WO2012040932A1 - 利用废电子线路板粉制造的板材及其制造工艺 - Google Patents

利用废电子线路板粉制造的板材及其制造工艺 Download PDF

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Publication number
WO2012040932A1
WO2012040932A1 PCT/CN2010/077523 CN2010077523W WO2012040932A1 WO 2012040932 A1 WO2012040932 A1 WO 2012040932A1 CN 2010077523 W CN2010077523 W CN 2010077523W WO 2012040932 A1 WO2012040932 A1 WO 2012040932A1
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WIPO (PCT)
Prior art keywords
electronic circuit
circuit board
waste electronic
powder
waste
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Application number
PCT/CN2010/077523
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English (en)
French (fr)
Inventor
宋党记
Original Assignee
Song Dangji
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Song Dangji filed Critical Song Dangji
Priority to PCT/CN2010/077523 priority Critical patent/WO2012040932A1/zh
Priority to CN201080028381.4A priority patent/CN102686667B/zh
Publication of WO2012040932A1 publication Critical patent/WO2012040932A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
    • B29B17/0026—Recovery of plastics or other constituents of waste material containing plastics by agglomeration or compacting
    • B29B17/0042—Recovery of plastics or other constituents of waste material containing plastics by agglomeration or compacting for shaping parts, e.g. multilayered parts with at least one layer containing regenerated plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J11/00—Recovery or working-up of waste materials
    • C08J11/04—Recovery or working-up of waste materials of polymers
    • C08J11/06—Recovery or working-up of waste materials of polymers without chemical reactions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/178—Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/62—Plastics recycling; Rubber recycling

Definitions

  • the invention relates to a board, in particular to a waterproof and fireproof zero carbon ecological board manufactured by using waste electronic circuit board powder.
  • the invention also relates to a manufacturing process for manufacturing a waterproof, fireproof and zero carbon ecological board using waste electronic circuit board powder. Background technique
  • the materials used in the current decorative panels include wood and synthetic panels.
  • the common synthetic panels have the disadvantages of being non-waterproof, prone to mildew, easy to expand and deform, and the production formula exceeds the standard, which affects environmental protection.
  • the use of wood requires forest resources. Due to the widespread use of wood in traditional plates, the global forest resources have been severely degraded, affecting the protection of the global ecological environment, making global warming seriously affecting normal human life, and a large number of natural disasters such as soil erosion and flooding. occur.
  • Waste electronic circuit board is a mixture of glass fiber reinforced resin and various metals. It is a typical electronic waste. If it is not properly handled and disposed, it will not only cause a large loss of useful resources, but also cause serious harm to the environment. The full resource utilization of waste circuit boards has significant economic recovery value and environmental protection significance. After the metal materials in the waste electronic circuit board are extracted and recovered, the remaining waste electronic circuit board powder, that is, the thermosetting resin powder and the glass fiber powder are discarded as garbage.
  • the material composition of waste electronic circuit board powder includes epoxy resin and glass fiber of skeleton material, etc., which has high chemical stability and is not easily degraded in the natural environment, thereby bringing about difficulty in the treatment of waste electronic circuit board powder.
  • the technical problem to be solved by the present invention is to provide a waterproof and fireproof zero carbon ecological board which can regenerate and recycle waste electronic circuit board powder and is synthesized with fiber resin and can reduce environmental pollution.
  • the invention also provides a manufacturing process for synthesizing waterproof fireproof zero carbon ecological board by using waste electronic circuit board powder
  • the technical solution adopted by the present invention is: a waterproof and fireproof zero carbon ecological board manufactured by using waste electronic circuit board powder, the raw materials for preparing the board include the following weight percentage components: waste electronic circuit board Powder 70% ⁇ 90%, phenol resin resin ⁇ % ⁇ 12%, chemical fiber 3% ⁇ 22%.
  • the raw material for preparing the sheet material comprises the following components by weight: 85% to 87% of the waste electronic circuit board powder, 8% by weight of the phenol resin resin, and 3% to 7% of the chemical fiber. %.
  • the raw material for preparing the sheet material comprises the following components by weight: 70% to 80% of waste electronic circuit board powder, 8% by weight of phenol resin resin, and 8% to 22% of chemical fiber. %.
  • the raw material for preparing the sheet material comprises the following components by weight: waste electronic circuit board powder 75% ⁇ 85 %, phenol resin resin 8% 8% ⁇ 10%, chemical fiber 7% ⁇ 15 %.
  • the raw material for preparing the sheet material comprises the following components by weight: 86% to 90% of waste electronic circuit board powder, 7% by weight of phenol resin resin, and 3% to 4% of chemical fiber %.
  • the raw material for preparing the sheet material comprises the following components by weight: waste electronic circuit board powder 75% ⁇ 85%, phenol resin resin 10% ⁇ 12%, chemical fiber 5% ⁇
  • the raw material for preparing the sheet material comprises the following components by weight: 80% to 85% of waste electronic circuit board powder, 10% to 12% of phenol resin resin, and 3% to 10% chemical fiber %.
  • the technical scheme adopted by the invention is: a manufacturing process for manufacturing waterproof and fireproof zero carbon ecological board by using waste electronic circuit board powder, which comprises the following steps,
  • the dried waste electronic circuit board powder is spirally fed into the sizer to mix 10% alcohol-soluble phenolic resin, and the mixing ratio of the phenolic resin and the waste electronic circuit board powder is adjusted as required during the mixing process. Mixing uniformly to make the surface of the powder particles coated with phenol resin, and at the same time, adding the chemical fiber to the mixer of the sizer, and then feeding it into the paving system by the glue applicator;
  • the raw material mixture powder is mixed into the paving system, and the paving process controls the feeding machine to move at a constant speed.
  • the paving system is equipped with a sweeping roller, a pre-pressing roller and a dust removing and recycling device. After the powder is flattened into a slab, Can be pressed into a plate in the next process;
  • step a is added before the agitation and mixing: the magnetic impurities in the waste electronic circuit board powder are removed by using a magnetic adsorption device.
  • waste electronic circuit board powder as the main raw material, so that the powder after the electronic circuit board recovers the metal material can be recycled and recycled to prevent environmental pollution caused by waste.
  • the main components of waste electronic circuit board powder are epoxy resin and glass fiber of skeleton material.
  • the performance parameters of the finished board can reach: tensile strength 6.70MPa, 24 hour water absorption rate 0.32%, end surface strength 120MPa, so the plate has bubbles The water does not swell and does not deform and waterproof, and has good strength and toughness.
  • FIG. 1 is a flow chart showing the operation of an embodiment of the present invention.
  • BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be specifically described.
  • the invention provides a waterproof and fireproof zero carbon ecological board manufactured by using waste electronic circuit board powder, wherein the preparation material of the board comprises the following weight percentage components: waste electronic circuit board powder 70% ⁇ 90%, phenol resin resin ⁇ % ⁇ 12 %, chemical fiber 3% ⁇ 22%.
  • the above-mentioned weight percentage component is used as the raw material for waterproofing and fireproof zero carbon ecological board, and the waste electronic circuit board powder is used as the main raw material, so that the powder material after the electronic circuit board recovers the metal material can be recycled and utilized to prevent environmental pollution caused by waste.
  • the main components of waste electronic circuit board powder are epoxy resin and glass fiber of skeleton material.
  • the pressed sheet has water-proofing, non-expanding, non-deformation and waterproof performance, and has good strength and toughness.
  • the phenol resin in the composition is a substance compatible with a wide variety of organic and inorganic fillers, and can be used as a binder and a refractory material.
  • the chemical fibers in the components can increase the strength and dimensional stability of the product.
  • the aging strong artificial board because the board adds a large amount of waste circuit board powder, it is fused with the phenolic resin glue, which improves the filling amount of the waste powder of the waste circuit board, makes the board have good rigidity and reduces the filling cost. It directly reduces the manufacturing cost and material cost of the sheet, and also facilitates the recycling of waste materials, which plays a certain role in environmental protection.
  • the simple phenol resin resin and the waste electronic circuit board powder are fused together, and the addition of an appropriate amount of chemical fiber as a synthetic auxiliary agent can make the synthesis effect more ideal and improve the toughness of the sheet.
  • the raw material for the preparation of the sheet material comprises the following components by weight: waste electronic circuit board powder 85 % ⁇ 87 %, phenol resin resin 8 % ⁇ 10 %, chemical fiber 3 % ⁇ 7%.
  • the material made of raw materials is more uniform and dense, and the obtained board is more solid, waterproof, and the strength is greatly improved.
  • the best performance parameters of the board can be achieved: Tensile strength 6.70MPa, water absorption rate of 0.22% in 24 hours, and end surface strength of 120MPa. Plates made from this ratio of raw materials can achieve good tensile strength by adding a small amount of chemical fiber, and it is not preferable to add more chemical fibers to their tensile strength.
  • the waste electronic circuit board powder also has a very good waterproof performance in the case of a large proportion, which is unexpected.
  • the raw material for the preparation of the sheet material comprises the following components by weight: waste electronic circuit board powder 70% ⁇ 80%, phenol resin resin 8 % ⁇ 12%, chemical fiber 8 % ⁇ 22%.
  • the material made of raw materials is more uniform and dense, and the obtained board is more solid, waterproof, and the strength is greatly improved.
  • the best performance parameters of the board can be achieved: Tensile strength 6.80MPa, water absorption rate of 0.22% in 24 hours, and end surface strength of 125MPa.
  • the content of the waste electronic circuit board powder is slightly lower, a plate having a higher end strength can be obtained, and the tensile strength is also very good.
  • the raw material for the preparation of the sheet material comprises the following components by weight: Waste electronic circuit board Powder 75% ⁇ 85 %, phenol resin resin 8 % ⁇ 10%, chemical fiber 7% ⁇ 15%. According to the above ratio, the material made of raw materials is more uniform and dense, and the obtained board is more solid, waterproof, and the strength is greatly improved.
  • the best performance parameters of the board can be achieved: Tensile strength 6.50 MPa, water absorption rate of 0.22% in 24 hours, and end surface strength of 120 MPa.
  • the above-mentioned ratio of the plate has a very excellent waterproof performance with respect to the high-density fiberboard, and is less than three percent of the minimum water absorption of the high-density fiberboard; the plate also has a relatively high tensile strength, and the high-density fiberboard can be obtained. 6.5 times.
  • the raw material for the preparation of the sheet material comprises the following components by weight: waste electronic circuit board powder 86% ⁇ 90%, phenol resin resin ⁇ % ⁇ 10%, chemical fiber 3% ⁇ 4%.
  • waste electronic circuit board powder 86% ⁇ 90%
  • phenol resin resin ⁇ % ⁇ 10% phenol resin resin ⁇ % ⁇ 10%
  • chemical fiber 3% ⁇ 4% the material made of raw materials is more uniform and dense, and the obtained board is more solid, waterproof, and the strength is greatly improved.
  • the best performance parameters of the board can be achieved: Tensile strength 6.5 MPa, water absorption rate of 0.22% in 24 hours, and end surface strength of 120 MPa.
  • the ratio of the chemical fiber is relatively low, the strength property can be obtained, and the tensile and shear resistance is excellent.
  • the raw material for the preparation of the sheet material comprises the following components by weight: waste electronic circuit board powder 75% ⁇ 85%, phenol resin resin 10% ⁇ 12%, chemical fiber 5% ⁇ 10%.
  • waste electronic circuit board powder 75% ⁇ 85%, phenol resin resin 10% ⁇ 12%, chemical fiber 5% ⁇ 10%.
  • the material made of raw materials is more uniform and dense, and the obtained board is more solid, waterproof, and the strength is greatly improved.
  • the best performance parameters of the board can be achieved: Tensile strength 6.60 MPa, water absorption rate of 0.30% at 24 hours, and end surface strength of 120 MPa.
  • the raw material for preparing the sheet material comprises the following components by weight: 80% to 85% of waste electronic circuit board powder, 10% to 12% of phenol resin resin, and 3% to 10% of chemical fiber.
  • the material made of raw materials is more uniform and dense, and the obtained board is more solid, waterproof, and the strength is greatly improved.
  • the best performance parameters of the board can be achieved: Tensile strength 6.50 MPa, water absorption rate of 0.30% at 24 hours, and end surface strength of 120 MPa. When the amount of waste electronic circuit board powder is higher, the water absorption rate of the board is lower, and the excellent tensile and shear resistance is ensured.
  • the invention adopts a kind
  • the manufacturing process of manufacturing waterproof, fireproof and zero carbon ecological board by using waste electronic circuit board powder comprises the following steps:
  • Drying the waste electronic circuit board powder to control the moisture does not exceed 5% of the powder.
  • the powder contains a certain amount of water. If it is not dried, the phenomenon of cracking will occur in the process of pressing the plate in the next step, in order to avoid For such problems, the powder must be dried.
  • the drying equipment is heated to the dryer with a heat-conducting oil furnace. The temperature is controlled to dry at 130 ° C ⁇ 150 ° C. The moisture content of the powder after treatment by the dryer does not exceed 5%.
  • the agitated raw material mixture is paved into a blank shape by a paving device, and the paving process controls the feeding machine to move at a constant speed, so that the feeding is uniform, so that the thickness of the plate is uniform and uniform, preventing the defect position and ensuring the plate has more The waterproof effect and strength performance; and the inconsistent thickness indirectly leads to the defect that the sheet is easily deformed.
  • the paving is the more critical part of the pressing process.
  • the raw material mixture powder is mixed into the paving system, and the paving process controls the feeding machine to move at a constant speed.
  • the paving machine is equipped with a sweeping roller, a pre-pressing roller and a dust collecting and recycling device. After the powder is flattened into a slab, it can be pressed into a plate in the next process.
  • the pressure applied by the plate pressing machine exceeds 100kg per square centimeter, and the upper and lower platens are heated by the heat transfer oil to heat the platen process at the same time, and the temperature is controlled between 160°C and 180°C;
  • the blank is transported into the presser, and then the oil pressure switch is activated for 1 minute. After 2 minutes, the pressure is applied again to achieve a pressure of 15 Mps.
  • the pressure is 5
  • the pressure can be exhausted in minutes, and the pressure relief speed is controlled during operation so that the pressure changes gently.
  • the pre-pressor applies pressure to the raw material while transferring heat so that the phenol resin is melted and combined with the waste electronic circuit board powder to form a plate body.
  • the press cylinder is a 6-cylinder radial press. It is necessary to grasp the pressure relief speed during the operation, otherwise it will easily explode.
  • trimming sanding into the warehouse. Trimming sanding is the last process in the process of manufacturing plates. The dimensions of the plates are required. When cutting the edges, it should be noted that the error between the flatness and the perpendicularity of the edges should not exceed 0.5 mm.
  • step S105 is added prior to agitation mixing: the magnetic impurities in the waste electronic circuit board powder are removed using a magnetic adsorption device.
  • metal materials are not allowed to be mixed into raw materials. Otherwise, due to the inconsistent heat expansion ratio and the large specific gravity, it is easy to cause metal powder deposition on the sheet, resulting in uneven mixing of raw materials. Hooks, raw materials are not dense and other defects.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Sustainable Development (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Dry Formation Of Fiberboard And The Like (AREA)
  • Processing Of Solid Wastes (AREA)

Description

说 明 书 利用废电子线路板粉制造的板材及其制造工艺 技术领域
本发明涉及一种板材， 尤其涉及一种利用废电子线路板粉制造的防水防火 零碳生态板材。 本发明还涉及一种利用废电子线路板粉制造防水防火零碳生态 板材的制造工艺。 背景技术
目前的装饰板材使用的材料包括木材、 合成板材， 普通合成板材具有不防 水、 容易发霉、 容易膨胀变形、 生产配方甲搭超标影响环保等缺点， 而木材的 使用则需要欲伐森林资源。 由于传统板材广泛使用木材而导致全球森林资源受 到严重恶劣的欲伐， 影响了全球生态环境的保护， 使得全球气候变暖而严重影 响了人类正常生活 , 大量的水土流失与洪水水灾等自然灾害不断发生。
建筑材料与装饰板材使用木材或者植物合成板材正是危害生态资源的头号 杀手， 而传统的木制品装饰板材是不可以循环使用的材料， 现在全球都在保护 森林资源严禁欲伐， 使得全球木制品行业的产品价格每天都在涨价， 限制了原 来的木制品行业装饰材料的发展， 形成了木制品的行业发展的一个瓶颈。
随着电子信息时代的发展， 废弃的电子产品产生大量电子垃圾， 电子工业 生产领域产生大量的电路板废品和边角料， 电子垃圾污染问题已经成为全社会 高度关注的焦点， 节能环保、 低碳排放等社会问题越来越被人们重视， 电子垃 圾的严重性已经成为当前社会急需解决的问题， 因此我国已将废电子垃圾处理 技术作为循环经济的一部分， 受到高度重视。
在我国一些家电产品制造业最集中的区域， 历年来生产出口种类、 数量庞 大的电子产品， 其中电子线路板是电子工业的基础， 从计算机、 电视机到电子 玩具等， 几乎所有的电子产品中都离不开电路板。 据估算从 1988年至 2008年 间， 全世界每年产生电子垃圾达到 30万至 35万吨， 其中与电子线路板有关的 废料就占了 15%〜25%。 目前全球有 40%的电路板在中国生产， 中国已成为全球 第二大电路板生产国， 而珠三角更是目前电路板生产商的集中地， 该地区的 电路板基板的产量约占全国总产量的 2/ 3 , 每年产生的废电子线路板约为 32 万 -64万 /m2。
废电子线路板是玻璃纤维强化树脂和多种金属的混合物， 属典型的电子 废弃物， 如不妥善处理与处置， 不但会造成有用资源的大量流失， 而且还会 对环境产生严重危害， 故对废电路板的全资源利用具有重大经济回收价值和 环境保护意义。 对废电子线路板中的金属物质被提取回收后， 剩余的废电子 线路板粉即热固性树脂粉沫及玻璃纤维粉沫被当作垃圾丢弃。 其实废电子线 路板粉的物质成分包括环氧树脂及骨架材料玻璃纤维等， 其化学稳定性较高， 在自然环境中不易降解， 从而给废电子线路板粉的处理也带来治理难度。
如何实现电子工业废品废电路板的再生利用 , 寻找何种材料作为传统木材 制品的优质替代品， 将是目前迫切需要解决的技术难题。 发明内容
针对现有技术不足， 本发明要解决的技术问题是提供一种可再生回收废电 子线路板粉并与纤维树脂合成的、 可减少环境污染的防水防火零碳生态板材。 本发明还提供一种利用废电子线路板粉合成防水防火零碳生态板材的制造工 艺
为了克服现有技术不足， 本发明采用的技术方案是： 一种利用废电子线路 板粉制造的防水防火零碳生态板材， 所述板材的制备原料包括如下重量百分比 的组分： 废电子线路板粉 70 % ~ 90 % , 酚搭树脂胶 Ί % ~ 12 % , 化学纤维 3 % ~ 22 %。
作为上述第一个方案的改进， 所述板材的制备原料包括如下重量百分比的 组分：废电子线路板粉 85 % ~ 87 % ,酚搭树脂胶 8 % ~ 10 % ,化学纤维 3 % ~ 7 %。
作为上述第一个方案的改进， 所述板材的制备原料包括如下重量百分比的 组分:废电子线路板粉 70 % ~ 80 % ,酚搭树脂胶 8 % ~ 12 % ,化学纤维 8 % ~ 22 %。 作为上述第一个方案的改进， 所述板材的制备原料包括如下重量百分比的 组分:废电子线路板粉 75 % ~ 85 % ,酚搭树脂胶 8 % ~10%,化学纤维 7 % ~ 15 %。
作为上述第一个方案的改进， 所述板材的制备原料包括如下重量百分比的 组分：废电子线路板粉 86 % ~ 90 % ,酚搭树脂胶 7 % ~ 10 %，化学纤维 3 % ~ 4 %。
作为上述第一个方案的改进， 所述板材的制备原料包括如下重量百分比的 组分： 废电子线路板粉 75% ~ 85%, 酚搭树脂胶 10% ~ 12%, 化学纤维 5% ~
10%。
作为上述第一个方案的改进， 所述板材的制备原料包括如下重量百分比的 组分： 废电子线路板粉 80% ~ 85%, 酚搭树脂胶 10% ~ 12%, 化学纤维 3% ~ 10%。
为了利用废电子线路板粉合成防水防火零碳生态板材， 本发明采用的技术 方案是： 一种利用废电子线路板粉制造防水防火零碳生态板材的制造工艺， 其 包括以下步骤，
a、 对废电子线路板粉进行干燥处理， 控制水分不超过粉料的 5%, 控制在 在 130°C ~ 150°C的环境温度中进行搅拌干燥；
b、把干燥处理过的废电子线路板粉用螺旋送入施胶机内拌混 10%的醇溶型 酚醛树脂， 混胶过程中按要求调配酚醛树脂与废电子线路板粉的混配比， 要混 合均匀使粉料的颗粒表面涂上酚搭树脂， 并且同时把化学纤维加入施胶机的混 料器内混匀 , 由施胶机再送入铺装系统；
c、 原料混合物粉料经过搅拌后进入铺装系统， 铺装过程控制喂料机等速移 动， 铺装系统内装有扫平滚、 预压滚及除尘回收装置， 粉料经过压平成板坯后， 可进入下一道工序里加压制成板材；
d、 再使用压板机进行压板， 压板机施加的压力超过每平方厘米 100kg, 上 下压板用导热油循环加热， 使得压板过程同时加热， 温度控制在 160°C ~180°C 之间； 当铺装完成的坯板经输送进入压板机内， 然后启动油压开关进行加压 1 分钟， 经 2分钟后再补压一次， 使板面的压力达到 15Mps， 当补压时间达到 5 分钟时可排气泄压， 在操作过程中控制泄压速度使得压力平緩变化； e、 将坯板单片水平放置 3 ~ 5天进行时效处理；
f、 切边砂光入库。 作为上述方案的改进， 在搅拌混和之前增加步骤 al : 使 用磁性吸附设备清除废电子线路板粉中的金属杂质。
作为上述方案的改进， 在 b步骤的搅拌过程中添加化学纤维， 均匀混和。 本发明的有益效果是：利用如下重量百分比的组分：废电子线路板粉 70 % ~ 90 % , 酚搭树脂胶 Ί % ~ 12 % , 化学纤维 3 % ~ 22 % , 作为制备原料制造的防水 防火零碳生态板材以废电子线路板粉为主要原料， 使得电子线路板回收金属材 料后的粉料可以再生回收利用， 防止废弃导致的环境污染。 废电子线路板粉主 要成分为环氧树脂及骨架材料玻璃纤维 , 制成的板材其性能参数能可以达到： 抗拉强度 6.70MPa， 24小时吸水率 0.32 % , 端面强度 120MPa， 从而该板材具有 泡水也不膨胀不变形防水性能， 同时具有良好的强度和韧性。 附图说明
图 1是本发明实施例的操作工艺流程图。 具体实施方式 下面对本发明的实施方式进行具体描述。
本发明提供了一种利用废电子线路板粉制造的防水防火零碳生态板材， 所 述板材的制备原料包括如下重量百分比的组分： 废电子线路板粉 70 % ~ 90 % , 酚搭树脂胶 Ί % ~ 12 % , 化学纤维 3 % ~ 22 %。 利用上述重量百分比的组分作为 制备原料制造的防水防火零碳生态板材以废电子线路板粉为主要原料， 使得电 子线路板回收金属材料后的粉料可以再生回收利用 , 防止废弃导致的环境污染。 废电子线路板粉主要成分为环氧树脂及骨架材料玻璃纤维， 压制成的板材具有 泡水也不膨胀不变形防水性能， 同时具有良好的强度和韧性。 组分中的酚搭树 脂是一种与各种各样的有机和无机填料都能相容的物质， 可以作为粘结剂， 同 时又是一种耐火材料。 组分中的化学纤维可以提高产品的强度和尺寸稳定性。
利用废电子线路板粉的耐水抗老化等特性再生利用制造出防水、 防火、 抗 老化性强的人造板材， 由于板材添加了大量的废电路板粉， 其与酚醛树脂胶互 相融合， 提高了废弃电路板回收粉的填充量， 使得板材具有良好的刚性， 同时 降低了填充成本， 直接降低了板材的制造成本和材料成本， 还有利于废弃料回 收利用， 对环境保护起到一定的作用。
单纯的酚搭树脂胶与废电子线路板粉两种材料互相融合， 再添加适量的化 学纤维作为合成助剂可以使其合成效果更加理想， 提高板材的韧性。
本发明的利用废电路板粉制造的生态板材与高密度纤维板性能对比如下:
Figure imgf000007_0001
更佳地， 所述板材的制备原料包括如下重量百分比的组分： 废电子线路板 粉 85 % ~ 87 % , 酚搭树脂胶 8 % ~ 10 % , 化学纤维 3 % ~ 7 %。 按上述比例配备 原料制作的板材， 其内部的材料融合更加均匀、 致密， 得到的板材更加结实， 防水性更好， 强度得到很大的提高， 板材的最佳性能参数能可以达到： 抗拉强 度 6.70MPa， 24小时吸水率 0.32 % , 端面强度 120MPa。 按该配比的原料制作的 板材只需添加少量化学纤维就可以达到很好的抗拉强度， 并非添加越多化学纤 维其抗拉强度才较佳。 而且废电子线路板粉所占比例较大情况下也具有非常好 的防水性能， 这是意想不到的。
更佳地， 所述板材的制备原料包括如下重量百分比的组分： 废电子线路板 粉 70 % ~ 80 % , 酚搭树脂胶 8 % ~ 12 % , 化学纤维 8 % ~ 22 %。 按上述比例配备 原料制作的板材， 其内部的材料融合更加均匀、 致密， 得到的板材更加结实， 防水性更好， 强度得到很大的提高， 板材的最佳性能参数能可以达到： 抗拉强 度 6.80MPa， 24小时吸水率 0.32 % , 端面强度 125MPa。 废电子线路板粉的含量 稍低的情况下反而可以得到端面强度更高的板材， 抗拉强度也非常好。
更佳地， 所述板材的制备原料包括如下重量百分比的组分： 废电子线路板 粉 75 % ~ 85 % , 酚搭树脂胶 8 % ~ 10 % , 化学纤维 7 % ~ 15 %。 按上述比例配备 原料制作的板材， 其内部的材料融合更加均匀、 致密， 得到的板材更加结实， 防水性更好， 强度得到很大的提高， 板材的最佳性能参数能可以达到： 抗拉强 度 6.50MPa， 24小时吸水率 0.32%, 端面强度 120MPa。 上述配比制作的板材相 对高密度纤维板具有非常优异的防水性能， 只有不到高密度纤维板的最小吸水 率的百分之三； 该板材也具有相对非常高的抗拉强度， 可达高密度纤维板的 6.5 倍。
更佳地， 所述板材的制备原料包括如下重量百分比的组分： 废电子线路板 粉 86 % ~ 90 % , 酚搭树脂胶 Ί % ~ 10 % , 化学纤维 3 % ~ 4 %。 按上述比例配备 原料制作的板材， 其内部的材料融合更加均匀、 致密， 得到的板材更加结实， 防水性更好， 强度得到很大的提高， 板材的最佳性能参数能可以达到： 抗拉强 度 6.5MPa， 24小时吸水率 0.32% , 端面强度 120MPa。 在此配比下的原料制作 的板材， 虽然化学纤维的配比量比较低， 还可以得到比较好的强度性能， 抗拉 抗剪切性能非常优异。
更佳地， 所述板材的制备原料包括如下重量百分比的组分： 废电子线路板 粉 75% ~ 85%, 酚搭树脂胶 10% ~ 12%, 化学纤维 5% ~ 10%。 按上述比例配 备原料制作的板材， 其内部的材料融合更加均匀、 致密， 得到的板材更加结实， 防水性更好， 强度得到很大的提高， 板材的最佳性能参数能可以达到： 抗拉强 度 6.60MPa， 24小时吸水率 0.30%, 端面强度 120MPa。
更佳地， 所述板材的制备原料包括如下重量百分比的组分： 废电子线路板 粉 80% ~ 85%, 酚搭树脂胶 10% ~ 12%, 化学纤维 3% ~ 10%。 按上述比例配 备原料制作的板材， 其内部的材料融合更加均匀、 致密， 得到的板材更加结实， 防水性更好， 强度得到很大的提高， 板材的最佳性能参数能可以达到： 抗拉强 度 6.50MPa， 24小时吸水率 0.30%, 端面强度 120MPa。 废电子线路板粉配比量 较高的情况下其板材的吸水率反而更低了， 同时保证了优异的抗拉抗剪切性能。 为了利用废电子线路板粉合成防水防火零碳生态板材， 本发明采用的一种 利用废电子线路板粉制造防水防火零碳生态板材的制造工艺， 参考图 1 , 其包括 以下步骤：
510、 对废电子线路板粉进行干燥处理， 控制水分不超过粉料的 5%, 否则 会在板材中产生疏孔， 不够致密而影响其防水性能， 也会导致板材各种强度性 能下降； 低水分含量也可以方便后续的混和过程， 使得混和后原料彼此均匀分 布。
对废电子线路板粉进行干燥处理， 控制水分不超过粉料的 5%, 粉料由于含 有一定的水分， 如果不进行干燥处理， 在下一步压板的过程中会出现爆板的现 象， 为避免出现这样的问题， 必须对粉料进行干燥处理， 干燥设备选用导热油 炉加热循环进入干燥机， 控制温度在 130°C ~ 150°C搅拌干燥， 经过干燥机处理 后的粉料的水分含量不超过 5%。
511、 经搅拌系统拌入热固性酚醛树脂， 使其均匀混和， 混入结合剂， 使得 废电子线路板粉之间具有更佳的结合效果； 把干燥处理过的粉料用螺旋送入施 胶机内拌混 10%的醇溶型酚醛树脂， 混胶过程中要控制好酚醛树脂与废电子线 路板粉的混配比， 要混合均匀使粉料的颗粒表面涂上胶粘剂， 并且同时把化学 纤维加入混料器内混匀 , 由施胶机再送入铺装系统。
512、 将搅拌完成的原料混合物用铺装设备铺成坯形， 铺装过程控制喂料机 等速移动， 使得喂料均匀从而使板材各处厚度均匀一致， 防止出现缺陷位置， 保证板材具有更加的防水效果和强度性能； 而且厚度不一致又间接导致板材容 易变形的缺陷出现。 铺装是压板过程中较关键的部分， 原料混合物粉料经过搅 拌后进入铺装系统， 铺装过程控制喂料机等速移动， 铺装机内装有扫平滚、 预 压滚及除尘回收等装置， 粉料经过压平成板坯后， 可进入下一道工序里加压制 成板材。
513、 使用压板机进行压板， 压板机施加的压力超过每平方厘米 100kg, 上 下压板用导热油循环加热， 使得压板过程同时加热， 温度控制在 160°C ~ 180°C 之间； 将铺装完成的坯板经输送进入压板机内， 然后启动油压开关进行加压 1 分钟， 经 2分钟后再补压一次， 使板面的压力达到 15Mps， 当补压时间达到 5 分钟时可排气泄压， 在操作过程中控制泄压速度使得压力平緩变化。 过程中预 压机对原料施加压力同时传递热量使得酚搭树脂熔融并与废电子线路板粉相互 结合形成板体。 压机油缸为 6缸径压机。 在操作过程中必须要把握好泄压速度， 否则容易出现爆板现象。
514、 将坯板单片水平放置 3 ~ 5天进行时效处理， 自然放置使其自然风冷， 防止产品堆放或竖直放置导致的变形； 刚压制的坯板胶易变形， 还需存放 3 ~ 5 天进行养生处理， 消除坯板中的内应力达到规定要求。
515、 切边砂光入库。 切边砂光是制造板材过程中最后的一道工序， 要求板 材的尺寸规格， 在切边时要注意板边的平整及垂直度之间误差不得超过 0.5mm。
更佳地， 在搅拌混和之前增加步骤 S105: 使用磁性吸附设备清除废电子线 路板粉中的金属杂质。 在利用废电子线路板粉制造防水防火零碳生态板材的制 造工艺不允许有金属物质混入原材料中， 否则会由于热伸缩比例不一致、 比重 悬殊等原因容易使板材产生金属粉沉积导致原料混和不均勾、 原料结合不致密 等缺陷。 以上所揭露的仅为本发明的优选实施例而已， 当然不能以此来限定本发明 之权利范围， 因此依本发明申请专利范围所作的等同变化， 仍属本发明所涵盖 的范围。

Claims

权 利 要 求
1、 一种利用废电子线路板粉制造的防水防火零碳生态板材， 其特征在于， 所述板材的制备原料包括如下重量百分比的组分：废电子线路板粉 70 % ~ 90 % , 酚搭树脂胶 Ί % ~ 12 % , 化学纤维 3 % ~ 22 %。
2、 根据权利要求 1所述的利用废电子线路板粉制造的防水防火零碳生态板 材， 其特征在于， 所述板材的制备原料包括如下重量百分比的组分： 废电子线 路板粉 85 % ~ 87 % , 酚搭树脂胶 8 % ~ 10 % , 化学纤维 3 % ~ 7 %。
3、 根据权利要求 1所述的利用废电子线路板粉制造的防水防火零碳生态板 材， 其特征在于， 所述板材的制备原料包括如下重量百分比的组分： 废电子线 路板粉 70 % ~ 80 % , 酚搭树脂胶 8 % ~ 12 % , 化学纤维 8 % ~ 22 %。
4、 根据权利要求 1所述的利用废电子线路板粉制造的防水防火零碳生态板 材， 其特征在于， 所述板材的制备原料包括如下重量百分比的组分： 废电子线 路板粉 75 % ~ 85 % , 酚搭树脂胶 8 % ~ 10 % , 化学纤维 7 % ~ 15 %。
5、 根据权利要求 1所述的利用废电子线路板粉制造的防水防火零碳生态板 材， 其特征在于， 所述板材的制备原料包括如下重量百分比的组分： 废电子线 路板粉 86 % ~ 90 % , 酚搭树脂胶 Ί % ~ 10 % , 化学纤维 3 % ~ 4 %。
6、 根据权利要求 1所述的利用废电子线路板粉制造的防水防火零碳生态板 材， 其特征在于， 所述板材的制备原料包括如下重量百分比的组分： 废电子线 路板粉 75 % ~ 85 % , 酚搭树脂胶 10 % ~ 12 % , 化学纤维 5 % ~ 10 %。
7、 根据权利要求 1所述的利用废电子线路板粉制造的防水防火零碳生态板 材， 其特征在于， 所述板材的制备原料包括如下重量百分比的组分： 废电子线 路板粉 80 % ~ 85 % , 酚搭树脂胶 10 % ~ 12 % , 化学纤维 3 % ~ 10 %。
8、 一种利用废电子线路板粉制造防水防火零碳生态板材的制造工艺， 其特 征在于， 包括：
a、 对废电子线路板粉进行干燥处理， 控制水分不超过粉料的 5%, 控制在 在 130°C ~ 150°C的环境温度中进行搅拌干燥；
b、把干燥处理过的废电子线路板粉用螺旋送入施胶机内拌混 10%的醇溶型 酚醛树脂， 混胶过程中按要求调配酚醛树脂与废电子线路板粉的混配比， 要混 合均匀使粉料的颗粒表面涂上酚搭树脂， 并且同时把化学纤维加入施胶机的混 料器内混匀 , 由施胶机再送入铺装系统；
c、 原料混合物粉料经过搅拌后进入铺装系统， 铺装过程控制喂料机等速移 动， 铺装系统内装有扫平滚、 预压滚及除尘回收装置， 粉料经过压平成板坯后， 可进入下一道工序里加压制成板材；
d、 再使用压板机进行压板， 压板机施加的压力超过每平方厘米 100kg, 上 下压板用导热油循环加热， 使得压板过程同时加热， 温度控制在 160°C ~ 180°C 之间； 当铺装完成的坯板经输送进入压板机内， 然后启动油压开关进行加压 1 分钟， 经 2分钟后再补压一次， 使板面的压力达到 15Mps， 当补压时间达到 5 分钟时可排气泄压， 在操作过程中控制泄压速度使得压力平緩变化；
e、 将坯板单片水平放置 3 ~ 5天进行时效处理；
f、 切边砂光入库。
9、 根据权利要求 8所述的利用废电子线路板粉制造防水防火零碳生态板材 的制造工艺， 其特征在于， 在搅拌混和之前增加步骤 al : 使用磁性吸附设备清 除废电子线路板粉中的金属杂质。
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