WO2012024887A1 - 一种晶闸管水冷散热器 - Google Patents

一种晶闸管水冷散热器 Download PDF

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Publication number
WO2012024887A1
WO2012024887A1 PCT/CN2011/001004 CN2011001004W WO2012024887A1 WO 2012024887 A1 WO2012024887 A1 WO 2012024887A1 CN 2011001004 W CN2011001004 W CN 2011001004W WO 2012024887 A1 WO2012024887 A1 WO 2012024887A1
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WO
WIPO (PCT)
Prior art keywords
spiral
flow path
flow
water
grid
Prior art date
Application number
PCT/CN2011/001004
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English (en)
French (fr)
Inventor
汤广福
周建辉
魏晓光
查鲲鹏
Original Assignee
中国电力科学研究院
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 中国电力科学研究院 filed Critical 中国电力科学研究院
Priority to US13/255,502 priority Critical patent/US20120235294A1/en
Publication of WO2012024887A1 publication Critical patent/WO2012024887A1/zh

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention belongs to the field of power electronic equipment, and particularly relates to a novel water-cooling radiator for a thyristor. Background technique
  • the traditional 6-inch water-cooled radiator runner design usually has two typical design methods: 1.
  • the flow channel 3 ⁇ 4 A ⁇ imid spiral design method, the flow inside the 3 ⁇ 4 with the increase of the guide column
  • the rogue adopts the large cavity design method, and the multi-layer grid fins are arranged in the flow channel to realize the fluid three-dimensional space flow path to enhance the heat exchange.
  • the heat sink designed in the first mode often has good thermal properties, and the surface of the heat sink is the same.
  • the temperature is very good, which can well meet the requirements of the temperature uniformity of the heat-suppressing components of the sluice gate components, but the flow of ilj in the flow is long, resulting in a large resistance, resulting in a large reduction in the total enthalpy of the water-cooling system. It is possible to leak the parallel waterway.
  • This type of radiator is suitable for cooling with low flow rates. Under flow-to-large conditions, fluid passing through the radiator requires very high pump pressure.
  • the second method is designed to have the complex 3D and three-dimensional characteristics of the internal flow of the radiator, and often: there is a good flow resistance, but the fluid flow is less than 3 ⁇ 4 minutes and the heat is discharged from the radiator. Has a large thermal resistance. At the time of I, there will be four flow dead in the flowing square cavity, which deteriorates the local convective heat transfer. In addition, the surface temperature of the heat sink near the water outlet side of the radiator is higher, resulting in a greater uneven temperature of the surface of the heat sink.
  • This type of radiator is used for cooling with a large flow rate. Under the condition of small flow rate, the flow rate of the fluid passing through the heat exchanger is too low, and the local convection heat exchange condition is very poor. Summary of the invention
  • the invention provides a novel product design of the water cooling radiator, as shown in FIG.
  • the design method of the water-cooled radiator flow channel adopts a design method of a spiral flow channel and a mesh-type rib piece, and the method has the advantages that the flow resistance and the heat resistance of the heat sink are small, the surface temperature of the heat sink is uniform, and the internal fluid is fully changed. Heat, no flow dead zone and local accumulation of heat, thermal resistance and flow resistance can be achieved by adjusting the number of spiral channels and the density of the grid fins according to design requirements.
  • a novel sluice gate water-cooling heat sink proposed by the present invention is characterized in that it comprises: a novel flow path heat sink having a spiral flow path and a mesh rib combined, the grid ribs being regularly arranged throughout Flow path with spiral Inside, the cooling fluid flows in the flow path for heat exchange.
  • the M. spiral flow path and the multi-layer mesh ribs are connected to the flow of t, but the fluid flows from the flow side of the spiral, and passes through the multi-grid along the flow cloth 3 ⁇ 4 After the sheet is evenly shunted and the heat is exchanged, the center of the spiral sinks and thus cools the gate of the thyristor, which has a temperature range of 3 ⁇ 4 ⁇ , and then flows out of the spiral path along the spiral path.
  • the number of helix valves of the flow line of the U spiral and the number of grid ribs can be summed according to the heat dissipation: it is required to be withered, and the flow resistance is ⁇ " - to reduce the spiral
  • the number of turns and the number of grid fins/numbers, the number of spiral coils can increase the number of spiral coils and the number of grid fins.
  • the number of the grid ribs is 1 - 5 layers and the thickness is l - 10mn.
  • the heat flow resistance is small, the heat sink ⁇ is good.
  • M 1 is the intention of the flow passage structure of the floodgate water cooling radiator according to the present invention.

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

一种晶闸管水冷散热器 技术领域
本发明属于电力电子设备领域, 具体涉及涉及 _种新型的品闸管水冷散热器。 背景技术
Π前国内外还没 类似的技术发明。传统的 6英寸品闹管水冷散热器流道设计通常 有两种典型的设计方式: 1 .流道¾ 阿』i米德螺旋线设计方法, 流逍内 ¾用增加导流柱
(肋柱) ¾现增强对流换热。 2. 流逍采用大空腔设计方法, 流道内布置多层网格肋片实 现流体三维空间流道, 以达到增强换热的 的。
不同的流道设计和内部肋片布置方式对散热器的流阻和热阻性能有很大影响, 第 - 种方式设计出来的散热器往往具有很好的热性能, 同吋散热器表面的均温性很好, 可以 很好满足品闸管元件对散热表而均温性的要求,但 ilj于流动的流程较长,造成阻力较大, 从而导致换流徇水冷系统总 ΓΕ降较大, 为并联水路的泄露带来可能。 这种散热器适用于 流量较小的冷却情况, 在流— 大的条件下, 流体通过散热器需要很卨的泵压力。 第二种 方式设计出来的散热器山十内部流动的复¾性和三维特性, 往往: 有很好的较小的流动 阻力, 但流体流动较快來不及 ¾分换热就被排出散热器, 从而具有较大的热阻。 I 时在 流逍方形空腔内会出现四个流动死 , 恶化了局部对流换热, 另外靠近散热器出水侧的 散热器表面温度较高, 致散热器表面温度不均匀性较大。 这种散热器迠用于流量较大 的冷却情况, 在流量小的条件下, 流体通过故热器流速过低, 局部位胥对流换热条件很 差。 发明内容
本发明提供了 ·种新颖的品闸 ί水冷散热器流道设计, 如图 1所示。 该水冷散热器 流道设计方法采用了螺旋流道和网格型肋片相结 的设计方法, 该方法优点是散热器流 阻和热阻较小, 散热器表面温度均匀 致, 内部流体充分换热, 没有流动死区和热量局 部积累, 热阻和流阻性能可以根据设计要求通过调整螺旋水道圈数和网格肋片密度來实 现。
本发明提出的一种新型的品闸管水冷散热器, ί特征在于包括: 有螺旋线的流道 和网格肋片相结合的新型流道散热器, 所述网格肋片规则布置在整个具有螺旋线的流道 内, 冷却流体在流道内流动进行换热。
Η·中, 所述 M.有螺旋线的流道和多层网格肋片相结 t的流逍, 、ά却流体从螺旋线的 流 侧流入, 经过沿流逍布 ¾的多 格肋片均匀分流和充分交换热量以后, 螺旋 中心区域汇 &从而冷却品闸管屮心位 ¾具有¾^温度的 域, 然后冉次沿螺旋线的流道 流出螺旋线流道的 外-低
it屮, 所述 U 螺旋线的流 ill屮 的螺旋线阀数和网格肋^的) ¾数可按散热 求 和流 :要求进行凋节, 流阻人时 π」 -以减小螺旋线阇数和网格肋片 / 数, 流阻小时可增人 螺旋线圈数和网格肋片层数。
其中, 所述网格肋片的 数为 1 -5层, 厚度为 l-10mn。
本发明技木方案的优点是:
1.热師流阻小, 散热器 ιίιί均 性好。
2.迠 性强: 以迠应不 |nj散热要求、 不问流盪要求的场合。 附图说明:
m 1是依据本发明的品闸^水冷散热器流道结构 意图;
K中, 1 -螺旋流道, 2-网格肋片。 具体实施方式:
下面结 附图和 j 休实施方式对本发明做进 说明。本发明 t要对换流阀 6英寸 品闸管水冷散热器流道进行了竿:新设 「, fe要 | 图 1所示的 2部分组成: 螺旋流道】和 M格肋片 2。 流体从螺旋线流 iii ,ij流入, 经过沿流逍 的网格肋片均匀分流和充分 交换热: 以后, 在螺旋中心 K域汇集冷却品闸管中心 ¾ ^ 度区域, 然后再次沿螺旋线 流道流出螺旋线流逍另外一侧。 为了使散热效 ¾达到最俊, 每两个网格肋片形成的顶端 夹 为 30° - 90"。 这种流逍和肋片布 方式充分发挥了阿基米德螺旋线流道设计和多 ΰ网格空腔设计的优点: 1 .流体流动受螺旋线流逍约束, 不会出现流动 "短路" 而带来 的流体不充分换热。 2.流道内流体流动避免了 'Υ>.—的绕螺 ½线流动的情况, 通过多 网 格布冒:, 实现了三维流体旋流, 即流体在网格内不但有螺旋线周向流动, 还出现了绕网 格上下的 "爬流", 强化 Γ流 上下的对流换热。 3.充分利用了螺旋流逍散热器热阻小和 网格型散热器流阻小的优点, 通过 iM;)整螺旋水逍圈数和 格肋片密度可以满足不冋流署: 条件 F热附和流阻耍求,这种散热器流道设计适用范 1 广阔。 4. 于整体采用螺旋流近, 散热器 ¾面温度分布均匀, π了以满足品闸 ^对散热几件苛刻的要求。 此处己经根据特定的示例性¾施例对本发明进行了描述。对本领域的技术人员來说 在不脱离本发明的范^卜'进行迠 的 换或修改将是显而易见的。示例性的¾施例仅仅 例证性的, 而不 对木发明的范 11^1的限制, 本发明的范 If山所附的权利要求定义。

Claims

权 利 要 求
1、 -种新型的品 水冷散热器, 其特征在于乜括: 具有螺旋线的流道和网格肋 片相结合的新型流逍散热器, 所述网格肋片规则布 ¾在整个具有螺旋线的流道内, 冷却 流体在流道内流动进 ί Γ换热。
2、 如权利耍求 1 所述的水冷散热器, 其特征在于: 所述具有螺旋线的流道和多层 网格肋片相结合的流道, 冷却流体从螺旋线的流道一侧流入, 经过沿流道布 W的多层网 格肋片均匀分流和充分交换热 ¾以后, 在螺旋屮心区域汇集从而冷却晶闸管中心位置具 有 ¾高温度的 域, 然后再次沿螺旋线的流道流出螺旋线流道的 外 - ·侧。
3、 如权利要求 1 或 2所述的水冷散热器, 其特征在于: 所述具有螺旋线的流道中 冇的螺旋线圈数和网格肋片的 数 按散热要求和流量要求进行调节, 流阻大时可以 减小螺旋线圈数和网格肋片层数, 流阻小吋可增大螺旋线圈数和网格肋片层数。
4、 如权利要求 3所述的水冷故热器, 其特征在于: 所述网格肋片的层数为 1-5层, 厚度为 l -10mm。
PCT/CN2011/001004 2010-08-27 2011-06-16 一种晶闸管水冷散热器 WO2012024887A1 (zh)

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US13/255,502 US20120235294A1 (en) 2010-08-27 2011-06-16 Novel water-cooling radiator of thyristor

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CN2010102641331A CN101984507A (zh) 2010-08-27 2010-08-27 一种新型的晶闸管水冷散热器
CN201010264133.1 2010-08-27

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Publication number Priority date Publication date Assignee Title
CN101984507A (zh) * 2010-08-27 2011-03-09 中国电力科学研究院 一种新型的晶闸管水冷散热器
CN108837780B (zh) * 2018-06-19 2019-10-11 西安交通大学 一种多层网状交错肋板的储氢反应装置

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US5539617A (en) * 1992-09-22 1996-07-23 Siemens Aktiengesellschaft Liquid-coolant cooling element
CN2831426Y (zh) * 2005-08-19 2006-10-25 姚迪 大功率半导体水冷式散热器
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CN101984507A (zh) * 2010-08-27 2011-03-09 中国电力科学研究院 一种新型的晶闸管水冷散热器
CN201838571U (zh) * 2010-08-27 2011-05-18 中国电力科学研究院 一种新型的晶闸管水冷散热器

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DE3411523A1 (de) * 1983-04-20 1984-10-25 CKD Praha O.P., Prag/Praha Fluessigkeitskuehlkoerper zum kuehlen von leistungs-halbleiterbauelementen
CN85107311A (zh) * 1984-10-05 1986-07-23 株式会社日立制作所 热传导管
CN2055586U (zh) * 1989-08-31 1990-04-04 赵中凯 鱼鳞状内壁热传导管
US5539617A (en) * 1992-09-22 1996-07-23 Siemens Aktiengesellschaft Liquid-coolant cooling element
EP0613179A1 (en) * 1993-02-26 1994-08-31 Gec Alsthom Limited Heat sink
CN2831426Y (zh) * 2005-08-19 2006-10-25 姚迪 大功率半导体水冷式散热器
CN201197250Y (zh) * 2008-05-22 2009-02-18 南京南瑞继保电气有限公司 大功率电力电子器件水冷散热器
CN201229939Y (zh) * 2008-07-02 2009-04-29 中国西电电气股份有限公司 一种直流输电晶闸管换流阀组件用散热器
CN101984507A (zh) * 2010-08-27 2011-03-09 中国电力科学研究院 一种新型的晶闸管水冷散热器
CN201838571U (zh) * 2010-08-27 2011-05-18 中国电力科学研究院 一种新型的晶闸管水冷散热器

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