WO2012040932A1 - Carte fabriquée à partir de poudres de cartes de circuits imprimés électroniques de rebut et son procédé de fabrication - Google Patents

Carte fabriquée à partir de poudres de cartes de circuits imprimés électroniques de rebut et son procédé de fabrication Download PDF

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Publication number
WO2012040932A1
WO2012040932A1 PCT/CN2010/077523 CN2010077523W WO2012040932A1 WO 2012040932 A1 WO2012040932 A1 WO 2012040932A1 CN 2010077523 W CN2010077523 W CN 2010077523W WO 2012040932 A1 WO2012040932 A1 WO 2012040932A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic circuit
circuit board
waste electronic
powder
waste
Prior art date
Application number
PCT/CN2010/077523
Other languages
English (en)
Chinese (zh)
Inventor
宋党记
Original Assignee
Song Dangji
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Song Dangji filed Critical Song Dangji
Priority to PCT/CN2010/077523 priority Critical patent/WO2012040932A1/fr
Priority to CN201080028381.4A priority patent/CN102686667B/zh
Publication of WO2012040932A1 publication Critical patent/WO2012040932A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
    • B29B17/0026—Recovery of plastics or other constituents of waste material containing plastics by agglomeration or compacting
    • B29B17/0042—Recovery of plastics or other constituents of waste material containing plastics by agglomeration or compacting for shaping parts, e.g. multilayered parts with at least one layer containing regenerated plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J11/00—Recovery or working-up of waste materials
    • C08J11/04—Recovery or working-up of waste materials of polymers
    • C08J11/06—Recovery or working-up of waste materials of polymers without chemical reactions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/178—Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/62—Plastics recycling; Rubber recycling

Definitions

  • the invention relates to a board, in particular to a waterproof and fireproof zero carbon ecological board manufactured by using waste electronic circuit board powder.
  • the invention also relates to a manufacturing process for manufacturing a waterproof, fireproof and zero carbon ecological board using waste electronic circuit board powder. Background technique
  • the materials used in the current decorative panels include wood and synthetic panels.
  • the common synthetic panels have the disadvantages of being non-waterproof, prone to mildew, easy to expand and deform, and the production formula exceeds the standard, which affects environmental protection.
  • the use of wood requires forest resources. Due to the widespread use of wood in traditional plates, the global forest resources have been severely degraded, affecting the protection of the global ecological environment, making global warming seriously affecting normal human life, and a large number of natural disasters such as soil erosion and flooding. occur.
  • Waste electronic circuit board is a mixture of glass fiber reinforced resin and various metals. It is a typical electronic waste. If it is not properly handled and disposed, it will not only cause a large loss of useful resources, but also cause serious harm to the environment. The full resource utilization of waste circuit boards has significant economic recovery value and environmental protection significance. After the metal materials in the waste electronic circuit board are extracted and recovered, the remaining waste electronic circuit board powder, that is, the thermosetting resin powder and the glass fiber powder are discarded as garbage.
  • the material composition of waste electronic circuit board powder includes epoxy resin and glass fiber of skeleton material, etc., which has high chemical stability and is not easily degraded in the natural environment, thereby bringing about difficulty in the treatment of waste electronic circuit board powder.
  • the technical problem to be solved by the present invention is to provide a waterproof and fireproof zero carbon ecological board which can regenerate and recycle waste electronic circuit board powder and is synthesized with fiber resin and can reduce environmental pollution.
  • the invention also provides a manufacturing process for synthesizing waterproof fireproof zero carbon ecological board by using waste electronic circuit board powder
  • the technical solution adopted by the present invention is: a waterproof and fireproof zero carbon ecological board manufactured by using waste electronic circuit board powder, the raw materials for preparing the board include the following weight percentage components: waste electronic circuit board Powder 70% ⁇ 90%, phenol resin resin ⁇ % ⁇ 12%, chemical fiber 3% ⁇ 22%.
  • the raw material for preparing the sheet material comprises the following components by weight: 85% to 87% of the waste electronic circuit board powder, 8% by weight of the phenol resin resin, and 3% to 7% of the chemical fiber. %.
  • the raw material for preparing the sheet material comprises the following components by weight: 70% to 80% of waste electronic circuit board powder, 8% by weight of phenol resin resin, and 8% to 22% of chemical fiber. %.
  • the raw material for preparing the sheet material comprises the following components by weight: waste electronic circuit board powder 75% ⁇ 85 %, phenol resin resin 8% 8% ⁇ 10%, chemical fiber 7% ⁇ 15 %.
  • the raw material for preparing the sheet material comprises the following components by weight: 86% to 90% of waste electronic circuit board powder, 7% by weight of phenol resin resin, and 3% to 4% of chemical fiber %.
  • the raw material for preparing the sheet material comprises the following components by weight: waste electronic circuit board powder 75% ⁇ 85%, phenol resin resin 10% ⁇ 12%, chemical fiber 5% ⁇
  • the raw material for preparing the sheet material comprises the following components by weight: 80% to 85% of waste electronic circuit board powder, 10% to 12% of phenol resin resin, and 3% to 10% chemical fiber %.
  • the technical scheme adopted by the invention is: a manufacturing process for manufacturing waterproof and fireproof zero carbon ecological board by using waste electronic circuit board powder, which comprises the following steps,
  • the dried waste electronic circuit board powder is spirally fed into the sizer to mix 10% alcohol-soluble phenolic resin, and the mixing ratio of the phenolic resin and the waste electronic circuit board powder is adjusted as required during the mixing process. Mixing uniformly to make the surface of the powder particles coated with phenol resin, and at the same time, adding the chemical fiber to the mixer of the sizer, and then feeding it into the paving system by the glue applicator;
  • the raw material mixture powder is mixed into the paving system, and the paving process controls the feeding machine to move at a constant speed.
  • the paving system is equipped with a sweeping roller, a pre-pressing roller and a dust removing and recycling device. After the powder is flattened into a slab, Can be pressed into a plate in the next process;
  • step a is added before the agitation and mixing: the magnetic impurities in the waste electronic circuit board powder are removed by using a magnetic adsorption device.
  • waste electronic circuit board powder as the main raw material, so that the powder after the electronic circuit board recovers the metal material can be recycled and recycled to prevent environmental pollution caused by waste.
  • the main components of waste electronic circuit board powder are epoxy resin and glass fiber of skeleton material.
  • the performance parameters of the finished board can reach: tensile strength 6.70MPa, 24 hour water absorption rate 0.32%, end surface strength 120MPa, so the plate has bubbles The water does not swell and does not deform and waterproof, and has good strength and toughness.
  • FIG. 1 is a flow chart showing the operation of an embodiment of the present invention.
  • BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be specifically described.
  • the invention provides a waterproof and fireproof zero carbon ecological board manufactured by using waste electronic circuit board powder, wherein the preparation material of the board comprises the following weight percentage components: waste electronic circuit board powder 70% ⁇ 90%, phenol resin resin ⁇ % ⁇ 12 %, chemical fiber 3% ⁇ 22%.
  • the above-mentioned weight percentage component is used as the raw material for waterproofing and fireproof zero carbon ecological board, and the waste electronic circuit board powder is used as the main raw material, so that the powder material after the electronic circuit board recovers the metal material can be recycled and utilized to prevent environmental pollution caused by waste.
  • the main components of waste electronic circuit board powder are epoxy resin and glass fiber of skeleton material.
  • the pressed sheet has water-proofing, non-expanding, non-deformation and waterproof performance, and has good strength and toughness.
  • the phenol resin in the composition is a substance compatible with a wide variety of organic and inorganic fillers, and can be used as a binder and a refractory material.
  • the chemical fibers in the components can increase the strength and dimensional stability of the product.
  • the aging strong artificial board because the board adds a large amount of waste circuit board powder, it is fused with the phenolic resin glue, which improves the filling amount of the waste powder of the waste circuit board, makes the board have good rigidity and reduces the filling cost. It directly reduces the manufacturing cost and material cost of the sheet, and also facilitates the recycling of waste materials, which plays a certain role in environmental protection.
  • the simple phenol resin resin and the waste electronic circuit board powder are fused together, and the addition of an appropriate amount of chemical fiber as a synthetic auxiliary agent can make the synthesis effect more ideal and improve the toughness of the sheet.
  • the raw material for the preparation of the sheet material comprises the following components by weight: waste electronic circuit board powder 85 % ⁇ 87 %, phenol resin resin 8 % ⁇ 10 %, chemical fiber 3 % ⁇ 7%.
  • the material made of raw materials is more uniform and dense, and the obtained board is more solid, waterproof, and the strength is greatly improved.
  • the best performance parameters of the board can be achieved: Tensile strength 6.70MPa, water absorption rate of 0.22% in 24 hours, and end surface strength of 120MPa. Plates made from this ratio of raw materials can achieve good tensile strength by adding a small amount of chemical fiber, and it is not preferable to add more chemical fibers to their tensile strength.
  • the waste electronic circuit board powder also has a very good waterproof performance in the case of a large proportion, which is unexpected.
  • the raw material for the preparation of the sheet material comprises the following components by weight: waste electronic circuit board powder 70% ⁇ 80%, phenol resin resin 8 % ⁇ 12%, chemical fiber 8 % ⁇ 22%.
  • the material made of raw materials is more uniform and dense, and the obtained board is more solid, waterproof, and the strength is greatly improved.
  • the best performance parameters of the board can be achieved: Tensile strength 6.80MPa, water absorption rate of 0.22% in 24 hours, and end surface strength of 125MPa.
  • the content of the waste electronic circuit board powder is slightly lower, a plate having a higher end strength can be obtained, and the tensile strength is also very good.
  • the raw material for the preparation of the sheet material comprises the following components by weight: Waste electronic circuit board Powder 75% ⁇ 85 %, phenol resin resin 8 % ⁇ 10%, chemical fiber 7% ⁇ 15%. According to the above ratio, the material made of raw materials is more uniform and dense, and the obtained board is more solid, waterproof, and the strength is greatly improved.
  • the best performance parameters of the board can be achieved: Tensile strength 6.50 MPa, water absorption rate of 0.22% in 24 hours, and end surface strength of 120 MPa.
  • the above-mentioned ratio of the plate has a very excellent waterproof performance with respect to the high-density fiberboard, and is less than three percent of the minimum water absorption of the high-density fiberboard; the plate also has a relatively high tensile strength, and the high-density fiberboard can be obtained. 6.5 times.
  • the raw material for the preparation of the sheet material comprises the following components by weight: waste electronic circuit board powder 86% ⁇ 90%, phenol resin resin ⁇ % ⁇ 10%, chemical fiber 3% ⁇ 4%.
  • waste electronic circuit board powder 86% ⁇ 90%
  • phenol resin resin ⁇ % ⁇ 10% phenol resin resin ⁇ % ⁇ 10%
  • chemical fiber 3% ⁇ 4% the material made of raw materials is more uniform and dense, and the obtained board is more solid, waterproof, and the strength is greatly improved.
  • the best performance parameters of the board can be achieved: Tensile strength 6.5 MPa, water absorption rate of 0.22% in 24 hours, and end surface strength of 120 MPa.
  • the ratio of the chemical fiber is relatively low, the strength property can be obtained, and the tensile and shear resistance is excellent.
  • the raw material for the preparation of the sheet material comprises the following components by weight: waste electronic circuit board powder 75% ⁇ 85%, phenol resin resin 10% ⁇ 12%, chemical fiber 5% ⁇ 10%.
  • waste electronic circuit board powder 75% ⁇ 85%, phenol resin resin 10% ⁇ 12%, chemical fiber 5% ⁇ 10%.
  • the material made of raw materials is more uniform and dense, and the obtained board is more solid, waterproof, and the strength is greatly improved.
  • the best performance parameters of the board can be achieved: Tensile strength 6.60 MPa, water absorption rate of 0.30% at 24 hours, and end surface strength of 120 MPa.
  • the raw material for preparing the sheet material comprises the following components by weight: 80% to 85% of waste electronic circuit board powder, 10% to 12% of phenol resin resin, and 3% to 10% of chemical fiber.
  • the material made of raw materials is more uniform and dense, and the obtained board is more solid, waterproof, and the strength is greatly improved.
  • the best performance parameters of the board can be achieved: Tensile strength 6.50 MPa, water absorption rate of 0.30% at 24 hours, and end surface strength of 120 MPa. When the amount of waste electronic circuit board powder is higher, the water absorption rate of the board is lower, and the excellent tensile and shear resistance is ensured.
  • the invention adopts a kind
  • the manufacturing process of manufacturing waterproof, fireproof and zero carbon ecological board by using waste electronic circuit board powder comprises the following steps:
  • Drying the waste electronic circuit board powder to control the moisture does not exceed 5% of the powder.
  • the powder contains a certain amount of water. If it is not dried, the phenomenon of cracking will occur in the process of pressing the plate in the next step, in order to avoid For such problems, the powder must be dried.
  • the drying equipment is heated to the dryer with a heat-conducting oil furnace. The temperature is controlled to dry at 130 ° C ⁇ 150 ° C. The moisture content of the powder after treatment by the dryer does not exceed 5%.
  • the agitated raw material mixture is paved into a blank shape by a paving device, and the paving process controls the feeding machine to move at a constant speed, so that the feeding is uniform, so that the thickness of the plate is uniform and uniform, preventing the defect position and ensuring the plate has more The waterproof effect and strength performance; and the inconsistent thickness indirectly leads to the defect that the sheet is easily deformed.
  • the paving is the more critical part of the pressing process.
  • the raw material mixture powder is mixed into the paving system, and the paving process controls the feeding machine to move at a constant speed.
  • the paving machine is equipped with a sweeping roller, a pre-pressing roller and a dust collecting and recycling device. After the powder is flattened into a slab, it can be pressed into a plate in the next process.
  • the pressure applied by the plate pressing machine exceeds 100kg per square centimeter, and the upper and lower platens are heated by the heat transfer oil to heat the platen process at the same time, and the temperature is controlled between 160°C and 180°C;
  • the blank is transported into the presser, and then the oil pressure switch is activated for 1 minute. After 2 minutes, the pressure is applied again to achieve a pressure of 15 Mps.
  • the pressure is 5
  • the pressure can be exhausted in minutes, and the pressure relief speed is controlled during operation so that the pressure changes gently.
  • the pre-pressor applies pressure to the raw material while transferring heat so that the phenol resin is melted and combined with the waste electronic circuit board powder to form a plate body.
  • the press cylinder is a 6-cylinder radial press. It is necessary to grasp the pressure relief speed during the operation, otherwise it will easily explode.
  • trimming sanding into the warehouse. Trimming sanding is the last process in the process of manufacturing plates. The dimensions of the plates are required. When cutting the edges, it should be noted that the error between the flatness and the perpendicularity of the edges should not exceed 0.5 mm.
  • step S105 is added prior to agitation mixing: the magnetic impurities in the waste electronic circuit board powder are removed using a magnetic adsorption device.
  • metal materials are not allowed to be mixed into raw materials. Otherwise, due to the inconsistent heat expansion ratio and the large specific gravity, it is easy to cause metal powder deposition on the sheet, resulting in uneven mixing of raw materials. Hooks, raw materials are not dense and other defects.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Sustainable Development (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Dry Formation Of Fiberboard And The Like (AREA)
  • Processing Of Solid Wastes (AREA)

Abstract

L'invention concerne une carte fabriquée à partir de poudres de cartes de circuits imprimés électroniques de rebut et les matériaux comprenant les composants suivants en pourcentage en poids : 70-90% de poudres de cartes de circuits imprimés électroniques de rebut, 7-12% de résine phénol aldéhyde, 3-22% de fibres chimiques. Le procédé de fabrication comprend les étapes consistant à sécher et mélanger les matériaux, paver et presser des plaques, etc… La carte ne gonfle ni ne se déforme lorsqu'elle est trempée dans de l'eau, et elle a une bonne résistance et une bonne ténacité. Le recyclage des poudres de cartes de circuits imprimés électroniques après la récupération de métaux peut empêcher une pollution environnementale due à la mise au rebut des poudres.
PCT/CN2010/077523 2010-09-30 2010-09-30 Carte fabriquée à partir de poudres de cartes de circuits imprimés électroniques de rebut et son procédé de fabrication WO2012040932A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/CN2010/077523 WO2012040932A1 (fr) 2010-09-30 2010-09-30 Carte fabriquée à partir de poudres de cartes de circuits imprimés électroniques de rebut et son procédé de fabrication
CN201080028381.4A CN102686667B (zh) 2010-09-30 2010-09-30 利用废电子线路板粉制造的防水防火零碳生态板材及其制造工艺

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2010/077523 WO2012040932A1 (fr) 2010-09-30 2010-09-30 Carte fabriquée à partir de poudres de cartes de circuits imprimés électroniques de rebut et son procédé de fabrication

Publications (1)

Publication Number Publication Date
WO2012040932A1 true WO2012040932A1 (fr) 2012-04-05

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PCT/CN2010/077523 WO2012040932A1 (fr) 2010-09-30 2010-09-30 Carte fabriquée à partir de poudres de cartes de circuits imprimés électroniques de rebut et son procédé de fabrication

Country Status (2)

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CN (1) CN102686667B (fr)
WO (1) WO2012040932A1 (fr)

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CN108485215B (zh) * 2018-05-09 2020-05-29 泰兴宜科新材料科技有限公司 一种再生复合板材及其生产工艺
CN116001407A (zh) * 2022-12-30 2023-04-25 常州市贝美家居科技有限公司 一种地板基材及其制备方法、地板的制备方法

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CN101555356A (zh) * 2009-05-15 2009-10-14 宋金有 利用废pcb板粉与树脂纤维合成的炭化环保板材
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ZHANG, ZONGKE ET AL.: "Preparation and Properties of Waste Printed Wiring Board Powder Reinforced Composites", FRP/CM, no. 2, March 2008 (2008-03-01), pages 20 - 22, 29 *

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Publication number Priority date Publication date Assignee Title
CN103011644A (zh) * 2012-12-21 2013-04-03 清远新绿环建筑材料有限公司 应用于生态板材的废旧线路板非金属粉的前处理工艺

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CN102686667B (zh) 2015-03-04

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