WO2012029402A1 - Pickup method and pickup device - Google Patents

Pickup method and pickup device Download PDF

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Publication number
WO2012029402A1
WO2012029402A1 PCT/JP2011/065058 JP2011065058W WO2012029402A1 WO 2012029402 A1 WO2012029402 A1 WO 2012029402A1 JP 2011065058 W JP2011065058 W JP 2011065058W WO 2012029402 A1 WO2012029402 A1 WO 2012029402A1
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WO
WIPO (PCT)
Prior art keywords
adhesive sheet
chip
pressure
sensitive adhesive
suction
Prior art date
Application number
PCT/JP2011/065058
Other languages
French (fr)
Japanese (ja)
Inventor
中尾　賢
充一 中村
到 飯田
原田　宗生
Original Assignee
東京エレクトロン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京エレクトロン株式会社 filed Critical 東京エレクトロン株式会社
Priority to KR1020137006721A priority Critical patent/KR20130113436A/en
Priority to US13/819,033 priority patent/US20150214088A1/en
Priority to CN201180041531.XA priority patent/CN103081083B/en
Publication of WO2012029402A1 publication Critical patent/WO2012029402A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1126—Using direct fluid current against work during delaminating
    • Y10T156/1132—Using vacuum directly against work during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1928—Differential fluid pressure delaminating means
    • Y10T156/1933—Spraying delaminating means [e.g., atomizer, etc.

Definitions

  • the present invention relates to a chip pickup method and a chip pickup apparatus.
  • a three-dimensional integration technique in which a plurality of semiconductor devices are stacked and arranged three-dimensionally.
  • the following method has been proposed.
  • a substrate on which an integrated circuit has been formed in advance is divided into a plurality of chips.
  • segmentation is selected from the some chip
  • the chips thus selected are stacked on another substrate and mounted as a three-dimensional stacked body (hereinafter also referred to as “stacked chip”).
  • such a stacked chip is manufactured as follows. First, an adhesive sheet such as a dicing tape or a back grind tape is attached to the substrate on which the semiconductor device is formed from the device forming surface side where the semiconductor device is formed. Then, the substrate with the adhesive sheet attached to the device forming surface in this way is thinned by grinding from the surface opposite to the device forming surface, that is, from the back surface of the substrate to a predetermined thickness. Thereafter, the substrate thinned in this way is diced while being attached to the adhesive sheet, and divided into individual chips. Next, the individual chips thus divided are taken out from the adhesive sheet, and the taken-out chips are stacked (for example, see Patent Document 1).
  • an adhesive sheet such as a dicing tape or a back grind tape is attached to the substrate on which the semiconductor device is formed from the device forming surface side where the semiconductor device is formed. Then, the substrate with the adhesive sheet attached to the device forming surface in this way is thinned by grinding from the surface opposite to the device forming surface,
  • a needle pickup device that picks up a chip by pushing up a needle from the back surface of an adhesive sheet is disclosed.
  • a needleless pickup device in which a nozzle capable of vacuum-sucking a chip is brought close to the surface of the chip and the chip is taken out from an adhesive sheet by vacuum suction using the nozzle.
  • a shear stress acts on the boundary surface between the part peeled off from the pressure-sensitive adhesive sheet and the part not peeled off from the pressure-sensitive adhesive sheet, and the shear stress is determined by the size of the chip plane and the thickness of the chip. Depends on. If the shear stress exceeds the shear fracture strength (shear strength) of the chip, the chip may be destroyed.
  • the present invention has been made in view of the above points. That is, the present invention provides a chip pickup method capable of reducing stress load applied to a chip when picking up a chip attached to an adhesive sheet when picking up a thinned chip and preventing chip breakage. And a pickup device.
  • the following pickup method is provided.
  • the first adsorbing portion is brought close to and in contact with the chip attached to the adhesive sheet, and the second adsorbing portion in which a concave portion is formed on the contact surface contacting the adhesive sheet is used as the adhesive sheet.
  • the second suction part is brought into contact with the pressure-sensitive adhesive sheet so as to approach the first suction part. Then, the pressure-sensitive adhesive sheet is sucked by the second suction part in contact with the pressure-sensitive adhesive sheet, and fluid is injected between the pressure-sensitive adhesive sheet and the chip by the injection part.
  • the adhesive sheet is peeled off from the portion of the chip facing the recess, and the first adsorption unit sucks the chip from the adhesive sheet sucked by the second adsorption unit. Keep the adsorption part away. In this way, the chip is separated from the adhesive sheet and picked up.
  • the first suction part that sucks the chip the first drive part that drives the first suction part to move, and the contact surface that contacts the adhesive sheet. It has a second suction part that is formed with a recess and sucks the adhesive sheet, a second drive part that drives to move the second suction part, an injection part that injects fluid, and a control part A pickup device is provided.
  • the control unit causes the first drive unit to bring the first suction unit into close contact with the chip attached to the adhesive sheet, and causes the second drive unit to stick the second suction unit.
  • the second suction part is brought into contact with the adhesive sheet so as to be close to the sheet and face the first suction part.
  • a control part opposes the recessed part of a chip
  • the adhesive sheet is peeled from the part.
  • the control part is in a state where the chip is adsorbed by the first adsorbing part, by moving the first adsorbing part away from the adhesive sheet sucked by the second adsorbing part by the first driving part, The chip is peeled off from the adhesive sheet and picked up.
  • the stress load applied to the chip when picking up the chip attached to the adhesive sheet can be reduced, and the chip can be prevented from being broken.
  • the pickup apparatus 10 includes a stage 20, an upper collet 30, a lower collet 40, and a control unit 60.
  • the stage 20 is installed horizontally.
  • An adhesive sheet 21, for example, a dicing tape, to which the wafer W is attached, is held on the stage 20 while being held on the ring frame 22.
  • the wafer W attached to the adhesive sheet 21 is bonded onto the adhesive sheet 21 in a state where a plurality of chips 23 formed on the wafer W are diced and divided into individual chips.
  • a stage 20 provided separately from the pickup device 10 may be used. That is, the pickup device 10 has at least an upper collet 30 and a lower collet 40.
  • the upper collet 30 and the lower collet 40 are configured so as to sandwich the chip 23 attached to the adhesive sheet 21 held on the stage 20 from above and below, that is, to face each other.
  • the upper collet 30 and the lower collet 40 are provided in a configuration that can move up and down and move in a two-dimensional direction within a horizontal plane, respectively.
  • the upper collet driving mechanism 32 and the lower collet driving mechanism 42 described later It is moved in a two-dimensional direction in the horizontal plane. Then, the upper collet driving mechanism 32 and the lower collet driving mechanism 42 are positioned so that the central axes of the upper collet 30 and the lower collet 40 coincide with the center of the chip 23 to be picked up.
  • the upper collet 30 and the lower collet 40 correspond to the first suction part and the second suction part in the present invention, respectively.
  • the pickup device 10 may be configured such that the configuration shown in FIG.
  • the upper collet 30 has an upper collet body 31, an upper collet drive mechanism 32, and an upper collet exhaust mechanism 33.
  • the upper collet drive mechanism 32 corresponds to the first drive unit in the present invention.
  • the lower surface of the upper collet lower end 34 that is, the surface on the chip 23 side, is configured to be substantially parallel to the upper surface of the chip 23, and has a shape such as a rectangle, a circle, and an ellipse in plan view.
  • the upper collet lower end portion 34 has a structure in which a peripheral side member 36 and a central side member 37 are arranged in a double manner on the central side and the peripheral side, respectively.
  • the peripheral side member 36 is an airtight member, and an opening 39 that communicates with a suction hole 38 for sucking the chip 23 in contact with the lower surface is formed on the center side of the lower surface of the peripheral side member 36.
  • the center side member 37 is provided in the vicinity of the opening 39 communicating with the suction hole 38 so as to be locked to the peripheral side member 36.
  • the center side member 37 is comprised with the porous material, and has the structure which can distribute
  • the upper collet shaft 35 holds the upper collet lower end 34.
  • the upper collet shaft portion 35 has a hollow suction hole 38 along the central axis.
  • the lower end of the suction hole 38 is connected to an opening 39 formed on the lower surface of the peripheral side member 36 via a center side member 37 formed of a porous material.
  • the upper end of the suction hole 38 is connected to the upper collet exhaust mechanism 33.
  • the upper collet exhaust mechanism 33 has an exhaust pump and a valve (not shown), and the exhaust pressure of the suction hole 38 can be adjusted by adjusting the opening of the valve at an arbitrary timing.
  • the suction hole 38 When the suction hole 38 is decompressed by the upper collet exhaust mechanism 33 in a state where the lower surface of the peripheral side member 36 is in contact with the upper surface of the chip 23, the opening 39 is sealed by the upper surface of the chip 23, and the central side member 37 and the suction hole are sealed. 38 is depressurized. As a result, the upper collet body 31 can suck the chip 23. That is, the lower surface of the peripheral side member 36 has a structure that isolates the center side member 37 and the suction hole 38 formed of the porous material inside the opening 39 from the atmosphere by contact with the upper surface of the chip 23.
  • the upper surface 45S of the lower collet upper end 45 that is, the surface on the pressure-sensitive adhesive sheet 21 side is configured substantially parallel to the sheet surface of the pressure-sensitive adhesive sheet 21, and has a shape such as a rectangle, a circle, or an ellipse in plan view. Yes.
  • the lower collet upper end portion 45 has a peripheral side member 47.
  • the peripheral side member 47 is an airtight member, and a recess 48 is formed on the center side of the upper surface 45S of the peripheral side member 47.
  • the recess 48 is used for sucking the adhesive sheet 21 brought into contact with the upper surface 45 ⁇ / b> S of the peripheral side member 47.
  • An opening 51 of a suction hole 50 for sucking the adhesive sheet 21 in contact with the upper surface 45 ⁇ / b> S of the peripheral side member 47 is formed on the bottom surface 49 of the recess 48.
  • the wafer W on which a plurality of chips 23 are formed is previously attached to an adhesive sheet 21 that is, for example, a dicing tape, and the periphery of the adhesive sheet 21 to which the wafer W is attached is attached. For example, it is held by the ring frame 22. Then, the wafer W attached to the pressure-sensitive adhesive sheet 21 is diced by a dicing apparatus (not shown), and is separated for each chip 23 while being attached to the pressure-sensitive adhesive sheet 21. Further, the pressure-sensitive adhesive sheet 21 to which the plurality of chips 23 diced are attached is fixed to the stage 20 and held, for example, while being held on the ring frame 22. At this time, the tape surface of the pressure-sensitive adhesive sheet 21 can be fixed and held on the stage 20 so as to be horizontal, for example, and the chip 23 is attached to the upper surface of the pressure-sensitive adhesive sheet 21 held horizontally. Can be arranged.
  • step S11 the position of the upper collet body 31 in the horizontal plane is adjusted in the state where the upper collet body 31 is above the adhesive sheet 21 fixedly held on the stage 20.
  • the position of the upper collet body 31 in the horizontal plane is adjusted by the upper collet drive mechanism 32 shown in FIG. 1 so that the center of the upper collet body 31 and the center of the chip 23 are substantially coincident with each other in plan view.
  • the upper collet body 31 whose position in the horizontal plane is adjusted in this way is lowered by the upper collet driving mechanism 32, and the upper collet body 31 is brought into contact with the upper surface of the chip 23.
  • the peripheral side member 36 of the upper collet main body 31 is in contact with the upper surface of the chip 23.
  • airtightness between the center side member 37 and the suction hole 38 of the upper collet body 31 and the upper surface of the chip 23 is ensured.
  • the upper collet exhaust mechanism 33 shown in FIG. 1 is connected to the suction hole 38 formed in the lower surface of the upper collet body 31. Then, as shown in FIG. 3B, the upper collet exhaust mechanism 33 decompresses the inside of the center side member 37 and the suction hole 38 of the upper collet main body 31 that is airtight with the upper surface of the chip 23. As a result, the upper surface of the chip 23 is sucked into the center side member 37 and the suction hole 38 of the upper collet body 31.
  • the vertical relationship between the upper collet 30 and the lower collet 40 may be opposite to that in FIG. 1, or the upper collet 30 and the lower collet 40 face each other in the horizontal direction. It may be configured as follows. In such a case, the step S13 may be anything as long as the lower collet 40 is brought close to the upper collet 30 to the adhesive sheet 21 that is fixedly held. And what is necessary is just to make the lower collet 40 brought close in this way contact the surface of the chip
  • step S ⁇ b> 17 as shown in FIG. 3G, a fluid containing a gas or a liquid between the chip 23 and the peeled adhesive sheet 21 by the needle 44 inserted between the chip 23 and the peeled adhesive sheet 21. Inject FL. As a result, the following force acts on the peeled adhesive sheet 21. That is, the pressure of the fluid FL injected between the chip 23 and the peeled adhesive sheet 21 and the suction force that sucks the peeled adhesive sheet 21 into the concave portion 48 due to the above-mentioned pressure reduction. As a result, a force for further peeling the pressure-sensitive adhesive sheet 21 from the chip 23 acts, and the pressure-sensitive adhesive sheet 21 can be completely peeled from the portion of the chip 23 facing the recess 48.
  • an incompressible fluid that is a liquid or a compressive fluid that is a gas can be used.
  • a fluid in a liquid phase state including any one or more of water such as pure water, alcohol such as ethanol, carbonated water and the like can be used.
  • a fluid in a gas phase state including any one or more of carbon dioxide (CO 2 ), nitrogen (N 2 ), and other various gases can be used.
  • the pickup device 110 includes a stage 120, an upper collet 130, and a lower collet 140.
  • the upper collet 130 has an upper collet body 131, an upper collet drive mechanism 132, and an upper collet exhaust mechanism 133.
  • the lower collet 140 includes a lower collet main body 141, a lower collet driving mechanism 142, a lower collet exhaust mechanism 143, and a needle 144.
  • the adhesive sheet 21 to which the chip 23 is attached is held on the stage 120 via the ring frame 22 as in the embodiment described above with reference to FIG.
  • the lower collet 40a in the present modification includes a lower collet body 41a, a lower collet drive mechanism 42a, a lower collet exhaust mechanism 43, and a needle 44a.
  • the configurations of the lower collet body 41a and the needle 44a are shown in FIG. This is different from the above-described embodiment.
  • the needle 44a has only the needle main body 52a and the fluid supply mechanism 54. That is, the needle 44a is provided integrally with the lower collet body 41a with the tip 44aT of the needle 44a protruding from the bottom surface 49a of the recess 48a of the lower collet body 41a, and is perpendicular to the lower collet body 41a. It is not provided to be movable in the direction.
  • the needle body 52a is provided with a supply hole 55a and communicates with the opening 56a provided at the tip 44aT of the needle body 52a, as in the embodiment described above with reference to FIG. .
  • FIG. 10 is a flowchart for explaining the procedure of each step of the pickup method according to this modification.
  • 11A to 11E are schematic cross-sectional views showing the state of the pickup device 10a in each step of the pickup method according to this modification.
  • the step of fixing and holding the pressure-sensitive adhesive sheet 21 with the chip 23 affixed to the stage 20 in advance is the same as in the embodiment described above with reference to FIG. It is.
  • the upper collet lowering step (step S21), the upper collet exhausting step (step S22), and the lower collet rising step (step S23) according to the present modification are respectively related to the embodiment described above with reference to FIG.
  • the pickup method is the same as the upper collet lowering step (step S11), the upper collet exhausting step (step S12), and the lower collet rising step (step S13).
  • 11A to 11C show states of the pickup device 10a when performing the upper collet lowering step (step S21), the upper collet exhausting step (step S22), and the lower collet rising step (step S23), respectively. .
  • step S24 the space SP formed by the recess 48a of the lower collet 40a and the adhesive sheet 21 is decompressed, and the adhesive sheet 21 is sucked.
  • FIG. 11D shows the state of the pickup device 10a when performing step S24.
  • the space SP formed by the recess 48a and the adhesive sheet 21 is formed by the lower collet exhaust mechanism 43 shown in FIG. 9 connected to the suction hole 50a formed in the recess 48a. Reduce pressure. Thereby, the adhesive sheet 21 affixed to the part of the chip 23 facing the recess 48a is sucked into the recess 48a.
  • the degree of decompression of the space SP may be such that the adhesive sheet 21 attached to the portion of the chip 23 facing the recess 48a is peeled off from the chip 23 by the suction by the decompression.
  • step S14 the lower collet exhaust process (step S14), the needle insertion process (step S16), and the fluid injection process (step S17) in the pickup method according to the embodiment described above with reference to FIG. S24).
  • step S25 before the chip 23 is peeled from the adhesive sheet 21 in the upper collet raising step (step S25), the adhesive sheet 21 is sucked into the recess 48a by the lower collet 40a and the needle in step S24 as described above.
  • the fluid FL is injected between the adhesive sheet 21 and the chip 23 by 44a.
  • the adhesive sheet 21 is peeled off from the part of the chip 23 facing the recess 48a.

Abstract

This pickup method picks up a chip by means of: causing a first suction unit to approach and contact a chip that is pasted to an adhesive sheet; causing a second suction unit to which a concavity is formed on the contact surface that contacts the adhesive sheet to approach the adhesive sheet; causing the second suction unit to contact the adhesive sheet in a manner so as to face the first suction unit; causing the adhesive sheet to be pulled by means of the second suction unit, which is contacting the adhesive sheet; peeling the adhesive sheet from the portion of the chip that faces the concavity by means of injecting a fluid between the adhesive sheet and the chip by means of an injection unit; and separating the first suction unit from the adhesive sheet in the state of the chip being subjected to suction by the first suction unit.

Description

ピックアップ方法及びピックアップ装置Pickup method and pickup device
　本発明は、チップのピックアップ方法及びチップのピックアップ装置に関する。 The present invention relates to a chip pickup method and a chip pickup apparatus.
　近年、半導体デバイスの高集積化が進んでいる。ここで、高集積化した複数の半導体デバイスを水平面内で配置し、これらの半導体デバイスを配線で接続して製品化する場合、以下に述べる点が懸念される。すなわち、配線長が増大し、それにより配線の抵抗が大きくなること、また配線による信号伝送遅延が大きくなることが懸念される。 In recent years, higher integration of semiconductor devices has progressed. Here, when a plurality of highly integrated semiconductor devices are arranged in a horizontal plane and these semiconductor devices are connected by wiring to produce a product, there are concerns about the following points. That is, there is a concern that the wiring length increases, thereby increasing the resistance of the wiring and increasing the signal transmission delay due to the wiring.
　そこで、複数の半導体デバイスを積層して三次元的に配置する三次元集積技術を用いることが提案されている。この三次元集積技術においては、以下に述べる方法が提案されている。すなわち、予め集積回路を作りこんだ基板を複数のチップに分割する。そして分割によって得られた複数のチップから、分割前に行った良品判別試験によって良品であると確認されたチップを選別する。次に、このようにして選別されたチップを別の基板上に積層し、三次元積層体（以下、「スタックド・チップ」とも称する）として実装する。 Therefore, it has been proposed to use a three-dimensional integration technique in which a plurality of semiconductor devices are stacked and arranged three-dimensionally. In this three-dimensional integration technique, the following method has been proposed. In other words, a substrate on which an integrated circuit has been formed in advance is divided into a plurality of chips. And the chip | tip confirmed as non-defective product by the non-defective product discrimination | determination test performed before the division | segmentation is selected from the some chip | tip obtained by division | segmentation. Next, the chips thus selected are stacked on another substrate and mounted as a three-dimensional stacked body (hereinafter also referred to as “stacked chip”).
　通常、このようなスタックド・チップは以下のようにして製造される。まず半導体デバイスを形成した基板に、ダイシングテープまたはバックグラインドテープ等の粘着シートを、半導体デバイスが形成されているデバイス形成面側から貼り付ける。そして、このようにしてデバイス形成面に粘着シートが貼り付けられた基板を、デバイス形成面とは反対側の面、すなわち基板の裏面から所定の厚さになるまで研削して薄化する。その後、このようにして薄化した基板を粘着シートに貼り付けたままダイシング加工して個々のチップに分割する。次に、このようにして分割された個々のチップを粘着シートから取り出し、取り出したチップを積層する（例えば特許文献１参照）。 Usually, such a stacked chip is manufactured as follows. First, an adhesive sheet such as a dicing tape or a back grind tape is attached to the substrate on which the semiconductor device is formed from the device forming surface side where the semiconductor device is formed. Then, the substrate with the adhesive sheet attached to the device forming surface in this way is thinned by grinding from the surface opposite to the device forming surface, that is, from the back surface of the substrate to a predetermined thickness. Thereafter, the substrate thinned in this way is diced while being attached to the adhesive sheet, and divided into individual chips. Next, the individual chips thus divided are taken out from the adhesive sheet, and the taken-out chips are stacked (for example, see Patent Document 1).
　ここで、このような製造工程のうち、個々のチップを粘着シートから取り出す工程では、ピックアップ装置により、個々のチップが貼り付けられている粘着シートから個々にチップが剥離され、取り出される。このピックアップ装置として、粘着シートの裏面から針を突き上げてチップを取り出すニードルピックアップ装置（例えば特許文献２参照）が開示されている。また、チップを真空吸着可能なノズルをチップの表面に近づけ、当該ノズルによる真空吸着によってチップを粘着シートから取り出すニードルレスピックアップ装置（例えば特許文献３参照）が開示されている。 Here, in such a manufacturing process, in the process of taking out individual chips from the pressure-sensitive adhesive sheet, the chips are individually peeled off from the pressure-sensitive adhesive sheet to which the individual chips are attached by the pickup device and taken out. As this pickup device, a needle pickup device (see, for example, Patent Document 2) that picks up a chip by pushing up a needle from the back surface of an adhesive sheet is disclosed. Further, there is disclosed a needleless pickup device (see, for example, Patent Document 3) in which a nozzle capable of vacuum-sucking a chip is brought close to the surface of the chip and the chip is taken out from an adhesive sheet by vacuum suction using the nozzle.
特開２０１０－０５６５３１号公報JP 2010-056531 A 特開昭６０－１０２７５４号公報JP 60-102754 A 特開２００４－０３９７２２号公報JP 2004-039722 A
　しかしながら、このような、個々のチップを粘着シートから取り出す、すなわちピックアップするピックアップ装置及びピックアップ方法については、以下のような問題点が考えられる。 However, the following problems are conceivable with respect to such a pickup apparatus and pickup method for taking out, that is, picking up, individual chips from the adhesive sheet.
　すなわち、薄化したチップをピックアップする場合、粘着シートからチップを短時間で剥離させると、チップに材料強度を超える応力が加えられ、チップが破壊される場合が懸念される。このような事態を回避するための方法として、例えば、粘着シートからチップを剥離させる時間をより長くし、剥離の際にチップに加えられる応力を低減する方法が考えられる。 That is, when picking up a thinned chip, there is a concern that if the chip is peeled off from the adhesive sheet in a short time, stress exceeding the material strength is applied to the chip and the chip is destroyed. As a method for avoiding such a situation, for example, a method of increasing the time for peeling the chip from the pressure-sensitive adhesive sheet and reducing the stress applied to the chip at the time of peeling can be considered.
　しかし、このように粘着シートからチップを剥離させる時間を長くした場合、チップの面内には、粘着シートから剥離している部分と粘着シートから剥離していない部分とが同時に存在する。そして、チップの面内における粘着シートから剥離している部分と粘着シートから剥離していない部分との分布に起因して、チップ面内においてチップに加えられる応力の分布が生じる。ここで、当該分布においてチップに加えられる応力が最も強い部分でチップが破壊される場合が懸念される。すなわち、チップに加えられる応力が、チップの平面の寸法及び厚さの寸法で決まるチップの形状、及び、例えばシリコン等であるチップの材料の材料強度によって決定される破壊強度を超える場合、チップは破壊されるおおそれがある。 However, when the time for peeling the chip from the pressure-sensitive adhesive sheet is lengthened in this way, a part peeled off from the pressure-sensitive adhesive sheet and a part not peeled off from the pressure-sensitive adhesive sheet simultaneously exist in the surface of the chip. And distribution of the stress added to a chip | tip arises in a chip | tip surface resulting from distribution of the part which has peeled from the adhesive sheet in the surface of a chip | tip, and the part which has not peeled from the adhesive sheet. Here, there is a concern that the chip is broken at a portion where the stress applied to the chip is the strongest in the distribution. That is, if the stress applied to the chip exceeds the chip shape determined by the planar dimensions and thickness dimensions of the chip, and the fracture strength determined by the material strength of the chip material, such as silicon, the chip will There is a risk of being destroyed.
　例えば、粘着シートから剥離している部分と粘着シートから剥離していない部分との境界面にはせん断応力が作用し、そのせん断応力はチップの平面の寸法及び厚さの寸法で決まるチップの形状に依存する。そして、せん断応力がチップのせん断破壊強度（せん断強度）を超えるとチップは破壊されるおそれがある。 For example, a shear stress acts on the boundary surface between the part peeled off from the pressure-sensitive adhesive sheet and the part not peeled off from the pressure-sensitive adhesive sheet, and the shear stress is determined by the size of the chip plane and the thickness of the chip. Depends on. If the shear stress exceeds the shear fracture strength (shear strength) of the chip, the chip may be destroyed.
　このように、単純に粘着シートからチップを剥離させる剥離時間を長くするだけでは、チップの形状によってはチップに加わる応力が材料強度よりも大きくなることを防止できない場合が懸念される。従って、チップが破壊されずにピックアップできる、チップの形状が、制限されるという問題がある。 As described above, there is a concern that the stress applied to the chip cannot be prevented from becoming larger than the material strength depending on the shape of the chip only by lengthening the peeling time for peeling the chip from the adhesive sheet. Therefore, there is a problem that the shape of the chip that can be picked up without being broken is limited.
　本発明は上記の点に鑑みてなされたものである。すなわち本発明は、薄化したチップをピックアップする場合において、粘着シートに貼り付けられているチップをピックアップする際にチップに加えられる応力負荷を低減でき、チップの破壊を防止できる、チップのピックアップ方法及びピックアップ装置を提供する。 The present invention has been made in view of the above points. That is, the present invention provides a chip pickup method capable of reducing stress load applied to a chip when picking up a chip attached to an adhesive sheet when picking up a thinned chip and preventing chip breakage. And a pickup device.
　上記の課題を解決するために本発明では、次に述べる各手段を講じたことを特徴とするものである。 In order to solve the above-mentioned problems, the present invention is characterized by taking the following means.
　本発明の一実施例によれば、以下に述べるピックアップ方法が提供される。当該ピックアップ方法では、粘着シートに貼り付けられているチップに第１の吸着部を近づけて接触させるとともに、粘着シートに接触する接触面に凹部が形成されている第２の吸着部を粘着シートに近づけ、第１の吸着部と対向するように粘着シートに第２の吸着部を接触させる。そして粘着シートに接触している第２の吸着部により粘着シートを吸引するとともに、粘着シートとチップとの間に注入部により流体を注入する。このようにしてチップの、凹部に対向する部分から粘着シートを剥離させ、第１の吸着部によりチップを吸着している状態で、第２の吸着部が吸引している粘着シートから第１の吸着部を遠ざける。このようにしてチップを粘着シートから剥離させてピックアップする。 According to one embodiment of the present invention, the following pickup method is provided. In the pick-up method, the first adsorbing portion is brought close to and in contact with the chip attached to the adhesive sheet, and the second adsorbing portion in which a concave portion is formed on the contact surface contacting the adhesive sheet is used as the adhesive sheet. The second suction part is brought into contact with the pressure-sensitive adhesive sheet so as to approach the first suction part. Then, the pressure-sensitive adhesive sheet is sucked by the second suction part in contact with the pressure-sensitive adhesive sheet, and fluid is injected between the pressure-sensitive adhesive sheet and the chip by the injection part. In this manner, the adhesive sheet is peeled off from the portion of the chip facing the recess, and the first adsorption unit sucks the chip from the adhesive sheet sucked by the second adsorption unit. Keep the adsorption part away. In this way, the chip is separated from the adhesive sheet and picked up.
　また、本発明の一実施例によれば、チップを吸着する第１の吸着部と、第１の吸着部を移動するように駆動する第１の駆動部と、粘着シートに接触する接触面に凹部が形成されており粘着シートを吸引する第２の吸着部と、第２の吸着部を移動するように駆動する第２の駆動部と、流体を注入する注入部と、制御部とを有するピックアップ装置が提供される。ここで、制御部は、第１の駆動部により、粘着シートに貼り付けられているチップに第１の吸着部を近づけて接触させるとともに、第２の駆動部により、第２の吸着部を粘着シートに近づけ、第１の吸着部と対向するように粘着シートに第２の吸着部を接触させる。そして制御部は、粘着シートに接触している第２の吸着部により粘着シートを吸引するとともに、粘着シートとチップとの間に注入部により流体を注入することによって、チップの、凹部に対向する部分から、粘着シートを剥離させる。そして制御部は、第１の吸着部によりチップを吸着している状態で、第１の駆動部により、第２の吸着部が吸引している粘着シートから第１の吸着部を遠ざけることによって、チップを粘着シートから剥離させてピックアップする。 In addition, according to one embodiment of the present invention, the first suction part that sucks the chip, the first drive part that drives the first suction part to move, and the contact surface that contacts the adhesive sheet. It has a second suction part that is formed with a recess and sucks the adhesive sheet, a second drive part that drives to move the second suction part, an injection part that injects fluid, and a control part A pickup device is provided. Here, the control unit causes the first drive unit to bring the first suction unit into close contact with the chip attached to the adhesive sheet, and causes the second drive unit to stick the second suction unit. The second suction part is brought into contact with the adhesive sheet so as to be close to the sheet and face the first suction part. And a control part opposes the recessed part of a chip | tip by attracting | sucking an adhesive sheet by the 2nd adsorption | suction part which is contacting the adhesive sheet, and inject | pouring a fluid with an injection | pouring part between an adhesive sheet and a chip | tip. The adhesive sheet is peeled from the part. And the control part is in a state where the chip is adsorbed by the first adsorbing part, by moving the first adsorbing part away from the adhesive sheet sucked by the second adsorbing part by the first driving part, The chip is peeled off from the adhesive sheet and picked up.
　本発明によれば、薄化したチップをピックアップする場合でも、粘着シートに貼り付けられているチップをピックアップする際にチップに加えられる応力負荷を低減でき、チップの破壊を防止できる。 According to the present invention, even when a thinned chip is picked up, the stress load applied to the chip when picking up the chip attached to the adhesive sheet can be reduced, and the chip can be prevented from being broken.
実施の形態に係るピックアップ装置の概略断面図である。It is a schematic sectional drawing of the pick-up apparatus which concerns on embodiment. 実施の形態に係るピックアップ方法の各工程の手順を説明するためのフローチャートである。It is a flowchart for demonstrating the procedure of each process of the pick-up method which concerns on embodiment. 実施の形態に係るピックアップ方法の各工程におけるピックアップ装置の状態を示す概略断面図である（その１）。It is a schematic sectional drawing which shows the state of the pick-up apparatus in each process of the pick-up method which concerns on embodiment (the 1). 実施の形態に係るピックアップ方法の各工程におけるピックアップ装置の状態を示す概略断面図である（その２）。It is a schematic sectional drawing which shows the state of the pick-up apparatus in each process of the pick-up method which concerns on embodiment (the 2). 実施の形態に係るピックアップ方法の各工程におけるピックアップ装置の状態を示す概略断面図である（その３）。It is a schematic sectional drawing which shows the state of the pick-up apparatus in each process of the pick-up method which concerns on embodiment (the 3). 実施の形態に係るピックアップ方法の各工程におけるピックアップ装置の状態を示す概略断面図である（その４）。It is a schematic sectional drawing which shows the state of the pick-up apparatus in each process of the pick-up method which concerns on embodiment (the 4). 実施の形態に係るピックアップ方法の各工程におけるピックアップ装置の状態を示す概略断面図である（その５）。It is a schematic sectional drawing which shows the state of the pick-up apparatus in each process of the pick-up method which concerns on embodiment (the 5). 実施の形態に係るピックアップ方法の各工程におけるピックアップ装置の状態を示す概略断面図である（その６）。It is a schematic sectional drawing which shows the state of the pick-up apparatus in each process of the pick-up method which concerns on embodiment (the 6). 実施の形態に係るピックアップ方法の各工程におけるピックアップ装置の状態を示す概略断面図である（その７）。It is a schematic sectional drawing which shows the state of the pick-up apparatus in each process of the pick-up method which concerns on embodiment (the 7). 実施の形態に係るピックアップ方法の各工程におけるピックアップ装置の状態を示す概略断面図である（その８）。It is a schematic sectional drawing which shows the state of the pick-up apparatus in each process of the pick-up method which concerns on embodiment (the 8). 比較例に係るピックアップ装置の構成を模式的に示す縦断面図である。It is a longitudinal cross-sectional view which shows typically the structure of the pick-up apparatus which concerns on a comparative example. ３つの状態のうちの一の状態における、上コレット上昇工程（ステップＳ１８）でチップに働く剥離力の時間変化を示すグラフである。It is a graph which shows the time change of the peeling force which acts on a chip | tip in the upper collet raising process (step S18) in one state of three states. ３つの状態のうちの他の状態における、上コレット上昇工程（ステップＳ１８）でチップに働く剥離力の時間変化を示すグラフである。It is a graph which shows the time change of the peeling force which acts on a chip | tip in the upper collet raising process (step S18) in the other state of three states. ３つの状態のうちのさらに他の状態における、上コレット上昇工程（ステップＳ１８）でチップに働く剥離力の時間変化を示すグラフである。It is a graph which shows the time change of the peeling force which acts on a chip | tip in the upper collet raising process (step S18) in the other state of three states. 上コレット上昇工程（ステップＳ１８）におけるチップに働くせん断応力を説明するためのピックアップ装置の縦断面図である。It is a longitudinal cross-sectional view of the pick-up apparatus for demonstrating the shear stress which acts on the chip | tip in an upper collet raising process (step S18). 上コレット上昇工程（ステップＳ１８）においてチップに働くせん断応力を説明するためのチップの平面図である。It is a top view of the chip | tip for demonstrating the shear stress which acts on a chip | tip in an upper collet raising process (step S18). 上コレット上昇工程（ステップＳ１８）においてチップに働くせん断応力のせん断面積を説明するためのチップの斜視図である。It is a perspective view of the chip | tip for demonstrating the shear area of the shear stress which acts on a chip | tip in an upper collet raising process (step S18). 実施の形態の変形例に係るピックアップ装置の概略断面図である。It is a schematic sectional drawing of the pick-up apparatus which concerns on the modification of embodiment. 実施の形態の変形例に係るピックアップ方法の各工程の手順を説明するためのフローチャートである。It is a flowchart for demonstrating the procedure of each process of the pick-up method which concerns on the modification of embodiment. 実施の形態の変形例に係るピックアップ方法の各工程におけるピックアップ装置の状態を示す概略断面図である（その１）。It is a schematic sectional drawing which shows the state of the pick-up apparatus in each process of the pick-up method which concerns on the modification of embodiment (the 1). 実施の形態の変形例に係るピックアップ方法の各工程におけるピックアップ装置の状態を示す概略断面図である（その２）。It is a schematic sectional drawing which shows the state of the pick-up apparatus in each process of the pick-up method which concerns on the modification of embodiment (the 2). 実施の形態の変形例に係るピックアップ方法の各工程におけるピックアップ装置の状態を示す概略断面図である（その３）。It is a schematic sectional drawing which shows the state of the pick-up apparatus in each process of the pick-up method which concerns on the modification of embodiment (the 3). 実施の形態の変形例に係るピックアップ方法の各工程におけるピックアップ装置の状態を示す概略断面図である（その４）。It is a schematic sectional drawing which shows the state of the pick-up apparatus in each process of the pick-up method which concerns on the modification of embodiment (the 4). 実施の形態の変形例に係るピックアップ方法の各工程におけるピックアップ装置の状態を示す概略断面図である（その５）。It is a schematic sectional drawing which shows the state of the pick-up apparatus in each process of the pick-up method which concerns on the modification of embodiment (the 5).
　次に、本発明を実施するための形態について図面と共に説明する。
 
（実施の形態）
　最初に、図１から図８を参照し、本発明の実施の形態に係るピックアップ装置及びピックアップ方法について説明する。 Next, a mode for carrying out the present invention will be described with reference to the drawings.

(Embodiment)
First, a pickup apparatus and a pickup method according to an embodiment of the present invention will be described with reference to FIGS.
　初めに、図１を参照し、本実施の形態に係るピックアップ装置について説明する。図１は、本実施の形態に係るピックアップ装置１０の概略断面図である。 First, the pickup device according to the present embodiment will be described with reference to FIG. FIG. 1 is a schematic cross-sectional view of a pickup device 10 according to the present embodiment.
　ピックアップ装置１０は、ステージ２０、上コレット３０、下コレット４０及び制御部６０を有する。 The pickup apparatus 10 includes a stage 20, an upper collet 30, a lower collet 40, and a control unit 60.
　ステージ２０は、水平に設置されている。ウェハＷが貼り付けられた、例えばダイシングテープである粘着シート２１が、リングフレーム２２に保持された状態で、ステージ２０に保持されている。粘着シート２１に貼り付けられたウェハＷは、ウェハＷに形成された複数のチップ２３がダイシング加工され、個々のチップに分割された状態で、粘着シート２１上に接着されている。 The stage 20 is installed horizontally. An adhesive sheet 21, for example, a dicing tape, to which the wafer W is attached, is held on the stage 20 while being held on the ring frame 22. The wafer W attached to the adhesive sheet 21 is bonded onto the adhesive sheet 21 in a state where a plurality of chips 23 formed on the wafer W are diced and divided into individual chips.
　なお、ステージ２０は、ピックアップ装置１０と別に設けられているものを使用してもよい。すなわち、ピックアップ装置１０は、少なくとも上コレット３０及び下コレット４０を有するものである。 It should be noted that a stage 20 provided separately from the pickup device 10 may be used. That is, the pickup device 10 has at least an upper collet 30 and a lower collet 40.
　上コレット３０と下コレット４０とは、ステージ２０に保持されている粘着シート２１に貼り付けられているチップ２３を上下から挟み込むように、すなわち互いに対向するように構成されている。上コレット３０及び下コレット４０は、それぞれ上下動及び水平面内で二次元の方向に移動が可能な構成で設けられており、後述する上コレット駆動機構３２及び下コレット駆動機構４２により、上下方向及び水平面内で二次元の方向に移動される。そして、上コレット駆動機構３２及び下コレット駆動機構４２により、上コレット３０と下コレット４０の中心軸が、ピックアップされるチップ２３の中心に一致するように位置決めされる。 The upper collet 30 and the lower collet 40 are configured so as to sandwich the chip 23 attached to the adhesive sheet 21 held on the stage 20 from above and below, that is, to face each other. The upper collet 30 and the lower collet 40 are provided in a configuration that can move up and down and move in a two-dimensional direction within a horizontal plane, respectively. The upper collet driving mechanism 32 and the lower collet driving mechanism 42 described later It is moved in a two-dimensional direction in the horizontal plane. Then, the upper collet driving mechanism 32 and the lower collet driving mechanism 42 are positioned so that the central axes of the upper collet 30 and the lower collet 40 coincide with the center of the chip 23 to be picked up.
　なお、上コレット３０及び下コレット４０は、それぞれ、本発明における第１の吸着部及び第２の吸着部に相当する。また、ピックアップ装置１０は、図１に示す構成を９０°回転して横に倒した構成にしてもよく、上下反転した構成にしてもよい。 In addition, the upper collet 30 and the lower collet 40 correspond to the first suction part and the second suction part in the present invention, respectively. In addition, the pickup device 10 may be configured such that the configuration shown in FIG.
　上コレット３０は、上コレット本体部３１、上コレット駆動機構３２、及び上コレット排気機構３３を有する。上コレット駆動機構３２は、本発明における第１の駆動部に相当する。 The upper collet 30 has an upper collet body 31, an upper collet drive mechanism 32, and an upper collet exhaust mechanism 33. The upper collet drive mechanism 32 corresponds to the first drive unit in the present invention.
　上コレット本体部３１は、上コレット下端部３４及び上コレット軸部３５を有する。上コレット本体部３１は、上コレット駆動機構３２の下端に取り付けられた構造体であり、水平面内での移動が可能であり、かつ垂直方向の移動が可能な構成で設けられている。そして、上コレット本体部３１は、上コレット駆動機構３２により、水平面内で移動するように駆動されるとともに垂直方向に移動するように駆動される。 The upper collet body 31 has an upper collet lower end 34 and an upper collet shaft 35. The upper collet main body 31 is a structure attached to the lower end of the upper collet drive mechanism 32, and is provided in a configuration that can move in a horizontal plane and can move in the vertical direction. The upper collet body 31 is driven by the upper collet driving mechanism 32 to move in the horizontal plane and to move in the vertical direction.
　上コレット下端部３４の下面、すなわちチップ２３側の表面は、チップ２３の上面に略平行に構成されており、平面視において例えば矩形、円形、楕円形等の形状を有している。上コレット下端部３４は、中心側及び周縁側に、それぞれ周縁側部材３６及び中心側部材３７を２重に配置した構造を有している。周縁側部材３６は、気密性の部材であり、周縁側部材３６の下面の中心側に、下面に接触したチップ２３を吸引するための吸引孔３８と連通する開口３９が形成されている。中心側部材３７は、吸引孔３８と連通する開口３９付近に、周縁側部材３６に係止されるように設けられている。中心側部材３７は、多孔質材料により構成されており、多孔質材料の内部の微細な孔を通って気体が流通可能な構成を有する。 The lower surface of the upper collet lower end 34, that is, the surface on the chip 23 side, is configured to be substantially parallel to the upper surface of the chip 23, and has a shape such as a rectangle, a circle, and an ellipse in plan view. The upper collet lower end portion 34 has a structure in which a peripheral side member 36 and a central side member 37 are arranged in a double manner on the central side and the peripheral side, respectively. The peripheral side member 36 is an airtight member, and an opening 39 that communicates with a suction hole 38 for sucking the chip 23 in contact with the lower surface is formed on the center side of the lower surface of the peripheral side member 36. The center side member 37 is provided in the vicinity of the opening 39 communicating with the suction hole 38 so as to be locked to the peripheral side member 36. The center side member 37 is comprised with the porous material, and has the structure which can distribute | circulate gas through the fine hole inside a porous material.
　上コレット軸部３５は、上コレット下端部３４を保持するものである。上コレット軸部３５は、中心軸に沿って中空の吸引孔３８を有している。吸引孔３８の下端は、多孔質材料で形成された中心側部材３７を介して、周縁側部材３６の下面に形成された開口３９に接続されている。吸引孔３８の上端は、上コレット排気機構３３に接続されている。上コレット排気機構３３は、図示しない排気ポンプ及びバルブを有しており、任意のタイミングでバルブの開度を調整することで、吸引孔３８の排気圧を調整することが可能である。 The upper collet shaft 35 holds the upper collet lower end 34. The upper collet shaft portion 35 has a hollow suction hole 38 along the central axis. The lower end of the suction hole 38 is connected to an opening 39 formed on the lower surface of the peripheral side member 36 via a center side member 37 formed of a porous material. The upper end of the suction hole 38 is connected to the upper collet exhaust mechanism 33. The upper collet exhaust mechanism 33 has an exhaust pump and a valve (not shown), and the exhaust pressure of the suction hole 38 can be adjusted by adjusting the opening of the valve at an arbitrary timing.
　周縁側部材３６の下面がチップ２３の上面と接触した状態で上コレット排気機構３３により吸引孔３８が減圧されるときは、チップ２３の上面によって開口３９が封じられて中心側部材３７及び吸引孔３８が減圧される。その結果、上コレット本体部３１はチップ２３を吸着することができる。すなわち、周縁側部材３６の下面は、チップ２３の上面との接触によって、開口３９の内部の多孔質材料で形成された中心側部材３７及び吸引孔３８を大気から隔離する構造を有する。従って、上コレット本体部３１は、上コレット下端部３４に形成された開口３９にチップ２３を吸着させた状態で、上コレット本体部３１を上コレット駆動機構３２により上方に移動して、チップ２３をピックアップする。このように、上コレット本体部３１は、チップ２３をピックアップするときも、チップ２３を吸着して保持することができる。 When the suction hole 38 is decompressed by the upper collet exhaust mechanism 33 in a state where the lower surface of the peripheral side member 36 is in contact with the upper surface of the chip 23, the opening 39 is sealed by the upper surface of the chip 23, and the central side member 37 and the suction hole are sealed. 38 is depressurized. As a result, the upper collet body 31 can suck the chip 23. That is, the lower surface of the peripheral side member 36 has a structure that isolates the center side member 37 and the suction hole 38 formed of the porous material inside the opening 39 from the atmosphere by contact with the upper surface of the chip 23. Accordingly, the upper collet main body 31 moves the upper collet main body 31 upward by the upper collet driving mechanism 32 in a state where the chip 23 is adsorbed to the opening 39 formed in the upper collet lower end 34. To pick up. Thus, the upper collet body 31 can suck and hold the chip 23 even when the chip 23 is picked up.
　下コレット４０は、下コレット本体部４１、下コレット駆動機構４２、下コレット排気機構４３、及びニードル４４を有する。下コレット駆動機構４２は、本発明における第２の駆動部に相当する。 The lower collet 40 includes a lower collet body 41, a lower collet driving mechanism 42, a lower collet exhaust mechanism 43, and a needle 44. The lower collet drive mechanism 42 corresponds to the second drive unit in the present invention.
　下コレット本体部４１は、下コレット上端部４５及び下コレット軸部４６を有する。下コレット本体部４１は、下コレット駆動機構４２の上端に取り付けられた構造体であり、水平面内での移動が可能であり、かつ垂直方向に移動が可能な構成で設けられている。なお、チップ２３が貼り付けられた粘着シート２１を保持するステージ２０が、粘着シート２１を水平面内で移動させることが可能な構成で設けられている場合がある。その場合には、下コレット本体部４１は、水平面内での移動が可能な構成で設けられていなくてもよい。 The lower collet body 41 has a lower collet upper end 45 and a lower collet shaft 46. The lower collet main body 41 is a structure attached to the upper end of the lower collet drive mechanism 42, and is configured to be movable in a horizontal plane and movable in the vertical direction. In addition, the stage 20 holding the adhesive sheet 21 to which the chip 23 is attached may be provided in a configuration capable of moving the adhesive sheet 21 in a horizontal plane. In that case, the lower collet body 41 may not be provided in a configuration that can move in a horizontal plane.
　下コレット上端部４５の上面４５Ｓ、すなわち粘着シート２１側の表面は、粘着シート２１のシート面に略平行に構成されており、平面視において例えば矩形、円形、楕円形等の形状を有している。下コレット上端部４５は、周縁側部材４７を有する。周縁側部材４７は気密性の部材であり、周縁側部材４７の上面４５Ｓの中心側に開口された凹部４８が形成されている。凹部４８は、周縁側部材４７の上面４５Ｓに接触させた粘着シート２１を吸引するために使用される。凹部４８の底面４９には、周縁側部材４７の上面４５Ｓに接触した粘着シート２１を吸引するための吸引孔５０の開口５１が形成されている。 The upper surface 45S of the lower collet upper end 45, that is, the surface on the pressure-sensitive adhesive sheet 21 side is configured substantially parallel to the sheet surface of the pressure-sensitive adhesive sheet 21, and has a shape such as a rectangle, a circle, or an ellipse in plan view. Yes. The lower collet upper end portion 45 has a peripheral side member 47. The peripheral side member 47 is an airtight member, and a recess 48 is formed on the center side of the upper surface 45S of the peripheral side member 47. The recess 48 is used for sucking the adhesive sheet 21 brought into contact with the upper surface 45 </ b> S of the peripheral side member 47. An opening 51 of a suction hole 50 for sucking the adhesive sheet 21 in contact with the upper surface 45 </ b> S of the peripheral side member 47 is formed on the bottom surface 49 of the recess 48.
　なお、下コレット上端部４５は、後述するように、その上面４５Ｓで粘着シート２１に接触する。従って、下コレット上端部４５の上面４５Ｓは、本発明における、粘着シートに接触する接触面に相当する。 In addition, the lower collet upper end part 45 contacts the adhesive sheet 21 on its upper surface 45S, as will be described later. Therefore, the upper surface 45S of the lower collet upper end portion 45 corresponds to a contact surface in contact with the adhesive sheet in the present invention.
　下コレット軸部４６は、下コレット上端部４５を保持するものである。下コレット軸部４６は、中心軸に沿って中空の吸引孔５０を有している。吸引孔５０の上端は、凹部４８の底面４９に形成された開口５１に接続されている。吸引孔５０の下端は、下コレット排気機構４３に接続されている。下コレット排気機構４３は、図示しない排気ポンプ及びバルブを有しており、任意のタイミングでバルブの開度を調整することで、吸引孔５０の排気圧を調整することが可能である。 The lower collet shaft 46 holds the upper end 45 of the lower collet. The lower collet shaft portion 46 has a hollow suction hole 50 along the central axis. The upper end of the suction hole 50 is connected to an opening 51 formed in the bottom surface 49 of the recess 48. The lower end of the suction hole 50 is connected to the lower collet exhaust mechanism 43. The lower collet exhaust mechanism 43 has an exhaust pump and a valve (not shown), and the exhaust pressure of the suction hole 50 can be adjusted by adjusting the opening of the valve at an arbitrary timing.
　周縁側部材４７の上面４５Ｓが粘着シート２１の下面と接触した状態で下コレット排気機構４３により吸引孔５０が減圧されると、粘着シート２１の下面によって開口が封じられた凹部４８及び吸引孔５０が減圧される。その結果、下コレット本体部４１は、粘着シート２１を凹部４８に吸着する。すなわち、周縁側部材４７の上面４５Ｓは、粘着シート２１の下面との接触によって、凹部４８及び吸引孔５０を大気から隔離する構造を有する。その結果、上コレット下端部３４に形成された開口３９にチップ２３を吸着させた状態でチップ２３をピックアップするときも、下コレット本体部４１は凹部４８により粘着シート２１を吸着して保持することができる。なお、チップ２３のピックアップは、上コレット下端部３４に形成された開口３９にチップ２３を吸着させた状態で、上コレット本体部３１を上コレット駆動機構３２により上方に移動して行う。 When the suction hole 50 is depressurized by the lower collet exhaust mechanism 43 in a state where the upper surface 45S of the peripheral side member 47 is in contact with the lower surface of the adhesive sheet 21, the recess 48 and the suction hole 50 whose opening is sealed by the lower surface of the adhesive sheet 21. Is depressurized. As a result, the lower collet body 41 adsorbs the adhesive sheet 21 to the recess 48. That is, the upper surface 45S of the peripheral side member 47 has a structure that isolates the recess 48 and the suction hole 50 from the atmosphere by contact with the lower surface of the adhesive sheet 21. As a result, even when the chip 23 is picked up with the chip 23 adsorbed in the opening 39 formed in the upper collet lower end 34, the lower collet body 41 adsorbs and holds the adhesive sheet 21 by the recess 48. Can do. The chip 23 is picked up by moving the upper collet body 31 upward by the upper collet driving mechanism 32 in a state where the chip 23 is adsorbed to the opening 39 formed in the upper collet lower end 34.
　ニードル４４は、ニードル本体部５２、ニードル駆動機構５３、及び流体供給機構５４を有する。ニードル４４は、本発明における注入部に相当する。 The needle 44 has a needle main body 52, a needle drive mechanism 53, and a fluid supply mechanism 54. The needle 44 corresponds to the injection part in the present invention.
　ニードル４４は、下コレット本体部４１に取り付けられた構造体であり、垂直方向に移動が可能な構成で設けられている。そして、ニードル本体部５２は、ニードル駆動機構５３により、垂直方向に移動するように駆動される。 The needle 44 is a structure attached to the lower collet main body 41 and is configured to be movable in the vertical direction. The needle body 52 is driven by the needle drive mechanism 53 so as to move in the vertical direction.
　ニードル４４の先端４４Ｔには開口５６が形成されている。開口５６は供給孔５５と連通する。供給孔５５は、チップ２３と、チップ２３から剥離した粘着シート２１との間に、気体または液体である流体を注入するために流体を供給するためのものである。ニードル４４は、中心軸に沿って中空の供給孔５５を有している。供給孔５５の上端は、ニードル４４の先端４４Ｔに形成された開口５６に接続されている。供給孔５５の下端は、流体供給機構５４に接続されている。 An opening 56 is formed at the tip 44T of the needle 44. The opening 56 communicates with the supply hole 55. The supply hole 55 is for supplying a fluid for injecting a fluid that is a gas or a liquid between the chip 23 and the adhesive sheet 21 peeled from the chip 23. The needle 44 has a hollow supply hole 55 along the central axis. The upper end of the supply hole 55 is connected to an opening 56 formed at the tip 44 </ b> T of the needle 44. The lower end of the supply hole 55 is connected to the fluid supply mechanism 54.
　上記したように、周縁側部材４７の上面４５Ｓに粘着シート２１の下面が接触することによって、凹部４８の開口４８Ｋが粘着シート２１で塞がれ、空間ＳＰが形成される（後述する図３Ｄ参照）。凹部４８の開口４８Ｋも、平面視において例えば矩形、円形、楕円形等の形状を有している。例えば、チップ２３が平面視で矩形の形状を有するものとし、凹部４８の開口４８Ｋの形状を矩形とし、チップ２３の平面の寸法をＬ１とし、凹部４８の開口４８Ｋの寸法をＬ２とすると、空間ＳＰを形成するために、Ｌ２＜Ｌ１であることが好ましい。例えばＬ１を１０ｍｍとすると、Ｌ２を例えば９ｍｍとすることができる。なお、このＬ２の値は、後述するように、チップ２３に作用するせん断応力がチップ２３のせん断破壊強度（せん断強度）と等しくなるような所定値よりも大きい値である。 As described above, when the lower surface of the adhesive sheet 21 comes into contact with the upper surface 45S of the peripheral side member 47, the opening 48K of the recess 48 is closed with the adhesive sheet 21, and a space SP is formed (see FIG. 3D described later). ). The opening 48K of the recess 48 also has a shape such as a rectangle, a circle, and an ellipse in plan view. For example, if the chip 23 has a rectangular shape in plan view, the shape of the opening 48K of the recess 48 is rectangular, the dimension of the plane of the chip 23 is L1, and the dimension of the opening 48K of the recess 48 is L2. In order to form SP, it is preferable that L2 <L1. For example, if L1 is 10 mm, L2 can be 9 mm, for example. Note that the value of L2 is larger than a predetermined value such that the shear stress acting on the chip 23 becomes equal to the shear fracture strength (shear strength) of the chip 23, as will be described later.
　一方、凹部４８の深さの寸法Ｈ１は、粘着シート２１をチップ２３の下面から剥離させて凹部４８に吸引することができ、吸引した粘着シート２１とチップ２３の下面との間にニードル４４を挿入して流体を注入できるような寸法であることが好ましい。 On the other hand, the depth dimension H1 of the recess 48 allows the adhesive sheet 21 to be peeled from the lower surface of the chip 23 and sucked into the recess 48, and the needle 44 is interposed between the sucked adhesive sheet 21 and the lower surface of the chip 23. The dimensions are preferably such that the fluid can be inserted and injected.
　ニードル４４の先端４４Ｔは、吸引した粘着シート２１を容易に貫通できるように、水平面に対して所定のテーパ角で切断されたような端面を有していてもよい。ニードル４４の外径を１ｍｍφ、テーパ角を４５°とすると、端面の上端と下端との間の高低差Ｈｎは、Ｈｎ＝１ｍｍ×ｔａｎ４５°＝１ｍｍとなる。ニードル４４の上下動に伴うマージンＨｍを４ｍｍ程度と考慮すると、凹部４８は、ニードル４４の端面の高低差Ｈｎ＝１ｍｍとマージンＨｍ＝４ｍｍとの合計である５ｍｍ程度の深さの寸法Ｈ１を有することが好ましい。 The tip 44T of the needle 44 may have an end face that is cut at a predetermined taper angle with respect to a horizontal plane so that the sucked adhesive sheet 21 can be easily penetrated. When the outer diameter of the needle 44 is 1 mmφ and the taper angle is 45 °, the height difference Hn between the upper end and the lower end of the end face is Hn = 1 mm × tan 45 ° = 1 mm. Considering that the margin Hm accompanying the vertical movement of the needle 44 is about 4 mm, the recess 48 has a dimension H1 having a depth of about 5 mm, which is the sum of the height difference Hn = 1 mm of the end face of the needle 44 and the margin Hm = 4 mm. It is preferable.
　以上より、凹部４８は、例えば、開口４８Ｋの形状が矩形の形状であるときは、開口４８Ｋの寸法Ｌ２が９ｍｍ、深さの寸法が５ｍｍの角錐台状の形状とすることができる。また、その他、凹部４８の開口４８Ｋの形状が円、楕円であってもよく、その場合は、凹部４８は、円錐台状、楕円錐台状の形状を有していてもよい。 Thus, for example, when the shape of the opening 48K is a rectangular shape, the recess 48 can have a truncated pyramid shape with a dimension L2 of the opening 48K of 9 mm and a depth of 5 mm. In addition, the shape of the opening 48K of the concave portion 48 may be a circle or an ellipse. In this case, the concave portion 48 may have a truncated cone shape or an elliptic truncated cone shape.
　下コレット本体部４１には、例えば超音波振動子等である振動部５７が設けられていてもよい。振動部５７が設けられているときは、振動部５７が振動することによって下コレット本体部４１が振動する。従って下コレット本体部４１がチップ２３に粘着シート２１を介して接触している状態で振動部５７を振動させることによって、チップ２３が貼り付けられている粘着シート２１に振動を付与することができる。粘着シート２１に振動を付与することによって、例えば粘着シート２１の上面にチップ２３を貼り付けるために設けられた粘着層に振動を付与してキャビテーションを発生させ、これにより粘着層に気泡を発生させることができる。そして、粘着層に気泡を発生させることによって、粘着シート２１をチップ２３の下面から剥離させることができる。 The lower collet main body 41 may be provided with a vibrating portion 57 such as an ultrasonic vibrator. When the vibration part 57 is provided, the lower collet body part 41 vibrates due to the vibration of the vibration part 57. Therefore, vibration can be applied to the pressure-sensitive adhesive sheet 21 to which the chip 23 is attached by vibrating the vibration part 57 in a state where the lower collet body 41 is in contact with the chip 23 via the pressure-sensitive adhesive sheet 21. . By applying vibration to the pressure-sensitive adhesive sheet 21, for example, vibration is applied to the pressure-sensitive adhesive layer provided for attaching the chip 23 to the upper surface of the pressure-sensitive adhesive sheet 21 to generate cavitation, thereby generating bubbles in the pressure-sensitive adhesive layer. be able to. Then, by generating bubbles in the adhesive layer, the adhesive sheet 21 can be peeled from the lower surface of the chip 23.
　なお、後述する下コレット排気工程（ステップＳ１４）において粘着シート２１がチップ２３の表面から剥離しにくくないときは、剥離開始工程（ステップＳ１５）を省略することができる。この場合、振動部５７を省略することができる。 In addition, when the adhesive sheet 21 is not easily peeled off from the surface of the chip 23 in the lower collet exhausting step (step S14) described later, the peeling starting step (step S15) can be omitted. In this case, the vibration part 57 can be omitted.
　制御部６０は、上コレット駆動機構３２、上コレット排気機構３３、下コレット駆動機構４２、及び下コレット排気機構４３を制御する。また、振動部５７が設けられているときは、制御部６０は振動部５７をも制御する。 The control unit 60 controls the upper collet drive mechanism 32, the upper collet exhaust mechanism 33, the lower collet drive mechanism 42, and the lower collet exhaust mechanism 43. Further, when the vibration unit 57 is provided, the control unit 60 also controls the vibration unit 57.
　制御部６０は、例えば、図示しない演算処理部、記憶部及び表示部を有する。演算処理部は、例えばＣＰＵ（Central Processing Unit）を有するコンピュータである。記憶部は、演算処理部に各種の処理を実行させるためのプログラムを記録した、例えばハードディスク等のコンピュータ読み取り可能な記録媒体である。表示部は、例えばコンピュータの画面である。演算処理部は、記憶部に記録されたプログラムを読み取り、そのプログラムに従って、ピックアップ装置１０の各部に制御信号を送り、以下に説明する実施の形態に係るピックアップ方法を実行する。 The control unit 60 includes, for example, an arithmetic processing unit, a storage unit, and a display unit (not shown). The arithmetic processing unit is, for example, a computer having a CPU (Central Processing Unit). The storage unit is a computer-readable recording medium such as a hard disk in which a program for causing the arithmetic processing unit to execute various processes is recorded. The display unit is, for example, a computer screen. The arithmetic processing unit reads a program recorded in the storage unit, sends a control signal to each unit of the pickup device 10 according to the program, and executes a pickup method according to the embodiment described below.
　次に、図２から図３Ｈを参照し、本実施の形態に係るピックアップ方法について説明する。図２は、本実施の形態に係るピックアップ方法の各工程の手順を説明するためのフローチャートである。図３Ａから図３Ｈは、本実施の形態に係るピックアップ方法の各工程におけるピックアップ装置の状態を示す概略断面図である。 Next, the pickup method according to the present embodiment will be described with reference to FIGS. 2 to 3H. FIG. 2 is a flowchart for explaining the procedure of each step of the pickup method according to the present embodiment. 3A to 3H are schematic cross-sectional views showing the state of the pickup device in each step of the pickup method according to the present embodiment.
　図２に示すように、本実施の形態に係るピックアップ方法は、上コレット下降工程（ステップＳ１１）、上コレット排気工程（ステップＳ１２）、下コレット上昇工程（ステップＳ１３）、下コレット排気工程（ステップＳ１４）、剥離開始工程（ステップＳ１５）、ニードル挿入工程（ステップＳ１６）、流体注入工程（ステップＳ１７）、及び上コレット上昇工程（ステップＳ１８）を有する。 As shown in FIG. 2, the pickup method according to the present embodiment includes an upper collet lowering step (step S11), an upper collet exhausting step (step S12), a lower collet rising step (step S13), and a lower collet exhausting step (step S14), a peeling start process (step S15), a needle insertion process (step S16), a fluid injection process (step S17), and an upper collet raising process (step S18).
　なお、図２に示すように、上コレット下降工程（ステップＳ１１）から下コレット上昇工程（ステップＳ１３）までは、本発明における第１のステップに相当する。また、下コレット排気工程（ステップＳ１４）から流体注入工程（ステップＳ１７）までは、本発明における第２のステップに相当する。また、上コレット上昇工程（ステップＳ１８）は、本発明における第３のステップに相当する。 In addition, as shown in FIG. 2, the upper collet lowering step (step S11) to the lower collet rising step (step S13) correspond to the first step in the present invention. Further, the process from the lower collet exhaust process (step S14) to the fluid injection process (step S17) corresponds to the second step in the present invention. The upper collet raising step (step S18) corresponds to the third step in the present invention.
　本実施の形態に係るピックアップ方法を行う前、予め、複数のチップ２３が形成されたウェハＷを例えばダイシングテープである粘着シート２１に貼り付け、ウェハＷが貼り付けられた粘着シート２１の周縁を例えばリングフレーム２２により保持する。そして、図示せぬダイシング加工装置により、粘着シート２１に貼り付けられたウェハＷをダイシング加工し、粘着シート２１に貼り付けられた状態でチップ２３ごとに分離する。更に、ダイシング加工された複数のチップ２３が貼り付けられている粘着シート２１を、リングフレーム２２に保持したまま、例えばステージ２０に固定して保持する。このとき、粘着シート２１のテープ面が例えば水平になるようにステージ２０上に固定して保持することができ、水平に保持されている粘着シート２１の上面にチップ２３が貼り付けられているように配置することができる。 Prior to performing the pick-up method according to the present embodiment, the wafer W on which a plurality of chips 23 are formed is previously attached to an adhesive sheet 21 that is, for example, a dicing tape, and the periphery of the adhesive sheet 21 to which the wafer W is attached is attached. For example, it is held by the ring frame 22. Then, the wafer W attached to the pressure-sensitive adhesive sheet 21 is diced by a dicing apparatus (not shown), and is separated for each chip 23 while being attached to the pressure-sensitive adhesive sheet 21. Further, the pressure-sensitive adhesive sheet 21 to which the plurality of chips 23 diced are attached is fixed to the stage 20 and held, for example, while being held on the ring frame 22. At this time, the tape surface of the pressure-sensitive adhesive sheet 21 can be fixed and held on the stage 20 so as to be horizontal, for example, and the chip 23 is attached to the upper surface of the pressure-sensitive adhesive sheet 21 held horizontally. Can be arranged.
　なお、本実施の形態に係るピックアップ装置は、以下のように構成されていればよい。すなわち、粘着シート２１の、チップ２３が貼り付けられている側から上コレット３０を近づける。そして粘着シート２１の、チップ２３が貼り付けられている側とは反対の側から下コレット４０を近づける。そしてこのように近づけた上コレット３０と下コレット４０とにより粘着シート２１及びチップ２３を挟むように構成されていればよい。従って、上コレット３０と下コレット４０との上下関係は限定されない。 Note that the pickup device according to the present embodiment may be configured as follows. That is, the upper collet 30 is brought closer to the adhesive sheet 21 from the side where the chip 23 is attached. Then, the lower collet 40 is approached from the side of the adhesive sheet 21 opposite to the side where the chip 23 is attached. And what is necessary is just to be comprised so that the adhesive sheet 21 and the chip | tip 23 may be pinched | interposed by the upper collet 30 and the lower collet 40 which approached in this way. Therefore, the vertical relationship between the upper collet 30 and the lower collet 40 is not limited.
　初めに、上コレット下降工程（ステップＳ１１）を行う。ステップＳ１１では、上コレット３０を下降させる。そして、後述するようにチップ２３を吸引して保持するため、固定して保持されている粘着シート２１の上面に貼り付けられているチップ２３の上面に上コレット３０を近づけて接触させる。図３Ａは、ステップＳ１１を行う際のピックアップ装置１０の状態を示す。 First, the upper collet lowering step (step S11) is performed. In step S11, the upper collet 30 is lowered. In order to suck and hold the chip 23 as will be described later, the upper collet 30 is brought into close contact with the upper surface of the chip 23 attached to the upper surface of the pressure-sensitive adhesive sheet 21 that is fixedly held. FIG. 3A shows the state of the pickup device 10 when performing step S11.
　ステップＳ１１では図３Ａに示すように、例えば、ステージ２０に固定して保持されている粘着シート２１の上方に上コレット本体部３１がある状態で、上コレット本体部３１の水平面内の位置を調整する。すなわち、図１に示した上コレット駆動機構３２により、平面視における上コレット本体部３１の中心とチップ２３の中心とが略一致するように、上コレット本体部３１の水平面内の位置を調整する。そして、このようにして水平面内の位置が調整された上コレット本体部３１を上コレット駆動機構３２により下降させ、チップ２３の上面に上コレット本体部３１を接触させる。このとき、上コレット本体部３１の周縁側部材３６はチップ２３の上面と接触している。その結果、上コレット本体部３１の中心側部材３７及び吸引孔３８とチップ２３の上面との間の気密が確保される。 In step S11, as shown in FIG. 3A, for example, the position of the upper collet body 31 in the horizontal plane is adjusted in the state where the upper collet body 31 is above the adhesive sheet 21 fixedly held on the stage 20. To do. That is, the position of the upper collet body 31 in the horizontal plane is adjusted by the upper collet drive mechanism 32 shown in FIG. 1 so that the center of the upper collet body 31 and the center of the chip 23 are substantially coincident with each other in plan view. . Then, the upper collet body 31 whose position in the horizontal plane is adjusted in this way is lowered by the upper collet driving mechanism 32, and the upper collet body 31 is brought into contact with the upper surface of the chip 23. At this time, the peripheral side member 36 of the upper collet main body 31 is in contact with the upper surface of the chip 23. As a result, airtightness between the center side member 37 and the suction hole 38 of the upper collet body 31 and the upper surface of the chip 23 is ensured.
　なお、ここで、本実施の形態にかかるピックアップ装置では、上コレット３０と下コレット４０との上下関係が図1の場合とは逆に構成されていてもよいし、或いは上コレット３０と下コレット４０とが水平方向に対向するように構成されていてもよい。本実施の形態にかかるピックアップ装置がこのように構成されている場合には、ステップＳ１１は、固定して保持されている粘着シート２１に上コレット３０を近づけ、粘着シート２１に貼り付けられているチップ２３の表面に上コレット３０を接触させるものであればよい。 Here, in the pickup device according to the present embodiment, the upper and lower relationships between the upper collet 30 and the lower collet 40 may be opposite to those in FIG. 1, or the upper collet 30 and the lower collet may be configured. 40 may be configured to face the horizontal direction. When the pickup device according to the present embodiment is configured as described above, in step S11, the upper collet 30 is brought close to the adhesive sheet 21 that is fixedly held, and is attached to the adhesive sheet 21. What is necessary is just to make the upper collet 30 contact the surface of the chip 23.
　ステップＳ１１の次に、上コレット排気工程（ステップＳ１２）を行う。ステップＳ１２では、ステップＳ１１で接触させた上コレット３０によりチップ２３を吸着する。図３Ｂは、ステップＳ１２を行う際のピックアップ装置１０の状態を示す。 After step S11, an upper collet exhaust process (step S12) is performed. In step S12, the chip 23 is adsorbed by the upper collet 30 brought into contact in step S11. FIG. 3B shows the state of the pickup device 10 when step S12 is performed.
　ここで、上コレット本体部３１の下面に形成されている吸引孔３８には、図１に示した上コレット排気機構３３が接続されている。そして上コレット排気機構３３により、図３Ｂに示すように、チップ２３の上面との間で気密が確保されている、上コレット本体部３１の中心側部材３７及び吸引孔３８内を減圧する。その結果、チップ２３の上面が上コレット本体部３１の中心側部材３７及び吸引孔３８に吸引される。 Here, the upper collet exhaust mechanism 33 shown in FIG. 1 is connected to the suction hole 38 formed in the lower surface of the upper collet body 31. Then, as shown in FIG. 3B, the upper collet exhaust mechanism 33 decompresses the inside of the center side member 37 and the suction hole 38 of the upper collet main body 31 that is airtight with the upper surface of the chip 23. As a result, the upper surface of the chip 23 is sucked into the center side member 37 and the suction hole 38 of the upper collet body 31.
　なお、ステップＳ１２は、下コレット排気工程（ステップＳ１４）においてチップ２３に働くせん断応力によってチップ２３が割れることを防止するために行う。このチップ２３に働くせん断応力とは、下コレット本体部４１の凹部４８と粘着シート２１とにより形成される空間ＳＰを減圧したときに、凹部４８の周縁に対応する部分において働くものである。従って、ステップＳ１２は、下コレット排気工程（ステップＳ１４）の前に行えばよい。 In addition, step S12 is performed in order to prevent the chip 23 from cracking due to the shear stress acting on the chip 23 in the lower collet exhaust process (step S14). The shear stress acting on the chip 23 acts on a portion corresponding to the periphery of the recess 48 when the space SP formed by the recess 48 of the lower collet body 41 and the adhesive sheet 21 is decompressed. Therefore, step S12 may be performed before the lower collet exhaust process (step S14).
　あるいは、後述するように、平面視における凹部４８の開口４８Ｋの面積（または開口４８Ｋの寸法）とチップ２３の面積（または平面の寸法）との大小関係によっては、凹部４８の周縁に対応する部分においてチップ２３に働くせん断応力がそれほど大きくならないようにすることができる。この場合には、ステップＳ１２は、後述する上コレット上昇工程（ステップＳ１８）の前に行えばよい。 Alternatively, as will be described later, depending on the size relationship between the area (or dimension of the opening 48K) of the opening 48K of the recess 48 in plan view and the area (or dimension of the plane) of the chip 23, a portion corresponding to the periphery of the recess 48 It is possible to prevent the shear stress acting on the chip 23 from becoming so large. In this case, step S12 may be performed before the upper collet raising step (step S18) described later.
　次に、下コレット上昇工程（ステップＳ１３）を行う。ステップＳ１３では、チップ２３を上コレット３０と下コレット４０とによって挟み、固定して保持する。すなわち下コレット４０を上昇させ、粘着シート２１が貼り付けられているチップ２３の下面に、粘着シート２１を介して下コレット４０を接触させる。図３Ｃは、ステップＳ１３を行う際のピックアップ装置１０の状態を示す。 Next, a lower collet raising process (step S13) is performed. In step S13, the chip 23 is sandwiched between the upper collet 30 and the lower collet 40, and is held fixed. That is, the lower collet 40 is raised, and the lower collet 40 is brought into contact with the lower surface of the chip 23 to which the adhesive sheet 21 is attached via the adhesive sheet 21. FIG. 3C shows the state of the pickup device 10 when performing step S13.
　ステップＳ１３では、図３Ｃに示すように、例えば、下コレット本体部４１が、ステージ２０に固定して保持されている粘着シート２１の下方にある状態で、下コレット本体部４１の水平面内の位置を調整する。すなわち図１に示した下コレット駆動機構４２により、平面視における下コレット本体部４１の中心とチップ２３の中心とが略一致するように、下コレット本体部４１の水平面内の位置を調整する。そして、このようにして水平面内の位置が調整された下コレット本体部４１を下コレット駆動機構４２により上昇させ、チップ２３の下面に、粘着シート２１を介して下コレット本体部４１を接触させる。このとき、下コレット本体部４１の周縁側部材４７は、チップ２３の下面と、粘着シート２１を介して接触している。その結果、下コレット本体部４１の凹部４８に形成された空間ＳＰの気密が確保される。 In step S13, as shown in FIG. 3C, for example, the position of the lower collet body 41 in the horizontal plane in a state where the lower collet body 41 is below the adhesive sheet 21 fixed and held on the stage 20. Adjust. That is, the position of the lower collet body 41 in the horizontal plane is adjusted by the lower collet drive mechanism 42 shown in FIG. 1 so that the center of the lower collet body 41 in plan view and the center of the chip 23 are substantially coincident with each other. Then, the lower collet main body 41 whose position in the horizontal plane is adjusted in this way is raised by the lower collet driving mechanism 42, and the lower collet main body 41 is brought into contact with the lower surface of the chip 23 via the adhesive sheet 21. At this time, the peripheral side member 47 of the lower collet body 41 is in contact with the lower surface of the chip 23 via the adhesive sheet 21. As a result, the airtightness of the space SP formed in the recess 48 of the lower collet body 41 is ensured.
　ここで上記の如く、上コレット３０と下コレット４０との上下関係が図１の場合とは逆に構成されていてもよいし、或いは、上コレット３０と下コレット４０とが水平方向に対向するように構成されていてもよい。このような場合には、ステップＳ１３は、固定して保持されている粘着シート２１に、上コレット３０と対向するように下コレット４０を近づけるものであればよい。そして、このようにして近づけた下コレット４０を、粘着シート２１に貼り付けられているチップ２３の表面に、粘着シート２１を介して接触させるものであればよい。 Here, as described above, the vertical relationship between the upper collet 30 and the lower collet 40 may be opposite to that in FIG. 1, or the upper collet 30 and the lower collet 40 face each other in the horizontal direction. It may be configured as follows. In such a case, the step S13 may be anything as long as the lower collet 40 is brought close to the upper collet 30 to the adhesive sheet 21 that is fixedly held. And what is necessary is just to make the lower collet 40 brought close in this way contact the surface of the chip | tip 23 currently affixed on the adhesive sheet 21 via the adhesive sheet 21. FIG.
　次に、下コレット排気工程（ステップＳ１４）を行う。ステップＳ１４では、下コレット４０の凹部４８と粘着シート２１とにより形成されている空間ＳＰを減圧し、粘着シート２１を吸引する。図３Ｄは、ステップＳ１４を行う際のピックアップ装置１０の状態を示す。 Next, the lower collet exhaust process (step S14) is performed. In step S <b> 14, the space SP formed by the recess 48 of the lower collet 40 and the adhesive sheet 21 is decompressed, and the adhesive sheet 21 is sucked. FIG. 3D shows the state of the pickup device 10 when performing step S14.
　図３Ｄに示すように、図１に示した下コレット排気機構４３により、凹部４８と粘着シート２１とにより形成されている空間ＳＰを減圧する。ここで下コレット排気機構４３は、凹部４８の底面４９に形成されている開口５１に、吸引孔５０を介して接続されている。この空間ＳＰの減圧により、チップ２３の、凹部４８に対向する部分に貼り付けられている粘着シート２１が、凹部４８に向かって吸引される。減圧の程度は、当該減圧による吸引によって、粘着シート２１の、チップ２３からの剥離が生ずる程度でよい。 As shown in FIG. 3D, the space SP formed by the concave portion 48 and the adhesive sheet 21 is decompressed by the lower collet exhaust mechanism 43 shown in FIG. Here, the lower collet exhaust mechanism 43 is connected to the opening 51 formed in the bottom surface 49 of the recess 48 through the suction hole 50. Due to the decompression of the space SP, the pressure-sensitive adhesive sheet 21 attached to the portion of the chip 23 facing the recess 48 is sucked toward the recess 48. The degree of pressure reduction may be such that the pressure-sensitive adhesive sheet 21 is peeled off from the chip 23 by suction.
　ただし、減圧の程度によっては、粘着シート２１がチップ２３の表面から剥離しにくいときがある。このときは、粘着シート２１がチップ２３の表面から剥離する起点を発生させるために剥離開始工程（ステップＳ１５）を行ってもよい。ステップＳ１５では、粘着シート２１を振動させることによって、チップ２３の、凹部４８に対向する部分からの、粘着シート２１の剥離を開始させる。図３Ｅは、ステップＳ１５を行う際のピックアップ装置１０の状態を示す。 However, depending on the degree of decompression, the adhesive sheet 21 may be difficult to peel off from the surface of the chip 23. At this time, a peeling start step (step S15) may be performed in order to generate a starting point at which the adhesive sheet 21 peels from the surface of the chip 23. In step S <b> 15, the adhesive sheet 21 is vibrated to start peeling of the adhesive sheet 21 from the portion of the chip 23 that faces the recess 48. FIG. 3E shows the state of the pickup device 10 when performing step S15.
　ステップＳ１５では、前述した振動部５７を振動させ、粘着シート２１に振動を付与する。このようにして、例えば粘着シート２１が有する粘着層に振動を付与してキャビテーションを発生させ、これにより粘着層に気泡を発生させることができる。ここで粘着層とは、粘着シート２１の上面にチップ２３を貼り付けるためのものである。一方、ステップＳ１４により、凹部４８と粘着シート２１とにより形成されている空間ＳＰが減圧されている。従って、図３Ｅに示すように、チップ２３の、凹部４８に対向する部分からの、粘着シート２１の剥離を開始させることができる。 In step S15, the vibration unit 57 described above is vibrated to impart vibration to the adhesive sheet 21. In this way, for example, vibration can be applied to the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet 21 to generate cavitation, thereby generating bubbles in the pressure-sensitive adhesive layer. Here, the adhesive layer is for attaching the chip 23 to the upper surface of the adhesive sheet 21. On the other hand, the space SP formed by the recess 48 and the adhesive sheet 21 is decompressed by step S14. Therefore, as shown in FIG. 3E, the peeling of the adhesive sheet 21 from the portion of the chip 23 facing the recess 48 can be started.
　次に、ニードル挿入工程（ステップＳ１６）を行う。ステップＳ１６では、チップ２３の、凹部４８に対向する部分からの、粘着シート２１の剥離が開始したときに、チップ２３と、剥離が開始した粘着シート２１との間に、ニードル４４を挿入する。図３Ｆは、ステップＳ１６を行う際のピックアップ装置１０の状態を示す。 Next, a needle insertion step (step S16) is performed. In step S <b> 16, when peeling of the adhesive sheet 21 from the portion of the chip 23 that faces the recess 48 starts, the needle 44 is inserted between the chip 23 and the adhesive sheet 21 that has started peeling. FIG. 3F shows the state of the pickup device 10 when performing step S16.
　本実施の形態では、ニードル４４は、図１に示されたニードル駆動機構５３により、吸引孔５０内を凹部４８の深さ方向に並行する方向に移動可能に、すなわち吸引孔５０内を上下動可能に設けられている。従って、ニードル駆動機構５３によりニードル４４を上昇させ、図３Ｆに示すように、剥離した粘着シート２１を貫通させ、チップ２３と、剥離した粘着シート２１との間に、ニードル４４を挿入する。 In the present embodiment, the needle 44 can be moved in the suction hole 50 in a direction parallel to the depth direction of the recess 48 by the needle drive mechanism 53 shown in FIG. It is provided as possible. Therefore, the needle 44 is raised by the needle drive mechanism 53, the peeled adhesive sheet 21 is penetrated, and the needle 44 is inserted between the chip 23 and the peeled adhesive sheet 21, as shown in FIG. 3F.
　次に、流体注入工程（ステップＳ１７）を行う。ステップＳ１７では、ステップＳ１６にて挿入したニードル４４により、チップ２３と、剥離した粘着シート２１との間に流体ＦＬを注入する。その結果、チップ２３の凹部４８に対向する部分の、より多くの部分から粘着シート２１を剥離させることができる。図３Ｇは、ステップＳ１７を行う際のピックアップ装置１０の状態を示す。 Next, a fluid injection process (step S17) is performed. In step S17, the fluid FL is injected between the tip 23 and the peeled adhesive sheet 21 with the needle 44 inserted in step S16. As a result, the pressure-sensitive adhesive sheet 21 can be peeled from a larger portion of the portion of the chip 23 that faces the recess 48. FIG. 3G shows the state of the pickup device 10 when step S17 is performed.
　ステップＳ１７では、図３Ｇに示すように、チップ２３と、剥離した粘着シート２１との間に挿入したニードル４４により、チップ２３と、剥離した粘着シート２１との間に、気体または液体を含む流体ＦＬを注入する。その結果、剥離した粘着シート２１には、以下の力が働く。すなわち、チップ２３と、剥離した粘着シート２１との間に注入された流体ＦＬの圧力と、上記減圧によって、剥離した粘着シート２１を凹部４８に吸引する吸引力とが働く。その結果、粘着シート２１を更にチップ２３から剥離させようとする力が働き、チップ２３の、凹部４８に対向する部分から、完全に粘着シート２１を剥離させることができる。 In step S <b> 17, as shown in FIG. 3G, a fluid containing a gas or a liquid between the chip 23 and the peeled adhesive sheet 21 by the needle 44 inserted between the chip 23 and the peeled adhesive sheet 21. Inject FL. As a result, the following force acts on the peeled adhesive sheet 21. That is, the pressure of the fluid FL injected between the chip 23 and the peeled adhesive sheet 21 and the suction force that sucks the peeled adhesive sheet 21 into the concave portion 48 due to the above-mentioned pressure reduction. As a result, a force for further peeling the pressure-sensitive adhesive sheet 21 from the chip 23 acts, and the pressure-sensitive adhesive sheet 21 can be completely peeled from the portion of the chip 23 facing the recess 48.
　流体ＦＬとして、液体である非圧縮性流体、または、気体である圧縮性流体を用いることができる。非圧縮性流体として、例えば、純水等の水、エタノール等のアルコール、炭酸水等のいずれか１種以上を含む、液相状態の流体を用いることができる。また、圧縮性流体として、例えば、二酸化炭素（ＣＯ２）、窒素（Ｎ２）、その他各種のガスのいずれか１種以上を含む、気相状態の流体を用いることができる。 As the fluid FL, an incompressible fluid that is a liquid or a compressive fluid that is a gas can be used. As the incompressible fluid, for example, a fluid in a liquid phase state including any one or more of water such as pure water, alcohol such as ethanol, carbonated water and the like can be used. Further, as the compressive fluid, for example, a fluid in a gas phase state including any one or more of carbon dioxide (CO 2 ), nitrogen (N 2 ), and other various gases can be used.
　次に、上コレット上昇工程（ステップＳ１８）を行う。ステップＳ１８では、剥離した粘着シート２１とチップ２３との間に流体ＦＬが注入されている状態（図３Ｇ参照）で、上コレット３０を上昇させる。そして、このようにして、下コレット４０が吸引している粘着シート２１から上コレット３０を遠ざけることによって、チップ２３を粘着シート２１から剥離させる。図３Ｈは、ステップＳ１８を行う際のピックアップ装置１０の状態を示す。 Next, an upper collet raising process (step S18) is performed. In step S18, the upper collet 30 is raised in a state where the fluid FL is injected between the peeled adhesive sheet 21 and the chip 23 (see FIG. 3G). In this way, the chip 23 is peeled from the adhesive sheet 21 by moving the upper collet 30 away from the adhesive sheet 21 sucked by the lower collet 40. FIG. 3H shows the state of the pickup device 10 when performing step S18.
　ステップＳ１８は、チップ２３の、凹部４８に対向する部分から粘着シート２１が剥離され、剥離した粘着シート２１とチップ２３との間に流体ＦＬが注入され、チップ２３が吸引された状態（図３Ｇ参照）で、行う。すなわち、ステップＳ１８では、この状態で、図１に示した上コレット駆動機構３２により、上コレット本体部３１を上昇させる。このように上コレット本体部３１を上昇させることにより、図３Ｈに示されるように、上コレット３１に吸着されたチップ２３を、粘着シート２１から剥離させてピックアップする。 In step S18, the adhesive sheet 21 is peeled from the portion of the chip 23 facing the recess 48, the fluid FL is injected between the peeled adhesive sheet 21 and the chip 23, and the chip 23 is sucked (FIG. 3G). ). That is, in step S18, in this state, the upper collet main body 31 is raised by the upper collet driving mechanism 32 shown in FIG. By raising the upper collet body 31 in this manner, the chip 23 adsorbed on the upper collet 31 is peeled off from the adhesive sheet 21 and picked up as shown in FIG. 3H.
　次に、図４及び図５Ａから図５Ｃを参照し、本実施の形態に係るピックアップ装置及びピックアップ方法によって、粘着シートに貼着されているチップをピックアップする際にチップに加えられる応力負荷を低減できる作用効果について説明する。 Next, referring to FIG. 4 and FIG. 5A to FIG. 5C, the stress load applied to the chip when the chip stuck to the adhesive sheet is picked up is reduced by the pickup device and pickup method according to the present embodiment. The possible effects will be described.
　通常、粘着シートの粘着力、すなわち粘着タック特性を調べる方法として、傾斜式ボールタック試験、ローリングボールタック試験、プローブタック試験等の方法がある。例えばプローブタック試験では、シリンダー状のプローブの平滑な端面を粘着剤の表面に接触させた後、これを引離す際の単位面積当たりの応力－ひずみ曲線を測定する。そして、例えばその応力－ひずみ曲線における単位面積当たりの最大応力σｍａｘ値から、粘着力を求めることができる。 Usually, as a method for examining the adhesive strength of the pressure-sensitive adhesive sheet, that is, the pressure-sensitive adhesive tack property, there are methods such as an inclined ball tack test, a rolling ball tack test, and a probe tack test. For example, in the probe tack test, a smooth end surface of a cylindrical probe is brought into contact with the surface of the adhesive, and then a stress-strain curve per unit area when the surface is separated is measured. For example, the adhesive force can be obtained from the maximum stress σ max value per unit area in the stress-strain curve.
　従って、本実施の形態に係るピックアップ方法の上コレット上昇工程（ステップＳ１８）において、粘着シートからチップを剥離するのに必要な剥離力Ｆは、
 
　Ｆ＝Ｓ×σｍａｘ　　　　　　　　　　　　　　　　　　　　　　（１）
 
で表される。ここで、Ｓは、上コレット上昇工程（ステップＳ１８）が開始される時点における、チップの粘着シートとの間の接着面積を示すものとする。 Therefore, in the upper collet raising step (step S18) of the pickup method according to the present embodiment, the peeling force F necessary for peeling the chip from the adhesive sheet is

F = S × σ max (1)

It is represented by Here, S represents the adhesion area between the chip and the adhesive sheet at the time when the upper collet raising step (step S18) is started.
　例えば、ダイシングテープとして株式会社トーヨーアドテックの一般感圧シリーズを用いる場合、プローブタック法による粘着力、すなわち剥離力Ｆは、０．７～１．０Ｎ／２０ｍｍ２となる。また、ダイシングテープとして株式会社トーヨーアドテックのＵＶシリーズを用いる場合、プローブタック法による粘着力、すなわち剥離力Ｆは、１．７～３．９Ｎ／２０ｍｍ２となる。 For example, when the general pressure sensitive series of Toyo Adtec Co., Ltd. is used as the dicing tape, the adhesive force by the probe tack method, that is, the peeling force F is 0.7 to 1.0 N / 20 mm 2 . Further, when the UV series of Toyo Adtec Co., Ltd. is used as the dicing tape, the adhesive force by the probe tack method, that is, the peeling force F is 1.7 to 3.9 N / 20 mm 2 .
　ここで、説明の便宜上、下コレットの上面に凹部が設けられておらず、また、ニードルが流体を注入できないように構成されているピックアップ装置を、比較例として説明する。図４は、比較例に係るピックアップ装置１１０の構成を模式的に示す縦断面図である。 Here, for convenience of explanation, a pickup device in which a recess is not provided on the upper surface of the lower collet and the needle cannot be injected with fluid will be described as a comparative example. FIG. 4 is a longitudinal sectional view schematically showing the configuration of the pickup device 110 according to the comparative example.
　図４に示すように、比較例に係るピックアップ装置１１０は、ステージ１２０、上コレット１３０、及び下コレット１４０を有する。上コレット１３０は、上コレット本体部１３１、上コレット駆動機構１３２、及び上コレット排気機構１３３を有する。下コレット１４０は、下コレット本体部１４１、下コレット駆動機構１４２、下コレット排気機構１４３、及びニードル１４４を有する。チップ２３が貼り付けられている粘着シート２１がリングフレーム２２を介してステージ１２０に保持されているのは、図１等と共に上述した実施の形態と同様である。また、上コレット本体部１３１の下面に形成された開口１３９に連通する吸引孔１３８が上コレット排気機構１３３により減圧されるのも、図１等と共に上述した実施の形態と同様である。また、下コレット本体部１４１の上面に形成された開口１５１に連通する吸引孔１５０が下コレット排気機構１４３により減圧されるのも、図１等と共に上述した実施の形態と同様である。 As shown in FIG. 4, the pickup device 110 according to the comparative example includes a stage 120, an upper collet 130, and a lower collet 140. The upper collet 130 has an upper collet body 131, an upper collet drive mechanism 132, and an upper collet exhaust mechanism 133. The lower collet 140 includes a lower collet main body 141, a lower collet driving mechanism 142, a lower collet exhaust mechanism 143, and a needle 144. The adhesive sheet 21 to which the chip 23 is attached is held on the stage 120 via the ring frame 22 as in the embodiment described above with reference to FIG. In addition, the suction hole 138 communicating with the opening 139 formed on the lower surface of the upper collet body 131 is decompressed by the upper collet exhaust mechanism 133, as in the embodiment described above with reference to FIG. Further, the suction hole 150 communicating with the opening 151 formed on the upper surface of the lower collet main body 141 is decompressed by the lower collet exhaust mechanism 143, similarly to the embodiment described above with reference to FIG.
　しかし、比較例に係るピックアップ装置１１０では、図４に示すように、下コレット本体部１４１の上面には、凹部が設けられていない。また、ニードル１４４は、下コレット本体部１４１の上面に形成された開口１５１を通って下コレット本体部１４１の上面から突出自在に設けられているものの、ニードル１４４によって流体を注入することはできない。 However, in the pickup device 110 according to the comparative example, as shown in FIG. 4, no recess is provided on the upper surface of the lower collet body 141. Further, although the needle 144 is provided so as to protrude from the upper surface of the lower collet main body 141 through the opening 151 formed on the upper surface of the lower collet main body 141, the needle 144 cannot inject fluid.
　ここで、比較例に係るピックアップ装置１１０において、上コレット本体部１３１の吸引孔１３８の減圧によりチップ２３を吸引し、下コレット本体部１４１の吸引孔１５０の減圧により粘着シート２１を吸引した状態とする。そして、この状態で上コレット本体部１３１を上昇することによって粘着シート２１からチップ２３を剥離させるのに必要な剥離力をＦ１とする。 Here, in the pickup device 110 according to the comparative example, the state in which the chip 23 is sucked by the decompression of the suction hole 138 of the upper collet body 131 and the adhesive sheet 21 is sucked by the decompression of the suction hole 150 of the lower collet body 141. To do. In this state, the upper collet main body 131 is lifted, and the peeling force necessary for peeling the chip 23 from the adhesive sheet 21 is defined as F1.
　一方、図１等と共に上述した本実施の形態に係るピックアップ装置１０において、流体注入工程（ステップＳ１７）を行う際に、注入された流体ＦＬの量が相対的に少ない状態を想定する。そして、この状態で上コレット本体部３１を上昇することによって粘着シート２１からチップ２３を剥離させるのに必要な剥離力をＦ２とする。また、図１等と共に上述した本実施の形態に係るピックアップ装置１０において、注入された流体ＦＬの量が相対的に多い状態を想定する。そして、この状態で、上コレット本体部３１を上昇することによって粘着シート２１からチップ２３を剥離させるのに必要な剥離力をＦ３とする。すると、Ｆ１＞Ｆ２＞Ｆ３の関係が成立する。 On the other hand, in the pickup device 10 according to the present embodiment described above with reference to FIG. 1 and the like, it is assumed that the amount of the injected fluid FL is relatively small when performing the fluid injection step (step S17). In this state, the upper collet main body 31 is raised, and the peeling force necessary for peeling the chip 23 from the adhesive sheet 21 is defined as F2. In addition, in the pickup device 10 according to the present embodiment described above with reference to FIG. 1 and the like, it is assumed that the amount of injected fluid FL is relatively large. In this state, the peeling force necessary for peeling the chip 23 from the adhesive sheet 21 by raising the upper collet body 31 is F3. Then, the relationship of F1> F2> F3 is established.
　上記した３つの状態における、上コレット上昇工程（ステップＳ１８）でチップ２３に働く剥離力の時間変化を、それぞれ図５Ａ、図５Ｂ、図５Ｃに示す。ここで図５Ａは、図４と共に上述した比較例の場合について示す。図５Ｂは、図１等と共に上述した本実施の形態において、注入された流体ＦＬの量が相対的に少ない場合について示す。図５Ｃは、図１等と共に上述した本実施の形態において、注入された流体ＦＬの量が相対的に多い場合について示す。また、図５Ａ、図５Ｂ、図５Ｃでは、上コレット３０（１３０）を等速で上昇させる場合を示しているため、図５Ａ、図５Ｂ、図５Ｃの横軸は、上コレット３０（１３０）の上方向への移動距離とも等価である。 5A, FIG. 5B, and FIG. 5C show the change over time of the peeling force that acts on the chip 23 in the upper collet raising step (step S18) in the three states described above. Here, FIG. 5A shows the case of the comparative example described above together with FIG. FIG. 5B shows a case where the amount of injected fluid FL is relatively small in the present embodiment described above with reference to FIG. FIG. 5C shows a case where the amount of injected fluid FL is relatively large in the present embodiment described above with reference to FIG. 5A, 5B, and 5C show the case where the upper collet 30 (130) is raised at a constant speed, the horizontal axis of FIGS. 5A, 5B, and 5C indicates the upper collet 30 (130). This is equivalent to the upward movement distance of.
　図５Ａ、図５Ｂ及び図５Ｃの３つの場合を比較すると、上コレット上昇工程（ステップＳ１８）の開始時点におけるチップ２３と粘着シート２１との接着面積が最も大きい場合、すなわち図５Ａの場合では、剥離力Ｆ１が最大である。また、この場合、剥離に要する時間ｔ１、すなわち上コレット１３０の移動距離も最大である。そして、上コレット上昇工程（ステップＳ１８）の開始時点におけるチップ２３と粘着シート２１との接着面積が最も小さい場合、すなわち図５Ｃの場合では、剥離力Ｆ３が最小である。また、この場合、剥離に要する時間ｔ３、すなわち上コレット３０の移動距離も最小である。そして、図５Ｂに示す場合では、剥離力Ｆ２はＦ１とＦ３の中間であり、剥離に要する時間ｔ２も、ｔ１とｔ３の中間である。 Comparing the three cases of FIG. 5A, FIG. 5B and FIG. 5C, when the adhesion area between the chip 23 and the adhesive sheet 21 at the start of the upper collet raising step (step S18) is the largest, that is, in the case of FIG. The peeling force F1 is maximum. In this case, the time t1 required for peeling, that is, the moving distance of the upper collet 130 is also the maximum. And when the adhesion area of the chip | tip 23 and the adhesive sheet 21 in the start time of an upper collet raising process (step S18) is the smallest, ie, in the case of FIG. 5C, the peeling force F3 is the minimum. In this case, the time t3 required for peeling, that is, the moving distance of the upper collet 30 is also minimum. In the case shown in FIG. 5B, the peeling force F2 is intermediate between F1 and F3, and the time t2 required for peeling is also intermediate between t1 and t3.
　すなわち、図１等と共に上述した本実施の形態では、上コレット上昇工程（ステップＳ１８）でチップ２３を粘着シート２１から剥離させる前に、下コレット４０により粘着シート２１を凹部４８に吸引する（ステップＳ１４）。そして、さらに、ニードル４４により、粘着シート２１とチップ２３との間に、流体ＦＬを注入する（ステップＳ１７）。このようにして、チップ２３の、凹部４８に対向する部分から、粘着シート２１を剥離させておく。これにより、上コレット上昇工程（ステップＳ１８）の開始時点における、チップ２３と粘着シート２１との接着面積を小さくすることができる。その結果、上コレット上昇工程（ステップＳ１８）における剥離力Ｆを低減し、剥離に要する時間ｔを短縮することができる。 That is, in the present embodiment described above with reference to FIG. 1 and the like, the adhesive sheet 21 is sucked into the recess 48 by the lower collet 40 before the chip 23 is peeled from the adhesive sheet 21 in the upper collet raising step (step S18) (step S18). S14). Further, the fluid FL is injected between the adhesive sheet 21 and the chip 23 by the needle 44 (step S17). In this way, the pressure-sensitive adhesive sheet 21 is peeled off from the portion of the chip 23 that faces the recess 48. Thereby, the adhesion area of the chip | tip 23 and the adhesive sheet 21 in the start time of an upper collet raising process (step S18) can be made small. As a result, the peeling force F in the upper collet raising step (step S18) can be reduced, and the time t required for peeling can be shortened.
　次に、図６から図８を参照し、図１等と共に上述した本実施の形態に係るピックアップ装置及びピックアップ方法によって、粘着シートに貼着されているチップをピックアップする際に、チップが破壊されることを防止できる作用効果について説明する。 Next, referring to FIG. 6 to FIG. 8, when the chip attached to the adhesive sheet is picked up by the pick-up apparatus and pick-up method according to the present embodiment described above with reference to FIG. The effect which can prevent that is demonstrated.
　図６は、上コレット上昇工程（ステップＳ１８）における、チップ２３に働くせん断応力を説明するための、ピックアップ装置１０の縦断面図である。図７は、上コレット上昇工程（ステップＳ１８）において、チップ２３に働くせん断応力を説明するための、チップ２３の平面図である。図８は、上コレット上昇工程（ステップＳ１８）において、チップ２３に働くせん断応力のせん断面積を説明するための、チップ２３の斜視図である。 FIG. 6 is a longitudinal sectional view of the pickup device 10 for explaining the shear stress acting on the chip 23 in the upper collet raising step (step S18). FIG. 7 is a plan view of the chip 23 for explaining the shear stress acting on the chip 23 in the upper collet raising step (step S18). FIG. 8 is a perspective view of the tip 23 for explaining the shear area of the shear stress acting on the tip 23 in the upper collet raising step (step S18).
　なお、以下では、流体注入工程（ステップＳ１７）において、可能な最大の量の流体ＦＬを注入した状態について説明する。この状態では、チップ２３の、凹部４８に対向する部分において、粘着シート２１がチップ２３から完全に剥離しており、図５Ｃに示すように、上コレット上昇工程（ステップＳ１８）における剥離力（剥離抵抗）Ｆが最小となる。 In the following, a state where the maximum possible amount of fluid FL is injected in the fluid injection step (step S17) will be described. In this state, the adhesive sheet 21 is completely peeled from the chip 23 at the portion of the chip 23 facing the recess 48, and as shown in FIG. 5C, the peeling force (peeling) in the upper collet raising process (step S18). Resistance) F is minimized.
　図６に示すように、上コレット上昇工程（ステップＳ１８）において、チップ２３の、凹部４８に対向する部分には、上コレット３０による上向きの吸引力ＦＵが働く。また、チップ２３の、凹部４８に対向する部分以外の部分には、粘着シート２１による下向きの吸引力ＦＤが働く。このとき、チップ２３の、凹部４８に対向する部分と、チップ２３の、凹部４８に対向する部分以外の部分との境界面（図６、図７及び図８における面ＳＦ。以下「せん断面」という。）に働くせん断力をＴとする。このとき、下向きを正とすると、
 
　Ｔ＝ＦＤ－ＦＵ　　　　　　　　　　　　　　　　　　　　　　　（２）
 
となる。そして、せん断面ＳＦの面積の合計をＡとすると、このせん断力Ｔがせん断面ＳＦに作用するせん断応力τは、
 
　τ＝Ｔ／Ａ＝（ＦＤ－ＦＵ）／Ａ　　　　　　　　　　　　　　　（３）
 
で表される。そして、チップ２３のせん断破壊強度をτｍａｘとすると、チップ２３がせん断破壊しない条件は、せん断応力τとせん断破壊強度τｍａｘとが
 
　τ＜τｍａｘ　　　　　　　　　　　　　　　　　　　　　　　　（４）
 
の関係を満たすことである。 As shown in FIG. 6, in the upper collet raising step (step S <b> 18), an upward suction force FU by the upper collet 30 acts on the portion of the chip 23 that faces the recess 48. Further, a downward suction force FD by the pressure-sensitive adhesive sheet 21 acts on the portion of the chip 23 other than the portion facing the recess 48. At this time, the boundary surface between the portion of the chip 23 facing the recess 48 and the portion of the chip 23 other than the portion facing the recess 48 (surface SF in FIGS. 6, 7 and 8; hereinafter referred to as “shear surface”). T) is the shear force acting on the At this time, if the downward direction is positive,

T = FD-FU (2)

It becomes. When the total area of the shear surface SF is A, the shear stress τ that the shear force T acts on the shear surface SF is

τ = T / A = (FD−FU) / A (3)

It is represented by When the shear fracture strength of the tip 23 is τ max , the conditions under which the tip 23 does not undergo shear failure are shear stress τ and shear fracture strength τ max.
τ <τ max (4)

To satisfy the relationship.
　次に、チップ２３のせん断応力τの見積もりを行う。以下では、図７及び図８に示すように、例えばチップ２３の平面視における形状を、一辺（平面の寸法）Ｌ１の正方形の形状とし、厚さをｄとする。また、図７に示すように、下コレット４０の凹部４８の平面視における形状を、例えば一辺（開口の寸法）Ｌ２の正方形の形状とする。また、簡単のため、上コレット３０の周縁側部材３６の形状とチップ２３の平面視における形状とが略等しいものとし、上向きの吸引力ＦＵは下向きの吸引力ＦＤに比べて小さいものとする。 Next, the shear stress τ of the chip 23 is estimated. Hereinafter, as shown in FIGS. 7 and 8, for example, the shape of the chip 23 in plan view is a square shape with one side (plane dimension) L1, and the thickness is d. Further, as shown in FIG. 7, the shape of the concave portion 48 of the lower collet 40 in plan view is, for example, a square shape with one side (opening dimension) L2. For simplicity, it is assumed that the shape of the peripheral side member 36 of the upper collet 30 is substantially equal to the shape of the chip 23 in plan view, and the upward suction force FU is smaller than the downward suction force FD.
　すると、図７及び図８から、
 
　Ａ＝Ｌ２×ｄ×４　　　　　　　　　　　　　　　　　　　　　　　（５）
 
となり、また、式（１）より
 
　ＦＤ－ＦＵ≒ＦＤ＝（Ｌ１２－Ｌ２２）×σｍａｘ　　　　　　　　（６）
 
となる。そして、式（３）、式（５）及び式（６）より、
 
　τ＝（Ｌ１２－Ｌ２２）×σｍａｘ／（Ｌ２×ｄ×４）　　　　　　（７）
 
となる。 Then, from FIG. 7 and FIG.

A = L2 × d × 4 (5)

From the formula (1)
FD−FU≈FD = (L1 2 −L2 2 ) × σ max (6)

It becomes. And from Formula (3), Formula (5) and Formula (6),

τ = (L1 2 −L2 2 ) × σ max / (L2 × d × 4) (7)

It becomes.
　最大応力σｍａｘについては、前述したダイシングテープの物性に基づいて、
 
　σｍａｘ＝０．０５Ｎ／ｍｍ２　　　　　　　　　　　　　　　　　（８）
 
とする。また、せん断破壊強度をτｍａｘについては、"Investigating the Influence of Fabrication Process and Crystal
Orientation on Shear Strength of Silicon Microcomponents", Q. Chen, D.-J. Yao, C.-J. Kim, and G. P. Carman, Journal
of Materials Science, Vol. 35, No. 21, Nov. 2000, pp. 5465-5474.の記載に基づいて、
 
　τｍａｘ＝５ＭＰａ
 
とする。また、チップ２３の平面の寸法Ｌ１及び厚さｄについては、
 
　Ｌ１＝１０ｍｍ　　　　　　　　　　　　　　　　　　　　　　　（９）
 
　ｄ＝０．０２ｍｍ　　　　　　　　　　　　　　　　　　　　　　（１０）
 
とする。 About the maximum stress σ max , based on the physical properties of the dicing tape described above,

σ max = 0.05 N / mm 2 (8)

And Also, regarding the shear fracture strength τ max , “Investigating the Influence of Fabrication Process and Crystal
Orientation on Shear Strength of Silicon Microcomponents ", Q. Chen, D.-J. Yao, C.-J. Kim, and G. P. Carman, Journal
of Materials Science, Vol. 35, No. 21, Nov. 2000, pp. 5465-5474.

τ max = 5 MPa

And Further, regarding the planar dimension L1 and thickness d of the chip 23,

L1 = 10mm (9)

d = 0.02mm (10)

And
　以上の数値を仮定した上で、凹部４８の開口４８Ｋの寸法Ｌ２を、５ｍｍ、６．７ｍｍ、８ｍｍ、及び９ｍｍ、と変化させたときの、せん断応力τ及びせん断破壊強度τｍａｘとの関係を計算した。その結果を、表１に示す。 Assuming the above numerical values, the relationship between the shear stress τ and the shear fracture strength τ max when the dimension L2 of the opening 48K of the recess 48 is changed to 5 mm, 6.7 mm, 8 mm, and 9 mm is shown. Calculated. The results are shown in Table 1.
Figure JPOXMLDOC01-appb-T000001
  
　表１に示すように、凹部４８の開口４８Ｋの寸法Ｌ２が６．７ｍｍ以下のときは、せん断面ＳＦに作用するせん断応力τは、せん断破壊強度τｍａｘ以上となる。その結果、上コレット上昇工程（ステップＳ１８）において、チップ２３がせん断破壊するおそれがある。一方、凹部４８の開口４８Ｋの寸法Ｌ２が６．７ｍｍよりも大きいときは、せん断面ＳＦに作用するせん断応力τは、せん断破壊強度τｍａｘよりも小さくなる。その結果、上コレット上昇工程（ステップＳ１８）において、チップ２３がせん断破壊するおそれがない。すなわち、凹部４８の開口４８Ｋの寸法Ｌ２がチップ２３の平面の寸法Ｌ１よりも小さく、かつ、所定値よりも大きいときは、せん断面ＳＦに作用するせん断応力τをせん断破壊強度τｍａｘよりも小さくすることができる。その結果、上コレット上昇工程（ステップＳ１８）において、チップ２３がせん断破壊することを防止できる。
Figure JPOXMLDOC01-appb-T000001
As shown in Table 1, when the dimension L2 of the opening 48K of the recess 48 is 6.7 mm or less, the shear stress τ acting on the shear surface SF is equal to or greater than the shear fracture strength τ max . As a result, in the upper collet raising step (step S18), the tip 23 may be sheared and broken. On the other hand, when the dimension L2 of the opening 48K of the recess 48 is larger than 6.7 mm, the shear stress τ acting on the shear surface SF is smaller than the shear fracture strength τ max . As a result, in the upper collet raising step (step S18), there is no possibility that the chip 23 is sheared and broken. That is, smaller than the dimension L1 of the plane of the opening 48K of the dimension L2 chip 23 of the recess 48, and, when greater than the predetermined value is less than the shear breaking strength tau max shear stress tau acting in shear plane SF can do. As a result, it is possible to prevent the chip 23 from being sheared and destroyed in the upper collet raising step (step S18).
　すなわち、本実施の形態では、凹部４８の開口４８Ｋの寸法Ｌ２を所定値よりも大きくし、かつ、チップ２３の平面の寸法Ｌ１よりも小さくすることができる。ここで所定値とは、上コレット上昇工程（ステップＳ１８）において、上コレット３０を上昇させる際にチップ２３に作用するせん断応力がチップ２３のせん断破壊強度（せん断強度）と等しくなるような、凹部４８の開口４８Ｋの寸法Ｌ２の値である。このように、凹部４８の開口４８Ｋの寸法Ｌ２を所定値よりも大きくし、かつ、チップ２３の平面の寸法Ｌ１よりも小さくすることにより、粘着シート２１に貼り付けられているチップ２３をピックアップする際に、チップ２３の破壊を防止できる。 That is, in the present embodiment, the dimension L2 of the opening 48K of the recess 48 can be made larger than a predetermined value and smaller than the dimension L1 of the chip 23 plane. Here, the predetermined value is a concave portion in which the shear stress acting on the tip 23 when raising the upper collet 30 in the upper collet raising step (step S18) becomes equal to the shear fracture strength (shear strength) of the tip 23. This is the value of the dimension L2 of the 48 openings 48K. In this way, the chip 23 attached to the adhesive sheet 21 is picked up by making the dimension L2 of the opening 48K of the recess 48 larger than a predetermined value and smaller than the dimension L1 of the plane of the chip 23. At this time, the chip 23 can be prevented from being broken.
　特に、式（７）から明らかなように、チップ２３の厚さｄが薄くなると、せん断応力τが大きくなる。このような場合でも、本実施の形態では、凹部４８の開口４８Ｋの寸法Ｌ２を大きくする方向に調整することによって、式（７）に示すせん断応力τを小さくできる。従って、本実施の形態では、厚さｄが薄いチップ２３をピックアップする際にもチップ２３の破壊を防止できる。
 
（実施の形態の変形例）
　次に、図９から図１１Ｅを参照し、本発明の実施の形態の変形例に係るピックアップ装置及びピックアップ方法について説明する。 In particular, as apparent from the equation (7), the shear stress τ increases as the thickness d of the chip 23 decreases. Even in such a case, in the present embodiment, the shear stress τ shown in the equation (7) can be reduced by adjusting the dimension L2 of the opening 48K of the recess 48 in the increasing direction. Therefore, in this embodiment, the chip 23 can be prevented from being broken even when the chip 23 having a small thickness d is picked up.

(Modification of the embodiment)
Next, with reference to FIGS. 9 to 11E, a pickup apparatus and a pickup method according to a modification of the embodiment of the present invention will be described.
　初めに、図９を参照し、本変形例に係るピックアップ装置について説明する。図９は、本変形例に係るピックアップ装置１０ａの概略断面図である。 First, a pickup device according to this modification will be described with reference to FIG. FIG. 9 is a schematic cross-sectional view of a pickup device 10a according to this modification.
　本変形例に係るピックアップ装置１０ａは、以下の点で、図１等と共に上述した実施の形態に係るピックアップ装置１０と相違する。すなわち、本変形例に係るピックアップ装置１０ａでは、ニードル４４ａは、ニードル４４ａの先端４４ａＴが下コレット４０ａの凹部４８ａの底面４９ａから突出した状態で、下コレット４０ａと一体に設けられている。 The pickup device 10a according to the present modification is different from the pickup device 10 according to the embodiment described above with reference to FIG. That is, in the pickup device 10a according to this modification, the needle 44a is provided integrally with the lower collet 40a in a state where the tip 44aT of the needle 44a protrudes from the bottom surface 49a of the recess 48a of the lower collet 40a.
　本変形例に係るピックアップ装置１０ａが、少なくとも上コレット３０、下コレット４０ａ及び制御部６０を有する点は、図１等と共に上述した実施の形態と同様である。また、本変形例における上コレット３０及び制御部６０は、図１等と共に上述した実施の形態における上コレット３０及び制御部６０と、それぞれ同様の構成にすることができる。図９では、図１等と共に上述した実施の形態に係るピックアップ装置１０と同様の箇所については、同一の符号を付し、その説明を省略する。 The pickup device 10a according to this modification has at least the upper collet 30, the lower collet 40a, and the control unit 60, which is the same as the embodiment described above with reference to FIG. Further, the upper collet 30 and the control unit 60 in the present modification can have the same configuration as the upper collet 30 and the control unit 60 in the embodiment described above with reference to FIG. In FIG. 9, portions similar to those of the pickup device 10 according to the embodiment described above with reference to FIG. 1 and the like are denoted by the same reference numerals, and description thereof is omitted.
　一方、本変形例における下コレット４０ａは、下コレット本体部４１ａ、下コレット駆動機構４２ａ、下コレット排気機構４３、及びニードル４４ａを有するが、下コレット本体部４１ａ及びニードル４４ａの構成が、図１等と共に上述した実施の形態と異なる。 On the other hand, the lower collet 40a in the present modification includes a lower collet body 41a, a lower collet drive mechanism 42a, a lower collet exhaust mechanism 43, and a needle 44a. The configurations of the lower collet body 41a and the needle 44a are shown in FIG. This is different from the above-described embodiment.
　下コレット本体部４１ａが、下コレット上端部４５ａ及び下コレット軸部４６ａを有し、下コレット上端部４５ａが周縁側部材４７ａを有する点は、図１等と共に上述した実施の形態と同様である。また、周縁側部材４７ａの上面４５ａＳの中心側に開口され、上面４５ａＳに接触させた粘着シート２１を吸引するための凹部４８ａが形成されている点は、図１等と共に上述した実施の形態と同様である。 The lower collet main body portion 41a has a lower collet upper end portion 45a and a lower collet shaft portion 46a, and the lower collet upper end portion 45a has a peripheral side member 47a, similar to the embodiment described above with reference to FIG. . Moreover, the point which is opened in the center side of the upper surface 45aS of the peripheral side member 47a, and the recessed part 48a for attracting | sucking the adhesive sheet 21 made to contact the upper surface 45aS is formed in FIG. It is the same.
　しかし、本変形例では、ニードル４４ａは、ニードル本体部５２ａ及び流体供給機構５４のみを有する。すなわち、ニードル４４ａは、下コレット本体部４１ａの凹部４８ａの底面４９ａからニードル４４ａの先端４４ａＴが突出した状態で、下コレット本体部４１ａと一体に設けられており、下コレット本体部４１ａに対し垂直方向に移動可能には設けられていない。 However, in this modification, the needle 44a has only the needle main body 52a and the fluid supply mechanism 54. That is, the needle 44a is provided integrally with the lower collet body 41a with the tip 44aT of the needle 44a protruding from the bottom surface 49a of the recess 48a of the lower collet body 41a, and is perpendicular to the lower collet body 41a. It is not provided to be movable in the direction.
　これに伴い、下コレット本体部４１ａの吸引孔５０ａは、ニードル４４ａを垂直方向に移動可能に貫通させるものでなくてもよい。従って、吸引孔５０ａは、図９に示す例のように、凹部４８ａの、ニードル本体部５２ａが設けられている部分以外の部分に、開口５１ａを有するように設けられていてもよい。図９に示す例では、ニードル本体部５２ａが設けられている凹部４８ａの底面４９ａの中央ではなく、底面４９ａの周縁部に、吸引孔５０ａの開口５１ａが形成されている。 Accordingly, the suction hole 50a of the lower collet main body 41a may not penetrate the needle 44a so as to be movable in the vertical direction. Therefore, the suction hole 50a may be provided so as to have an opening 51a in a portion of the recess 48a other than the portion where the needle main body 52a is provided, as in the example shown in FIG. In the example shown in FIG. 9, the opening 51a of the suction hole 50a is formed not on the center of the bottom surface 49a of the recess 48a in which the needle main body 52a is provided, but on the peripheral portion of the bottom surface 49a.
　なお、ニードル本体部５２ａに供給孔５５ａが設けられており、ニードル本体部５２ａの先端４４ａＴに設けられた開口５６ａと連通しているのは、図１等と共に上述した実施の形態と同様である。 The needle body 52a is provided with a supply hole 55a and communicates with the opening 56a provided at the tip 44aT of the needle body 52a, as in the embodiment described above with reference to FIG. .
　その他、下コレット本体部４１ａに振動部が設けられていてもよい点も、図１等と共に上述した実施の形態と同様であるが、以下では、図９に示すように、振動部が設けられていない例について説明する。 In addition, although the vibration part may be provided in the lower collet main body part 41a is the same as that of the embodiment described above with reference to FIG. 1 and the like, hereinafter, the vibration part is provided as shown in FIG. An example that is not described will be described.
　次に、図１０から図１１Ｅを参照し、図９と共に上述した本変形例に係るピックアップ方法について説明する。図１０は、本変形例に係るピックアップ方法の各工程の手順を説明するためのフローチャートである。図１１Ａから図１１Ｅは、本変形例に係るピックアップ方法の各工程におけるピックアップ装置１０ａの状態を示す概略断面図である。 Next, with reference to FIG. 10 to FIG. 11E, the pickup method according to this modification described above with reference to FIG. 9 will be described. FIG. 10 is a flowchart for explaining the procedure of each step of the pickup method according to this modification. 11A to 11E are schematic cross-sectional views showing the state of the pickup device 10a in each step of the pickup method according to this modification.
　図１０に示すように、本変形例に係るピックアップ方法は、上コレット下降工程（ステップＳ２１）、上コレット排気工程（ステップＳ２２）、下コレット上昇工程（ステップＳ２３）、下コレット排気工程（ステップＳ２４）、及び上コレット上昇工程（ステップＳ２５）を有する。 As shown in FIG. 10, the pick-up method according to this modification includes an upper collet lowering step (step S21), an upper collet exhausting step (step S22), a lower collet rising step (step S23), and a lower collet exhausting step (step S24). ) And an upper collet raising step (step S25).
　なお、図１０に示すように、上コレット下降工程（ステップＳ２１）から下コレット上昇工程（ステップＳ２３）までは、本発明における第１のステップに相当する。また、下コレット排気工程（ステップＳ２４）は、本発明における第２のステップに相当する。また、上コレット上昇工程（ステップＳ２５）は、本発明における第３のステップに相当する。 In addition, as shown in FIG. 10, the upper collet lowering step (step S21) to the lower collet rising step (step S23) correspond to the first step in the present invention. The lower collet exhaust process (step S24) corresponds to the second step in the present invention. The upper collet raising step (step S25) corresponds to the third step in the present invention.
　本変形例に係るピックアップ方法を行う前に、予め、チップ２３が貼り付けられた粘着シート２１をステージ２０に固定して保持する工程を行う点は、図１等と共に上述した実施の形態と同様である。また、本変形例に係るピックアップ方法の上コレット下降工程（ステップＳ２１）、上コレット排気工程（ステップＳ２２）及び下コレット上昇工程（ステップＳ２３）は、それぞれ図１等と共に上述した実施の形態に係るピックアップ方法の上コレット下降工程（ステップＳ１１）、上コレット排気工程（ステップＳ１２）及び下コレット上昇工程（ステップＳ１３）と同様である。また、図１１Ａから図１１Ｃは、それぞれ上コレット下降工程（ステップＳ２１）、上コレット排気工程（ステップＳ２２）及び下コレット上昇工程（ステップＳ２３）を行う際の、ピックアップ装置１０ａの状態を、それぞれ示す。 Before performing the pick-up method according to this modification, the step of fixing and holding the pressure-sensitive adhesive sheet 21 with the chip 23 affixed to the stage 20 in advance is the same as in the embodiment described above with reference to FIG. It is. In addition, the upper collet lowering step (step S21), the upper collet exhausting step (step S22), and the lower collet rising step (step S23) according to the present modification are respectively related to the embodiment described above with reference to FIG. The pickup method is the same as the upper collet lowering step (step S11), the upper collet exhausting step (step S12), and the lower collet rising step (step S13). 11A to 11C show states of the pickup device 10a when performing the upper collet lowering step (step S21), the upper collet exhausting step (step S22), and the lower collet rising step (step S23), respectively. .
　上コレット下降工程（ステップＳ２１）、上コレット排気工程（ステップＳ２２）及び下コレット上昇工程（ステップＳ２３）の次に、下コレット排気工程（ステップＳ２４）を行う。ステップＳ２４では、下コレット４０ａの凹部４８ａと粘着シート２１とによって形成された空間ＳＰを減圧し、粘着シート２１を吸引する。図１１Ｄは、ステップＳ２４を行う際のピックアップ装置１０ａの状態を示す。 Next to the upper collet lowering step (step S21), the upper collet exhausting step (step S22) and the lower collet rising step (step S23), the lower collet exhausting step (step S24) is performed. In step S24, the space SP formed by the recess 48a of the lower collet 40a and the adhesive sheet 21 is decompressed, and the adhesive sheet 21 is sucked. FIG. 11D shows the state of the pickup device 10a when performing step S24.
　図１１Ｄに示すように、凹部４８ａに形成されている吸引孔５０ａに接続されている、図９に示した下コレット排気機構４３により、凹部４８ａと粘着シート２１とにより形成されている空間ＳＰを減圧する。これにより、チップ２３の、凹部４８ａに対向する部分に貼り付けられている粘着シート２１が、凹部４８ａに吸引される。空間ＳＰの減圧の程度は、当該減圧による吸引によって、チップ２３の、凹部４８ａに対向する部分に貼り付けられている粘着シート２１の、チップ２３からの剥離が生ずる程度でよい。 As shown in FIG. 11D, the space SP formed by the recess 48a and the adhesive sheet 21 is formed by the lower collet exhaust mechanism 43 shown in FIG. 9 connected to the suction hole 50a formed in the recess 48a. Reduce pressure. Thereby, the adhesive sheet 21 affixed to the part of the chip 23 facing the recess 48a is sucked into the recess 48a. The degree of decompression of the space SP may be such that the adhesive sheet 21 attached to the portion of the chip 23 facing the recess 48a is peeled off from the chip 23 by the suction by the decompression.
　下コレット排気工程（ステップＳ２４）では、空間ＳＰの減圧によって粘着シート２１が凹部４８ａに吸引され、チップ２３の、凹部４８ａに対向する部分に貼り付けられている粘着シート２１が剥離する。このとき、剥離した粘着シート２１を貫通してニードル４４ａが挿入される。実際には、下コレット排気機構４３により減圧される吸引孔５０ａが粘着シート２１を吸引する吸引力に応じて、ニードル４４ａが凹部４８ａの底面４９ａから突出する高さを設計することが可能である。 In the lower collet exhausting step (step S24), the pressure-sensitive adhesive sheet 21 is sucked into the concave portion 48a by the decompression of the space SP, and the pressure-sensitive adhesive sheet 21 attached to the portion of the chip 23 facing the concave portion 48a is peeled off. At this time, the needle 44a is inserted through the peeled adhesive sheet 21. Actually, it is possible to design the height at which the needle 44a protrudes from the bottom surface 49a of the recess 48a according to the suction force by which the suction hole 50a decompressed by the lower collet exhaust mechanism 43 sucks the adhesive sheet 21. .
　また、下コレット排気工程（ステップＳ２４）では、このようにして挿入されたニードル４４ａにより、チップ２３と、剥離した粘着シート２１との間に、流体ＦＬを注入する。そのようにすることによって、チップ２３の、凹部４８ａに対向する部分のうち、より広い部分から、粘着シート２１を剥離させる。 In the lower collet exhausting step (step S24), the fluid FL is injected between the tip 23 and the peeled adhesive sheet 21 by the needle 44a inserted in this manner. By doing so, the pressure-sensitive adhesive sheet 21 is peeled from a wider portion of the portion of the chip 23 facing the recess 48a.
　すなわち、本変形例では、図１等と共に上述した実施の形態に係るピックアップ方法における下コレット排気工程（ステップＳ１４）、ニードル挿入工程（ステップＳ１６）及び流体注入工程（ステップＳ１７）を同時に行う（ステップＳ２４）。 That is, in this modification, the lower collet exhaust process (step S14), the needle insertion process (step S16), and the fluid injection process (step S17) in the pickup method according to the embodiment described above with reference to FIG. S24).
　下コレット排気工程（ステップＳ２４）の後、上コレット上昇工程（ステップＳ２５）を行う。上コレット上昇工程（ステップＳ２５）は、図１等と共に上述した実施の形態における上コレット上昇工程（ステップＳ１８）と同様にすることができる。図１１Ｅは、ステップＳ２５を行う際のピックアップ装置１０ａの状態を示す。 After the lower collet exhaust process (step S24), the upper collet raising process (step S25) is performed. The upper collet raising step (step S25) can be the same as the upper collet raising step (step S18) in the embodiment described above with reference to FIG. FIG. 11E shows the state of the pickup device 10a when performing step S25.
　本変形例でも、上コレット上昇工程（ステップＳ２５）でチップ２３を粘着シート２１から剥離させる前に、上述の如くステップＳ２４にて、下コレット４０ａにより粘着シート２１を凹部４８ａに吸引し、かつニードル４４ａにより粘着シート２１とチップ２３との間に流体ＦＬを注入する。このようにすることにより、チップ２３の、凹部４８ａに対向する部分から粘着シート２１を剥離させておく。これにより、上コレット上昇工程（ステップＳ２５）の開始時点におけるチップ２３と粘着シート２１との接着面積を小さくすることができるため、上コレット上昇工程（ステップＳ２５）における、剥離力Ｆを低減でき、剥離に要する時間ｔを短縮することができる。 Also in this modified example, before the chip 23 is peeled from the adhesive sheet 21 in the upper collet raising step (step S25), the adhesive sheet 21 is sucked into the recess 48a by the lower collet 40a and the needle in step S24 as described above. The fluid FL is injected between the adhesive sheet 21 and the chip 23 by 44a. By doing in this way, the adhesive sheet 21 is peeled off from the part of the chip 23 facing the recess 48a. Thereby, since it is possible to reduce the bonding area between the chip 23 and the adhesive sheet 21 at the start of the upper collet raising process (step S25), the peeling force F in the upper collet raising process (step S25) can be reduced, The time t required for peeling can be shortened.
　また、本変形例でも、凹部４８ａの開口４８ａＫの寸法Ｌ２を、上コレット上昇工程（ステップＳ２５）においてチップ２３に働くせん断応力τがチップ２３のせん断破壊強度（せん断強度）と等しくなるような所定値よりも大きくする。さらに、凹部４８ａの開口４８ａＫの寸法Ｌ２を、チップ２３の平面の寸法Ｌ１よりも小さくすることができる。これにより、粘着シート２１に貼り付けられているチップ２３をピックアップする際のチップ２３の破壊を防止できる。 Also in this modification, the dimension L2 of the opening 48aK of the recess 48a is set so that the shear stress τ acting on the tip 23 in the upper collet raising step (step S25) becomes equal to the shear fracture strength (shear strength) of the tip 23. Make it larger than the value. Furthermore, the dimension L2 of the opening 48aK of the recess 48a can be made smaller than the dimension L1 of the plane of the chip 23. Thereby, destruction of the chip | tip 23 at the time of picking up the chip | tip 23 currently affixed on the adhesive sheet 21 can be prevented.
　また、本変形例でも、式（７）に示したせん断応力τの見積もりを適用できる。従って、チップ２３の厚さｄが薄い場合に、凹部４８ａの開口４８ａＫの寸法Ｌ２を大きくする方向に調整することによって、式（７）に示すせん断応力τを小さくできる。このようにすることによって、厚さｄが薄いチップ２３をピックアップする際にもチップ２３の破壊を防止できる。 Also in this modification, the estimation of the shear stress τ shown in Equation (7) can be applied. Therefore, when the thickness d of the chip 23 is small, the shear stress τ shown in the equation (7) can be reduced by adjusting the dimension L2 of the opening 48aK of the recess 48a in the increasing direction. By doing so, the chip 23 can be prevented from being broken even when the chip 23 having a small thickness d is picked up.
　以上、本発明の好ましい実施の形態について記述したが、本発明は、かかる特定の実施の形態に限定されるものではなく、「請求の範囲」に記載された本発明の要旨の範囲内において、種々の変形・変更が可能である。 The preferred embodiments of the present invention have been described above, but the present invention is not limited to such specific embodiments, and within the scope of the gist of the present invention described in the “claims” Various modifications and changes are possible.
　本国際出願は２０１０年８月３１日に出願した日本国特許出願２０１０－１９４６１９号に基づく優先権を主張するものであり、日本国特許出願２０１０－１９４６１９号の全内容を本国際出願に援用する。 This international application claims priority based on Japanese Patent Application No. 2010-194619 filed on August 31, 2010, and the entire contents of Japanese Patent Application No. 2010-194619 are incorporated herein by reference. .
１０，１０ａ　ピックアップ装置
３０　上コレット
３２　上コレット駆動機構
４０，４０ａ　下コレット
４２，４２ａ　下コレット駆動機構
４４，４４ａ　ニードル
４４Ｔ，４４ａＴ　ニードルの先端
４５Ｓ，４５ａＳ　下コレット上端部の上面
４８，４８ａ　凹部
４８Ｋ，４８ａＫ　凹部の開口
４９，４９ａ　凹部の底面
５１　　凹部の底面に形成された開口
５７　振動部 10, 10a Pick-up device 30 Upper collet 32 Upper collet drive mechanism 40, 40a Lower collet drive mechanism 42, 42a Lower collet drive mechanism 44, 44a Needle tip 44S, 44aT Needle tip 45S, 45aS Upper surface 48, 48a of upper end of lower collet Recess 48K, 48aK Recess opening 49, 49a Recess bottom face 51 Opening 57 formed on the bottom face of the recess

Claims (10)

  1. 　粘着シートに貼り付けられているチップに第１の吸着部を近づけて接触させるとともに、前記粘着シートに接触する接触面に凹部が形成されている第２の吸着部を前記粘着シートに近づけ、前記第１の吸着部と対向するように前記粘着シートに前記第２の吸着部を接触させ、
    　前記粘着シートに接触している前記第２の吸着部により前記粘着シートを吸引するとともに、前記粘着シートと前記チップとの間に、注入部により流体を注入することによって、前記チップの、前記凹部に対向する部分から、前記粘着シートを剥離させ、
    　前記第１の吸着部により前記チップを吸着している状態で、前記第２の吸着部が吸引している前記粘着シートから前記第１の吸着部を遠ざけることによって、前記チップを前記粘着シートから剥離させてピックアップする、ピックアップ方法。     The first adsorbing part is brought close to and in contact with the chip attached to the adhesive sheet, and the second adsorbing part in which a concave portion is formed on the contact surface in contact with the adhesive sheet is brought close to the adhesive sheet, Bringing the second adsorbing portion into contact with the adhesive sheet so as to face the first adsorbing portion;
    The suction part is sucked by the second suction part in contact with the pressure-sensitive adhesive sheet, and a fluid is injected between the pressure-sensitive adhesive sheet and the chip by the injection part, whereby the concave part of the chip The adhesive sheet is peeled off from the part facing the
    The chip is removed from the pressure-sensitive adhesive sheet by moving the first suction part away from the pressure-sensitive adhesive sheet sucked by the second suction part in a state where the chip is sucked by the first suction part. Pick-up method to pick up after peeling.
  2. 　前記第２の吸着部は、前記凹部の開口の寸法が、前記粘着シートから前記第１の吸着部を遠ざける際に前記チップに作用するせん断応力が前記チップのせん断強度と等しくなるような所定値よりも大きく、かつ、前記チップの平面の寸法よりも小さいものである、請求項１に記載のピックアップ方法。 The second adsorbing portion has a predetermined opening size of the concave portion such that a shear stress acting on the chip when the first adsorbing portion is moved away from the adhesive sheet is equal to a shear strength of the chip. The pick-up method according to claim 1, wherein the pick-up method is larger than and smaller than a plane dimension of the chip.
  3. 　前記粘着シートに接触している前記第２の吸着部により前記粘着シートを吸引するとともに、前記粘着シートと前記チップとの間に、前記注入部により流体を注入することによって、前記チップの、前記凹部に対向する部分から、前記粘着シートを剥離させる際、前記第２の吸着部により前記粘着シートを吸引するとともに、振動部により前記粘着シートを振動させることによって、前記チップの、前記凹部に対向する部分からの前記粘着シートの剥離を開始させ、剥離が開始した前記粘着シートと前記チップとの間に前記注入部を挿入し、挿入した前記注入部により流体を注入することによって、前記チップの、前記凹部に対向する部分から、前記粘着シートを剥離させる、請求項１に記載のピックアップ方法。 While sucking the pressure-sensitive adhesive sheet by the second suction part in contact with the pressure-sensitive adhesive sheet and injecting a fluid by the injection part between the pressure-sensitive adhesive sheet and the chip, the chip, When the pressure-sensitive adhesive sheet is peeled from a portion facing the recess, the pressure-sensitive adhesive sheet is sucked by the second suction part, and the pressure-sensitive adhesive sheet is vibrated by the vibration part to face the recess of the chip. Peeling of the pressure-sensitive adhesive sheet from the part to be inserted, inserting the injection part between the pressure-sensitive adhesive sheet and the chip where peeling has started, and injecting fluid through the inserted injection part, The pickup method according to claim 1, wherein the pressure-sensitive adhesive sheet is peeled off from a portion facing the concave portion.
  4. 　前記第２の吸着部は、前記凹部の底面に、前記粘着シートを吸引する吸引孔と連通する開口が形成されたものであり、
    　前記注入部は、前記吸引孔を通って、前記注入部の先端が前記開口から突出自在に設けられたものである、請求項１から請求項３のいずれかに記載のピックアップ方法。     The second suction part is formed with an opening communicating with a suction hole for sucking the pressure-sensitive adhesive sheet on the bottom surface of the concave part,
    The pick-up method according to claim 1, wherein the injection part is provided so that a tip of the injection part protrudes from the opening through the suction hole.
  5. 　前記注入部は、前記注入部の先端が前記凹部の底面から突出した状態で、前記第２の吸着部と一体に設けられたものである、請求項１から請求項３のいずれかに記載のピックアップ方法。 The said injection | pouring part is provided in one with the said 2nd adsorption | suction part in the state which the front-end | tip of the said injection | pouring part protruded from the bottom face of the said recessed part. Pickup method.
  6. 　チップを吸着する第１の吸着部と、
    　前記第１の吸着部を移動するように駆動する第１の駆動部と、
    　粘着シートに接触する接触面に凹部が形成されており、前記粘着シートを吸引する第２の吸着部と、
    　前記第２の吸着部を移動するように駆動する第２の駆動部と、
    　流体を注入する注入部と、
    　前記第１の駆動部により、粘着シートに貼り付けられているチップに前記第１の吸着部を近づけて接触させるとともに、前記第２の駆動部により、前記第２の吸着部を前記粘着シートに近づけ、前記第１の吸着部と対向するように前記粘着シートに前記第２の吸着部を接触させ、
    　前記粘着シートに接触している前記第２の吸着部により前記粘着シートを吸引するとともに、前記粘着シートと前記チップとの間に前記注入部により流体を注入することによって、前記チップの、前記凹部に対向する部分から、前記粘着シートを剥離させ、
    　前記第１の吸着部により前記チップを吸着している状態で、前記第２の吸着部が吸引している前記粘着シートから前記第１の吸着部を前記第１の駆動部により遠ざけることによって、前記チップを前記粘着シートから剥離させてピックアップする、制御部と
    を有する、ピックアップ装置。     A first suction part for sucking chips;
    A first drive unit that drives the first suction unit to move;
    A concave portion is formed on the contact surface that contacts the pressure-sensitive adhesive sheet, and a second suction part that sucks the pressure-sensitive adhesive sheet;
    A second drive unit that drives the second suction unit to move;
    An injection part for injecting a fluid;
    The first drive unit brings the first suction unit into contact with the chip attached to the adhesive sheet, and the second drive unit causes the second suction unit to be brought into contact with the adhesive sheet. Approach the second suction part to the adhesive sheet so as to face the first suction part,
    The suction part is sucked by the second suction part in contact with the pressure-sensitive adhesive sheet, and fluid is injected between the pressure-sensitive adhesive sheet and the chip by the injection part. The adhesive sheet is peeled off from the part facing the
    By moving the first suction part away from the adhesive sheet sucked by the second suction part while the chip is sucked by the first suction part, by the first drive part, A pick-up device having a control part which peels and picks up the chip from the adhesive sheet.
  7. 　前記第２の吸着部は、前記凹部の開口の寸法が、前記粘着シートから前記第１の吸着部を前記第１の駆動部により遠ざける際に前記チップに作用するせん断応力が前記チップのせん断強度と等しくなるような所定値よりも大きく、かつ、前記チップの平面の寸法よりも小さいものである、請求項６に記載のピックアップ装置。 In the second suction part, the size of the opening of the concave part is determined by shear stress acting on the chip when the first suction part is moved away from the adhesive sheet by the first driving part. The pickup device according to claim 6, which is larger than a predetermined value equal to and smaller than a plane dimension of the chip.
  8. 　前記粘着シートを振動させる振動部を有し、
    　前記制御部は、前記第２の吸着部により前記粘着シートを吸引するとともに、前記振動部により前記粘着シートを振動させることによって、前記チップの、前記凹部に対向する部分からの前記粘着シートの剥離を開始させ、剥離を開始した前記粘着シートと前記チップとの間に前記注入部を挿入し、挿入した前記注入部により流体を注入することによって、前記チップの、前記凹部に対向する部分から、前記粘着シートを剥離させるものである、請求項６に記載のピックアップ装置。     Having a vibrating part for vibrating the adhesive sheet;
    The control unit sucks the pressure-sensitive adhesive sheet by the second suction unit and vibrates the pressure-sensitive adhesive sheet by the vibration unit, thereby peeling the pressure-sensitive adhesive sheet from a portion of the chip facing the recess. From the portion of the chip facing the recess, by inserting the injection part between the pressure-sensitive adhesive sheet that started peeling and the chip, and injecting fluid by the inserted injection part, The pickup device according to claim 6, wherein the pressure-sensitive adhesive sheet is peeled off.
  9. 　前記第２の吸着部は、前記凹部の底面に、前記粘着シートを吸引する吸引孔と連通する開口が形成されたものであり、
    　前記注入部は、前記吸引孔を通って、前記注入部の先端が前記開口から突出自在に設けられたものである、請求項６から請求項８のいずれかに記載のピックアップ装置。     The second suction part is formed with an opening communicating with a suction hole for sucking the pressure-sensitive adhesive sheet on the bottom surface of the concave part,
    The pickup device according to any one of claims 6 to 8, wherein the injection portion is provided so that a tip of the injection portion protrudes from the opening through the suction hole.
  10. 　前記注入部は、前記注入部の先端が前記凹部の底面から突出した状態で、前記第２の吸着部と一体に設けられたものである、請求項６から請求項８のいずれかに記載のピックアップ装置。 The said injection | pouring part is a state in which the front-end | tip of the said injection | pouring part protruded from the bottom face of the said recessed part, and is provided in one with the said 2nd adsorption | suction part. Pickup device.
PCT/JP2011/065058 2010-08-31 2011-06-30 Pickup method and pickup device WO2012029402A1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150314544A1 (en) * 2012-12-13 2015-11-05 Michelin Recherche Et Technique, S.A. Method for retreading a vehicle tire casing and vehicle casing obtained by this method

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016009822A (en) * 2014-06-26 2016-01-18 住友ベークライト株式会社 Dicing film
CN107369642A (en) * 2017-06-08 2017-11-21 太极半导体（苏州）有限公司 A kind of suction method for being avoided that ultra-thin chip fragmentation
US10497667B2 (en) * 2017-09-26 2019-12-03 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus for bond wave propagation control
US10043688B1 (en) * 2018-01-10 2018-08-07 Micron Technology, Inc. Method for mount tape die release system for thin die ejection
US11234351B2 (en) * 2018-10-18 2022-01-25 Facebook Technologies, Llc Display fabrication microassembly system
CN109891569B (en) * 2019-01-29 2024-04-02 京东方科技集团股份有限公司 Element pickup device, and preparation method and application method thereof
CN110349896B (en) * 2019-07-23 2021-11-12 深圳市律远汇智科技有限公司 Chip picking system with adjusting function
JP7237033B2 (en) * 2020-02-18 2023-03-10 三菱電機株式会社 Chip pick-up device, chip pick-up method, and semiconductor device manufacturing method
JP7412219B2 (en) * 2020-02-25 2024-01-12 ファスフォードテクノロジ株式会社 Die bonding equipment, semiconductor device manufacturing method, and peeling equipment
JP2022157318A (en) * 2021-03-31 2022-10-14 芝浦メカトロニクス株式会社 Pick-up collet, pick-up device, and mounting device
JP2022157320A (en) * 2021-03-31 2022-10-14 芝浦メカトロニクス株式会社 Pick-up collet, pick-up device, and mounting device
JP2023049407A (en) * 2021-09-29 2023-04-10 芝浦メカトロニクス株式会社 Pickup device and mounting device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06204319A (en) * 1993-01-07 1994-07-22 Fujitsu Ltd Method and device for picking-up semiconductor chip
JPH11274181A (en) * 1998-03-26 1999-10-08 Matsushita Electric Ind Co Ltd Chip push-up device
JP2009277912A (en) * 2008-05-15 2009-11-26 Fujitsu Microelectronics Ltd Peeling method and peeling device
JP2011054648A (en) * 2009-08-31 2011-03-17 Elpida Memory Inc Method of manufacturing semiconductor device

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60102754A (en) * 1983-11-09 1985-06-06 Nec Corp Chip isolating mechanism
JPH0697212A (en) * 1992-09-14 1994-04-08 Hitachi Ltd Die-bonding device and semiconductor manufacturing device using the same
JP2002050670A (en) * 2000-08-04 2002-02-15 Toshiba Corp Pick-up device and pick-up method
JP3915613B2 (en) * 2002-07-01 2007-05-16 松下電器産業株式会社 Pickup device and pick-up method of chip on wafer sheet
JP2005064172A (en) * 2003-08-11 2005-03-10 Shinkawa Ltd Die pickup method and die pickup jig
CH697213A5 (en) * 2004-05-19 2008-06-25 Alphasem Ag Method and apparatus for peeling a film adhered to a flexible component.
JP5201990B2 (en) * 2005-08-31 2013-06-05 芝浦メカトロニクス株式会社 Semiconductor chip pickup device
KR20070120319A (en) * 2006-06-19 2007-12-24 삼성전자주식회사 Apparatus having a pair of ejectors for detaching semiconductor chips and method of detaching semiconductor chips using the apparatus
JP5525200B2 (en) * 2008-07-28 2014-06-18 積水化学工業株式会社 Manufacturing method of semiconductor chip laminated body
JP5343525B2 (en) * 2008-11-19 2013-11-13 富士電機株式会社 Semiconductor device manufacturing apparatus and semiconductor device manufacturing method
CN102472790B (en) * 2009-08-02 2015-01-28 Qmc株式会社 Pickup apparatus and LED chip classification apparatus including same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06204319A (en) * 1993-01-07 1994-07-22 Fujitsu Ltd Method and device for picking-up semiconductor chip
JPH11274181A (en) * 1998-03-26 1999-10-08 Matsushita Electric Ind Co Ltd Chip push-up device
JP2009277912A (en) * 2008-05-15 2009-11-26 Fujitsu Microelectronics Ltd Peeling method and peeling device
JP2011054648A (en) * 2009-08-31 2011-03-17 Elpida Memory Inc Method of manufacturing semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150314544A1 (en) * 2012-12-13 2015-11-05 Michelin Recherche Et Technique, S.A. Method for retreading a vehicle tire casing and vehicle casing obtained by this method
US10046533B2 (en) * 2012-12-13 2018-08-14 Compagnie Generale Des Etablissements Michelin Method for retreading a vehicle tire casing and vehicle casing obtained by this method

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