WO2012048281A1 - Source de lumière de haute intensité - Google Patents

Source de lumière de haute intensité Download PDF

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Publication number
WO2012048281A1
WO2012048281A1 PCT/US2011/055459 US2011055459W WO2012048281A1 WO 2012048281 A1 WO2012048281 A1 WO 2012048281A1 US 2011055459 W US2011055459 W US 2011055459W WO 2012048281 A1 WO2012048281 A1 WO 2012048281A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
heat
sink
lateral region
Prior art date
Application number
PCT/US2011/055459
Other languages
English (en)
Inventor
Frank Tin Chung Shum
Clifford Jue
Original Assignee
Soraa, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soraa, Inc. filed Critical Soraa, Inc.
Priority to DE112011102961T priority Critical patent/DE112011102961T5/de
Priority to CN2011800543977A priority patent/CN103228985A/zh
Priority to JP2013532992A priority patent/JP2013541164A/ja
Publication of WO2012048281A1 publication Critical patent/WO2012048281A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/75—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F21V17/164—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being subjected to bending, e.g. snap joints
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to lighting. More specifically, the present invention relates to high efficiency lighting sources.
  • fluorescent lighting sources often rely upon a separate starter or ballast mechanism to initiate the illumination. Because of this, fluorescent lights sometimes do not turn on "instantaneously" as consumers expect and demand. Further, fluorescent lights typically do not immediately provide light at full brightness, but typically ramp up to full brightness within an amount of time (e.g. 30 seconds). Further, most fluorescent lights are fragile, are not capable of dimming, have ballast transformers that can emit annoying audible noise, and can fail in a shortened period of time if cycled on and off frequently. Because of this, fluorescent lights do not have the performance consumers require.
  • LEDs light emitting diodes
  • LEDs have advantages over fluorescent lights including the robustness and reliability inherent in solid state devices, the absence of toxic chemicals that can be released during accidental breakage or disposal, instant-on capabilities, dimmability, and the absence of audible noise.
  • the inventors of the present invention believe, however, that current LED lighting sources themselves have significant drawbacks that cause consumers to be reluctant to using them.
  • a key drawback with current LED lighting sources is that the light output (e.g. lumens) is relatively low.
  • current LED lighting sources draw a significantly lower amount of power than their incandescent equivalents (e.g. 5-10 watts v. 50 watts), they are believed to be far too dim to be used as primary lighting sources.
  • a typical 5 watt LED lamp in the MR-16 form factor may provide 200-300 lumens
  • a typical 50 watt incandescent bulb in the same form factor may provide700-1000 lumens.
  • current LEDs are often used only for exterior accent lighting, closets, basements, sheds or other small spaces.
  • LED lighting sources Another drawback with current LED lighting sources includes that the upfront cost of the LED is often shockingly high to consumers. For example, for floodlights, a current 30 watt equivalent LED bulb may retail for over $60, whereas a typical incandescent floodlight may retail for $ 12. Although the consumer may rationally "make up the difference" over the lifetime of the LED by the LED consuming less power, the inventors believe the significantly higher prices greatly suppress consumer demand. Because of this, current LED lighting sources do not have the price or performance that consumers expect and demand.
  • Additional drawbacks with current LED lighting sources includes they have many parts and are labor intensive to produce. As merely an example, one manufacturer of an MR- 16 LED lighting source utilizes over 14 components (excluding electronic chips), and another manufacturer of an MR- 16 LED lighting source utilizes over 60 components. The inventors of the present invention believe that these manufacturing and testing processes are more complicated and more time consuming, compared to manufacturing and testing of a LED device with fewer parts and a more modular manufacturing process.
  • the present invention relates to high efficient lighting sources. More specifically, the present invention relates to a novel LED lighting source and methods of manufacturing thereof. Some general goals include, to increase light output without increasing device cost or device size, to enable coverage of many beam angles, and to provide a high reliability product for long life (ROI).
  • ROI long life
  • a lighting module includes from 20 to 1 10 LEDs arrayed in series upon a top surface of thermally conductive substrate (e.g. silicon substrate).
  • the top surface of the silicon substrate is soldered onto a first portion of a flexible printed circuit substrate (FPC).
  • the bottom surface of the conductive silicon substrate is physically bonded to a recess of an MR-16 form factor heat-sink via a thermal epoxy.
  • electrical driving components are soldered onto a second portion of the FPC, and the second portion of the FPC is inserted into an interior cavity of a thermally conductive plug base.
  • a potting compound is then injected into the cavity of the plug base and to the recess of the heat-sink in one step.
  • the potting compound allows heat generated by the silicon substrate and the electrical driving components to be transferred to the heat-sink or thermally conductive plug base.
  • a lens is then secured to the heat-sink.
  • the electrical driving portion / module transforms the input power from 12 AC volts to a higher DC voltage, such as 40 volts 120 Volts.
  • the driving portion drives the lighting module with the higher voltage, and the lighting module emits the light.
  • the light is conditioned with the lens to the desired type of lighting, e.g. spot, flood, etc.
  • the driving module and the lighting module produce heat that is dissipated by the MR- 16 form factor heat-sink.
  • these modules may operate in the range of
  • the MR- 16 form factor heat-sink greatly facilitates the dissipation of heat.
  • the heat-sink includes an inner core that has a diameter less than half the outer diameter of the heat-sink. In various embodiments, the inner core is less than one third, one fourth, and one fifth the outer diameter.
  • the silicon substrate of the LEDs is directly bonded to the inner core region via the thermal epoxy.
  • Typical fin configurations include a number radiating fin "trunks" extending from the inner core. In some embodiments, the number of trunks range from 8 to 35. At the end of each trunk, two or more fin “branches” are provided having "U” branching shape. In various embodiments, at the end of each branch, two or more fin "sub-branches” are provided, also having a "U” branching shape.
  • the fin thickness of the trunk may be thicker than the branches, which in turn may be thicker than the sub-branches, etc.
  • the amount of heat flow from the inner core towards the outer diameter, airflow, and surface area are therefore carefully engineered to greatly increase heat dissipating capability.
  • FIG. 1 Other aspects of various embodiments include: simplified construction facilitating high volume manufacturing, flex interconnects to eliminate hand wiring, modular subassembly construction to enable parallel processing.
  • Other features include thermal management aspects: Fin branching algorithm, reduced cross section central core, airflow behind lens, single thermal interface, direct die attachment, flex printed circuits, base contour to minimize potting material, recessed front, ensured airflow with coverage; Low-Cost Manufacturing: flexible printed circuit interconnect (Main and interposer), flex circuit light chip interposer, redundant latching and bonding features, and the like.
  • aspects include: high temperature operation enabling a densely packed LED array, higher component reliability, high heat dissipation, maximum surface area, maximum airflow, minimum thermal interface losses, minimum length thermal paths within the electronics module, and the like.
  • Advantages with embodiments of the present invention include operating a LED light source reliably at high temperatures, allowing the concentration of a large number of LEDs in a small space while simultaneously operating them at higher power levels.
  • a light source is described.
  • One apparatus includes a heat-sink comprising a mounting region, and a plurality of heat-dissipating fins, and a base housing coupled to the heat-sink, wherein the base housing includes an inner cavity.
  • a device may include an integrated lighting module coupled to the heat-sink and to the base housing.
  • the integrated lighting module may include a printed circuit board, a light emitting source formed on a top surface of substrate, wherein the top surface of the substrate is coupled to a first surface of the printed circuit board within a first lateral region of the printed circuit board, and an electronic driving circuit configured to provide electrical power to the light emitting source, wherein the electronic driving circuit is coupled to the first surface of the printed circuit board within a second lateral region of the printed circuit board.
  • a bottom surface of the substrate is thermally coupled to the mounting region of the heat-sink, and wherein the second lateral region of the integrated lighting module is located within the inner cavity of the base housing.
  • a method for assembling a light source includes receiving a heat-sink comprising a mounting region, and a plurality of heat-dissipating structures, and receiving a base housing coupled to the heat-sink, wherein the base housing includes an inner cavity.
  • a process may include receiving an integrated lighting module, wherein the integrated lighting module includes a printed circuit board having a first lateral region and a second lateral region, wherein a first surface of the printed circuit board within the first lateral region is coupled to a top surface of a light emitting source substrate, and wherein the first surface of the printed circuit board within the second lateral region is coupled to a plurality of electronic driving devices.
  • a methodology may include disposing the second lateral region of the integrated lighting module within the inner cavity of the base housing, and coupling a bottom surface of the light emitting source substrate to the mounting region of the heat-sink.
  • FIG. 1 A-B illustrate various embodiments of the present invention
  • FIG. 2A-B illustrate an embodiment of the present invention
  • FIG. 3 illustrate a block diagram of a manufacturing process according to embodiments of the present invention
  • FIG. 4 illustrate an example of an integrated lighting module according to embodiments of the present invention.
  • FIGS. 5A-B illustrate examples during the manufacturing process according to
  • Fig. 1 A illustrates an embodiment of the present invention. More specifically, Fig. 1 A-B illustrate embodiments of MR-16 form factor compatible LED lighting source 100 having GU 5.3 form factor compatible base 120. MR-16 lighting sources typically operate upon 12 volts, alternating current (e.g. VAC). In the examples illustrated, LED lighting source 100 is configured to provide a spot light having a 10 degree beam size. In other embodiments LED lighting sources may be configured to provide a flood light having a 25 or 40 degree beam size, or any other lighting pattern. [0028] In various embodiments, an LED assembly described in the pending patent applications described above, and variations thereof, may be used within LED lighting source 100. Theses LED assemblies are currently under development by the assignee of the present patent application.
  • LED lighting source 100 may provide a peak output brightness of approximately 7600 to 8600 candelas (with approximately 360 to 400 lumens), a peak output brightness of approximately 1050 to 1400 candelas for a 40 degree flood light (with approximately 510 to 650 lumens), and a peak output of approximately 2300 to 2500 candelas for a 25 degree flood light (with approximately 620 to 670 lumens), and the like.
  • Various embodiments of the present invention therefore are believed to have achieve the same brightness as conventional halogen bulb MR- 16 lights.
  • Fig. I B illustrates a modular diagram according to various embodiments of the present invention.
  • light 200 includes a lens 210, an integrated LED module / assembly 220, a heat-sink 230, and a base housing 240.
  • the modular approach to assembling light 200 are believed to reduce the manufacturing complexity, reduce manufacturing costs, and increase the reliability of such lights.
  • lens 210 may be formed from a UV and resistant transparent material, such as glass, polycarbonate material, or the like.
  • lens 210 may be solid.
  • the solid material creates a folded light path such that light that is generated by the integrated LED assembly 220 internally reflects within lens 210 more than one time prior to being output.
  • Such a folded optic lens enables light 200 to have a tighter columniation of light than is normally available from a conventional reflector of equivalent depth.
  • the transparent material should be operable at an elevated temperature (e.g. 120 degrees C) for a prolonged period of time (e.g. hours).
  • an elevated temperature e.g. 120 degrees C
  • a prolonged period of time e.g. hours
  • MakrolonTM LED 2045 or LED 2245 polycarbonate available from Bayer Material Science AG. In other embodiments, other similar materials may also be used.
  • lens 210 may be secured to heat-sink 230 via one or more clips integrally formed on the edge of lens 210.
  • lens 210 may also be secured via an adhesive proximate to where integrated LED assembly 220 is secured to heat-sink 230.
  • separate clips may be used to restrain lens 210. These clips may be formed of heat resistant plastic material that is preferably white colored to reflect backward scattered light back through the lens.
  • LED assemblies may be binned based upon lumen per watt efficacy.
  • an integrated LED module / assembly having a lumen per watt (L/W) efficacy from 53 to 66 L/W may be binned for use for 40 degree flood lights
  • a LED assembly having an efficacy of approximately 60 L/W may be binned for use for spot lights
  • a LED assembly having an efficacy of approximately 63 to 67 L/W may be use for 25 degree flood lights, and the like.
  • other classification or categorization of LED assemblies on the basis of L/W efficacy may used for other target applications.
  • integrated LED assembly / module 220 typically includes 36 LEDs arranged in series, in parallel series (e.g. three parallel strings of
  • any number of LEDs may be used, e.g. 1 , 10, 16, or the like.
  • the LEDs may be electrically coupled in other manner, e.g. all series, or the like. Further detail regarding such LED assemblies are provided in the patent applications incorporated by reference above.
  • the targeted power consumption for LED assemblies is less than
  • embodiments of the present invention are able to match the brightness or intensity of halogen based MR- 16 lights, but using less than 20% of the energy.
  • LED assembly 220 is directly secured to heat-sink 230.
  • LED assembly 220 typically includes a flat substrate such as silicon or the like.
  • an operating temperature of LED assembly 220 may be on the order of 125 to 140 degrees C.
  • the silicon substrate is then secured to the heat-sink using a high thermal conductivity epoxy (e.g. thermal conductivity ⁇ 96 W/m.k.).
  • a thermoplastic / thermo set epoxy may be used such as TS-369, TS-3332-LD, or the like, available from Tanaka Kikinzoku Kogyo .K. Other epoxies may also be used.
  • heat-sink 230 may include other metals such as copper, or the like.
  • heat-sink 290 has been measured to have a thermal resistance of approximately 7.5 degrees C / Watt.
  • thermal resistance of as little as 6.6 degrees C / Watt are achievable in other embodiments.
  • one of ordinary skill in the art will be able to envision other materials having different properties within embodiments of the present invention.
  • base assemblies / modules 240 in Fig. I B provides a standard GU 5.3 physical and electronic interface to a light socket.
  • a cavity within base module 240 includes high temperature resistant electronic circuitry used to drive LED module 220.
  • an input voltage of 12 VAC to the lamps are converted to 120 VAC, 40 VAC, or other voltage by the LED driving circuitry.
  • the driving voltage may be set depending upon specific LED configuration (e.g. series, parallel / series, etc.) desired.
  • the shell of base assembly 240 may be formed from an aluminum alloy, and may formed from an alloy similar to that used for heat-sink 230 and / or heat-sink 290. In one example, an alloy such as AL 1 100 may be used. In other embodiments, high temperature plastic material may be used. In some embodiments of the present invention, instead of being separate units, base assembly 240 may be monolithically formed with heat-sink 230. [0041] As illustrated in Fig. I B, a portion of the LED assembly 220 (silicon substrate of the LED device) contacts heat-sink 230 in a recess within the heat-sink 230. Additionally, another portion of the LED assembly 220 (containing the LED driving circuitry) is bent downwards and is inserted into an internal cavity of base module 240.
  • a potting compound is provided.
  • the potting compound may be applied in a single step to the internal cavity of base assembly 240 and to the recess within heat-sink 230.
  • a compliant potting compound such as Omegabond ® 200 available from Omega Engineering, Inc. or 50-1225 from Epoxies, Etc. may be used.
  • other types of heat transfer materials may be used.
  • Figs. 2A-B illustrate an embodiment of the present invention. More specifically, Fig. 2A illustrates an LED package subassembly (LED module) according to various embodiments. More specifically, a plurality of LEDs 300 are illustrated disposed upon a silicon substrate 310. In some embodiments, it is contemplated that the plurality of LEDs 300 are connected in series and powered by a voltage source of approximately 120 volts AC (VAC). To enable a sufficient voltage drop (e.g. 3 to 4 volts) across each LED 300, in various embodiments 30 to 40 LEDs are contemplated to be used. In specific embodiments, 37 to 39 LEDs are coupled in series.
  • VAC 120 volts AC
  • LEDs 300 are connected in parallel series and powered by a voltage source of approximately 40 VAC.
  • the plurality of LEDs 300 include 36 LEDs arranged in three groups each having 12 LEDs 300 coupled in series. Each group is thus coupled in parallel to the voltage source (40 VAC) provided by the LED driver circuitry, such that a sufficient voltage drop (e.g. 3 to 4 volts) is achieved across each LED 300.
  • a sufficient voltage drop e.g. 3 to 4 volts
  • other driving voltages are envisioned, and other arrangements of LEDs 300 are also envisioned.
  • the LEDs 300 are mounted upon a silicon substrate 310, or other thermally conductive substrate.
  • a thin electrically insulating layer and / or a reflective layer may separate LEDs 300 and the silicon substrate 310. Heat produced from LEDs 300 is typically transferred to silicon substrate 310 and to a heat-sink via a thermally conductive epoxy, as discussed above.
  • silicon substrate is approximately 5.7 mm x 5.7 mm in size, and approximately 0.6 microns in depth.
  • the dimensions may vary. according to specific lighting requirement. For example, for lower brightness intensity, fewer LEDs may be mounted upon the substrate, accordingly the substrate may decrease in size.
  • other substrate materials may be used and other shapes and sizes may also be used
  • a ring of silicone 315 is disposed around LEDs 300 to define a well-type structure.
  • a phosphorus bearing material is disposed within the well structure.
  • LEDs 300 provide a blue-ish light output, a violet, or a UV light output.
  • the phosphorous bearing material is excited by the blue / uv output light, and emits white light output. Further details of embodiments of plurality of LEDs 300 and substrate 310 are described in the co-pending application incorporated by reference and referred to above.
  • a number of bond pads 320 may be provided upon the top surface of substrate 310 (e.g. 2 to 4 bond pads). Then, a conventional solder layer (e.g. 96.5% tin and 5.5% gold) may be disposed upon silicon substrate 310, such that one or more solder balls 330 are formed thereon. In the embodiments illustrated in Fig. 2A, four bond pads 320 are provided, one at each corner, two for each power supply connection. In other embodiments, only two bond pads may be used, one for each AC power supply connection.
  • a conventional solder layer e.g. 96.5% tin and 5.5% gold
  • FPC 340 may include a flexible substrate material such as a polyimide, such as KaptonTM from DuPont, or the like. As illustrated, FPC 340 may have a series of bonding pads 350, for bonding to silicon substrate 310, and bonding pads 360, for coupling to the high supply voltage (e.g. 120 VAC, 40 VAC, etc). Additionally, in some embodiments, an opening 370 is provided, through which LEDs 300 will shine through. In some embodiments, opening 370 may be a closed shape, e.g. circle, square, etc, however in other embodiments, opening 370 may be an open shape, e.g. similar to a tuning fork.
  • a closed shape e.g. circle, square, etc
  • opening 370 may be an open shape, e.g. similar to a tuning fork.
  • FPC 340 Various shapes and sizes for FPC 340 are contemplated in various embodiments of the present invention. For example, as illustrated in Fig. 2A, a series of cuts 380 may be made upon FPC 340 to reduce the effects of expansion and contraction of FPC 340 versus substrate 310. As another example, a different number of bonding pads 350 may be provided, such as two bonding pads. As merely another example, FPC 340 may be crescent shaped, and opening 370 may not be a through hole. In other embodiments, other shapes and sizes for FPC 340 are contemplated in light of the present patent disclosure. [0050] In various embodiments, the silicon substrate 310 is bonded to a first portion of FPC 340. As shown in Figs.
  • FPC 340 extends to a second portion, where the electronic driving components are bonded there to.
  • the side of the FPC 340 where the silicon substrate 310 is bonded to is the same side as where the electronic driving components are also bonded to.
  • substrate 310 is bonded to FPC 340 via solder balls 330, in a conventional flip-chip type arrangement to the top surface of the silicon.
  • solder balls 330 By making the electrical connection at the top surface of the silicon, it is electrically isolated from the heat transfer surface of the silicon. This allows the entire bottom surface of the silicon substrate 310 to transfer heat to the heat-sink. Additionally, this allows the LED to bonded directly to the heat-sink to maximize heat transfer instead of a PCB material that typically inhibits heat transfer.
  • LEDs 300 are thus positioned to emit light through opening 370.
  • the potting compound discussed above is also used to serve as an under fill operation, or the like to seal the space 380 between substrate 310 and FPC 340.
  • the LED package sub assembly or module 220 is thus assembled. In various embodiments, these LED modules may then be individually tested for proper operation.
  • FIG. 3 illustrates a block diagram of a manufacturing process according to embodiments of the present invention. In various embodiments, some of the manufacturing separate processes may occur in parallel or in series. For sake of understanding, reference may be given to features in prior figures.
  • the following process may be performed to form an LED assembly / module.
  • a plurality of LEDs 300 are provided upon an electrically insulated silicon substrate 310 and wired, step 400.
  • a silicone dam 315 is placed upon the silicon substrate 310 to define a well, which is then filled with a phosphor-bearing material, step 410.
  • the silicon substrate 310 is bonded to a flexible printed circuit 340, step 420.
  • a solder ball and flip-chip soldering (e.g. 330) may be used for the soldering process in various embodiments.
  • a plurality of electronic driving circuit devices and contacts may be soldered to the flexible printed circuit 340, step 430.
  • the contacts are for receiving a driving voltage of approximately 12 VAC.
  • the electronic circuit devices in various embodiments, are capable of sustained high-temperature operation, e.g. 120 degrees C.
  • the second portion of the flexible printed circuit including the electronic driving circuit is inserted into the heat-sink and into the inner cavity of the base module, step 440.
  • the first portion of the flexible printed circuit is then bent approximately 90 degrees such that the silicon substrate is adjacent to the recess of the heat-sink.
  • the back side of the silicon substrate is then bonded to the heat-sink within the recess of the heat-sink using an epoxy, or the like, step 450.
  • a potting material is used to fill the air space within the base module and to serve as an under fill compound for the silicon substrate, step 460.
  • a lens may be secured to the heat-sink, step 470, and the LED light source may then be tested for proper operation, step 480.
  • Fig. 4 illustrates an embodiment of the present invention. More specifically, Fig. 4 illustrates a side view of a flexible printed circuit 500. In various embodiments, a top surface of silicon substrate 510 including the light emitting elements is shown bonded to a bottom surface of FPC 500 within a first region. Additionally, electronic driving circuits 520 and electrical connections 530 is also shown bonded to the bottom surface of FPC 500 with a second region. In various embodiments, FPC is typically insulated between the first region and the second region.
  • FIGs. 5A-B illustrate various embodiments of the present invention. More specifically, Figs. 5A-B illustrate cross-section views of planned embodiments of the present invention.
  • Fig. 5 A a cross-section of an embodiment of a MR- 16 form factor compatible LED lighting source 600 having a GU 5.3 form factor compatible base, although other form factors are contemplated.
  • lighting source 600 includes a lens 610, an integrated LED assembly / module 620, a heat-sink 630, and a base assembly 640.
  • integrated LED assembly / module 620 may include one or more bends.
  • a white- spaced region 650 is also illustrated, illustrating contemplated air-gap regions between the FPC and heat-sink 630 and base assembly 640.
  • lighting source 600 represents a configuration of an LED light source having a combination of performance characteristics that have not been previously achievable with LED light sources. More specifically, in a spot light configuration, as shown in Fig. 5 A, the light source is characterized with a highly concentrated spot beam: FWHM beam angle of approximately 9.8°, having a field angle of approximately 13.3°, and a full cutoff angle of approximately 31.4°. Additionally, the light source is characterized by high maximum intensity: center beam candlepower (CBCP) 24.60 cd/LPKG with 81.9% lumens efficiency.
  • CBCP center beam candlepower
  • the air-gap region 650 is shown filled with potting material 660.
  • the potting material 660 is used to fill the cavity within base assembly 640 about the second portion of the integrated LED assembly 620, and to fill the recess within heat-sink 630 where the LED silicon substrate contacts heat-sink 630. In various embodiments, all of the potting material 660 is applied in a single step.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Geometry (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

L'invention concerne une source de lumière qui comprend un dissipateur de chaleur comportant une région de montage et des ailettes de dissipation de chaleur, un boîtier de base comportant une cavité interne et couplé au dissipateur de chaleur, et un module d'éclairage intégré comprenant : une carte de circuit imprimé ; une DEL sur un substrat couplé à la carte de circuit imprimé dans une première région latérale de la carte de circuit imprimé ; et un circuit d'actionnement électronique alimentant la DEL et couplé à la carte de circuit imprimé dans une seconde région latérale de la carte de circuit imprimé. Une surface inférieure du substrat est couplée thermiquement à la région de montage du dissipateur thermique, et la seconde région latérale du module d'éclairage intégré est située dans la cavité interne du boîtier de base.
PCT/US2011/055459 2010-10-08 2011-10-07 Source de lumière de haute intensité WO2012048281A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE112011102961T DE112011102961T5 (de) 2010-10-08 2011-10-07 Hochintensitätslichtquelle
CN2011800543977A CN103228985A (zh) 2010-10-08 2011-10-07 高强度光源
JP2013532992A JP2013541164A (ja) 2010-10-08 2011-10-07 高輝度光源

Applications Claiming Priority (2)

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US39150610P 2010-10-08 2010-10-08
US61/391,506 2010-10-08

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WO2012048281A1 true WO2012048281A1 (fr) 2012-04-12

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JP (1) JP2013541164A (fr)
CN (1) CN103228985A (fr)
DE (1) DE112011102961T5 (fr)
WO (1) WO2012048281A1 (fr)

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EP2725295A1 (fr) * 2012-10-26 2014-04-30 LG Electronics, Inc. Appareil d'éclairage
CN104956487A (zh) * 2012-08-20 2015-09-30 贺利氏特种光源美国有限责任公司 微通道冷却的高热负荷发光器件
JP2015529948A (ja) * 2012-08-07 2015-10-08 コーニンクレッカ フィリップス エヌ ヴェ ヒートシンク構造を有する照明装置
JP2015535649A (ja) * 2012-11-26 2015-12-14 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 改良型熱伝達装置を含む照明デバイス
EP3376099A1 (fr) * 2017-03-17 2018-09-19 Lumileds Holding B.V. Dispositif d'éclairage a del

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DE102013112372B4 (de) * 2013-11-11 2020-08-13 Horst Pauly Schlosserei Gmbh LED-Hochleistungsleuchte
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US20070007898A1 (en) * 2003-09-09 2007-01-11 Koninklijke Philips Electronics N.V. Integrated lamp with feedback and wireless control
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JP2015529948A (ja) * 2012-08-07 2015-10-08 コーニンクレッカ フィリップス エヌ ヴェ ヒートシンク構造を有する照明装置
CN104956487A (zh) * 2012-08-20 2015-09-30 贺利氏特种光源美国有限责任公司 微通道冷却的高热负荷发光器件
EP2725295A1 (fr) * 2012-10-26 2014-04-30 LG Electronics, Inc. Appareil d'éclairage
JP2015535649A (ja) * 2012-11-26 2015-12-14 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 改良型熱伝達装置を含む照明デバイス
EP3376099A1 (fr) * 2017-03-17 2018-09-19 Lumileds Holding B.V. Dispositif d'éclairage a del
US10208929B2 (en) 2017-03-17 2019-02-19 Lumileds Holding B.V. LED lighting arrangement

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DE112011102961T5 (de) 2013-07-04
CN103228985A (zh) 2013-07-31
JP2013541164A (ja) 2013-11-07

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