200824823 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種無晶鑽石微型加工切割線鋸，尤其係指一 種將無晶鑽石坡覆於極細線材上，該線材利用抽線眼模的幾何形 狀及無晶鑽石塗佈技術以控制線材表面粗糙度，讓線材表面形成 鋸齒狀之無晶鑽石微型加工切割線鋸。 【先前技術】 於半導體產業中，晶圓加工技術對於產品的品質與企業成本 Φ 有著極大的影響性，其中尤以晶圓切割技術佔最重要的關鍵因素。 在長晶、晶圓切割、拋光、清洗等晶圓製造步驟中，切割技 術係決定未來晶圓產量及品質的重要因素，其進而影響整個企業 之成本，因此晶圓切割步驟係晶圓製造中最重要的一個步驟。 晶圓切割技術可分為三個階段，即外晶圓切割技術、内晶圓 切割技術以及線切割技術。為了增加產能以及減少晶圓的消耗成 本，隨著長晶技術的成長，晶圓直徑亦越來越大，而圓錐等並無 法切出薄片且會大量的消耗晶圓，因此未來將會被淘汰，而線切 • 割技術因不受晶圓直徑大小限制，因此為目前半導體產業之切割 技術主流。 線切割技術依使用磨料之不同可分為兩種，一種為切割過程 中使用游離磨料之游離磨料鋸切（FREE-ABRASIVE)，其原理是 利用鋼琴線或金屬線帶動磨漿對加工物件進行切割；另一種為切 割過程中使用固定磨料的磨料鋸切（FIXED-ABRASIVE)，其原 理是將鑽石等磨料經由燒結、樹脂黏結、電鍍或硬焊之方式固定 在鋼琴線或金屬線上以對加工物進行切割。此兩種技術各有其優 5 200824823 缺點 共宁游離磨料据切之優點為可以減少加工物的浪費，但卻 存在游離磨料對加工物的移除效率低，且在純絲被完全利用 «要吾棄，造成加卫時間長、磨料成本提高之缺點。另一方面， 固疋磨枓㈣之優點在於磨除效率高，但是將鑽石固定在鋼琴線 ^金^線之過程中，必須經過高溫製程，此會導致鋼琴線或金屬 線受貝而減低剛性’進而造成斷裂，且鑽石不易與線材接合，在 中’鑽石可能會脫落而刮傷晶圓’因此現有的作法係將200824823 IX. Description of the invention: [Technical field of the invention] The present invention relates to a micro-machining and cutting wire saw for an amorphous diamond, in particular to a non-crystalline diamond which is coated on a very thin wire, which utilizes a threaded eye mold. Geometric shape and amorphous diamond coating technology to control the surface roughness of the wire, so that the surface of the wire forms a serrated amorphous diamond cutting wire saw. [Prior Art] In the semiconductor industry, wafer processing technology has a great impact on product quality and enterprise cost Φ, especially wafer cutting technology is the most important key factor. In the wafer fabrication steps of wafer, wafer dicing, polishing, cleaning, etc., the cutting technology determines the important factors of future wafer yield and quality, which in turn affects the cost of the entire enterprise. Therefore, the wafer cutting step is in wafer fabrication. The most important step. Wafer cutting technology can be divided into three stages, namely outer wafer cutting technology, internal wafer cutting technology and wire cutting technology. In order to increase the production capacity and reduce the cost of wafers, as the growth of the crystal growth technology, the wafer diameter is also larger, and the cone and the like cannot cut out the wafer and consume a large amount of wafers, so it will be eliminated in the future. However, the wire cutting and cutting technology is not limited by the size of the wafer, so it is the mainstream of the cutting technology in the semiconductor industry. Wire cutting technology can be divided into two types according to the use of abrasive materials. One is the free abrasive sawing (FREE-ABRASIVE) using free abrasive in the cutting process. The principle is to use the piano wire or metal wire to drive the pulp to cut the processed objects. Another type of abrasive sawing (FIXED-ABRASIVE) that uses a fixed abrasive during the cutting process. The principle is to fix the abrasive such as diamond on the piano wire or metal wire by sintering, resin bonding, electroplating or brazing to process the workpiece. Cut. The two technologies have their own advantages. 5 200824823 Disadvantages The advantages of the free abrasives are that the waste of the processed materials can be reduced, but the removal efficiency of the free abrasives on the processed materials is low, and the pure silk is completely utilized. I abandon it, causing the shortcomings of long curing time and increased abrasive cost. On the other hand, the advantage of solid grinding (4) is that the grinding efficiency is high, but in the process of fixing the diamond to the piano wire, it must be subjected to a high temperature process, which causes the piano wire or the wire to be reduced in rigidity. 'There is a break, and the diamond is not easily bonded to the wire. In the middle, the diamond may fall off and scratch the wafer. So the existing method will
衫筒上，再將套筒焊接在線材上，但如此卻造成線鑛 直仫…、法％小之缺點，反而造成加工物的浪費。 因此，隨著晶圓直徑的增加，減少切口寬度、降低加工時間、 降低磨料損耗成本以提高晶圓產量乃為目前所研究 【發明内容】 逆m 本發明人有鑑於上述問題，乃積極著手進行研發，以期可以 解決上述課題，經過不斷的試驗即努力，終於研發出本發明。 本發明之主要技術手段在於提供一種以無晶鑽石膜披覆於線 材上，該線材可利用抽線眼模的幾何形狀及無晶鑽顯塗佈技術， 鲁 控制線材之粗糙度’使其表面具有銀齒狀。 本發明係利用無晶鑽石（amorph〇us diam〇nd，a_D)塗 佈於線材上以作為微型加工切割線錯，並利用抽線眼膜的幾何形 狀及無晶鑽石塗佈技術，控制線材表面的粗糙度，使得線材表面 具有鋸齒狀。 無晶鑽石膜具有類石墨鍵與類鑽石鍵結合之非晶質類鑽碳 (Diamond like carb〇n，DLC)薄膜，可以物理氣相沉積法或 化學氣相沉積法塗佈於任何基材上，無晶鑽石為最硬及最滑的鍍 6 200824823 膜，其硬度遠超過其他鍍膜（如TiCN等），如其類鑽碳鍵結之 比例甚高（如90%)，其硬度甚至可接近鑽石之真硬度。 本發明兼具游離磨料鋸切與固定磨料鋸切之優點，其主要之 優點如下： 1. 無晶鑽石的硬度幾乎等於鑽石刻例的硬度，因此可以輕易 的切割晶圓。 2. 本發明不需要游離磨料，故可以降低磨料成本。 3. 本發明之線鋸直徑幾乎等於原來之線材直徑，因此切口寬 ^ 度極小，不會浪費加工物，進而可以增加晶圓產量。 4. 本發明沒有鑽石顆粒摻入其中，因此在切割過程中不會有 鑽石顆粒脫洛而刮傷晶圓之虞，可以確保晶圓品質。 5. 利用抽線眼模之幾何形狀，可以控制線材表面的粗糙度， 使得其表面呈錯齒狀，藉此增加切割表面積及尖點，可使加工速 度增加而降低加工時間。 【實施方式】 本發明係一種將無晶鑽石披覆在極細的線材上，利用無晶鑽 • 石塗佈技術以及抽線眼模之幾何形狀來控制線材的形狀及粗糙 度，使線材表面具有鋸齒狀以增加線材切割的表面積。 請參看第一及二圖所示，本發明所使用線材（2 0)可以藉 由抽線眼模之幾何形狀使得其呈現出徑向剖面呈表面具鋸齒狀之 類圓形（如第一圖）、或是三角形（如第二圖），配合第三圖所 示，藉由物理氣相沉積法或化學氣相沉積法等無晶鑽石塗佈技術， 將無晶鑽石膜（1 0)彼覆在線材（20)表面，因為無晶鑽石 膜（1 0 )可以塗設於幾乎所有的材料上，因此線材（2 0)之 7 200824823 選擇可以使用金屬類（如不鏽鋼線、鋼線、鈦合金線等）、穿 類（鋼琴線）、陶瓷類（氧化鋁等）之绩 、塑膠 《線材。線材（2 〇)利用 抽線眼模之幾何形狀（如三角形、多邊形等）以及無晶鑽石膜 〇)塗佈技術，可以使得具無晶鑽石膜（i 〇)之線材（2、⑸ 表面呈現出鋸齒狀，大大增加切割表面積及加工速度。On the sleeve, the sleeve is welded to the wire, but this causes the wire mine to be straight... The shortcomings of the method are small, but the waste of the workpiece is caused. Therefore, as the diameter of the wafer increases, the reduction of the slit width, the reduction of the processing time, and the reduction of the abrasive loss cost to increase the wafer yield are currently studied. [Inventive content] The present inventors have actively pursued the above problems in view of the above problems. R & D, in order to solve the above problems, through continuous trials and efforts, finally developed the present invention. The main technical means of the present invention is to provide a crystallized diamond film coated on a wire material, which can utilize the geometry of the eye-catching eye mold and the crystal-free drilling coating technology, and control the roughness of the wire to make the surface It has a silvery tooth shape. The invention utilizes amorphous diamond (amorph〇us diam〇nd, a_D) to be coated on the wire as a micro-machining cutting line fault, and controls the wire surface by using the geometry of the eye-catching eye film and the crystal-free diamond coating technology. The roughness makes the surface of the wire have a zigzag shape. The amorphous diamond film has a graphite-like diamond-like carbon (Diamond like carb〇n, DLC) film bonded to a diamond-like bond and can be applied to any substrate by physical vapor deposition or chemical vapor deposition. Amorphous diamond is the hardest and smoothest plated 6 200824823 film, its hardness is far more than other coatings (such as TiCN, etc.), such as its proportion of diamond-like carbon bonding is very high (such as 90%), its hardness can even be close to diamonds The true hardness. The invention has the advantages of free abrasive sawing and fixed abrasive sawing. The main advantages are as follows: 1. The hardness of the amorphous diamond is almost equal to the hardness of the diamond engraving, so the wafer can be easily cut. 2. The present invention does not require free abrasives, so the abrasive cost can be reduced. 3. The wire saw of the present invention has a diameter almost equal to the original wire diameter, so that the slit width is extremely small, and the workpiece is not wasted, thereby increasing the wafer yield. 4. In the present invention, no diamond particles are incorporated therein, so that there is no diamond particles in the cutting process and the wafer is scratched, which ensures wafer quality. 5. Using the geometry of the eye-catching eye mold, the surface roughness of the wire can be controlled so that the surface of the wire is misaligned, thereby increasing the cutting surface area and sharp points, which can increase the processing speed and reduce the processing time. [Embodiment] The present invention is a method in which an amorphous diamond is coated on a very fine wire, and the shape and roughness of the wire are controlled by the geometry of the crystalless diamond stone coating technique and the eye shape of the wire, so that the surface of the wire has Jagged to increase the surface area cut by the wire. Referring to the first and second figures, the wire (20) used in the present invention can be drawn into a circular shape with a zigzag shape by the geometry of the eye-drawing eye mold (as shown in the first figure). ) or a triangle (as shown in the second figure), as shown in the third figure, the amorphous diamond film (10) is coated by an amorphous diamond coating technique such as physical vapor deposition or chemical vapor deposition. Cover the surface of the wire (20), because the amorphous diamond film (10) can be applied to almost all materials, so the wire (20) 7 200824823 can choose to use metal (such as stainless steel wire, steel wire, titanium Alloy wire, etc., wear (piano line), ceramic (alumina, etc.), plastic "wire." The wire (2 〇) can be coated with a geometrical shape (such as a triangle, a polygon, etc.) and an amorphous diamond film (抽 〇), which can make the surface of the wire with an amorphous diamond film (i () It is jagged and greatly increases the cutting surface area and processing speed.
請參看第四圖所示，本發明之無晶鑽石（DLC)硬度僅欠於 鑽石，但遠高於其他磨料材’因此本發明可以輕易的切割加工物，、 如陶竟切晶圓等’且由於本發明並無磨料顆粒而係以抽線眼模 控制線材形狀並使得線材表面呈現出鑛齒狀，因此切割加工時不 會有顆粒掉落而損傷晶圓表面之問題，且由於無晶鑽石模之厚度 可控制在極小的範圍，因此線鋸之切口寬度幾乎等同線材寬度而 不會浪費加工物。 【圖式簡單說明】 第一圖係本發明實施例之徑向剖面圖。 第二圖係本發明另一實施例之徑向剖面圖。 第三圖係本發明之軸向剖面圖。 第四圖係本發明與其他磨料材之硬度比較圖。 【主要元件符號說明】 (1 0)無晶鑽石膜 (2 0)線材 8Referring to the fourth figure, the amorphous diamond (DLC) hardness of the present invention is only owed to diamonds, but is much higher than other abrasive materials. Therefore, the present invention can easily cut processed materials, such as ceramic chips, etc. Moreover, since the present invention has no abrasive particles and controls the shape of the wire by the eye-catching eye mold and causes the surface of the wire to exhibit a mineral tooth shape, there is no problem that the surface of the wire is damaged when the cutting process is damaged, and since the crystal is not crystallized, The thickness of the diamond mold can be controlled to a very small extent, so the slit width of the wire saw is almost equal to the width of the wire without wasting the workpiece. BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a radial sectional view of an embodiment of the present invention. The second drawing is a radial cross-sectional view of another embodiment of the present invention. The third figure is an axial sectional view of the present invention. The fourth figure is a comparison of the hardness of the present invention with other abrasive materials. [Main component symbol description] (1 0) Amorphous diamond film (20) wire 8