WO2012069208A9 - Support de substrat pour le traitement de surface de substrats et utilisation du support de substrat - Google Patents

Support de substrat pour le traitement de surface de substrats et utilisation du support de substrat Download PDF

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Publication number
WO2012069208A9
WO2012069208A9 PCT/EP2011/005948 EP2011005948W WO2012069208A9 WO 2012069208 A9 WO2012069208 A9 WO 2012069208A9 EP 2011005948 W EP2011005948 W EP 2011005948W WO 2012069208 A9 WO2012069208 A9 WO 2012069208A9
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
substrate holder
holder according
frame
edge
Prior art date
Application number
PCT/EP2011/005948
Other languages
German (de)
English (en)
Other versions
WO2012069208A1 (fr
Inventor
Dirk Reinwand
Marc Hofmann
Daniel Trogus
Philip Hartmann
Jan-Frederik Nekarda
Jochen Rentsch
Ralf Preu
Original Assignee
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. filed Critical Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
Priority to EP11796619.2A priority Critical patent/EP2643850A1/fr
Publication of WO2012069208A1 publication Critical patent/WO2012069208A1/fr
Publication of WO2012069208A9 publication Critical patent/WO2012069208A9/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile

Definitions

  • Substrate holder for the surface treatment of sub ⁇ straten and use of the substrate holder The invention relates to a substrate holder for
  • substrates can be maintained, for example, to make a one-sided coating, cleaning or etching back of substrates, for example, of solar cells can.
  • Such processes are usually carried out in continuous systems, such as in vacuum systems, such as plasma-enhanced chemical vapor Deposition (PECVD) - or in Physical Vapor Deposition (PVD) or in Atmospheric Pressure Chemical Vapor Deposition (APCVD) plants.
  • PECVD plasma-enhanced chemical vapor Deposition
  • PVD Physical Vapor Deposition
  • APCVD Atmospheric Pressure Chemical Vapor Deposition
  • a problem with such surface treatments of substrates, such as solar cells is, inter alia, that the substrate must be held so that no shading surfaces arise.
  • the substrates are located at individual points on the surface to be coated.
  • Coating of substrates with a metal film can, if the metal film is deposited at undesired locations, lead to short-circuiting of a solar cell.
  • a substrate holder as defined in claim 1 by the feature combination.
  • a substrate holder is thus proposed in frame form, wherein the substrate holder is characterized in that the inner frame ⁇ edge is formed in the form of an oblique edge surface.
  • the substrate to be coated then lies with its substrate edge on this oblique edge surface.
  • the edge of the substrate on the oblique edge surface forms a peripheral support line which exactly defines and defines the surface to be processed. The machining process can thus continue until the
  • Substrate edge are performed without shading occurs, at the same time avoiding the processing of the substrate to undesirable areas is avoided by the circumferential support line of the substrate edge on the oblique edge surface.
  • a frame means a single frame but also the arrangement of several frames next to one another to form a carrier.
  • the oblique edge surfaces are formed in the carrier itself.
  • the invention also includes embodiments in which individual frames are used in a carrier. It has been found that it is preferred if the oblique edge surface is formed so that an angle ⁇ of 25 ° to 70 °, preferably 35 ° to 55 ° is maintained. According to the invention, an angle ⁇ is understood to mean an angle which arises between the first oblique edge surface and an imaginary vertical arranged on the substrate starting from the substrate edge.
  • the substrate holder according to the invention can also be designed so that not only an oblique Kan ⁇ ten Design as described above, but that even a second oblique edge surface which is ge ⁇ communly to the first oblique edge surface latestbil ⁇ det, is provided.
  • a triangular construction is realized in the cross section of the frame.
  • an angle ⁇ of 25 ° to 70 °, preferably from 35 ° to 55 °tienthal ⁇ th is.
  • the determination of the angle ⁇ is carried out as described above, namely in such a way that the angle between the second oblique edge surface and an imaginary vertical arranged on the substrate is taken into account here starting from the apex of the triangle.
  • the substrate holder of the invention also includes embodiments in which additionally a holding plate is provided.
  • a holding plate is provided.
  • Ge ⁇ Mäss of the invention it is preferred in this case if this support plate is positively fitted between the first inclined edge surfaces of the frame.
  • the dimensioning and shaping is chosen so that when the substrate is placed with its opposite surface for processing on the holding plate, the substrate edge in turn has contact with the oblique edge surface.
  • a linear support of the substrate is achieved on the oblique edge surface, so that an exact processing is possible.
  • a substrate holder is used only with a frame or with a frame and a holding plate depends on which processing method is selected.
  • the substrate with the surface to be coated is routinely arranged downwards and coated from below (face down). This can still be achieved that particles do not fall on the surface.
  • the substrate holder according to the invention thus also permits both a face-down and a face-up arrangement to be realized.
  • the invention has no limitations with respect to the frame.
  • the only thing that matters is that the area covered by the frame measurement is adapted to the substrate to be processed.
  • a frame which is polygonal, for example four- or hexagonal.
  • the material of the frame and / or the retaining plate is known in the art. The materials must be selected so that they remain stable under the given process conditions.
  • the substrate holder according to the invention is thus particularly suitable for coating any layers or layer systems as well as for cleaning or etching back substrates.
  • These processing steps are preferably carried out in continuous systems, preferably in vacuum systems such as PECVD, PVD or also APCVD.
  • the invention can advantageously be implemented in coating systems in which a pressure difference is formed between the side to be coated and the side not to be coated, the pressure on the side to be coated being lower than on the side not to be coated.
  • This can, for example, by an appropriate arrangement of pumps or
  • FIG. 1 shows in cross-section the substrate holder according to the invention with an oblique edge surface (FIG
  • FIG. 2 shows in FIG. 2a a substrate holder with two oblique edge surfaces and a holding plate, and in FIG. 2b a substrate holder with an oblique edge surface and a holding plate, again in cross section.
  • FIG. 3 shows in perspective in FIG. 3a
  • FIG. 4 shows a detail of a frame with the oblique edge surface and the substrate in a 3D representation.
  • FIG. 5 shows an SEM image of the edge after metal deposition.
  • Figure 6 shows an exploded view of an embodiment with a carrier.
  • Figure la shows in cross-section an inventive
  • Frame as he e.g. in Figure 3 is shown in a perspective view.
  • the substrate holder with the frame 1 according to the invention has, as shown in
  • the substrate 2 is now arranged with its surface to be machined 4 down in the frame 1 so that the substrate edge 6 rests on the oblique edge surface 5 (see also Figure 4).
  • a linear support results, so that, as can also be seen from the illustration, a processing (illustrated) is by arrows) of the surface 4 to be processed is possible. Due to the oblique edge surface thus processing can be performed up to the substrate edge 6.
  • a shading by any kind of holding elements is not present and by the
  • Overlay on the oblique edge surface 5 is also a grip on areas of the substrate 2, for. on the surface 4 to be machined surface 3 and / or the edges avoided. It can also be seen from FIG. 1a how the angle ⁇ of the oblique edge surface has been determined.
  • the angle ⁇ which is 45 ° in the example, is determined between an imaginary perpendicular to the substrate, starting from the substrate edge 6, and the oblique edge surface 5.
  • FIG. 1b is again a cross-sectional view.
  • the second oblique edge surface which is denoted by 8, is thus formed in opposite directions to the first oblique edge surface 5, so that a triangular profile is produced in cross-section. It is essential that the substrate 2 in turn rests with its substrate edge 6 on the first oblique edge surface 5, so that in turn a line-shaped support of the substrate on the oblique edge surface 5 is formed.
  • the angle ⁇ for the second oblique edge surface is calculated as already described above in FIG.
  • FIGS. 2a and 2b correspond to the embodiments with regard to the frame configuration, as have already been described in detail above in FIGS. 1a and b.
  • a holding plate 10 is additionally inserted in a form-fitting manner between the first oblique edge surfaces 5.
  • the dimensioning and shaping of the holding plate 10 is chosen so that when placing the substrate 2 on the holding plate 10 in turn, a contact of the substrate edge 6 takes place with the oblique edge surface 5.
  • FIG. 2b Face-up procedure to work.
  • the determination of the angle ⁇ and ⁇ takes place as described above in FIG. 1a.
  • the embodiment further described in FIG. 2b corresponds in turn to the embodiment as already described above with reference to FIG. 1, but here again only one substrate plate 10 is inserted in a form-fitting manner.
  • FIG. 3 a substrate holder in the form of a hexagonal frame and in FIG. 3b in the form of a quadrangular frame are shown by way of example in FIG. 3a.
  • the inner frame edge 7 is designed as an oblique edge surface.
  • FIG. 3 b shows a quadrilateral frame, and 7 again denotes the inner frame edge 7.
  • the frame edges 7 both in FIG. 3 a and in FIG. 3 b can, of course, be designed so that only an oblique edge surface or that, as already shown in FIG described, two oblique edge surfaces are present.
  • FIG. 4 illustrates in a 3D representation, in detail, how the substrate 2 is inclined
  • Edge surface 5 of a frame 1 according to the invention of the substrate holder rests.
  • the coating is done in this embodiment, of course, from below, so that no shadowing.
  • FIG. 5 shows an SEM image of the edge after metal deposition.
  • the embodiment of the substrate holder according to the invention achieves optimum metal deposition up to the edge.
  • FIG. 6 now shows an embodiment in which a carrier 30 is provided, which consists of several juxtaposed openings, wherein in the openings 30 then a frame 1 is used.
  • Frame 1 is then formed as already described in the figures 1 to 5. 31, in the example of FIG. 6, denotes a solar cell.
  • the invention also includes embodiments in which a plurality of side by side arranged frame 1 then the carrier 30, as shown in Figure 6, form. In this case, then no separate frame 1 must be used, but the oblique edge surfaces are already formed in the carrier 30. In particular, in industrial implementation, such an embodiment is preferred.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

L'invention concerne un support de substrat pour le revêtement de surface de substrats présentant une forme de cadre. Selon l'invention, le substrat repose sur une surface à arête inclinée, de sorte que la surface est entièrement enduite sans enveloppement sur des zones non souhaitées du substrat. L'invention concerne en outre l'utilisation d'un support de substrat de ce type.
PCT/EP2011/005948 2010-11-26 2011-11-25 Support de substrat pour le traitement de surface de substrats et utilisation du support de substrat WO2012069208A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP11796619.2A EP2643850A1 (fr) 2010-11-26 2011-11-25 Support de substrat pour le traitement de surface de substrats et utilisation du support de substrat

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010052689.4 2010-11-26
DE201010052689 DE102010052689A1 (de) 2010-11-26 2010-11-26 Substrathalter für die Oberflächenbehandlung von Substraten und Verwendung des Substrathalters

Publications (2)

Publication Number Publication Date
WO2012069208A1 WO2012069208A1 (fr) 2012-05-31
WO2012069208A9 true WO2012069208A9 (fr) 2012-07-19

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PCT/EP2011/005948 WO2012069208A1 (fr) 2010-11-26 2011-11-25 Support de substrat pour le traitement de surface de substrats et utilisation du support de substrat

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EP (1) EP2643850A1 (fr)
DE (1) DE102010052689A1 (fr)
WO (1) WO2012069208A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6013824B2 (ja) * 2012-07-27 2016-10-25 株式会社荏原製作所 ワーク搬送装置
WO2014191624A1 (fr) * 2013-05-29 2014-12-04 Beneq Oy Support de substrat et agencement de support de substrats
DE102014116342B4 (de) * 2014-11-10 2016-06-09 Von Ardenne Gmbh Substrathaltevorrichtung und Verfahren zum Prozessieren eines Substrats
DE102015014903A1 (de) * 2015-11-18 2017-05-18 Centrotherm Photovoltaics Ag Waferboot und Plasma-Behandlungsvorrichtung für Wafer
DE102016214445A1 (de) 2016-08-04 2018-02-08 Meyer Burger (Germany) Ag Anpassungsvorrichtung für Substratträger
DE102018111868A1 (de) * 2018-05-17 2019-11-21 Meyer Burger (Germany) Gmbh Substratträger

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US5304248A (en) * 1990-12-05 1994-04-19 Applied Materials, Inc. Passive shield for CVD wafer processing which provides frontside edge exclusion and prevents backside depositions
US5805408A (en) * 1995-12-22 1998-09-08 Lam Research Corporation Electrostatic clamp with lip seal for clamping substrates
TW344100B (en) * 1996-05-31 1998-11-01 Toshiba Co Ltd Semiconductor liquid phase epitaxial growth method and apparatus
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Also Published As

Publication number Publication date
DE102010052689A1 (de) 2012-05-31
WO2012069208A1 (fr) 2012-05-31
EP2643850A1 (fr) 2013-10-02

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