without using a separate heat-dissipating member or fixing member, while an internal support unit maintains a circular shape even if it does not maintain a cylindrical shape, and can also have a heat-dissipating function by itself.

The present invention also provides an LED package suitable for achieving a 360 degree light source without using a separate support unit.

That is, the present invention provides a variable LED package which can be formed in a semicircular, circular, or planar shape by itself without using a cylindrical rear support unit.

In accordance with an aspect of the present invention, there is provided an LED package arrangement including: a plurality of LED illumination units each including a band-shaped base having connecting portions at opposite ends thereof, a plurality of molding parts disposed adjacent to each other in a row along the lengthwise direction of the base, and a plurality of LED devices located at centers of the molding parts and wire-bonded and connected to the base, the LED illumination units being able to be bent to have an arc-like shape; and a rod-shaped support unit acting as a support body where the LED illumination units are installed, being equipped with a connecting member electrically connected to a power source at one end thereof, and having a plurality of connecting portions disposed along opposite radial sides thereof along the lengthwise direction thereof, wherein the plurality of LED illumination units are installed continuously along the lengthwise direction of the rod shape to be bent in a semicircular shape along a circumferential surface of the support unit and are electrically connected to each other, whereby light can be irradiated and illuminated in all directions from an entire circumferential surface of the illumination arrangement.

Preferably, the support unit may be formed with a single integral body or with two bodies split along the lengthwise direction thereof to have a semicircular cross-section.

In particular, the variable LED package assembly of the present invention has the following features.

The variable LED package includes: an LED illumination unit including a band-shaped base having connecting portions at opposite ends thereof, a plurality of molding parts disposed adjacent to each other in a row along the lengthwise direction of the base, and a plurality of LED devices located at centers of the molding parts and wire-bonded and connected to the base, the LED illumination units being able to be bent to have an arc-like shape. A plurality of variable LED packages each including a plurality of LED illumination units which are bent in a circular or semicircular shape are arranged in parallel on one base plate. The plurality of molding parts, the LED devices disposed within the molding parts, and the wires wire-bonded between the LED devices and the base are collectively molded on the base plate so that the variable LED packages can be separated into pieces.

The variable LED package and the LED package arrangement according to the present invention have the following advantages.

First, the present invention employs a band-shaped LED illumination unit which can be bent in a circular shape to be used, and thus it can be widely applied to various fields where various shapes such as a rod-like shape or a plate-like shape are required.

Second, since an illumination arrangement where a band-shaped LED illumination unit and a cylindrical support unit are combined can be realized, the present invention can be highly applicable as a security light, a safety light, or a 3-wave lamp.

Third, a lens may be conventionally attached to a front surface of an LED Package to obtain an excellent optical efficiency in an LED emitting light of straight propagation and to achieve an expansion efficiency of a light source, but it can possibly expand a light source of straight propagation but it is a little difficult to mount the lens to a widely used general illumination device.

Thus, the present invention supplements the disadvantages of the LED package depending on straight propagation, and can obtain an LED package which can be easily bent and deformed in a circular shape while being easily used in an illumination arrangement and achieving a high efficiency at low costs.

Fourth, in particular, since the conventional illumination LED is high-priced by using a high-output LED chip of more than 1 Watt and cannot easily secure a 360 degree light source as it is wire-bonded to a plane and is made of a metallic material, it is difficult to secure a 360 degree light source and it is impossible to wire-bond the light source in an automatic wire-bonding machine due to its volume and size. Accordingly, it is high-priced in an aspect of manufacturing costs by using a manual device, but since the variable LED package of the present invention is formed with a package arrangement connected through an array of a predetermined pattern when an LED wire is bonded, it is designed to be wire-bonded by using an automatic wire-bonding device and is low-priced. In particular, a bare chip of 0.064 to 0.12 is used instead of a high-output LED chip of more than 1 Watt to disperse a light source necessary for illumination, making it possible to secure an optical efficiency, reduce costs, and reduce costs of an auxiliary heat-dissipating unit which are pointed out as one of the disadvantages of a high-output LED while reducing manufacturing costs by 40%.

In particular, after LEDs are wire-bonded on a plane through an automatic device, they may be designed to be deformed in a planar, semicircular, or circular shape.

Fifth, an angle of a hole cup for bonding central LEDs can be designed to secure a maximum amount of side light in a planar, semicircular, and circular shape and realize a design for maximizing an optical efficiency of a reflective plate. Further, a certain angle can be maintained at articulations of modules, making it possible to deform the entire shape of the modules in a semicircular or circular shape.

Sixth, when the present invention is applied to a plane, it can be used in a conventional backlight for illumination such as a sign board. In particular, since arrays connected lengthwise to each other are deformed in a semicircular shape, they can be designed to be easily used in an illumination device in a form of a fluorescent light using LEDs. When deformed in a circular shape, since they may be erected to form a rod-like shape or be laid down, they can be mounted to a conventional international illumination device and can be easily manufactured in various forms to manufacture an illumination device.

Accordingly, the present invention can be installed in a general illumination device and can be applied as a light source having a high efficiency. Further, the light source according to the present invention can be easily bent to be manufactured in a circular, linear, or semicircular shape. In addition, according to the present invention, a 360 degree light source can be achieved without using a separate support unit, securing high efficiency at low cost. Furthermore, the present invention can improve productivity, lower price, and achieve mass-production and uniform quality due to improvement of manufacturing efficiency.

The foregoing and other objects, features and advantages of the present invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings in which:

FIGS. 1A, 1B, and 1C are perspective views illustrating a variable LED package according to an embodiment of the present invention;

FIGS. 2A and 2B are sectional views illustrating a variable LED package according to another embodiment of the present invention;

FIGS. 3A and 3B are perspective views illustrating an LED package arrangement using a variable LED package according to an embodiment of the present invention;

FIG. 4 is a perspective view illustrating an LED package arrangement using a variable LED package according to another embodiment of the present invention;

FIG. 5 is a perspective view illustrating a variable LED package according to another embodiment of the present invention;

FIG. 6 is a perspective view illustrating an LED package arrangement using a variable LED package according to another embodiment of the present invention;

FIGS. 7A to 7C are perspective views illustrating a variable LED package according to another embodiment of the present invention;

FIG. 8 is a sectional view illustrating a variable LED package according to another embodiment of the present invention;

FIG. 9 is a plan view illustrating a state where variable LED packages according to another embodiment of the present invention are separated into pieces;

FIG. 10 is a perspective view illustrating a variable LED package according to another embodiment of the present invention; and

FIGS. 11A and 11B are perspective views illustrating a variable LED package assembly according to an embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIGS. 1A to 1C are perspective views illustrating a variable LED package according to an embodiment of the present invention. FIGS. 2A and 2B are sectional views illustrating a variable LED package according to another embodiment of the present invention.

As illustrated in FIGS. 1A to 1C, 2A, and 2B, the variable LED package, i.e. an LED illumination unit 14 is a substantial illumination means using an LED device 13, and can be bent in an arc-like shape and can be used to be wound on and attached to a circumferential surface of a support unit 16 to be described later.

To this end, the LED illumination unit 14 includes a base 11 having a long rectangular band-like shape. The base 11 is formed with a thin metal plate so as to be easily bent to be connected to the LED device 13. Aperture-shaped connecting portions 10a for electrical connection to connecting portions 10b formed in the support unit 16 are formed at opposite ends of the base 11.

Since the base 11 can be bent lengthwise, it may be bent in a semicircular arc-like shape as in an example of the present invention. The base 11 may be bent to have various shapes such as a rectangle and a polygon depending on a shape of the support unit 16 which may have various cross-sections.

Here, the base 11 is preferably formed of a copper material or a metal material coated with silver, considering a rate of electric currents and durability.

A plurality of cutaway portions are preferably formed in the base 11 so that the base 11 can be bent more easily. A plurality of circular apertures are preferably formed in the base 11 at locations adjacent to the connecting portions 10a so that the base 11 is easily bent when it is bent by approximately 90 degrees to connect the connecting portions 10a at the opposite ends of the base 11 to the connection portions 10b of the support unit 16.

The LED illumination unit 14 includes a plurality of molding parts 12 for protecting LED devices 13.

The molding parts 12 may be formed of a plastic resin such as , and are integrally formed on the base 11 while having a substantially rectangular frame-like shape.

That is, the molding parts 12 may be integrally formed over an upper surface and a bottom surface of the base 11.

A plurality of molding parts 12 are disposed adjacent to each other in a row in parallel along the lengthwise direction of the base 11, and the LED devices 13 are accommodated within the frames of the molding parts 12 respectively.

The molding parts 12 should not generate an interference at their borders so that the base 11 is bent naturally. To this end, the molding parts 12 have a predetermined gap therebetween and ends of the molding parts 12 have inclined surfaces 17 so that an interference can be effectively avoided when the molding parts 12 are bent. As a result, the molding parts 12 can be easily bent in a desired shape, e.g. a semicircular shape on the whole.

Then, the inclined surfaces 17 formed at the ends of the molding parts 12 are preferably formed on upper and lower sides of the base 11.

In particular, a plurality of heat-dissipating apertures 18 are formed on a rear surface of each of the molding parts 12 integrally formed with the LED illumination unit 14. Accordingly, heat generated by the LED devices 13 can be efficiently discharged, and the LED devices 13 can be protected from the influence of heat maximally. As a result, the heat-dissipating apertures 18 enhance a durability of the LED illumination unit 14 and extend a life span of the LED illumination unit 14.

Inner peripheries of each of the molding parts 12, i.e. inner peripheries of the frame structure have surfaces inclined at a predetermined angle, e.g. approximately 120 degrees, and accordingly, light irradiated from the LED device 13 is guided and reflected along the inclined surfaces, making it possible to secure a wide range of diffusion of light.

The LED illumination unit 14 includes the LED devices 13 for substantially performing an illumination function.

The LED devices 13 are located within the molding parts 12 respectively, and in particular, are installed at the centers of the molding parts 12.

That is, hole cups 24 are formed at inner central regions of the molding parts 12 at a center of the base 11, and the LED devices 13 are fixed to and installed in the hole cups 24 through bonding while being accommodated within the hole cups 24 respectively.

The hole cups 24 have wall surfaces inclined at an angle of 120 degrees, and accordingly, the efficiencies of reflective light sources of the LED devices 13 can be maximized.

In particular, since a fluorescent material 26 is applied on inner surfaces of the hole cups 24 after the LED devices 13 are bonded, costs can be reduced. Further, since transparent epoxy 25 or a transparent silicon is applied to inner regions of the molding parts 12 except for the hole cups 24, light can be penetrated and diffused.

The optimum size of the hole cups 24 for maximizing these effects is a depth of 0.25 mm and a diameter of 0.45 mm.

Here, if the depth of the hole cups 24 is not 0.25 mm, the fluorescent material flows and spreads out to the periphery, resulting in a disagreement of the features of light and colors.

Further, when the fluorescent material is applied to an entire inner region of the molding part including the hole cup, its firmness is degraded considering an increase of costs due to use of the fluorescent material, causing a degradation of efficiency due to little diffusion of light. Meanwhile, a chip, i.e. an LED device can be easily bonded through a hole cup of a predetermined size, and if after a fluorescent material is applied only to a periphery of a hole cup, transparent epoxy or silicon is applied to the other peripheries, light can be diffused or manufacturing costs can be reduced.

Such an LED device 13 is wire-bonded and electrically connected to the base 11.

Then, the wires of the LED devices 13 bonded and connected to the base 11 may extend at opposite ends thereof in two rows.

In particular, when the LED devices 13 are wire-bonded according to an example of the present invention, the LED illumination unit 14 is bent in an arc-like shape to be used after the LED devices 13 are wire-boned while being laid lengthwise on a plane. Accordingly, the LED illumination unit 14 can improve work efficiency, productivity, and work precision as compared with the conventional LED illumination arrangements.

Preferably, the LED devices 13 are installed such that positioning recesses are formed in the base 11 so that the LED devices 13 can be positioned and accommodated in the positioning recesses.

The inner regions of the molding parts 12 corresponding to the LED devices 13 are preferably finished with a transparent resin or protect the LED devices 13 from an exterior environment by a separate cover means mounted thereto.

Accordingly, the LED devices 13 are wire-bonded to the base 11 to receive electric power and are turned on to irradiate light.

FIGS. 3A and 3B are perspective views illustrating an LED package arrangement using a variable LED package according to an embodiment of the present invention.

FIGS. 3A and 3B illustrate an example of realizing an LED illumination arrangement through a combination of the LED illumination unit 14 and the support unit 16.

The support unit 16 includes two pieces split from a circular rod-shaped body along the lengthwise direction thereof and having a semicircular cross-section. The LED illumination units 14 are attached to and installed in the circumferences of the semicircular cross-sections along the lengthwise direction of the rod.

That is, with the connecting portions 10a at opposite ends of the LED illumination unit 14 being bent inward to face each other by approximately 90 degrees, a region to which the LED devices 13 and the molding parts 12 pertain is attached to a circumferential surface of the LED illumination unit 14 and the connecting portions 10a at opposite sides bent inward are attached to inner planes of the LED illumination unit 14 and are connected to the connecting portions 10b of the LED illumination unit 14.

Then, when the two split pieces of the support unit 16 are combined together, an insulating plate 20 is interposed between the contacting planes of the

pieces

16a and 16b of the support unit 16 to insulate the facing connecting portions.

Although not illustrated in the drawings, a PCB substrate electrically connected to a connecting member 15 is attached to inner surfaces of the

pieces

16a and 16b of the support unit 16 and is connected to the connecting portions 10b so that electric power can be supplied to the LED illumination unit 14.

It is apparent that the PCB substrate may be directly connected to the connecting portions 10a of the LED illumination unit 14 without using the connecting portions 10b as another example.

Thus, a plurality of LED illumination units 14 are attached to the support member 16 continuously along the lengthwise direction of the support member 16 so that the LED illumination units 14 and the support unit 16 can finish one LED illumination arrangement.

It is apparent that since the connecting portions 10b are connected to an internal electrode terminal (not shown), the connecting portions 10a of the LED illumination unit 14 and the connecting portions 10b of the support unit 16 are electrically connected to each other.

The two split pieces of the support unit 16 may be combined into a single circular rod-like shape. Threaded portions 23 are formed at upper ends of the

pieces

16a and 16b of the support unit 16 to be coupled to a cap 19 whose inner surface is also threaded so that the

pieces

16a and 16b of the support unit 16 can be combined into a single integral support unit 16.

A connector 22 is formed at a lower end of the support unit 16, and a connecting portion 15 electrically connected to a power source is mounted on the connector 22 so that electric power can be supplied to the LED devices 13 of the LED illumination unit 14 through an internal electrode of the support unit 16.

In particular, a passage (not shown) through which a cooling medium such as distilled water or oil, which is supplied from the outside, can flow may be formed in an interior of the support unit 16, and accordingly, the LED illumination unit 14 including the support unit 16, i.e. the LED illumination arrangement can be maximally protected from heat radiated from a number of LED devices due to a heat transfer operation (cooling operation) performed by the cooling medium.

FIG. 4 is a perspective view illustrating an LED package arrangement using a variable LED package according to another embodiment of the present invention.

FIG. 4 illustrates an example of forming the support member 16 where the LED illumination units 14 are installed into a single integral body.

That is, the support unit 16 has a long rod-like shape having a circular cross-section and has grooves 21 extending along the lengthwise direction of the rod on a circumferential surface thereof on opposite sides having a phase difference of 180 degrees, and a plurality of connecting portions 10b disposed at an interval along the lengthwise direction of the rod are formed on the opposite walls of the grooves 21.

Accordingly, when the LED illumination units 14 where the opposite connecting portions 10a are bent inward by approximately 90 degrees are installed in the support unit 16 having the grooves 21, if a region to which the LED devices 13 and the molding parts 12 pertain is attached to a circumferential surface of the LED illumination unit 14 and the connecting portions 10b in the grooves 21 and the connecting portions 10a of the LED illumination unit 14 while the connecting portions 10a bent inward are inserted within the grooves 21, the LED illumination unit 14 using the support member 16 having a single body is completely installed.

It is apparent that the connecting member 15 may be connected to the support unit 16 of this case like the above-described split support unit 16, and the support unit 16 may include an internal electrode connected to the connecting portions 10b and a passage for flowing of a cooling medium.

In the LED illumination arrangement of the present invention, a plurality of LED illumination units 14 are attached to and installed in a circumference of the circular rod-shaped support unit 16. Accordingly, light can be irradiated in all directions without being limited to a specific direction, and the LED illumination arrangement can be utilized for a security light, a safety light, or a 3-wave lamp.

In the LED illumination arrangement, if the LED illumination unit and the reflective plate are disposed on its front and rear sides to be combined with each other, an illumination effect can be maximized, for example, by doubling an amount of light irradiated to the front due to an increase of a reflection efficiency of the reflective plate.

Meanwhile, an example of the present invention provides an LED illumination arrangement where the band-shaped LED illumination units are combined with a plane.

For example, the present invention provides an LED illumination arrangement where after a plurality of LED illumination units are disposed on a rectangular plate-shaped substrate (support unit) to have a band-like shape, that is, a plurality of LED illumination units each including a long band-like base having connecting portions at opposite ends thereof, a plurality of molding parts disposed adjacent to each other in parallel in a row along the lengthwise direction of the base, and a plurality of LED devices located at the centers of the molding parts and wire-bonded to the base to be connected to the base are arranged, they are electrically connected to the substrate to which electric power is supplied from the outside.

In the LED illumination arrangement, a plurality of LED illumination units may be variously combined and arranged on a plane to have a structure of 3 by 3 or 4 by 4. The LED illumination arrangement may be widely applied in various illumination fields such as for an outdoor electronic display for advertising.

FIG. 5 is a perspective view illustrating a variable LED package according to another embodiment of the present invention.

FIG. 5 illustrates an LED illumination unit 14 including a plurality of LED devices 13 for substantially irradiating light and which can be bent to have a circular shape.

Like the above-described embodiment, the LED illumination unit 14 also includes a long rectangular band-like base 11. The base 11 has a thin metal plate-like shape for its connection to the LED devices 13 and so as to be bent easily. Aperture contact points 27 and protruding contact points 28 are formed at opposite ends of the base 11 such that a pair of an aperture contact point 27 and a protruding contact point 28 form a (+) electrode whereas the other pair of an aperture contact point 27 and a protruding contact point 28 form a (-) electrode.

Here, a diameter of the protruding contact points 28 is larger than an inner diameter of the aperture contact points 27 so that they cannot be separated once they are coupled to each other.

Since the base 11 may be bent lengthwise, it may be used while being bent to have a circular shape.

The LED illumination unit 14 includes a plurality of molding parts 12 for protecting the LED devices 13.

Here, each of the molding parts 12 has a hexagonal shape, so it can increase a reflection efficiency of light further as compared with a rectangular shape.

A plurality of molding parts 12 are disposed adjacent to each other in a row in parallel along the lengthwise direction of the base 11, and the LED devices 13 are accommodated within the molding parts 12, i.e. the frames of the molding parts 12 respectively.

A gap is disposed between the adjacent molding parts to exclude an interference between the molding parts 12 when the base 11 is bent. Further, since ends of the molding parts 12 adjacent to each other include inclined surfaces 17, an interference can be effectively avoided between the molding parts 12 when the molding parts 12 are bent. As a result, they can be easily bent to have a desired shape, e.g. a perfect circle on the whole.

Then, the inclined surfaces 17 formed at ends of the molding parts 12 are formed on upper and lower sides with respect to the base 11.

In particular, a plurality of heat-dissipating apertures are preferably formed on a rear surface of each of the molding parts 12 integrally formed with the LED illumination unit 14 to efficiently radiate heat generated by the LED devices 13.

Inner peripheries of each of the molding parts 12, i.e. inner peripheries of the rectangular frame includes surfaces inclined at a certain angle, i.e. at approximately 120 degrees, and accordingly lights irradiated from the LED devices 13 are guided along and reflected on the inclined surfaces, securing a wide diffusion range of light.

Such an LED device 13 is wire-bonded and electrically connected to the base 11.

A plurality of (+) electrode plates 29 and a plurality of (-) electrode plates 30 are formed in the base 11 of the LED illumination unit 14, the electrode plates corresponding to the number of the LED devices 13 and being disposed in a row along the lengthwise direction of the base 11.

In particular, the (+) electrode plates 29 and the (-) electrode plates 30 have triangular shapes respectively and are formed alternately by one pitch such that when two adjacent LED illumination units 14 are connected to each other, the electrode plates of the LED illumination units 14 are fitted with each other to be connected to each other.

The electrode plates are connected to each other through soldering etc.

FIG. 6 is a perspective view illustrating an LED package arrangement using a variable LED package according to another embodiment of the present invention.

FIG. 6 illustrates an example of bending LED illumination units 14 on a circular bar-shaped support unit 16 in a circular shape to install the LED illumination units 14

The support unit 16 has a long rod-like shape having a circular cross-section, and a connecting member for supply of electric power is mounted to one side of a lower end of the support unit 16.

Accordingly, if an LED illumination unit 14 is bent in a circular shape to be mounted on a circumference of the support unit 16 and the recessed contact points 27 and the protruding contact points 28 are coupled to each other, it is wound and mounted on the support unit 16. If other LED illumination units 14 are mounted on a circumference of the support unit 16 continuously, the adjacent LED illumination units 14 are electrically connected to each other through the electrode plates, and are connected to each other on one support unit 16.

FIGS. 7A to 7C are perspective views illustrating a variable LED package according to another embodiment of the present invention. FIG. 8 is a sectional view illustrating a variable LED package according to another embodiment of the present invention.

As illustrated in FIGS. 7A to 7C and 8, the variable LED package, i.e. the LED illumination unit 170 is a substantial illumination unit using LED devices 120, and can be bent in a circular or semicircular shape. The LED illumination unit 170 is wound and attached on a circumferential surface of a support unit 210 to be described later.

To this end, the LED illumination unit 170 includes a long rectangular band-shaped base 110. The base 110 is formed with a thin metal plate for its connection to the LED devices 120 and to be easily bent.

Bonding portions

100a and 100b for connection to wires 200 of the support unit 210 or bonding to each other are formed at opposite ends of the base 110.

Since the base 110 can be bent lengthwise, it may be bent in a circular or semicircular shape as in an embodiment of the present invention. The base 100 may be bent to have various shapes such a rectangle and a polygon depending on a shape of the support unit 16 which may have various cross-sections.

Here, the base 100 is preferably formed of a stainless steel, a copper material or a metal material coated with silver, considering a rate of electric currents and durability.

In particular, the

bonding portions

100a and 100b formed at opposite sides of the base 110 have triangular shapes, and accordingly, when the base 100 is rolled in a circular shape such that opposite ends of the base 100 contact each other, the opposite contact portions 110a and 110b are fitted with each other and are attached and bonded to each other.

Apertures

240a and 240b are formed in the

bonding portions

100a and 100b, and fused solder is filled in the

apertures

240a and 240b located to contact each other during a soldering operation for bonding, firmly coupling the

bonding portions

100a and 100b.

The LED illumination unit 170 includes a plurality of molding parts 140 for protecting the LED devices 120.

The molding parts 140 may be formed of a plastic resin such as , and are integrally formed on the base 110.

Then, the molding parts 140 may be various shapes such as a rectangle, and an example of the present invention provides the molding parts 140 each having a hexagonal body formed on an upper surface of the base 110 while accommodating an LED device 120.

The molding parts 140 may be integrally formed over an upper surface and a bottom surface of the base 110.

A plurality of molding parts 140 are disposed adjacent to each other in a row in parallel along the lengthwise direction of the base 11, and the LED devices 120 are accommodated within the molding parts 140, i.e. within the hexagonal frames of the molding parts 140 respectively.

The molding parts 140 should not generate an interference at their borders so that the base 110 is bent naturally. To this end, the molding parts 140 have a predetermined gap therebetween and ends of the molding parts 140 have inclined surfaces so that an interference can be effectively avoided when the molding parts 140 are bent. As a result, the molding parts 140 can be easily bent in a desired shape, e.g. a semicircular shape on the whole.

Then, the inclined surfaces formed at the ends of the molding parts 140 are preferably formed on both upper and lower sides of the base 110.

Each of the molding parts 140 includes two insulating bands 230 formed in two rows in parallel along the lengthwise direction of the base 110, and the insulating bands 230 serve to divide the molding part 140 into a central region with respect to the width of the base 110 to which the LED device 120 pertains and opposite outer regions with respect to the width of the base 110 to which the wire-bonded wires 220 are connected, electrically insulating the regions.

Here, the insulating bands 230 are formed together with the molding parts 140 when the molding parts 140 are molded in the base 110, and cutaway portion 270 (see FIG. 9) passing through a base plate 180 (see FIG. 9) which is a mother body of the base 110 and disposed in parallel in two rows. The cutaway portions 270 are filled with a resin when the molding parts 140 are molded.

In particular, a plurality of heat-dissipating apertures 130 are formed on a rear surface of each of the molding parts 140 integrally formed with the LED illumination unit 170, and accordingly, heat generated by the LED devices 120 can be effectively radiated, maximally protecting the LED devices 120 from heat. As a result, the heat-dissipating apertures 130 enhance a durability of the LED illumination unit 170 and extend a life span of the LED illumination unit 170.

Inner peripheries of each of the molding parts 140, i.e., inner peripheries of the hexagonal frame structure have surfaces inclined at a predetermined angle, e.g., approximately 120 degrees, and accordingly, light irradiated from the LED device 120 is guided and reflected along the inclined surfaces, making it possible to secure a wide range of diffusion of light.

The LED illumination unit 170 includes the LED devices 120 for substantially performing an illumination function.

The LED devices 120 are located within the molding parts 140 respectively, and in particular, are installed at the centers of the molding parts 140.

That is, the LED devices 120 are located in inner central regions of the molding parts 140, e.g. in regions between the insulating bands 230, and are fixed and installed through bonding.

Meanwhile, as illustrated in FIG. 10, as another example, two LED devices 120 may be disposed in each of the molding parts 140.

In this case, as compared with an LED device having a capacity of the two LED devices, an amount of radiated heat is reduced and an amount of light can become larger.

The LED devices 120 may be wire-bonded and electrically connected to the base 110.

Then, the wire-bonded portions of the LED devices 120 connected to the base 110 may have a form where two wires 220 in two rows extend and connect to the base 110 at opposite sides of the LED devices 120.

The inner regions of the molding parts 140 corresponding to the LED devices 120 are preferably finished with a transparent resin 150 or protect the LED devices 120 from an exterior environment by a separate cover means mounted thereto.

Accordingly, the LED devices 120 are wire-bonded to the base 110 to receive electric power and are turned on to irradiate light.

In particular, the present invention provides a variable LED package assembly where a plurality of variable LED packages are combined together.

The variable LED package assembly is advantageous in an aspect of manufacturing since several variable LED package units may be manufactured collectively and may be separated into pieces.

In an example of the present invention, the LED devices 120 may be wire-bonded to a plane while being spread out lengthwise on the plane and are bent in a circular or semicircular shape when used, so they can achieve excellent work efficiency, productivity, and work precision as compared with the conventional illumination apparatuses to which a wire-bonding operation is performed while they are bent circularly.

For example, as illustrated in FIG. 9, a rectangular base plate 180 is prepared, and a plurality of variable LED package units, i.e., a plurality of LED illumination units 170 are disposed on the base plate 180 in several rows.

Here, each of the LED illumination units 170 includes a base 110 having

bonding portions

100a and 100b at opposite ends thereof, a plurality of molding parts 140 accommodating the LED devices 120, and a plurality of LED devices 120 located within the molding parts 140 and sealed by a resin 150.

The plurality of LED illumination units 170 are simultaneously molded on the base plate 180. For example, two rows of cutaway portions 270 are formed at locations where the LED illumination units 170 are formed. Several molding parts 140 are formed at an interval at locations where the two rows of cutaway portions 270 are wire-bonded and sealed with a resin while the LED devices 140 and are mounted within the molding parts 140.

That is, since a molding process for the molding parts 140 for molding the LED illumination units 170, a soldering process for the LED devices 140, a wire-bonding process, and a sealing process of a resin are collectively performed on one base plate 180, efficiency is improved in aspects of manufacturing and production.

After the variable LED packages formed in one base plate 180 are separated into pieces, they may be assembled in the support unit 210 to form a circular or semicircular shape.

FIGS. 11A and 11B illustrate an example of realizing one LED illumination arrangement through combination of the LED illumination units 170 and the support units 210.

The support unit 210 acts as a support body where the LED illumination units 170 are installed, and has a circular rod-like shape and also has grooves 190 formed in parallel at opposite sides along the lengthwise direction of the rod.

Wires 200 are installed in the grooves 190 of the support unit 210, and are electrically connected to the LED illumination units 210 assembled around the support unit 210 to supply electric power.

Here, the wires 200 extending from ends of the support members 210 are electrically connected to an external power supply (not shown), and electric power can be supplied through the extending portions.

For example, as illustrated in FIG. 11B, after the cylindrical LED packages are soldered in parallel through the soldering portions 160, they are bonded to both electrodes of upper and lower packages through soldering via insulating bus bars having a U-shaped cross-section and manufactured within the grooves 190 through insert injection-molding to be fixed and electrically connected.

The wires of the (+) and (-) electrodes may be designed to be electrically connected to other pin terminals (not shown) connected to the outside.

Here, an external terminal refers to a general power supply insertion unit used at a lower end of a microphone, wherein a body and a power supply part can be easily separated from and attached to each other. The standard and interval of the wires may be designed to be compatible to be freely connected and easily attached by using pin terminals.

Considering that the variable LED package of the present invention is designed to irradiate heat without including an internal semicircular or circular column, wires may be connected to each other such that one pole can be connected to an upper portion of the variable LED package and another pole can be grounded to a lower portion of the variable LED package though soldering of FIG. 5B.

A plurality of LED illumination units 170 are rolled circularly on a circumferential surface of the support unit 210, for example, one LED illumination unit 170 is bent in a circular shape or two LED illumination units 170 are bent such that two semicircular shapes form one circle. They are disposed continuously along the lengthwise direction of the rod, and are installed in the support units 210 to be electrically connected to the wires 200.

Here, contacting ends of the LED illumination units 170 bent in a circular or semicircular form to be installed (they are opposite ends when one LED illumination unit forms a circular shape and respective ends when two LED illumination units form semicircular shapes) may be connected to the soldering portions 160 formed through soldering of the overlapping bonding portions.

Threaded

portions

260a and 260b are formed at opposite ends of the support units 210, wherein since nut members 250 are coupled to the threaded portions 260 and 260b, the LED illumination units continuously attached along the lengthwise direction of the rod 170 can be prevented from being separated and can be attached without forming a gap therebetween.

In the LED illumination arrangement of the present invention, a plurality of LED illumination units are attached to and installed in a circumference of the circular rod-shaped support unit 160. Accordingly, light can be irradiated in all directions without being limited to a specific direction, and the LED illumination arrangement can be utilized for a security light, a safety light, or a 3-wave lamp.

Therefore, according to the variable LED package and the LED package arrangement of the present invention, after a total amount of light of an LED lamp manufactured by a multi-type LED package where twelve LED chips having the 3528 size are wire-bonded as in the example of the present invention, it can be seen that a package of the present invention where twelve packages form one unit increases a light efficiency further as compared with an high-output LED using an LED chip of 1 Watt in a general metal type package.

This proves that even a low-efficiency LED chip (3528 size) whose optical efficiency is low as compared with a general high-output (1 Watt) LED package forming one unit can disperse light and heat through an LED wire-bonded by the LED package of the present invention having a regular interval, a regular reflection angle, and a heat-dissipating structure in a complex unit, improving efficiency.

Although several exemplary embodiments of the present invention have been described for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims.

Accordingly, even when an LED chip having a general efficiency feature or an LED chip with low efficiency is used, it can maintain an efficiency in a basic amount of light maximally according to a type and a feature of an LED package and can be designed to be easily coupled to an illumination apparatus and an application product. Therefore, since a maximum efficiency can be expected, the present invention has a suitable industrial applicability in an aspect of cost.

Claims

An LED package arrangement comprising:
a plurality of LED illumination units (14) each including a band-shaped base (11) having connecting portions (10a) at opposite ends thereof, a plurality of molding parts (12) disposed adjacent to each other in a row along the lengthwise direction of the base (11), and a plurality of LED devices (13) located at centers of the molding parts (12) and wire-bonded and connected to the base (11), the LED illumination units (14) being able to be bent to have an arc-like shape; and
a rod-shaped support unit (16) acting as a support body where the LED illumination units (14) are installed, being equipped with a connecting member (15) electrically connected to a power source at one end thereof, and having a plurality of connecting portions (10b) disposed along opposite radial sides thereof along the lengthwise direction thereof,
wherein the plurality of LED illumination units (14) are installed continuously along the lengthwise direction of the rod shape to be bent in a semicircular shape along a circumferential surface of the support unit (16) and are electrically connected to each other, and
wherein a plurality of heat-dissipating apertures (18) are formed on a rear surface of each of the molding parts (12) in the LED illumination units to dissipate heat generated by the LED devices (13).
The LED package arrangement as claimed in claim 1, wherein the molding parts (12) of each of the LED illumination units (14) are disposed to have a predetermined gap therebetween to avoid an interference therebetween when the LED illumination unit (14) is bent.
The LED package arrangement as claimed in claim 1 or 2, wherein adjacent ends of the molding parts (12) of each of the LED illumination units (14) have inclined surfaces (17) respectively to avoid an interference therebetween when the LED illumination unit (14) is bent.
The LED package arrangement as claimed in claim 1, wherein the base of each of the LED illumination units (14) is formed of a copper material or a metal coated with silver.
The LED package arrangement as claimed in claim 1, wherein the support unit (16) is formed with a single integral body or with two bodies split along the lengthwise direction thereof to have a semicircular cross-section.
The LED package arrangement as claimed in claim 1 or 5, wherein a passage for circulating a cooling medium is formed in an interior of the support unit (16) to cool the LED package arrangement on the whole.
A variable LED package comprising:
an LED illumination unit (14) including a band-shaped base (11) having connecting portions (10a) at opposite ends thereof, a plurality of molding parts (12) disposed adjacent to each other in a row along the lengthwise direction of the base (11), and a plurality of LED devices (13) located at centers of the molding parts (12) and wire-bonded and connected to the base (11), the LED illumination units (14) being able to be bent to have an arc-like shape,
wherein the molding parts (12) of the LED illumination unit (14) are disposed to have a predetermined gap therebetween to avoid an interference therebetween when the LED illumination unit (14) is bent.
The variable LED package as claimed in claim 7, wherein adjacent ends of the molding parts (12) of the LED illumination unit (14) have inclined surfaces (17) respectively to avoid an interference therebetween when the LED illumination unit (14) is bent.
A variable LED package comprising:
an LED illumination unit (14) including a band-shaped base (11) having recessed contact points (27) and protruding contact points (28) at opposite ends thereof respectively, a plurality of molding parts (12) disposed adjacent to each other in a row along the lengthwise direction of the base (11), and a plurality of LED devices (13) located at centers of the molding parts (12) and wire-bonded and connected to the base (11), the LED illumination units (14) being able to be bent to have an arc-like shape,
wherein the molding parts (12) have a hexagonal shape.
The variable LED package as claimed in claim 9, wherein a plurality of (+) electrode plates (29) and a plurality of (-) electrode plates (30) are formed in the base (11) of the LED illumination unit (14), the electrode plates corresponding to the number of the LED devices (13) and being disposed in a row along the lengthwise direction of the base (11).
The variable LED package as claimed in claim 9, wherein the (+) electrode plates (29) and the (-) electrode plates (30) have triangular shapes respectively and are formed alternately by one pitch such that when two adjacent LED illumination units (14) are connected to each other, the electrode plates of the LED illumination units (14) are fitted with each other to be connected to each other.
A variable LED package assembly comprising:
a plurality of variable LED packages each having an LED illumination unit (170) including a band-shaped base (110) having bonding portions (100a, 100b) overlapping each other and bonded to each other through soldering portions (160) at opposite lengthwise ends thereof respectively, a plurality of molding parts (12) disposed adjacent to each other in a row along the lengthwise direction of the base (110) and accommodating LED devices (120) therein, and a plurality of LED devices (120) located within the molding parts (12) and wire-bonded and connected to the base (110) while being sealed by a resin body (150), the LED illumination units (170) being able to be bent roundly in a circular or semicircular shape,
wherein the plurality of variable LED packages are arranged in parallel on one base plate (180) constituting the base (110), and the molding parts (140), the LED devices (120) located within the molding parts (140), wires (220) wire-bonded between the LED devices (120) and the base (110) are collectively molded so that the variable LED packages are separated from each other to be used.
The variable LED package assembly as claimed in claim 12, wherein the bonding portions (100a, 100b) formed on opposite sides of the base (100) have triangular shapes, the bonding portions (100a, 100b) being fitted with each other while overlapping each other, and being bonded to each other while being attached to each other.