TWI568027B - Led package structure and method of manufacturing dam structure thereof - Google Patents

Description

Light-emitting diode package structure and manufacturing method thereof

The present invention relates to a light emitting diode package structure, a wall structure thereof, and a method for manufacturing the same, and particularly to a plurality of LED chips on a top surface of a substrate and having a wall structure to enclose the package gel. The inner LED package structure and the manufacturing method of the wall structure.

Due to the advancement of LED technology and the maturity of related peripheral integrated circuit control components and heat dissipation technology, the application of LEDs has become increasingly diversified.

As shown in FIG. 1 , the prior art has developed a light emitting diode package structure including a carrier plate 9 , a plurality of LED chips 92 disposed on the top surface of the carrier plate 9 , and a dam 94 surrounding The LED chips 92. The carrier board 9 includes an electrically conductive substrate 90, a Dielectric layer D, and a wiring layer 91. Most of the wafer 92 is connected to the wiring layers 91 on both sides by wire bonding 921, 922 by wire bonding. The wall 94 is a white frame surrounding the LED chips, and the encapsulating resin is filled in the middle (not shown). Some of the conventionally used walls are made by a molding method, which requires a mold to form a wall, resulting in an increase in manufacturing cost. When the shape of the white frame needs to be changed, the shape of the mold also changes. Therefore, such a conventional molding used to make a wall has no elasticity in terms of variation.

Another conventional technique is to use a dispenser to supply the glue and surround it around the periphery of the LED chips 92 and then undergo a curing procedure to complete the wall structure 94. The appearance of the fence 94 in this way often has no The good condition, especially at the joint of the starting point and the end point of the wall structure 94, is prone to protrusion, which often causes unevenness of the rubber surface and poor color uniformity. Therefore, it affects the problem of uneven shape in a large number of productions.

Furthermore, due to the limitation of the material properties of the rubber material, for example, a rubber material having a thixotropic index (also referred to as a thixotropic index, a thixotropic index) of 3.5, the aspect ratio of the conventional wall structure 94 is as shown in the figure. It is shown that the height h/width w) is generally less than 0.8, generally in the range of 0.6 to 0.7, that is, the appearance is low and wide, resulting in a small number of LED chips 92 that can be placed in the wall 94, which affects the overall design. In addition, the lower and wider wall structure 94 is easily pressed to the gold wire to create a risk of leakage. The gold wire 921 on the right side of Fig. 1 is easily pressed by the fence 94.

In addition, in the application of the luminaire, the LED package structure usually adds a secondary optical lens to change the light shape. For this purpose, the designer needs to consider the condition of "the outer diameter of the wall is close to the inner diameter of the optical lens" when designing the outer diameter of the wall. Therefore, when the outer diameter of the wall structure is too large, in addition to affecting the number of LED chips placed in the light-emitting area, the lamp manufacturer cannot directly apply the secondary optical lens of the general specification to the LED package structure.

The reason is that the present inventors have felt that the above problems can be improved, and that the present invention has been deliberately studied and used in conjunction with the theory, and a present invention which is reasonable in design and effective in improving the above problems has been proposed.

The technical problem to be solved by the present invention is to provide a light emitting diode package structure, which improves the problem that the conventional wall is easy to produce an uneven appearance, and has a high skinny (height/width ratio). The wall is used to reduce the probability of being pressed to the gold wire due to the short wall and reduce the occupation of the carrying plate area, thereby making the light-emitting area larger, and facilitating the lamp manufacturer to apply the secondary optics to the light-emitting diode package structure. Lens.

The technical problem to be solved by the present invention is to provide a method for manufacturing a wall of a light-emitting diode package structure, which can stably produce a wall structure with uniform shape and high output (large aspect ratio, height/ Width ratio) of the fence.

In order to solve the above technical problem, according to one aspect of the present invention, a light emitting diode package structure includes: a carrier plate body; at least one light emitting diode disposed on the carrier plate body; and a wall structure The wall structure is disposed on the top surface of the carrier body and surrounds the at least one light emitting diode, the wall structure comprises: a first adhesive layer; and a second adhesive layer disposed on the first adhesive layer, the second The height of the adhesive layer is greater than the height of the first adhesive layer, and the volume of the second adhesive layer is greater than or equal to the volume of the first adhesive layer; and an encapsulant disposed in the surrounding wall structure to encapsulate the light emitting diode .

In order to solve the above technical problem, according to one aspect of the present invention, a method for manufacturing a wall of a light emitting diode package structure is provided, which is suitable for a light emitting diode package structure, and includes the following steps: setting a dispensing of a glue machine The needle is coated with a first adhesive layer on a top surface of a carrier plate with a first glue discharge height and a first glue discharge pressure; and a second glue discharge height is used by the dispensing needle of the dispenser Applying a second adhesive layer to the first adhesive layer; The second dispensing height is greater than the first dispensing height, the second dispensing pressure is greater than the first dispensing pressure, and the second adhesive layer has a volume greater than or equal to the volume of the first adhesive layer.

In order to solve the above technical problems, according to one aspect of the present invention, a wall structure obtained by the above-described manufacturing method of a wall structure is provided.

The invention has the following beneficial effects: the invention utilizes dispensing instead of molding, which eliminates the use of the mold and reduces the manufacturing cost; moreover, the invention can be easily prepared by means of two dispensing methods. It also stabilizes the wall structure with high uniformity and avoids the overall yield of the LED package structure due to the poor appearance of the wall structure. Furthermore, the two-layered wall structure of the present invention can produce a relatively thin (height/width ratio) wall, which can reduce the probability of pressing onto the gold wire and reduce the occupation of the carrier plate on the other side. Increase the area for the area to place more wafers.

In order to further understand the technology, method and effect of the present invention in order to achieve the intended purpose, reference should be made to the detailed description and drawings of the present invention. The drawings and the annexed drawings are intended to be illustrative and not to limit the invention.

Please refer to FIG. 2, which is a plan view of the LED package structure of the present invention. The illuminating diode package structure of the present invention comprises a carrier board 10 and a plurality of LEDs 14 disposed on the carrier board 10, and the LEDs 14 are wires 142 (such as gold wires, alloy wires, etc.) They are connected to each other and to the wiring layer 12. Fig. 2A is an enlarged cross-sectional view of Fig. 2; Figure 2A and Figure 2B, respectively A schematic diagram of coating a first adhesive layer and a second adhesive layer in the LED package structure of the invention. The invention provides a method for manufacturing a wall of a light emitting diode package structure, comprising the following steps: First, as shown in FIG. 2A, a carrier board 10 is provided, the carrier board body 10 having a flat top surface for setting Light-emitting diode (LED). The carrier board 10 includes a substrate 11 and a wiring layer 12. The substrate 11 may be a conductive substrate or an insulating substrate such as a ceramic substrate, an aluminum substrate, a tantalum substrate, a tantalum carbide substrate, an anodized aluminum substrate, or an aluminum nitride substrate. The material of the circuit layer 12 may be gold, silver, nickel, palladium, copper, or the like. In the case of the substrate 11 having an insulating property, a wiring layer 12 is usually disposed on the substrate 11 for a plurality of LEDs 14 to be disposed thereon, and the LEDs 14 and the wiring layer are formed by bonding wires 142 or flip chip. 12 electrical connection. If the substrate 11 is made of a conductive material, an insulating layer (not shown) is usually provided between the substrate 11 and the wiring layer 12.

Regarding the method for manufacturing a wall according to the present invention, first, a first adhesive layer 21 is applied to the top surface of the carrier sheet 10, and the first adhesive layer 21 is layered and has a substantially flat top surface. The position of the first glue layer 21 is as shown by G of FIG. Then, as shown in FIG. 2B, a second adhesive layer 22 is coated on the first adhesive layer 21, and the second adhesive layer 22 is stacked on the first adhesive layer 21 in a strip shape. The height h2 of the second adhesive layer 22 is greater than the height h1 of the first adhesive layer 21. In this embodiment, the first adhesive layer 21 and the second adhesive layer 22 can be dispensed by a one-point glue machine (FIG. 2B is only represented by the glue needle 30), but is not limited thereto. The rubber material may be a silicone gel or an epoxy resin (Epoxy), as long as the polarities of the two are the same, and the bonding may be performed. For example, the first adhesive layer 21 and the second adhesive layer 22 are both silicone rubber, or both are rings. The oxygen resin, or one of the silicones and the other is an epoxy resin; and in order to increase the reflection, it is preferable to add a highly reflective rubber material of titanium oxide (TiO ₂ ) to the rubber.

In particular, the glue that is extruded under normal conditions depends on the shape of the hole of the glue needle. If the hole shape is circular, the extruded glue usually has a cylindrical shape. However, the shape of the hole of the dispensing needle can also be square. In the first adhesive layer 21 of the present embodiment, by adjusting the dispenser 30 with a slower dispensing speed L1-V (or a smaller dispensing pressure L1-P) with a lower height L1-H ( The distance between the glue tip 30 and the top surface of the carrier plate 10 is indicated so that the extruded glue exhibits a thin layered and generally flat top surface. The flat top surface of the first adhesive layer 21 allows the second adhesive layer 22 to be coated on a level flat base plane, thus making it easier to ensure that the second adhesive layer 22 has a uniform shape appearance.

As shown in FIG. 2B, when the second adhesive layer 22 is applied, the dispenser 30 can be used with a faster dispensing speed L2-V (or a larger dispensing pressure L2-P) with a higher height L2. -H (indicating the distance between the rubber needle head 30 and the top surface of the carrier plate 10), so that the extruded rubber material is relatively thin and forms a major part of the wall. The dispensing pressure L2-P of the second adhesive layer 22 of the present embodiment is preferably greater than the dispensing pressure L1-P of the first adhesive layer 21; the height h21 of the top surface of the dispensing adhesive head 30 and the first adhesive layer 21 (eg 2B) is greater than the height L1-H between the dispensing needle 30 and the carrier plate 10 (as shown in FIG. 2A).

In addition, even if the material of the first layer of the first layer 21 and the material of the carrier sheet 10 have different polarities, the intersection of the starting point and the end point of the first layer 21 is uneven. However, the first adhesive layer 21 of the present embodiment has a thin layer shape, and the influence is not large. Furthermore, the upper second adhesive layer 22 can cover the first adhesive layer 21 to improve the overall appearance. Thereby, when the wall is manufactured in a large amount in the invention, the wall structure 20 having a uniform shape can be stably produced, thereby avoiding the color point shift when the glue is in the point. Furthermore, the two-layered wall structure 20 of the present invention can produce a relatively thin (height/width ratio) wall. One side can reduce the probability of pressing onto the wire, and the other side reduces the area occupied by the carrier plate 10 and increases the functional area for placing more wafers. Compared with the conventional general single-layer structure, the aspect ratio is only 0.6-0.7. According to the experimental example of the present invention, the aspect ratio (h/w, as shown on the right side of FIG. 2B) may be greater than or equal to 0.8, or even Can be greater than 2.

Please refer to FIG. 3 , which is a flow chart of a pre-preparation procedure of the method for manufacturing a wall according to the present invention. Prior to the formal application of the above-mentioned wall structure, the present invention has a pre-preparation procedure for testing the glue supply parameters of the dispenser 30 in accordance with predetermined specifications of the LED package structure to obtain suitable manufacturing parameters. First, as shown in step S72, the parameters of the first adhesive layer are set, that is, the glue dispenser supplies glue to form the parameters of the first adhesive layer (the first set of parameters), such as the height L1-H, the pressure L1-P, and the speed. L1-V...etc. Then, in step S73, the first adhesive layer is applied to the carrier board (as shown in FIG. 2A); after step S73, the first adhesive layer may be first cured, but the baking step is Can be skipped first. Next, in step S74, the appearance of the first adhesive layer is examined, mainly the width w1 and the height h1. It is also possible to check whether the surface is flat, whether it meets the pre-expected specifications, and avoid excessively wide and occupy too much load-bearing plate area. If it is unsatisfactory, step S72 is repeated, the parameters are re-adjusted, and if necessary, the originally applied first adhesive layer is erased. If the appearance of the first adhesive layer meets the desired specifications, that is, the parameters of the dispenser meet the specifications expected in advance. After the first adhesive layer is baked, it is not necessary to return to step S72, and the subsequent steps can be directly performed to directly apply the second adhesive layer on the first adhesive layer after baking.

As shown in step S75, in order to set the parameters of the second adhesive layer (the second set of parameters), that is, the glue dispensing parameters of the second adhesive layer, such as the height L2-H, the pressure L2-P and the speed L2. -V...etc. Next, in step S76, the second adhesive layer is applied to the first adhesive layer; then, in step S77, the first inspection is performed. The appearance of the second rubber layer is mainly the width w2 and the height h2, and whether it meets the predetermined specifications. If the overall wall structure has met the predetermined specifications, that is, the pre-expected specifications of the parameters of the dispenser. The post-coating procedure of the formal wall can be carried out according to the parameters after the test. The post coating process, as shown in step S8, coats the fence. The details will be illustrated in Figure 4. Finally, in step S79, the wall is hardened, and the hardening method may be baking or ultraviolet light or the like. If the second adhesive layer does not meet the predetermined specifications, then return to step S72 to repaint the first adhesive layer. The step of hardening the surrounding wall may be performed after the first adhesive layer is completed together with the second adhesive layer. However, after the first adhesive layer is completed as in the above step S73, the first adhesive layer is hardened first, and after the second adhesive layer is completed, the second baking is performed.

In addition, the LED package structure of the present invention can be carried out in the following two ways: (1) before the coating of the wall structure, performing AM (Auto mounting) and wire bonding (AB, Auto bonding). The step may also be (2) after the coating of the wall structure, the step of solidifying and wire bonding is performed.

FIG. 3A is a flow chart showing a first manufacturing method of the LED package structure of the present invention. Before forming the wall structure, in step S60, a carrier board is provided; and in step S61, at least one light emitting diode is disposed on the carrier board. In step S79, after the wall is hardened, the final packaging process is performed. As shown in step S62, an encapsulant is disposed in the surrounding wall structure to encapsulate the light emitting diode.

FIG. 3B is a flow chart showing a second manufacturing method of the LED package structure of the present invention. Before forming the wall structure, in step S60, a carrier plate body is provided. After the wall is hardened in step S79, step S61 is performed to set at least one light emitting diode in the surrounding wall structure; finally, the final packaging process is performed, and as shown in step S62, an encapsulant is disposed. The light-emitting diode is encapsulated in the surrounding wall structure.

With regard to the relationship between the parameters of the above two groups of the present invention, according to one of the embodiments of the present invention, the height between the dispensing needle and the carrier plate when the first adhesive layer is applied and the pressure of the glue supply are lower than The height between the dispensing needle and the first adhesive layer and the glue supply pressure when the second adhesive layer is applied. In other words, the dispensing needle of the present invention first forms a low, layered first adhesive layer at a lower height and a lower pressure, and then at a higher height on the top surface of the first adhesive layer, and Use a higher pressure to form a higher second layer of glue. The speed at which the dispensing needle coats the first adhesive layer and the second adhesive layer can be the same.

Please refer to FIG. 4 , which is a flow chart of a post-coating procedure for manufacturing a wall of a light-emitting diode package structure according to the present invention. After the parameters of the dispenser have been confirmed, the formal wall can be applied to the top surface of the carrier plate. First, in step S82, according to the set first set of parameters (including pressure L1-P, first height L1-H, and speed L1-V) and coating the first adhesive layer on the carrier board according to a closed path The carrier plate body here is a carrier plate body of a formal product. The closed path of this embodiment may be circular, but is not limited thereto, and may be, for example, an ellipse, a square, or the like. The dispensing path is a closed loop.

As shown in step S83, it is judged whether or not the dispensing needle of the dispenser reaches the starting point of the closed path. In other words, it is checked that the dispenser that coats the first adhesive layer performs one turn from the starting point and returns to the origin. Regarding whether or not the origin is reached, the movement path of the dispenser can be set by the computer or judged by a visually recognized machine. If not, continue with the above steps, that is, continue to dispense. If yes, proceeding to step S84, stopping the glue and continuing to move the dispenser by a predetermined distance according to the first dispensing height L1-H of the first set of parameters and the closed path. That is, the dispensing needle of the dispenser stops the supply of glue and maintains the original height, that is, the first dispensing height L1-H, and then continues to travel a predetermined distance, and then according to the next step The number of the glue needle is raised. The predetermined distance may be a quarter turn to a third turn of the closed path of the first adhesive layer. This method can avoid the occurrence of protrusions at the joint between the start point and the end point. The reason is that when the glue is stopped at the same time and the glue needle is pulled up, the surface tension of the rubber material tends to be uneven, resulting in poor color uniformity. Thereby, the appearance of this embodiment is relatively uniform.

As shown in step S85, according to the set second set of parameters (including the pressure L2-P, the second adhesive height L2-H, and the speed L2-V), the second adhesive layer is coated according to the closed path. On a glue layer. The path of the second adhesive layer is the same as the path of the first adhesive layer. Similarly, as shown in step S86, it is judged whether or not the dispenser has reached the starting point of the closed path. If not, continue the above steps, that is, continue to dispense the glue; if yes, proceed to step S87, stop the glue and continue to move the dispenser a predetermined distance according to the height of the second set of parameters and the closed path. In other words, when the dispenser applying the second adhesive layer is one turn from the starting point and returns to the origin, the dispensing needle of the dispenser stops supplying glue and maintains the original height, and then continues to travel a predetermined distance. Wherein the predetermined distance is a quarter turn to a third turn of the circumference of the path of the second adhesive layer.

The first adhesive layer and the second adhesive layer coated in the above embodiment may be successively coated by the same dispenser. However, it can also be coated by different dispensers.

Please refer to FIG. 5A and FIG. 5B , which are schematic diagrams of coating a first adhesive layer and a second adhesive layer in a light emitting diode package structure according to a second embodiment of the present invention. The manufacturing method of the present invention may further include forming a trench 120 on the carrier substrate 10a, that is, forming the trench 120 from the wiring layer 12. The first adhesive layer 21 is coated on the trench 120, and the width of the first adhesive layer 21 is greater than the width of the trench 120, whereby the adhesion of the first adhesive layer 21 to the carrier board 10a can be increased.

Please refer to FIG. 6 , which is a cross-sectional view of the LED package structure of the present invention. After the double-walled wall structure 20 is completed, an encapsulant 40 is formed in the wall structure 20, and the encapsulant 40 may contain a fluorescent material. Thus, the light emitting diode package structure of the present invention is completed. The number of light-emitting diodes 14 in Fig. 6 is a schematic representation.

Please refer to FIG. 7A to FIG. 8C for a schematic cross-sectional view of an experimental comparison of the present invention. 8A to 8C are schematic cross-sectional views of the three sets of conventional single-layer wall coating processes according to the following Table 1, respectively, as a control group. Please refer to the following list 2 for four sets of double wall coating process of the invention. 7A and 7B are schematic cross-sectional views of the double-walled wall coating process according to the present invention.

The first group of parameters of the control group, the pressure L1-P is 300 kPa, the height between the dispensing needle and the carrier plate is 0.58 mm, the speed is 7.33 mm/s, and the height (h) of the wall structure is 0.56 mm, width (w) It is 0.8mm. The aspect ratio (h/w ratio) of the first set of parameters is 0.7.

The second group of parameters of the control group, the pressure L1-P was 260 kPa, the height was 0.58 mm, and the speed was 7.33 mm/s. The result was a height (h) of 0.435 mm and a width (w) of 0.63 mm. The aspect ratio (h/w ratio) was 0.69.

The third group of parameters of the control group, the pressure L1-P is 220 kPa, the height L1-H is 0.58 mm, and the speed L1-V is 7.33 mm/s. As a result, the height (h) of the fence was 0.41 mm and the width (w) was 0.61 mm. The aspect ratio (h/w ratio) of the second set of parameters is conventionally 0.67.

From the above, it is known that the wall structure of the conventional single layer, when the height of the glue needle is fixed (such as 0.58 mm above), the smaller the pressure of the glue is, the smaller the height of the wall is, and the smaller the aspect ratio is. And the aspect ratio does not exceed 0.7.

The first set of data of the embodiment, the glue of the first adhesive layer of the double wall The pressure L1-P is 100 kPa, the first dispensing height L1-H is 0.2 mm, the first dispensing speed L1-V is 7.33 mm/s; the second dispensing pressure L2-P is 100 kPa, and the second dispensing height is L2 -H is 0.55 mm, and the second dispensing speed L2-V is 7.33 mm/s. As a result, the final height (h) of the wall structure was 0.41 mm and the width (w) was 0.495 mm. The aspect ratio (h/w ratio) was 0.823. Compared with the conventional technology, the wall structure of this case is relatively tall and thin.

In the second group of data of the embodiment, the first adhesive layer L1-P of the double-layered wall is 100 kPa, the first adhesive height L1-H is 0.2 mm, and the first dispensing speed L1-V is 7.33 mm. /s; the second glue layer has a glue discharge pressure L2-P of 120 kPa, a second glue discharge height L2-H of 0.55 mm, and a second glue discharge speed L2-V of 7.33 mm/s. As a result, the final height (h) of the wall structure was 0.54 mm and the width (w) was 0.508 mm. The aspect ratio (h/w ratio) was 1.06. Compared with the conventional technology, the wall structure of this case is relatively tall and thin.

In the third group of data of the embodiment, the first glue layer of the double layer wall has a glue discharge pressure L1-P of 100 kPa, the first glue output height L1-H is 0.2 mm, and the first glue discharge speed L1-V is 7.33 mm. /s; the second glue layer has a glue pressure L2-P of 140 kPa, the second glue height L2-H is slightly increased to 0.65 mm, and the second glue output speed L2-V is 7.33 mm/s. As a result, the final height (h) of the wall structure was 0.635 mm and the width (w) was 0.43 mm. The aspect ratio (h/w ratio) was 1.48.

In the fourth group of data of the embodiment, the first glue layer of the double layer wall has a glue discharge pressure L1-P of 100 kPa, the first glue output height L1-H is 0.2 mm, and the first glue discharge speed L1-V is 7.33 mm. /s; the second glue layer has a glue discharge pressure L2-P of 170 kPa, a second glue discharge height L2-H of 0.7 mm, and a second glue discharge speed L2-V of 7.33 mm/s. As a result, the final height (h) of the wall structure was 0.83 mm and the width (w) was 0.41 mm. The aspect ratio (h/w ratio) was 2.02. Compared with the prior art, the wall structure of the fourth group of the present embodiment is more tall and thin.

Compared with the conventional technology, the wall structure of the four groups in this case is more high and thin, which is beneficial to reduce the area occupied by the functional area to accommodate more light-emitting diode chips; in addition, the possibility of pressing the wire can be reduced to avoid The risk of leakage. In addition, it can be concluded that the ratio of the height to the width of the first adhesive layer and the second adhesive layer of the present invention is greater than 0.8, and may even reach 2.

After the actual test, the width w1 of the first adhesive layer is preferably greater than or equal to the width w2 of the second adhesive layer, and the first adhesive layer as a base has a larger width, so that the second adhesive layer can be smoothly applied to the second adhesive layer. on. The dispensing pressure L1-P of the first adhesive layer is smaller than the dispensing pressure of the second adhesive layer L2-P, so that the second adhesive layer has more glue extruded per unit time and has a larger sectional area. The volume of the first adhesive layer is smaller than the volume of the second adhesive layer. Since the first adhesive layer is used as a foundation, in the actual test, the volume of the second adhesive layer is twice to four times the volume of the first adhesive layer. between.

In the prior art, when a single-layered wall is formed by using a rubber material having a rocking coefficient of 3.5, the ratio of h/w is approximately between 0.6 and 0.7. The invention selects the rubber material with the shaking coefficient of 3.5, and adopts the double-layer coating method, so that the ratio of h/w is slightly dropped between 0.8-2, successfully breaking the limitation of the material, thereby obtaining the aspect ratio. The wall.

In addition, in the prior art, when a rubber material having a rocking coefficient of 7.5 is selected to form a single-layered wall, the ratio of h/w is approximately 0.9-1, but a wall structure having a uniform shape cannot be obtained. However, in the present invention, a rubber material having a rocking coefficient of 7.5 is selected, and a double-layer coating method is adopted, so that the ratio of h/w can easily exceed the above limit (ie, h/w>1.0), except that a uniform wall can be obtained. Outside the structure, a higher and thiner wall structure is obtained.

The coefficient of rocking (thixotropy index) reflects the ability of the fluid to restore its original structure after the structure is destroyed by the shear force. The greater the thixotropic index, the touch The better the degeneration, the better the effect of structural damage and restoration of the original structure under the action of shear force. In other words, the larger the value, the better the thixotropy and the better the anti-slipping. In another embodiment of the present invention, the second adhesive layer 22 has a rocking coefficient of 7.5, and the first adhesive layer 21 has a rocking coefficient of 3.5. When the rocking coefficient of the second adhesive layer 22 is greater than the rocking coefficient of the first adhesive layer 21, after the second adhesive layer 22 is applied to the first adhesive layer 21, the anti-sliding is better, and it is easier to maintain its shape. It is also possible to obtain a wall structure of uniform shape.

Therefore, the present invention has the feature of at least two layers of the wall structure 20. First, a thin layer of the first adhesive layer 21 is formed on the surface of the carrier sheet 10 as a basic interface; then the second adhesive layer 22 is applied to the first adhesive layer 21 having the same (or similar) properties. Conventional single-layer wall glue is applied to the carrier plate body, because the difference in interface properties often results in uneven appearance and instability. The wall of the second layer of the present invention is applied to the underlying base layer having a homogenous interface, which can improve the appearance of poor appearance. It should be noted that the second adhesive layer of the present invention does not necessarily need to be the same material as the first adhesive layer, and may also be a material with similar polarity.

As seen from the cross-sectional view of the wall structure of the present invention, as shown in Figs. 7A and 7B, the portion where the second adhesive layer is joined to the first adhesive layer is slightly recessed inward due to the surface tension of the adhesive. In other words, the bottom of the second adhesive layer is recessed inwardly, and then extends obliquely outward to be connected to the top surface of the first adhesive, and has a cross-sectional shape such as a keyhole and a spherical shape. In other words, the keyhole is formed by a superposition of a trapezoid and a circle. In addition, since the volume of the second adhesive layer is 2-4 times the volume of the first adhesive layer, it can be inferred that the height ratio of the first adhesive layer to the second adhesive layer falls between about 0.2 and 0.4. The results of the four sets of experiments according to the present invention are substantially the same as the ratio of the first dispensing height L1-H to the second dispensing height L2-H in the manufacturing method of the present invention.

In summary, the present invention has at least the following effects:

1. The present invention utilizes dispensing instead of molding, eliminating the use of molds and reducing manufacturing costs.

2. The invention utilizes the dispensing needle of the dispenser to stop the supply of glue and continue to travel a predetermined distance, and the joint of the starting point and the end point of the surrounding wall structure is easily protruded, so that the rubber surface is evenly distributed, and the firefly mixed with the rubber material is successfully solved. The light powder is unevenly distributed due to the poor appearance of the wall, which affects the color uniformity of the LED package structure.

3. The invention selects the rubber material with high rocking coefficient and the structure with two layers of shielding to obtain the wall structure with high uniformity, and avoids the overall good yield of the LED package structure due to the poor appearance of the wall structure.

4. The invention utilizes a two-layer occlusion structure to make a high-thin wall structure, so that the number of wafers in the wall is increased, and the wall structure is kept away from the wire-punching area, thereby avoiding accidentally pressing the wire into the wire structure. The problem of leakage is generated.

5. The present invention facilitates the luminaire manufacturer to directly apply the secondary optical lens to the high-thin wall structure to further engage the secondary optical lens, without the need for additional screws or adhesives to engage it.

The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.

10, 10a‧‧‧ carrying board

11‧‧‧Substrate

12, 12a‧‧‧ circuit layer

120‧‧‧ trench

14‧‧‧Lighting diode

142‧‧‧ wire

20‧‧‧Wall structure

21‧‧‧First layer

22‧‧‧Second layer

30‧‧‧ Dispenser

40‧‧‧Package colloid

W, w1, w2‧‧‧ width

h, h1, h2, h21, L1-H, L2-H‧‧‧ height

[Practical Technology]

9‧‧‧ Carrying plate body

90‧‧‧Substrate

91‧‧‧Line layer

92‧‧‧LED chip

94‧‧‧Wall

921, 922‧‧‧ wires

D‧‧‧Insulation

1 is a cross-sectional view of a conventional light emitting diode package structure.

2 is a plan view showing a light emitting diode package structure of the present invention.

2A is an illustration of coating a first adhesive layer of a light emitting diode package structure of the present invention intention.

2B is a schematic view showing the coating of the second adhesive layer of the light emitting diode package structure of the present invention.

Fig. 3 is a flow chart showing a pre-preparation procedure of the method for manufacturing a wall according to the present invention.

3A is a flow chart of a first method of fabricating a light emitting diode package structure of the present invention.

3B is a flow chart showing a second method of fabricating the LED package structure of the present invention.

Fig. 4 is a flow chart showing a post-coating procedure of the method for manufacturing a wall according to the present invention.

FIG. 5A is a schematic view showing a first adhesive layer coated on a light emitting diode package structure according to a second embodiment of the present invention; FIG.

FIG. 5B is a schematic view showing a second adhesive layer applied to a light emitting diode package structure according to a second embodiment of the present invention; FIG.

FIG. 6 is a cross-sectional view showing the completed LED package structure of the present invention.

7A to 7B are cross-sectional views showing an experiment of a method for manufacturing a double-walled wall according to the present invention.

8A to 8C are schematic cross-sectional views showing a conventional single-layer wall coating process experiment.

10‧‧‧ Carrying plate body

11‧‧‧ grassroots

12‧‧‧Line layer

20‧‧‧Wall structure

21‧‧‧First layer

22‧‧‧Second layer

30‧‧‧ Dispensing needle

w, w2‧‧‧ width

h, h2, h21, L2-H‧‧‧ height

Claims (12)

A light-emitting diode package structure includes: a carrier plate body; at least one light-emitting diode body disposed on the carrier plate body; a wall structure disposed on a top surface of the carrier plate body and surrounding the at least one a light-emitting diode, the wall structure comprising: a first adhesive layer, a thin layer structure, and the first adhesive layer has a substantially flat surface; and a second adhesive layer disposed on the first adhesive layer The height of the second adhesive layer is greater than the height of the first adhesive layer, and the volume of the second adhesive layer is greater than the volume of the first adhesive layer; and an encapsulant disposed in the surrounding wall structure to encapsulate the light-emitting layer The pole body; wherein the width of the first rubber layer is greater than or equal to the width of the second rubber layer, and the rocking coefficient of the second rubber layer is greater than or equal to the rocking coefficient of the first rubber layer. The light emitting diode package structure of claim 1, wherein a height ratio of the first adhesive layer to the second adhesive layer falls between 0.2 and 0.4. The light emitting diode package structure of claim 1, wherein the volume of the second adhesive layer is between two and four times the volume of the first adhesive layer. The light emitting diode package structure according to claim 1, wherein the second adhesive layer has a spherical shape in cross section. The light-emitting diode package structure according to claim 1, wherein the second adhesive layer has a keyhole shape and has a bottom portion of a ladder shape and a bottom portion of a spherical top portion recessed inwardly, and then Outward oblique The extension extends and is connected to the top surface of the buffer. The light-emitting diode package structure of claim 1, wherein the carrier body further has a groove, the first adhesive layer is formed on the groove, and the width of the second adhesive layer is greater than The width of the groove. The light emitting diode package structure of claim 1, wherein a ratio of a height to a width of the first adhesive layer and the second adhesive layer is between 0.8 and 2. A method for manufacturing a wall of a light-emitting diode package structure, which is suitable for a light-emitting diode package structure, comprising the steps of: setting a dispensing needle of a dispenser to a first dispensing height and a first dispensing pressure Applying a first adhesive layer to a top surface of a carrier plate, wherein the first adhesive layer is a thin layer structure, and the first adhesive layer has a substantially flat surface; and a dispensing needle using the dispenser Applying a second adhesive layer to the first adhesive layer with a second adhesive height and a second adhesive pressure; wherein the second adhesive height is greater than the first adhesive height, and the second adhesive pressure is More than the first dispensing pressure, the volume of the second adhesive layer is greater than the volume of the first adhesive layer. The method for manufacturing a wall of a light-emitting diode package structure according to claim 8, wherein the coating the first adhesive layer or the second adhesive layer further comprises the steps of: setting the dispenser to perform the dispensing, And coating the first adhesive layer or the second adhesive layer according to a closed path; when the dispensing needle of the dispenser returns to the starting point of the closed path, setting the dispenser to stop dispensing and sealing along the sealing The path travels a predetermined distance. The manufacturing method of the wall of the light-emitting diode package structure according to claim 9, wherein the predetermined distance is a quarter turn to a third turn of the closed path. The method for manufacturing a wall of a light-emitting diode package according to claim 10, wherein the height of the first glue layer is close to the first glue height, and the second glue height is substantially equal to the first a sum of a height of a glue layer and a height of the second glue layer; a height of the second glue layer being greater than a height of the first glue layer. A light-emitting diode package structure includes: a carrier plate body; at least one light-emitting diode body disposed on the carrier plate body; and a wall structure disposed on a top surface of the carrier plate body and surrounding the at least A light-emitting diode is produced by the manufacturing method of the wall structure as described in claim 8 wherein the width of the first adhesive layer is greater than or equal to the width of the second adhesive layer.