TW201210089A - Light Emitting Diode lead frame assembly - Google Patents

Light Emitting Diode lead frame assembly Download PDF

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Publication number
TW201210089A
TW201210089A TW99128998A TW99128998A TW201210089A TW 201210089 A TW201210089 A TW 201210089A TW 99128998 A TW99128998 A TW 99128998A TW 99128998 A TW99128998 A TW 99128998A TW 201210089 A TW201210089 A TW 201210089A
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Taiwan
Prior art keywords
lead frame
frame assembly
rubber seat
light
rubber
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TW99128998A
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Chinese (zh)
Inventor
Been-Yang Liaw
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Hon Hai Prec Ind Co Ltd
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Priority to TW99128998A priority Critical patent/TW201210089A/en
Publication of TW201210089A publication Critical patent/TW201210089A/en

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Abstract

A Light Emitting Diode (LED) lead frame assembly for receiving a Light Emitting Diode (LED) module, comprises a base made from a plastic material in deep color and a plurality of metallic frames embedded of the base. The base has an accommodation portion, and side walls of the accommodation portion is laid on a coat, the coat is a silicone colloid mixing Tio2 particles. The LED lead frame assembly has a high lightness and a long using life.

Description

201210089六、發明說明: 【發明所屬之技術領诚】 [0001]本發明涉及一種發光二極管導線架組合,尤其係一種高 亮度及使用壽命長之發光二極管導線架組合。 [0002] Ο [0003]201210089 VI. Description of the Invention: [Technology of the Invention] [0001] The present invention relates to a combination of a light-emitting diode lead frame, and more particularly to a combination of a high-brightness and long-life LED lead frame. [0002] Ο [0003]

[0004] [先前技術] 發光二極管是一種固態的半導體元件,不同於鎢絲燈泡 發光原理,屬於冷光發光,只需極小電流就可以發光。 發光二極管不但具有時間長、省電、耐用、耐震、牢靠 、適合量產、體積小及反轉等優點,更普遍應用在生 活中多項產品,如:手機、產品的背光源、信息與消費 性電子產品的指示燈、卫業儀表設備、汽車用儀表指示 燈與煞車燈及大型廣告看板等。 f %知之發光—極管導線架組合通常包括—膠座、兩個導 電接腳、—發光晶片及導線。膠座具有-中空狀之功能 區匕導電接腳埋⑦於膠座中,其中導電接腳部分暴露於職相對兩側,並且沿膝座外 侧营折至膠座底面以作為後續製程之接點。 壯之發光二極管導線架組合至少存在以下缺點:膠座 一般採用白色或者顏色較淡之塑膠製成,因為白色塑膠 的光反射率較高,可得到較佳的反射效果,惟,發光晶 片發出的光會由膠座的内壁透射至膠座外側,其光的損 耗率亦大大增加。而且顏色較淡之膠座因長期使用受熱 後’其内壁顏色會變黃’光的反射率會下降,進而影響 發光晶片的發光亮度。而且隨著發光二極管導線架組合 逐漸向小型化及薄型化之方向發展,膠座之功能區之侧 099128998 表單編號A0101 第3頁/共13頁 0992050901-0 201210089 壁之厚度變薄、功能區之整體尺寸變小,膠座之功能區 之側壁的阻光性能變差,發光晶片發出的光易穿透膠座 ,使光的亮度損失,造成發光晶片發出的光亮度下降。 [0005] 鑒於此,實有必要提供一種改進發光二極管導線架組合 以克服上述之缺陷。 【發明内容】 [0006] 本發明所解決之技術問題係提供一種高亮度及使用壽命 長之發光二極管導線架組合。 [0007] 為解決前述技術問題,本發明提供一種發光二極管導線 架組合,用於連接發光晶片,其包括由塑膠製成的膠座 及埋設於膠座中的金屬接腳,膠座中部設有一功能區, 功能區之内侧壁設有由矽膠及二氧化鈦粒子混合形成的 塗層。 [0008] 與習知技術相比,本發明之發光二極管導線架組合的膠 座具有良好遮光性,其塗層可以延長使用壽命,而且還 可提高光反射率。 【實施方式】 [0009] 參閲第一圖至第四圖所示,本發明為一種表面黏著型發 光二極管導線架組合1〇〇,其包括一絕緣之膠座1及固持 於膠座1中之一對金屬接腳2。 [0010] 參閲第二圖至第四圖所示,膠座1由黑色絕緣塑膠製造而 成,大致呈長方體結構,通過塑膠射出成型於金屬接腳2 上。膠座1外側形成一外膠壁11,膠座1之中部向下凹設 形成中空狀之功能區1 0。功能區1 0之内側壁上通過相應 099128998 表單編號A0101 第4頁/共13頁 0992050901-0 201210089 的治具塗設有具有高反射率之塗層12,該塗層12由液態 矽膠120混合固態白色二氧化鈦粒子121所組成。所述功 能區10為長方形狀,其亦可為圓形狀、橢圓形狀或其它 多邊形狀。 [0011] ο 所述膠座1亦可由褐色、咖啡色或深藍色等其他深色的絕 緣塑膠製造,採用深色的塑膠具有良好遮光性,即使膠 座1之功能區10之側壁之厚度變薄、功能區之整體尺寸變 小,依然可以避免發光晶片3發出的光由膠座1之侧壁穿 透出去,而造成光的損失。所述塗層12中之矽膠120與用 於密封該功能區10的封膠材質之間有良好的結合力,可 增加與封膠良好的融合性及可靠性,塗層12之二氧化鈦 粒子121係一種高白度及耐光性較好的物質,不但可使功 能區10之内壁之顏色不會在長時間使用後發生變化,進 而提高該發光二極管導線架組合100的使用壽命,而且還 可提高光反射率。 [0012] Ο 本發明之金屬接腳2係通過銅或者銅合金等導電金屬片以 衝壓成型的方式形成。所述金屬接腳2埋設於膠座1中, 每一金屬接腳2均有可見部分213可見於功能區10之底部 ,並通過導線4與放置在金屬接腳2上的發光晶片3電性連 接,每一金屬接腳2從自功能區10向膠座1外部延伸,並 彎折至膠座1之外膠壁11之底部形成彎折部20,該彎折部 20的高度高於膠座1底面之高度以做為後續製程之接點。 本發明之發光二極管導線架組合100的製造方法步驟如下 :a.提供一金屬片,通過對金屬片衝切形成一對金屬接 腳2 ; b.將一黑色或其他深色的塑膠於金屬接腳2之四周 099128998 表單編號A0101 第5頁/共13頁 0992050901-0 [0013] 201210089 射出成型形成㈣1,並同時形成_中部向了凹陷之功能 區10 ; C.將位於膠座1之外膠壁丨丨外側之金屬接腳2沿著b 外膠壁11向功能區10之底部彎折形成彎折部2{) ; d將由 液態石夕膠120與固態白色二氧化欽粒子121混合形成的塗 料’通過相應、治具塗至功能區10之内側壁之表面形成塗 層12 ·,e.將發光晶片3安裝在金屬接腳2之可見部分213 之上表面,再進行打線,使導線4將金屬接腳2與發光晶 片3電性連接;f.最後對膠座丨之功能㈣内填注封膠, 其中塗層12中之石夕膠120與封膠之谬材質具有良好的相融 性。 [0014] [0015] [0016] [0017] 本發明之發光二極管導線架組合1〇〇之膠座i採用深色的 塑膠,具有良好遮光性,可有效減小光的損耗率。位於 功能區1〇之内侧壁之表面之塗層12中的梦踢12〇與封膠具 有良好的結合力,可增加封膠的可靠度及融合性,塗層 12中的二氧化錄子121具有高自度及耐紐,可提供較 高的光反射率及延長產品的使用壽命〗 综上所述’本發明確已符·明專利之要件,爰依法提 出專利巾請。惟,以上所述者僅係本發明之較佳實施方 式本發月之範圍並不以上述實施方式為限舉凡熟習本 案技藝之人士援依本發明之精神所作之等效修飾或變化 ,皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 第-圖為本發日树光二極管導㈣組合之立體圖; 第二圖為本發明發光二極管導線架組合之分解圖; 099128998 表單編號A0101 第6頁/共13頁 0992050901-0 201210089 [0018] 第三圖為本發明發光二極管導線架組合之俯視圖; [0019] 第四圖沿第三圖中之IV-1 V線之剖視圖。 【主要元件符號說明】 [0020] 發光二極管導線架組合:100 [0021] 膠座:1 [0022] 功能區:10 [0023] 外膠壁:11[0004] [Prior Art] A light-emitting diode is a solid-state semiconductor component. Unlike the principle of light-emitting of a tungsten filament bulb, it is a luminescent light that emits light with a very small current. LEDs not only have long-term, power-saving, durable, shock-resistant, reliable, suitable for mass production, small size and reverse, etc., more commonly used in life, such as: mobile phones, product backlights, information and consumerism Indicators for electronic products, Weiye instrumentation, vehicle indicator lights and brake lights, and large advertising billboards. f% Knowing Illumination—The pole tube leadframe combination typically includes a rubber seat, two conductive pins, an illuminating wafer, and a wire. The rubber seat has a hollow functional area, and the conductive pin is buried in the plastic seat, wherein the conductive pin portion is exposed to the opposite sides of the working body, and is folded along the outer side of the knee seat to the bottom surface of the rubber seat to serve as a joint for the subsequent process. . The strong LED lead frame combination has at least the following disadvantages: the plastic seat is generally made of white or light-colored plastic, because the white plastic has a higher light reflectivity, and a better reflection effect can be obtained, but the light-emitting chip emits The light is transmitted from the inner wall of the rubber seat to the outside of the rubber seat, and the light loss rate is also greatly increased. Moreover, the light-colored rubber seat will be yellowed due to long-term use, and the color of the inner wall will be yellow. The reflectance of the light will decrease, which will affect the brightness of the light-emitting chip. Moreover, as the LED lead frame assembly gradually develops toward miniaturization and thinning, the side of the functional area of the rubber seat 099128998 Form No. A0101 Page 3 / Total 13 Page 0992050901-0 201210089 The thickness of the wall is thinned, and the functional area is As the overall size becomes smaller, the light blocking performance of the sidewall of the functional area of the rubber seat is deteriorated, and the light emitted from the light-emitting chip easily penetrates the rubber seat, so that the brightness of the light is lost, and the brightness of the light emitted from the light-emitting chip is lowered. In view of this, it is necessary to provide an improved LED leadframe assembly to overcome the above-mentioned drawbacks. SUMMARY OF THE INVENTION [0006] The technical problem to be solved by the present invention is to provide a light-emitting diode lead frame assembly with high brightness and long service life. [0007] In order to solve the foregoing technical problem, the present invention provides a light-emitting diode lead frame assembly for connecting a light-emitting chip, which comprises a rubber seat made of plastic and a metal pin embedded in the rubber seat, and a middle portion of the rubber seat is provided. The functional zone, the inner side wall of the functional zone is provided with a coating formed by mixing a mixture of silicone and titanium dioxide particles. Compared with the prior art, the LED socket of the present invention has a good light-shielding property, and the coating can extend the service life and also improve the light reflectivity. [Embodiment] [0009] Referring to the first to fourth figures, the present invention is a surface-adhesive LED lead frame assembly 1A, which comprises an insulating rubber seat 1 and is held in the rubber seat 1. One pair of metal pins 2. [0010] Referring to the second to fourth figures, the rubber seat 1 is made of black insulating plastic and has a substantially rectangular parallelepiped structure and is molded on the metal pin 2 by plastic injection. An outer rubber wall 11 is formed on the outer side of the rubber seat 1, and a central portion of the rubber seat 1 is recessed downward to form a hollow functional area 10. The inner side wall of the functional area 10 is coated with a coating 12 having a high reflectivity by a corresponding fixture of 099128998 Form No. A0101, 4/13, 0992050901-0 201210089, which is mixed with liquid silicone 120. The white titanium dioxide particles 121 are composed of. The functional area 10 is rectangular, and may have a circular shape, an elliptical shape or other polygonal shape. [0011] ο The rubber seat 1 can also be made of other dark insulating plastic such as brown, brown or dark blue, and the dark plastic has good light shielding property, even if the thickness of the side wall of the functional area 10 of the plastic seat 1 is thin. The overall size of the functional area is reduced, and the light emitted from the illuminating chip 3 can be prevented from being transmitted by the side wall of the rubber seat 1, thereby causing loss of light. The silicone 120 in the coating 12 has a good bonding force with the sealing material for sealing the functional area 10, and can improve the fusion and reliability with the sealing, and the titanium dioxide particle 121 of the coating 12 A material with high whiteness and good light resistance can not only change the color of the inner wall of the functional area 10 after a long time of use, thereby improving the service life of the LED lead frame assembly 100, and also improving the light. Reflectivity. [0012] The metal pin 2 of the present invention is formed by press forming a conductive metal piece such as copper or a copper alloy. The metal pins 2 are embedded in the rubber seat 1. Each of the metal pins 2 has a visible portion 213 visible at the bottom of the functional area 10, and is electrically connected to the luminescent wafer 3 placed on the metal pin 2 through the wire 4. Connecting, each metal pin 2 extends from the function area 10 to the outside of the rubber seat 1 and is bent to the bottom of the rubber wall 11 outside the rubber seat 1 to form a bent portion 20, the height of the bent portion 20 being higher than the glue The height of the bottom of the seat 1 is used as a contact for subsequent processes. The manufacturing method of the LED lead frame assembly 100 of the present invention is as follows: a. providing a metal piece, punching a metal piece to form a pair of metal pins 2; b. connecting a black or other dark plastic to the metal Around the foot 2 099128998 Form No. A0101 Page 5 / Total 13 Page 0992050901-0 [0013] 201210089 Injection molding forms (4) 1, and at the same time forms a functional area 10 with a central depression; C. will be located outside the rubber seat 1 The metal pin 2 on the outer side of the niche is bent along the b outer rubber wall 11 to the bottom of the functional area 10 to form a bent portion 2{); d is formed by mixing liquid stellite 120 with solid white dioxin particles 121. The coating is formed by applying a corresponding fixture to the surface of the inner side wall of the functional area 10 to form a coating layer 12, e. Mounting the light-emitting wafer 3 on the upper surface of the visible portion 213 of the metal pin 2, and then performing wire bonding to make the wire 4 The metal pin 2 is electrically connected to the light-emitting chip 3; f. Finally, the function of the rubber seat (4) is filled with a sealant, wherein the material of the coating 12 has good compatibility with the material of the sealant. Sex. [0017] [0017] [0017] The LED socket of the LED lead frame of the present invention is made of a dark plastic, which has a good light-shielding property and can effectively reduce the light loss rate. The dream kick 12 in the coating 12 on the surface of the inner side wall of the functional zone has a good bonding force with the sealant, which can increase the reliability and fusion of the sealant, and the oxidized record 121 in the coating 12 With high self-adhesion and resistance, it can provide high light reflectivity and prolong the service life of the product. In summary, the invention has indeed been patented by the patent, and the patent towel is required according to law. However, the above description is only for the preferred embodiment of the present invention. The scope of the present invention is not limited to the above embodiments, and those skilled in the art will be able to make equivalent modifications or variations in accordance with the spirit of the present invention. It is covered by the following patent application. [Simple diagram of the figure] The first figure is a perspective view of the combination of the light-emitting diodes of the hair tree (four); the second figure is an exploded view of the combination of the light-emitting diode lead frames of the present invention; 099128998 Form No. A0101 Page 6 of 13 0992050901- 0 201210089 [0018] The third drawing is a plan view of the LED lead frame assembly of the present invention; [0019] The fourth drawing is a cross-sectional view taken along line IV-1 V of the third figure. [Main component symbol description] [0020] LED lead frame combination: 100 [0021] Plastic seat: 1 [0022] Functional area: 10 [0023] Exterior rubber wall: 11

[0024] 塗層:12 [0025] 矽膠:120 [0026] 二氧化鈦粒子:121 [0027] 金屬接腳:2 [0028] 彎折部:20 [0029] 可見部分:213 [0030] 發光晶片:3 [0031] 導線:4 099128998 表單編號A0101 第7頁/共13頁 0992050901-0[0024] Coating: 12 [0025] Silicone: 120 [0026] Titanium dioxide particles: 121 [0027] Metal pin: 2 [0028] Bending: 20 [0029] Visible portion: 213 [0030] Illuminated wafer: 3 [0031] Wire: 4 099128998 Form No. A0101 Page 7 / Total 13 Page 0992050901-0

Claims (1)

201210089 七、申請專利範圍: 1 . 一種發光二極管導線架組合,用於連接發光晶片,其包括 膠座,係由塑膠製成,其中部設有一功能區,功能區之内 侧壁設有由矽膠及二氧化鈦粒子混合形成的塗層;及 金屬接腳,埋設於膠座中。 2 .如申請專利範圍第1項所述之發光二極管導線架組合,其 中所述矽膠為液態,所述二氧化鈦粒子為白色固態。 3 .如申請專利範圍第2項所述之發光二極管導線架組合,其 中所述膠座通過深色塑膠射出成型於金屬接腳上,膠座外 侧形成外膠壁,所述功能區位於膠座之中部並向下凹設。 4 .如申請專利範面第3項所述之發光二極管導線架組合,其 中所述金屬接腳從功能區向膠座外部延伸並彎折至膠座之 外膠壁之底部形成彎折部,彎折部的高度高於膠座底面之 高度。 5 . —種發光二極管導線架組合,用於連接發光晶片,其包括 膠座,係由深色塑膠製成,其中部設有一功能區,功能區 之内側壁設有膠體材料及耐光性粒子材料相混合的塗層; 及 金屬接腳,埋設於膠座中。 6 .如申請專利範圍第5項所述之發光二極管導線架組合,其 中所述膠體材料係矽膠,所述耐光性粒子材料係二氧化鈦 粒子。 7 .如申請專利範圍第6項所述之發光二極管導線架組合,其 099128998 表單編號A0101 第8頁/共13頁 0992050901-0 201210089 中所述矽膠為液態,所述二氧化鈦粒子為白色固態。 8 .如申請專利範圍第7項所述之發光二極管導線架組合,其 中所述膠座通過塑膠射出成型於金屬接腳上,膠座外側形 成外膠壁,所述功能區位於膠座之中部並向下凹設。 9 .如申請專利範圍第8項所述之發光二極管導線架組合,其 •中所述金屬接腳從功能區向膠座外部延伸並彎折至膠座之 外膠壁之底部形成彎折部,彎折部的高度高於膠座底面之 高度以做為後續製程之接點。 〇 0992050901-0 099128998 表單編號A0101 第9頁/共13頁201210089 VII. Patent application scope: 1. A combination of light-emitting diode lead frame for connecting a light-emitting chip, which comprises a plastic seat, which is made of plastic, and has a functional area in the middle portion thereof, and the inner side wall of the functional area is provided with a silicone rubber and A coating formed by mixing titanium dioxide particles; and a metal pin embedded in the rubber seat. 2. The LED lead frame assembly of claim 1, wherein the silicone is in a liquid state and the titanium dioxide particles are in a white solid state. 3. The LED lead frame assembly of claim 2, wherein the rubber seat is injection molded on the metal pin by a dark plastic, and the outer side of the rubber seat forms an outer rubber wall, and the functional area is located at the rubber seat. The middle part is recessed downwards. 4. The LED lead frame assembly of claim 3, wherein the metal pin extends from the functional area to the outside of the plastic seat and is bent to the bottom of the rubber wall to form a bent portion. The height of the bent portion is higher than the height of the bottom surface of the rubber seat. 5 . A light-emitting diode lead frame assembly for connecting a light-emitting chip, comprising a rubber seat, which is made of dark plastic, wherein a functional area is arranged in the middle portion, and the inner side wall of the functional area is provided with a colloid material and a light-resistant particle material. The mixed coating; and the metal pins are embedded in the rubber seat. 6. The LED lead frame assembly of claim 5, wherein the colloidal material is silicone, and the light resistant particulate material is titanium dioxide particles. 7. The LED lead frame assembly of claim 6, wherein the silicone resin is in a liquid state and the titanium dioxide particles are in a white solid state as described in 099128998 Form No. A0101, page 8 / page 13 0992050901-0 201210089. 8. The LED lead frame assembly of claim 7, wherein the rubber seat is injection molded on a metal pin, and an outer rubber wall is formed on the outer side of the rubber seat, and the functional area is located in the middle of the rubber seat. And recessed downwards. 9. The LED lead frame assembly of claim 8, wherein the metal pin extends from the functional area to the outside of the plastic seat and is bent to the bottom of the rubber seat to form a bent portion. The height of the bent portion is higher than the height of the bottom surface of the rubber seat as a contact point for the subsequent process. 〇 0992050901-0 099128998 Form No. A0101 Page 9 of 13
TW99128998A 2010-08-30 2010-08-30 Light Emitting Diode lead frame assembly TW201210089A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104253192A (en) * 2013-06-28 2014-12-31 逢甲大学 Light emitting element

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104253192A (en) * 2013-06-28 2014-12-31 逢甲大学 Light emitting element
TWI573294B (en) * 2013-06-28 2017-03-01 逢甲大學 Light-emitting device
CN104253192B (en) * 2013-06-28 2018-07-03 逢甲大学 Light emitting element

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