WO2012096460A1 - Boîtier de diodes électroluminescentes variable et agencement de boîtier de diodes électroluminescentes l'utilisant, et ensemble boîtier de diodes électroluminescentes variable - Google Patents

Boîtier de diodes électroluminescentes variable et agencement de boîtier de diodes électroluminescentes l'utilisant, et ensemble boîtier de diodes électroluminescentes variable Download PDF

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Publication number
WO2012096460A1
WO2012096460A1 PCT/KR2011/010142 KR2011010142W WO2012096460A1 WO 2012096460 A1 WO2012096460 A1 WO 2012096460A1 KR 2011010142 W KR2011010142 W KR 2011010142W WO 2012096460 A1 WO2012096460 A1 WO 2012096460A1
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WO
WIPO (PCT)
Prior art keywords
led
base
led illumination
molding parts
led package
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PCT/KR2011/010142
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English (en)
Inventor
Zun Kim
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Lumexbio Pharm Co., Ltd.
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Publication date
Application filed by Lumexbio Pharm Co., Ltd. filed Critical Lumexbio Pharm Co., Ltd.
Publication of WO2012096460A1 publication Critical patent/WO2012096460A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/30—Light sources with three-dimensionally disposed light-generating elements on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Definitions

  • the present invention relates to a variable LED package and an LED package arrangement using the same, and more particularly to an LED light source easily detachably mounted and applicable to generally widely produced illumination apparatuses.
  • LEDs are semiconductor devices adapted to emit light when a voltage is applied thereto in a forward direction. Such LEDs use a field emission effect and are being used for various purposes until now. The LEDs are expected to replace fluorescent lights and light bulbs in the future.
  • the LEDs have advantages of low power consumption, a semi-permanent life span, impact-resistance, and high precision. In addition, they hardly cause environmental contamination since they do not use mercury or discharge gases. Further, since they do not require time for preheating, they can achieve a quick response.
  • discharge lamps such as fluorescent lights, light bulbs, or halogen lamps are being widely used as light sources of interior illuminations for homes or offices, or light sources of outdoor illuminations such as street lamps or security lights.
  • discharge lamps consume much energy due to their high drive voltages and a voltage boost of electric power and discharge gases such as mercury harmful to human bodies or environments when disposed.
  • the backlights of lamps are rarely suitable for direct use of illuminations, but may be received in illumination apparatuses so that distribution of backlights can be converted to a form suitable for illuminations, creating the best interior atmosphere.
  • it is very important to design their optical functions.
  • An overall efficiency including a life span, a total amount of light, color rendering, and an optical efficiency is the most important issue for illuminations using current LEDs.
  • one or more phenomena are complexly accompanied among optical phenomena if electromagnetic waves are radiated and introduced into the reflective plate.
  • LED light sources matched with such reflective plates using the phenomena, in which case reflection, absorption, penetration, selective reflection, wave change, refraction, polarization, etc., of light should be considered.
  • a reflective plate of an LED light source usually reflects, collects, and distributes light through a design of a prism or a lens
  • double costs are generated through a design of a separate reflective plate or lens and there is a limit in applying the reflective plate to a generally widely used illumination apparatus.
  • Most illumination apparatuses are designed to have an arc-like shape or a spherical shape, and are used by using specular reflection, diffusive reflection, and spread reflection, which is a type of specular reflection.
  • LED illumination packages suitable for general illumination apparatuses whose lamp efficiencies are maximized though an improved reflection efficiency have been developed to achieve a better optical efficiency in LEDs showing straight propagation of light through attachment of a lens on a front surface of the LED packages and expansion of light sources.
  • light sources showing straight propagation of light may be expanded, it is difficult to mount the light sources to a generally used illumination apparatus.
  • a 360 degree light source may be used to maximize the efficiency of a reflective plate in manufacturing an LED package.
  • General methods of obtaining a 360 degree light source to be used an illumination light source using an LED include a method disclosed in Korean Patent No. 10-0883327 and a method disclosed in Korean Patent Application Publication No. 10-2007-0117692.
  • the apparatus cannot achieve a high optical efficiency due to a wide gap between metallic packages, and it is difficult to achieve a high reflection efficiency of diffused light due to dotted light sources in a 360 degree form.
  • the apparatus since the apparatus has a predetermined pattern using a reflective plate at an upper portion thereof, it is disadvantageous in an aspect of maximizing a reflection efficiency.
  • a material of a PCB has not been suggested clearly, for example, when an FR4 material is used, a PCB substrate having a minimum thickness of 0.2 mm or more is flexible but cannot be bent in a perfect circular rod-like shape having at least 13 mm.
  • an system may be used for the purpose of a general black light or a surface light source, but there is a limit in using it as a general LED light source for illumination having a high reflection efficiency.
  • the present invention has been made in view of the above-mentioned problems, and the present invention provides a package for achieving a 360 degree side surface light source, considering that it is very difficult to achieve a reflection efficiency of a general illumination due to a very low optical efficiency caused by a linear property and radiation of light.
  • the present invention also provides a variable LED package and an LED package arrangement which can improve an efficiency related to use of light and can be widely used for various purposes such as a security light or a safety light, by realizing a new band-shaped LED illumination arrangement equipped with a plurality of LED devices, which can be bent in an arc-like shape.
  • the present invention also provides a variable LED package and an LED package arrangement which can increase a utility of an illumination device using an LED as a light source and widen an application field for various illumination devices, by realizing a new illumination device where a plurality of band-shaped LED illumination units are combined with a cylindrical support unit.
  • the present invention also provides a variable LED package assembly for achieving a highly efficient light source, considering the disadvantages of a general illumination, for example, a low efficiency of a widely used reflective plate and a difficulty in installing the reflective plate in a general illumination device other than an LED dedicated illumination device.
  • the present invention also provides an LED package which can be easily applied to an illumination arrangement and can achieve a high efficiency at low cost using a reflective plate of a general illumination device, by manufacturing an LED package which can be easily bent or deformed in a circular, linear, or semicircular shape, considering the disadvantages of the LED package depending on the linearity.
  • the present invention also provides an LED package assembly which can achieve improved productivity at low cost, for example, by allowing the LED package to achieve mass-production and uniform quality through a smooth production process due to a package design where wire-bonding is easily accomplished to radiate heat by themselves.
  • the present invention provides an LED package assembly which can be manufactured in a circular shape without using a separate heat-dissipating member or fixing member, while an internal support unit maintains a circular shape even if it does not maintain a cylindrical shape, and can also have a heat-dissipating function by itself.
  • the present invention also provides an LED package suitable for achieving a 360 degree light source without using a separate support unit.
  • the present invention provides a variable LED package which can be formed in a semicircular, circular, or planar shape by itself without using a cylindrical rear support unit.
  • an LED package arrangement including: a plurality of LED illumination units each including a band-shaped base having connecting portions at opposite ends thereof, a plurality of molding parts disposed adjacent to each other in a row along the lengthwise direction of the base, and a plurality of LED devices located at centers of the molding parts and wire-bonded and connected to the base, the LED illumination units being able to be bent to have an arc-like shape; and a rod-shaped support unit acting as a support body where the LED illumination units are installed, being equipped with a connecting member electrically connected to a power source at one end thereof, and having a plurality of connecting portions disposed along opposite radial sides thereof along the lengthwise direction thereof, wherein the plurality of LED illumination units are installed continuously along the lengthwise direction of the rod shape to be bent in a semicircular shape along a circumferential surface of the support unit and are electrically connected to each other, whereby light can be irradiated and illuminated in all directions from an entire circumferential surface
  • the support unit may be formed with a single integral body or with two bodies split along the lengthwise direction thereof to have a semicircular cross-section.
  • variable LED package assembly of the present invention has the following features.
  • the variable LED package includes: an LED illumination unit including a band-shaped base having connecting portions at opposite ends thereof, a plurality of molding parts disposed adjacent to each other in a row along the lengthwise direction of the base, and a plurality of LED devices located at centers of the molding parts and wire-bonded and connected to the base, the LED illumination units being able to be bent to have an arc-like shape.
  • a plurality of variable LED packages each including a plurality of LED illumination units which are bent in a circular or semicircular shape are arranged in parallel on one base plate.
  • the plurality of molding parts, the LED devices disposed within the molding parts, and the wires wire-bonded between the LED devices and the base are collectively molded on the base plate so that the variable LED packages can be separated into pieces.
  • variable LED package and the LED package arrangement according to the present invention have the following advantages.
  • the present invention employs a band-shaped LED illumination unit which can be bent in a circular shape to be used, and thus it can be widely applied to various fields where various shapes such as a rod-like shape or a plate-like shape are required.
  • the present invention can be highly applicable as a security light, a safety light, or a 3-wave lamp.
  • a lens may be conventionally attached to a front surface of an LED Package to obtain an excellent optical efficiency in an LED emitting light of straight propagation and to achieve an expansion efficiency of a light source, but it can possibly expand a light source of straight propagation but it is a little difficult to mount the lens to a widely used general illumination device.
  • the present invention supplements the disadvantages of the LED package depending on straight propagation, and can obtain an LED package which can be easily bent and deformed in a circular shape while being easily used in an illumination arrangement and achieving a high efficiency at low costs.
  • the conventional illumination LED is high-priced by using a high-output LED chip of more than 1 Watt and cannot easily secure a 360 degree light source as it is wire-bonded to a plane and is made of a metallic material, it is difficult to secure a 360 degree light source and it is impossible to wire-bond the light source in an automatic wire-bonding machine due to its volume and size. Accordingly, it is high-priced in an aspect of manufacturing costs by using a manual device, but since the variable LED package of the present invention is formed with a package arrangement connected through an array of a predetermined pattern when an LED wire is bonded, it is designed to be wire-bonded by using an automatic wire-bonding device and is low-priced.
  • a bare chip of 0.064 to 0.12 is used instead of a high-output LED chip of more than 1 Watt to disperse a light source necessary for illumination, making it possible to secure an optical efficiency, reduce costs, and reduce costs of an auxiliary heat-dissipating unit which are pointed out as one of the disadvantages of a high-output LED while reducing manufacturing costs by 40%.
  • LEDs are wire-bonded on a plane through an automatic device, they may be designed to be deformed in a planar, semicircular, or circular shape.
  • an angle of a hole cup for bonding central LEDs can be designed to secure a maximum amount of side light in a planar, semicircular, and circular shape and realize a design for maximizing an optical efficiency of a reflective plate. Further, a certain angle can be maintained at articulations of modules, making it possible to deform the entire shape of the modules in a semicircular or circular shape.
  • the present invention when applied to a plane, it can be used in a conventional backlight for illumination such as a sign board.
  • a conventional backlight for illumination such as a sign board.
  • arrays connected lengthwise to each other are deformed in a semicircular shape, they can be designed to be easily used in an illumination device in a form of a fluorescent light using LEDs.
  • deformed in a circular shape since they may be erected to form a rod-like shape or be laid down, they can be mounted to a conventional international illumination device and can be easily manufactured in various forms to manufacture an illumination device.
  • the present invention can be installed in a general illumination device and can be applied as a light source having a high efficiency. Further, the light source according to the present invention can be easily bent to be manufactured in a circular, linear, or semicircular shape. In addition, according to the present invention, a 360 degree light source can be achieved without using a separate support unit, securing high efficiency at low cost. Furthermore, the present invention can improve productivity, lower price, and achieve mass-production and uniform quality due to improvement of manufacturing efficiency.
  • FIGS. 1A, 1B, and 1C are perspective views illustrating a variable LED package according to an embodiment of the present invention
  • FIGS. 2A and 2B are sectional views illustrating a variable LED package according to another embodiment of the present invention.
  • FIGS. 3A and 3B are perspective views illustrating an LED package arrangement using a variable LED package according to an embodiment of the present invention
  • FIG. 4 is a perspective view illustrating an LED package arrangement using a variable LED package according to another embodiment of the present invention.
  • FIG. 5 is a perspective view illustrating a variable LED package according to another embodiment of the present invention.
  • FIG. 6 is a perspective view illustrating an LED package arrangement using a variable LED package according to another embodiment of the present invention.
  • FIGS. 7A to 7C are perspective views illustrating a variable LED package according to another embodiment of the present invention.
  • FIG. 8 is a sectional view illustrating a variable LED package according to another embodiment of the present invention.
  • FIG. 9 is a plan view illustrating a state where variable LED packages according to another embodiment of the present invention are separated into pieces;
  • FIG. 10 is a perspective view illustrating a variable LED package according to another embodiment of the present invention.
  • FIGS. 11A and 11B are perspective views illustrating a variable LED package assembly according to an embodiment of the present invention.
  • FIGS. 1A to 1C are perspective views illustrating a variable LED package according to an embodiment of the present invention.
  • FIGS. 2A and 2B are sectional views illustrating a variable LED package according to another embodiment of the present invention.
  • variable LED package i.e. an LED illumination unit 14 is a substantial illumination means using an LED device 13, and can be bent in an arc-like shape and can be used to be wound on and attached to a circumferential surface of a support unit 16 to be described later.
  • the LED illumination unit 14 includes a base 11 having a long rectangular band-like shape.
  • the base 11 is formed with a thin metal plate so as to be easily bent to be connected to the LED device 13.
  • Aperture-shaped connecting portions 10a for electrical connection to connecting portions 10b formed in the support unit 16 are formed at opposite ends of the base 11.
  • the base 11 can be bent lengthwise, it may be bent in a semicircular arc-like shape as in an example of the present invention.
  • the base 11 may be bent to have various shapes such as a rectangle and a polygon depending on a shape of the support unit 16 which may have various cross-sections.
  • the base 11 is preferably formed of a copper material or a metal material coated with silver, considering a rate of electric currents and durability.
  • a plurality of cutaway portions are preferably formed in the base 11 so that the base 11 can be bent more easily.
  • a plurality of circular apertures are preferably formed in the base 11 at locations adjacent to the connecting portions 10a so that the base 11 is easily bent when it is bent by approximately 90 degrees to connect the connecting portions 10a at the opposite ends of the base 11 to the connection portions 10b of the support unit 16.
  • the LED illumination unit 14 includes a plurality of molding parts 12 for protecting LED devices 13.
  • the molding parts 12 may be formed of a plastic resin such as , and are integrally formed on the base 11 while having a substantially rectangular frame-like shape.
  • the molding parts 12 may be integrally formed over an upper surface and a bottom surface of the base 11.
  • a plurality of molding parts 12 are disposed adjacent to each other in a row in parallel along the lengthwise direction of the base 11, and the LED devices 13 are accommodated within the frames of the molding parts 12 respectively.
  • the molding parts 12 should not generate an interference at their borders so that the base 11 is bent naturally. To this end, the molding parts 12 have a predetermined gap therebetween and ends of the molding parts 12 have inclined surfaces 17 so that an interference can be effectively avoided when the molding parts 12 are bent. As a result, the molding parts 12 can be easily bent in a desired shape, e.g. a semicircular shape on the whole.
  • the inclined surfaces 17 formed at the ends of the molding parts 12 are preferably formed on upper and lower sides of the base 11.
  • a plurality of heat-dissipating apertures 18 are formed on a rear surface of each of the molding parts 12 integrally formed with the LED illumination unit 14. Accordingly, heat generated by the LED devices 13 can be efficiently discharged, and the LED devices 13 can be protected from the influence of heat maximally. As a result, the heat-dissipating apertures 18 enhance a durability of the LED illumination unit 14 and extend a life span of the LED illumination unit 14.
  • Inner peripheries of each of the molding parts 12, i.e. inner peripheries of the frame structure have surfaces inclined at a predetermined angle, e.g. approximately 120 degrees, and accordingly, light irradiated from the LED device 13 is guided and reflected along the inclined surfaces, making it possible to secure a wide range of diffusion of light.
  • the LED illumination unit 14 includes the LED devices 13 for substantially performing an illumination function.
  • the LED devices 13 are located within the molding parts 12 respectively, and in particular, are installed at the centers of the molding parts 12.
  • hole cups 24 are formed at inner central regions of the molding parts 12 at a center of the base 11, and the LED devices 13 are fixed to and installed in the hole cups 24 through bonding while being accommodated within the hole cups 24 respectively.
  • the hole cups 24 have wall surfaces inclined at an angle of 120 degrees, and accordingly, the efficiencies of reflective light sources of the LED devices 13 can be maximized.
  • a fluorescent material 26 is applied on inner surfaces of the hole cups 24 after the LED devices 13 are bonded, costs can be reduced. Further, since transparent epoxy 25 or a transparent silicon is applied to inner regions of the molding parts 12 except for the hole cups 24, light can be penetrated and diffused.
  • the optimum size of the hole cups 24 for maximizing these effects is a depth of 0.25 mm and a diameter of 0.45 mm.
  • the fluorescent material flows and spreads out to the periphery, resulting in a disagreement of the features of light and colors.
  • a chip i.e. an LED device can be easily bonded through a hole cup of a predetermined size, and if after a fluorescent material is applied only to a periphery of a hole cup, transparent epoxy or silicon is applied to the other peripheries, light can be diffused or manufacturing costs can be reduced.
  • Such an LED device 13 is wire-bonded and electrically connected to the base 11.
  • the wires of the LED devices 13 bonded and connected to the base 11 may extend at opposite ends thereof in two rows.
  • the LED illumination unit 14 is bent in an arc-like shape to be used after the LED devices 13 are wire-boned while being laid lengthwise on a plane. Accordingly, the LED illumination unit 14 can improve work efficiency, productivity, and work precision as compared with the conventional LED illumination arrangements.
  • the LED devices 13 are installed such that positioning recesses are formed in the base 11 so that the LED devices 13 can be positioned and accommodated in the positioning recesses.
  • the inner regions of the molding parts 12 corresponding to the LED devices 13 are preferably finished with a transparent resin or protect the LED devices 13 from an exterior environment by a separate cover means mounted thereto.
  • the LED devices 13 are wire-bonded to the base 11 to receive electric power and are turned on to irradiate light.
  • FIGS. 3A and 3B are perspective views illustrating an LED package arrangement using a variable LED package according to an embodiment of the present invention.
  • FIGS. 3A and 3B illustrate an example of realizing an LED illumination arrangement through a combination of the LED illumination unit 14 and the support unit 16.
  • the support unit 16 includes two pieces split from a circular rod-shaped body along the lengthwise direction thereof and having a semicircular cross-section.
  • the LED illumination units 14 are attached to and installed in the circumferences of the semicircular cross-sections along the lengthwise direction of the rod.
  • an insulating plate 20 is interposed between the contacting planes of the pieces 16a and 16b of the support unit 16 to insulate the facing connecting portions.
  • a PCB substrate electrically connected to a connecting member 15 is attached to inner surfaces of the pieces 16a and 16b of the support unit 16 and is connected to the connecting portions 10b so that electric power can be supplied to the LED illumination unit 14.
  • PCB substrate may be directly connected to the connecting portions 10a of the LED illumination unit 14 without using the connecting portions 10b as another example.
  • a plurality of LED illumination units 14 are attached to the support member 16 continuously along the lengthwise direction of the support member 16 so that the LED illumination units 14 and the support unit 16 can finish one LED illumination arrangement.
  • connecting portions 10b are connected to an internal electrode terminal (not shown), the connecting portions 10a of the LED illumination unit 14 and the connecting portions 10b of the support unit 16 are electrically connected to each other.
  • the two split pieces of the support unit 16 may be combined into a single circular rod-like shape. Threaded portions 23 are formed at upper ends of the pieces 16a and 16b of the support unit 16 to be coupled to a cap 19 whose inner surface is also threaded so that the pieces 16a and 16b of the support unit 16 can be combined into a single integral support unit 16.
  • a connector 22 is formed at a lower end of the support unit 16, and a connecting portion 15 electrically connected to a power source is mounted on the connector 22 so that electric power can be supplied to the LED devices 13 of the LED illumination unit 14 through an internal electrode of the support unit 16.
  • a passage (not shown) through which a cooling medium such as distilled water or oil, which is supplied from the outside, can flow may be formed in an interior of the support unit 16, and accordingly, the LED illumination unit 14 including the support unit 16, i.e. the LED illumination arrangement can be maximally protected from heat radiated from a number of LED devices due to a heat transfer operation (cooling operation) performed by the cooling medium.
  • a cooling medium such as distilled water or oil
  • FIG. 4 is a perspective view illustrating an LED package arrangement using a variable LED package according to another embodiment of the present invention.
  • FIG. 4 illustrates an example of forming the support member 16 where the LED illumination units 14 are installed into a single integral body.
  • the support unit 16 has a long rod-like shape having a circular cross-section and has grooves 21 extending along the lengthwise direction of the rod on a circumferential surface thereof on opposite sides having a phase difference of 180 degrees, and a plurality of connecting portions 10b disposed at an interval along the lengthwise direction of the rod are formed on the opposite walls of the grooves 21.
  • the LED illumination units 14 where the opposite connecting portions 10a are bent inward by approximately 90 degrees are installed in the support unit 16 having the grooves 21, if a region to which the LED devices 13 and the molding parts 12 pertain is attached to a circumferential surface of the LED illumination unit 14 and the connecting portions 10b in the grooves 21 and the connecting portions 10a of the LED illumination unit 14 while the connecting portions 10a bent inward are inserted within the grooves 21, the LED illumination unit 14 using the support member 16 having a single body is completely installed.
  • the connecting member 15 may be connected to the support unit 16 of this case like the above-described split support unit 16, and the support unit 16 may include an internal electrode connected to the connecting portions 10b and a passage for flowing of a cooling medium.
  • a plurality of LED illumination units 14 are attached to and installed in a circumference of the circular rod-shaped support unit 16. Accordingly, light can be irradiated in all directions without being limited to a specific direction, and the LED illumination arrangement can be utilized for a security light, a safety light, or a 3-wave lamp.
  • an illumination effect can be maximized, for example, by doubling an amount of light irradiated to the front due to an increase of a reflection efficiency of the reflective plate.
  • an example of the present invention provides an LED illumination arrangement where the band-shaped LED illumination units are combined with a plane.
  • the present invention provides an LED illumination arrangement where after a plurality of LED illumination units are disposed on a rectangular plate-shaped substrate (support unit) to have a band-like shape, that is, a plurality of LED illumination units each including a long band-like base having connecting portions at opposite ends thereof, a plurality of molding parts disposed adjacent to each other in parallel in a row along the lengthwise direction of the base, and a plurality of LED devices located at the centers of the molding parts and wire-bonded to the base to be connected to the base are arranged, they are electrically connected to the substrate to which electric power is supplied from the outside.
  • a plurality of LED illumination units may be variously combined and arranged on a plane to have a structure of 3 by 3 or 4 by 4.
  • the LED illumination arrangement may be widely applied in various illumination fields such as for an outdoor electronic display for advertising.
  • FIG. 5 is a perspective view illustrating a variable LED package according to another embodiment of the present invention.
  • FIG. 5 illustrates an LED illumination unit 14 including a plurality of LED devices 13 for substantially irradiating light and which can be bent to have a circular shape.
  • the LED illumination unit 14 also includes a long rectangular band-like base 11.
  • the base 11 has a thin metal plate-like shape for its connection to the LED devices 13 and so as to be bent easily.
  • Aperture contact points 27 and protruding contact points 28 are formed at opposite ends of the base 11 such that a pair of an aperture contact point 27 and a protruding contact point 28 form a (+) electrode whereas the other pair of an aperture contact point 27 and a protruding contact point 28 form a (-) electrode.
  • a diameter of the protruding contact points 28 is larger than an inner diameter of the aperture contact points 27 so that they cannot be separated once they are coupled to each other.
  • the base 11 may be bent lengthwise, it may be used while being bent to have a circular shape.
  • the base 11 is preferably formed of a copper material or a metal material coated with silver, considering a rate of electric currents and durability.
  • the LED illumination unit 14 includes a plurality of molding parts 12 for protecting the LED devices 13.
  • the molding parts 12 may be formed of a plastic resin such as , and are integrally formed on the base 11 while having a substantially rectangular frame-like shape.
  • the molding parts 12 may be integrally formed over an upper surface and a bottom surface of the base 11.
  • each of the molding parts 12 has a hexagonal shape, so it can increase a reflection efficiency of light further as compared with a rectangular shape.
  • a plurality of molding parts 12 are disposed adjacent to each other in a row in parallel along the lengthwise direction of the base 11, and the LED devices 13 are accommodated within the molding parts 12, i.e. the frames of the molding parts 12 respectively.
  • a gap is disposed between the adjacent molding parts to exclude an interference between the molding parts 12 when the base 11 is bent. Further, since ends of the molding parts 12 adjacent to each other include inclined surfaces 17, an interference can be effectively avoided between the molding parts 12 when the molding parts 12 are bent. As a result, they can be easily bent to have a desired shape, e.g. a perfect circle on the whole.
  • a plurality of heat-dissipating apertures are preferably formed on a rear surface of each of the molding parts 12 integrally formed with the LED illumination unit 14 to efficiently radiate heat generated by the LED devices 13.
  • Inner peripheries of each of the molding parts 12, i.e. inner peripheries of the rectangular frame includes surfaces inclined at a certain angle, i.e. at approximately 120 degrees, and accordingly lights irradiated from the LED devices 13 are guided along and reflected on the inclined surfaces, securing a wide diffusion range of light.
  • the LED illumination unit 14 includes the LED devices 13 for substantially performing an illumination function.
  • the LED devices 13 are located within the molding parts 12 respectively, and in particular, are installed at the centers of the molding parts 12.
  • hole cups 24 are formed at inner central regions of the molding parts 12 at a center of the base 11, and the LED devices 13 are fixed to and installed in the hole cups 24 through bonding while being accommodated within the hole cups 24 respectively.
  • the hole cups 24 have wall surfaces inclined at an angle of 120 degrees, and accordingly, the efficiencies of reflective light sources of the LED devices 13 can be maximized.
  • Such an LED device 13 is wire-bonded and electrically connected to the base 11.
  • the wires of the LED devices 13 bonded and connected to the base 11 may extend at opposite ends thereof in two rows.
  • the LED devices 13 are installed such that positioning recesses are formed in the base 11 so that the LED devices 13 can be positioned and accommodated in the positioning recesses.
  • the inner regions of the molding parts 12 corresponding to the LED devices 13 are preferably finished with a transparent resin or protect the LED devices 13 from an exterior environment by a separate cover means mounted thereto.
  • the LED devices 13 are wire-bonded to the base 11 to receive electric power and are turned on to irradiate light.
  • a plurality of (+) electrode plates 29 and a plurality of (-) electrode plates 30 are formed in the base 11 of the LED illumination unit 14, the electrode plates corresponding to the number of the LED devices 13 and being disposed in a row along the lengthwise direction of the base 11.
  • (+) electrode plates 29 and the (-) electrode plates 30 have triangular shapes respectively and are formed alternately by one pitch such that when two adjacent LED illumination units 14 are connected to each other, the electrode plates of the LED illumination units 14 are fitted with each other to be connected to each other.
  • the electrode plates are connected to each other through soldering etc.
  • FIG. 6 is a perspective view illustrating an LED package arrangement using a variable LED package according to another embodiment of the present invention.
  • FIG. 6 illustrates an example of bending LED illumination units 14 on a circular bar-shaped support unit 16 in a circular shape to install the LED illumination units 14
  • the support unit 16 has a long rod-like shape having a circular cross-section, and a connecting member for supply of electric power is mounted to one side of a lower end of the support unit 16.
  • an LED illumination unit 14 is bent in a circular shape to be mounted on a circumference of the support unit 16 and the recessed contact points 27 and the protruding contact points 28 are coupled to each other, it is wound and mounted on the support unit 16. If other LED illumination units 14 are mounted on a circumference of the support unit 16 continuously, the adjacent LED illumination units 14 are electrically connected to each other through the electrode plates, and are connected to each other on one support unit 16.
  • FIGS. 7A to 7C are perspective views illustrating a variable LED package according to another embodiment of the present invention.
  • FIG. 8 is a sectional view illustrating a variable LED package according to another embodiment of the present invention.
  • variable LED package i.e. the LED illumination unit 170 is a substantial illumination unit using LED devices 120, and can be bent in a circular or semicircular shape.
  • the LED illumination unit 170 is wound and attached on a circumferential surface of a support unit 210 to be described later.
  • the LED illumination unit 170 includes a long rectangular band-shaped base 110.
  • the base 110 is formed with a thin metal plate for its connection to the LED devices 120 and to be easily bent. Bonding portions 100a and 100b for connection to wires 200 of the support unit 210 or bonding to each other are formed at opposite ends of the base 110.
  • the base 110 can be bent lengthwise, it may be bent in a circular or semicircular shape as in an embodiment of the present invention.
  • the base 100 may be bent to have various shapes such a rectangle and a polygon depending on a shape of the support unit 16 which may have various cross-sections.
  • the base 100 is preferably formed of a stainless steel, a copper material or a metal material coated with silver, considering a rate of electric currents and durability.
  • the bonding portions 100a and 100b formed at opposite sides of the base 110 have triangular shapes, and accordingly, when the base 100 is rolled in a circular shape such that opposite ends of the base 100 contact each other, the opposite contact portions 110a and 110b are fitted with each other and are attached and bonded to each other.
  • Apertures 240a and 240b are formed in the bonding portions 100a and 100b, and fused solder is filled in the apertures 240a and 240b located to contact each other during a soldering operation for bonding, firmly coupling the bonding portions 100a and 100b.
  • the LED illumination unit 170 includes a plurality of molding parts 140 for protecting the LED devices 120.
  • the molding parts 140 may be formed of a plastic resin such as , and are integrally formed on the base 110.
  • the molding parts 140 may be various shapes such as a rectangle, and an example of the present invention provides the molding parts 140 each having a hexagonal body formed on an upper surface of the base 110 while accommodating an LED device 120.
  • the molding parts 140 may be integrally formed over an upper surface and a bottom surface of the base 110.
  • a plurality of molding parts 140 are disposed adjacent to each other in a row in parallel along the lengthwise direction of the base 11, and the LED devices 120 are accommodated within the molding parts 140, i.e. within the hexagonal frames of the molding parts 140 respectively.
  • the molding parts 140 should not generate an interference at their borders so that the base 110 is bent naturally. To this end, the molding parts 140 have a predetermined gap therebetween and ends of the molding parts 140 have inclined surfaces so that an interference can be effectively avoided when the molding parts 140 are bent. As a result, the molding parts 140 can be easily bent in a desired shape, e.g. a semicircular shape on the whole.
  • the inclined surfaces formed at the ends of the molding parts 140 are preferably formed on both upper and lower sides of the base 110.
  • Each of the molding parts 140 includes two insulating bands 230 formed in two rows in parallel along the lengthwise direction of the base 110, and the insulating bands 230 serve to divide the molding part 140 into a central region with respect to the width of the base 110 to which the LED device 120 pertains and opposite outer regions with respect to the width of the base 110 to which the wire-bonded wires 220 are connected, electrically insulating the regions.
  • the insulating bands 230 are formed together with the molding parts 140 when the molding parts 140 are molded in the base 110, and cutaway portion 270 (see FIG. 9) passing through a base plate 180 (see FIG. 9) which is a mother body of the base 110 and disposed in parallel in two rows.
  • the cutaway portions 270 are filled with a resin when the molding parts 140 are molded.
  • a plurality of heat-dissipating apertures 130 are formed on a rear surface of each of the molding parts 140 integrally formed with the LED illumination unit 170, and accordingly, heat generated by the LED devices 120 can be effectively radiated, maximally protecting the LED devices 120 from heat.
  • the heat-dissipating apertures 130 enhance a durability of the LED illumination unit 170 and extend a life span of the LED illumination unit 170.
  • Inner peripheries of each of the molding parts 140 i.e., inner peripheries of the hexagonal frame structure have surfaces inclined at a predetermined angle, e.g., approximately 120 degrees, and accordingly, light irradiated from the LED device 120 is guided and reflected along the inclined surfaces, making it possible to secure a wide range of diffusion of light.
  • the LED illumination unit 170 includes the LED devices 120 for substantially performing an illumination function.
  • the LED devices 120 are located within the molding parts 140 respectively, and in particular, are installed at the centers of the molding parts 140.
  • the LED devices 120 are located in inner central regions of the molding parts 140, e.g. in regions between the insulating bands 230, and are fixed and installed through bonding.
  • two LED devices 120 may be disposed in each of the molding parts 140.
  • the LED devices 120 may be wire-bonded and electrically connected to the base 110.
  • the wire-bonded portions of the LED devices 120 connected to the base 110 may have a form where two wires 220 in two rows extend and connect to the base 110 at opposite sides of the LED devices 120.
  • the inner regions of the molding parts 140 corresponding to the LED devices 120 are preferably finished with a transparent resin 150 or protect the LED devices 120 from an exterior environment by a separate cover means mounted thereto.
  • the LED devices 120 are wire-bonded to the base 110 to receive electric power and are turned on to irradiate light.
  • the present invention provides a variable LED package assembly where a plurality of variable LED packages are combined together.
  • variable LED package assembly is advantageous in an aspect of manufacturing since several variable LED package units may be manufactured collectively and may be separated into pieces.
  • the LED devices 120 may be wire-bonded to a plane while being spread out lengthwise on the plane and are bent in a circular or semicircular shape when used, so they can achieve excellent work efficiency, productivity, and work precision as compared with the conventional illumination apparatuses to which a wire-bonding operation is performed while they are bent circularly.
  • a rectangular base plate 180 is prepared, and a plurality of variable LED package units, i.e., a plurality of LED illumination units 170 are disposed on the base plate 180 in several rows.
  • each of the LED illumination units 170 includes a base 110 having bonding portions 100a and 100b at opposite ends thereof, a plurality of molding parts 140 accommodating the LED devices 120, and a plurality of LED devices 120 located within the molding parts 140 and sealed by a resin 150.
  • the plurality of LED illumination units 170 are simultaneously molded on the base plate 180.
  • two rows of cutaway portions 270 are formed at locations where the LED illumination units 170 are formed.
  • Several molding parts 140 are formed at an interval at locations where the two rows of cutaway portions 270 are wire-bonded and sealed with a resin while the LED devices 140 and are mounted within the molding parts 140.
  • variable LED packages formed in one base plate 180 may be assembled in the support unit 210 to form a circular or semicircular shape.
  • FIGS. 11A and 11B are perspective views illustrating a variable LED package assembly according to an embodiment of the present invention.
  • FIGS. 11A and 11B illustrate an example of realizing one LED illumination arrangement through combination of the LED illumination units 170 and the support units 210.
  • the support unit 210 acts as a support body where the LED illumination units 170 are installed, and has a circular rod-like shape and also has grooves 190 formed in parallel at opposite sides along the lengthwise direction of the rod.
  • Wires 200 are installed in the grooves 190 of the support unit 210, and are electrically connected to the LED illumination units 210 assembled around the support unit 210 to supply electric power.
  • the wires 200 extending from ends of the support members 210 are electrically connected to an external power supply (not shown), and electric power can be supplied through the extending portions.
  • the cylindrical LED packages are soldered in parallel through the soldering portions 160, they are bonded to both electrodes of upper and lower packages through soldering via insulating bus bars having a U-shaped cross-section and manufactured within the grooves 190 through insert injection-molding to be fixed and electrically connected.
  • the wires of the (+) and (-) electrodes may be designed to be electrically connected to other pin terminals (not shown) connected to the outside.
  • an external terminal refers to a general power supply insertion unit used at a lower end of a microphone, wherein a body and a power supply part can be easily separated from and attached to each other.
  • the standard and interval of the wires may be designed to be compatible to be freely connected and easily attached by using pin terminals.
  • variable LED package of the present invention is designed to irradiate heat without including an internal semicircular or circular column
  • wires may be connected to each other such that one pole can be connected to an upper portion of the variable LED package and another pole can be grounded to a lower portion of the variable LED package though soldering of FIG. 5B.
  • a plurality of LED illumination units 170 are rolled circularly on a circumferential surface of the support unit 210, for example, one LED illumination unit 170 is bent in a circular shape or two LED illumination units 170 are bent such that two semicircular shapes form one circle. They are disposed continuously along the lengthwise direction of the rod, and are installed in the support units 210 to be electrically connected to the wires 200.
  • contacting ends of the LED illumination units 170 bent in a circular or semicircular form to be installed may be connected to the soldering portions 160 formed through soldering of the overlapping bonding portions.
  • Threaded portions 260a and 260b are formed at opposite ends of the support units 210, wherein since nut members 250 are coupled to the threaded portions 260 and 260b, the LED illumination units continuously attached along the lengthwise direction of the rod 170 can be prevented from being separated and can be attached without forming a gap therebetween.
  • a plurality of LED illumination units are attached to and installed in a circumference of the circular rod-shaped support unit 160. Accordingly, light can be irradiated in all directions without being limited to a specific direction, and the LED illumination arrangement can be utilized for a security light, a safety light, or a 3-wave lamp.
  • an illumination effect can be maximized, for example, by doubling an amount of light irradiated to the front due to an increase of a reflection efficiency of the reflective plate.
  • variable LED package and the LED package arrangement of the present invention after a total amount of light of an LED lamp manufactured by a multi-type LED package where twelve LED chips having the 3528 size are wire-bonded as in the example of the present invention, it can be seen that a package of the present invention where twelve packages form one unit increases a light efficiency further as compared with an high-output LED using an LED chip of 1 Watt in a general metal type package.
  • the present invention has a suitable industrial applicability in an aspect of cost.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

L'invention porte sur un boîtier de diodes électroluminescentes variable et sur un agencement d'éclairage à diodes électroluminescentes utilisant des dispositifs à semi-conducteurs de diodes électroluminescentes. La présente invention porte sur un boîtier de diodes électroluminescentes variable, sur un ensemble boîtier de diodes électroluminescentes variable, sur un ensemble, et sur un agencement d'éclairage à diodes électroluminescentes qui réalisent un nouveau type d'agencement d'éclairage à diodes électroluminescentes en forme de bande qui peut être incurvé sous une forme d'arc tout en comprenant une pluralité de dispositifs de diodes électroluminescentes et tout en augmentant un rendement associé à l'utilisation de lumière et en étant largement applicable à différents buts telle qu'une lumière de sécurité ou une lumière de sûreté, et qui réalisent un nouveau type de dispositif d'éclairage dans lequel une pluralité d'unités d'éclairage à diodes électroluminescentes en forme de bande et une unité de support cylindrique sont combinées tout en augmentant une utilité du dispositif d'éclairage utilisant des diodes électroluminescentes comme sources de lumière et en élargissant des domaines d'application pour des dispositifs d'éclairage.
PCT/KR2011/010142 2011-01-11 2011-12-27 Boîtier de diodes électroluminescentes variable et agencement de boîtier de diodes électroluminescentes l'utilisant, et ensemble boîtier de diodes électroluminescentes variable WO2012096460A1 (fr)

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KR10-2011-0002507 2011-01-11
KR1020110002507A KR101066471B1 (ko) 2011-01-11 2011-01-11 가변형 ｌｅｄ 패키지 및 이것을 이용한 조립구조체

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CN108474546A (zh) * 2015-12-28 2018-08-31 爱丽思欧雅玛株式会社 Led照明装置
WO2021094124A1 (fr) * 2019-11-11 2021-05-20 Signify Holding B.V. Lampe à filament à del et procédé de fabrication d'un filament à del en spirale

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CN102509760B (zh) * 2011-11-21 2014-04-02 上海大溥实业有限公司 一种线条型led及其生产方法和应用
KR101612538B1 (ko) * 2014-04-24 2016-04-15 한국광기술원 렌즈 일체형 발광다이오드 모듈의 제조방법
KR101913830B1 (ko) * 2016-12-05 2018-10-31 주식회사 코쿤디자인 기능성 led 어셈블리를 이용한 디스플레이 장치

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EP3399231A4 (fr) * 2015-12-28 2019-07-10 Irisohyama Inc. Dispositif d'éclairage à diodes électroluminescentes
WO2021094124A1 (fr) * 2019-11-11 2021-05-20 Signify Holding B.V. Lampe à filament à del et procédé de fabrication d'un filament à del en spirale
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