Classifications

• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
  • F01N—GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR MACHINES OR ENGINES IN GENERAL; GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR INTERNAL COMBUSTION ENGINES
  • F01N5/00—Exhaust or silencing apparatus combined or associated with devices profiting by exhaust energy
  • F01N5/02—Exhaust or silencing apparatus combined or associated with devices profiting by exhaust energy the devices using heat
  • F01N5/025—Exhaust or silencing apparatus combined or associated with devices profiting by exhaust energy the devices using heat the device being thermoelectric generators
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
  • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
  • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
  • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
  • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F28—HEAT EXCHANGE IN GENERAL
  • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
  • F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
  • F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F28—HEAT EXCHANGE IN GENERAL
  • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
  • F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
  • F28F2260/02—Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
  • Y02T10/00—Road transport of goods or passengers
  • Y02T10/10—Internal combustion engine [ICE] based vehicles
  • Y02T10/12—Improving ICE efficiencies

Definitions

• thermoelectric modules which are suitable for fitting in the exhaust system of an internal combustion engine.
• Thermoelectric generators and Peltier arrangements per se have been known for a long time, p- and n-doped semiconductors, which are heated on one side and cooled on the other side, transport electric charges through an external circuit, so that electrical work can be performed on a load in the circuit.
• the efficiency thereby achieved for the conversion of heat into electrical energy is thermodynamically limited by the Carnot efficiency.
• efficiencies up to 6% have been achieved.
• Peltier arrangement works as a heat pump and is therefore suitable for cooling equipment parts, vehicles or buildings. Heating by means of the Peltier principal is also more favorable than conventional heating, because more heat is always transported than corresponds to the energy equivalent supplied.
• thermoelectric generators are used in space probes for the generation of direct currents, for the cathodic corrosion protection of pipelines, for the energy supply of light and radio buoys, and for the operation of radios and televisions.
• the advantages of thermoelectric generators reside in their extreme reliability. They operate irrespective of atmospheric conditions such as relative humidity; no material transport susceptible to interference takes place, rather only charge transport.
• thermoelectric module consists of p- and n-type pieces which are connected electrically in series and thermally in parallel.
• Figure 2 shows such a module.
• the conventional structure consists of two ceramic plates, between which the individual pieces are fitted alternately. Two pieces are in each case contacted electrically conductively via the end faces.
• thermoelectric components An essential element of thermoelectric components is the contacting.
• the contacting establishes the physical connection between the material in the "heart" of the component (which is responsible for the desired thermoelectric effect of the component) and the "outside world".
• the structure of such a contact is schematically represented in Fig 1 .
• the thermoelectric material 1 inside the component provides the actual effect of the component. It is a thermoelectric piece. An electric current and a heat flux flow through the material 1 , in order for it to fulfill its function in the overall structure.
• the material 1 is connected on at least two sides via the contacts 4 and 5 to the leads 6 and 7, respectively.
• the layers 2 and 3 are in this case intended to symbolize one or more optionally required intermediate layers (barrier material, solder, bonding agent etc.) between the material and the contacts 4 and 5.
• the segments 2/3, 4/5, 6/7 respectively associated with one another pairwise may be identical, although they do not have to be. This will in the end depend likewise on the specific structure and the application, as well as the flow direction of electric current or heat flux through the structure.
• the contacts 4 and 5 now have an important role. They ensure a tight connection between material and leads. If the contacts are poor, then high losses occur here and can greatly restrict the performance of the component. For this reason, the pieces and contacts are often pressed onto the material for use. The contacts are thus exposed to a strong mechanical load. This mechanical load increases further whenever elevated (or reduced) temperatures and/or thermal cycling are involved. The thermal expansion of the materials built into the component inevitably leads to mechanical stresses, which in the extreme case lead to failure of the component by fracture of the contact.
• the contacts used must have a certain flexibility and resilient properties, so that such thermal stresses can be compensated for.
• carrier plates are necessary.
• a ceramic is conventionally used, for example made of oxides or nitrides such as Al 2 0 3 , Si0 2 or AIN.
• the conventional structure is often subject to limitations in respect of an application, since in each case only planar surfaces can be brought in contact with the
• thermoelectric module A tight connection between the module surface and the heat source/heat sink is indispensable in order to ensure a sufficient heat flux.
• Nonplanar surfaces for example a round waste heat pipe, are not suitable for direct contact with the conventional module or they require a corresponding straight heat exchanger structure, in order to provide a transition from the nonplanar surface to the planar module.
• thermoelectric modules in motor vehicles such as automobiles and trucks, in the exhaust system or the exhaust gas recirculation, in order to obtain electrical energy from a part of the exhaust gas heat.
• the hot side of the thermoelectric element is connected to the exhaust gas or tailpipe, while the cold side is connected to a cooler.
• the amount of electricity which can be generated depends on the temperature of the exhaust gas and the heat flux from the exhaust gas to the thermoelectric material.
• devices are often built into the tailpipe.
• thermoelectric generator is installed for use behind the exhaust gas catalytic converter in the exhaust system. Together with the pressure loss of the exhaust gas catalytic converter, this often leads to excessive pressure losses so that thermally conductive devices cannot be provided in the exhaust system; rather, the thermoelectric module bears on the outside of the tailpipe. To this end, the tailpipe must often be configured with a polygonal cross section so that planar external surfaces can come in tight contact with the thermoelectric material.
• thermoelectric module for installation in the exhaust system of an internal combustion engine, which avoids the
• thermoelectric module consisting of p- and n-conducting thermoelectric material pieces which are alternately connected to one another via electrically conductive contacts, wherein the thermoelectric module is thermally conductively connected to a micro heat exchanger which comprises a plurality of continuous channels having a diameter of at most 1 mm, through which a fluid heat exchanger medium can flow.
• the channels of the micro heat exchanger prefferably be coated with a washcoat of an internal combustion engine exhaust gas catalyst, in particular a motor vehicle exhaust gas catalyst.
• a separate exhaust gas catalytic converter can be obviated and the pressure loss in the exhaust system is minimized.
• the integrated design simplifies the overall structure and facilitates installation in the exhaust system.
• the exhaust gas flows through the microchannels of the micro heat exchanger.
• the channels are in this case preferably coated with an exhaust gas catalyst, which in particular catalyzes one or more of the conversions: NO x to nitrogen, hydrocarbons to C0 2 and H 2 0, and CO to C0 2 .
• Suitable catalytically active materials such as Pt, Ru, Ce, Pd are known, and are described for example in Stone, R. et al., Automotive Engineering Fundamentals, Society of Automotive Engineers 2004. These catalytically active materials are applied in a suitable way onto the channels of the micro heat exchanger.
• application in the form of a washcoat may be envisaged.
• the catalyst is applied in the form of a suspension as a thin layer onto the inner walls of the micro heat exchanger, or onto its channels.
• the catalyst may then consist of a single layer or various layers with identical or varying composition.
• the applied catalyst may then fully or partially replace the normally used exhaust gas catalytic converter of the internal combustion engine during use in a motor vehicle, depending on the dimensioning of the micro heat exchanger and its coating.
• micro heat exchanger is intended to mean heat exchangers which have a plurality of continuous channels with a diameter of at most 1 mm, particularly preferably at most 0.8 mm.
• the minimum diameter is set only by technical feasibility, and is preferably of the order of 50 ⁇ , particularly preferably 100 ⁇ .
• the channels may have any suitable cross section, for example round, oval, polygonal such as square, triangular or star-shaped, etc.
• the shortest distance between opposite edges or points of the channel is considered as the diameter.
• the channels may also be formed so as to be flat, in which case the diameter is defined as the distance between the bounding surfaces. This is the case in particular for heat exchangers which are constructed from plates or layers.
• a heat exchanger medium flows through the continuous channels while transferring heat to the heat exchanger.
• the heat exchanger is on the other hand thermally connected to the thermoelectric module, so that good heat transfer is obtained from the heat exchanger to the thermoelectric module.
• the micro heat exchanger may be constructed in any suitable way from any suitable materials. It may for example be made from a block of a thermally conductive material, into which the continuous channels are introduced.
• any suitable materials may be used as the material, such as plastics, for example polycarbonate, liquid crystal polymers such as Zenith ® from DuPont, polyether ether ketones (PEEK), etc.
• Metals may also be used, such as iron, copper, aluminum or suitable alloys such as chromium-iron, Fecralloy. Ceramics or inorganic oxide materials may furthermore be used, such as aluminum oxide or zirconium oxide or cordierite. It may also be a composite material made of a plurality of the aforementioned materials.
• the micro heat exchanger is preferably made of a high temperature-resistant alloy (1000-1200°C), Fecralloy, iron alloys containing Al, stainless steel, cordierite.
• the microchannels may be introduced into a block of a thermally conductive material in any suitable way for example by laser methods, etching, boring, etc.
• the micro heat exchanger may also be constructed from different plates, layers or tubes, which are subsequently connected to one another, for example by adhesive bonding or welding.
• the plates, layers or tubes may in this case be provided in advance with the microchannels and then assembled.
• the micro heat exchanger from a powder by means of a sintering method.
• Both metal powders and ceramic powders can be used as the powder. Mixtures composed of metal and ceramic, composed of different metals or composed of different ceramics are also possible. Suitable metal powders comprise, for example, powders composed of ferritic steels, Fecralloy or stainless steel.
• the production of the micro heat exchanger by means of a sintering method makes it possible to manufacture any desired structure.
• micro heat exchanger affords the advantage of a good thermal conductivity.
• ceramics have a good heat storage capability, and so they can be utilized, in particular, to compensate for temperature fluctuations.
• plastics are used as material for the micro heat exchanger, it is necessary to apply a coating that protects the plastic from the temperatures of the exhaust gas flowing through the micro heat exchanger. Such coatings are also referred to as "thermal barrier coating". On account of the high temperatures of the exhaust gas, it is necessary to coat all surfaces of the micro heat exchanger composed of the plastics material.
• the external dimensions of the micro heat exchanger used according to the invention are preferably from 60 x 60 x 20 to 40 x 40 x 8 mm 3 .
• the specific heat transfer area of the micro heat exchanger in relation to the volume of the micro heat exchanger, is preferably from 0.1 to 5 m 2 /l, particularly preferably from 0.3 to 3 m 2 /l, in particular from 0.5 to 2 m 2 /l.
• Suitable micro heat exchangers are commercially available, for example from the Insti- tut fur Mikrotechnik Mainz GmbH.
• the IMM offers various geometries of
• microstructured heat exchangers and in particular microstructured high-temperature heat exchangers for a maximum operating temperature of 900°C.
• These high- temperature heat exchangers have dimensions of about 80 x 50 x 70 mm 3 and function (for other applications) according to the counterflow principle. They have a pressure loss of less than 50 mbar and a specific heat transfer area of about 1 m 2 /l.
• micro heat exchangers are exhibited by VDIA DE-Technologie scholar Informati- onstechnik GmbH (www.nanowelten.de). Micro heat exchangers are furthermore offered by Ehrfeld Mikrotechnik BTS GmbH, Wendelsheim and SWEP Market Services, a branch of Dover Market Services GmbH, Fijrth.
• the micro heat exchanger is configured so that it can be connected to the
• thermoelectric module in a way which has the best possible thermal conduction.
• thermoelectric module may be thermally conductively connected directly to the thermoelectric module. It is also possible for the
• thermoelectric module to be flat and, on the thermoelectric material pieces, to have a carrier plate on the hot side which is thermally conductively connected to the micro heat exchanger.
• carrier plate on the hot side which is thermally conductively connected to the micro heat exchanger.
• the micro heat exchanger integrally with the thermoelectric module.
• the pressure loss generated through the continuous channels of the heat exchanger for a gas flowing through is preferably at most 100 mbar, in particular at most 50 mbar. Such pressure losses do not lead to an increased fuel consumption of the internal combustion engine.
• Such a pressure loss can be realized, in particular if the micro heat exchangers are arranged such that the channels through which the exhaust gas flows run parallel and are connected to an inlet on one side and to an outlet on the other side.
• the length of the channels through which the exhaust gas flows is in this case preferably at most 60 mm, in particular at most 40 mm. If more than one micro heat exchanger is used, the micro heat exchangers are likewise connected in parallel and connected to a common inlet and a common outlet, such that the channels of the individual heat exchangers likewise run parallel.
• the heat-exchanging surface of the micro heat exchanger may be installed directly in the exhaust system or tailpipe of an internal combustion engine, in particular of a motor vehicle. It may in this case be installed fixed or removably.
• the heat-exchanging surface may also be firmly encapsulated with the thermoelectric module.
• the micro heat exchanger is provided with a washcoat of the catalyst material, it may be installed in the exhaust system at the position of the original exhaust gas catalytic converter. In this way, a high exhaust gas temperature can be supplied to the micro heat exchanger. The temperature may be increased even further by the chemical conversion at the exhaust gas catalyst of the micro heat exchanger, so that much more efficient heat transfer takes place than in known systems.
• thermoelectric module An improved efficiency of the thermoelectric module is also achieved by the improved heat flux.
• thermoelectric module A protective layer for protecting against excessive temperatures may furthermore be provided between the thermoelectric module and the micro heat exchanger.
• This layer also referred to as a phase-change layer, is preferably made of inorganic metal salts or metal alloys having a melting point in the range of from 250°C to 1700°C.
• Suitable metal salts are for example fluorides, chlorides, bromides, iodides, sulfates, nitrates, carbonates, chromates, molybdates, vanadates and tungstates of lithium, sodium, potassium, rubidium, cesium, magnesium, calcium, strontium and barium.
• Mixtures of suitable salts of this type, which form double or triple eutectics, are preferably used. They may also form quadruple or quintuple eutectics.
• thermoelectric module may be encapsulated with the protective layer, in particular when using metals such as nickel, zirconium, titanium, silver and iron, or when using alloys based on nickel, chromium, iron, zirconium and/or titanium.
• thermoelectric modules for example connected in succession, may be integrated into the exhaust system of the internal combustion engine.
• thermoelectric modules comprising different thermoelectric materials may also be combined.
• thermoelectric module is used in particular for generating electricity from the heat of the exhaust gas.
• the thermoelectric module may also be used in reverse for preheating the exhaust gas catalyst during a cold start of an internal combustion engine, preferably of a motor vehicle.
• the thermoelectric module is used as a Peltier element. When a voltage difference is applied to the module, the module transports heat from the cold side to the hot side. The preheating of the exhaust gas catalyst due to this reduces the cold start time of the catalyst.
• the invention furthermore relates to an exhaust system of an internal combustion engine, preferably of a motor vehicle, comprising one or more thermoelectric modules as described above, integrated into the exhaust system
• the exhaust system is intended to mean the system which is connected to the outlet of an internal combustion engine and in which the exhaust gas is processed.
• the thermoelectric module according to the invention has many advantages.
• the pressure loss in the exhaust system of an internal combustion engine is low, in particular when the micro heat exchanger is coated with a washcoat of the exhaust gas catalyst.
• the structure of the exhaust system can be simplified significantly by the one integrated component. Since the integrated component can be integrated closer to the internal combustion engine in the exhaust system, higher exhaust gas temperatures can be supplied to the thermoelectric module.
• the thermoelectric module By the reverse use of the thermoelectric module as a Peltier element, the exhaust gas catalyst can be heated during a cold start of the engine. Exemplary embodiments of the invention are illustrated in the figures and are explained in greater detail in the following description.
• figure 3 shows a three-dimensional illustration of a construction of a thermoelectric generator
• figure 4 shows a three-dimensional illustration of a layer construction of a thermoelectric generator
• thermoelectric generator thermoelectric generator
• Figure 3 illustrates a construction of a thermoelectric generator such as can be inserted into the exhaust system of a motor vehicle, for example.
• the manifold 1 1 has a cross-sectional area that decreases in the flow direction of the exhaust gas.
• the manifold 1 1 is adjoined by micro heat exchangers 13. The latter are connected to the manifold 1 1 in such a way that the exhaust gas flows through channels in the micro heat exchangers 13.
• the channels in the micro heat exchangers lead to a collector 15, via which the exhaust gas, after the latter has flowed through the channels in the micro heat exchangers, is conducted into a further exhaust pipe 17, which usually ends in an exhaust of the internal combustion engine.
• the micro heat exchangers 13 are each connected on one side to a thermoelectric module 19.
• the thermoelectric module 19 is cooled on the opposite side to the micro heat exchanger.
• a cooling liquid for example cooling water
• micro heat exchangers 13, thermoelectric modules 19 and cooling channels 21 are stacked, wherein the micro heat exchangers 13 situated in the inner portion are in each case connected at their opposite sides to a thermoelectric module 19 and, accordingly, the cooling channels 21 situated in the inner portion are also connected in each case at their opposite sides to a thermoelectric module 19.
• a corresponding layer construction is illustrated by way of example in figure 4. Here the layer construction is bounded by a cooling channel in each case at the top side and at the underside.
• the cooling channel 21 is adjoined by a thermoelectric module 19, which is connected on the opposite side to a micro heat exchanger 13.
• the micro heat exchanger 13 is followed by a further thermoelectric module 19 and a further cooling channel 21 .
• the layer construction makes it possible to utilize the heat of the exhaust gas as well as possible and to use a large number of thermoelectric modules 19 in a small space.
• the channels in the micro heat exchangers 13 preferably always run transversely with respect to the main flow direction of the exhaust pipe 10 from the manifold 1 1 to the collector 15.
• the individual layers can comprise in each case one micro heat exchanger 13 and one thermoelectric module 19 or alternatively a plurality of micro heat exchangers 13 and/or a plurality of thermoelectric modules 19, which are respectively positioned alongside one another. If a plurality of micro heat exchangers 13 and a plurality of thermoelectric modules 19 are used, then they can have contact areas having the same size or different sizes.
• the contact areas have the same size, such that one micro heat exchanger 13 in each case is connected to one thermoelectric module 19.
• the individual stacks are preferably oriented such that the respective cooling channels 21 adjoin one another with their inlets and outlets, thus forming cooling channels that are continuous over the series of the stacks.
• the orientation of the cooling channels is chosen such that the cooling liquid and the exhaust gas are guided in cross-flow relative to one another.
• the cooling channels can, for example, also run parallel to the channels in the micro heat exchangers.

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• Engineering & Computer Science (AREA)
• Chemical & Material Sciences (AREA)
• Combustion & Propulsion (AREA)
• Mechanical Engineering (AREA)
• General Engineering & Computer Science (AREA)
• Exhaust Gas After Treatment (AREA)
• Exhaust Silencers (AREA)

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Cited By (5)

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• 2011
  • 2011-09-29 JP JP2013532298A patent/JP6117102B2/ja active Active
  • 2011-09-29 KR KR1020137011384A patent/KR20130108381A/ko not_active Application Discontinuation
  • 2011-09-29 BR BR112013007718A patent/BR112013007718A2/pt not_active IP Right Cessation
  • 2011-09-29 EP EP11830269.4A patent/EP2625727A4/en not_active Withdrawn
  • 2011-09-29 WO PCT/IB2011/054295 patent/WO2012046170A1/en active Application Filing
  • 2011-09-29 CN CN201180058155.5A patent/CN103238227B/zh not_active Expired - Fee Related
  • 2011-10-04 TW TW100135936A patent/TW201230261A/zh unknown

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