WO2012050290A1 - Dispositif de dissipation de chaleur de dispositif d'écran à cristaux liquides utilisant un boîtier arrière - Google Patents

Dispositif de dissipation de chaleur de dispositif d'écran à cristaux liquides utilisant un boîtier arrière Download PDF

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Publication number
WO2012050290A1
WO2012050290A1 PCT/KR2011/004374 KR2011004374W WO2012050290A1 WO 2012050290 A1 WO2012050290 A1 WO 2012050290A1 KR 2011004374 W KR2011004374 W KR 2011004374W WO 2012050290 A1 WO2012050290 A1 WO 2012050290A1
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WO
WIPO (PCT)
Prior art keywords
heat
rear case
liquid crystal
crystal display
display device
Prior art date
Application number
PCT/KR2011/004374
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English (en)
Korean (ko)
Inventor
남동진
정인수
Original Assignee
주식회사 에이치앤에스솔루션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 주식회사 에이치앤에스솔루션 filed Critical 주식회사 에이치앤에스솔루션
Publication of WO2012050290A1 publication Critical patent/WO2012050290A1/fr

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133382—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133314—Back frames
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133628—Illuminating devices with cooling means

Definitions

  • the present invention relates to a heat dissipation device of a liquid crystal display device, and more particularly, it is possible to efficiently discharge heat generated from a heating element mounted on a printed circuit board of a liquid crystal display device to the outside by using a rear case of the liquid crystal display device. It relates to a heat dissipation device of a liquid crystal display device using a rear case.
  • a heat dissipating device such as a heat sink is mounted on the heat generating elements in order to prevent malfunction of the product due to heat generation.
  • heat sinks such as heat sinks, use metals with high thermal conductivity so that the heat generated by the product can be released quickly.
  • a heat having a structure in which a plurality of heat dissipation fins which are uniformly protruded on the front surface is arranged by heating and melting aluminum, copper, and their alloys at a high temperature, and then extruding them using a mold having a predetermined shape.
  • Sinks have been commonly used.
  • manufacturing a heat sink by a method of extrusion molding into a mold has a problem in that a manufacturing process is difficult and a processing cost increases because a separate mold corresponding to the heat sink has to be manufactured in order to manufacture a heat sink having various shapes.
  • a separate process such as anodizing has to be performed. In this process, a large amount of acid or basic waste is generated, resulting in additional treatment costs.
  • the heat pipe type cooling apparatus includes an evaporation unit in which a refrigerant absorbs heat from a heating element, a condensation unit in which evaporated refrigerant releases heat, and a transfer unit in which a microstructure is formed so that the refrigerant liquefied in the condensation unit moves back to the evaporation unit. Is common.
  • the conventional heat spreader for cooling electronics has to be formed in a plurality of layers having a thin plate shape of 1 mm or less in thickness, a lead frame structure that forms upper and lower flow paths in order to transfer the refrigerant using a capillary phenomenon in a long section, that is, There was a problem that the design and manufacture of the microstructure is difficult.
  • the conventional heat spreader for cooling electronic products made of metals such as aluminum, copper, iron, zinc, silver, and gold requires a complicated structure in order to reduce the heat generated per unit area to a desired level, and as a result, a large amount of metal is used.
  • the weight and volume of the whole product increases, and the price also increases.
  • a device was developed to increase the cooling efficiency by increasing the heat dissipation surface area by using a heat sink made of ceramic material rather than a metal material, and using the characteristic capillary pores of the ceramic material. This lengthened productivity was low, and inefficient in terms of processability, impact resistance, and size and weight of shapes having various and complex structures.
  • the heat radiators listed above must drill a considerable amount of vent holes in the product casing, which may cause the hot air inside the product to flow to the outside, which may cause system malfunction and failure. There is a problem that there is a high possibility that foreign dust and contaminants that may enter through the vent hole.
  • the present invention has been made to solve the above problems, and the problem to be solved by the present invention is that the heat generated from the heating element mounted on the printed circuit board of the liquid crystal display device can be efficiently discharged to the outside and has become more slim recently.
  • a heat dissipation device of a liquid crystal display device using a rear case, which can be miniaturized and lighter than a conventional heat dissipation device.
  • a heat dissipation device disposed between a backlight unit of a liquid crystal display device having a printed circuit board coupled to a rear surface and a rear case accommodating the backlight unit, wherein the heat dissipation device is disposed between the heating element mounted on the printed circuit board and the rear case. And a heat conductive pad positioned thereon, wherein the heat dissipation device is in close contact with a surface of the heat generating element and one surface of the rear case.
  • the thermally conductive pad is preferably an elastomer pad.
  • a non-adhesive layer may be formed on a surface of the thermal conductive pad in contact with the heating element.
  • the heat dissipation device may further include a thermally conductive sheet positioned between the thermally conductive pad and the rear case.
  • thermally conductive sheet is preferably a graphite sheet.
  • an adhesive layer may be formed on a surface of the thermal conductive sheet in contact with the rear case.
  • a protective film may be disposed between the graphite sheet and the thermally conductive pad.
  • the elastomer pad may be made by mixing hexamethylene diisocyanate, methylene diphenyl isocyanate, isophorone diisocyanate and dibutyl tin dilaurate to the synthesized polyol.
  • the heat dissipation device is provided in close contact with a heat generating element which is electrically operated inside a liquid crystal display device in which a liquid crystal display device, in particular, a light emitting diode (LED) is used as a light source, and controls the liquid crystal display device.
  • a heat generating element which is electrically operated inside a liquid crystal display device in which a liquid crystal display device, in particular, a light emitting diode (LED) is used as a light source, and controls the liquid crystal display device.
  • the heat dissipation efficiency can be improved by transferring the heat generated from the back case to the rear case, and the thickness can be reduced compared to the existing heat dissipation device, which can help slim down and lighten the liquid crystal display.
  • external dust or contaminants may be introduced, which may cause malfunction and failure of the device by minimizing or eliminating the quantity and area of the air vent holes formed in the radiator of the existing LCD. Can significantly reduce the likelihood of
  • FIG. 1 is a schematic structural diagram of a backlight unit of a liquid crystal display device in which a light emitting diode is used as a light source.
  • FIG. 2 is a schematic cross-sectional view of a heat dissipation device of a liquid crystal display using a rear case according to an embodiment of the present invention.
  • FIG. 3 is a schematic cross-sectional view of a heat dissipation device of a liquid crystal display using a rear case according to another embodiment of the present invention.
  • FIG. 4 is a schematic cross-sectional view of a heat dissipation device of a conventional liquid crystal display.
  • FIG. 1 is a view schematically illustrating a structure of a backlight unit 100 of a liquid crystal display device in which a light emitting diode (LED) is used as a light source.
  • LED light emitting diode
  • the general edge type backlight unit 100 includes a lower chassis 70, a light emitting diode (LED) 30, a reflective sheet 60, a light guide plate 50, an optical sheet 20, an LCD panel 10, a substrate for attaching an LED ( 40).
  • the substrate 40 to which the light emitting diodes 30 are coupled is coupled to both sides of the lower chassis 70.
  • the substrate 40 may be made of metal or FR4.
  • the reflective sheet 60 and the light guide plate 50 may be accommodated in the lower chassis 70.
  • the light guide plate 50 scatters the linear light emitted from the light emitting diodes 30 to emit the surface light. In this case, not all of the light emitted from the light emitting diode 30 is incident on the light guide plate 50, but is also reflected and lost to the lower portion of the light guide plate 50, and the reflective sheet 60 transmits the light to the light guide plate 50. Let it reflect totally.
  • the lower chassis 70 may be provided with a printed circuit board formed with a circuit portion including a drive driver.
  • the printed circuit board is equipped with various heating elements that are electrically operated inside the liquid crystal display device and control the liquid crystal display device. This heating element has a recent increase in heat generation in accordance with the trend of high integration. It is emerging.
  • FIG. 4 is a schematic cross-sectional view of a heat dissipation device of a conventional liquid crystal display device, and the heat dissipation device 120 is mounted on a printed circuit board 110 coupled to a rear surface of the backlight unit 100 of the liquid crystal display device.
  • the heat generating element 120 is configured by attaching a heat sink 150 made of aluminum or ceramic.
  • the heat sink 150 is installed to be spaced apart from the rear case 200 that accommodates the backlight unit 100 coupled to the rear surface of the printed circuit board 110.
  • a thermally conductive acrylic foam tape 155 is disposed between the heat generating element 120 and the heat sink 150 to strengthen the adhesive force while maintaining the thermal conductivity.
  • the heat dissipation device of the conventional liquid crystal display device uses a method of attaching a heat sink to a heat generating element, transferring heat generated by the heat generating element to the heat sink by conduction, and releasing heat by convection in the heat sink.
  • the heat dissipation device of the conventional liquid crystal display device is limited in heat dissipation area by the heat sink area, and furthermore, the gap between the rear case and the heat sink becomes narrower in view of the trend of the liquid crystal display device becoming more slim recently. As a result, smooth natural convection is hindered and the heat dissipation performance is reduced.
  • FIG. 100 is a heat dissipation device disposed between the rear case 200 to accommodate the backlight unit 100, the thermal conductivity is located between the heating element 120 mounted on the printed circuit board 110 and the rear case. It includes a pad 130, the heat dissipating device is in close contact with the surface of the heat generating element 120 and one surface of the rear case 200.
  • one surface of the rear case refers to a surface facing the backlight unit 100 of both surfaces of the rear case.
  • the heat dissipation device of the liquid crystal display since the heat dissipation device of the liquid crystal display according to the exemplary embodiment of the present invention utilizes the rear case 200 of the liquid crystal display as a heat sink, the heat dissipation performance of the heat sink can be maximized by maximizing the heat dissipation area of the heat sink.
  • the rear case 200 is generally preferably made of a metal having good thermal conductivity, and may be a galvanized steel sheet that is commonly used as a case material.
  • the thermal conductive pad is installed to be in contact with the surface of the heat generating element 120 to effectively transfer heat from the heat generating element 120 to the rear case 200 of the liquid crystal display device.
  • the heat conductive pad is thermally conductive to a polymer material such as silicone, urethane, and acryl.
  • a polymer material such as silicone, urethane, and acryl.
  • metal powders such as aluminum, zinc, nickel, copper, calcium, potassium, iron, silver, zinc, gold, oxides and hydrates or metal salts thereof, carbon nanotubes, carbon black, silicon carbide, graphite, and nitride It can be prepared by mixing boron, aluminum nitride and the like.
  • the thermal conductive pad 130 is an elastomer pad having good thermal conductivity and adhesion for smooth heat transfer from the heat generating element 120 to the rear case 200 functioning as a heat sink.
  • Elastomeric pads as thermally conductive pads can solve the disadvantages of thermally conductive silicone pads that have conventionally been used as heat transfer materials.
  • the silicon pad when the silicon pad is attached to the substrate or the heating element, oil may leak little by little in the silicon pad as time elapses, which may adversely affect the electrical conductivity of the substrate.
  • the silicon pad has a limit in the strength of the self-adhesiveness, so if more adhesive force is required, there is a need for a separate adhesive treatment.
  • the elastomer pad according to the present invention solves the drawbacks of the above-described thermally conductive silicone pads, and does not have oil leakage over time, and has an advantage of superior self-adhesiveness compared to the silicone pads, so that the elastomer pad is closely adhered to the rear case 200. Can be combined.
  • the elastomer pad may be prepared by mixing hexamethylene diisocyanate, methylene diphenyl isocyanate, isophorone diisocyanate and dibutyl tin dilaurate to the synthesized polyol, or further comprising alumina powder and aluminum hydroxide. Can be. Detailed description of the manufacturing method of the elastomer pad will be described later.
  • a non-adhesive layer 125 may be formed on one side of the elastomer pad, that is, the surface in contact with the heat generating element 120, which is made of no adhesive force or very weakly to be provided with the heat generating element 120. Tally can be easily done.
  • the non-adhesive layer 125 may be a polymer film such as PET, PE, PP, or the like, and may be formed by coating a silane compound, such as a polymer and an inorganic material, such as acrylic and urethane, which have no adhesive force, on an elastomer pad.
  • a silane compound such as a polymer and an inorganic material, such as acrylic and urethane, which have no adhesive force, on an elastomer pad.
  • the type of adhesive such as acrylic, silicone adhesive, and the like, the amount of additives thereof, the coating thickness, and the like may be appropriately adjusted to suitably adjust the non-tackiness of the non-adhesive layer.
  • thermally conductive sheet 140 having a good horizontal thermal conductivity may be further used.
  • Such materials may be graphite sheets, carbon sheets, metal plates such as aluminum, copper, silver, gold or magnesium, or thermally conductive sheets made of silicon, urethane, or acryl, but more preferably, workability, workability and economy. It is good to use this good graphite sheet.
  • One side of the thermal conductive sheet 140 having a good horizontal thermal conductivity forms an adhesive layer 145 made of acrylic, silicon, or the like, so that the thermal conductive sheet is easily adhered to the rear case.
  • the other side covers a polymer film such as PET, PE, PP, etc., which is not adhesive, or a silane compound, which is a polymer and inorganic material such as acrylic or urethane, which is made of adhesive. It is preferable to coat.
  • the reason for using the thermally conductive sheet 140 having a good horizontal thermal conductivity is to further lower the surface temperature of the rear case serving as a heat sink.
  • the surface temperature of the electronics case is prescribed to be below a certain temperature (45 °C), which is to increase the reliability of the product so that consumers do not feel the heat when contacted with the electronics.
  • Example 1 As shown in FIG. 3, in Example 1, 0.5 mm thick single-sided acrylic adhesive graphite sheet was cut to a size of 70 mm ⁇ 70 mm on one surface of a rear case made of a galvanized steel sheet, and the graphite sheet was cut thereon. To prevent breakage, a composition coated with a 20 ⁇ m thick single-sided acrylic adhesive PET film was added.
  • the temperature of the heating element and the temperature of the rear case according to Examples 1 and 2 and Comparative Examples 1 and 2 are as follows.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Liquid Crystal (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)

Abstract

La présente invention concerne un dispositif de dissipation de chaleur placé entre une unité de rétroéclairage d'un dispositif d'écran à cristaux liquides comprenant une carte de circuit imprimé couplée à la surface arrière de celui-ci, et un boîtier arrière pour recevoir l'unité de rétroéclairage, le dispositif de dissipation de chaleur comportant un tampon conducteur de chaleur disposé entre un élément exothermique implanté sur la carte de circuit imprimé, et le boîtier arrière. Le dispositif de dissipation de chaleur est caractérisé en étant en contact intime avec la surface de l'élément exothermique et une surface du boîtier arrière, permettant ainsi l'évacuation efficace vers l'extérieur de la chaleur générée depuis l'élément exothermique implanté sur la carte de circuit imprimé du dispositif d'écran à cristaux liquides au moyen du boîtier arrière du dispositif d'écran à cristaux liquides, améliorant l'efficacité de dissipation de chaleur, et permettant d'obtenir un dispositif d'écran à cristaux liquides plus mince et plus léger.
PCT/KR2011/004374 2010-10-12 2011-06-15 Dispositif de dissipation de chaleur de dispositif d'écran à cristaux liquides utilisant un boîtier arrière WO2012050290A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20100099119 2010-10-12
KR10-2010-0099119 2010-10-12

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WO2012050290A1 true WO2012050290A1 (fr) 2012-04-19

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105830135A (zh) * 2013-12-25 2016-08-03 京瓷株式会社 电子设备
CN113782504A (zh) * 2021-09-08 2021-12-10 中国矿业大学 一种集成散热器的功率模块简化封装结构及制作方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060030132A (ko) * 2004-10-05 2006-04-10 엘지이노텍 주식회사 튜너
KR20060125286A (ko) * 2005-06-02 2006-12-06 삼성전기주식회사 전자기기용 방열조립체
KR20060131382A (ko) * 2005-06-16 2006-12-20 삼성전자주식회사 백라이트 어셈블리 및 이를 이용한 액정표시장치
KR20070057356A (ko) * 2005-12-02 2007-06-07 에스케이케미칼주식회사 열전도성 및 전기절연성이 향상된 전자부품용 방열패드
KR20100004752A (ko) * 2008-07-04 2010-01-13 엘지디스플레이 주식회사 액정표시장치의 방열 장치 및 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060030132A (ko) * 2004-10-05 2006-04-10 엘지이노텍 주식회사 튜너
KR20060125286A (ko) * 2005-06-02 2006-12-06 삼성전기주식회사 전자기기용 방열조립체
KR20060131382A (ko) * 2005-06-16 2006-12-20 삼성전자주식회사 백라이트 어셈블리 및 이를 이용한 액정표시장치
KR20070057356A (ko) * 2005-12-02 2007-06-07 에스케이케미칼주식회사 열전도성 및 전기절연성이 향상된 전자부품용 방열패드
KR20100004752A (ko) * 2008-07-04 2010-01-13 엘지디스플레이 주식회사 액정표시장치의 방열 장치 및 방법

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105830135A (zh) * 2013-12-25 2016-08-03 京瓷株式会社 电子设备
EP3089142A4 (fr) * 2013-12-25 2017-05-31 Kyocera Corporation Dispositif électronique
US10241549B2 (en) 2013-12-25 2019-03-26 Kyocera Corporation Electronic apparatus
CN113782504A (zh) * 2021-09-08 2021-12-10 中国矿业大学 一种集成散热器的功率模块简化封装结构及制作方法
CN113782504B (zh) * 2021-09-08 2024-06-25 中国矿业大学 一种集成散热器的功率模块简化封装结构及制作方法

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