WO2012024847A1 - Substrat poreux et son procédé de fabrication - Google Patents
Substrat poreux et son procédé de fabrication Download PDFInfo
- Publication number
- WO2012024847A1 WO2012024847A1 PCT/CN2010/076713 CN2010076713W WO2012024847A1 WO 2012024847 A1 WO2012024847 A1 WO 2012024847A1 CN 2010076713 W CN2010076713 W CN 2010076713W WO 2012024847 A1 WO2012024847 A1 WO 2012024847A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- porous structure
- porous
- holes
- pores
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 158
- 238000004519 manufacturing process Methods 0.000 title abstract description 9
- 238000000034 method Methods 0.000 claims abstract description 76
- 238000002347 injection Methods 0.000 claims abstract description 50
- 239000007924 injection Substances 0.000 claims abstract description 50
- 238000002360 preparation method Methods 0.000 claims abstract description 36
- 150000002500 ions Chemical class 0.000 claims abstract description 17
- 238000012876 topography Methods 0.000 claims abstract description 3
- 239000011148 porous material Substances 0.000 claims description 35
- 238000005530 etching Methods 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 17
- 239000002210 silicon-based material Substances 0.000 claims description 5
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 4
- 229910003902 SiCl 4 Inorganic materials 0.000 claims description 3
- 238000011049 filling Methods 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 238000004140 cleaning Methods 0.000 abstract description 4
- 230000031700 light absorption Effects 0.000 abstract description 4
- 239000007789 gas Substances 0.000 description 62
- 238000007654 immersion Methods 0.000 description 15
- 238000005468 ion implantation Methods 0.000 description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 10
- 229910052710 silicon Inorganic materials 0.000 description 10
- 239000010703 silicon Substances 0.000 description 10
- 238000012806 monitoring device Methods 0.000 description 9
- 230000005684 electric field Effects 0.000 description 8
- 238000002161 passivation Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000003792 electrolyte Substances 0.000 description 5
- 238000000605 extraction Methods 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 238000011282 treatment Methods 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 238000002513 implantation Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000000137 annealing Methods 0.000 description 3
- 239000003575 carbonaceous material Substances 0.000 description 3
- 239000000284 extract Substances 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 229910021426 porous silicon Inorganic materials 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000000866 electrolytic etching Methods 0.000 description 1
- 238000000295 emission spectrum Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002068 genetic effect Effects 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004949 mass spectrometry Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/068—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02167—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/02168—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells the coatings being antireflective or having enhancing optical properties for the solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
- H01L31/02363—Special surface textures of the semiconductor body itself, e.g. textured active layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
- H01L31/035272—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions characterised by at least one potential jump barrier or surface barrier
- H01L31/035281—Shape of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- Step 2022 the vacuuming system of the plasma source extracts the gas injected into the chamber
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Sustainable Energy (AREA)
- Drying Of Semiconductors (AREA)
Abstract
L'invention porte sur un substrat poreux et sur son procédé de fabrication. La topographie de surface du substrat est désordonnée et poreuse. La profondeur des trous est inférieure à l'épaisseur du substrat ; les trous sont séparés les uns des autres et ne sont pas reliés entre eux. Le procédé met en œuvre : la disposition du substrat dans la chambre d'injection de l'équipement de préparation du substrat, le réglage du paramètre de traitement de l'équipement de préparation du substrat dans la plage de valeurs prédéfinie ; l'injection des ions réactifs du plasma généré par l'équipement de préparation du substrat dans le substrat, et la mise en réaction des ions réactifs avec le substrat afin de former le substrat poreux. Les fonds des trous dans le substrat poreux ne sont pas reliés entre eux. L'utilisation du substrat poreux pour réaliser des cellules solaires procure des avantages d'absorption de lumière, de transport de porteurs et de collecte. Le procédé de fabrication du substrat poreux permet un traitement simple, est facile à commander, et rend inutile la mise en oeuvre d'un nettoyage.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010102600581A CN101964367A (zh) | 2010-08-23 | 2010-08-23 | 一种多孔结构的衬底及其制备方法 |
CN201010260058.1 | 2010-08-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2012024847A1 true WO2012024847A1 (fr) | 2012-03-01 |
Family
ID=43517183
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2010/076713 WO2012024847A1 (fr) | 2010-08-23 | 2010-09-08 | Substrat poreux et son procédé de fabrication |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN101964367A (fr) |
WO (1) | WO2012024847A1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105826332A (zh) * | 2015-01-09 | 2016-08-03 | 中芯国际集成电路制造(上海)有限公司 | 半导体结构的形成方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1193808A (zh) * | 1997-03-17 | 1998-09-23 | 佳能株式会社 | 半导体衬底及其制造工艺以及在其上制作的电子器件 |
KR100677374B1 (ko) * | 2005-11-14 | 2007-02-02 | 준 신 이 | 박판 실리콘 기판을 이용한 다공성 실리콘 태양전지 및 그제조방법 |
WO2009025502A2 (fr) * | 2007-08-21 | 2009-02-26 | Lg Electronics Inc. | Cellule solaire ayant une structure poreuse et son procédé de fabrication |
US20090071537A1 (en) * | 2007-09-17 | 2009-03-19 | Ozgur Yavuzcetin | Index tuned antireflective coating using a nanostructured metamaterial |
CN101734611A (zh) * | 2009-12-16 | 2010-06-16 | 北京大学 | 基于无掩膜深反应离子刻蚀制备黑硅的方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100338269C (zh) * | 2005-10-10 | 2007-09-19 | 天津大学 | 制备一维取向的纳米二氧化钛管状晶薄膜的方法 |
CN100546049C (zh) * | 2006-07-25 | 2009-09-30 | 天津大学 | 绝热性能的多孔硅基氧化钒薄膜及制备方法 |
CN101777615B (zh) * | 2010-01-13 | 2013-07-31 | 南京大学 | 表面多孔的GaN基片的制备方法及由所述制备方法得到的GaN基片 |
-
2010
- 2010-08-23 CN CN2010102600581A patent/CN101964367A/zh active Pending
- 2010-09-08 WO PCT/CN2010/076713 patent/WO2012024847A1/fr active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1193808A (zh) * | 1997-03-17 | 1998-09-23 | 佳能株式会社 | 半导体衬底及其制造工艺以及在其上制作的电子器件 |
KR100677374B1 (ko) * | 2005-11-14 | 2007-02-02 | 준 신 이 | 박판 실리콘 기판을 이용한 다공성 실리콘 태양전지 및 그제조방법 |
WO2009025502A2 (fr) * | 2007-08-21 | 2009-02-26 | Lg Electronics Inc. | Cellule solaire ayant une structure poreuse et son procédé de fabrication |
US20090071537A1 (en) * | 2007-09-17 | 2009-03-19 | Ozgur Yavuzcetin | Index tuned antireflective coating using a nanostructured metamaterial |
CN101734611A (zh) * | 2009-12-16 | 2010-06-16 | 北京大学 | 基于无掩膜深反应离子刻蚀制备黑硅的方法 |
Also Published As
Publication number | Publication date |
---|---|
CN101964367A (zh) | 2011-02-02 |
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