WO2012060099A1 - Procédé d'ajustement d'une source lumineuse, procédé d'exposition, procédé de fabrication d'un dispositif, système optique d'éclairement et dispositif d'exposition - Google Patents

Procédé d'ajustement d'une source lumineuse, procédé d'exposition, procédé de fabrication d'un dispositif, système optique d'éclairement et dispositif d'exposition Download PDF

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Publication number
WO2012060099A1
WO2012060099A1 PCT/JP2011/006132 JP2011006132W WO2012060099A1 WO 2012060099 A1 WO2012060099 A1 WO 2012060099A1 JP 2011006132 W JP2011006132 W JP 2011006132W WO 2012060099 A1 WO2012060099 A1 WO 2012060099A1
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WIPO (PCT)
Prior art keywords
light source
illumination
illumination light
optical elements
shape
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PCT/JP2011/006132
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English (en)
Japanese (ja)
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嘉彦 藤村
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株式会社ニコン
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions

Definitions

  • the present invention relates to a light source adjustment method, an exposure method, a device manufacturing method, an illumination optical system, and an exposure apparatus, and in particular, a predetermined light in an illumination optical path by light via each of a plurality of optical elements constituting a spatial light modulator.
  • Light source adjustment method for adjusting the illumination light source formed on the surface exposure method for exposing an object with illumination light from the illumination light source adjusted by the light source adjustment method, device manufacturing method using the exposure method, light from the light source
  • the present invention relates to an illumination optical system that illuminates an illuminated surface, and an exposure apparatus that includes the illumination optical system and that exposes an object with illumination light from an illumination light source to form a pattern on the object.
  • ⁇ is the wavelength of the light source (illumination light)
  • NA is the numerical aperture of the projection optical system
  • k 1 is a process factor determined by the resolution and / or process controllability of the resist.
  • an illumination technique realized by a spatial light modulator (SLM) as disclosed in Patent Document 1 or the like Is attracting attention.
  • the light is formed on the predetermined surface by selectively distributing the light through each of the plurality of optical elements constituting the spatial light modulator to the plurality of sections in the predetermined surface in the illumination optical path.
  • a light source adjustment method for adjusting an illumination light source wherein the plurality of optical elements is based on characteristics of the plurality of optical elements, a shape of a beam irradiated to the plurality of optical elements, and a target of the shape of the illumination light source.
  • an exposure method for exposing an object with illumination light from the illumination light source having a light source shape adjusted by the light source adjustment method of the first aspect and forming a pattern on the object Is done.
  • a pattern is formed on an object using the exposure method of the second aspect; the object on which the pattern is formed is developed, and a mask layer having a shape corresponding to the pattern
  • a device manufacturing method comprising: forming a surface of the object on the surface of the object; and processing the surface of the object through the mask layer.
  • an illumination optical system that illuminates a surface to be irradiated with light from a light source, the illumination optical system having a plurality of optical elements, and passing light through each of the plurality of optical elements in an illumination optical path.
  • a spatial light modulator that forms an illumination light source on the predetermined surface by selectively allocating to a plurality of sections in the predetermined surface; a control unit that controls the plurality of optical elements of the spatial light modulator; and the illumination light source
  • An illumination light source measuring instrument that measures the shape of the illumination light source and outputs a measurement result; and the control unit includes characteristics of the plurality of optical elements, shapes of beams irradiated on the plurality of optical elements, and the illumination light source.
  • the combination of the plurality of optical elements and the plurality of sections is optimized, and the illumination light source is formed via the plurality of optical elements according to the optimization result, and the shape of the beam Using the measurement result, Estimating the characteristics of a plurality of optical elements, illumination optical system for adjusting the shape of the illumination light source based on the estimation result of the characteristics of the plurality of optical elements are provided.
  • an exposure apparatus comprising the illumination optical system according to the fourth aspect, and exposing an object with illumination light from the illumination light source to form a pattern on the object.
  • FIG. 6A is a diagram showing an example of the ideal and measurement result of the intensity distribution (light source shape) of the light beam
  • FIG. 6B is a diagram showing an example of the ideal of the illumination light source shape and the measurement result.
  • FIG. 1 schematically shows a configuration of an exposure apparatus 100 according to an embodiment.
  • the exposure apparatus 100 is a step-and-scan projection exposure apparatus, a so-called scanner.
  • a projection optical system PL is provided.
  • a reticle and wafer are arranged in a direction perpendicular to the Z-axis direction parallel to the optical axis AX of the projection optical system PL and in a plane perpendicular to the Z-axis direction.
  • the exposure apparatus 100 includes an illumination system IOP, a reticle stage RST that holds a reticle R, a projection unit PU that projects a pattern image formed on the reticle R onto a wafer W coated with a sensitive agent (resist), and a wafer W.
  • a wafer stage WST to be held and a control system for these are provided.
  • the illumination system IOP includes a light source 1, a beam expander 2, a beam splitter BS1, a spatial light modulation unit 3, a relay optical system 4, a beam splitter BS2, which are sequentially arranged on the optical path of the light beam LB emitted from the light source 1.
  • an illumination optical system including a fly-eye lens 5 as an optical integrator, a condenser optical system 6, an illumination field stop (reticle blind) 7, an imaging optical system 8, a bending mirror 9, and the like.
  • the light source 1 an ArF excimer laser (output wavelength 193 nm) is used.
  • the light beam LB emitted from the light source 1 has a rectangular cross-sectional shape that is long in the X-axis direction.
  • the beam expander 2 is composed of a concave lens 2a and a convex lens 2b.
  • the concave lens 2a has a negative refractive power
  • the convex lens 2b has a positive refractive power.
  • a beam splitter BS1 is disposed behind the optical path of the light beam LB with respect to the beam expander 2.
  • the beam splitter BS1 transmits most of the light beam LB and reflects the rest.
  • a beam shape detection unit D1 including an image sensor such as a CCD is disposed on the reflected light path of the light beam LB.
  • the beam shape detection unit D1 receives the light beam LB from the beam splitter BS1 and detects the intensity distribution (including the positional deviation of the light beam LB) of the light beam LB toward the spatial light modulation unit 3.
  • the detection result of the beam shape detection unit D1 is sent to the main controller 20.
  • the spatial light modulation unit 3 includes a so-called K prism (hereinafter simply referred to as a prism) 3P, and a reflective spatial light modulator (SLM: Spatial Light Modulator) 3S disposed on the upper surface (+ Z side surface) of the prism 3P. And.
  • the prism 3P is made of optical glass such as fluorite or quartz glass.
  • an incident surface ⁇ Y side surface
  • V-shaped surfaces surfaces recessed in a wedge shape
  • the back surfaces of the surfaces PS1 and PS2 function as reflecting surfaces R1 and R2, respectively.
  • the reflection surface R1 reflects the light parallel to the Y axis that is transmitted from the beam expander 2 through the beam splitter BS1 and perpendicularly incident on the incident surface of the prism 3P in the direction of the spatial light modulator 3S.
  • the reflected light beam LB reaches the spatial light modulator 3S via the upper surface of the prism 3P, and is reflected toward the reflection surface R2 by the spatial light modulator 3S as will be described later.
  • the reflecting surface R2 of the prism 3P reflects the light that has arrived from the spatial light modulator 3S via the upper surface of the prism 3P and emits it to the relay optical system 4 side.
  • the spatial light modulator 3S is a reflective spatial light modulator.
  • the spatial light modulator means an element that processes, displays, and erases spatial information such as an image or patterned data by two-dimensionally controlling the amplitude, phase, or traveling direction of incident light.
  • a movable multi-mirror array having a large number of minute mirror elements SE arranged on a two-dimensional (XY) plane is used.
  • the spatial light modulator 3S includes a large number of mirror elements. In FIG. 2, only the mirror elements SEa, SEb, SEc, and SEd are shown.
  • the spatial light modulator 3S continuously tilts (rotates) a large number of mirror elements SE and the large number of mirror elements SE within a predetermined range around two orthogonal axes (for example, the X axis and the Y axis) in the XY plane. And the same number of driving units.
  • the drive unit includes, for example, a support column that supports the center of the back surface (the surface on the + Z side, that is, the surface opposite to the reflection surface) of the mirror element SE, a substrate on which the support column is fixed, and four electrodes provided on the substrate. And four electrodes (not shown) provided on the back surface of the mirror element SE so as to face the electrodes.
  • the detailed configuration of the spatial light modulator similar to the spatial light modulator 3S is disclosed in, for example, US Patent Application Publication No. 2009/0097094.
  • a beam splitter BS2 is disposed behind the optical path of the relay optical system 4, and a fly-eye lens 5 is disposed on the transmitted optical path of the beam splitter BS2.
  • the fly-eye lens 5 is a set of a large number of microlens elements having positive refractive power arranged densely in the direction perpendicular to the light beam LB.
  • the fly-eye lens 5 divides the incident light beam into wavefronts, and forms a secondary light source (substantially surface light source) composed of the same number of light source images as the lens elements on the rear focal plane.
  • a cylindrical micro fly's eye lens disclosed in, for example, US Pat. No. 6,913,373 is adopted as the fly eye lens 5.
  • the light beam LB emitted from the light source 1 is incident on the beam expander 2 and passes through the beam expander 2 so that its cross section is enlarged, and a predetermined rectangular cross section is formed. It is shaped into a light beam.
  • the light beam LB shaped by the beam expander 2 passes through the beam splitter BS1 and enters the spatial light modulation unit 3.
  • each parallel light beams L1 to L4 arranged in the Z-axis direction in the light beam LB enter the inside from the incident surface of the prism 3P and are spatially modulated by the reflecting surface R1. Reflected parallel to each other toward the container 3S.
  • the light beams L1 to L4 respectively enter the reflecting surfaces of different mirror elements SEa, SEb, SEc, and SEd arranged in the Y-axis direction among the plurality of mirror elements SE.
  • the mirror elements SEa, SEb, SEc, and SEd are independently tilted by respective driving units (not shown). For this reason, the light beams L1 to L4 are reflected toward the reflecting surface R2 in different directions.
  • the light beams L1 to L4 (light beam LB) are reflected by the reflecting surface R2 and emitted to the outside of the prism 3P.
  • the air-converted optical path lengths of the light beams L1 to L4 from the ⁇ Y side surface (incident surface) to the + Y side surface (outgoing surface) of the prism 3P correspond to the air-converted optical path length when the prism 3P is not provided. Is set equal to
  • the air-converted optical path length is an optical path length L / n obtained by converting an optical path length (L) of light in the medium (refractive index n) into an optical path length in the air (refractive index 1).
  • the light beams L1 to L4 (light beam LB) emitted to the outside of the prism 3P are aligned parallel to the Y axis via the relay optical system 4 and pass through the beam splitter BS2 disposed behind the relay optical system 4. Is incident on the fly-eye lens 5. Then, each of the light beams L1 to L4 is incident on one of a large number of lens elements of the fly-eye lens 5, whereby the light beam LB is divided (wavefront division).
  • a secondary light source surface light source, that is, an illumination light source
  • a secondary light source composed of a plurality of light source images is formed on the rear focal plane LPP of the fly-eye lens 5 that coincides with the pupil plane (illumination pupil plane) of the illumination optical system. .
  • FIG. 2 schematically shows light intensity distributions SP1 to SP4 corresponding to the light rays L1 to L4 on the rear focal plane LPP of the fly-eye lens 5.
  • the light intensity distribution (also referred to as luminance distribution or illumination light source shape) of the secondary light source (illumination light source) is freely set by the spatial light modulator 3S.
  • the spatial light modulator is not limited to the reflective active spatial light modulator described above, and a transmissive or reflective diffractive optical element as an inactive spatial light modulator can also be used.
  • the relay optical system 4 can be configured to include, for example, an afocal lens and a zoom lens, and at least a part of the optical members (lens,
  • the light intensity distribution of the secondary light source (illumination light source) can be variably set by controlling the position and / or orientation of the prism member or the like.
  • the diffractive optical element for example, as disclosed in US Pat. No. 6,671,035 or US Pat. No. 7,265,816, the position of the diffractive optical element having a plurality of sections is disclosed. By controlling the light intensity distribution, the light intensity distribution of the secondary light source (illumination light source) may be variably set.
  • a secondary light source (illumination light source) can be used by using a movable illumination aperture stop disclosed in, for example, US Pat. No. 6,452,662.
  • the light intensity distribution may be set variably.
  • the secondary light source formed by the fly-eye lens 5 is used as an illumination light source, and the reticle R held on the reticle stage RST described later is Koehler illuminated. Therefore, the surface on which the secondary light source is formed is a conjugate surface with respect to the surface of the aperture stop 41 (aperture stop surface) of the projection optical system PL, and is called a pupil plane (illumination pupil plane) of the illumination optical system. Further, the irradiated surface (the surface on which the reticle R is disposed or the surface on which the wafer W is disposed) is an optical Fourier transform surface with respect to the illumination pupil plane.
  • the light intensity distribution on the incident surface of the fly-eye lens 5 and the surface optically conjugate with the incident surface is also referred to as the light intensity distribution (luminance distribution or illumination light source shape) of the secondary light source (illumination light source). it can.
  • the illumination pupil distribution measurement unit D2 is disposed on the reflected light path of the beam splitter BS2.
  • the illumination pupil distribution measurement unit D2 includes a CCD imaging unit having an imaging surface disposed at a position optically conjugate with the incident surface of the fly-eye lens 5, and a light intensity distribution formed on the incident surface of the fly-eye lens 5. (Luminance distribution or illumination light source shape) is monitored. That is, the illumination pupil distribution measurement unit D2 has a function of measuring the pupil intensity distribution on the illumination pupil or a surface optically conjugate with the illumination pupil.
  • the measurement result of the illumination pupil distribution measurement unit D2 is supplied to the main controller 20.
  • the illumination pupil distribution measurement unit D2 For the detailed configuration and operation of the illumination pupil distribution measurement unit D2, reference can be made to, for example, US Patent Application Publication No. 2008/0030707.
  • the light beam LB from the secondary light source illuminates the illumination field stop 7 in a superimposed manner via the condenser optical system 6.
  • the illumination field stop 7 is formed with a rectangular illumination field corresponding to the shape and focal length of the rectangular minute refracting surface, which is the wavefront division unit of the fly-eye lens 5.
  • the light beam LB that passes through the rectangular opening (light transmission portion) of the illumination field stop 7 receives the light condensing action of the imaging optical system 8 and then superimposes the reticle R on which a predetermined pattern is formed. Illuminate. That is, the light beam LB from the secondary light source is collected by the condenser optical system 6, and further, the illumination field stop 7, the imaging optical system 8, the folding mirror 9, etc.
  • Reticle stage RST is arranged below illumination system IOP ( ⁇ Z side). On reticle stage RST, reticle R is fixed, for example, by vacuum suction.
  • the reticle stage RST can be finely driven in a horizontal plane (XY plane) by a reticle stage drive system (not shown) including a linear motor, for example, and can be driven within a predetermined stroke range in the scanning direction (Y-axis direction). It has become.
  • Position information of the reticle stage RST in the XY plane (including rotation information in the ⁇ z direction) is transferred to a movable mirror 12 (or an end surface of the reticle stage RST) by a reticle laser interferometer (hereinafter referred to as “reticle interferometer”) 14.
  • reticle interferometer reticle laser interferometer
  • main controller 20 main controller 20.
  • Projection optical system PL is disposed below reticle stage RST ( ⁇ Z side).
  • the projection optical system PL for example, a refractive optical system including a plurality of optical elements (lens elements) arranged along the optical axis AX is used.
  • the projection optical system PL is, for example, both-side telecentric and has a predetermined projection magnification (for example, 1/4 times, 1/5 times, or 1/8 times). Therefore, as described above, when the reticle R is illuminated by the illumination light IL from the illumination system IOP, illumination on the pattern surface of the reticle R (the first surface of the projection optical system, the object surface) via the projection optical system PL. A reduced image of the pattern in the region (a reduced image of a part of the pattern) is projected onto the exposure region IA on the wafer W (second surface of the projection optical system, image surface) coated with a resist (sensitive agent). .
  • a plurality of lens elements (not shown) on the object plane side (reticle R side) are controlled by an imaging performance correction controller 48 under the main controller 20.
  • it is a movable lens that can be driven in the Z-axis direction, which is the optical axis direction of the projection optical system PL, and in the tilt direction with respect to the XY plane (that is, the ⁇ x and ⁇ y directions).
  • an aperture stop 41 capable of continuously changing the numerical aperture (NA) within a predetermined range is provided in the vicinity of the pupil plane of the projection optical system PL.
  • the aperture stop 41 for example, a so-called iris stop is used.
  • the aperture stop 41 is controlled by the main controller 20 via the imaging performance correction controller 48.
  • Wafer stage WST is driven on stage base 22 with a predetermined stroke in the X-axis direction and Y-axis direction by stage drive system 24 including a linear motor and the like, and in Z-axis direction, ⁇ x direction, ⁇ y direction, and ⁇ z direction. It is driven minutely.
  • wafer W is held by vacuum suction or the like via a wafer holder (not shown).
  • Interferometer system 18 always detects with a resolution of about 0.25 nm, for example, via a movable mirror 16 (or a reflecting surface formed on the end surface of wafer stage WST). The The measurement result of the interferometer system 18 is supplied to the main controller 20.
  • the position and the inclination of the surface of the wafer W in the Z-axis direction are such that an imaging light beam for forming images of many pinholes or slits toward the imaging surface of the projection optical system PL with respect to the optical axis AX. It is measured by a focal position detection system having an irradiation system 60a that irradiates from an oblique direction and a light receiving system 60b that receives a reflected light beam of the imaging light beam on the surface of the wafer W.
  • the focal position detection system (60a, 60b) one having the same configuration as the oblique incidence type multipoint focal position detection system disclosed in, for example, US Pat. No. 5,448,332 is used.
  • a reference plate FP whose surface is flush with the surface of the wafer W is fixed on the wafer stage WST.
  • a reference mark used for baseline measurement of the alignment system AS a pair of reference marks detected by a reticle alignment system described later, and the like are formed.
  • the wafer stage WST is provided with a luminance distribution measuring device 80 for measuring (measuring) the pupil luminance distribution on-body.
  • the luminance distribution measuring instrument 80 includes a cover glass 80a, a condenser lens 80b, a light receiving unit 80c, and the like.
  • the upper surface of the cover glass 80a is set to be equal to the imaging plane position of the projection optical system PL, that is, the surface position of the wafer W placed on the wafer stage WST.
  • a light shielding film having a circular opening (pinhole) in the center is formed by vapor deposition of a metal such as chromium.
  • the light shielding film prevents (blocks) unnecessary light from entering the light receiving unit 80c from the surroundings when measuring the pupil luminance distribution.
  • the cover glass 80a (pinhole) and the light receiving unit 80c are disposed at the front and rear focal positions of the condenser lens 80b, respectively.
  • the light receiving surface of the light receiving unit 80c is arranged at a position optically conjugate with the position of the aperture stop 41 of the projection optical system PL (that is, the pupil plane of the projection optical system PL and the pupil plane of the illumination system IOP).
  • the light receiving unit 80c includes a light receiving element including a two-dimensional CCD and the like, and an electric circuit such as a charge transfer control circuit. The measurement data from the light receiving unit 80c is sent to the main controller 20.
  • the luminance distribution measuring instrument 80 having the above-described configuration, a part of the illumination light IL emitted from the projection optical system PL passes through the pinhole of the cover glass 80a, is condensed by the condenser lens 80b, and is collected by the light receiving unit 80c. Incident on the light receiving surface.
  • the intensity distribution of the illumination light IL at the aperture stop 41 of the projection optical system PL is reproduced on the light receiving surface of the light receiving unit 80c. That is, the intensity distribution on the aperture stop 41 of the illumination light IL passing through the pinhole of the cover glass 80a is measured by the light receiving unit 80c.
  • the position of the aperture stop 41 is optically conjugate with the positions of the pupil plane of the projection optical system PL and the pupil plane of the illumination system IOP, measuring the intensity distribution of the illumination light IL measures the pupil luminance distribution. Is equivalent to
  • an alignment mark (not shown) having a known positional relationship with the pinhole is provided on the upper surface of the cover glass 80a.
  • the alignment mark is used to calibrate the position of the pinhole on the stage coordinate system, that is, the position of the luminance distribution measuring instrument 80.
  • the pupil luminance distribution regarding a plurality of points on the irradiated surface (second surface) is measured.
  • the measurement of the pupil luminance distribution will be further described later.
  • an alignment system AS that detects an alignment mark and a reference mark formed on the wafer W is provided on the side surface of the lens barrel 40 of the projection unit PU.
  • the alignment system AS for example, an image processing method in which a mark is illuminated and detected by broadband light such as a halogen lamp and the position of the mark is measured by performing image processing on the detected mark image (image).
  • An FIA (Field Image Alignment) system which is a kind of imaging type alignment sensor, is used.
  • TTR Through The Reticle alignment using light having an exposure wavelength disclosed in, for example, US Pat. No. 5,646,413 is provided above the reticle stage RST.
  • a pair of reticle alignment systems comprising the system is provided.
  • a detection signal of the reticle alignment system is supplied to main controller 20.
  • the control system is mainly configured by a main controller 20 in FIG.
  • the main controller 20 is composed of a so-called workstation (or microcomputer) composed of a CPU (Central Processing Unit), ROM (Read Only Memory), RAM (Random Access Memory), etc. Control all over.
  • the main controller 20 includes, for example, a storage device 42 including a hard disk, an input device 45 including a pointing device such as a keyboard and a mouse, a display device 44 such as a CRT display (or liquid crystal display), and a CD (compact disc).
  • a drive device 46 of an information storage medium such as a DVD (digital versatile disc), MO (magneto-optical disc) or FD (flexible disc) is externally attached (connected).
  • the storage device 42 information on the illumination light source shape (pupil luminance distribution) in which the imaging state of the projection image projected onto the wafer W by the projection optical system PL is optimum (for example, aberration or line width is within an allowable range),
  • the control information of the illumination system IOP corresponding to this, in particular, the mirror element SE of the spatial light modulator 3S, the information on the aberration of the projection optical system PL, and the like are stored.
  • the drive device 46 is set with an information storage medium (hereinafter referred to as a CD-ROM for convenience) in which a processing program for adjusting the illumination light source shape and the like are stored as will be described later. Note that these programs may be installed in the storage device 42. Main controller 20 reads these programs onto the memory as appropriate.
  • a processing program for adjusting the illumination light source shape and the like are stored as will be described later.
  • Main controller 20 reads these programs onto the memory as appropriate.
  • the exposure apparatus 100 as in a normal scanner, after performing preparatory work such as wafer exchange, reticle exchange, reticle alignment, baseline measurement of the alignment system AS, and wafer alignment (such as EGA), exposure in a step-and-scan manner is performed. Operation is performed. Detailed description is omitted.
  • an illumination light source shape (pupil luminance distribution) setting process using the spatial light modulation unit 3 (spatial light modulator 3S) in the exposure apparatus 100 of the present embodiment will be described.
  • FIG. 4 shows a flowchart schematically showing a processing algorithm of the main controller 20 (internal CPU) relating to setting of the illumination light source shape at the time of initial adjustment (starting up) of the exposure apparatus 100.
  • the main controller 20 includes information on the illumination light source shape (pupil luminance distribution) stored in the storage device 42, the corresponding illumination system IOP, and control information on the mirror element SE of the spatial light modulator 3S, And information on aberrations of the projection optical system PL are read out.
  • the information regarding the illumination light source shape includes a target illumination light source shape (hereinafter, also referred to as a target as appropriate) ⁇ 0 as the target.
  • the target illumination light source shape ⁇ 0 is expressed as a function ⁇ 0 ( ⁇ , ⁇ ) of two-dimensional coordinates ⁇ , ⁇ in the illumination pupil plane.
  • the control information of the mirror element SE includes mirror characteristic information such as reflectivity of the mirror element SE and reflected light intensity information with respect to the angle.
  • Main controller 20 activates each component (light source 1, spatial light modulator 3S, etc.) of illumination system IOP according to the basic information.
  • an intensity distribution (also referred to as a beam shape) within the beam cross section of the light beam LB emitted from the light source 1 is measured.
  • the main controller 20 detects the light beam LB reflected by the beam splitter BS1 using the beam shape detector D1.
  • a measurement result of the beam shape ⁇ 0 (denoted as ⁇ 0 >) is obtained.
  • the beam shape ⁇ 0 is expressed as a function ⁇ 0 (x, y) of the two-dimensional coordinates x, y in the detection surface of the beam shape detection unit D1, for example.
  • the illumination light source is set.
  • the main controller 20 Based on the control information of the mirror element SE of the spatial light modulator 3S, the main controller 20 causes the light beam LB having the intensity distribution ⁇ 0 > to pass through the illumination pupil via the spatial light modulator 3S, the fly-eye lens 5 and the like.
  • the control parameter of the mirror element SE is determined so that the intensity distribution formed on the surface, that is, the illumination light source shape ⁇ , reproduces the target ⁇ 0 . That is, the main controller 20 determines a plurality of mirror elements SE and fly-eye based on the target ⁇ 0 of the shape of the illumination light source and the measurement result ⁇ 0 > of the beam shape ⁇ 0 irradiated to the plurality of mirror elements SE.
  • a combination of the lens 5 and a plurality of lens elements is optimized by a predetermined calculation, and the control parameter of the mirror element SE is determined according to the optimization result.
  • the main control device 20 controls the spatial light modulator 3S (such as the inclination of the mirror element SE) according to the determined control parameter, and sets the illumination light source shape to reproduce the target illumination light source shape.
  • the actual illumination light source shape that is as close as possible to the target illumination light source shape is set based on the target illumination light source shape that is virtual information. This is because an illumination light source shape that substantially matches the illumination light source shape is reproduced. In this specification, the expression of reproduction in this sense is used.
  • Main controller 20 calibrates the position of luminance distribution measuring instrument 80 prior to measurement.
  • main controller 20 drives wafer stage WST to position luminance distribution measuring instrument 80 mounted on wafer stage WST directly below alignment system AS.
  • main controller 20 uses alignment system AS to detect alignment marks (not shown) provided on luminance distribution measuring instrument 80, and the detection results and measurement results of interferometer system 18 at the time of detection are detected. Are used to find the exact position of the luminance distribution measuring instrument 80 on the stage coordinate system.
  • main controller 20 drives wafer stage WST to accurately position luminance distribution measuring instrument 80 (opening on cover glass 80a) on optical axis AX.
  • main controller 20 measures the surface position and inclination of cover glass 80a using the focus position detection system (60a, 60b), performs focus / leveling control of wafer stage WST, and controls the upper surface of cover glass 80a. Is positioned at the imaging point (image plane).
  • Illumination light IL is emitted from the illumination light source (secondary light source) set in step 206, and as shown in FIG. 3, through the illumination system IOP (more precisely, the light transmission optical system 10) and the projection optical system PL. Is condensed on the image plane. Thereby, the illumination light IL passes through the opening on the cover glass 80a and is received by the light receiving element in the light receiving unit 80c via the condenser lens 80b.
  • a light receiving element (such as a two-dimensional CCD) detects the light intensity distribution in the cross section of the illumination light IL. Thereby, the measurement result ⁇ > of the illumination light source shape ⁇ is obtained.
  • the measurement result ⁇ > is expressed as a function ⁇ ( ⁇ , ⁇ )> of two-dimensional coordinates ⁇ , ⁇ in the illumination pupil plane, similarly to the illumination light source shape ⁇ .
  • the main controller 20 transfers the measurement result ⁇ ( ⁇ , ⁇ )> of the illumination light source shape ⁇ ( ⁇ , ⁇ ) to, for example, a host computer or server connected via a LAN (not shown). Strictly speaking, since the illumination light source shape (pupil luminance distribution) is measured at discrete points on the pupil plane coordinate system, the measurement result ⁇ ( ⁇ , ⁇ )> is expressed as discrete data.
  • the measurement result of the illumination light source shape is optical in the projection optical system PL. Error is included. However, in the present embodiment, it is assumed that there is no optical error of the projection optical system PL or correction is performed using the information related to the aberration read in step 202 unless otherwise specified.
  • the degree of coincidence between the illumination light source shape reproduced in step 206 and the target is evaluated.
  • the main controller 20 determines the RMS error, (assumed to have been defined in step 202) the value and the threshold value of the RMS error between Compare the size of.
  • the processing of this routine (setting of a series of illumination light source shapes and The adjustment process is terminated.
  • step 212 adjustment processing is selected in steps 212 and 213.
  • step 212 it is determined whether or not the illumination light source shape adjustment process is selected for the first time. In this case, since this is the first time, the determination in step 212 is affirmed, and the routine proceeds to step 214.
  • the beam shape ⁇ 0 is estimated (calculation processing).
  • the beam shape ⁇ 0 has already been measured in step 204.
  • the beam shape detection unit D1 does not detect the light beam LB itself incident on the mirror element SE of the spatial light modulator 3S. For this reason, there is a possibility that an accurate measurement result ⁇ 0 > may not be obtained due to an optical axis shift generated in the spatial light modulation unit 3 (prism 3P) or a detection error of the beam shape detection unit D1. Therefore, in the selection of the first adjustment process, main controller 20 preferentially selects the beam shape ⁇ 0 in order to perform the estimation (calculation process) first.
  • the main control device 20 uses the beam shape estimation result (represented as ⁇ ⁇ 0 >>), and the illumination light source shape ⁇ formed by the light beam LB having the intensity distribution ⁇ ⁇ 0 >> reproduces the target ⁇ 0 .
  • the control parameters of the mirror element SE are redetermined.
  • the main controller 20 controls the spatial light modulator 3S (such as the tilt of the mirror element SE) according to the determined control parameter, and resets the illumination light source shape to reproduce the target illumination light source shape.
  • step 212 determines whether or not the selection of the adjustment process is less than the m-th time. If the selection of the adjustment process is less than the m-th time (usually, m is set to 3, 4, 5, etc.), the determination in step 213 is affirmed and the process proceeds to step 216.
  • the basis for setting m times will be described later.
  • step 216 estimation (calculation processing) of mirror characteristics, that is, the intensity of reflected light with respect to the angle of the mirror element SE of the spatial light modulator 3S is performed.
  • the mirror characteristics are already set in step 202. However, since the performance as set is not always obtained, it is necessary to estimate the mirror characteristics. The mirror characteristic estimation process will be described in detail later.
  • the process returns to step 206 as before, and the main controller 20 uses the estimation result of the mirror characteristics to change the illumination light source shape in order to reproduce the illumination light source shape. Reset it. That is, the main controller 20, the illumination light source using an estimated result of the mirror characteristic, the intensity distribution "[Phi 0" is formed by a light beam LB having a ( " ⁇ 0" is ⁇ [Phi 0> If not obtained)
  • the control parameter of the mirror element SE is redetermined so that the shape ⁇ reproduces the target ⁇ 0 , and the spatial light modulator 3S (the inclination of the mirror element SE, etc.) is controlled according to the determined control parameter.
  • the main controller 20 selects the optimum illumination light source setting after the estimation of the beam shape. It is decided to select it prioritizing. Further, when the estimation of the mirror characteristic is selected, the illumination light source shape is reset using the estimation result of the mirror characteristic each time, so it is meaningful to repeat the estimation of the mirror characteristic several times. For this reason, the above m is set to 3, 4, 5, etc.
  • step 213 determines whether the adjustment process is selected for the m-th time and the determination in step 213 is negative. If the adjustment process is selected for the m-th time and the determination in step 213 is negative, the process proceeds to step 218 to optimize the setting of the illumination light source.
  • the repetition cycle of the adjustment process at step 206, the beam shape [Phi 0 measurement results ⁇ [Phi 0> or estimation result "[Phi 0", or based on an initial set or estimated mirror characteristics, illumination source shape ⁇ is reproduced.
  • the judgment in step 213 is denied because the illumination light source shape is repeatedly reset based on the results of the beam shape estimation and (m-2 times) mirror characteristic estimation, respectively.
  • This is a case where the shape did not sufficiently match the target, that is, the target illumination light source shape ⁇ 0 was not reproduced with sufficient accuracy. Therefore, in this case, it is unlikely that the target illumination light source shape ⁇ 0 will be reproduced with sufficient accuracy even if the same processing is repeated any more. In this case, it is more important to reproduce the target illumination light source shape ⁇ 0 even if time is required for adjustment because it is a process at the time of initial setting.
  • step 218 the main controller 20, the illumination source shape [psi (measurement results obtained in step 208 ⁇ >) is reproduced, so as to coincide with the target [psi 0, the control parameters of the mirror elements SE fine By adjusting, the setting of the illumination light source is optimized. That is, the main controller 20 controls the spatial light modulator 3S (such as the inclination of the mirror element SE) according to the optimized control parameter, and reproduces the illumination light source shape.
  • the spatial light modulator 3S such as the inclination of the mirror element SE
  • step 218 fine adjustments such as the inclination of the plurality of mirror elements SE of the spatial light modulator 3S are repeated over time, and are sequentially performed. Therefore, when the processing of step 218 is completed and the processing returns to step 208 In step 209 and 210, the evaluation result becomes good, and the process ends.
  • step 210 determines whether the determination in step 210 is denied again. If the determination in step 210 is denied again, the same processing as described above is repeated until the determination in step 210 is affirmed.
  • FIG. 5 shows a flowchart schematically showing a processing algorithm of the main controller 20 (internal CPU) regarding the setting processing of the illumination light source shape during operation of the exposure apparatus 100, particularly at the time of idling and at the beginning of the lot.
  • the above-described illumination light source shape setting process is performed when the exposure apparatus 100 is activated (at the time of initial adjustment). That is, it is assumed that the illumination light source shape has been set in step 206, the initial setting for the illumination light source in step 202 has been performed, and the target illumination light source shape ⁇ 0 , mirror characteristic information, and the like have been acquired.
  • the beam shape is adjusted in order to reproduce the target illumination light source shape ⁇ 0 .
  • the intensity distribution (beam shape) in the beam cross section of the light beam LB emitted from the light source 1 is measured as in step 204 described above. Specifically, main controller 20 detects light beam LB reflected by beam splitter BS1 using beam shape detector D1. From this result, a measurement result ⁇ 0 > of the beam shape ⁇ 0 is obtained.
  • the illumination light source shape ⁇ is measured.
  • the luminance distribution measuring instrument 80 is used for measuring the illumination light source shape.
  • the illumination pupil distribution measurement unit D2 provided in the illumination system IOP is used.
  • Main controller 20 detects illumination light IL reflected by beam splitter BS2 using illumination pupil distribution measurement unit D2. From this result, a measurement result ⁇ > of the illumination light source shape ⁇ is obtained.
  • the measurement result ⁇ > is transferred to the host computer or server connected to the main controller 20 via a LAN (not shown), for example.
  • step 308 the degree of coincidence between the illumination light source shape and the target is evaluated. Specifically, main controller 20 obtains a deviation of measurement result ⁇ > measured in step 306 from target ⁇ 0 , for example, an RMS error, and calculates the RMS error value and threshold (when exposure apparatus 100 is activated). Compared with the size of the specified setting process).
  • the processing of this routine (setting of a series of illumination light source shapes and The adjustment process is terminated.
  • step 312 adjustment processing is selected in steps 312, 314, and 318.
  • step 312 it is determined whether or not the illumination light source shape adjustment process is selected for the first time. In this case, since this is the first time, the determination in step 312 is affirmed and the process returns to step 302.
  • the presence or absence of an abnormality in the beam shape is determined using the measurement result ⁇ 0 > measured in step 304 described above, and the process may return to step 302 only when an abnormality in the beam shape is detected.
  • the process returns to step 302 unconditionally and the beam shape is adjusted. That is, in the first adjustment process, the beam shape adjustment is selected with priority over others.
  • the detection of the abnormality of the beam shape can be performed as follows as an example. That is, main controller 20 compares, for example, measurement result ⁇ 0 > with the beam shape measured in the setting process at the time of activation of exposure apparatus 100. For example, when the optical axis of the light beam LB is deviated, the distribution of the measurement result ⁇ 0 > is shifted, or the integral value thereof is reduced, so that an abnormality in the beam shape is detected.
  • step 312 determines whether or not the selection of the adjustment process is less than the nth time. If the selection of the adjustment process is less than the nth time (usually, n is set to 3, 4, 5, etc.), the determination in step 314 is affirmed and the process proceeds to step 316.
  • n is set to 3, 4, 5, etc.
  • step 316 the setting of the illumination light source is optimized.
  • main controller 20 determines, based on the measurement result ⁇ > of illumination light source shape ⁇ obtained in step 306, the measurement result ⁇ 0 > of beam shape ⁇ 0 , the initially set mirror characteristics, and the like.
  • the control parameter of the mirror element SE is finely adjusted so that the illumination light source shape ⁇ matches the target ⁇ 0 .
  • the setting of the illumination light source is optimized.
  • the optimization of the setting of the illumination light source in step 316 is a highly accurate processing algorithm in a short processing time, unlike the processing in step 218 described above. Therefore, in the selection of the adjustment process, the main control device 20 is selected with priority over the beam shape adjustment.
  • the optimization of the setting of the illumination light source in step 316 is meaningful to be repeated several times because the illumination light source shape is reset. For this reason, the above-mentioned n is set to 3, 4, 5, etc.
  • step 318 determines whether or not the estimation of the beam shape and / or the estimation of the mirror characteristic is selected.
  • the estimation of the beam shape (step 214) and the estimation of the mirror characteristic (step 216) have already been performed at least once when the exposure apparatus 100 is started. Therefore, only if the evaluation result in step 310 does not improve even if other adjustment processing (in this case, (n-2) iterations of optimization of the setting of the illumination light source in step 316) is performed, the beam shape is changed.
  • the estimation and / or the estimation of the mirror characteristic is selected.
  • step 318 determines whether the determination in step 318 is negative. If the determination in step 318 is negative, the process proceeds to step 320.
  • step 320 the beam shape estimation similar to step 214 described above and / or the mirror characteristic estimation similar to step 216 are performed. When the beam shape estimation and / or mirror characteristic estimation ends, the process proceeds to step 322.
  • the illumination light source is reset using the estimation result of the beam shape and / or the mirror characteristic.
  • the main controller 20 uses the above estimation result to re-set the control parameters of the mirror element SE so that the illumination light source shape ⁇ reproduces the target ⁇ 0 , as in step 206 described above. decide.
  • main controller 20 controls spatial light modulator 3S (such as the inclination of mirror element SE) according to the determined control parameter, and reproduces the illumination light source shape.
  • step 318 determines whether the desired light source shape is still not obtained as a result of all other processing. If the determination in step 318 described above is affirmative, that is, if the estimation of the beam shape and / or the mirror characteristic has already been selected, all the processes that can be performed without stopping the exposure apparatus have been selected. Therefore, in order to select maintenance as the last option, the process proceeds to step 324 to notify the operator of the necessity of maintenance of the spatial light modulator 3S of the spatial light modulation unit 3. As an example, this notification is performed by displaying “SLM maintenance is required” on the display screen of the display device 44 and by emitting the same content by voice from a speaker (not shown). After the notification, the process proceeds to step 326 and waits for an instruction to restart (restart). Since the maintenance of the spatial light modulator 3S is performed with the exposure apparatus 100 stopped, a long processing time is required. Therefore, the main control device 20 selects the last when the desired light source shape is still not obtained as a result of all other processing.
  • the exposure apparatus 100 is temporarily stopped by the operator who has received the notification by the above display and sound, and the mirror element SE of the spatial light modulator 3S is inspected. After the inspection is completed, the operator instructs the restart of the exposure apparatus 100. Thereby, the determination in step 326 is affirmed, and the routine proceeds to step 328.
  • step 328 after restarting, calibration of the mirror characteristics and resetting of the illumination light source are performed.
  • main controller 20 restarts exposure apparatus 100, calibrates the characteristics of mirror element SE, and controls mirror element SE in the same manner as step 206 based on the result of the calibration. Determine the parameters.
  • the main controller 20 controls the spatial light modulator 3S (such as the inclination of the mirror element SE) according to the determined control parameter, and reproduces the illumination light source shape.
  • step 328 After the process of step 328 is completed, the process returns to step 306, and the above process is repeated until the determination in step 310 is affirmed.
  • an adjustment method that can be accurately adjusted in a short time is preferentially selected, so that the exposure apparatus 100 is in operation.
  • the illumination light source can be adjusted efficiently with almost no decrease in throughput.
  • FIG. 6A schematically shows an example of the measurement result ⁇ 0 > of the beam shape ⁇ 0 measured in step 204.
  • a measurement result ⁇ 0 > a step function distribution is obtained with respect to the two-dimensional coordinates x, y in the detection surface of the beam shape detection unit D1 (FIG. 6A shows the one-dimensional coordinates x). Distribution is shown).
  • the illumination light source shape ⁇ sets the target ⁇ 0 schematically shown in FIG. 6B, for example.
  • the control parameter of the mirror element SE is determined so as to reproduce.
  • the mirror characteristics that is, the reflectance of the mirror element SE of the spatial light modulator 3S, the intensity information of the reflected light with respect to the angle, and the like have already been acquired in step 202.
  • the spatial light modulator 3S is set to reproduce the target ⁇ 0 based on the measurement result ⁇ 0 > and the acquired mirror characteristic, for example, as shown in FIG. 6B.
  • the illumination light source shape ⁇ deviated from the target ⁇ 0 is reproduced.
  • the mirror characteristic estimation process is prepared as an adjustment process that is preferentially selected after the beam shape estimation process.
  • the individual mirror elements SE k (k 1 to K (K is the mirror) with respect to the cross section of the light beam LB reflected on the K mirror elements SE k of the spatial light modulator 3S (K is the total number of mirror elements)
  • K is the total number of mirror elements
  • the surface of the total number of elements SE)) is sufficiently small.
  • the intensity distribution ⁇ 0 (and measurement result ⁇ 0 >) is the intensity ⁇ 0k of the light beam LB on the mirror element SE k ( ⁇ 0k >).
  • the intensity ⁇ 0k is also expressed as a beam shape ⁇ 0k as appropriate.
  • each lens element FL n 1 to Nf (Nf is the total number of lens elements)) with respect to the illumination light source shape ⁇ (and target shape ⁇ 0 , measurement result ⁇ >) is Since it is sufficiently small, the illumination light source shape ⁇ (and target shape ⁇ 0 , measurement result ⁇ 0 >) is expressed as a set of luminance ⁇ n ( ⁇ 0n , ⁇ n >) on each lens element FL n. Can do.
  • the illumination light source shape ⁇ is reproduced by appropriately superimposing the reflected light of.
  • the coefficient ⁇ is a learning rate.
  • the reflectance R k is estimated.
  • the reflectance R k of the mirror element SE k related to the lens element FL n having a large square error between the illumination light source shape ⁇ n ( ⁇ 0n ) and the measurement result ⁇ n > is estimated.
  • the degree of freedom of estimation (maximum K) is substantially limited to Nf or less, and the reflectance R k can be estimated by the error back propagation method.
  • Equation (1) is rewritten as follows.
  • the measurement result ⁇ n > of the illumination light source shape ⁇ is measured using the luminance distribution measuring instrument 80 through the projection optical system PL, particularly in step 208.
  • a gentle distribution is expected for the illumination light source shape ⁇ .
  • the left side of Expression (1), Expression (5), or Expression (6) is convoluted using a filter function.
  • the main controller 20 spatial light modulator plurality of mirror elements SE k characteristics (reflectance, etc.) and a plurality of mirror elements SE k of 3S
  • the combination of a plurality of mirror elements SE k and a plurality of lens elements FL n of the fly-eye lens 5 is based on the shape (beam shape) ⁇ 0 of the light beam applied to the light source and the target ⁇ 0 of the shape of the illumination light source.
  • an illumination light source (secondary light source) is formed on the pupil plane of the illumination optical system via the plurality of mirror elements SE k (step 206), and the shape ⁇ of the illumination light source is measured (step 208), the beam shape as the result of the measurement by using the ⁇ [psi>, characteristic of a plurality of mirror elements SE k (reflectance, etc.) is estimated (step 216), estimating the characteristics of a plurality of mirror elements SE k Illumination light source is adjusted to the shape on the basis of the result (step 206).
  • the exposure apparatus 100 of the present embodiment it is possible to accurately estimate the characteristics of the mirror element SE and accurately adjust the illumination light source shape ⁇ based on the result.
  • the reticle R on which a pattern is formed with the illumination light IL from the illumination light source having the light source shape adjusted as described above is illuminated, and the reticle R from the illuminated reticle R is illuminated.
  • the light is passed through the projection optical system PL to form an image of the pattern of the reticle R on the wafer W.
  • the pattern of the reticle R can be accurately transferred onto the wafer W.
  • the movable multi-mirror array is used as the spatial light modulator 3S
  • the fly-eye lens 5 is used as the optical integrator
  • light is transmitted through each of the plurality of mirror elements SE k constituting the movable multi-mirror array. It has been described a case where selectively distributed to a plurality of lens elements FL n of the fly's eye lens 5 of the illumination optical path. That is, in the above embodiment, for the sake of simplification, the number of sections (grids) formed in the vicinity of the entrance surface of the fly-eye lens by the spatial light modulator 3S and the number of lens elements FL n of the fly-eye lens 5 are described.
  • each grid is provided instead of each lens element FL n of the fly-eye lens 5 in the above embodiment, the method of the above embodiment is employed as it is to accurately determine the target light source shape.
  • the reproduced illumination light source can be formed in a short time.
  • the spatial light modulator is not limited to the movable multi-mirror array described above.
  • a transmissive liquid crystal display element such as optical elements, DMD (Deformable Micro-mirror Device or Digital Micro-mirror Device), reflective liquid crystal display element, electrophoretic display (EPD: ElectroPhoretic Display), electronic paper (or electronic Ink), a light diffraction type light valve (Grating Light Valve), a reflection type spatial light modulator such as a reflection type diffractive optical element, and the like can also be used.
  • DMD Deformable Micro-mirror Device or Digital Micro-mirror Device
  • EPD ElectroPhoretic Display
  • electronic paper or electronic Ink
  • a light diffraction type light valve Grating Light Valve
  • a reflection type spatial light modulator such as a reflection type diffractive optical element, and the like
  • the transmittance of a plurality of optical elements included in the spatial light modulator is estimated as one of the characteristics in the same manner as the reflectance of the mirror element
  • the optical integrator is not limited to a fly-eye lens, and a diffractive optical element or an internal reflection type optical integrator (typically, a rod type integrator) may be used.
  • the condensing lens is arranged so that the front focal position of the relay optical system 4 coincides with the rear focal position of the relay optical system 4 (corresponding to the position of the incident surface of the fly-eye lens 5 of the above embodiment).
  • the rod type integrator is arranged so that the incident end is positioned at or near the rear focal position of the condenser lens. At this time, the exit end of the rod integrator is the position of the illumination field stop 7.
  • a position optically conjugate with the position of the aperture stop of the projection optical system PL in the imaging optical system 8 downstream of the rod type integrator can be called an illumination pupil plane.
  • this position and a position optically conjugate with this position are also referred to as the illumination pupil plane.
  • a beam splitter BS2 for guiding light to the illumination pupil distribution measurement unit D2 can be disposed between the relay optical system 4 and the condenser lens.
  • the configuration in which the pupil luminance distribution is measured on the wafer surface using the luminance distribution measuring instrument 80 provided on the wafer stage WST is adopted.
  • the luminance distribution measuring instrument 80 is placed on the reticle stage RST.
  • the measurement result of the pupil luminance distribution does not include the influence of the optical characteristics (for example, aberration) of the projection optical system PL, which is suitable for accurately measuring the pupil luminance distribution.
  • one spatial light modulation unit (spatial light modulator) is used.
  • the present invention is not limited to this, and a plurality of spatial light modulation units (spatial light modulators) can also be used.
  • an illumination optical system for an exposure apparatus using a plurality of spatial light modulation units for example, an illumination optical system disclosed in US Patent Application Publication No. 2009/0109417 and US Patent Application Publication No. 2009/0128886 is used. Can be adopted.
  • the spatial light modulator that independently controls the tilt of the mirror elements arranged two-dimensionally is employed.
  • a spatial light modulator for example, European Patent Application No. 779530 is disclosed. , U.S. Pat. No. 6,900,915, U.S. Pat. No. 7,095,546, and the like.
  • a spatial light modulator that independently controls the height of the mirror element as the spatial light modulator.
  • a spatial light modulator for example, the spatial light modulator disclosed in US Pat. No. 5,312,513 and US Pat. No. 6,885,493 can be adopted.
  • the above-described spatial light modulator can be modified in accordance with the disclosure of, for example, US Pat. No. 6,891,655 or US Patent Application Publication No. 2005/0095749.
  • the exposure apparatus is a scanning stepper.
  • the exposure apparatus is not limited to this, and may be a stationary exposure apparatus such as a stepper. Further, it may be a step-and-stitch reduction projection exposure apparatus that synthesizes a shot area and a shot area.
  • the exposure apparatus 100 is a dry-type exposure apparatus that exposes the wafer W without using liquid (water) has been described.
  • an immersion light path including illumination light path between the projection optical system and the wafer As disclosed in US Pat. No. 1,420,298, WO 2004/055803, US Pat. No. 6,952,253, and the like, an immersion light path including illumination light path between the projection optical system and the wafer.
  • An exposure apparatus that forms a space and exposes the wafer with illumination light through the liquid in the projection optical system and the immersion space may be used.
  • the projection optical system of the exposure apparatus may be not only a reduction system but also an equal magnification and an enlargement system, and the projection optical system may be not only a refraction system but also a reflection system or a catadioptric system. May be either an inverted image or an erect image.
  • the light source of the exposure apparatus is not limited to the ArF excimer laser, but is a KrF excimer laser (output wavelength 248 nm), F 2 laser (output wavelength 157 nm), Ar 2 laser (output wavelength 126 nm), Kr 2 laser (output wavelength 146 nm). It is also possible to use a pulse laser light source such as a super high pressure mercury lamp that emits bright lines such as g-line (wavelength 436 nm) and i-line (wavelength 365 nm). A harmonic generator of a YAG laser or the like can also be used. In addition, as disclosed in, for example, US Pat. No.
  • a single wavelength laser beam in an infrared region or a visible region oscillated from a DFB semiconductor laser or a fiber laser is used as vacuum ultraviolet light.
  • a harmonic that is amplified by a fiber amplifier doped with erbium (or both erbium and ytterbium) and wavelength-converted into ultraviolet light using a nonlinear optical crystal may be used.
  • an exposure apparatus (lithography system) that forms line and space patterns on a wafer W by forming interference fringes on the wafer W is provided.
  • the exposure apparatus 100 can be employed.
  • two reticle patterns are synthesized on a wafer via a projection optical system, and 1 on the wafer by one scan exposure.
  • An exposure apparatus that double exposes two shot areas almost simultaneously can be employed as the exposure apparatus 100.
  • the object on which the pattern is to be formed is not limited to the wafer, but may be another object such as a glass plate, a ceramic substrate, a film member, or a mask blank. good.
  • the use of the exposure apparatus is not limited to the exposure apparatus for semiconductor manufacturing, but for example, an exposure apparatus for liquid crystal that transfers a liquid crystal display element pattern to a square glass plate, an organic EL, a thin film magnetic head, an image sensor (CCD, etc.), micromachines, DNA chips and the like can also be widely applied to exposure apparatuses. Further, in order to manufacture reticles or masks used in not only microdevices such as semiconductor elements but also light exposure apparatuses, EUV exposure apparatuses, X-ray exposure apparatuses, electron beam exposure apparatuses, etc., glass substrates or silicon wafers, etc. The above embodiment can also be applied to an exposure apparatus that transfers a circuit pattern.
  • An electronic device such as a semiconductor element includes a step of designing a function / performance of a device, a step of manufacturing a reticle based on the design step, a step of manufacturing a wafer from a silicon material, the above-described exposure apparatus (pattern forming apparatus), and its A lithography step for transferring a reticle (photomask) pattern to a wafer by an exposure method, a developing step for developing the exposed wafer, and forming a mask layer having a shape corresponding to the pattern on the surface (resist layer) of the wafer, a mask Etching the wafer through the layer and removing the exposed member in the part other than the part where the resist remains, resist removing step for removing the resist that has become unnecessary after the etching, device assembly step (dicing process, Bonding process, par Including cages step), and an inspection step or the like.
  • the exposure method described above is executed using the exposure apparatus according to the above-described embodiment, and a device pattern
  • the light source adjustment method and illumination optical system of the present invention are suitable for adjusting the shape of the illumination light source.
  • the exposure method and exposure apparatus of the present invention are suitable for exposing an object with illumination light from an illumination light source.
  • the device manufacturing method of the present invention is suitable for manufacturing an electronic device such as a semiconductor element or a liquid crystal display element.

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Abstract

Selon l'invention, grâce à une unité principale de commande, des objectifs multiples d'un objectif en œil de mouche et des miroirs élémentaires multiples d'un modulateur spatial de lumière sont combinés de manière optimale sur la base de caractéristiques (taux de réflexion, etc.) des miroirs élémentaires multiples, de la forme du faisceau optique envoyé sur les miroirs élémentaires multiples et de la forme cible d'une source lumineuse d'éclairement. En fonction des résultats de cette optimisation, une source lumineuse d'éclairement (source lumineuse secondaire) est formée sur le plan de pupille du système optique d'éclairement à l'aide des miroirs élémentaires (étape 206) ; la forme de la source lumineuse d'éclairement est mesurée (étape 208) ; les caractéristiques (taux de réflexion, etc.) des miroirs élémentaires sont estimées en utilisant la forme du faisceau et le résultat de la mesure ci-dessus (étape 216) ; et la forme de la source lumineuse d'éclairement est ajustée en fonction du résultat de l'estimation des caractéristiques des miroirs élémentaires. De cette façon, les caractéristiques des miroirs élémentaires sont estimées de manière précise et, sur la base des résultats de l'estimation, il devient possible d'ajuster de manière précise la forme de la source lumineuse d'éclairement.
PCT/JP2011/006132 2010-11-04 2011-11-02 Procédé d'ajustement d'une source lumineuse, procédé d'exposition, procédé de fabrication d'un dispositif, système optique d'éclairement et dispositif d'exposition WO2012060099A1 (fr)

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Cited By (2)

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Publication number Priority date Publication date Assignee Title
WO2014042044A1 (fr) * 2012-09-11 2014-03-20 株式会社ニコン Procédé permettant de déterminer une distribution de luminance de pupille
US10146134B2 (en) 2014-09-25 2018-12-04 Asml Netherlands B.V. Illumination system

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