WO2012070396A1 - 導電性接着材料、太陽電池モジュール及びその製造方法 - Google Patents
導電性接着材料、太陽電池モジュール及びその製造方法 Download PDFInfo
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- WO2012070396A1 WO2012070396A1 PCT/JP2011/075935 JP2011075935W WO2012070396A1 WO 2012070396 A1 WO2012070396 A1 WO 2012070396A1 JP 2011075935 W JP2011075935 W JP 2011075935W WO 2012070396 A1 WO2012070396 A1 WO 2012070396A1
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- WIPO (PCT)
- Prior art keywords
- curing agent
- conductive adhesive
- adhesive material
- solar cell
- particles
- Prior art date
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0512—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to a conductive adhesive material in which conductive particles are dispersed, a solar battery module that uses this to connect the front / back electrode of a solar battery cell and a tab wire, and a method for manufacturing the solar battery module.
- a plurality of adjacent solar cells are connected by tab wires made of solder-coated ribbon-like copper foil.
- One end of the tab wire is connected to the surface electrode of one solar battery cell, and the other end is connected to the back electrode of another adjacent solar battery cell, thereby connecting the solar battery cells in series.
- connection between the solar battery cell and the tab wire is made up of a bus bar electrode formed by screen printing of silver paste on the light receiving surface of the solar battery cell, an Ag electrode formed on the back surface connection portion of the solar battery cell, and a tab.
- the wires are connected by soldering.
- Al electrodes are formed in regions other than the connection portion on the back surface of the solar battery cell.
- connection process is performed at a high temperature exceeding 200 ° C. in soldering, the solar cell is warped, the internal stress generated in the connection portion between the tab wire and the front electrode and the back electrode, the residue of the flux, etc. There is a concern that the connection reliability between the front and back electrodes of the battery cell and the tab wire is lowered.
- the conventional conductive adhesive film for solar cell modules uses a metal filler as conductive particles and does not form a metal bond with an electrode unlike soldering, there is a concern about connection reliability.
- the present invention has been proposed in view of such a conventional situation, and provides a conductive adhesive material and a method for manufacturing the same, a solar cell module and a method for manufacturing the same, which can obtain high connection reliability.
- the inventors of the present invention have achieved high connection reliability by using solder particles as the conductive particles of the conductive adhesive material and using an acid anhydride-based curing agent or a phenol-based curing agent as the curing agent. It was found that can be obtained.
- the conductive adhesive material according to the present invention contains a film-forming resin, a liquid epoxy resin, a curing agent, and conductive particles, and the curing agent is an acid anhydride curing agent or a phenol curing agent. And the conductive particles are solder particles.
- the solar cell module according to the present invention is a tab wire that connects a surface electrode of one solar cell and a back electrode of another solar cell adjacent to the one solar cell via a conductive adhesive material.
- the conductive adhesive material contains a forming resin, a liquid epoxy resin, a curing agent, and conductive particles, and the curing agent is an acid anhydride curing agent. Or it is a phenol type hardening
- the said electroconductive particle is a solder particle, It is characterized by the above-mentioned.
- the manufacturing method of the solar cell module which concerns on this invention connects the surface electrode of one photovoltaic cell, and the back surface electrode of the other photovoltaic cell adjacent to this one photovoltaic cell via a conductive adhesive material.
- the conductive adhesive material contains a forming resin, a liquid epoxy resin, a curing agent, and conductive particles, and the curing agent is an acid. It is an anhydride-based curing agent or a phenol-based curing agent, and the conductive particles are solder particles, the surface electrode and tab wire of the one solar cell, and the back electrode and tab wire of the other solar cell.
- a temporary placement step of temporarily placing the conductive adhesive material in between, and a pressing step of pressing from the upper surface of the tab wire by a heating press head.
- the manufacturing method of the solar cell module which concerns on this invention connects the surface electrode of one photovoltaic cell, and the back surface electrode of the other photovoltaic cell adjacent to this one photovoltaic cell via a conductive adhesive material.
- the conductive adhesive material contains a forming resin, a liquid epoxy resin, a curing agent, and conductive particles, and the curing agent is an acid. It is an anhydride-based curing agent or a phenol-based curing agent, and the conductive particles are solder particles, the surface electrode and tab wire of the one solar cell, and the back electrode and tab wire of the other solar cell.
- a temporary placement step of temporarily placing the conductive adhesive material interposed therebetween, and a sealing material and a protective base material are sequentially laminated on the upper and lower surfaces of the solar battery cell, and the laminating device is applied from the upper surface of the protective base material.
- solder particles are used as the conductive particles of the conductive adhesive material, and an acid anhydride-based curing agent or a phenol-based curing agent is used as the curing agent, so that wetting and spreading of the solder is improved, and a strong metal Since a bond can be formed, high connection reliability can be obtained.
- FIG. 1 is an exploded perspective view of a solar cell module to which the present invention is applied.
- FIG. 2 is a cross-sectional view of the solar cell module.
- FIG. 3 is a cross-sectional view showing the configuration of the decompression laminator.
- Conductive adhesive material for electrically connecting the front surface electrode or back surface electrode of the solar battery cell and the tab wire will be described.
- the shape of the conductive adhesive material is not limited to a film shape, and may be a paste.
- the conductive adhesive material in the present embodiment contains a film-forming resin, a liquid epoxy resin, a curing agent, and conductive particles, and uses an acid anhydride curing agent or a phenol curing agent as the curing agent. Solder particles are used as the conductive particles.
- the film-forming resin corresponds to a high molecular weight resin having an average molecular weight of 10,000 or more, and preferably has an average molecular weight of about 10,000 to 80,000 from the viewpoint of film formation.
- various resins such as an epoxy resin, a modified epoxy resin, a urethane resin, and a phenoxy resin can be used.
- a phenoxy resin is preferably used from the viewpoint of the film formation state, connection reliability, and the like. .
- the liquid epoxy resin is not particularly limited as long as it has fluidity at room temperature, and all commercially available epoxy resins can be used.
- Specific examples of such epoxy resins include naphthalene type epoxy resins, biphenyl type epoxy resins, phenol novolac type epoxy resins, bisphenol type epoxy resins, stilbene type epoxy resins, triphenolmethane type epoxy resins, phenol aralkyl type epoxy resins.
- Resins, naphthol type epoxy resins, dicyclopentadiene type epoxy resins, triphenylmethane type epoxy resins, and the like can be used. These may be used alone or in combination of two or more. Moreover, you may use it combining suitably with other organic resins, such as an acrylic resin.
- an acid anhydride curing agent or a phenol curing agent is used as the curing agent.
- These curing agents have a flux effect that improves the wetting and spreading of the solder and react with the epoxy component during curing, so that adverse effects due to the residue of the curing agent can be prevented.
- alicyclic acid anhydrides As the acid anhydride curing agent, alicyclic acid anhydrides, aromatic acid anhydrides, aliphatic acid anhydrides and the like can be used. Among these, alicyclic acid anhydrides having a norbornene skeleton are preferably used. Examples of such alicyclic acid anhydrides include methylbicyclo [2.2.1] heptane-2.3-dicarboxylic acid anhydride / bicyclo [2.2.1] heptane-2.3-dicarboxylic acid anhydride represented by the following general formula. Can be mentioned.
- R represents hydrogen or a methyl group.
- a curing agent having a free carboxylic acid is not preferable because it has high reactivity and the life of the conductive adhesive material is reduced.
- a phenol formaldehyde type novolak resin a phenol aralkyl type novolak resin, or the like can be used.
- solder particles such as eutectic solder that can be connected by thermocompression bonding at a relatively low temperature, and low melting point solder added with Bi or In are preferably used.
- the melting point of the solder particles is appropriately set according to the starting temperature of the curing agent. From the viewpoint of the warpage of the solar battery cell and the internal stress generated in the connection portion between the tab wire and the front and back electrodes, the solder particle has a melting point of 100 ° C. It is preferable that it is below, More preferably, it is 135 degreeC or more and 150 degrees C or less.
- the curing start temperature of the curing agent is equal to or higher than the melting point of the solder particles.
- the absolute value of the difference between the curing start temperature of the curing agent and the melting point of the solder particles is preferably 35 ° C. or less, more preferably 15 ° C. or less. When the temperature difference becomes larger than this, the flux effect is insufficient, and the connection reliability is lowered.
- rubber-based elastic particles such as acrylic rubber (ACR), butadiene rubber (BR), and nitrile rubber (NBR). Since the elastic particles can absorb internal stress and do not inhibit the curing, high connection reliability can be provided.
- ACR acrylic rubber
- BR butadiene rubber
- NBR nitrile rubber
- silane coupling agent may be added.
- silane coupling agent epoxy, amino, mercapto sulfide, ureido, and the like can be used. Thereby, the adhesiveness in the interface of an organic material and an inorganic material can be improved.
- a strong metal bond can be formed between the tab wire and the electrode by a thermocompression treatment at a relatively low temperature, and high connection reliability can be obtained.
- the forming resin, the liquid epoxy resin, the curing agent, and the conductive particles are dissolved in a solvent.
- a solvent toluene, ethyl acetate or the like, or a mixed solvent thereof can be used.
- a resin composition in which a forming resin, a liquid epoxy resin, a curing agent, and conductive particles are dissolved in a solvent is used using a bar coater, a coating device, or the like.
- the conductive conductive film having a predetermined thickness can be obtained by coating on a release substrate and drying the composition on the release substrate using a heat oven, a heat drying apparatus or the like.
- the release substrate has, for example, a laminated structure in which a release agent such as silicone is applied to PET (Poly Ethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methylpentene-1), PTFE (Polytetrafluoroethylene), etc. While preventing a conductive conductive film from drying, these shapes can be maintained.
- a release agent such as silicone is applied to PET (Poly Ethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methylpentene-1), PTFE (Polytetrafluoroethylene), etc. While preventing a conductive conductive film from drying, these shapes can be maintained.
- the solar cell module 1 to which the present invention is applied includes a single crystal silicon photoelectric conversion device, a crystalline silicon solar cell module using a polycrystalline photoelectric conversion device, a cell made of amorphous silicon, and microcrystalline silicon as a photoelectric conversion device. Or a thin-film silicon solar cell using a photoelectric conversion element in which cells made of amorphous silicon germanium are stacked.
- the solar cell module 1 has a string 4 in which a plurality of solar cells 2 are connected in series by tab wires 3 serving as interconnectors, and includes a matrix 5 in which a plurality of strings 4 are arranged.
- the matrix 5 is sandwiched between sheets 6 of a sealing adhesive, and together with a front cover 7 provided on the light receiving surface side as a protective substrate and a back sheet 8 provided on the back surface side.
- a metal frame 9 such as aluminum is attached to the periphery.
- sealing adhesive for example, a translucent sealing material such as ethylene vinyl alcohol resin (EVA) is used.
- EVA ethylene vinyl alcohol resin
- surface cover 7 for example, a light-transmitting material such as glass or light-transmitting plastic is used.
- back sheet 8 a laminated body in which glass or aluminum foil is sandwiched between resin films is used.
- Each solar cell 2 of the solar cell module has a photoelectric conversion element 10 made of a silicon substrate, as shown in FIG.
- the photoelectric conversion element 10 is provided with a bus bar electrode 11 serving as a surface electrode on the light receiving surface side and a finger electrode 12 that is a collecting electrode formed in a direction substantially orthogonal to the bus bar electrode 11.
- the photoelectric conversion element 10 is provided with an Al back electrode 13 made of aluminum on the back side opposite to the light receiving surface.
- the photovoltaic cell 2 is electrically connected to the bus bar electrode 11 on the front surface and the Al back electrode 13 of the adjacent photovoltaic cell 2 by the tab wire 3, thereby constituting the strings 4 connected in series. To do.
- the tab wire 3 is connected to the bus bar electrode 11 and the Al back electrode 13 by the conductive adhesive film 20.
- the tab wire 3 can use the tab wire used in the conventional solar cell module.
- the tab wire 3 is formed by using, for example, a ribbon-like copper foil having a thickness of 50 to 300 ⁇ m and performing gold plating, silver plating, tin plating, solder plating, or the like as necessary. Moreover, you may use what the electroconductive adhesive film was laminated
- the bus bar electrode 11 is formed by applying Ag paste and heating.
- the bus bar electrode 11 formed on the light receiving surface of the solar battery cell 2 is formed in a line shape with a width of 1 mm, for example, in order to reduce the area that blocks incident light and suppress shadow loss.
- the number of bus bar electrodes 11 is appropriately set in consideration of the size and resistance of the solar battery cell 2.
- the finger electrode 12 is formed over almost the entire light receiving surface of the solar battery cell 2 so as to intersect the bus bar electrode 11 by the same method as the bus bar electrode 11.
- the finger electrodes 12 are formed with lines having a width of about 100 ⁇ m, for example, at a predetermined interval, for example, every 2 mm.
- the Al back electrode 13 is an aluminum electrode formed on the back surface of the solar battery cell 2 by, for example, screen printing or sputtering.
- the solar battery cell 2 does not necessarily need to be provided with the bus bar electrode 11.
- the current of the finger electrode 12 is collected by the tab wire 3 that intersects the finger electrode 12.
- an opening may be formed in the Al back electrode 13 to such an extent that it does not cause poor connection with the tab line, and thereby the adhesive strength may be ensured.
- the manufacturing method of the solar cell module according to the first embodiment includes a surface electrode of one solar cell and a back electrode of another solar cell adjacent to the one solar cell via a conductive adhesive film.
- the conductive adhesive film described above includes the surface electrode and the tab wire of one solar cell and the back electrode and the tab wire of the other solar cell. Is temporarily arranged with a gap interposed between them and pressed from the upper surface of the tab wire by a heating press head.
- the finger electrode 12 and the bus bar electrode 11 are formed on the surface of the photoelectric conversion element 10 by applying and baking Ag paste, and the Al back electrode 13 is formed on the connection portion of the tab wire 3 by Al screen printing on the back surface.
- the Al back electrode 13 is formed on the connection portion of the tab wire 3 by Al screen printing on the back surface.
- the conductive adhesive film 20 is attached to the bus bar electrode 11 on the surface of the photoelectric conversion element 10 and the Al back electrode 13 on the back surface, and the tab wire 3 is disposed on the conductive adhesive film 20.
- the tab wire 3 is electrically connected to the bus bar electrode 11 and the Al back electrode 13 by heating and pressing from above the tab wire 3 with a predetermined pressure. At this time, the tab wire 3 is mechanically firmly connected to the bus bar electrode 11 because the binder resin of the conductive adhesive film 20 has good adhesiveness with the bus bar electrode 11 formed of Ag paste. The tab wire 3 is electrically connected to the Al back electrode 13.
- the matrix 5 to which the solar cells 2 are connected is sandwiched between sheets 6 of a sealing adhesive and laminated together with a front cover 7 provided on the light receiving surface side and a back sheet 8 provided on the back surface side as protective materials.
- the solar cell module 1 is manufactured.
- the conductive adhesive film described above contains a forming resin, a liquid epoxy resin, a curing agent, and conductive particles, and the curing agent is an acid anhydride curing agent or phenol. Since the conductive particles are solder particles, the metal is a strong metal between the tab wire and the electrode by a thermocompression treatment at a relatively low temperature of 200 ° C. or lower when pressed by a heating press head. A bond can be formed, and high connection reliability can be obtained.
- the manufacturing method of the solar cell module according to the second embodiment includes a surface electrode of one solar cell and a back electrode of another solar cell adjacent to the one solar cell via a conductive adhesive film.
- the above-mentioned conductive adhesive film is used to connect the surface electrode and the tab wire of one solar cell and the back electrode and the tab wire of the other solar cell.
- sealing material and protective base material are laminated in order on the upper and lower surfaces of the solar battery cell, laminating and pressing with a laminating device from the upper surface of the protective base material, and the sealing material is cured and the surface electrode The tab wire and the back electrode are connected to the tab wire.
- FIG. 3 is a diagram showing the configuration of the decompression laminator.
- the decompression laminator 30 includes an upper unit 31 and a lower unit 32. These units are detachably integrated through a seal member 33 such as an O-ring.
- the upper unit 31 is provided with a flexible sheet 34 such as a silicon rubber.
- the flexible sheet 34 divides the decompression laminator 30 into a first chamber 35 and a second chamber 36.
- each of the upper unit 31 and the lower unit 32 has a pipe 37 so that each chamber can independently adjust the internal pressure, that is, can be decompressed, pressurized, and released to the atmosphere by a vacuum pump, a compressor, or the like. , 38 are provided.
- the pipe 37 is branched in two directions of a pipe 37a and a pipe 37b by a switching valve 39
- the pipe 38 is branched in two directions of a pipe 38a and a pipe 38b by a switching valve 40.
- the lower unit 32 is provided with a stage 41 that can be heated.
- the upper unit 31 and the lower unit 32 are separated, and a sealing material and a protective substrate (surface cover 7 and back sheet 8) are placed on the upper and lower surfaces of the solar cells on which the tab wires are temporarily fixed on the stage 41.
- stacked in order is mounted. Note that the temperature at the time of temporarily fixing the tab wire to the solar battery cell may be lower than the melting point of the solder particles of the conductive adhesive material.
- the upper unit 31 and the lower unit 32 are integrated so as to be separable via the seal member 33, and then a vacuum pump is connected to each of the pipe 37a and the pipe 38a, and the inside of the first chamber 35 and the second chamber 36 is connected. Apply high vacuum. While the inside of the second chamber 36 is kept at a high vacuum, the switching valve 39 is switched to introduce air into the first chamber 35 from the pipe 37b. As a result, the flexible sheet 34 is spread toward the second chamber 36, and as a result, the laminate is pressed by the flexible sheet 34 while being heated by the stage 41.
- the switching valve 40 is switched to introduce air into the second chamber 36 from the pipe 38b. Thereby, the flexible sheet 34 is pushed back toward the first chamber 35, and finally the internal pressures of the first chamber 35 and the second chamber 36 become the same.
- thermocompression bonding temperature in the laminating apparatus by setting the thermocompression bonding temperature in the laminating apparatus to be higher than the melting point of the solder particles of the conductive adhesive material, a strong metal bond can be formed between the tab wire and the electrode. High connection reliability can be obtained.
- a conductive adhesive material in which the curing start temperature of the curing agent is equal to or higher than the melting point of the solder particles the curing agent and the epoxy can be cured after exhibiting a sufficient flex function of the curing agent.
- a conductive adhesive material in which the difference between the curing start temperature of the curing agent and the melting point of the solder particles is 15 ° C. or less, a sufficient flux effect can be obtained and the connection reliability can be improved.
- Example> Examples of the present invention will be described below, but the present invention is not limited to these examples.
- the front and back electrodes of the solar battery cell and the tab wire are connected using a conductive adhesive film, and the bondability, adhesiveness, and connection reliability are connected. Sex was evaluated.
- connection resistance With respect to the solar cell, the initial resistance and the resistance after a TH test (Thermal Humidity Test) at a temperature of 85 ° C., a humidity of 85% RH, and 500 hours were measured. The measurement was performed using a digital multimeter (digital multimeter 7555, manufactured by Yokogawa Electric Corporation) to measure the connection resistance when a current of 1 mA was passed by the four-terminal method.
- a digital multimeter digital multimeter 7555, manufactured by Yokogawa Electric Corporation
- Example 1 20 parts by mass of phenoxy resin (YD-50, manufactured by Nippon Steel Chemical Co., Ltd.), 30 parts by mass of liquid epoxy resin (EP828, manufactured by Mitsubishi Chemical Co., Ltd.), acid anhydride curing agent (HNA-100, 20 parts by mass of Shin Nippon Rika Co., Ltd., 15 parts by mass of acrylic rubber (Taisan Resin SG80H, manufactured by Nagase ChemteX Corporation), and 15 parts by mass of polybutadiene rubber (RKB series, manufactured by Resinas Kasei Co., Ltd.) And 30 parts by mass of Sn—In (52%) solder particles (melting point: 117 ° C., manufactured by Senju Metal Industry Co., Ltd.) were prepared to prepare a conductive adhesive material. This was applied to the peeled PET using a bar coater and dried in an oven at 80 ° C. for 5 minutes to produce a conductive adhesive film having a thickness of 25 ⁇ m.
- a 6-inch polycrystalline Si cell (dimensions: 15.6 cm ⁇ 15.6 cm, thickness: 180 ⁇ m) is bonded with a conductive adhesive film on the surface electrode portion made of Ag and the back electrode portion made of Al.
- a Cu tab wire (width: 2 mm, thickness: 0.15 mm) coated with solder on the film was temporarily fixed by applying heat and pressure (140 ° C., 15 seconds, 2 MPa) with a heater head.
- the solar cells on which the tab wires were temporarily fixed were sandwiched between sealing adhesive sheets and laminated together with a front cover provided on the light receiving surface side and a back sheet provided on the back surface side.
- the first chamber 35 and the second chamber 36 are both decompressed to 133 Pa while maintaining the heating stage of the second chamber 36 of the decompression laminator 30 shown in FIG.
- the atmospheric pressure in which the atmosphere was introduced into the first chamber 35 was maintained while maintaining the reduced pressure. After maintaining this state for 5 minutes, the atmosphere was introduced into the second chamber 36 to obtain atmospheric pressure.
- Example 2 A conductive adhesive film was produced in the same manner as in Example 1 except that Sn-Bi (58%) solder particles (melting point 139 ° C., manufactured by Senju Metal Industry Co., Ltd.) were used. Using this conductive adhesive film, a solar cell module was produced in the same manner as in Example 1.
- Example 3 A conductive adhesive film was produced in the same manner as in Example 1 except that Sn-Bi (50%) solder particles (melting point 150 ° C., manufactured by Senju Metal Industry Co., Ltd.) were used. Using this conductive adhesive film, a solar cell module was produced in the same manner as in Example 1.
- Example 4 A conductive adhesive film was produced in the same manner as in Example 1 except that Sn—Pb (37%) solder particles (melting point 183 ° C., manufactured by Senju Metal Industry Co., Ltd.) were used.
- a solar cell module was produced in the same manner as in Example 1 except that the thermal pressurization at the time of temporary fixing was performed at 180 ° C.
- Example 5 Sn-Bi (50%) solder particles (melting point 150 ° C., manufactured by Senju Metal Industry Co., Ltd.) using phenolic curing agent (TD-2131, manufactured by DIC Corporation) instead of acid anhydride curing agent
- TD-2131 phenolic curing agent
- a conductive adhesive film was produced in the same manner as in Example 1 except that. Using this conductive adhesive film, a solar cell module was produced in the same manner as in Example 1.
- Example 6 A conductive adhesive film was produced in the same manner as in Example 1 except that Sn—Pb (37%) solder particles (melting point 183 ° C., manufactured by Senju Metal Industry Co., Ltd.) were used.
- the solar cell module was mounted in the same manner as in Example 4 except that the thermal pressurization during temporary fixing was performed at 180 ° C. and the heating stage of the second chamber 36 of the decompression laminator 30 shown in FIG. 3 was maintained at 200 ° C. Produced.
- Comparative Example 1 using an organic acid dihydrazide-based curing agent and Comparative Example 2 using an imidazole-based curing agent no solder wetting spread was observed, and good connection reliability was not obtained.
- Examples 1 to 4 using an acid anhydride-based curing agent and Example 5 using a phenol-based curing agent wetting spread of solder was observed. That is, according to Examples 1 to 6, it was found that the flux function was exhibited in the conductive adhesive film using solder particles, and thus good connection reliability was obtained.
- connection reliability can be obtained by using a connection method in which the sealing resin is cured and the electrode and the tab wire are connected simultaneously.
- connection reliability was obtained even when the electrode and the tab wire were connected at the time of (temporary) fixing by the heating and pressing head.
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Abstract
Description
1.導電性接着材料
2.太陽電池モジュール
3.太陽電池モジュールの製造方法
4.実施例
先ず、太陽電池セルの表面電極又は裏面電極とタブ線とを電気的に接続するための導電性接着材料について説明する。なお、導電性接着材料の形状は、フィルム形状に限定されず、ペーストであってもよい。
以下、本発明が適用された太陽電池モジュール及びその製造方法について、図面を参照しながら詳細に説明する。本発明が適用された太陽電池モジュール1は、光電変換素子として、単結晶型シリコン光電変換素子、多結晶型光電変換素子を用いる結晶シリコン系太陽電池モジュールや、アモルファスシリコンからなるセルと微結晶シリコンやアモルファスシリコンゲルマニウムからなるセルとを積層させた光電変換素子を用いた薄膜シリコン系太陽電池である。
次に、太陽電池モジュールの製造方法について、図1を参照して説明する。第1の実施の形態における太陽電池モジュールの製造方法は、一の太陽電池セルの表面電極と、一の太陽電池セルと隣接する他の太陽電池セルの裏面電極とを導電性接着フィルムを介してタブ線で電気的に接続させる太陽電池モジュールの製造方法において、一の太陽電池セルの表面電極とタブ線、及び前記他の太陽電池セルの裏面電極とタブ線とを、前述した導電性接着フィルムを介在させて仮配置し、タブ線の上面から加熱押圧ヘッドにより押圧するものである。
以下、本発明の実施例について説明するが、本発明はこれらの実施例に限定されるものではない。ここでは、下記実施例1~6及び比較例1~3のように、導電性接着フィルムを用いて太陽電池セルの表裏面電極とタブ線とを接続し、その結合性、接着性及び接続信頼性を評価した。
フラックス機能の評価として、太陽電池セルの電極とタブ線とを引き剥がし、光学顕微鏡にてハンダの濡れ広がりを観察した。表1、2に示す評価において、元の面積から面積比3.0倍以上の濡れ広がりを示したものを◎、元の面積から面積比1.5倍以上3.0倍未満の濡れ広がりを示したものを○、元の面積から面積比1.5倍未満の濡れ広がりを示したものを△、元の面積から濡れ広がりを示さないものを×とした。
太陽電池セルのタブ線を電極面に対して90°方向に引張り試験機(テンシオロン、オリエンテック社製)を用いて引き上げ、接着強度を測定した。表1、2に示す評価において、接着強度が2.0N/mm以上のものを◎、接着強度が1.5N/mm以上2.0N/mm未満のものを○、接着強度が1.0N/mm以上1.5N/mm未満のものを△、接着強度が1.0N/mm未満のものを×とした。
太陽電池セルについて、初期(Initial)の抵抗と、温度85℃、湿度85%RH、500時間のTHテスト(Thermal Humidity Test)後の抵抗を測定した。測定は、デジタルマルチメータ(デジタルマルチメータ7555、横河電機社製)を用いて4端子法にて電流1mAを流したときの接続抵抗を測定した。表1、2に示す評価において、接続抵抗が4Ω未満のものを◎、接続抵抗が4Ω以上5Ω未満のものを○、接続抵抗が5Ω以上6Ω未満のものを△、接続抵抗が6Ω以上のものを×とした。
フェノキシ樹脂(YD-50、新日鐵化学(株)製)を20質量部、液状エポキシ樹脂(EP828、三菱化学(株)製)を30質量部、酸無水物系硬化剤(HNA-100、新日本理化(株)製)を20質量部、アクリルゴム(テイサンレジンSG80H、ナガセケムテックス(株)製)を15質量部、ポリブタジエンゴム(RKBシリーズ、レジナス化成(株)製)を15質量部、及びSn-In(52%)系ハンダ粒子(溶点117℃、千住金属工業(株)製)を30質量部配合し、導電性接着材料を調製した。これを、剥離処理されたPETにバーコーターを用いて塗布し、80℃のオーブンで5分乾燥させ、厚さ25μmの導電性接着フィルムを作製した。
Sn-Bi(58%)系ハンダ粒子(溶点139℃、千住金属工業(株)製)を用いた以外は、実施例1と同様にして導電性接着フィルムを作製した。この導電性接着フィルムを用いて、実施例1と同様にして太陽電池モジュールを作製した。
Sn-Bi(50%)系ハンダ粒子(溶点150℃、千住金属工業(株)製)を用いた以外は、実施例1と同様にして導電性接着フィルムを作製した。この導電性接着フィルムを用いて、実施例1と同様にして太陽電池モジュールを作製した。
Sn-Pb(37%)系ハンダ粒子(溶点183℃、千住金属工業(株)製)を用いた以外は、実施例1と同様にして導電性接着フィルムを作製した。
酸無水物系硬化剤に代えてフェノール系硬化剤(TD-2131、DIC(株)製)を用い、Sn-Bi(50%)系ハンダ粒子(溶点150℃、千住金属工業(株)製)を用いた以外は、実施例1と同様にして導電性接着フィルムを作製した。この導電性接着フィルムを用いて、実施例1と同様にして太陽電池モジュールを作製した。
Sn-Pb(37%)系ハンダ粒子(溶点183℃、千住金属工業(株)製)を用いた以外は、実施例1と同様にして導電性接着フィルムを作製した。
酸無水物系硬化剤に代えて有機酸ジヒドラジド系硬化剤(アミキュアUDH-J、味の素ファインテクノ(株)製)を用い、Sn-Bi(50%)系ハンダ粒子(溶点150℃、千住金属工業(株)製)を用いた以外は、実施例1と同様にして導電性接着フィルムを作製した。この導電性接着フィルムを用いて、実施例1と同様にして太陽電池モジュールを作製した。
酸無水物系硬化剤に代えてイミダゾール系硬化剤(ノバキュアHX3941HP、旭化成イーマテリアルズ(株)製)を用い、Sn-Bi(50%)系ハンダ粒子(溶点150℃、千住金属工業(株)製)を用いた以外は、実施例1と同様にして導電性接着フィルムを作製した。この導電性接着フィルムを用いて、実施例1と同様にして太陽電池モジュールを作製した。
Claims (9)
- 膜形成樹脂と、液状エポキシ樹脂と、硬化剤と、導電性粒子とを含有し、
前記硬化剤が、酸無水物系硬化剤又はフェノール系硬化剤であり、
前記導電性粒子が、ハンダ粒子である導電性接着材料。 - 前記硬化剤が、酸無水物系硬化剤であり、
前記酸無水物系硬化剤が、ノルボルネン骨格を有する脂環式酸無水物である請求項1記載の導電性接着材料。 - 前記硬化剤の硬化開始温度が、前記ハンダ粒子の融点以上である請求項1又は2記載の導電性接着材料。
- 前記硬化剤の硬化開始温度と前記ハンダ粒子の融点との差が、15℃以下である請求項3記載の導電性接着材料。
- 前記ハンダ粒子の融点が、135℃以上150℃以下である請求項3又は4記載の導電性接着材料。
- 一の太陽電池セルの表面電極と、該一の太陽電池セルと隣接する他の太陽電池セルの裏面電極とを導電性接着材料を介してタブ線で電気的に接続させた太陽電池モジュールにおいて、
前記導電性接着材料が、形成樹脂と、液状エポキシ樹脂と、硬化剤と、導電性粒子とを含有し、前記硬化剤が、酸無水物系硬化剤又はフェノール系硬化剤であり、前記導電性粒子が、ハンダ粒子である太陽電池モジュール。 - 一の太陽電池セルの表面電極と、該一の太陽電池セルと隣接する他の太陽電池セルの裏面電極とを導電性接着材料を介してタブ線で電気的に接続させる太陽電池モジュールの製造方法において、
前記導電性接着材料が、形成樹脂と、液状エポキシ樹脂と、硬化剤と、導電性粒子とを含有し、前記硬化剤が、酸無水物系硬化剤又はフェノール系硬化剤であり、前記導電性粒子が、ハンダ粒子であり、
前記一の太陽電池セルの表面電極とタブ線、及び前記他の太陽電池セルの裏面電極とタブ線とを、前記導電性接着材料を介在させて仮配置する仮配置工程と、
前記タブ線の上面から加熱押圧ヘッドにより押圧する押圧工程と
を有する太陽電池モジュールの製造方法。 - 一の太陽電池セルの表面電極と、該一の太陽電池セルと隣接する他の太陽電池セルの裏面電極とを導電性接着材料を介してタブ線で電気的に接続させる太陽電池モジュールの製造方法において、
前記導電性接着材料が、形成樹脂と、液状エポキシ樹脂と、硬化剤と、導電性粒子とを含有し、前記硬化剤が、酸無水物系硬化剤又はフェノール系硬化剤であり、前記導電性粒子が、ハンダ粒子であり、
前記一の太陽電池セルの表面電極とタブ線、及び前記他の太陽電池セルの裏面電極とタブ線とを、前記導電性接着材料を介在させて仮配置する仮配置工程と、
前記太陽電池セルの上下面に封止材、保護基材を順に積層し、前記保護基材の上面からラミネート装置にてラミネート圧着させ、前記封止材を硬化させるとともに前記表面電極とタブ線及び前記裏面電極とタブ線とを接続させるラミネート圧着工程と
を有する太陽電池モジュールの製造方法。 - 前記ラミネート圧着工程における温度が、前記ハンダ粒子の融点よりも高い請求項8記載の太陽電池モジュールの製造方法。
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US13/882,294 US20130213453A1 (en) | 2010-11-26 | 2011-11-10 | Conductive adhesive material, solar cell module, and method for manufacturing same |
EP11843258.2A EP2645423A4 (en) | 2010-11-26 | 2011-11-10 | Conductive adhesive material, solar cell module and method of making same |
CN2011800566964A CN103222069A (zh) | 2010-11-26 | 2011-11-10 | 导电性粘接材料、太阳能电池模块及其制造方法 |
KR20137016473A KR20130132497A (ko) | 2010-11-26 | 2011-11-10 | 도전성 접착 재료, 태양 전지 모듈 및 그의 제조 방법 |
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JP2010-263607 | 2010-11-26 | ||
JP2010263607A JP5707110B2 (ja) | 2010-11-26 | 2010-11-26 | 導電性接着材料、太陽電池モジュール及びその製造方法 |
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WO2012070396A1 true WO2012070396A1 (ja) | 2012-05-31 |
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PCT/JP2011/075935 WO2012070396A1 (ja) | 2010-11-26 | 2011-11-10 | 導電性接着材料、太陽電池モジュール及びその製造方法 |
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US (1) | US20130213453A1 (ja) |
EP (1) | EP2645423A4 (ja) |
JP (1) | JP5707110B2 (ja) |
KR (1) | KR20130132497A (ja) |
CN (1) | CN103222069A (ja) |
WO (1) | WO2012070396A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103805087A (zh) * | 2012-11-12 | 2014-05-21 | 迪睿合电子材料有限公司 | 导电性粘接剂、太阳能电池模块及太阳能电池模块的制造方法 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5958701B2 (ja) * | 2012-07-17 | 2016-08-02 | デクセリアルズ株式会社 | 配線材、太陽電池モジュール及び太陽電池モジュールの製造方法 |
JP6163014B2 (ja) * | 2013-05-22 | 2017-07-12 | 三菱電機株式会社 | 太陽電池モジュールの製造方法 |
JP6247059B2 (ja) * | 2013-09-05 | 2017-12-13 | デクセリアルズ株式会社 | 導電性接着剤、太陽電池モジュール、及び太陽電池モジュールの製造方法 |
DE102015116334A1 (de) * | 2014-09-29 | 2016-03-31 | Panasonic Intellectual Property Management Co., Ltd. | Solarzellenfertigungsverfahren |
KR102303827B1 (ko) | 2014-10-06 | 2021-09-17 | 삼성전자주식회사 | 다수의 전극조립체를 구비하는 복합전극조립체 및 이를 포함하는 전기화학소자 |
CN105702769B (zh) * | 2016-03-28 | 2019-04-16 | 泰州中来光电科技有限公司 | 一种太阳能电池模块及其制备方法和组件、系统 |
KR20180095410A (ko) * | 2017-02-17 | 2018-08-27 | 주식회사 동진쎄미켐 | 도전성 접착제 조성물 |
JP2017143311A (ja) * | 2017-05-17 | 2017-08-17 | 三菱電機株式会社 | 太陽電池モジュールの製造方法 |
JP2024007200A (ja) * | 2022-07-05 | 2024-01-18 | デクセリアルズ株式会社 | 太陽電池モジュール、導電性接着材、及び太陽電池モジュールの製造方法 |
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- 2011-11-10 WO PCT/JP2011/075935 patent/WO2012070396A1/ja active Application Filing
- 2011-11-10 KR KR20137016473A patent/KR20130132497A/ko not_active Application Discontinuation
- 2011-11-10 US US13/882,294 patent/US20130213453A1/en not_active Abandoned
- 2011-11-10 EP EP11843258.2A patent/EP2645423A4/en not_active Withdrawn
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Also Published As
Publication number | Publication date |
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JP5707110B2 (ja) | 2015-04-22 |
CN103222069A (zh) | 2013-07-24 |
EP2645423A4 (en) | 2015-07-01 |
KR20130132497A (ko) | 2013-12-04 |
JP2012114339A (ja) | 2012-06-14 |
EP2645423A1 (en) | 2013-10-02 |
US20130213453A1 (en) | 2013-08-22 |
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