CN102492367B - Low-melting-point metal adhesive and diamond wire saw obtained by metal adhesion - Google Patents
Low-melting-point metal adhesive and diamond wire saw obtained by metal adhesion Download PDFInfo
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- CN102492367B CN102492367B CN 201110403623 CN201110403623A CN102492367B CN 102492367 B CN102492367 B CN 102492367B CN 201110403623 CN201110403623 CN 201110403623 CN 201110403623 A CN201110403623 A CN 201110403623A CN 102492367 B CN102492367 B CN 102492367B
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Abstract
The invention discloses a low-melting-point metal adhesive which comprises the following components by weight percent: 10-20% of Cu, 2-15% of Ti and the balance of Sn, wherein the particle size of Cu is 20-30mu m, the particle size of Ti is 20-30 mu m and the particle size of Sn is 20-30mu m; and the melting point of the metal adhesive is 250-350 DEG C. Meanwhile, the invention also discloses a diamond wire saw adhered by using the metal adhesive. According to the invention, the surface of a steel wire is treated and then the steel wire is placed in low-melting-point alloy powder mixed with diamond; the steel wire is electrified and heated so that the metal adhesive mixed with the diamond grains is molten, a metal layer mixed with the diamond is rapidly plated on the surface of the steel wire, and the exposure height of the diamond is regulated through nickel plating posttreatment and the diamond is prevented from falling. According to the invention, the low-melting-point metal alloy powder is used as the adhesive, thereby increasing the bonding strength of the steel wire and a grinding layer and improving the mechanical property of the wire saw; and the steel wire is subjected to direct electric heating, thereby improving production efficiency and reducing preparation cost.
Description
Technical field
The present invention relates to a kind of diamond wire saw, relate in particular to a kind of diamond wire saw that adopts the low melting point metal caking agent.
Background technology
Along with progress of science and technology and development of modern industry, hard and fragile material, particularly non-metallic material, non-conducting material and semiconductor material, because of its unique character in the application of numerous areas such as electronics, optics, instrument, aerospace, national defence and civilian industry more and more widely.Because hard and fragile material hardness height, fragility are big, and conduction scarcely, difficult cutting can not be processed with physical process methods such as electrical spark.And the diamond wire cutting technique can effectively address these problems, and therefore is widely used in the cutting of hard and fragile material.
At present, the diamond wire sawing machine adopts the diamond wire cutting technique of free abrasive mostly, and its cutting efficiency is low, operating environment abominable and the saw silk life-span is short, the processing of slurry and cost recovery height.In recent years, the concretion abrasive diamond wire saw began to enter industrial application.At the surperficial fixed Buddha's warrior attendant abrasive particle of saw silk, the cutting process fixed grain substitutes original free abrasive, makes cutting efficiency improve greatly.
Electroplating technology and resin solidification technology are adopted in the production of fixed grain diamond wire saw usually.Electroplated diamond silk saw is a kind of superhard material parting tool of the firm plating of diamond abrasive being made on the steel wire matrix by the electrocrystallization effect of plated metal.It is very thin very long that its saw silk can be done, and reduces kerf width greatly, improves volume recovery, and be applicable to the sheet material processing of larger size range.But have the handling problem of waste liquid in the production process of saw silk, the while electrolytic coating need form certain thickness could be fixed with abrasive particle, is subjected to the restriction of electroplating deposition speed, and production efficiency is low and cost is higher.Simultaneously, the electrochemical plating abrasive material is embedded in the coating in fact just by mechanical embedding, and abrasive particle easily comes off, and for increasing hold, must increase thickness of coating, reduces the exposed height of abrasive material, thereby causes chip space to diminish, and instrument service efficiency and life-span reduce.In addition, for the resin solidification technology, diamond hold Xiao Yi comes off, and wear resistance, thermotolerance are relatively poor, is difficult to use in the multiple tracks cutting of the high heavy caliber silicon ingot of valuable hard and fragile material such as machine silicon crystal, crystal or processing stand temperature.The nearly more than ten years, the diamond brazing technology has caused people's attention.Braze welding diamond adopts the diamond surface metallization technology, with active solder or nickel-based solder welding diamond, by strong carbonization forming element or alloy, diamond and matrix realization metallurgical chemistry is combined.Compare with the resin solidification method with traditional electrochemical plating, can realize the chemical metallurgy combination between method for brazing diamond abrasive, solder and matrix three, improved adamantine bonding strength greatly; The abrasive particle proud exposure is big, and chip space is big, is conducive to taking full advantage of of abrasive material; But the required equipment output investment ratio is bigger in the diamond brazing manufacturing processed, the cost height.
Summary of the invention
At above-mentioned prior art, the invention provides the diamond wire saw of a kind of low melting point metal caking agent and metal sticking thereof.Deficiency such as can improve environmental pollution in the existing diamond wire saw manufacture method, production efficiency is low, cost is high, product strength is low, in addition, the low melting point metal caking agent that adopts in the diamond wire saw of the present invention, its bonding strength height, wear resistance are strong.
In order to solve the problems of the technologies described above, the technical scheme that low melting point metal caking agent of the present invention is achieved is: the component of this low melting point metal caking agent and weight percent content are: 10～20% Cu, and 2～15% Ti, all the other are Sn; Wherein, the particle diameter of Cu is 20～30 μ m, and the particle diameter of Ti is 20～30 μ m, and the particle diameter of Sn is 20～30 μ m; The fusing point of this metal binding agent is 250～350 ℃.
The diamond wire saw of a kind of metal sticking of the present invention, adopt the following step manufacturing:
Step 1, be that oil removing, processing of rust removing are carried out in the surface of the 65Mn steel wire of 0.05-2.5mm with diameter, standby;
Step 2, being the diamond particles of 23-75 μ m with particle diameter, is that 1: 1 aqueous hydrochloric acid cleans with volume ratio earlier, use the diluted sodium hydroxide solution alkali cleaning again after, be washed to neutrality, dry at last;
Step 6, according to following composition and quality-volumetric concentration preparation watt type nickel plating solution: single nickel salt 230～280g/L, nickelous chloride 25～35g/L, boric acid 25～35g/L, 1,4-butynediol, 1～1.5g/L, sodium lauryl sulphate 0.10～0.15g/L;
Further, in the above-mentioned steps five, the diamond wire saw of a kind of metal sticking of the present invention, wherein, moment can be heated to 300～400 ℃ after the steel wire energising.In the step 7, on the steel wire total thickness of metal binding agent and nickel layer be the diamond particle diameter 1/3 and 1/2 between.
Compared with prior art, the invention has the beneficial effects as follows:
The present invention adopts the diamond wire saw of steel wire direct heating manufactured metal sticking, steel wire heats to make the metal binding agent that is mixed with diamond abrasive grain to melt by steel wire self after surface treatment, make the metal adhesion of molten state on steel wire, diamond is also by equably being held in the metal bonding layer.At last, adjust the overhang of abrasive particle again by Steel Wire Surface nickel plating, prevent coming off of diamond abrasive grain.Combine the advantage of resin solidification technology, electroplating technology and soldering tech among the present invention, in steel wire plating process, adopt the direct rapid heating of steel wire, improved production efficiency, reduced cost.The present invention adopts low melting point Sn-Cu-Ti alloy powder as caking agent, and wear resistance, bonding strength that makes diamond wire saw etc. is better than the resin solidification technology.The optimum overhang of recycling electronickelling technological adjustment diamond abrasive grain, and can prevent coming off of diamond abrasive grain.In the diamond wire saw of metal sticking of the present invention, form the chemical metallurgy combination between diamond abrasive, metal binding agent and the steel wire matrix three, thereby improved bonding strength, the long service life of silk saw.Silk saw manufacturing processed is simple, easy handling, and cleaning, safe and reliable, application prospect is very widely arranged.
Description of drawings
Fig. 1 is the structural representation of the diamond wire saw of metal sticking of the present invention;
Fig. 2 is the synoptic diagram of making the diamond wire saw of metal sticking of the present invention.
Among the figure:
1-damping system 2-actinobacillus wheel 3-guide wheel 4-steel wire
5-inlet mouth 6-powder feeding machine 7-powder 71-metal binding agent
72-diamond particles 8-venting port 9-constant current supply 10-take-up reel
Embodiment
Tell about detailed process of the present invention by the following examples, it is convenience in order to understand that embodiment is provided, and never is restriction the present invention.
Embodiment 1:
Prepare the low melting point metal binding agent according to following component and weight percent content: 10% Cu, 15% Ti, all the other are Sn; Wherein, the particle diameter of Cu is 25 μ m, and the particle diameter of Ti is 25 μ m, and the particle diameter of Sn is 25 μ m, and the fusing point that can extrapolate this metal binding agent according to each melting point metal in the above-mentioned Sn-10Cu-15Ti alloy powder is 300 ℃.
Embodiment 2:
Metal saw wire material adopts the 65Mn steel, and diameter 0.13mm at first, cleans 5min in basic solution, and back water is rinsed well, cleans 5min again in acidic solution, uses flushing with clean water, removes residual acid solution, and is standby.Being the diamond particles of 50 μ m with particle diameter, is that 1: 1 aqueous hydrochloric acid cleans 10min with volume ratio earlier,, with cleaning 30min in the diluted sodium hydroxide solution, be washed to neutrality again, dry at last; Diamond after cleaning is mixed the powder machine with packing into 1: 2 by the low melting point metal binding agent (being the Sn-10Cu-15Ti alloy powder) of above-described embodiment 1 preparation, mix the metal worn particle mixed powder that powder formation in 24 hours mixes.Prepare watt type nickel plating solution according to following composition and quality-volumetric concentration: single nickel salt 230～280g/L, nickelous chloride 25～35g/L, boric acid 25～35g/L, 1,4-butynediol, 1～1.5g/L, sodium lauryl sulphate 0.10～0.15g/L.
Make diamond wire saw with reference to Fig. 2: will be placed on the actinobacillus wheel 2 through pretreated steel wire 4; damping system 1 on the actinobacillus wheel 2 makes steel wire 4 increase certain tensile force; steel wire 4 enters in the metal worn particle mixed powder 7 through guide wheel 3; steel wire 4 joins with 9 liang of electrodes of constant current supply in metal worn particle mixed powder 7; holding current is at 0.9A; be 1.5 minutes conduction time; steel wire 4 can be heated to 350 ℃; make metal worn particle mixed powder fusing on every side through conduction; thereby plate the metal level that one deck is mixed with diamond abrasive grain on steel wire 4 surfaces; because when temperature surpasses 800 ℃; carbonization will take place in diamond; and Cu in the metal binding agent; Ti etc. are very easily oxidations in air; therefore; in steel wire 4 plating processes, charge into argon gas through inlet mouth 5; argon gas is discharged through venting port 8; in addition; guarantee that by powder feeding machine 6 metal worn particle mixed powder 7 is full of whole conical hopper all the time; steel wire portion temperature inequality prevents from switching on; then; by another guide wheel 3 silk is sawed on take-up reel 10; next; above-mentioned steel wire is carried out Nickel Plating Treatment; that is: be coated with the steel wire 4 that one deck is mixed with the diamond metal layer and in above-mentioned watt type nickel-plating liquid, carry out plating nickel on surface above-mentioned; make diamond 72 by the buried depth degree for its particle diameter 1/3 to 1/2, also, on the steel wire total thickness of metal binding agent and nickel layer 71 be diamond 72 particle diameters 1/3 and 1/2 between.So far, produce a kind of diamond wire saw of metal sticking, as shown in Figure 1.
Embodiment 3:
(i.e. all the other are Sn for 20% Cu, 10% Ti to adopt Sn-20Cu-10Ti as the copper base alloy powder proportioning (weight percent) of metal binding agent in the present embodiment; The fusing point that can extrapolate this metal binding agent according to each melting point metal in the above-mentioned Sn-20Cu-10Ti alloy powder is 350 ℃.In addition, when producing the silk saw, the electrically heated holding current of steel wire is at 0.8A, and be 2.5 minutes conduction time, and steel wire 4 can be heated to nearly 400 ℃.All the other are identical with embodiment one.
Embodiment 4:
(i.e. all the other are Sn for 20% Cu, 2% Ti to adopt Sn-20Cu-2Ti as the copper base alloy powder proportioning (weight percent) of metal binding agent in the present embodiment; The fusing point that can extrapolate this metal binding agent according to each melting point metal in the above-mentioned Sn-20Cu-2Ti alloy powder is 250 ℃.In addition, when producing the silk saw, the electrically heated holding current of steel wire is at 0.7A, and be 2 minutes conduction time, can be heated to 300 ℃.All the other are identical with embodiment one.
Adopt low melting point Sn-Cu-Ti alloy powder as metal adhesive among the present invention, be conducive to diamond and this caking agent and form metallurgical binding, reduce interfacial tension, improve wettability, form the good binding interface.The intensity of this metal binding agent and hardness are all very high, and its shrinking percentage is little, and have good thermal conductivity, help to reduce the temperature that produces in the processing, avoid the steel wire burn.In addition since in air when temperature surpasses 800 ℃, carbonization will take place in diamond, and all very easily oxidations in air such as copper, titanium in the metal binding agent, so the method that adopts rare gas element (argon gas) to protect among the present invention is produced.
Also have, the metal binding agent among the present invention and nickel coating should not be too thick, and blocked up meeting too much is embedded in wherein diamond abrasive grain, does not just reach the purpose of cutting, cross thin then diamond abrasive grain and can not well well be controlled by metal binding agent, easily come off in the cutting.Therefore, the total thickness of metal binding agent and nickel layer will be controlled at the diamond particle diameter 1/3 and 1/2.
For the stability that is conducive to obtain high-quality steel wire and improve metal sticking and abrasive particle particle, carry out surface preparation before the steel wire plating earlier, comprise alkali cleaning and pickling, be mainly used in removing its surperficial greasy dirt and oxide skin etc.; Soda-wash solution mainly comprises sodium hydroxide, anhydrous sodium carbonate, water glass, sodium phosphate etc., and 100 ℃ of temperature are with the greasy dirt that guarantees to remove fully Steel Wire Surface, lubricant film etc.Acidic solution mainly adopts 10% hydrochloric acid soln, and hydrochloric acid has stronger erosional competency to the burning leatherware at normal temperatures, but slower to steel substrate dissolving is difficult for taking place excessive erosion and hydrogen embrittlement phenomenon.Diamond also carries out pickling, alkali cleaning is mainly used in improving the wetting ability on surface, removes the impurity of diamond surface simultaneously.
Nickel plating among the present invention belongs to protection to be handled, because Nickel Plating Treatment can prevent coming off of silk saw surface diamond abrasive particle, adjusts the overhang of abrasive particle simultaneously, and raising is to the diamond hold when assurance silk saw surface holds the bits ability.Nickel plating solution is selected watt type plating bath, mainly comprises single nickel salt, nickelous chloride, boric acid etc.Watt type plating bath has that cost is low, bath stability, be easy to advantage such as maintenances, and coating fragility and internal stress are less simultaneously, is particularly suitable for the electroplated diamond saw thread of bending motion.
To sum up, silk saw of the present invention uses low-melting metal alloy powder as caking agent, has increased the bonding strength of steel wire and grinding layer, has improved silk saw tool performance; Adopt the direct electrically heated of steel wire, both improved production efficiency, reduced manufacturing cost simultaneously.
Although top invention has been described in conjunction with figure; but the present invention is not limited to above-mentioned embodiment; above-mentioned embodiment only is schematic; rather than it is restrictive; those of ordinary skill in the art is under enlightenment of the present invention; under the situation that does not break away from aim of the present invention, can also make a lot of distortion, these all belong within the protection of the present invention.
Claims (4)
1. a low melting point metal caking agent is characterized in that, its component and weight percent content are:
10～20% Cu, 2～15% Ti, all the other are Sn;
Wherein, the particle diameter of Cu is 20～30 μ m, and the particle diameter of Ti is 20～30 μ m, and the particle diameter of Sn is 20～30 μ m; The fusing point of this metal binding agent is 250～350 ℃.
2. the diamond wire saw of a metal sticking is characterized in that: adopt the following step manufacturing:
Step 1, be that oil removing, processing of rust removing are carried out in the surface of the 65Mn steel wire of 0.05-2.5mm with diameter, standby;
Step 2, being the diamond particles of 23-75 μ m with particle diameter, is that the aqueous hydrochloric acid of 1:1 cleans with volume ratio earlier, use the diluted sodium hydroxide solution alkali cleaning again after, be washed to neutrality, dry at last;
Step 3, with following component according to weight percent preparing metal caking agent: 10～20% Cu, 2～15% Ti, all the other are Sn; Wherein, the particle diameter of Cu is 20～30 μ m, and the particle diameter of Ti is 20～30 μ m, and the particle diameter of Sn is 20～30 μ m, and the fusing point of this metal binding agent is 250～350 ℃;
Step 4, by weight in 1 part of above-mentioned metal binding agent, adding 0.5 part of diamond particles, in mixing the powder machine, carry out powder mixing machine to the powder that mixes;
Step 5, steel wire tension is placed the above-mentioned powder that mixes, steel wire is switched on, holding current is at 0.7～0.9A, be 1.5～2.5 minutes conduction time, powder and steel wire basal body interface dissolve, infiltration, diffusion, chemical combination interact, and the employing argon shield, be mixed with adamantine metal level thereby plated one deck fast in Steel Wire Surface;
Step 6, according to following composition and quality-volumetric concentration preparation watt type nickel plating solution: single nickel salt 230～280g/L, nickelous chloride 25～35g/L, boric acid 25～35g/L, 1,4-butynediol, 1～1.5g/L, sodium lauryl sulphate 0.10～0.15g/L;
Step 7, be coated with the steel wire that one deck is mixed with the diamond metal layer and in above-mentioned watt type nickel-plating liquid, carry out plating nickel on surface above-mentioned, make adamantinely to be 1/3 to 1/2 of its particle diameter by the buried depth degree.
3. the diamond wire saw of a kind of metal sticking according to claim 2 is characterized in that, in described step 5, and steel wire energising post-heating to 300～400 ℃, 1.5～2.5 minutes.
4. the diamond wire saw of a kind of metal sticking according to claim 2 is characterized in that, on the Steel Wire Surface total thickness of metal binding agent and nickel layer be the diamond particle diameter 1/3 and 1/2 between.
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| CN 201110403623 CN102492367B (en) | 2011-12-07 | 2011-12-07 | Low-melting-point metal adhesive and diamond wire saw obtained by metal adhesion |
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| CN 201110403623 CN102492367B (en) | 2011-12-07 | 2011-12-07 | Low-melting-point metal adhesive and diamond wire saw obtained by metal adhesion |
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| CN102492367B true CN102492367B (en) | 2013-08-14 |
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| CN103144209B (en) * | 2013-04-03 | 2016-01-13 | 盛利维尔（中国）新材料技术有限公司 | A kind of diamond fretsaw and production technology thereof |
| CN109203264B (en) * | 2018-09-18 | 2021-04-06 | 苏州宇邦新型材料股份有限公司 | Dip-soldering diamond wire and manufacturing method thereof |
| CN111604620A (en) * | 2020-06-08 | 2020-09-01 | 郑州机械研究所有限公司 | Binderless coated electrode and method and apparatus for making same |
| CN113999617A (en) * | 2021-11-20 | 2022-02-01 | 河南工业大学 | Method for preparing inorganic heat-conducting glue by using etched diamond micro powder as filler |
| CN117486350B (en) * | 2024-01-02 | 2024-03-19 | 山东众思创环境工程有限公司 | Treatment process of biological fermentation organic wastewater |
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| CN1146390A (en) * | 1995-09-27 | 1997-04-02 | 中国科学院金属研究所 | Tin-base active flux for soldering ceramic under coarse vacuum condition |
| CN101209505A (en) * | 2006-12-26 | 2008-07-02 | 浙江工业大学 | Method for preparing metal binding agent diamond scroll saw |
| CN101362238A (en) * | 2007-08-10 | 2009-02-11 | 北京康普锡威焊料有限公司 | Low temperature use method of high temperature solder |
| CN101417478A (en) * | 2008-11-21 | 2009-04-29 | 青岛高校测控技术有限公司 | Cutting wire production method and cutting wire and tyre cutting device |
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2011
- 2011-12-07 CN CN 201110403623 patent/CN102492367B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1146390A (en) * | 1995-09-27 | 1997-04-02 | 中国科学院金属研究所 | Tin-base active flux for soldering ceramic under coarse vacuum condition |
| CN101209505A (en) * | 2006-12-26 | 2008-07-02 | 浙江工业大学 | Method for preparing metal binding agent diamond scroll saw |
| CN101362238A (en) * | 2007-08-10 | 2009-02-11 | 北京康普锡威焊料有限公司 | Low temperature use method of high temperature solder |
| CN101417478A (en) * | 2008-11-21 | 2009-04-29 | 青岛高校测控技术有限公司 | Cutting wire production method and cutting wire and tyre cutting device |
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