JP5662059B2 - LED lamp - Google Patents

LED lamp Download PDF

Info

Publication number
JP5662059B2
JP5662059B2 JP2010128632A JP2010128632A JP5662059B2 JP 5662059 B2 JP5662059 B2 JP 5662059B2 JP 2010128632 A JP2010128632 A JP 2010128632A JP 2010128632 A JP2010128632 A JP 2010128632A JP 5662059 B2 JP5662059 B2 JP 5662059B2
Authority
JP
Japan
Prior art keywords
led
mounting
circuit board
shaped
led lamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2010128632A
Other languages
Japanese (ja)
Other versions
JP2011253782A (en
Inventor
三貴 政弘
政弘 三貴
上田 康之
康之 上田
隆在 植本
隆在 植本
Original Assignee
パナソニックIpマネジメント株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニックIpマネジメント株式会社 filed Critical パナソニックIpマネジメント株式会社
Priority to JP2010128632A priority Critical patent/JP5662059B2/en
Publication of JP2011253782A publication Critical patent/JP2011253782A/en
Application granted granted Critical
Publication of JP5662059B2 publication Critical patent/JP5662059B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00Light sources with three-dimensionally disposed light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Description

  The present invention relates to an LED lamp, for example, an LED lamp suitable as an alternative light source for an incandescent bulb.
  Due to the recent demand for resource saving, in order to reduce the replacement frequency due to the lifetime and to save power, a bulb-shaped LED lamp that has a longer lifetime and consumes less power than incandescent bulbs has been put into practical use and further development is underway. .
  Generally, a light bulb shaped LED lamp has a circuit unit for mounting a large number of LED chips on one mounting board and lighting the LED chips in a housing space between the back side of the mounting board and the base. It has the structure by which it is accommodated (patent document 1).
  Further, in order to use an alternative light source for an incandescent bulb, it is required to be as close as possible to the light distribution characteristics of the incandescent bulb. That is, for example, when it is attached downward, it is required to emit light not only downward but also laterally.
  In this respect, the light distribution of the LED exhibits Lambertian characteristics and its directivity is strong, and as such, the light distribution characteristics are such that the light distribution directly illuminates directly under and near the lamp.
  In order to cope with this problem, Patent Documents 2 and 3 disclose the following bulb-type LED lamps. That is, the LED lamp has an LED module in which LEDs are mounted on each of the strip-shaped portions of the flexible substrate having strip-shaped portions extending radially, at intervals in the longitudinal direction thereof. Then, each of the strip-shaped portions is bent into a semicircular shape (Patent Document 2) or a 1/4 arc shape (Patent Document 3) with the radiation center as a base point, and is formed into a spherical shape or a hemispherical shape as a whole. The light is emitted from the LED mounted on the convex side.
  Patent Document 4 includes a rigid substrate having a square shape, and four rigid substrates each having a rectangular shape in which a short side is connected to each of the four sides by a flexible joint, and each of the rectangular rigid substrates. An LED module in which LEDs are mounted with a space in the longitudinal direction is disclosed. And it is set as the structure which turned up the rectangular rigid board | substrate at right angle with the flexible joint part with respect to the square rigid board | substrate so that LED may become an outer side.
  According to the LED lamps of Patent Documents 2 and 3, since the LEDs are arranged on a virtual spherical surface or a virtual hemispherical surface, the LED lamps also emit light in the lateral direction. According to the above, light is emitted in the lateral direction from the LED mounted on the rectangular rigid board.
JP 2009-037995 A JP 2003-59305 A US Patent Application Publication No. 2005/0174769 JP 2010-55993 A
  However, in the LED lamps described in Patent Documents 2 and 3, the yield becomes a problem in the production of the flexible substrate. That is, a flexible substrate having a desired shape is usually produced by punching a large rectangular substrate, but the flexible substrate used in the LED lamp has a shape in which strip-shaped portions extend radially. This is because the substrate material portion between adjacent strip portions is not used and is wasted.
  On the other hand, in the LED lamp described in Patent Document 4, since each rigid substrate is square (square or rectangular), it can be manufactured by punching from the substrate material without waste, so that the yield is not a problem. Must not. However, since the work of connecting the rigid substrates to each other with a flexible joint is forced, there is a problem that the number of manufacturing steps is increased.
  An object of the present invention is to provide an LED lamp having a structure in which the yield of a substrate material is good and the number of manufacturing steps is as short as possible.
  In order to achieve the above object, an LED lamp according to the present invention has a plurality of LED modules provided on a pedestal and is configured to supply external power to the LED module via a base. Each of the LED modules has an independent transport structure in which a plurality of LEDs are mounted on an individually band-shaped mounting substrate, and each of the LED modules is individually erected on a pedestal. It is provided.
  The mounting board of at least one LED module among the plurality of LED modules is a flexible board, and is erected on the pedestal in a state where the mounting board is curved in an arch shape. To do.
  Alternatively, among the plurality of LED modules, at least two of the LED modules have a mounting board that is a flexible board, and the mounting board is bent in an arch shape so that the two mounting boards are three-dimensionally crossed. It is characterized by being.
In this case, the two mounting boards are three-dimensionally crossed at a portion where the LEDs are not mounted.
And a heat sink including a plate-like portion and a standing portion provided corresponding to each LED module. The heat sink has a back surface of the plate-like portion. It is provided in a state facing the pedestal, and the plate-like portion has a through hole or a notch through which each LED module is inserted from the front surface to the back surface side, and each of the standing portions corresponds to each other. The LED module mounting substrate is in contact with the surface opposite to the LED mounting surface of the mounting substrate.
  According to the LED lamp having the above-described configuration, each of the mounting substrates constituting each of the plurality of LED modules is individually band-shaped. For this reason, in general, the substrate material used for manufacturing the mounting substrate by punching out a large rectangular substrate material is not wasted as much as possible, and thus the yield of the substrate material is improved. Each LED module is individually provided on the pedestal. For this reason, since the process of connecting these LED modules in advance before the mounting to the pedestal is unnecessary, the manufacturing man-hour for that is not required.
1 is a cross-sectional view illustrating a schematic configuration of an LED lamp according to Embodiment 1. FIG. It is a perspective view which shows the heat sink and LED module of the said LED lamp. 6 is a cross-sectional view showing a schematic configuration of an LED lamp according to Embodiment 2. FIG. It is a perspective view which shows the heat sink and LED module of the said LED lamp. (A) is the figure which planarly viewed the LED module in the said LED lamp, (b) is the figure which planarly viewed the LED module in the LED lamp which concerns on a modification. It is a perspective view which shows the heat sink and LED module of the LED lamp which concerns on Embodiment 3. It is a perspective view which shows the heat sink and LED module of the LED lamp which concern on Embodiment 4. (A), (b) is a figure which shows the modification of the LED lamp which concerns on Embodiment 1. FIG.
Embodiments of an LED lamp according to the present invention will be described below with reference to the drawings.
<Embodiment 1>
FIG. 1 is a cross-sectional view showing a schematic configuration of a light bulb shaped LED lamp 10 (hereinafter simply referred to as “LED lamp 10”) according to Embodiment 1, and FIG. It is a perspective view which shows LED module 32,34,36,38. In addition, the scale between each member is not unified in all drawings including these drawings.
  As shown in FIG. 1, the LED lamp 10 has a holder 12 made of an insulating material such as synthetic resin. The cross section of the holder 12 is substantially circular, and has a shape in which a small cylindrical portion 14 and a large cylindrical portion 18 are connected by a tapered cylindrical portion 16.
  The small cylindrical portion 14 of the holder 12 is provided with a base portion 24 including a shell 20 and an eyelet 22. The base part 24 conforms to the standard of E26 base specified in JIS (Japanese Industrial Standard), for example, and is attached to a socket (not shown) for a general incandescent lamp.
  A disk-shaped first circuit board 26 is attached in the large cylindrical portion 18 of the holder 12. A second circuit board 28 is attached to the first circuit board 26 on the side of the cap 24.
  A plurality of electronic components 30 are mounted on the second circuit board 28, thereby converting the power supplied from the commercial power source through the base unit 24 into the power necessary for lighting the LED described later. A lighting circuit is configured. The second circuit board 28 is electrically connected to the base portion 24 via a first lead wire 29 connected to the shell 20 and a second lead wire 31 connected to the eyelet 22.
  A plurality of (four in this example) LED modules 32, 34, 36, and 38 are provided upright on the opposite side of the first circuit board 26 from the base portion 24. Therefore, the first circuit board 26 also functions as a pedestal to which the LED modules 32, 34, 36, and 38 are attached.
Since all the LED modules 32, 34, 36, and 38 have the same size and the same structure (that is, they are the same), the LED module 32 will be described as a representative.
The LED module 32 has an independent portable structure having a strip-shaped mounting board 32S and a plurality of (in this example, five) LEDs 32L mounted at a predetermined interval in the longitudinal direction of the mounting board 32S. doing. The independent portable structure means that it can be handled independently from other LED modules.
  Each of the LEDs 32L includes, for example, a blue LED chip (not shown) and a yellow phosphor film 32P covering the blue LED chip, and emits white light. The five LED chips are electrically connected in series by printed wiring (not shown) on the mounting substrate 32S.
  A pair of terminal pins 32T are provided at one end of the mounting board 32 (only one terminal pin 32T appears in FIG. 1), and both terminal pins 32T are opened on the first circuit board 26. It is fitted in a pin hole (not shown). The tip portion of each terminal pin 32T is soldered (not shown) to a printed wiring (not shown) of the first circuit board 26.
  The LED lamp 10 is also provided so as to correspond to each of the LED modules 32, 34, 36, and 38 that are erected from the disk-shaped portion 42 that is a plate-shaped portion and the front (front) surface of the disk-shaped portion 42. The heat sink 40 is composed of columnar portions 46, 48, 50, and 52 which are the standing portions. The disk-shaped part 42 has a large diameter part 42A and a small diameter part 42B, and a step part 42C is formed. The heat sink 40 is made of aluminum, for example. The heat sink 40 is manufactured by casting, for example, and in this example, the disk-shaped portion 42 and the columnar portions 46, 48, 50, and 52 are integrally formed.
The heat sink 40 is fitted into the large cylindrical portion 18 of the holder 12 with the back surface of the disk-shaped portion 42 facing the first circuit board 26.
The disk-shaped part 42 has through holes 54, 56, 58, 60 corresponding to the LED modules 32, 34, 36, 38. Each LED module 32, 34, 36, 38 is attached to the first circuit board 26 with one end portion side provided with the terminal pin inserted through the corresponding through hole from the front surface side to the back surface side of the disk-shaped portion 42. ing.
  In addition, the LED modules 32, 34, 36, and 38 are attached to the first circuit board 26, and the back surfaces (surfaces opposite to the LED mounting surface) of the respective mounting substrates 32S, 34S, 36S, and 38S. The corresponding columnar portions 46, 48, 50, and 52 are in contact with each other by surface contact. In order to achieve surface contact, the back surfaces of the mounting substrates 32S, 34S, 36S, and 38S and the corresponding columnar portions 46, 48, 50, and 52 are fixed with a heat conductive adhesive (not shown). Further, not only the adhesive but also U-shaped groove portions are provided at both ends in the length direction of the columnar portions 46, 48, 50, 52, and both end portions in the length direction of the mounting boards 32S, 34S, 36S, 38S May be slid into the U-shaped groove and fixed in close contact. Further, the mounting boards 32S, 34S, 36S, 38S and the columnar parts 46, 48, 50, 52 may be bound together by, for example, binding bands (not shown). Alternatively, in the mounting substrates 32S, 34S, 36S, 38S, through holes are opened at positions that do not hinder the mounting or wiring of the LEDs, and female screws are provided in the columnar portions 46, 48, 50, 52 corresponding to the through holes, Both may be fastened with screws.
  An LED module 62 is mounted on the center of the surface of the disk-shaped portion 42 of the heat sink 40. The LED module 62 has a square (in this example, a square) mounting board 62S and a plurality (four in this example) of LEDs 62L mounted on the mounting board 62S. The LED 62L has the same configuration as the LED 32L. The LED chips (not shown) constituting the LEDs 62L are electrically connected in series by printed wiring (not shown) on the mounting board 62S. The LED module 62 is electrically connected to the first circuit board 26 by lead wires 64 and 66. The lead wires 64 and 66 are led out to the back surface of the disk-shaped part 42 through the through hole 68 formed in the disk-shaped part 42 of the heat sink 40 and connected to the first circuit board 26.
  The LED modules 32, 34, 36, and 38 and the LED module 62 are connected in series by printed wiring (not shown) of the first circuit board 26. Then, a land (not shown) provided at the high potential side end of the serially connected wiring and a land (not shown) provided at the low potential side end are connected to the second circuit board 28 by an internal wiring (not shown). And are electrically connected.
  With the above configuration, the external power supplied from the commercial power supply via the base part 24 is converted into DC power by the lighting circuit composed of the electronic components 30 mounted on the second circuit board 28, and each of the LED modules 32, 34. , 36, 38 and 62, each of the LEDs constituting the LED module emits light.
  Further, the LED lamp 10 has a globe 70 that covers the LED modules 32, 34, 36, 38, 62. The globe 70 has a substantially oval shape with one end cut off, and an opening periphery is fitted into a stepped portion 42 </ b> C existing in the large cylindrical portion 16 of the holder 12. The step portion 42 </ b> C is filled with a heat-resistant adhesive 72, whereby the disk-shaped portion 42 and the globe 72 of the heat sink 40, and thus the first circuit board 26 are fixed to the holder 12. The globe 72 is made of a translucent material such as a synthetic resin material or a glass material. In addition, if the holder 12 uses metal things, such as aluminum, heat dissipation will also improve. In this case, an insulator that insulates the base portion 24 and the metal holder 12 is provided between the shell 20 and the small cylindrical portion 14, and the circuit is housed in a resin case or the like. Insulate.
  In the LED lamp 10 having the above-described configuration, the mounting substrate constituting the LED modules 32, 34, 36, 38 that emits light in the lateral direction (direction intersecting the central axis X including the axis of the base portion 24) Are also individually banded (elongated rectangles). For this reason, in general, since the substrate material in manufacturing by punching a large rectangular substrate material is not wasted as much as possible, the yield of the substrate material is improved.
  Each of the LED modules 32, 34, 36, and 38 is individually attached to the first circuit board 26. For this reason, before attaching to the 1st circuit board 26, since the process of connecting these LED modules beforehand etc. is unnecessary, the manufacturing man-hour for the part is not taken.
In the above example, four LED modules are used, but the number of LED modules is not limited to this, and may be two, three, or five or more.
In the above embodiment, the globe 70 that collectively covers the four LED modules 32, 34, 36, 38 is provided. However, the present invention is not limited to this, and a globe is provided for each of the LED modules 32, 34, 36, 38. May be provided. Specifically, four globes having an elongated bottomed cylindrical shape are prepared, and each LED module 32, 34, 36, 38 is covered. Thereby, a lamp having a shape similar to a so-called twin fluorescent lamp can be realized. In addition, the cross-sectional shape of a cylinder is arbitrary, such as a square and a circle.
<Embodiment 2>
FIG. 3 is a cross-sectional view showing a schematic configuration of a light bulb shaped LED lamp 80 (hereinafter simply referred to as “LED lamp 80”) according to the second embodiment, and FIG. It is a perspective view which shows LED module 104,106. In FIG. 4, the second circuit board 108 described later is omitted for convenience.
  The LED lamp 80 of the second embodiment has the same configuration as that of the LED lamp 10 of the first embodiment except that the configuration of the LED module and the heat sink are mainly different. Therefore, in FIG. 3, FIG. 4, the same code | symbol is attached | subjected to the component similar to the LED lamp 10, and the detailed description is abbreviate | omitted and hereafter, it demonstrates centering on a different part.
  The disc-shaped portion 86 of the first circuit board 82 and the heat sink 84 is fitted into the large cylindrical portion 18 of the holder 12. The outer shape of the disk-shaped part 86 is substantially the same as the disk-shaped part 42 of the first embodiment.
  The heat sink 84 also has an upright portion 88 provided upright from the front (front) surface of the disk-like portion 86 and provided corresponding to the LED modules 104 and 106 described later. The upright portion 88 is formed by a substantially U-shaped first arch portion 90 and a second arch portion 92 intersecting (planar crossing) at the central portion in the longitudinal direction (here, the intersecting portion is the first portion). 1 and the shared part 94 of the second arch parts 90 and 92. Therefore, the shared part 94 belongs to both the arch parts 90 and 92).
The disc-shaped part 86 has through holes 96, 98, 100, 102 for inserting LED modules, which are opened in the vicinity of the base end parts of the first arch part 90 and the second arch part 92. A plurality of (two in this example) LED modules 104 and 106 are provided. Both LED modules 104 and 106 have the same size and the same structure (that is, they are the same). Therefore, the LED module 104 will be described as a representative. The LED module 104 includes a mounting board 104S made of a strip-like flexible printed wiring board and a plurality of (in this example, 10) LEDs 104L mounted at a predetermined interval in the longitudinal direction of the mounting board 104S. It has an independent portable structure. The LED 104L has the same configuration as the LED 32L of the first embodiment.
  The LED chips (not shown) of each of the ten LEDs 104L are electrically connected in series by printed wiring (not shown) on the mounting substrate 104S. Terminal pins 104T are provided at both ends of the mounting substrate 104S. In the series connection, the wiring portion at the high potential side end and one terminal pin 104T are electrically connected, and the wiring portion at the low potential side end and the other terminal pin 104T are electrically connected.
  In the LED module 104, the mounting substrate 104S is curved in a U shape so that the LED 104L faces outside, and the terminal pins 104T provided at both ends thereof are pin holes (not shown) formed in the first circuit board 82. (Shown). The tip of each terminal pin 104T is soldered (not shown) to the printed wiring (not shown) of the first circuit board 82, as in the case of the first embodiment. In this case, the back surface of the mounting substrate 104S (the surface on which the LED 104L is not mounted) is in close contact with the first arch portion 90.
  The other LED module 106 is provided so as to three-dimensionally intersect the LED module 104 along the second arch portion 92. Note that terminal pins (not shown) provided at both ends of the mounting board 106S of the LED module 106 are fixed to the first circuit board 82 as in the case of the LED module 104.
  Here, the LEDs 104L and 106L are not mounted on the mounting boards 104S and 106S of the three-dimensional intersection (scheduled intersection) in both the LED modules 104 and 106. Thereby, the LED module can be mounted on the first circuit board 82 without paying attention to which one is the upper side and the lower side of the three-dimensional intersection.
  The crossing portion of the LED module 104 that is below the crossing is pushed down by the LED module 106 that is above the crossing, and is recessed downward (to the shared portion 94 side of the heat sink 84). The shared portion 94 of the heat sink 84 is similarly recessed downward in consideration of this recess. Thereby, the back surface of the mounting substrate 104S of the LED module 104 is in close contact with the first arch portion 90 over the entire length thereof. In addition, since the central portion (intersection) of the mounting substrate 104S is recessed downward, the two LEDs 104L mounted in the immediate vicinity of both sides of the intersection are directed in the direction of the central axis X of the LED lamp 80. Thereby, the light distribution spreads not only in the direction orthogonal to the central axis X but also in the direction of the central axis X. For this reason, it is possible to effectively spread the light distribution in the direction of the central axis X without providing LEDs at the three-dimensional intersection (curved portion top). Furthermore, in order to spread the light distribution in the direction of the central axis X, the type of component (mounting board, etc.) compared to the case where LEDs are provided at the three-dimensional intersection of the mounting board of the LED module above the three-dimensional intersection. Can be reduced.
  The second circuit board 108 is provided in a standing state on the surface of the disk-shaped part 86 of the heat sink 84 and in a region surrounded by the standing part 88. A plurality of electronic components 110 are mounted on the second circuit board 108, and thereby convert the power supplied from the commercial power source through the base unit 24 into the power necessary for lighting the LEDs 104 </ b> L and 106 </ b> L. A lighting circuit is configured. The second circuit board 108 is electrically connected to the base portion 24 via the first lead wire 112 connected to the shell 20 and the second lead wire 114 connected to the eyelet 22. Both the lead wires 112 and 114 are inserted through the first circuit board 82 and the communication hole 116 provided in the disc-shaped portion 86. The second circuit board 108 is electrically connected to the first circuit board 82 via the internal wirings 118 and 120.
  The LED module 104 and the LED module 106 are connected in series by a printed wiring (not shown) of the first circuit board 82, and are lit by power supplied from the second circuit board 108 via the internal wirings 118 and 120. Is done.
  Similar to the LED lamp 10 of the first embodiment, in the LED lamp 80 having the above-described configuration, each of the mounting substrates constituting the LED modules 104 and 106 is individually formed in a strip shape (elongated rectangle). For this reason, in general, since the substrate material in manufacturing by punching a large rectangular substrate material is not wasted as much as possible, the yield of the substrate material is improved.
  One LED module 104 and the other LED module 106 are individually attached to the first circuit board 82. For this reason, before the attachment to the 1st circuit board 82, since the process of connecting these LED modules beforehand etc. is unnecessary, the manufacturing man-hour for the part is not taken.
  Furthermore, since the heat sink 84 is provided in close contact with the back surfaces of the mounting substrates 104S and 106S, the heat generated by the LEDs 104L and 106L of the LED modules 104 and 106 is transferred to the back surfaces of the mounting substrates 104S and 106S, the first. Heat can be effectively radiated through the arch portion 90, the second arch portion 92, and the disk-shaped portion 86. In this regard, as in Patent Document 3, an LED lamp in which the flexible substrate 5 is only supported by the frame 4 and a heat sink that is in close contact with the back surface of the flexible substrate 5 is not provided (see FIGS. 4 and 4 of Patent Document 3). It is considered that better heat dissipation is obtained compared to .7).
  In the LED lamp 80, as shown in FIG. 5A, two LED modules 104 and 106 are provided to cross each other in a plan view. However, the present invention is not limited to this, and three or more LED modules are crossed. It doesn't matter if you let them.
FIG. 5B shows an example in which four LED modules 104, 106, 122, and 124 are crossed.
Alternatively, the height of the globe 70 (the length in the central axis X direction) may be slightly reduced, and the space between the curved portion outer peripheral surface of the LED module 106 and the inner peripheral surface of the globe 70 may be filled with silicone. By doing in this way, the heat which generate | occur | produces in LED module 106,104 is effectively transmitted to the globe 70 via the said silicone, and heat dissipation is improved.
<Embodiment 3>
In the first embodiment, straight LED modules 32, 34, 36, and 38 (FIGS. 1 and 2) are combined, and in the second embodiment, the LED modules 104 and 106 (FIGS. 3 and 4) curved in a U shape are used. ) To form LED lamps 10 and 80, respectively.
  On the other hand, in Embodiment 3, the LED lamp is configured by combining the straight LED modules 32 and 36 and the LED module 126 curved in a U-shape.
FIG. 6 shows a partial perspective view of an LED lamp having such a combination.
Since the LED modules 32 and 36 and the columnar portions 46 and 50 provided on the back surfaces of the mounting boards 32S and 36S are the same as those in the first embodiment, the same reference numerals are given and the description thereof is omitted.
  The LED module 126 has basically the same configuration as the LED modules 104 and 106 of the second embodiment. The main difference is that the LED module 126 also has the LED 126L disposed in the curved portion (where it intersects when intersecting) because it does not intersect with other LED modules.
The heat sink 128 has an arch portion 132 that corresponds to the LED module 126 and is an erected portion that is erected from the surface of the disk-shaped portion 130. The arch part 132 is in close contact with the back surface of the mounting board 126 </ b> S of the LED module 126.
<Embodiment 4>
In the fourth embodiment, the LED lamps 126 and 134 curved in a U-shape are arranged in parallel to constitute the LED lamp.
FIG. 7 shows a partial perspective view of an LED lamp having such a combination.
As shown in FIG. 7, in addition to the LED module 126, an LED module 134 is provided. The LED module 134 has the same configuration as the LED module 126.
  The LED module 126 and the LED module 134 are juxtaposed as shown in FIG. In accordance with this form, the heat sink 136 has an arch part 140 and an arch part 142 which are standing parts erected from the surface of the disk-like part 138 in parallel.
As described above, the LED lamp according to the present invention has been described based on the embodiment. However, the present invention is not limited to the above-described form, and for example, the following form may be adopted.
(1) In the above embodiment, the connection between the LED module mounting board and the first circuit board is realized by the terminal pins provided on the mounting board and the pin holes provided in the first circuit board. Is not limited to this. For example, a male or female connector may be provided at the end of the mounting board, a female or male connector may be provided on the first circuit board, and the connectors may be connected by relatively inserting them.
(2) In the above embodiment, each LED module is passed through from the front surface to the back surface of the disk-shaped portion 42 (FIGS. 1 and 2) and the disk-shaped portion 86 (FIGS. 3 and 4) of the heat sink. Although the holes 54, 56, 58, 60 and the through holes 96, 98, 100, 102 are provided, the present invention is not limited to this, and a notch may be provided. That is, it is possible to provide a notch portion cut in a U-shape, for example, in the radial direction from the outer periphery of the disk-shaped portions 42 and 86. Needless to say, the shape of the notch is not limited to a U-shape, and the shape may be any shape as long as the LED module can be inserted.
(3) In the above-described embodiment, the first circuit board and the disk-shaped portion of the heat sink are provided in this order from the direction of the central axis X and the base side, but both may be provided in the reverse order. I do not care. That is, the disk-shaped part of the heat sink and the first circuit board may be provided in this order from the direction of the central axis X and the base part side.
  Specifically, for example, the case of changing the first embodiment will be described as an example. The first circuit board 26 is made to correspond to each of the columnar portions 46, 48, 50, 52 of the heat sink 40, and the columnar portion 46. , 48, 50, 52 are opened through four through holes.
  The LED module 62 is provided at the center of the first circuit board 26 on the same side as the LED modules 32, 34, 36, and 38. The second circuit board 28 is provided on the back surface of the disk-shaped part 42 of the heat sink 40.
  The first circuit board 26 to which the LED modules 32, 34, 36, and 38 and the LED module 62 are connected is inserted into the four through-holes through the columnar portions 46, 48, 50, and 52, and the disk of the heat sink 40 It mounts on the shape part 42. FIG. Wiring between the first circuit board 26 and the second circuit board 28 is performed, for example, through any of the through holes 54, 56, 58, and 60. Note that unnecessary through holes may be eliminated.
The second embodiment is changed to constitute a light bulb-shaped LED lamp in which the disc-shaped portion of the heat sink and the first circuit board are provided in this order from the direction of the central axis X and the base portion side. It doesn't matter. In this case, a cross hole is formed in the first circuit board 82 so that the heat sink 84 can pass through the first circuit board 82.
(4) In the first embodiment, the second circuit board 28 for the lighting circuit is provided on the back surface side (inside the holder 12) of the disk-shaped portion 42 of the heat sink 40 (FIGS. 1 and 2). 2, the second circuit board 108 is provided on the front surface side (the globe 70 side) of the disk-shaped portion 82 (FIGS. 3 and 4). It doesn't matter if it is on the side.
  FIG. 8A and FIG. 8B show two examples in which the second circuit board is provided on the front surface side (inside the globe 70) of the disk-shaped portion 82 in the first embodiment. Each figure is a plan view illustrating each component member in a simplified manner with the globe 70 (FIG. 1) removed. In addition, the same code | symbol is attached | subjected about the same structural member shown in FIG. 1, FIG. 2, and the description is abbreviate | omitted.
  In FIG. 8A, reference numerals 144, 146, 148, 150 indicate the second circuit board. In this example, in order to provide the lighting circuit in a limited space, the electronic components constituting the lighting circuit are distributed and mounted on the plurality of second circuit boards 144, 146, 148, 150 (FIG. 8). The illustration of the electronic components is omitted in FIG.
  Each of the second circuit boards 144, 146, 148, and 150 has an elongated rectangular shape, and is provided on the disk-shaped portion 42 in a state of standing in the longitudinal direction. The second circuit boards 144, 146, 148, 150 are connected to each other by lead wires (not shown).
  In the example shown in FIG. 8A, the second circuit boards 144, 146, 148, 150 are LED modules 32, 34, 36, 38 (heat sink columnar portions 46, 48, 50, 52) and LED modules 62, respectively. Between.
  FIG. 8B shows that each of the second circuit boards 144, 146, 148, 150 is provided between the adjacent LED modules 32, 34, 36, 38 on the circumference centered on the central axis X. This is an example.
  The number of second circuit boards is not limited to four. The number of second circuit boards is determined by the size and quantity of electronic components to be mounted and the area (mounting ability) of the second circuit board per board, and is arbitrary.
  The position where the second circuit board is provided is not limited to the above example. In short, any position that does not block light emitted from the LED as much as possible is acceptable.
  The light bulb shaped LED lamp according to the present invention can be suitably used as an alternative light source for an incandescent light bulb, for example.
10, 80 Light bulb shaped LED lamp 24 Base part 26, 82 First circuit board 32, 34, 36, 38, 104, 106 LED module 32S, 34S, 36S, 38S, 104S, 106S Mounting board 32L, 36L, 104L, 106L LED

Claims (5)

  1. A light bulb-shaped LED lamp having a plurality of LED modules provided on a pedestal and having a circuit for receiving external power via a base and lighting the LED module,
    Each of the LED modules has an independent transport structure in which a plurality of LEDs are mounted on a mounting substrate that is individually band-shaped,
    Each of the LED modules is provided in a standing state on the pedestal individually in a non-contact state ,
    A circuit board on which the electronic components constituting the circuit are mounted is provided in a standing state on the surface of the pedestal, in a state of being in non-contact with the plurality of LED modules, in an area surrounded by the plurality of LED modules. LED lamp characterized by having.
  2.   The mounting board of at least one LED module among the plurality of LED modules is a flexible board, and is erected on the pedestal in a state where the mounting board is curved in an arch shape. Item 2. The LED lamp according to Item 1.
  3.   Among the plurality of LED modules, at least two of the LED modules are such that the mounting substrate is a flexible substrate, and the mounting substrates are erected so that the two mounting substrates intersect in a three-dimensional manner. The LED lamp according to claim 1, wherein:
  4.   The LED lamp according to claim 3, wherein the two mounting boards are three-dimensionally crossed at a portion where the LEDs are not mounted.
  5. A heat sink having a plate-like portion, and a standing portion provided corresponding to each LED module, erect from the surface of the plate-like portion;
    The heat sink is provided in a state where the back surface of the plate-like portion faces the pedestal, and the plate-like portion has a through hole or a notch through which each LED module is inserted from the front surface to the back surface side. And
    5. The LED lamp according to claim 1, wherein each of the standing portions is in contact with a surface opposite to the LED mounting surface of the mounting substrate of the corresponding LED module. .
JP2010128632A 2010-06-04 2010-06-04 LED lamp Active JP5662059B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010128632A JP5662059B2 (en) 2010-06-04 2010-06-04 LED lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010128632A JP5662059B2 (en) 2010-06-04 2010-06-04 LED lamp

Publications (2)

Publication Number Publication Date
JP2011253782A JP2011253782A (en) 2011-12-15
JP5662059B2 true JP5662059B2 (en) 2015-01-28

Family

ID=45417544

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010128632A Active JP5662059B2 (en) 2010-06-04 2010-06-04 LED lamp

Country Status (1)

Country Link
JP (1) JP5662059B2 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5750297B2 (en) * 2011-04-19 2015-07-15 日本メクトロン株式会社 Substrate assembly and lighting device
WO2013182937A1 (en) * 2012-06-04 2013-12-12 Koninklijke Philips N.V. Lamp comprising a flexible printed circuit board
CN104251470A (en) * 2013-06-28 2014-12-31 上海德士电器有限公司 Pawl type LED (light emitting diode) assembly and LED bulb lamp using same
CN103343902A (en) * 2013-07-05 2013-10-09 邵子刚 LED lamp with built-in power source
CN104421870A (en) * 2013-08-23 2015-03-18 上海德士电器有限公司 Comb type LED component and LED bubble using same
JP6261119B2 (en) * 2013-12-26 2018-01-17 岩崎電気株式会社 Light source support for LED lamp and assembly thereof
BR112017025425A2 (en) * 2015-06-04 2018-08-07 Corvi Led Pvt Ltd led lamp assembly and method for mounting a led lamp assembly
TW201644075A (en) * 2015-06-11 2016-12-16 Unity Opto Technology Co Ltd Solid-state encapsulated LED light bulb
WO2016198431A1 (en) * 2015-06-11 2016-12-15 Philips Lighting Holding B.V. Carrier for solid-state lighting devices intended for a light bulb.
CH711339B1 (en) * 2015-07-17 2019-06-28 Corvi Led Pvt Ltd LED lamp assembly and method of making the same.
USD800373S1 (en) 2016-02-05 2017-10-17 Corvi Led Pvt Ltd. Lamp
CN105972461A (en) * 2016-06-30 2016-09-28 浙江生辉照明有限公司 LED light source module and LED lamp
CN106195679A (en) * 2016-06-30 2016-12-07 浙江生辉照明有限公司 A kind of LED
WO2018015781A1 (en) * 2016-07-19 2018-01-25 Ismet Yesil Self light guided led lighting unit
CN106535408A (en) * 2016-11-29 2017-03-22 深圳市裕富照明有限公司 LED light-emitting assembly

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5017A (en) * 1847-03-13 1847-03-13 Self-adjusting- pendulum
US6283604B1 (en) * 1999-09-20 2001-09-04 Ching-Shin Liao Electro luminescent illuminator
JP2006244725A (en) * 2005-02-28 2006-09-14 Atex Co Ltd Led lighting system
JP3139851U (en) * 2007-12-11 2008-03-06 呉祖耀 LED light
US8013501B2 (en) * 2008-06-04 2011-09-06 Forever Bulb, Llc LED-based light bulb device
JP2010055993A (en) * 2008-08-29 2010-03-11 Toshiba Lighting & Technology Corp Lighting system and luminaire
JP5246402B2 (en) * 2008-09-16 2013-07-24 東芝ライテック株式会社 Light bulb shaped lamp

Also Published As

Publication number Publication date
JP2011253782A (en) 2011-12-15

Similar Documents

Publication Publication Date Title
JP5662059B2 (en) LED lamp
US8727789B2 (en) Electrical connectors and light emitting device package and methods of assembling the same
EP2228587B1 (en) Led bulb and lighting apparatus
CN103180661B (en) Lamp and lighting device
KR101253199B1 (en) Lighting apparatus
US20130328088A1 (en) LED Module and Lighting Apparatus
JP5360402B2 (en) Light bulb shaped lamp and lighting equipment
EP2392851A1 (en) LED lighting device
JP3187458U (en) Light emitting diode bulb
EP2662620A1 (en) Bulb-shaped lamp and luminaire
CN203734891U (en) Light source for lighting and lighting device
KR20130128623A (en) Lighting apparatus
JP5129411B1 (en) lamp
JP5584841B2 (en) Illumination light source and illumination device
JP5971504B2 (en) Illumination light source and illumination device
TW201344091A (en) Light-emitting module and lamp
JPWO2014030271A1 (en) Light bulb shaped lamp and lighting device
CN204201514U (en) Bulb-shaped lamp and lighting device
JP5563730B1 (en) Illumination light source and illumination device
JP6135986B2 (en) Illumination light source and illumination device
JP6124054B2 (en) Illumination light source and illumination device
JP5967483B2 (en) Light source for illumination
JP5948666B2 (en) Illumination light source and illumination device
JP2019114482A (en) Lighting device
WO2014024339A1 (en) Bulb-type lamp, illumination device, and method for manufacturing bulb-type lamp

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20130409

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20131209

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20131217

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140212

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20140606

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140624

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140825

A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A711

Effective date: 20141007

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20141111

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20141204

R150 Certificate of patent or registration of utility model

Ref document number: 5662059

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150