WO2012093548A1 - 成膜パターン形成方法及び成膜パターン形成装置 - Google Patents

成膜パターン形成方法及び成膜パターン形成装置 Download PDF

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Publication number
WO2012093548A1
WO2012093548A1 PCT/JP2011/078378 JP2011078378W WO2012093548A1 WO 2012093548 A1 WO2012093548 A1 WO 2012093548A1 JP 2011078378 W JP2011078378 W JP 2011078378W WO 2012093548 A1 WO2012093548 A1 WO 2012093548A1
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Prior art keywords
pattern
forming
film
wiring
mounting member
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PCT/JP2011/078378
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English (en)
French (fr)
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謙磁 塚田
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富士機械製造株式会社
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Definitions

  • the present invention relates to a film forming pattern forming method and a film forming pattern forming apparatus for forming a film forming pattern by a droplet discharge method across a plurality of circuit elements mounted on a mounting member and the mounting member. is there.
  • a semiconductor element mounting process after a semiconductor element is die-bonded to a mounting member (circuit board, lead frame, etc.), wiring between the electrode of the semiconductor element and a pad of the mounting member is generally performed by wire bonding. Is.
  • Patent Document 1 Japanese Patent No. 3992038
  • a resin slope is formed by discharging a fluid resin material around the semiconductor element with a dispenser and connecting the upper surface of the semiconductor element and the surface of the wiring board with an inclined surface.
  • a wiring technique has been proposed in which a wiring pattern for connecting between the electrode on the upper surface of the semiconductor element and the pad of the wiring substrate is formed on the resin slope by the droplet discharge method after the formation.
  • Patent Document 2 Japanese Patent Laid-Open No. 2005-50911
  • a lead frame and one semiconductor element mounted on the lead frame are used with a camera. It has been proposed to pick up an image, recognize the position of the electrode on the upper surface of the semiconductor element and the position of the lead frame from the picked-up image, determine the position of the wiring pattern that connects them, and form the wiring pattern by the droplet discharge method .
  • This type of semiconductor product is shipped to the user after die bonding a large number of semiconductor elements to a single mounting member (multiple substrate, lead frame, etc.) on a single mounting member.
  • the mounting member is divided for each semiconductor element and mounted on a circuit board or the like.
  • each semiconductor element is mounted. It is desirable to modify and form the position at which the resin slope or wiring pattern is formed for each semiconductor element in accordance with the displacement of the element mounting position.
  • Patent Documents 1 and 2 only describe a method of forming a resin slope or a wiring pattern for one semiconductor element mounted on a mounting member, and a plurality of semiconductor elements mounted on the mounting member. However, there is no description of a method for forming a resin slope or a wiring pattern in a lump. As in Patent Document 2, for each of the semiconductor elements mounted on the mounting member, each semiconductor element is subjected to a process of picking up an image of the semiconductor elements one by one and designating a position where a resin slope or wiring pattern is formed. Then, it takes time and production efficiency is bad.
  • the problem to be solved by the present invention is that a plurality of circuit elements mounted on a mounting member and a film forming pattern (for example, a resin slope, a wiring pattern, etc.) straddling the mounting member are formed by a droplet discharge method. It is an object of the present invention to provide a film formation pattern forming method and a film formation pattern forming apparatus capable of forming with high positional accuracy and efficiency.
  • the present invention provides a film formation pattern forming method for forming a film formation pattern by a droplet discharge method across a plurality of circuit elements mounted on a mounting member and the mounting member ( Film-forming pattern forming apparatus), in which the mounting member and the plurality of circuit elements mounted on the mounting member are collectively stored in the field of view of the camera or imaged by dividing the imaging area into two or more parts,
  • An image recognition step image recognition means for recognizing a positional relationship between the mounting member and each circuit element from the captured image, and a position between the mounting member and each circuit element recognized in the image recognition step (image recognition means)
  • a film forming pattern forming position specifying step film forming pattern forming position specifying means for specifying a position for forming the film forming pattern for each circuit element on the basis of a relationship;
  • a droplet discharge step (droplet discharge unit) for forming the film formation pattern by a droplet discharge method at a position specified for each circuit element in (film formation pattern formation position specifying unit
  • the mounting member and a plurality of circuit elements mounted on the mounting member are collectively captured in the field of view of the camera or imaged by dividing the imaging area into two or more parts, and the mounting member is obtained from the captured image.
  • the number of times of imaging is less than the number of circuit elements mounted on the mounting member, because the positional relationship between the circuit element and each circuit element is recognized and the position at which the film formation pattern is formed for each circuit element is specified based on the positional relationship.
  • the film pattern can be formed with high positional accuracy and efficiency by the droplet discharge method.
  • the present invention creates a drawing file for each film forming material for designating a position for forming a plurality of types of film forming patterns having different film forming materials in the film forming pattern forming position specifying step, and You may make it form the said film-forming pattern using the said drawing file for every different film-forming material. In this way, even when a plurality of types of film formation patterns overlap each other, a plurality of types of film formation patterns can be formed with high positional accuracy and efficiency by the droplet discharge method for each circuit element.
  • the drawing for the inclined surface resin that designates the position at which the film formation pattern of the inclined surface resin that is inclined downward from the upper side surface of the circuit component toward the surface of the mounting member is formed.
  • a wiring base drawing file for designating a position at which a wiring base film forming pattern made of a resin or surface treatment material having a property different from that of the inclined surface resin is formed on the inclined surface resin film forming pattern;
  • the wiring base film forming pattern is formed on the inclined surface resin film forming pattern using the wiring base drawing file, Using drawing file for a line may be the deposition pattern of the wiring to be formed on the deposition pattern for the wiring substrate.
  • drawing file for a line may be the deposition pattern of the wiring to be formed on the deposition pattern for the wiring substrate.
  • the mounting member on which the plurality of circuit elements are mounted may be, for example, a single circuit board, a lead frame, or a multi-chip board.
  • FIG. 1 is a diagram for explaining a wiring pattern forming process in one embodiment of the present invention.
  • FIG. 2 is a flowchart showing the flow of processing of the pattern forming program.
  • FIG. 3 is an enlarged longitudinal sectional view schematically showing the LED mounting structure.
  • FIG. 4 is a block diagram illustrating a configuration example of a film forming pattern forming apparatus.
  • a lead frame 11 as a mounting member is formed with a die pad 12 and leads 13 and is joined to an insulating base material 14.
  • An LED chip 15 (circuit element) is die-bonded to the die pad 12 with an adhesive 16, and an inclined surface resin pattern 17, which is an inclined surface resin film forming pattern inclined downward from the upper edge of the side surface of the LED chip 15 toward the lead 13.
  • a wiring pattern 19 formed by a droplet discharge method (for example, a dispenser) and forming a wiring pattern for connecting the electrode 18 on the upper surface of the LED chip 15 and the lead 13 is formed on the inclined surface resin pattern 17. It is formed by a method (for example, ink jet).
  • the LED mounting structure for one chip is shown in FIG. 3, in reality, as shown in FIG. 1, a large number of LED chips 15 are die-bonded to a single lead frame 11 at a predetermined pitch. ing. In FIG. 1, the lead 13 and the like of the lead frame 11 are not shown. In addition, after the formation of the wiring pattern 19, the LED chip 15 and the wiring pattern 19 may be molded (sealed) with an insulating resin or the like as necessary to form a package.
  • a control device 21 that is a main body of the control of the film forming pattern forming device is constituted by a personal computer or the like, controls the imaging operation of the camera 22, and displays a display device 25 such as a liquid crystal display that displays an image captured by the camera 22, and the like.
  • a display device 25 such as a liquid crystal display that displays an image captured by the camera 22, and the like.
  • an input device 26 such as a keyboard and a mouse.
  • a camera 22 that can fit the entire lead frame 11 within the field of view is used.
  • the control device 21 is installed with an image processing program that processes an image captured by the camera 22 and recognizes the position of the edge of each LED chip 15 and the position of each lead 13 of the lead frame 11.
  • control device 21 controls the discharge operation of the dispenser device 23 and the ink jet device 24 which are two types of droplet discharge means.
  • the dispenser device 23 ejected a fluid resin material between the side surface of the LED chip 15 and the lead 13 to form the inclined surface resin pattern 17 that inclines downward from the upper end of the side surface of the LED chip 15 toward the lead 13.
  • a wiring base pattern 20 is formed on the inclined surface resin pattern 17 by discharging a resin or surface treatment material having a property different from that of the inclined surface resin pattern 17.
  • the inclined surface resin pattern 17 and the wiring base pattern 20 may be formed by separate dispensers.
  • the inkjet device 24 discharges a conductive ink material onto the wiring base pattern 20 to form a wiring pattern 19 that connects the electrode 18 on the upper surface of the LED chip 15 and the lead 13.
  • the wiring base pattern 20 interposed between the inclined surface resin pattern 17 and the wiring pattern 19 may be formed of a resin or surface treatment material having a property different from that of the inclined surface resin pattern 17. Is formed of a resin having a property different from that of the inclined surface resin pattern 17 because the resin of the inclined surface resin pattern 17 cannot be cured even after being cured, and the organic matter decomposed by the subsequent heat treatment is used for wiring. This is to prevent the pattern 19 from being mixed, and as an effect, it is possible to improve the adhesion between the inclined surface resin pattern 17 and the wiring pattern 19 while ensuring the conductivity of the wiring pattern 19.
  • the purpose of forming the wiring base pattern 20 with the surface treatment material is to make the wiring pattern 19 finer and to improve the adhesion with the inclined surface resin pattern 17. As an effect, the LED chip 15 and the lead frame are effective. 11 leads 13 can be reliably connected by the wiring pattern 19, and furthermore, the width of the wiring pattern 19 can be controlled by the balance between liquid repellency and lyophilicity.
  • control device 21 executes the pattern forming program shown in FIG. 2 to capture the entire lead frame 11 within the field of view of the camera 22 and capture the lead 13 of the lead frame 11 and each LED chip from the captured image. 15 and a film forming pattern (inclined surface resin) for each LED chip 15 based on the positional relationship between the recognized lead 13 of the lead frame 11 and each LED chip 15.
  • a film formation pattern formation position designation means for designating positions for forming the pattern 17, the wiring base pattern 20 and the wiring pattern 19
  • a droplet discharge means (dispenser device 23 and Inkjet device 24) is used to form film forming materials (flowable resin materials or surface treatment materials, conductive By ejecting material) to form a deposition pattern (inclined surface resin pattern 17, the wiring layer pattern 20 and the wiring pattern 19).
  • the formation of the inclined surface resin pattern 17 and the wiring pattern 19 of the present embodiment described above is executed by the control device 21 according to the pattern formation program of FIG.
  • the processing contents of the pattern formation program shown in FIG. 2 will be described below.
  • step 101 the entire lead frame 11 to which a large number of LED chips 15 are die-bonded is placed in the field of view of the camera 22 and imaged. Thereafter, the process proceeds to step 102, where the image captured by the camera 22 is processed to recognize the positions (edges) of the LED chips 15 on the lead frame 11 and the positions of the leads 13 of the lead frame 11.
  • step 103 the process proceeds to step 103, and the inclined surface that inclines downward from the side surface upper edge of each LED chip 15 toward the lead 13 based on the position recognition result of the side surface upper edge of each LED chip 15 and the lead 13 of the lead frame 11.
  • a drawing file [refer to FIG. 1 (e)] for the inclined surface resin that specifies the position where the inclined surface resin pattern 17 that is a resin film forming pattern is to be formed is created.
  • the drawing file for the inclined surface resin includes the position data of all the inclined surface resin patterns 17 formed on the lead frame 11.
  • step 104 a wiring base drawing file [refer to FIG. 1 (f)] for specifying a position where the wiring base pattern 20 is formed on the inclined surface resin pattern 17 is created.
  • the wiring base drawing file includes position data of all the wiring base patterns 20 formed on the lead frame 11.
  • step 105 the electrodes 18 on the upper surface of the LED chips 15 on the lead frame 11 are connected to the leads 13 based on the position recognition result of the upper side edges of the LED chips 15 and the leads 13 of the lead frame 11.
  • Wiring pattern 1 which is a film forming pattern of wiring to be performed
  • a wiring drawing file [refer to FIG. 1 (g)] for designating a position for forming 9 is created.
  • the position of each electrode 18 is calculated from the position of the upper edge of the side surface of each LED chip 15, and wiring drawing is performed so that each electrode 18 and each corresponding lead 13 are connected by a wiring pattern 19.
  • This wiring drawing file includes position data of all wiring patterns 19 formed on the lead frame 11.
  • the position of each electrode 18 of the LED chip 15 can be recognized from the captured image of the camera 22, the position of each electrode 18 may also be recognized by image processing.
  • step 106 the dispenser device 23 is driven to discharge the flowable resin material to all the positions specified in the drawing file for the inclined surface resin.
  • a surface resin pattern 17 is formed.
  • an inclined surface resin pattern 17 that is inclined downward from the upper edge of the side surface of each LED chip 15 toward the lead 13 is formed.
  • step 107 the dispenser device 23 is driven and the inclined surface resin pattern is formed at all positions designated by the wiring base drawing file.
  • a wiring base pattern 20 is formed on the inclined surface resin pattern 17 by discharging a resin or surface treatment material having a property different from that of the resin 17.
  • the inclined surface resin pattern 17 and the wiring base pattern 20 may be formed by separate dispensers.
  • step 108 the ink jet device 24 is driven to discharge the conductive ink material to all the positions designated in the wiring drawing file, thereby forming the wiring pattern 19. It is formed on the wiring base pattern 20.
  • the wiring pattern 19 connects the electrodes 18 of the LED chip 15 and the leads 13.
  • the entire lead frame 11 to which a large number of LED chips 15 are die-bonded is stored in the field of view of the camera 22, and the positions of the leads 13 of the lead frame 11 and the LED chips 15 are determined from the captured image. And, based on the position recognition result, a drawing file for the inclined surface resin that specifies the position at which the inclined surface resin pattern 17 inclined downward from the upper edge of the side surface of each LED chip 15 toward the lead 13 is formed, A drawing file for wiring base designating a position for forming the wiring base pattern 20 on the inclined surface resin pattern 17 and a position for forming the wiring pattern 19 for connecting the electrode 18 on the upper surface of each LED chip 15 and the lead 13 are designated.
  • dispensation is performed at all positions specified in the drawing file for inclined surface resin.
  • the dispenser device 23 After the flowable resin material is discharged by the service device 23 to form the resin pattern 17, the dispenser device 23 has a property different from that of the inclined surface resin pattern 17 at all positions specified in the drawing file for wiring base. Resin or surface treatment material is discharged to form the wiring base pattern 20 on the inclined surface resin pattern 17, and then the conductive ink material is discharged to all positions designated by the wiring drawing file by the inkjet device 24. Thus, the wiring pattern 19 is formed on the wiring base pattern 20.
  • the position where the inclined surface resin pattern 17, the wiring base pattern 20, and the wiring pattern 19 are formed with high accuracy is designated with respect to all the LED chips 15 on the lead frame 11 by one imaging operation of the camera 22.
  • the inclined surface resin pattern 17, the wiring base pattern 20, and the wiring pattern 19 can be formed with high positional accuracy and efficiency by the droplet discharge method.
  • the entire lead frame 11 to which a large number of LED chips 15 are die-bonded is captured within the field of view of the camera 22, but the imaging area of the lead frame 11 is divided into two or more parts. You may make it produce a synthesized image of the whole lead frame 11 by imaging and synthesizing those divided images. Even in this case, if two or more LED chips 15 are included in one divided image, the number of imaging is less than the total number of LED chips 15 die-bonded to the lead frame 11, and the die frame is die-bonded. Recognizing all the positions of a large number of LED chips 15, it is possible to designate a position where a film formation pattern is formed for each LED chip 15, and to form a film formation pattern for each LED chip 15 die-bonded to the lead frame 11. It can be formed with high positional accuracy and efficiency by the droplet discharge method.
  • both the inclined surface resin pattern 17 and the wiring base pattern 20 were formed with the dispenser apparatus, both the inclined surface resin pattern 17 and the wiring base pattern 20 were used with the inkjet apparatus. You may make it form.
  • the circuit element to which the present invention can be applied is not limited to the LED chip 15 but may be other semiconductor elements, and may be a resistor, a capacitor, or the like.
  • the present invention can also be applied to the formation of any one or two film formation patterns, and can also be applied to the formation of other film formation patterns such as resistor patterns and dielectric patterns.
  • the present invention can also be applied to the case where the film formation pattern is formed.
  • the example in which the plurality of LED chips 15 (circuit elements) are mounted on the lead frame 11 has been described.
  • the mounting member on which the plurality of LED chips 15 (circuit elements) are mounted is divided on the user side.
  • the present invention can also be applied to a case where a plurality of circuit elements are mounted on a single circuit board that is not divided.
  • the plurality of circuit elements mounted on the mounting member are not limited to those of the same type, and the present invention can also be applied to a case where a plurality of types of circuit elements are mounted on the mounting member.
  • SYMBOLS 11 Lead frame, 12 ... Die pad, 13 ... Lead, 14 ... Insulating base material, 15 ... LED chip (circuit element), 16 ... Adhesive, 17 ... Inclined surface resin pattern (film formation pattern), 18 ... Electrode , 19 ... wiring pattern (film formation pattern), 20 ... wiring base pattern (film formation pattern), 21 ... control device (image recognition means, film formation pattern formation position designation means), 22 ... camera, 23 ... dispenser device (liquid Droplet discharge means), 24... Inkjet device (droplet discharge means)

Abstract

　多数のＬＥＤチップ１５が搭載されたリードフレーム１１全体をカメラの視野内に収めて撮像してその撮像画像からリードフレーム１１のリードと各ＬＥＤチップ１５の位置を認識し、その認識結果に基づいて、各ＬＥＤチップ１５の側面上端からリードに向けて下り傾斜する傾斜面樹脂パターン１７を形成する位置を指定する傾斜面樹脂用の描画ファイルと、配線下地パターン２０を傾斜面樹脂パターン１７上に形成する位置を指定する配線下地用の描画ファイルと、配線パターン１９を形成する位置を指定する配線用の描画ファイルを作成し、これらの描画ファイルを用いて、傾斜面樹脂パターン１７、配線下地パターン２０及び配線パターン１９をディスペンサ装置又はインクジェット装置で形成する。

Description

成膜パターン形成方法及び成膜パターン形成装置
　本発明は、搭載部材に搭載された複数の回路素子と該搭載部材とに跨がってそれぞれ液滴吐出法により成膜パターンを形成する成膜パターン形成方法及び成膜パターン形成装置に関する発明である。
　従来より、半導体素子の実装工程では、半導体素子を搭載部材（回路基板、リードフレーム等）にダイボンドした後に、該半導体素子の電極と搭載部材のパッドとの間をワイヤボンディングで配線するのが一般的である。
　しかし、特許文献１（特許第３９９２０３８号公報）に記載されているように、ワイヤボンディングを行うときの機械的なストレスによって不良が発生する可能性があるため、ワイヤボンディングに代わる接続信頼性の高い実装構造を低コストで実現することを目的として、半導体素子の周囲に流動性の樹脂材料をディスペンサで吐出して、半導体素子の上面と配線基板の表面との間を傾斜面でつなぐ樹脂スロープを形成した後、半導体素子上面の電極と配線基板のパッドとの間を接続する配線パターンを液滴吐出法により樹脂スロープ上に形成する配線技術が提案されている。
　更に、特許文献２（特開２００５－５０９１１号公報）では、液滴吐出法により形成する配線パターンの位置精度を向上させることを目的として、リードフレームとこれに搭載した１つの半導体素子をカメラで撮像してその撮像画像から半導体素子上面の電極とリードフレームの位置を認識して、両者を接続する配線パターンの位置を決めて、配線パターンを液滴吐出法により形成することが提案されている。
特許第３９９２０３８号公報 特開２００５－５０９１１号公報
　この種の半導体製品は、製造会社側で、１枚の搭載部材（多数個取り基板、リードフレーム等）に多数の半導体素子をダイボンドして配線等を施してからユーザーに出荷し、ユーザー側で、搭載部材を各半導体素子毎に分割して回路基板等に実装する場合が多い。
　この場合、搭載部材上の各半導体素子の搭載位置は、製造ばらつきにより多少の位置ずれが生じることは避けられないため、液滴吐出法により樹脂スロープや配線パターンを形成する際には、各半導体素子の搭載位置の位置ずれに応じて各半導体素子毎に樹脂スロープや配線パターンを形成する位置を修正して形成することが望ましい。
　しかし、上記特許文献１，２には、搭載部材に搭載した１つの半導体素子に対して樹脂スロープや配線パターンを形成する方法が記載されているだけであり、搭載部材に搭載した複数の半導体素子に対して一括して樹脂スロープや配線パターンを形成する方法が記載されていない。特許文献２のように、搭載部材に搭載した多数の半導体素子について、半導体素子を１個ずつ撮像して樹脂スロープや配線パターンを形成する位置を指定する処理を各半導体素子毎に行っていたのでは、手間がかかり、生産能率が悪い。
　そこで、本発明が解決しようとする課題は、搭載部材に搭載された複数の回路素子と該搭載部材とに跨がる成膜パターン（例えば、樹脂スロープ、配線パターン等）を液滴吐出法により位置精度良く且つ能率良く形成できる成膜パターン形成方法及び成膜パターン形成装置を提供することである。
　上記課題を解決するために、本発明は、搭載部材に搭載された複数の回路素子と該搭載部材とに跨がってそれぞれ液滴吐出法により成膜パターンを形成する成膜パターン形成方法（成膜パターン形成装置）において、前記搭載部材とこれに搭載した前記複数の回路素子とを一括してカメラの視野内に収めて撮像し又はその撮像エリアを２分割以上に分割して撮像し、その撮像画像から前記搭載部材と各回路素子との位置関係を認識する画像認識工程（画像認識手段）と、前記画像認識工程（画像認識手段）で認識した前記搭載部材と各回路素子との位置関係を基準にして前記各回路素子毎に前記成膜パターンを形成する位置を指定する成膜パターン形成位置指定工程（成膜パターン形成位置指定手段）と、前記成膜パターン形成位置指定工程（成膜パターン形成位置指定手段）で前記各回路素子毎に指定された位置にそれぞれ液滴吐出法により前記成膜パターンを形成する液滴吐出工程（液滴吐出手段）を含むことを特徴とするものである。
　本発明では、搭載部材とこれに搭載した複数の回路素子とを一括してカメラの視野内に収めて撮像し又はその撮像エリアを２分割以上に分割して撮像し、その撮像画像から搭載部材と各回路素子との位置関係を認識し、その位置関係を基準にして各回路素子毎に成膜パターンを形成する位置を指定するため、搭載部材に搭載した回路素子の数よりも少ない撮像回数で、搭載部材に搭載した複数の回路素子の全ての位置を認識して各回路素子毎に成膜パターンを形成する位置を指定することができ、搭載部材に搭載された各回路素子毎に成膜パターンを液滴吐出法により位置精度良く且つ能率良く形成することができる。
　本発明は、成膜パターン形成位置指定工程で、成膜材料の異なる複数種類の成膜パターンを形成する位置を指定する描画ファイルを成膜材料毎に作成し、液滴吐出工程で、種類の異なる成膜材料毎に前記描画ファイルを用いて前記成膜パターンを形成するようにしても良い。このようにすれば、複数種類の成膜パターンが上下に重なる場合でも、各回路素子毎に複数種類の成膜パターンを液滴吐出法により位置精度良く且つ能率良く形成することができる。
　具体的には、成膜パターン形成位置指定工程で、回路部品の側面上端から搭載部材の表面に向けて下り傾斜する傾斜面樹脂の成膜パターンを形成する位置を指定する傾斜面樹脂用の描画ファイルと、前記傾斜面樹脂とは異なる性質の樹脂又は表面処理材料からなる配線下地用の成膜パターンを前記傾斜面樹脂の成膜パターン上に形成する位置を指定する配線下地用の描画ファイルと、配線の成膜パターンを前記配線下地用の成膜パターン上に形成する位置を指定する配線用の描画ファイルとを作成し、液滴吐出工程で、前記傾斜面樹脂用の描画ファイルを用いて前記傾斜面樹脂の成膜パターンを形成した後、前記配線下地用の描画ファイルを用いて前記配線下地用の成膜パターンを前記傾斜面樹脂の成膜パターン上に形成し、その後、前記配線用の描画ファイルを用いて前記配線の成膜パターンを前記配線下地用の成膜パターン上に形成するようにしても良い。このようにすれば、各回路素子毎に傾斜面樹脂の成膜パターンと配線下地用の成膜パターンを下地とする配線の成膜パターン（配線パターン）を液滴吐出法により位置精度良く且つ能率良く形成することができる。
　この場合、複数の回路素子を搭載する搭載部材は、例えば、１枚の回路基板であっても良いし、リードフレーム又は多数個取り基板であっても良い。
図１は本発明の一実施例における配線パターンの形成工程を説明する図である。 図２はパターン形成プログラムの処理の流れを示すフローチャートである。 図３はＬＥＤ実装構造を模式的に示す拡大縦断面図である。 図４は成膜パターン形成装置の構成例を説明するブロック図である。
　以下、本発明を実施するための形態をＬＥＤ実装方法に適用して具体化した一実施例を説明する。
　まず、図３に基づいてＬＥＤ実装構造を説明する。
　搭載部材であるリードフレーム１１は、ダイパッド１２とリード１３等が形成され、絶縁性の基材１４に接合されている。ダイパッド１２にはＬＥＤチップ１５（回路素子）が接着剤１６でダイボンドされ、ＬＥＤチップ１５の側面上端エッジからリード１３に向けて下り傾斜する傾斜面樹脂の成膜パターンである傾斜面樹脂パターン１７が液滴吐出法（例えばディスペンサ）により形成され、該傾斜面樹脂パターン１７上には、ＬＥＤチップ１５上面の電極１８とリード１３とを接続する配線の成膜パターンである配線パターン１９が液滴吐出法（例えばインクジェット）により形成されている。
　図３には、チップ１個分のＬＥＤ実装構造しか図示されていないが、実際には、図１に示すように、１枚のリードフレーム１１に、多数のＬＥＤチップ１５が所定ピッチでダイボンドされている。図１では、リードフレーム１１のリード１３等の図示が省略されている。尚、配線パターン１９の形成後に、必要に応じて、ＬＥＤチップ１５と配線パターン１９等を絶縁性樹脂等によりモールド（封止）して、パッケージ化するようにしても良い。
　次に、図４を用いて成膜パターン形成装置の構成例を説明する。
　成膜パターン形成装置の制御の主体となる制御装置２１は、パーソナルコンピュータ等により構成され、カメラ２２の撮像動作を制御すると共に、カメラ２２の撮像画像等を表示する液晶ディスプレイ等の表示装置２５と、キーボード、マウス等からなる入力装置２６とが接続されている。カメラ２２は、リードフレーム１１全体を視野内に収めることができるものが用いられる。制御装置２１は、カメラ２２で撮像した画像を処理して各ＬＥＤチップ１５のエッジの位置とリードフレーム１１の各リード１３の位置を認識する画像処理プログラムがインストールされている。
　更に、制御装置２１は、２種類の液滴吐出手段であるディスペンサ装置２３とインクジェット装置２４の吐出動作を制御する。ディスペンサ装置２３は、流動性の樹脂材料をＬＥＤチップ１５の側面とリード１３との間に吐出して、ＬＥＤチップ１５の側面上端からリード１３に向けて下り傾斜する傾斜面樹脂パターン１７を形成した後、この傾斜面樹脂パターン１７上に、傾斜面樹脂パターン１７とは異なる性質の樹脂又は表面処理材料を吐出して配線下地パターン２０を形成する。尚、傾斜面樹脂パターン１７と配線下地パターン２０とを別々のディスペンサ装置で形成しても良い。
　一方、インクジェット装置２４は、導電性インク材料を配線下地パターン２０上に吐出して、ＬＥＤチップ１５上面の電極１８とリード１３とを接続する配線パターン１９を形成する。
　ここで、傾斜面樹脂パターン１７と配線パターン１９との間に介在させる配線下地パターン２０は、傾斜面樹脂パターン１７とは異なる性質の樹脂又は表面処理材料で形成すれば良いが、配線下地パターン２０を傾斜面樹脂パターン１７とは異なる性質の樹脂で形成する目的は、傾斜面樹脂パターン１７の樹脂によっては硬化後であっても硬化しきらない表面の樹脂や後の熱処理によって分解した有機物が配線パターン１９に混入しないようにするためであり、効果としては、配線パターン１９の導電性を確保しつつ傾斜面樹脂パターン１７と配線パターン１９との密着性を高めることができることが挙げられる。また、配線下地パターン２０を表面処理材料で形成する目的は、配線パターン１９の微細線化や傾斜面樹脂パターン１７との密着性を向上させることであり、効果としては、ＬＥＤチップ１５とリードフレーム１１のリード１３とを確実に配線パターン１９で接続することができ、更に、撥液性と親液性のバランスによって配線パターン１９の幅の制御が可能になることが挙げられる。
　この場合、制御装置２１は、図２のパターン形成プログラムを実行することで、リードフレーム１１全体をカメラ２２の視野内に収めて撮像してその撮像画像からリードフレーム１１のリード１３と各ＬＥＤチップ１５との位置関係を認識する画像認識手段として機能すると共に、認識したリードフレーム１１のリード１３と各ＬＥＤチップ１５との位置関係を基準にして各ＬＥＤチップ１５毎に成膜パターン（傾斜面樹脂パターン１７、配線下地パターン２０及び配線パターン１９）を形成する位置を指定する成膜パターン形成位置指定手段として機能し、各ＬＥＤチップ１５毎に指定された位置に液滴吐出手段（ディスペンサ装置２３とインクジェット装置２４）でそれぞれ成膜材料（流動性の樹脂材料又は表面処理材料、導電性インク材料）を吐出して成膜パターン（傾斜面樹脂パターン１７、配線下地パターン２０及び配線パターン１９）を形成する。
　以上説明した本実施例の傾斜面樹脂パターン１７と配線パターン１９の形成は、制御装置２１によって、図２のパターン形成プログラムに従って実行される。以下、図２のパターン形成プログラムの処理内容を説明する。
　図２のパターン形成プログラムが起動されると、まず、ステップ１０１で、多数のＬＥＤチップ１５がダイボンドされたリードフレーム１１全体をカメラ２２の視野内に収めて撮像する。この後、ステップ１０２に進み、カメラ２２の撮像画像を処理してリードフレーム１１上の各ＬＥＤチップ１５のエッジ（側縁）とリードフレーム１１のリード１３の位置を認識する。
　この後、ステップ１０３に進み、各ＬＥＤチップ１５の側面上端エッジとリードフレーム１１のリード１３の位置認識結果に基づいて、各ＬＥＤチップ１５の側面上端エッジからリード１３に向けて下り傾斜する傾斜面樹脂の成膜パターンである傾斜面樹脂パターン１７を形成する位置を指定する傾斜面樹脂用の描画ファイル［図１（ｅ）参照］を作成する。この傾斜面樹脂用の描画ファイルには、リードフレーム１１上に形成する全ての傾斜面樹脂パターン１７の位置データが含まれる。
　この後、ステップ１０４に進み、配線下地パターン２０を傾斜面樹脂パターン１７上に形成する位置を指定する配線下地用の描画ファイル［図１（ｆ）参照］を作成する。この配線下地用の描画ファイルには、リードフレーム１１上に形成する全ての配線下地パターン２０の位置データが含まれる。
　この後、ステップ１０５に進み、各ＬＥＤチップ１５の側面上端エッジとリードフレーム１１のリード１３の位置認識結果に基づいて、リードフレーム１１上の各ＬＥＤチップ１５上面の電極１８とリード１３とを接続する配線の成膜パターンである配線パターン１
９を形成する位置を指定する配線用の描画ファイル［図１（ｇ）参照］を作成する。この際、各ＬＥＤチップ１５の側面上端エッジの位置から各電極１８の位置を算出し、各電極１８とそれらに対応する各リード１３との間を配線パターン１９で結線するように配線用の描画ファイルを作成する。この配線用の描画ファイルには、リードフレーム１１上に形成する全ての配線パターン１９の位置データが含まれる。尚、ＬＥＤチップ１５の各電極１８の位置をカメラ２２の撮像画像から認識可能である場合には、各電極１８の位置も、画像処理により認識するようにしても良い。
　この後、ステップ１０６に進み、図１（ｂ）に示すように、ディスペンサ装置２３を駆動して傾斜面樹脂用の描画ファイルで指定された全ての位置に流動性の樹脂材料を吐出して傾斜面樹脂パターン１７を形成する。これにより、各ＬＥＤチップ１５の側面上端エッジからリード１３に向けて下り傾斜する傾斜面樹脂パターン１７が形成される。
　傾斜面樹脂パターン１７の硬化後、ステップ１０７に進み、図１（ｃ）に示すように、ディスペンサ装置２３を駆動して配線下地用の描画ファイルで指定された全ての位置に、傾斜面樹脂パターン１７とは異なる性質の樹脂又は表面処理材料を吐出して、配線下地パターン２０を傾斜面樹脂パターン１７上に形成する。尚、傾斜面樹脂パターン１７と配線下地パターン２０とを別々のディスペンサ装置で形成しても良い。
　この後、ステップ１０８に進み、図１（ｄ）に示すように、インクジェット装置２４を駆動して配線用の描画ファイルで指定された全ての位置に導電性インク材料を吐出して配線パターン１９を配線下地パターン２０上に形成する。これにより、ＬＥＤチップ１５の各電極１８と各リード１３との間を配線パターン１９で結線する。
　以上説明した本実施例では、多数のＬＥＤチップ１５がダイボンドされたリードフレーム１１全体をカメラ２２の視野内に収めて撮像してその撮像画像からリードフレーム１１のリード１３と各ＬＥＤチップ１５の位置を認識し、その位置認識結果に基づいて、各ＬＥＤチップ１５の側面上端エッジからリード１３に向けて下り傾斜する傾斜面樹脂パターン１７を形成する位置を指定する傾斜面樹脂用の描画ファイルと、配線下地パターン２０を傾斜面樹脂パターン１７上に形成する位置を指定する配線下地用の描画ファイルと、各ＬＥＤチップ１５上面の電極１８とリード１３とを接続する配線パターン１９を形成する位置を指定する配線用の描画ファイルを作成した後、傾斜面樹脂用の描画ファイルで指定された全ての位置にディスペンサ装置２３で流動性の樹脂材料を吐出して樹脂パターン１７を形成した後、配線下地用の描画ファイルで指定された全ての位置に、ディスペンサ装置２３で傾斜面樹脂パターン１７とは異なる性質の樹脂又は表面処理材料を吐出して、配線下地パターン２０を傾斜面樹脂パターン１７上に形成し、その後、配線用の描画ファイルで指定された全ての位置にインクジェット装置２４で導電性インク材料を吐出して配線パターン１９を配線下地パターン２０上に形成するようにした。これにより、１回のカメラ２２の撮像動作で、リードフレーム１１上の全てのＬＥＤチップ１５に対して傾斜面樹脂パターン１７と配線下地パターン２０と配線パターン１９を形成する位置を精度良く指定することができ、傾斜面樹脂パターン１７と配線下地パターン２０と配線パターン１９を液滴吐出法により位置精度良く且つ能率良く形成することができる。
　尚、上記実施例では、多数のＬＥＤチップ１５がダイボンドされたリードフレーム１１全体をカメラ２２の視野内に収めて撮像するようにしたが、リードフレーム１１の撮像エリアを２分割以上に分割して撮像してそれらの分割画像を合成してリードフレーム１１全体の合成画像を作成するようにしても良い。この場合でも、１つの分割画像に２個以上のＬＥＤチップ１５が含まれるようにすれば、リードフレーム１１にダイボンドされたＬＥＤチップ１５の総数よりも少ない撮像回数で、リードフレーム１１にダイボンドされた多数のＬＥＤチップ１５の全ての位置を認識して各ＬＥＤチップ１５毎に成膜パターンを形
成する位置を指定することができ、リードフレーム１１にダイボンドされた各ＬＥＤチップ１５毎に成膜パターンを液滴吐出法により位置精度良く且つ能率良く形成することができる。
　また、上記実施例では、傾斜面樹脂パターン１７と配線下地パターン２０の両方をディスペンサ装置で形成するようにしたが、傾斜面樹脂パターン１７と配線下地パターン２０の両方又はいずれか一方をインクジェット装置で形成するようにしても良い。
　また、本発明を適用可能な回路素子は、ＬＥＤチップ１５に限定されず、他の半導体素子であっても良く、その他、抵抗体、コンデンサ等であっても良い。
　また、上記実施例では、傾斜面樹脂パターン１７、配線下地パターン２０、配線パターン１９の３種類の成膜パターンを形成する例について説明したが、本発明は、これら３種類の成膜パターンのうちのいずれか１つ又は２つの成膜パターンを形成する場合にも適用でき、その他、抵抗体パターン、誘電体パターン等の他の成膜パターンを形成する場合にも適用でき、勿論、３種類以上の成膜パターンを形成する場合にも適用できる。
　また、上記実施例では、複数のＬＥＤチップ１５（回路素子）をリードフレーム１１に搭載する例について説明したが、複数のＬＥＤチップ１５（回路素子）を搭載する搭載部材は、ユーザー側で分割して使用する多数個取り基板であっても良く、その他、分割されない１枚の回路基板に複数の回路素子を搭載する場合にも本発明を適用できる。
　また、搭載部材に搭載する複数の回路素子は、同一品種のものに限定されず、複数種類の回路素子を搭載部材に搭載する場合にも本発明を適用できる。
　１１…リードフレーム、１２…ダイパッド、１３…リード、１４…絶縁性の基材、１５…ＬＥＤチップ（回路素子）、１６…接着剤、１７…傾斜面樹脂パターン（成膜パターン）、１８…電極、１９…配線パターン（成膜パターン）、２０…配線下地パターン（成膜パターン）、２１…制御装置（画像認識手段，成膜パターン形成位置指定手段）、２２…カメラ、２３…ディスペンサ装置（液滴吐出手段）、２４…インクジェット装置（液滴吐出手段）

Claims (5)

  1. 　搭載部材に搭載された複数の回路素子と該搭載部材とに跨がってそれぞれ液滴吐出法により成膜パターンを形成する成膜パターン形成方法において、
    　前記搭載部材とこれに搭載した前記複数の回路素子とを一括してカメラの視野内に収めて撮像し又はその撮像エリアを２分割以上に分割して撮像し、その撮像画像から前記搭載部材と各回路素子との位置関係を認識する画像認識工程と、
    　前記画像認識工程で認識した前記搭載部材と各回路素子との位置関係を基準にして前記各回路素子毎に前記成膜パターンを形成する位置を指定する成膜パターン形成位置指定工程と、
    　前記成膜パターン形成位置指定工程で前記各回路素子毎に指定された位置にそれぞれ液滴吐出法により前記成膜パターンを形成する液滴吐出工程と
    　を含むことを特徴とする成膜パターン形成方法。
  2. 　前記成膜パターン形成位置指定工程では、成膜材料の異なる複数種類の成膜パターンを形成する位置を指定する描画ファイルを成膜材料毎に作成し、
    　前記液滴吐出工程では、種類の異なる成膜材料毎に前記描画ファイルを用いて前記成膜パターンを形成することを特徴とする請求項１に記載の成膜パターン形成方法。
  3. 　前記成膜パターン形成位置指定工程では、前記回路部品の側面上端から前記搭載部材の表面に向けて下り傾斜する傾斜面樹脂の成膜パターンを形成する位置を指定する傾斜面樹脂用の描画ファイルと、前記傾斜面樹脂とは異なる性質の樹脂又は表面処理材料からなる配線下地用の成膜パターンを前記傾斜面樹脂の成膜パターン上に形成する位置を指定する配線下地用の描画ファイルと、配線の成膜パターンを前記配線下地用の成膜パターン上に形成する位置を指定する配線用の描画ファイルとを作成し、
    　前記液滴吐出工程では、前記傾斜面樹脂用の描画ファイルを用いて前記傾斜面樹脂の成膜パターンを形成した後、前記配線下地用の描画ファイルを用いて前記配線下地用の成膜パターンを前記傾斜面樹脂の成膜パターン上に形成し、その後、前記配線用の描画ファイルを用いて前記配線の成膜パターンを前記配線下地用の成膜パターン上に形成することを特徴とする請求項２に記載の成膜パターン形成方法。
  4. 　前記搭載部材は、リードフレーム又は多数個取り基板であることを特徴とする請求項１乃至３のいずれかに記載の成膜パターン形成方法。
  5. 　搭載部材に搭載された複数の回路素子と該搭載部材とに跨がってそれぞれ成膜パターンを形成する成膜パターン形成装置において、
    　前記搭載部材とこれに搭載した前記複数の回路素子とを一括してカメラの視野内に収めて撮像し又はその撮像エリアを２分割以上に分割して撮像し、その撮像画像から前記搭載部材と各回路素子との位置関係を認識する画像認識手段と、
    　前記画像認識手段で認識した前記搭載部材と各回路素子との位置関係を基準にして前記各回路素子毎に前記成膜パターンを形成する位置を指定する成膜パターン形成位置指定手段と、
    　前記成膜パターン形成位置指定手段で前記各回路素子毎に指定された位置にそれぞれ成膜材料を吐出して前記成膜パターンを形成する液滴吐出手段と
    　を含むことを特徴とする成膜パターン形成装置。
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