WO2012044054A2 - Procédé de formation d'une nanostructure permettant l'obtention d'une surface hautement transparente et super-hydrophobe - Google Patents

Procédé de formation d'une nanostructure permettant l'obtention d'une surface hautement transparente et super-hydrophobe Download PDF

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WO2012044054A2
WO2012044054A2 PCT/KR2011/007132 KR2011007132W WO2012044054A2 WO 2012044054 A2 WO2012044054 A2 WO 2012044054A2 KR 2011007132 W KR2011007132 W KR 2011007132W WO 2012044054 A2 WO2012044054 A2 WO 2012044054A2
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substrate
forming
super water
nanostructure
island
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PCT/KR2011/007132
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Korean (ko)
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WO2012044054A3 (fr
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김윤택
양순석
조상무
김병찬
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바코스 주식회사
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/18—Coatings for keeping optical surfaces clean, e.g. hydrophobic or photo-catalytic films
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • C23C14/5846—Reactive treatment
    • C23C14/5853—Oxidation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • C23C14/5846—Reactive treatment
    • C23C14/586—Nitriding
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/0006—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 with means to keep optical surfaces clean, e.g. by preventing or removing dirt, stains, contamination, condensation

Definitions

  • the present invention relates to a method for forming nanostructures for implementing a highly translucent and super water-repellent surface, and more particularly, to form island fine metal particles on the surface of the substrate and to form the island fine metal particles as a protective mask. After etching, by removing the metal particles remaining on the surface of the etched substrate, to a method for producing a highly translucent, super water-repellent nanostructure surface.
  • the antireflective coating refers to a coating capable of eliminating the reflection of light generated by the sharp refractive index change in the cross section of the optical device and increasing the amount of transmitted light.
  • a material having a refractive index corresponding to the square root of the refractive index of the substrate is applied to the substrate at a quarter thickness of a single wavelength by using electron beam deposition or ion assisted deposition. If you want to have minimal reflectance at different wavelengths, you need to deposit different layers of different materials.
  • this method has a problem that the antireflection effect is insufficient in a wide angle of incidence and the wavelength region and it is expensive to implement.
  • a method of forming a fine concavo-convex structure on the surface of the optical element is known.
  • a typical example of this method is moth eyes, which are made of aligned nanostructures that have very low light reflections to protect themselves from predators like birds and to secure visibility at night with less light. Your activities are easy.
  • the light is diffracted when passing through the surface of the optical element, and the linear component of the transmitted light is greatly reduced.
  • the pitch of the irregularities formed on the optical element surface is shorter than the wavelength of the transmitted light. Since the diffraction does not occur in the shape, light having a single wavelength corresponding to the pitch and depth of the unevenness may have an antireflection effect.
  • Electron beam lithography is generally used to produce such a fine structure because fine patterns below the wavelength of light are required to obtain the anti-reflection effect for such a wide wavelength.
  • This method is a method in which an electron beam resist is applied, patterned using an electron beam, and then processed using reactive etching. Since the electron beam is scanned and patterned, there is a problem that production speed is very slow and manufacturing cost is high. Thus, there is a need for the development of a technology that can easily manufacture fine patterns, while low manufacturing costs by using expensive equipment.
  • the water repellency refers to a property that is difficult to wet the water
  • the water repellency is evaluated by the contact angle ⁇ of the water droplets placed on the surface, in general, if ⁇ exceeds 90 degrees, water repellency, 120 degrees ⁇ ⁇ 150 degrees is high water repellency, ⁇ is 150 degrees Above is defined as superhydrophobic.
  • Super water-repellent surface technology is a field of surface modification technology to control the surface wetting phenomenon, which makes the surface of the solid physically or chemically modify the surface so that the contact angle is 150 ° or more when the liquid contacts the surface of the solid.
  • the super water-repellent surface As a representative model of the super water-repellent surface, there is a lotus leaf. In the case of the lotus leaf, there are numerous micro to nano-sized ciliary protrusions on the surface and the wax component is coated at the same time. The surface is super water-repellent and exhibits a feature that does not get wet.
  • water droplets easily roll on super water-repellent surfaces, they are waterproof, anti-fogging, anti-skid, snow-preventing, anti-corrosion by tides, and anti-fingerprints, making them attractive for a wide range of applications including building materials, cosmetics, textile processing, and electronic components. I am getting it.
  • the water-repellent film prepared by coating various conventional fluorine-based materials is an example in which a coating film is formed using a material having a low surface energy. Since a contact angle of 150 ° or more cannot be obtained only by low surface energy, a super water-repellent material of 150 ° or more is required. It is necessary to fabricate nanostructures on the surface.
  • the highly transparent and super water-repellent surface using the nanostructure when applied to optical devices such as computers or notebooks, reduces the glare of the reflection of external light, and increases the amount of light from the inside It is expected to have a ripple effect in related industries if it is possible to form a large amount of nanostructures at low cost in an optical device because it can provide bright and bright image quality.
  • the present invention was devised to solve the above problems, and by forming fine unevenness on the surface of the substrate and coating it with a fluorine compound, not only shows excellent super water repellency but also reduces the reflectance of the surface of the substrate to show high transparency It is an object of the present invention to provide a manufacturing method that can easily produce the surface at a low manufacturing cost.
  • the present invention provides a method of forming an island-shaped metal particles on a surface of a substrate, etching the substrate surface using the island-shaped metal particles as a protective mask, and etching the substrate surface. It provides a method for forming a nanostructure comprising the step of removing the remaining metal particles.
  • the present invention comprises the steps of forming an intermediate layer on the surface of the substrate, the step of forming the metal particles of the island form on the surface of the substrate on which the intermediate layer is formed, the metal particles of the island form as a protective mask Etching the intermediate surface, etching the substrate surface using the metal particles in the intermediate and island form remaining after the etching as a protective mask, removing the metal particles remaining on the etched substrate surface, and the etched It provides a method of forming a nanostructure comprising the step of removing the intermediate remaining on the substrate surface.
  • the island-like metal fine particles are discontinuous thin films formed on the surface of the substrate by physical vapor deposition (PVD), and the intermediate is preferably made of silicon or polymer.
  • PVD physical vapor deposition
  • the method may further include oxidizing, nitriding, or oxynitrating the island-shaped metal particles after forming the island-like metal particles on the surface of the substrate, wherein the island-shaped islands of the oxidized, nitrided, or oxynitride are formed.
  • the metal fine particles as a protective mask, the substrate surface or the intermediate layer is etched and the oxidized, nitrided or oxynitride metal particles remaining on the etched substrate surface are removed.
  • the metal fine particles may be formed of any one of low melting point metals such as indium, tin, lead, zinc, and aluminum, and the average particle diameter of the metal fine particles may be in the range of 10 to 1000 nm. It is preferable that the average particle diameter is 10-400 nm.
  • the average spacing between the metal fine particles is 20 to 2000 nm
  • the shape of the metal fine particles formed on the surface of the base material is a weight in which the surface-area-to-volume ratio of the base side and the atmospheric side continuously changes.
  • the nanostructures are formed on both surfaces of the substrate.
  • the nanostructure forming method of the present invention it is possible to easily form a random fine concavo-convex surface on the surface of the substrate without using expensive low-efficiency method such as lithography method, forming a nanostructure showing high permeability and super water repellency
  • the surface can be produced at low cost and high efficiency.
  • Figure 2-Flow chart showing a method of manufacturing a non-reflective surface and super water-repellent surface in accordance with a preferred embodiment of the present invention
  • 6 to 4 are cross-sectional views illustrating a state in which oxidized, nitrided, and oxynitride particles are formed on an intermediate layer according to the flowchart of FIG. 4.
  • FIG. 7 to 6 are cross-sectional views illustrating a state in which an intermediate layer is etched.
  • FIGS. 8 to 7 are cross-sectional views illustrating a state in which the substrate is etched.
  • the present invention does not use conventional low-productivity and costly electron beam lithography to form nanostructures on the surface of the substrate, and immediately forms the island-like metal fine particles on the surface of the substrate, which is then etched as a protective mask. It is made into the summary to form a nanostructure by the following.
  • the method of forming a nanostructure for realizing a highly permeable and super water-repellent surface includes forming metal fine particles in island form on the surface of the substrate (P100), and in the island shape. Etching the substrate surface using the metal fine particles of the protective mask (P200), and removing the metal fine particles remaining on the etched substrate surface (P300), wherein the metal particles have been removed from the fluorine on the surface of the substrate.
  • the method may further include coating the compound (P400).
  • forming an intermediate layer on a surface of a substrate P50
  • forming fine metal particles in island form on the surface of the substrate on which the intermediate layer is formed P100
  • etching the intermediate surface using the island-shaped metal particles as a protective mask P150
  • etching the substrate surface using the intermediate and island-type metal particles remaining after the etching as a protective mask P200
  • P300 removing metal particles remaining on the etched substrate surface
  • P350 removing intermediates remaining on the etched substrate surface
  • the method may further include coating a fluorine compound (P400).
  • the island fine metal particles are oxidized, Further comprising nitriding or oxynitriding, wherein the surface of the substrate is etched using the metal particles in the form of the oxidized, nitrided or oxynitrided island as a protective mask, and the oxidation, nitriding or acid remaining on the surface of the etched substrate Nitrided metal particles are removed.
  • the embodiment is a step (P100) of forming the island-like metal fine particles on the surface of the substrate, the step of oxidizing, nitrating or oxynitrating the island-shaped metal particles (P110), the oxidized, nitrided or oxynitride island form Etching the substrate surface using the metal fine particles of the protective mask (P200), and removing the metal oxide particles oxidized, nitrided or oxynitized remaining on the surface of the etched substrate (P300).
  • the method may further include coating a fluorine compound on the removed substrate surface (P400).
  • FIG 4 another method of forming a nanostructure according to another embodiment of the present invention, after the step of forming the island-like metal fine particles on the surface of the substrate formed with the intermediate layer in Figure 2, And oxidizing, nitriding or oxynitrating the metal fine particles, wherein the substrate surface and the intermediate layer are etched using the metal fine particles in the oxidized, nitrided or oxynitrated island form as a protective mask, and the etched substrate surface is etched. It will remove the remaining oxidized, nitrided or oxynitride metal particles.
  • the embodiment of the present invention comprises the steps of forming an intermediate layer on the surface of the substrate (P50), forming the fine metal particles of the island form on the surface of the substrate on which the intermediate layer is formed (P100), oxidizing, nitriding or oxidizing the island-shaped metal particles Oxidizing (P110), etching the surface of the intermediate with the metal particles in the form of the oxidized, nitrided or oxynitride as a protective mask (P150), oxidizing, nitriding or the oxynitride in the form of oxidized, nitrided or oxynitride islands.
  • the thin film when the thin film is manufactured by physical vapor deposition such as thermal evaporation, electron beam evaporation, sputtering, etc., nuclei are generated in the initial stage of thin film formation, and island-shaped fine particles, which are discontinuous thin films, are formed through the growth thereof. Channeling is achieved by the growth of island-like fine particles, and finally, it grows into a continuous thin film by increasing the channeling.
  • physical vapor deposition such as thermal evaporation, electron beam evaporation, sputtering, etc.
  • the thin film When manufacturing the thin film, it is possible to control the size and spacing of the fine particles in the form of islands by adjusting pressure, film formation speed, temperature, applied power, and the like, and the non-conductive coating applied to mobile phones in recent years uses materials such as indium or tin. It is made of fine particles in the form of a protective coating on it, but the metal thin film on the naked eye, but in fact, island-like fine particles are not connected to each other, so that they are not electrically connected to pass radio frequency waves in the communication band.
  • nano-size masks can be randomly manufactured on the surface of the substrate at low cost.
  • Various metals may be used to prepare the island-like fine particles, but it is preferable to coat a low melting point metal.
  • a high melting point metal such as silver or gold
  • the thin film is as thin as 10 nm, it grows into a continuous thin film. Therefore, nanoparticles are usually produced by annealing, but the temperature is high. Even after the annealing, it is difficult to process.
  • island-like fine particles using low melting point metals such as indium, tin, lead, zinc, and aluminum, and aluminum is the highest melting point metal, but is easily formed when formed at an appropriate temperature. Particulates can be formed.
  • FIG. 5 is a SEM photograph of a thin film state in which film formation is stopped in an island-like fine particle state, and shows a state in which fine particles of several hundred nanometers are formed on the glass surface at intervals of several hundred nanometers. These sizes can be controlled by pressure, film formation speed, temperature, and applied power as described above.
  • the substrate may be formed of glass. Even if the substrate is a transparent material, the substrate becomes opaque when the size of the unevenness formed on the surface of the substrate is 400 nm or more.
  • the average particle diameter of the metal particles for high permeability and super water repellency is preferably 10 to 1000 nm, but since the wavelength of visible light that can be detected by the human eye is 400 nm to 800 nm, the substrate is a transparent material.
  • the average particle diameter of the metal fine particles is preferably 10 to 400 nm, more preferably 200 nm or less.
  • the average spacing between the metal fine particles is preferably 20 to 2000 nm
  • the shape of the metal fine particles formed on the surface of the substrate has a volume ratio between the substrate side and the atmosphere side (Surface-area-to). It is preferable that it is a weight shape which -volume ratio) changes continuously.
  • the substrate is used to etch (etch) the mask, wherein the etching may use a reactive etching method using an etching gas. Since the island-type fine particles used as a mask can be removed by a reactive etching process using a suitable gas or a wet process using an etching solution, depending on the material.
  • the nanoparticles are randomly mixed with small ones and large ones, and too small nanoparticles may be etched together when the substrate is etched in a subsequent etching process. It may not be possible to serve as a protective film until it is.
  • FIGS. 2 and 4 even small particles may be used as a protective film by separately forming an intermediate layer (FIGS. 2 and 4) or by using one or more methods of oxidizing, nitriding and oxynitrating the particles (FIGS. 3 and 4). .
  • the intermediate layer when the silicon or polymer having a large difference in the etching ratio from the base glass or plastic according to the type of etching gas is used as the intermediate layer, the island-like fine particles form the protective mask until the intermediate layer is etched. After that, the intermediate layer becomes a new mask and can later etch the substrate to a desired depth, so that even small sized particles can act as a protective mask.
  • oxidizing, nitriding, and oxynitriding particles In the method of oxidizing, nitriding, and oxynitriding particles, oxidizing, nitriding, and oxynitriding the island-like fine particles through plasma treatment increases resistance to etch, so that even small-sized particles can sufficiently serve as a protective mask until the etching completion stage. It becomes possible.
  • FIG. 6 is a step of dry etching the intermediate layer using the fine particles of islands of oxidized, nitrided, and oxynitride as a protective mask. P150) is shown.
  • etching is preferably performed using an etching gas having a high etching selectivity for the protective mask and the intermediate layer.
  • the etching ratio of silicon is higher than that of glass as etching gas CCl 4 / Ar, SiF 4 / Ar, CF 4 / O 2 , C 2 ClF 3 , C 2 F 4 / CF 3
  • etching gas CCl 4 / Ar, SiF 4 / Ar, CF 4 / O 2 , C 2 ClF 3 , C 2 F 4 / CF 3 Cl can be used.
  • Figure 7 shows the step of etching the substrate after the intermediate layer etching, the remaining fine particles and the intermediate layer acts as a protective mask, the etching gas of the glass etch ratio is higher than the silicon of the intermediate layer C 2 F 4 , CF 4 / H 2 , CHF 3 / CO 2 , C 2 F 4 / CHF 3 / He can be used.
  • the substrate substrate may be etched using an Ar / CF 4 / Ar mixed gas or a gas mixed with H 2 gas.
  • the polymer may be formed using PECVD as an intermediate layer.
  • the polymer may be etched using an Ar / CF 4 / O 2 mixed gas as a protective film using island-shaped fine particles formed on the polymer by removing the polymer as an intermediate layer. Thereafter, to etch the glass, one of C 2 F 4 , CF 4 / H 2 , CHF 3 / CO 2 , and C 2 F 4 / CHF 3 / He may be used as an etching gas.
  • an appropriate gas or a solution may be used to dissolve the metal fine particles or to remove the intermediate layer silicon or polymer.
  • the fine particles in the island form are pure low melting point metals or their oxidized, nitrided, or oxynitrided materials.
  • the dry etching process for example, CCl 4 He, CCl 4 , BCl 3 can be removed using a gas or the like.
  • the gas is removed, if the intermediate layer is silicon, the remaining silicon may be removed using the etching gas used in the intermediate layer etching step, and even the polymer may be removed by an O 2 plasma ashing process.
  • indium is a solution of HNO 3 : HCl 2: 1 and aluminum is H 3 PO 4 : NHO 3 : HC 2 H 3 O 2 : H 2 O can be removed using a solution with 80: 5: 5: 10.
  • the fine particles can be removed using an ITO etching solution or a H 3 PO 4 solution.
  • KOH or NHO 3 : HC 2 H 3 O 2 : HF can be removed with a 20: 20: 1 to 20: 80: 1 solution.
  • the intermediate layer is a polymer, it can be easily removed with a piranha solution or an organic solvent.
  • the base material is formed of a glass material
  • the hydrophilic property is easily combined with water molecules. Therefore, in the present invention, by coating the surface of the substrate formed of a glass material with a fluorine compound, it is possible to implement a super water-repellent surface. Even when the base material is plastic, when the base material is free of fluorine, it is preferable to coat the fluorine compound to impart super water repellency.
  • the fluorine compound has a property to be coated on an object to lower the surface energy to exhibit water repellency
  • the surface of the substrate coated with the fluorine compound is (CF3-), (-(CF2-CF2) n-,- (O (CF2) m) n-,-((CF2) mO) n-,-(OC (CF3) FCF2) n- and-(C (CF3) FCF2O) n-, preferably at least one of M is 1 or more and 25 or less and n is 1 or more and 100 or less.
  • the method of coating the fluorine compound on the surface of the substrate is a dip coating for dipping the substrate in a solution in which the fluorine compound is dissolved and taking it out at a speed of 10 mm / min, or after dropping the solution on the substrate, the substrate is subjected to 3000 rpm.
  • a method such as spin coating that rotates for 1 minute at a rotational speed may be used.
  • the fluorine compound may be vaporized into a plasma state in the plasma chamber, and free radicals formed on the surface of the fluorine compound may be coated by graft polymerization on a substrate exposed to the plasma, or may be coated by surface modification of the fluorine compound using plasma. .
  • the manufacturing method of the surface of the nanostructure according to the embodiment of the present invention can achieve the object of the present invention by one side treatment, but more preferably by treating the other side of the substrate when the substrate is an optical element It is possible to maximize the transmittance of the substrate.
  • the glass was used as a substrate and 10 nm sputter-coated silicon as an intermediate layer on one side and indium coated on the silicon.
  • Indium oxide was oxidized by an oxygen plasma treatment in a reactive etching process, and silicon interlayer was etched using CF 4 / O 2 as a silicon etching gas.
  • the etching gas was etched using CF 4 / Ar for 1 minute, indium oxide was removed using a commercially available ITO etchant, and rinsed, and silicon was removed using KOH 30% solution.
  • a fluorine compound was coated on the surface of the nanostructure to form a nanostructure on one side of the glass.
  • the produced glass has a conventional reflectance is reduced and the optical transmittance was increased from 91.0% to 94.0% at 550nm wavelength optically improved and the contact angle of water droplets was also increased to 160 degrees from the conventional 35 degrees showed super water repellency.
  • a plastic (a transparent acrylic sheet or an injection molded product coated with UV curable resin on the surface), which is generally used for a mobile phone sight glass, was used, and nanostructures were formed on one side of the substrate by the same process as in Example 1.
  • the plastic surface on which the nanostructures were formed showed super water repellency and the transmittance was increased by the reflection reduction effect.
  • a plastic (a polycarbonate opaque injection molded surface coated with a UV curable resin or a thermosetting resin) commonly used in a cell phone case was used and coated with indium.
  • indium was oxidized by oxygen plasma treatment, and the plastic substrate was etched by the Ar / CF 4 / O 2 mixed gas, and changed to BCl 3 gas to remove the remaining indium oxide.

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Abstract

La présente invention concerne un procédé de formation d'une nanostructure permettant l'obtention d'une surface hautement transparente et super-hydrophobe et, plus précisément, un procédé de formation d'une surface nanostructurée hautement transparente et super-hydrophobe, comprenant les étapes consistant à former de fines particules métalliques en forme d'îlots à la surface d'un substrat ; à graver la surface du substrat en utilisant les fines particules métalliques en forme d'îlots en tant que masque protecteur ; et à éliminer les fines particules métalliques subsistant à la surface du substrat gravé. Grâce au procédé de formation d'une nanostructure de la présente invention, il est facile d'obtenir une mince surface inégale et aléatoire à la surface d'un substrat même sans utiliser un procédé coûteux et peu efficace tel que la lithographie et, ainsi, de produire une surface hautement transparente et super-hydrophobe sur laquelle est formée une nanostructure, et ce pour un coût faible et de manière très efficace.
PCT/KR2011/007132 2010-09-30 2011-09-28 Procédé de formation d'une nanostructure permettant l'obtention d'une surface hautement transparente et super-hydrophobe WO2012044054A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0095523 2010-09-30
KR1020100095523A KR101283665B1 (ko) 2010-09-30 2010-09-30 고투광성, 초발수성 표면 구현을 위한 나노구조물 형성 방법

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WO2012044054A2 true WO2012044054A2 (fr) 2012-04-05
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CN114133611A (zh) * 2021-11-02 2022-03-04 北京大学 一种在聚合物材料表面制备纳米纤毛结构的方法
CN114682922A (zh) * 2022-03-08 2022-07-01 江苏大学 一种激光刻蚀制备铝合金超疏水表面应力与织构形貌调控方法

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EP3116942A4 (fr) * 2014-05-27 2017-12-06 SABIC Global Technologies B.V. Matériaux polymères super-hydrophobe autonettoyants pour un effet anti-salissure
CN109534684A (zh) * 2018-12-27 2019-03-29 河南豫科玻璃技术股份有限公司 一种基于纳米级无闪点防眩光技术的蚀刻玻璃及其刻蚀工艺
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CN114133611B (zh) * 2021-11-02 2023-02-07 北京大学 一种在聚合物材料表面制备纳米纤毛结构的方法
CN114682922A (zh) * 2022-03-08 2022-07-01 江苏大学 一种激光刻蚀制备铝合金超疏水表面应力与织构形貌调控方法

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