CN101591796A - A kind of production technique for preparing high-performance diamond wire saw - Google Patents
A kind of production technique for preparing high-performance diamond wire saw Download PDFInfo
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- CN101591796A CN101591796A CNA2009100433806A CN200910043380A CN101591796A CN 101591796 A CN101591796 A CN 101591796A CN A2009100433806 A CNA2009100433806 A CN A2009100433806A CN 200910043380 A CN200910043380 A CN 200910043380A CN 101591796 A CN101591796 A CN 101591796A
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Abstract
A kind of production technique for preparing high-performance diamond wire saw may further comprise the steps: at first, utilize diamond and Tungsten oxide 99.999 650 ℃～900 ℃ with water vapor, hydrogen reaction, form W-W at diamond surface
2The C layer is realized diamond surface alloying tungsten; Then, the diamond of surface alloying tungsten and a watt type nickel plating solution are mixed with electroplate liquid, as anode, wire is electroplated as negative electrode with the nickel plate; Make the diamond of surface metalation tungsten do the electrophoresis motion galvanic deposit on the wire surface under electric field action, metallic nickel also is electroplated onto the wire surface simultaneously.The diamond fretsaw of the present invention's preparation has diamond particles and is evenly distributed, diamond accounts for quality of coating per-cent height, electroplating velocity is fast, it between diamond and the Ni substrate metallurgical binding, significantly improve the control ability of matrix, increase substantially the cutting power and the work-ing life of diamond fretsaw the cutting edge diamond particles.Be suitable for suitability for industrialized production, alternative existing diamond fretsaw production technique.
Description
Technical field
The invention discloses a kind of preparation method of high-performance diamond wire saw, be meant a kind of production technique for preparing high-performance diamond wire saw especially, relate to material surface alloying and electroplating technology field.
Background technology
Hard and fragile material comprises various stone materials, jewel, glass, silicon crystal, quartz crystal, Wimet, pottery, rareearth magnetic material etc.Hard and fragile material mostly is electrical insulator or semi-conductor greatly, has high rigidity, high fragility, high-wearing feature, high corrosion stability, high antioxidant, high resistivity, high temperature resistant, performance such as magnetic conduction not usually.Because hard and fragile material has the good characteristic that many metallic substance hardly match, so its range of application expands to industrial circles such as space flight, machinery, automobile, light industry, chemical industry (as making bearing with agate, jewel etc. gradually by construction industry, artwork production etc.; Make cutting tool etc. with engineering ceramics).Applying of hard and fragile material proposed requirements at the higher level to its processing technology.Cutting processing is the critical process of hard and fragile material processing, and its main technique requirement is: high-level efficiency, low cost, narrow joint-cutting (material use efficiency height), not damaged, non-environmental-pollution etc.Be subjected to the restriction of hard and fragile material characteristic, the cutting method that can Gong select for use mainly contains diamond saw blade cutting (comprising diamond frame sawing, band-saw diamond etc.), laser beam cutting etc.Each tool advantage of these cutting methods also respectively has its limitation, can not cutting curve as diamond saw blade cutting, and the joint-cutting broad, volume recovery is lower, is unsuitable for precious materials is carried out precise cutting.The scope of application of laser beam cutting is wider, but depth of cut is limited, if adopt high power laser, the high-temperature plasma that then produces between laser and workpiece is known from experience the obvious working (machining) efficiency that reduces, and increases the discharge difficulty of melts, and facility investment expense costliness.
Diamond fretsaw is a kind of good tool of processing hard and fragile material, and diamond fretsaw can be made different diameters and length as required; Can be installed in the different processing mode of formation on the different equipment, as reciprocation cycle (saw frame) formula, high speed band saw formula, line cutting type etc.To the processing of hard and fragile material, can dicing sheet, processing curve, the advanced study and training aperture, application prospect is very wide.Diamond wire normally adopts electric plating method to deposit layer of metal (being generally nickel and nickel cobalt (alloy)) on wire (line) matrix, and consolidating material and diamond abrasive is made in sedimentary metal.Metal plating is a wedding agent, and diamond abrasive is used for machining.Because diamond is an electrical insulator, in electroplating process, diamond is by wire the absorption of diamond particles to be finished with electroplating combining of matrix nickel, causes diamond skewness one in electroplated nickel matrix, and agglomeration is serious; It is low that diamond accounts for quality of coating per-cent, and electroplating velocity is slow; Particularly diamond and Ni substrate are combined into mechanical bond but not metallurgical binding, matrix to the diamond particles hold a little less than, cause that diamond is easy to peel off in the work working angles, diamond fretsaw is short work-ing life.
Summary of the invention
The objective of the invention is to overcome the deficiency of prior art and provide a kind of diamond in electroplated nickel matrix, to be evenly distributed, it is higher that diamond accounts for quality of coating per-cent, electroplating velocity is slow, it between diamond and the Ni substrate metallurgical binding, matrix is strong to the diamond particles hold, the production technique of the preparation high-performance diamond wire saw of long service life.
The present invention adopts following proposal to realize: a kind of production technique for preparing high-performance diamond wire saw may further comprise the steps:
The first step: diamond surface alloying
Get Tungsten oxide 99.999 that diamond that granularity is 10um-150um and granularity be 2～5um by weight: diamond: Tungsten oxide 99.999=1: (3～3.5) uniform mixing places tube furnace to be heated to 650 ℃～900 ℃, the feeding dew point is-25 ℃～-35 ℃ a hydrogen in tube furnace, is incubated 0.5～2.0 hour; Preferential and the high-volatile hydronium(ion) oxidation tungsten gas of steam reaction formation of Tungsten oxide 99.999, described hydronium(ion) oxidation tungsten gas is formed the high reactivity tungsten atom by hydrogen reduction, and is attracted to diamond particles surface and diamond reaction, and formation thickness is the W-W of 5～20um
2The surface metalation diamond particles raw material of C-diamond surface layer;
Second step: electroplate liquid preparation
Get the first step gained surface alloying diamond and watt type nickel plating solution by weight: diamond: nickel plating solution=(1.5～2): 100 mix composition diamond suspension liquid;
The 3rd step: the pre-plating
The second step gained electroplate liquid is placed coating bath, adopt the nickel plate as anode, wire is as negative electrode, and electroplating voltage is 2.15～3.50V, after electroplating time is 2～3.5 minutes, steel wire is carried out clear water rinsing, oven dry; Make the diamond of surface metalation tungsten do the electrophoresis motion galvanic deposit on the wire surface under electric field action, metallic nickel also is electroplated onto the wire surface simultaneously.
Among the present invention, in the described step the first step, diamond particles deoils through 10%Na (OH) aqueous solution, and the clear water rinsing then, with 5% chloroazotic acid pickling, is removed the impurity of diamond surface.
Among the present invention, it is that the coating bath of electroplate liquid carries out the electroless nickel layer thickening that the steel wire after pre-plating of three steps of described step the is placed with watt type nickel plating solution, and electroplating time is 4.0～6.5 minutes, further solidifies diamond particles.
Among the present invention, described step the is in three steps, and wire is through alkali cleaning oil removing, acid pickling and rust removing activation treatment.
The present invention is owing to adopt above-mentioned processing method, utilize Tungsten oxide 99.999 to make presoma, descend and the hydrogen effect that contains minor amount of water at 650 ℃～900 ℃, vaporization-the reduction reaction of generation tungsten is formed the high reactivity tungsten atom by hydrogen reduction after forming high-volatile hydronium(ion) oxidation tungsten gas, and be attracted to the diamond particles surface diffusion to diamond, forming thickness is the W-W of 5～20um
2The diamond particles of C-diamond composite structure is realized the metallization of diamond surface layer; Then, adopt surface metalation Buddha's warrior attendant masonry preparation of raw material electronickelling watt solution, in the process to the wireline electronickelling, the surface alloying diamond is under electric field action, and surface alloying Buddha's warrior attendant masonry electrophoresis motion is plated to the wireline surface in the time of with the electronickelling process.Based on the excellent metallurgical bonding interface that the W-Ni consistency forms, in the diamond fretsaw of preparing, diamond particles is evenly distributed on the electroplated nickel matrix, and Ni substrate is controlled diamond particles securely.The alloying diamond particles is plated to wireline surface by plating and forms good chemical bond with matrix nickel and combine; The Ni-W alloying makes the surface and the electroplated nickel matrix of surface plating tungstenalloy diamond particles form metallurgical binding in addition, so, bear the diamond particles of cutting task and firmly controlled by matrix, the military service performance, particularly work-ing life of diamond fretsaw increase substantially.
Compare with existing preparation method, the present invention has the following advantages:
1, diamond fretsaw being carried out surface plating tungsten metallization with diamond handles, make diamond become electrical conductor, do electrophoresis motion at electric field action lower surface metallization diamond during plating,, concentration controllably galvanic deposit even on the wire surface firmly combine with wire.
2, adopt plating tungsten surface metalation diamond as the feedstock production diamond fretsaw, form W-W based on the diamond particles surface
2C-diamond surface layer and Ni-W alloying, the metallurgical binding at formation diamond particles and matrix nickel interface, the assurance Ni substrate is controlled the cutting edge-diamond particles of diamond fretsaw securely, makes diamond fretsaw obtain stronger machinability, longer work-ing life.
3, because diamond has carried out electroplating preceding pre-treatment, can adapt to the diamond of particle diameter on a large scale, particle diameter can be selected at 10um-150um;
4, diamond fretsaw being carried out surface plating tungsten metallization with diamond handles, make diamond become electrical conductor, can control the content of diamond in coating easily, can significantly improve plating production efficiency simultaneously, make that electroplating speed can reach 1-20m/min;
In sum, a kind of method for preparing high-performance diamond wire saw of the present invention, adopt plating tungsten surface alloying diamond as raw material, pass through electric field action, alloying diamond and matrix nickel carry out composite plating, the diamond fretsaw of preparation has diamond particles and is evenly distributed, diamond accounts for quality of coating per-cent height, electroplating velocity is fast, it between diamond and the Ni substrate metallurgical binding, significantly improve the control ability of matrix, increase substantially the cutting power and the work-ing life of diamond fretsaw the cutting edge diamond particles.Be suitable for suitability for industrialized production, alternative existing diamond fretsaw production technique.
Embodiment
Embodiment 1
The first step: diamond surface alloying
Being averaged granularity is that 15um, process 10%Na (OH) aqueous solution deoil, the clear water rinsing, then, with 5% chloroazotic acid pickling, remove the diamond of diamond surface impurity and Tungsten oxide 99.999 that mean particle size is 3um by weight: diamond: 1: 3.5 uniform mixing of Tungsten oxide 99.999 places tube furnace to be heated to 650 ℃～660 ℃, the feeding dew point is-25 ℃～-26 ℃ a hydrogen in tube furnace, is incubated 0.5～0.6 hour; Former wire diameter is 0.16mm, and forming one deck total thickness on the diamond particles surface is the tungsten of 5um;
Second step: electroplate liquid preparation
Get the first step gained surface alloying diamond and watt type nickel plating solution by weight: diamond: nickel plating solution=1.8: 100 mixes forms the diamond suspension liquid;
The 3rd step: electroplate
The second step gained electroplate liquid is placed coating bath, adopt the nickel plate as anode, the wire of process alkali cleaning oil removing, acid pickling and rust removing activation treatment is as negative electrode, electroplating voltage is 2.15～2.20V, electroplating time is 3 minutes, it is that the coating bath of electroplate liquid carries out electroless nickel layer thickening 5.5 minutes that steel wire after electroplating is in advance placed with watt type nickel plating solution, then, steel wire is carried out clear water rinsing, oven dry; Obtain the diamond fretsaw diameter and be 0.230mm (± 0.005mm), the diamond fretsaw tensile strength remains 81.5% (the naked silk of former wireline intensity is 72N) of former naked silk.Adopt high-performance diamond wire saw cutting sapphire on reciprocating type diamond wire saw of preparation, the cutting Trace speed is 900m/min, implements 120 synchronous cutting.Joint-cutting≤0.2um, section angularity≤5um, through cutting twice, line directly weares and teares≤0.0002mm, and acceptable life is 8 times.。Adopt Japan to produce line and directly be the sticking diamond wire contrast of 0.18um resin cutting, the cutting life-span is 3 times.
Embodiment 2
The first step: diamond surface alloying
Being averaged granularity is that 70um, process 10%Na (OH) aqueous solution deoil, the clear water rinsing, then, with 5% chloroazotic acid pickling, remove the diamond of diamond surface impurity and granularity and be 4.0 Tungsten oxide 99.999 by weight: diamond: 1: 3.0 uniform mixing of Tungsten oxide 99.999 places tube furnace to be heated to 750 ℃～760 ℃, the feeding dew point is-29 ℃～-30 ℃ a hydrogen in tube furnace, is incubated 0.9～1.0 hour; Former wire diameter is 0.18mm, and forming one deck total thickness on the diamond particles surface is the tungsten of 3～5um;
Second step: electroplate liquid preparation
Get the first step gained surface alloying diamond and watt type nickel plating solution by weight: diamond: nickel plating solution=2.0: 100 mixes forms the diamond suspension liquid;
The 3rd step: electroplate
The second step gained electroplate liquid is placed coating bath, adopt the nickel plate as anode, the wire of process alkali cleaning oil removing, acid pickling and rust removing activation treatment is as negative electrode, electroplating voltage is 2.6～2.7V, electroplating time is 3.5 minutes, it is that the coating bath of electroplate liquid carries out electroless nickel layer thickening 4.0 minutes that steel wire after electroplating is in advance placed with watt type nickel plating solution, then, steel wire is carried out clear water rinsing, oven dry; Obtain the diamond fretsaw diameter and be 0.240mm (± 0.005mm), the diamond fretsaw tensile strength remains 80% (the naked silk of former wireline intensity is 78N) of former naked silk.Adopt the high-performance diamond wire saw of preparation to cut magneticsubstance on reciprocating type diamond wire saw, the cutting Trace speed is 900m/min, implements 80 synchronous cutting.Joint-cutting≤0.25um, section angularity≤5um, through cutting twice, line directly weares and teares≤0.0002mm, and acceptable life is 10 times.。Adopt Japan to produce line and directly be the sticking diamond wire contrast of 0.18um resin cutting, the cutting life-span is 3 times.
Embodiment 3
The first step: diamond surface alloying
Being averaged granularity is that 140um, process 10%Na (OH) aqueous solution deoil, the clear water rinsing, then, with 5% chloroazotic acid pickling, remove the diamond of diamond surface impurity and Tungsten oxide 99.999 that mean particle size is 2.5um by weight diamond: 1: 3.2 uniform mixing of Tungsten oxide 99.999 places tube furnace to be heated to 890 ℃～900 ℃, the feeding dew point is-34 ℃～-35 ℃ a hydrogen in tube furnace, is incubated 1.9～2.0 hours; Former wire diameter is 0.160mm, and forming one deck total thickness on the diamond particles surface is the tungsten of 15um;
Second step: electroplate liquid preparation
Get the first step gained surface alloying diamond and watt type nickel plating solution by weight: diamond: nickel plating solution=1.5: 100 mixes forms the diamond suspension liquid;
The 3rd step: electroplate
The second step gained electroplate liquid is placed coating bath, adopt the nickel plate as anode, the wire of process alkali cleaning oil removing, acid pickling and rust removing activation treatment is as negative electrode, electroplating voltage is 3.4～3.5V, electroplating time is 2 minutes, it is that the coating bath of electroplate liquid carries out electroless nickel layer thickening 6.5 minutes that steel wire after electroplating is in advance placed with watt type nickel plating solution, then, steel wire is carried out clear water rinsing, oven dry; Obtain the diamond fretsaw diameter and be 0.240mm (± 0.005mm), the diamond fretsaw tensile strength remains 75% (the naked silk of former wireline intensity is 76N) of former naked silk.Adopt the high-performance diamond wire saw of preparation to cut magneticsubstance on reciprocating type diamond wire saw, the cutting Trace speed is 900m/min, implements 101 synchronous cutting.Joint-cutting≤0.25um, section angularity≤5um, through 4 cuttings, line directly weares and teares≤0.0003mm, and acceptable life is 12 times.Adopt Japan to produce line and directly be the sticking diamond wire contrast of 0.18um resin cutting, the cutting life-span is 4 times.
Claims (4)
1, a kind of production technique for preparing high-performance diamond wire saw may further comprise the steps:
The first step: diamond surface alloying
Get Tungsten oxide 99.999 that diamond that granularity is 10um-150um and granularity be 2～5um by weight: diamond: Tungsten oxide 99.999=1: (3～3.5) uniform mixing places tube furnace to be heated to 650 ℃～900 ℃, the feeding dew point is-25 ℃～-35 ℃ a hydrogen in tube furnace, is incubated 0.5～2.0 hour; Preferential and the high-volatile hydronium(ion) oxidation tungsten gas of steam reaction formation of Tungsten oxide 99.999, described hydronium(ion) oxidation tungsten gas is formed the high reactivity tungsten atom by hydrogen reduction, and is attracted to diamond particles surface and diamond reaction, and formation thickness is the W-W of 5～20um
2The surface metalation diamond particles raw material of C-diamond surface layer;
Second step: electroplate liquid preparation
Get the first step gained surface alloying diamond and watt type nickel plating solution by weight: diamond: nickel plating solution=(1.5～2): 100 mix composition diamond suspension liquid;
The 3rd step: the pre-plating
The second step gained electroplate liquid is placed coating bath, adopt the nickel plate as anode, wire is as negative electrode, and electroplating voltage is 2.15～3.50V, after electroplating time is 2～3.5 minutes, steel wire is carried out clear water rinsing, oven dry; Make the diamond of surface metalation tungsten do the electrophoresis motion galvanic deposit on the wire surface under electric field action, metallic nickel also is electroplated onto the wire surface simultaneously.
2, a kind of production technique for preparing high-performance diamond wire saw according to claim 1 is characterized in that: in the described step the first step, diamond particles deoils through 10%Na (OH) aqueous solution, the clear water rinsing, then, with 5% chloroazotic acid pickling, remove the impurity of diamond surface.
3, a kind of production technique for preparing high-performance diamond wire saw according to claim 1 is characterized in that: it is that the coating bath of electroplate liquid carries out the electroless nickel layer thickening that the steel wire after pre-plating of three steps of described step the is placed with watt type nickel plating solution, electroplating time is 4.0～6.5 minutes, further solidifies diamond particles.
4, a kind of production technique for preparing high-performance diamond wire saw according to claim 1 is characterized in that: described step the is in three steps, and wire is through alkali cleaning oil removing, acid pickling and rust removing activation treatment.
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| CN101812710A (en) * | 2010-04-26 | 2010-08-25 | 长沙岱勒金刚石制品有限公司 | Diamond wire saw production method of surface modified diamond |
| CN101838838A (en) * | 2010-04-26 | 2010-09-22 | 长沙岱勒金刚石制品有限公司 | Preparation method of composite diamond fretsaw |
| CN101934557A (en) * | 2010-08-18 | 2011-01-05 | 江苏友和工具有限公司 | Process for carrying out shape cutting on stone by electroplated diamond wire saw |
| CN102152216A (en) * | 2010-12-27 | 2011-08-17 | 长沙岱勒新材料科技有限公司 | Cubic boron nitride cutting line |
| CN102152215A (en) * | 2010-12-27 | 2011-08-17 | 长沙岱勒新材料科技有限公司 | Wire-cutting wire of structural electrodeposited abrasive material |
| CN102152416A (en) * | 2011-01-27 | 2011-08-17 | 王楚雯 | Diamond fretsaw and manufacture method thereof |
| CN102225596A (en) * | 2011-06-03 | 2011-10-26 | 蒙特集团（香港）有限公司 | Solar silicon wafer wire cutting steel wire and manufacturing method thereof |
| CN102268717A (en) * | 2011-07-22 | 2011-12-07 | 南京三超金刚石工具有限公司 | Sand feeding method for diamond wire saw |
| CN102392286A (en) * | 2011-11-14 | 2012-03-28 | 李园 | Device for preparing diamond wire saw and method for preparing diamond wire saw by device |
| CN102644102A (en) * | 2012-04-05 | 2012-08-22 | 燕山大学 | Diamond wire saw manufactured by adopting diamond micropowder |
| CN102653878A (en) * | 2012-04-24 | 2012-09-05 | 苏闽(张家港)新型金属材料科技有限公司 | Process for plating diamond on surface of cutting steel wire |
| CN103003015A (en) * | 2010-08-27 | 2013-03-27 | 长沙岱勒新材料科技有限公司 | Electroplated diamond wire of corrugated shape |
| CN103266341A (en) * | 2013-05-17 | 2013-08-28 | 浙江工业大学 | Preparation method for producing diamond cutting line through steel wire magnetization |
| CN103305895A (en) * | 2012-03-09 | 2013-09-18 | 株式会社山本镀金试验器 | Plating device and production method for plated article |
| CN108747874A (en) * | 2018-05-31 | 2018-11-06 | 芜湖昌菱金刚石工具有限公司 | A kind of scuff-resistant coating diamond composite and preparation method thereof |
| CN109016197A (en) * | 2018-07-18 | 2018-12-18 | 郑州磨料磨具磨削研究所有限公司 | A kind of novel electroplating diamond fretsaw |
| CN109016196A (en) * | 2018-07-18 | 2018-12-18 | 郑州磨料磨具磨削研究所有限公司 | A kind of electroplating diamond wire saw |
| CN111593374A (en) * | 2020-07-01 | 2020-08-28 | 信丰崇辉科技有限公司 | Electroplating solution for diamond cutting wire and preparation method thereof |
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| CN101838838A (en) * | 2010-04-26 | 2010-09-22 | 长沙岱勒金刚石制品有限公司 | Preparation method of composite diamond fretsaw |
| CN101812710A (en) * | 2010-04-26 | 2010-08-25 | 长沙岱勒金刚石制品有限公司 | Diamond wire saw production method of surface modified diamond |
| CN101934557A (en) * | 2010-08-18 | 2011-01-05 | 江苏友和工具有限公司 | Process for carrying out shape cutting on stone by electroplated diamond wire saw |
| CN103003015B (en) * | 2010-08-27 | 2015-11-25 | 长沙岱勒新材料科技股份有限公司 | A kind of corrugated electroplated diamond line |
| CN103003015A (en) * | 2010-08-27 | 2013-03-27 | 长沙岱勒新材料科技有限公司 | Electroplated diamond wire of corrugated shape |
| CN102152215A (en) * | 2010-12-27 | 2011-08-17 | 长沙岱勒新材料科技有限公司 | Wire-cutting wire of structural electrodeposited abrasive material |
| CN102152216A (en) * | 2010-12-27 | 2011-08-17 | 长沙岱勒新材料科技有限公司 | Cubic boron nitride cutting line |
| CN102152416A (en) * | 2011-01-27 | 2011-08-17 | 王楚雯 | Diamond fretsaw and manufacture method thereof |
| CN102152416B (en) * | 2011-01-27 | 2014-05-28 | 盛利维尔（中国）新材料技术有限公司 | Diamond fretsaw and manufacture method thereof |
| CN102225596A (en) * | 2011-06-03 | 2011-10-26 | 蒙特集团（香港）有限公司 | Solar silicon wafer wire cutting steel wire and manufacturing method thereof |
| CN102268717B (en) * | 2011-07-22 | 2013-12-25 | 南京三超金刚石工具有限公司 | Sand feeding method for diamond wire saw |
| CN102268717A (en) * | 2011-07-22 | 2011-12-07 | 南京三超金刚石工具有限公司 | Sand feeding method for diamond wire saw |
| CN102392286B (en) * | 2011-11-14 | 2014-07-30 | 李园 | Device for preparing diamond wire saw and method for preparing diamond wire saw by device |
| CN102392286A (en) * | 2011-11-14 | 2012-03-28 | 李园 | Device for preparing diamond wire saw and method for preparing diamond wire saw by device |
| CN103305895A (en) * | 2012-03-09 | 2013-09-18 | 株式会社山本镀金试验器 | Plating device and production method for plated article |
| CN102644102A (en) * | 2012-04-05 | 2012-08-22 | 燕山大学 | Diamond wire saw manufactured by adopting diamond micropowder |
| CN102653878A (en) * | 2012-04-24 | 2012-09-05 | 苏闽(张家港)新型金属材料科技有限公司 | Process for plating diamond on surface of cutting steel wire |
| CN103266341A (en) * | 2013-05-17 | 2013-08-28 | 浙江工业大学 | Preparation method for producing diamond cutting line through steel wire magnetization |
| CN108747874A (en) * | 2018-05-31 | 2018-11-06 | 芜湖昌菱金刚石工具有限公司 | A kind of scuff-resistant coating diamond composite and preparation method thereof |
| CN109016197A (en) * | 2018-07-18 | 2018-12-18 | 郑州磨料磨具磨削研究所有限公司 | A kind of novel electroplating diamond fretsaw |
| CN109016196A (en) * | 2018-07-18 | 2018-12-18 | 郑州磨料磨具磨削研究所有限公司 | A kind of electroplating diamond wire saw |
| CN109016196B (en) * | 2018-07-18 | 2020-12-01 | 郑州磨料磨具磨削研究所有限公司 | Electroplated diamond wire saw |
| CN111593374A (en) * | 2020-07-01 | 2020-08-28 | 信丰崇辉科技有限公司 | Electroplating solution for diamond cutting wire and preparation method thereof |
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Open date: 20091202 |