WO2012024821A1 - Electroplated diamond wire of corrugated shape - Google Patents
Electroplated diamond wire of corrugated shape Download PDFInfo
- Publication number
- WO2012024821A1 WO2012024821A1 PCT/CN2010/001306 CN2010001306W WO2012024821A1 WO 2012024821 A1 WO2012024821 A1 WO 2012024821A1 CN 2010001306 W CN2010001306 W CN 2010001306W WO 2012024821 A1 WO2012024821 A1 WO 2012024821A1
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- WIPO (PCT)
- Prior art keywords
- wire
- diamond
- corrugated
- diamond wire
- electroplated
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
- B28D1/08—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with saw-blades of endless cutter-type, e.g. chain saws, i.e. saw chains, strap saws
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
- B23D57/0007—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
- B23D61/185—Saw wires; Saw cables; Twisted saw strips
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
Definitions
- the present invention relates to an electroplated diamond wire, and more particularly to a corrugated electroplated diamond wire which is a diamond wire prepared by a composite electroplating method using a metal wire having a corrugated structure as a baseline. It belongs to the field of hard and brittle material cutting processing consumables. Background technique
- Hard and brittle materials include various stone, gemstone, glass, silicon crystal, quartz crystal, cemented carbide, ceramic, rare earth magnetic material and the like. Hard and brittle materials are mostly non-conductors or semiconductors, and generally have high hardness, high brittleness, high wear resistance, high corrosion resistance, high electrical resistivity, high temperature resistance, and non-magnetic properties. Since hard and brittle materials have excellent properties that are difficult to compare with metal materials, they have a very wide range of uses. The popularization and application of hard and brittle materials puts high demands on its processing technology. Cutting processing is a key process in the processing of hard and brittle materials.
- the main process requirements are: high efficiency, low cost, narrow slit (improving material utilization), no damage on the sliced surface, no environmental pollution, etc.
- electroplated diamond wire cutting is a highly efficient and energy-saving method. It can cut planes and curved surfaces, and has narrow slits and high yield. It is suitable for precision cutting of precious materials. Such as sapphire, monocrystalline silicon, polycrystalline silicon, etc.
- the cut-off section has a negative impact on the quality of the product, especially the slice with high quality requirements. After cutting, the slice needs to be subsequently ground. The removal of the line marks leads to complicated processes, increased damage, and decreased yield.
- Second, the service life of the diamond wire is short.
- the diamond particles are consolidated on the metal wire depending on the plated metal.
- the object to be cut is at a maximum angle of 90 degrees.
- the diamond particles are scraped, and the diamond particles are easily peeled off, which affects the service life. Therefore, the development of a diamond wire with high cutting efficiency, long service life and good cut surface quality has become an urgent demand in the industry.
- the present invention is directed to a corrugated electroplated diamond wire having a long service life and good cut surface quality, wherein the corrugated diamond wire is formed into a corrugated diamond wire by a composite plating method using a corrugated metal wire as a baseline; It has a good chip removal function, which effectively improves the cutting quality, reduces or even eliminates the line marks on the cut surface, and has a long service life.
- a corrugated electroplated diamond wire of the present invention is realized by the following scheme:
- a corrugated electroplated diamond wire consisting of a metal embryo wire and a diamond particle plated on the surface of the metal embryo wire, the metal embryo wire being a corrugated wire having a peak height of 0.05 to 3 mm and a wave pitch of l to 15 mm.
- the corrugation shape of the metal germ line is one of a U shape and a V shape
- the metal embryo wire has a diameter of 0.1 to 1.2 mm.
- the diamond particles have a particle diameter of 10 to 150 ⁇ m.
- the corrugated electroplated diamond wire is prepared by a composite electroplating method, and the production process thereof is: original embryo line - pre-treatment degreasing, derusting - pre-plating - composite electroplating diamond - drying - - Cable, take-up.
- the invention adopts the above technical solution, and the prepared corrugated electroplated diamond wire has the advantages of ordinary diamond wire, for example, can be made into different diameters and lengths according to requirements; and can be installed on different equipment to form different processing modes. It can cut thin slices, machine curved surfaces, repair small holes, etc.
- the invention adopts a composite electroplating method to deposit a layer of metallic nickel or nickel-cobalt alloy on a corrugated metal blank substrate, and then compacts the diamond particle abrasive in the deposited metal layer.
- the metal coating is a bonding agent that holds the diamond particle abrasive for cutting.
- the corrugated diamond wire has a long service life.
- the life of a diamond wire is primarily determined by the diamond consolidation capacity of the wire. After most of the diamond particles are detached or worn away, the diamond wire is scrapped.
- the key factor that causes the diamond particles to fall off is the scraping force along the axial direction of the diamond between the diamond particles and the body being cut during the cutting process.
- the structural characteristics of the corrugated diamond wire determine that the diamond particles on the surface of the diamond wire are cut at an angle greater than or less than 90 degrees, and the cutting force is decomposed by the contact point of the diamond particles with the object to be cut. It can be seen that the force causing the diamond particles to fall off is the cutting component along the axis of the metal blank, which is certainly much smaller than the cutting force. Therefore, the possibility of the diamond particles falling off the corrugated diamond wire is significantly reduced, thereby The service life is longer than the existing linear diamond wire.
- the invention has long service life and good cut surface quality, and adopts corrugated metal wire as a baseline, and is prepared by a composite plating method; has good chip removal function, effectively improves cutting quality, reduces or even eliminates cut line marks, and is suitable for In industrial production and use.
- Embodiment 1 is a schematic view showing the structure of a corrugated electroplated diamond wire according to the present invention.
- 1 metal blank
- 2 plated alloy
- 3 diamond particles.
- BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be further described below in conjunction with specific embodiments.
- Embodiment 1 A metal embryo wire having a U-shaped corrugation shape, a peak height of 0.05 to 0.5 mm, a wave pitch of 1 to 5 mm, and a wire diameter of 0.1 mm is selected, and a diamond particle diameter of 10 to 20 um is prepared by a composite plating method.
- the corrugated electroplated diamond wire is compared with a straight diamond wire prepared by the same process using the same wire diameter, the same diamond particle size, and the same process.
- a straight diamond wire prepared by the same process using the same wire diameter, the same diamond particle size, and the same process.
- two polysilicon rods of the same size were respectively sliced, the diameter of the polycrystalline silicon rod was 2 ⁇ , and 50 pieces of silicon wafer were cut out at the same time. Observe the wear condition of the diamond wire and the line mark of the slice section, as shown in Table 1: Table 1
- the service life of the corrugated electroplated diamond wire is significantly better than that of the universal linear electroplated diamond wire.
- Embodiment 2 The corrugation shape is selected to be V-shaped, the peak height is 1 to 1.5 mm, the wave pitch is 5 to 10 mm, and the wire diameter is 0.5mm metal embryo wire, diamond particle size 60 ⁇ 70 m, corrugated electroplated diamond wire prepared by composite plating method, and straight diamond wire prepared by the same wire diameter, the same diamond particle size and the same process Cutting contrast.
- the wire diameter is 0.5mm metal embryo wire, diamond particle size 60 ⁇ 70 m, corrugated electroplated diamond wire prepared by composite plating method, and straight diamond wire prepared by the same wire diameter, the same diamond particle size and the same process Cutting contrast.
- two polysilicon rods of the same size were respectively sliced, the diameter of the polycrystalline silicon rod was 2 ⁇ , and 50 pieces of silicon wafer were cut out at the same time. Cut the observation King Kong
- the service life of the corrugated electroplated diamond wire is significantly better than that of the universal linear electroplated diamond wire.
- Embodiment 3 A metal embryo wire having a V-shaped corrugation shape, a peak height of 2.5 to 3 mm, a wave pitch of 10 to 15 mm, and a wire diameter of 1.2 mm is selected, and the diamond particle diameter is 130 to 150 m, which is prepared by a composite plating method.
- the corrugated electroplated diamond wire is cut and compared with a straight diamond wire prepared by the same process using the same wire diameter, the same diamond particle size, and the same process.
- two polysilicon rods of the same size were respectively sliced, the diameter of the polycrystalline silicon rod was 2 ⁇ , and 50 pieces of silicon wafer were cut out at the same time.
- Table 3 Project ordinary linear electroplated diamond wire corrugated electroplated diamond wire
- Diamond wire wear most of the diamond is detached, part of the exposed diamond is partially detached, and there is still cutting ability.
- the service life of the corrugated electroplated diamond wire is better than that of the general linear electroplated diamond wire.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mining & Mineral Resources (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
An electroplated diamond wire of corrugated shape is disclosed. The diamond wire is comprised of a metal blank wire and diamond particles coated on a surface of the metal blank wire. The metal blank wire is the corrugated wire having at least one corrugation shape selected from U or V shape. The height of the crest is 0.05~3mm, and the distance between two crests is 1~15mm. The diameter of the metal blank wire is 0.1~1.2mm. The diameter of the diamond particle is 10~150μm. The diamond wire is prepared by a composite electroplating method. The electroplated diamond wire of the invention has advantages of long life, good quality of cutting surfaces, excellent cutting processing capacity, good chip removal function; and the cutting quality is effectively improved, the wire track of the cutting surface is reduced or even eliminated. The electroplated diamond wire is suitable for industrialized production and use.
Description
一种波纹形电镀金刚石线 Corrugated electroplated diamond wire
技术领域 本发明涉及一种电镀金刚石线， 具体是指一种波纹形电镀金刚石线， 是利 用具备波紋结构特征的金属线作为基线， 采用复合电镀法制备出的金刚石线。 属于硬脆材料切割加工耗材领域。 背景技术 BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electroplated diamond wire, and more particularly to a corrugated electroplated diamond wire which is a diamond wire prepared by a composite electroplating method using a metal wire having a corrugated structure as a baseline. It belongs to the field of hard and brittle material cutting processing consumables. Background technique
硬脆材料包括各种石材、 宝石、玻璃、硅晶体、石英晶体、硬质合金、 陶瓷、 稀土磁性材料等。 硬脆材料大多为非导电体或半导体， 通常具有高硬度、 高脆 性、 高耐磨性、 高抗蚀性、 高电阻率、 耐高温、 不导磁等性能。 由于硬脆材料 具有金属材料难以比拟的优良特性，因此有非常广泛的用途。 硬脆材料的推广应 用对其加工技术提出了较高要求。 切割加工是硬脆材料加工的关键工序， 其主 要工艺要求为： 高效率、低成本、窄切缝 (提高材料利用率） 、切片表面无损伤、 无环境污染等。 随着技术的发展， 现采用电镀金刚石线切割加工是一种高效、 节能的好方法， 能切割平面与曲面， 且切缝窄， 出材率高， 适于对贵重材料进 行精密切割。 如蓝宝石、 单晶硅、 多晶硅等。 但这种切割方式依然存在两个方 面的问题： 一是切出的断面有线痕， 对产品质量有负面影响， 特别是切面质量 要求高的切片， 切割后， 切片还需进行后续磨削， 将线痕去除， 导致工序复杂， 损害增加， 出材率下降； 二是金刚石线的使用寿命短， 金刚石颗粒依赖镀层金 属固结在金属线上， 切割时， 被切物体以最大角 90度，对金刚石颗粒进行刮切， 金刚石颗粒容易脱落， 影响使用寿命。 因此， 开发一种切削效率高、 使用寿命 长、 切面质量好的金刚石线成为行业的迫切需求。
发明内容 本发明旨在提供一种使用寿命长、 切面质量好的波紋形电镀金刚石线， 所 述波纹形金刚石线采用波紋形金属线作为基线， 通过复合电镀方法， 制备出波 纹形金刚石线； 其具备良好的排屑功能， 从而有效的提高切削质量， 减少甚至 消除了切断面的线痕， 且使用寿命长。 本发明 一种波纹形电镀金刚石线， 是采用下述方案实现的： Hard and brittle materials include various stone, gemstone, glass, silicon crystal, quartz crystal, cemented carbide, ceramic, rare earth magnetic material and the like. Hard and brittle materials are mostly non-conductors or semiconductors, and generally have high hardness, high brittleness, high wear resistance, high corrosion resistance, high electrical resistivity, high temperature resistance, and non-magnetic properties. Since hard and brittle materials have excellent properties that are difficult to compare with metal materials, they have a very wide range of uses. The popularization and application of hard and brittle materials puts high demands on its processing technology. Cutting processing is a key process in the processing of hard and brittle materials. The main process requirements are: high efficiency, low cost, narrow slit (improving material utilization), no damage on the sliced surface, no environmental pollution, etc. With the development of technology, electroplated diamond wire cutting is a highly efficient and energy-saving method. It can cut planes and curved surfaces, and has narrow slits and high yield. It is suitable for precision cutting of precious materials. Such as sapphire, monocrystalline silicon, polycrystalline silicon, etc. However, there are still two problems in this type of cutting: First, the cut-off section has a negative impact on the quality of the product, especially the slice with high quality requirements. After cutting, the slice needs to be subsequently ground. The removal of the line marks leads to complicated processes, increased damage, and decreased yield. Second, the service life of the diamond wire is short. The diamond particles are consolidated on the metal wire depending on the plated metal. When cutting, the object to be cut is at a maximum angle of 90 degrees. The diamond particles are scraped, and the diamond particles are easily peeled off, which affects the service life. Therefore, the development of a diamond wire with high cutting efficiency, long service life and good cut surface quality has become an urgent demand in the industry. SUMMARY OF THE INVENTION The present invention is directed to a corrugated electroplated diamond wire having a long service life and good cut surface quality, wherein the corrugated diamond wire is formed into a corrugated diamond wire by a composite plating method using a corrugated metal wire as a baseline; It has a good chip removal function, which effectively improves the cutting quality, reduces or even eliminates the line marks on the cut surface, and has a long service life. A corrugated electroplated diamond wire of the present invention is realized by the following scheme:
一种波纹形电镀金刚石线， 由金属胚线与镀覆在金属胚线表面的金刚石颗 粒组成， 所述金属胚线为波纹线， 其波峰高度为 0.05〜3mm, 波距为 l〜15mm。 A corrugated electroplated diamond wire consisting of a metal embryo wire and a diamond particle plated on the surface of the metal embryo wire, the metal embryo wire being a corrugated wire having a peak height of 0.05 to 3 mm and a wave pitch of l to 15 mm.
本发明中， 所述金属胚线的波紋形状为 U形、 V形中的一种 In the present invention, the corrugation shape of the metal germ line is one of a U shape and a V shape
本发明中， 所述金属胚线的直径为 0.1〜1.2mm。 In the present invention, the metal embryo wire has a diameter of 0.1 to 1.2 mm.
本发明中， 所述金刚石颗粒粒径为 10〜150 μ πι。 本发明中， 所述波纹形电镀金刚石线是采用复合电镀方法制备， 其生产工 艺流程为： 原胚线——前处理除油、 去锈——预镀——复合电镀金刚石——烘 干——排线、 收线。 本发明由于采用上述技术方案， 制备出的波紋形电镀金刚石线， 既具备普 通金刚石线的优点， 如可以根据需要制成不同的直径和长度； 可以安装在不同 的设备上形成不同的加工方式， 可以切割薄片， 加工曲面， 研修小孔等， 还克 服了现有金刚石线切割断面存在线痕及使用寿命短的缺陷， 应用前景十分广阔。 本发明采用复合电镀的方法在波纹金属坯线基体上沉积一层金属镍或镍钴合 金， 然后在沉积的金属层内固结金刚石颗粒磨料而制成。 金属镀层是结合剂， 把持金刚石颗粒磨料用于切削加工。 与现有技术相比， 具有以下优点：
1、 由于采用波纹结构特征的金刚石线， 其波峰、 波谷之间具有较大的容隙 空间， 因此， 在切割过程当中， 切割线槽的容屑能力大幅提高， 使出屑能力显 著增强， 有效减少甚至消除切割断面的线痕。 这主要是由于波纹形金刚石线进 行切割加工时， 其凸出部位的金刚石颗粒对被切物体进行切割， 产生切削， 同 时金刚石颗粒会有部分脱落， 切屑与脱落的金刚石颗粒可以暂时聚集在波纹金 刚石线的凹处部位， 在金刚石线的切割运动下， 带出被切体， 不会因为切割线 槽空间狭窄而使切削屑与脱落的金刚石颗粒对被切物的切出表面进行二次磨 切， 有效减少甚至消除切割断面的线痕。 In the present invention, the diamond particles have a particle diameter of 10 to 150 μm. In the present invention, the corrugated electroplated diamond wire is prepared by a composite electroplating method, and the production process thereof is: original embryo line - pre-treatment degreasing, derusting - pre-plating - composite electroplating diamond - drying - - Cable, take-up. The invention adopts the above technical solution, and the prepared corrugated electroplated diamond wire has the advantages of ordinary diamond wire, for example, can be made into different diameters and lengths according to requirements; and can be installed on different equipment to form different processing modes. It can cut thin slices, machine curved surfaces, repair small holes, etc. It also overcomes the defects of existing wire cutting sections and short service life, and has a broad application prospect. The invention adopts a composite electroplating method to deposit a layer of metallic nickel or nickel-cobalt alloy on a corrugated metal blank substrate, and then compacts the diamond particle abrasive in the deposited metal layer. The metal coating is a bonding agent that holds the diamond particle abrasive for cutting. Compared with the prior art, it has the following advantages: 1. Due to the diamond wire with corrugated structure, the peak and valley have a large tolerance space. Therefore, during the cutting process, the chip capacity of the cutting groove is greatly improved, and the chip discharging capacity is significantly enhanced, which is effective. Reduce or even eliminate line marks on the cut section. This is mainly due to the fact that when the corrugated diamond wire is cut, the diamond particles in the protruding portion cut the cut object to produce cutting, and at the same time, the diamond particles may partially fall off, and the chip and the falling diamond particles may temporarily gather on the corrugated diamond. The concave portion of the wire, under the cutting motion of the diamond wire, carries out the cut body, and does not cause the cutting debris and the falling diamond particles to perform secondary grinding on the cut surface of the cut object due to the narrow space of the cutting wire groove. , effectively reduce or even eliminate the line marks of the cutting section.
2、 波纹金刚石线的使用寿命长。 金刚石线的寿命主要由金属线上的金刚石 固结能力决定。 金刚石颗粒大部分脱落或磨掉后， 金刚石线就报废。 导致金刚 石颗粒脱落的关键因素是切割过程中， 金刚石颗粒与被切体间的沿金属线轴向 的刮切力。 波紋金刚石线的结构特点决定了在切割时， 金刚石线表面的金刚石 颗粒是以大于或小于 90度的角度对被切物体形成切割， 以金刚石颗粒与被切物 体的接触点对切削力进行分解， 可知， 造成金刚石颗粒脱落的力是沿金属坯线 轴线方向的切削分力， 该分力肯定比切削力要小得多， 因此， 波纹金刚石线的 金刚石颗粒脱落的可能性明显降低， 从而， 其使用寿命相对现有直线型金刚石 线的使用寿命更长。 2. The corrugated diamond wire has a long service life. The life of a diamond wire is primarily determined by the diamond consolidation capacity of the wire. After most of the diamond particles are detached or worn away, the diamond wire is scrapped. The key factor that causes the diamond particles to fall off is the scraping force along the axial direction of the diamond between the diamond particles and the body being cut during the cutting process. The structural characteristics of the corrugated diamond wire determine that the diamond particles on the surface of the diamond wire are cut at an angle greater than or less than 90 degrees, and the cutting force is decomposed by the contact point of the diamond particles with the object to be cut. It can be seen that the force causing the diamond particles to fall off is the cutting component along the axis of the metal blank, which is certainly much smaller than the cutting force. Therefore, the possibility of the diamond particles falling off the corrugated diamond wire is significantly reduced, thereby The service life is longer than the existing linear diamond wire.
综上所述， 本发明使用寿命长、 切面质量好， 采用波紋形金属线作为基线， 通过复合电镀方法制备； 具备良好的排屑功能， 有效提高切削质量， 减少甚至 消除切断面线痕， 适于工业化生产、 使用。 In summary, the invention has long service life and good cut surface quality, and adopts corrugated metal wire as a baseline, and is prepared by a composite plating method; has good chip removal function, effectively improves cutting quality, reduces or even eliminates cut line marks, and is suitable for In industrial production and use.
附图说明 DRAWINGS
附图 1为本发明一种波紋形电镀金刚石线结构示意图。
图中： 1—金属坯线， 2—镀层合金， 3—金刚石颗粒。 具体实施方式 下面结合具体实施例对本发明作进一步说明。 实施例 1 选择波紋形状为 U形、波峰高度为 0.05〜0.5mm、波距为 l〜5mm， 线径为 0.1mm的金属胚线， 金刚石颗粒粒径为 10〜20 u m， 采用复合电镀方法制备的 波紋形电镀金刚石线， 与采用相同线径、 相同金刚石颗粒粒径、 相同工艺制备 的直线型金刚石线进行切削对比。 在同一台切割机上， 分别对两个相同尺寸的 多晶硅棒进行切片， 多晶硅棒直径为 2〃 ， 同时切出 50片硅片。 切完观察金刚 石线的磨损情况与切片断面的线痕情况， 如表 1 : 表 1 1 is a schematic view showing the structure of a corrugated electroplated diamond wire according to the present invention. In the figure: 1—metal blank, 2—plated alloy, 3—diamond particles. BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be further described below in conjunction with specific embodiments. Embodiment 1 A metal embryo wire having a U-shaped corrugation shape, a peak height of 0.05 to 0.5 mm, a wave pitch of 1 to 5 mm, and a wire diameter of 0.1 mm is selected, and a diamond particle diameter of 10 to 20 um is prepared by a composite plating method. The corrugated electroplated diamond wire is compared with a straight diamond wire prepared by the same process using the same wire diameter, the same diamond particle size, and the same process. On the same cutting machine, two polysilicon rods of the same size were respectively sliced, the diameter of the polycrystalline silicon rod was 2〃, and 50 pieces of silicon wafer were cut out at the same time. Observe the wear condition of the diamond wire and the line mark of the slice section, as shown in Table 1: Table 1
波纹形电镀金刚石线的使用寿命， 切出片断面的质量明显好于普遍直线电 镀金刚石线。 The service life of the corrugated electroplated diamond wire is significantly better than that of the universal linear electroplated diamond wire.
实施例 2 选择波纹形状为 V形、 波峰高度为 l〜1.5mm、 波距为 5〜10mm， 线径为
0.5mm的金属胚线， 金刚石颗粒粒径为 60〜70 m， 采用复合电镀方法制备的 波纹形电镀金刚石线， 与采用相同线径、 相同金刚石颗粒粒径、 相同工艺制备 的直线型金刚石线进行切削对比。 在同一台切割机上， 分别对两个相同尺寸的 多晶硅棒进行切片， 多晶硅棒直径为 2〃 ， 同时切出 50片硅片。 切完观察金刚 Embodiment 2 The corrugation shape is selected to be V-shaped, the peak height is 1 to 1.5 mm, the wave pitch is 5 to 10 mm, and the wire diameter is 0.5mm metal embryo wire, diamond particle size 60~70 m, corrugated electroplated diamond wire prepared by composite plating method, and straight diamond wire prepared by the same wire diameter, the same diamond particle size and the same process Cutting contrast. On the same cutting machine, two polysilicon rods of the same size were respectively sliced, the diameter of the polycrystalline silicon rod was 2〃, and 50 pieces of silicon wafer were cut out at the same time. Cut the observation King Kong
表 2 Table 2
波紋形电镀金刚石线的使用寿命， 切出片断面的质量明显好于普遍直线电 镀金刚石线。 The service life of the corrugated electroplated diamond wire is significantly better than that of the universal linear electroplated diamond wire.
实施例 3 选择波紋形状为 V形、 波峰高度为 2.5〜3mm、 波距为 10〜15mm， 线径为 1.2mm的金属胚线， 金刚石颗粒粒径为 130〜150 m， 采用复合电镀方法制备 的波纹形电镀金刚石线， 与采用相同线径、 相同金刚石颗粒粒径、 相同工艺制 备的直线型金刚石线进行切削对比。 在同一台切割机上， 分别对两个相同尺寸 的多晶硅棒进行切片， 多晶硅棒直径为 2〃 ， 同时切出 50片硅片。 切完观察金 刚石线的磨损情况与切片断面的线痕情况， 如表 3 : 表 3
项目 普通直线电镀金刚石线 波纹形电镀金刚石线 Embodiment 3 A metal embryo wire having a V-shaped corrugation shape, a peak height of 2.5 to 3 mm, a wave pitch of 10 to 15 mm, and a wire diameter of 1.2 mm is selected, and the diamond particle diameter is 130 to 150 m, which is prepared by a composite plating method. The corrugated electroplated diamond wire is cut and compared with a straight diamond wire prepared by the same process using the same wire diameter, the same diamond particle size, and the same process. On the same cutting machine, two polysilicon rods of the same size were respectively sliced, the diameter of the polycrystalline silicon rod was 2〃, and 50 pieces of silicon wafer were cut out at the same time. Observe the wear condition of the diamond wire and the line mark of the slice section, as shown in Table 3: Table 3 Project ordinary linear electroplated diamond wire corrugated electroplated diamond wire
金刚石线磨损情 金刚石大部分脱落， 部分露 金刚石少部分脱落， 仍有切 况 割能力 Diamond wire wear, most of the diamond is detached, part of the exposed diamond is partially detached, and there is still cutting ability.
切片的断面线痕 肉眼可见明显线痕 肉眼可见轻微线痕， 但手感 手感线痕明显 线痕不明显 波纹形电镀金刚石线的使用寿命， 切出片断面的质量明显好于普遍直线电 镀金刚石线。 Sectional line marks of the slice visible obvious line marks visible to the naked eye. Minor line marks are visible to the naked eye, but the hand touch line marks are obvious. The line marks are not obvious. The service life of the corrugated electroplated diamond wire is better than that of the general linear electroplated diamond wire.
从表 1、 2、 3 可知， 波紋形电镀金刚石线的使用寿命， 切出片断面的质量 明显好于普遍直线电镀金刚石线。
It can be seen from Tables 1, 2, and 3 that the service life of the corrugated electroplated diamond wire is significantly better than that of the universal linear electroplated diamond wire.
Claims
1、 一种波纹形电镀金刚石线， 由金属胚线与镀覆在金属胚线表面的金刚石 颗粒组成， 其特征在于： 所述金属胚线为波纹线， 其波峰高度为 0.05〜3mm， 波距为 l〜15mm。 1. A corrugated electroplated diamond wire consisting of a metal embryo wire and a diamond particle plated on a surface of a metal embryo wire, wherein: the metal embryo wire is a corrugated wire, and the peak height thereof is 0.05 to 3 mm, and the pitch is It is l~15mm.
2、 根据权利要求 1所述的一种波纹形电镀金刚石线， 其特征在于： 所述金 属胚线的波纹形状为 U形、 V形中的一种 2. A corrugated electroplated diamond wire according to claim 1, wherein: said metal embryo has a corrugated shape of one of a U shape and a V shape.
3、 根据权利要求 2所述的一种波纹形电镀金刚石线， 其特征在于： 所述金 属胚线的直径为 0.1〜1.2mm。 3. A corrugated electroplated diamond wire according to claim 2, wherein: said metal embryo wire has a diameter of 0.1 to 1.2 mm.
4、 根据权利要求 3所述的一种波紋形电镀金刚石线， 其特征在于： 所述金 刚石颗粒粒径为 10〜150 μ πι。 4. A corrugated electroplated diamond wire according to claim 3, wherein: said diamond particles have a particle size of 10 to 150 μm.
5、 根据权利要求 1、 2、 3、 4任意一项所述的一种波紋形电镀金刚石线， 其特征在于： 所述波紋形电镀金刚石线是采用复合电镀方法制备， 其生产工艺 流程为： 原胚线——前处理除油、 去锈——预镀——复合电镀金刚石——烘干 ——排线、 收线。 The corrugated electroplated diamond wire according to any one of claims 1, 2, 3 and 4, wherein the corrugated electroplated diamond wire is prepared by a composite electroplating method, and the production process is: Original embryo line - pre-treatment degreasing, derusting - pre-plating - composite electroplating diamond - drying - cable, take-up.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201080065844.4A CN103003015B (en) | 2010-08-27 | 2010-08-27 | A kind of corrugated electroplated diamond line |
| PCT/CN2010/001306 WO2012024821A1 (en) | 2010-08-27 | 2010-08-27 | Electroplated diamond wire of corrugated shape |
| KR1020137007724A KR20130136985A (en) | 2010-08-27 | 2010-08-27 | Electroplated diamond wire of corrugated shape |
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| Application Number | Priority Date | Filing Date | Title |
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| PCT/CN2010/001306 WO2012024821A1 (en) | 2010-08-27 | 2010-08-27 | Electroplated diamond wire of corrugated shape |
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| WO2012024821A1 true WO2012024821A1 (en) | 2012-03-01 |
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| KR (1) | KR20130136985A (en) |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0259274A (en) * | 1988-08-23 | 1990-02-28 | Noritake Dia Kk | Diamond wire saw |
| WO2002040207A1 (en) * | 2000-11-17 | 2002-05-23 | Schrittwieser, Robert | Cutting wire |
| CN101209505A (en) * | 2006-12-26 | 2008-07-02 | 浙江工业大学 | Method for preparing metal binding agent diamond scroll saw |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4055700A (en) * | 1974-09-03 | 1977-10-25 | Lumalampan Ab | Thin composite wire saw with surface cutting crystals |
| JP2004276207A (en) * | 2003-03-18 | 2004-10-07 | Kanai Hiroaki | Saw wire for multi-wire saw |
| CN2678862Y (en) * | 2004-03-15 | 2005-02-16 | 占志斌 | Diamond fret-saw for cutting-off hard and fragile material |
| JP2007021677A (en) * | 2005-07-19 | 2007-02-01 | Asahi Diamond Industrial Co Ltd | Electrodeposition wire tool |
| TW200824823A (en) * | 2006-12-07 | 2008-06-16 | Kinik Co | Amorphous diamond cutting wire saw for micro fabrication |
| CN101591796A (en) * | 2009-05-13 | 2009-12-02 | 长沙岱勒金刚石制品有限公司 | A kind of production technique for preparing high-performance diamond wire saw |
-
2010
- 2010-08-27 WO PCT/CN2010/001306 patent/WO2012024821A1/en active Application Filing
- 2010-08-27 KR KR1020137007724A patent/KR20130136985A/en not_active Application Discontinuation
- 2010-08-27 CN CN201080065844.4A patent/CN103003015B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0259274A (en) * | 1988-08-23 | 1990-02-28 | Noritake Dia Kk | Diamond wire saw |
| WO2002040207A1 (en) * | 2000-11-17 | 2002-05-23 | Schrittwieser, Robert | Cutting wire |
| CN101209505A (en) * | 2006-12-26 | 2008-07-02 | 浙江工业大学 | Method for preparing metal binding agent diamond scroll saw |
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| CN103003015B (en) | 2015-11-25 |
| KR20130136985A (en) | 2013-12-13 |
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