WO2012026801A3 - Methodology of forming optical lens for semiconductor light emitting device - Google Patents

Methodology of forming optical lens for semiconductor light emitting device Download PDF

Info

Publication number
WO2012026801A3
WO2012026801A3 PCT/MY2011/000114 MY2011000114W WO2012026801A3 WO 2012026801 A3 WO2012026801 A3 WO 2012026801A3 MY 2011000114 W MY2011000114 W MY 2011000114W WO 2012026801 A3 WO2012026801 A3 WO 2012026801A3
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
semiconductor light
optical lens
methodology
emitting device
Prior art date
Application number
PCT/MY2011/000114
Other languages
French (fr)
Other versions
WO2012026801A2 (en
Inventor
Huck Khim Koay
Original Assignee
Silq (Malaysia) Sdn Bhd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Silq (Malaysia) Sdn Bhd filed Critical Silq (Malaysia) Sdn Bhd
Priority to CN201180041273.5A priority Critical patent/CN103119738B/en
Publication of WO2012026801A2 publication Critical patent/WO2012026801A2/en
Publication of WO2012026801A3 publication Critical patent/WO2012026801A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

The present invention relates generally to a methodology of forming optical lens (103) on support structure (101) for semiconductor light emitting device (100) by applying low surface energy barrier band or surface (104) onto said support structure (101). Said optical lens (103) is used as an encapsulation over semiconductor light emitting die (102) to shape and extract light out from the semiconductor light emitting die (102), as well as to provide protection from mechanical damage and environmental influence.
PCT/MY2011/000114 2010-08-24 2011-06-20 Methodology of forming optical lens for semiconductor light emitting device WO2012026801A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201180041273.5A CN103119738B (en) 2010-08-24 2011-06-20 The method forming the optical lenses for light emitting semiconductor device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
MYPI2010003985 MY152737A (en) 2010-08-24 2010-08-24 Methodology of forming optical lens for semiconductor light emitting device
MYPI2010003985 2010-08-24

Publications (2)

Publication Number Publication Date
WO2012026801A2 WO2012026801A2 (en) 2012-03-01
WO2012026801A3 true WO2012026801A3 (en) 2012-04-19

Family

ID=45723955

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/MY2011/000114 WO2012026801A2 (en) 2010-08-24 2011-06-20 Methodology of forming optical lens for semiconductor light emitting device

Country Status (4)

Country Link
CN (1) CN103119738B (en)
MY (1) MY152737A (en)
TW (1) TWI487152B (en)
WO (1) WO2012026801A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI568027B (en) * 2012-12-21 2017-01-21 光寶電子（廣州）有限公司 Led package structure and method of manufacturing dam structure thereof
CN103400930A (en) * 2013-07-23 2013-11-20 沈阳利昂电子科技有限公司 High-efficiency wide-optical angle LED (Light-Emitting Diode) module silicone lens structure and manufacturing method
US20150323965A1 (en) * 2014-05-09 2015-11-12 Apple Inc. Self-profiling friction pads for electronic devices

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001036150A (en) * 1999-07-19 2001-02-09 Citizen Electronics Co Ltd Light emitting diode
JP2001044512A (en) * 1999-07-29 2001-02-16 Sanyo Electric Co Ltd Hybrid integrated circuit device
JP2004119583A (en) * 2002-09-25 2004-04-15 Seiko Epson Corp Method for manufacturing optical element
US20060097621A1 (en) * 2004-11-05 2006-05-11 Samsung Electro-Mechanics Co., Ltd. White light emitting diode package and method of manufacturing the same
US20070111344A1 (en) * 2003-06-18 2007-05-17 Tridonic Optoelectronics Gmbh Method for the production of white leds and white led light source

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW331042B (en) * 1996-10-11 1998-05-01 Highlight Optoelectronics Inc The apparatus and producing method for wireless light emitted diode
KR100425566B1 (en) * 1999-06-23 2004-04-01 가부시키가이샤 시티즌 덴시 Light emitting diode
US20070096139A1 (en) * 2005-11-02 2007-05-03 3M Innovative Properties Company Light emitting diode encapsulation shape control
US8969908B2 (en) * 2006-04-04 2015-03-03 Cree, Inc. Uniform emission LED package
JP4954591B2 (en) * 2006-04-13 2012-06-20 シャープ株式会社 Light emitting device and manufacturing method thereof
JP2009038292A (en) * 2007-08-03 2009-02-19 Rohm Co Ltd Light emitting device, and manufacturing method thereof
JP2010129923A (en) * 2008-11-28 2010-06-10 Showa Denko Kk Light-emitting member, light-emitting device, illumination device, backlight device and method for manufacturing light-emitting member

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001036150A (en) * 1999-07-19 2001-02-09 Citizen Electronics Co Ltd Light emitting diode
JP2001044512A (en) * 1999-07-29 2001-02-16 Sanyo Electric Co Ltd Hybrid integrated circuit device
JP2004119583A (en) * 2002-09-25 2004-04-15 Seiko Epson Corp Method for manufacturing optical element
US20070111344A1 (en) * 2003-06-18 2007-05-17 Tridonic Optoelectronics Gmbh Method for the production of white leds and white led light source
US20060097621A1 (en) * 2004-11-05 2006-05-11 Samsung Electro-Mechanics Co., Ltd. White light emitting diode package and method of manufacturing the same

Also Published As

Publication number Publication date
TW201232849A (en) 2012-08-01
CN103119738B (en) 2017-03-08
WO2012026801A2 (en) 2012-03-01
MY152737A (en) 2014-11-28
TWI487152B (en) 2015-06-01
CN103119738A (en) 2013-05-22

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