CN111593374A - Electroplating solution for diamond cutting wire and preparation method thereof - Google Patents
Electroplating solution for diamond cutting wire and preparation method thereof Download PDFInfo
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- CN111593374A CN111593374A CN202010622933.XA CN202010622933A CN111593374A CN 111593374 A CN111593374 A CN 111593374A CN 202010622933 A CN202010622933 A CN 202010622933A CN 111593374 A CN111593374 A CN 111593374A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0607—Wires
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Abstract
The invention discloses an electroplating solution for a diamond cutting wire and a preparation method thereof, and particularly relates to the technical field of electroplating, wherein the electroplating solution comprises the following solutes in concentration: 500g/L of main salt 300-500g/L, 20-30g/L of conductive salt, 3-5ml/L of complexing agent, 8-12ml/L of stress relieving agent, 25-30ml/L of electroplating stabilizer, 8-15ml/L of plating refiner, 5-10ml/L of anode activator, 10-15g/L of diamond micro powder, 35-45ml/L of other auxiliary agents and buffer agent, wherein the solvent used by the solute is water. The invention eliminates or reduces anode polarization phenomenon in the electroplating process by using the anode activator to promote the normal dissolution of the anode, thereby improving the current density of the anode, and uses the soluble anode as electric conduction and controlling the distribution of current on the cathode surface, and can supplement discharge metal ions to the plating solution, in addition, the invention also uses the leveling agent to assist the wetting agent to solve the problems that the plating layer formed by electroplating is easy to have fine unevenness and pinholes.
Description
Technical Field
The invention relates to the technical field of electroplating, in particular to an electroplating solution for a diamond cutting line and a preparation method thereof.
Background
Solar photovoltaic power generation is one of the rapidly developing sustainable energy utilization forms at present, and has been rapidly developed in the united states, european union, japan, and china in recent years. At present, the most widely applied photovoltaic power generation is a crystalline silicon solar cell. Reducing the cost of solar power generation has been a development goal in the photovoltaic industry. The silicon ingot is cut and cut by using a diamond cutting line, and the cutting life of the diamond cutting line directly influences the cost of power generation.
The conventional nickel plating method is to fix diamond particles on the surface of a stainless steel strip to form a cutting line. However, in the prior art, the electroplating solution used during electroplating is prone to have an anodic polarization phenomenon in the electroplating process, so that the anodic current density is reduced, the concentration of the main salt in the electroplating process is large in floating, meanwhile, a plating layer formed by electroplating is prone to have fine unevenness and pinholes, the holding force of the plating layer on diamond is insufficient, and diamond particles are prone to falling off in the cutting use process, so that the cutting capability is lost.
The above information disclosed in this background section is only for enhancement of understanding of the background of the disclosure and therefore it may contain information that does not constitute prior art that is already known to a person of ordinary skill in the art.
Disclosure of Invention
In order to overcome the above-mentioned drawbacks of the prior art, embodiments of the present invention provide an electroplating solution for a diamond cutting wire and a method for preparing the same, in which an anodic polarization phenomenon is eliminated or reduced during electroplating by using an anodic activator, so as to promote normal dissolution of an anode, thereby increasing an anodic current density, and a soluble anode is used for conduction and controlling distribution of current on a cathode surface, and at the same time, discharge metal ions can be replenished into the electroplating solution, and in addition, a leveling agent is used to fill fine unevenness on a substrate surface with a plating layer, and a wetting agent is used to reduce interfacial tension between the solution and the cathode, so that hydrogen bubbles are easily separated from the cathode surface, thereby preventing pinholes from being generated in the plating layer during electroplating, and solving the problems suggested in the background art.
In order to achieve the purpose, the invention provides the following technical scheme: an electroplating solution for a diamond cutting wire comprising the following solutes in concentrations: 500g/L of main salt 300-500g/L, 20-30g/L of conductive salt, 3-5ml/L of complexing agent, 8-12ml/L of stress relieving agent, 25-30ml/L of electroplating stabilizer, 8-15ml/L of plating refiner, 5-10ml/L of anode activator, 10-15g/L of diamond micro powder, 35-45ml/L of other auxiliary agent and buffer agent, wherein the solvent used by the solute is water;
the main salt is nickel sulfamate;
the conductive salt is any one of NaCl or KCl;
the complexing agent is K4P2O7Or Na4P2O7Any one of the above;
the stress relief agent is coumarin;
the buffer is H3BO3Or Na2HPO4Any one of the above;
the coating refiner is dipentaerythritol;
the anode activator is tartrate;
the electroplating stabilizer is any one of sulfuric acid or an antioxidant.
In a preferred embodiment, the other auxiliary agents include brightener, leveler, wetting agent, antifogging agent and soluble anode, and the amount ratio of brightener, leveler, wetting agent, antifogging agent and soluble anode is 3:5:8:2: 6.
In a preferred embodiment, the brightening agent is saccharin or 1, 4-butynediol, the leveling agent is methyl violet or thiazolidinethione, the wetting agent is sodium dodecyl sulfate, and the fog inhibitor is gemini quaternary ammonium salt.
In a preferred embodiment, the soluble anode has the same valence of metal ions dissolved into solution as consumed at the cathode.
The invention also provides a preparation method of the electroplating solution for the diamond cutting wire, which comprises the following operation steps:
the method comprises the following steps: soaking an electroplating solution preparation tank in a sulfuric acid solution with the concentration of 0.5%, and cleaning the preparation tank; then adding a proper amount of solvent into the preparation tank, and heating the solvent to 55-65 ℃ for later use;
step two: sequentially dissolving main salt and conductive salt in a solvent in a preparation tank, adding a complexing agent, a stress relieving agent, a coating refiner, an anode activator, diamond micro powder and other auxiliaries into the preparation tank according to a formula ratio, and fully and uniformly mixing all components in the preparation tank by using a magnetic stirrer;
step three: and (5) slowly adding a buffering agent into the preparation tank in the step two, stirring to be in a uniform state while adding, and adjusting the pH value to 3.8-4.2.
The invention has the technical effects and advantages that:
1. the invention utilizes the anode activator to eliminate or reduce the anode polarization phenomenon in the electroplating process so as to promote the normal dissolution of the anode, thereby improving the current density of the anode, utilizes the soluble anode as the electric conduction and controls the distribution of the current on the surface of the cathode, and can supplement discharging metal ions into the plating solution at the same time, compared with the prior art, ensures the stability of the concentration of main salt in the electroplating process;
2. the invention uses leveling agent to fill the coating to the fine uneven parts of the surface of the substrate, and uses wetting agent to reduce the interfacial tension between the solution and the cathode, so that hydrogen bubbles are easy to separate from the surface of the cathode, thereby preventing the coating from generating pinholes in the electroplating process;
3. the invention reduces the internal stress of the plating layer by utilizing the stress relieving agent and improves the toughness of the plating layer.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying examples. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the examples set forth herein; rather, these example embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art.
Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more example embodiments. In the following description, numerous specific details are provided to give a thorough understanding of example embodiments of the disclosure. One skilled in the relevant art will recognize, however, that the subject matter of the present disclosure can be practiced without one or more of the specific details, or with other methods, components, steps, and so forth. In other instances, well-known structures, methods, implementations, or operations are not shown or described in detail to avoid obscuring aspects of the disclosure.
[ example one ]
The invention provides an electroplating solution for a diamond cutting wire, which comprises the following solutes in concentration: 300g/L of main salt, 20g/L of conductive salt, 3ml/L of complexing agent, 8ml/L of stress relieving agent, 25ml/L of electroplating stabilizer, 8ml/L of plating refiner, 5ml/L of anode activator, 10g/L of diamond micro powder, 35ml/L of other auxiliary agent and a proper amount of buffer, wherein the solvent used by the solute is water;
the main salt is nickel sulfamate;
the conductive salt is any one of NaCl or KCl, can greatly improve the conductivity of the solution, and does not have a complexing effect on discharged metal ions;
the complexing agent is K4P2O7Or Na4P2O7Any one of the two can improve the dispersion capacity and the covering capacity of the plating solution;
the stress relieving agent is coumarin, so that the internal stress of the coating can be reduced, and the toughness of the coating can be improved;
the buffer is H3BO3Or Na2HPO4Any one of the two is beneficial to improving the cathode polarization so as to improve the dispersion capability and the coating quality of the plating solution;
the coating refiner is dipentaerythritol, which is favorable for refining the crystallization of the coating and has luster;
the anode activator is tartrate, and can eliminate or reduce the anode polarization phenomenon in the electroplating process so as to promote the normal dissolution of the anode and improve the current density of the anode;
the electroplating stabilizer is any one of sulfuric acid or antioxidant, can prevent hydrolysis of main salt or oxidation of metal ions in the electroplating solution, and keeps the solution clear and stable.
Further, other auxiliary agents comprise a brightening agent, a leveling agent, a wetting agent, a fog inhibitor and a soluble anode, and the dosage ratio of the brightening agent to the leveling agent to the wetting agent to the fog inhibitor to the soluble anode is 3:5:8:2:6, wherein the brightening agent can brighten a plating layer; the leveling agent can enable the coating to fill and level up the fine uneven parts on the surface of the substrate; the wetting agent can reduce the interfacial tension between the solution and the cathode, so that hydrogen bubbles are easy to separate from the surface of the cathode, thereby preventing the plating layer from generating pinholes; the fog inhibitor (namely the foaming agent) can generate a layer of thicker stable foam on the liquid surface under the action of gas or mechanical stirring to inhibit acid mist or solution spray during precipitation; the soluble anode can be used to conduct electricity and control the distribution of current on the cathode surface, and can supplement the discharged metal ions in the plating solution.
Further, the brightening agent is saccharin or 1, 4-butynediol, the leveling agent is methyl violet or thiazolidinethione, the wetting agent is sodium dodecyl sulfate, and the fog inhibitor is gemini quaternary ammonium salt.
Further, the valence of the metal ions dissolved into the solution at the soluble anode is the same as that consumed at the cathode to maintain the main salt concentration stable during electroplating.
The invention also provides a preparation method of the electroplating solution for the diamond cutting wire, which comprises the following operation steps:
the method comprises the following steps: soaking an electroplating solution preparation tank in a sulfuric acid solution with the concentration of 0.5%, and cleaning the preparation tank; then adding a proper amount of solvent into the preparation tank, and heating the solvent to 55-65 ℃ for later use;
step two: sequentially dissolving main salt and conductive salt in a solvent in a preparation tank, adding a complexing agent, a stress relieving agent, a coating refiner, an anode activator, diamond micro powder and other auxiliaries into the preparation tank according to a formula ratio, and fully and uniformly mixing all components in the preparation tank by using a magnetic stirrer;
step three: and (5) slowly adding a buffering agent into the preparation tank in the step two, stirring to be in a uniform state while adding, and adjusting the pH value to 3.8-4.2.
[ example two ]
The invention provides an electroplating solution for a diamond cutting wire, which comprises the following solutes in concentration: 400g/L of main salt, 25g/L of conductive salt, 4ml/L of complexing agent, 10ml/L of stress relieving agent, 28ml/L of electroplating stabilizer, 12ml/L of plating refiner, 8ml/L of anode activator, 13g/L of diamond micro powder, 40ml/L of other auxiliary agent and a proper amount of buffer, wherein the solvent used by the solute is water;
the main salt is nickel sulfamate;
the conductive salt is any one of NaCl or KCl, can greatly improve the conductivity of the solution, and does not have a complexing effect on discharged metal ions;
the complexing agent is K4P2O7Or Na4P2O7Any one of the two can improve the dispersion capacity and the covering capacity of the plating solution;
the stress relieving agent is coumarin, so that the internal stress of the coating can be reduced, and the toughness of the coating can be improved;
the buffer is H3BO3Or Na2HPO4Any one of the two is beneficial to improving the cathode polarization so as to improve the dispersion capability and the coating quality of the plating solution;
the coating refiner is dipentaerythritol, which is favorable for refining the crystallization of the coating and has luster;
the anode activator is tartrate, and can eliminate or reduce the anode polarization phenomenon in the electroplating process so as to promote the normal dissolution of the anode and improve the current density of the anode;
the electroplating stabilizer is any one of sulfuric acid or antioxidant, can prevent hydrolysis of main salt or oxidation of metal ions in the electroplating solution, and keeps the solution clear and stable.
Further, other auxiliary agents comprise a brightening agent, a leveling agent, a wetting agent, a fog inhibitor and a soluble anode, and the dosage ratio of the brightening agent, the leveling agent, the wetting agent, the fog inhibitor and the soluble anode is 3:5:8:2:6, wherein the brightening agent can brighten a plating layer; the leveling agent can enable the coating to fill and level up the fine uneven parts on the surface of the substrate; the wetting agent can reduce the interfacial tension between the solution and the cathode, so that hydrogen bubbles are easy to separate from the surface of the cathode, thereby preventing the plating layer from generating pinholes; the fog inhibitor (namely the foaming agent) can generate a layer of thicker stable foam on the liquid surface under the action of gas or mechanical stirring to inhibit acid mist or solution spray during precipitation; the soluble anode can be used to conduct electricity and control the distribution of current on the cathode surface, and can supplement the discharged metal ions in the plating solution.
Further, the brightening agent is saccharin or 1, 4-butynediol, the leveling agent is methyl violet or thiazolidinethione, the wetting agent is sodium dodecyl sulfate, and the fog inhibitor is gemini quaternary ammonium salt.
Further, the valence of the metal ions dissolved into the solution at the soluble anode is the same as that consumed at the cathode to maintain the main salt concentration stable during electroplating.
The invention also provides a preparation method of the electroplating solution for the diamond cutting wire, which is characterized by comprising the following steps: the method specifically comprises the following operation steps:
the method comprises the following steps: soaking an electroplating solution preparation tank in a sulfuric acid solution with the concentration of 0.5%, and cleaning the preparation tank; then adding a proper amount of solvent into the preparation tank, and heating the solvent to 55-65 ℃ for later use;
step two: sequentially dissolving main salt and conductive salt in a solvent in a preparation tank, adding a complexing agent, a stress relieving agent, a coating refiner, an anode activator, diamond micro powder and other auxiliaries into the preparation tank according to a formula ratio, and fully and uniformly mixing all components in the preparation tank by using a magnetic stirrer;
step three: and (5) slowly adding a buffering agent into the preparation tank in the step two, stirring to be in a uniform state while adding, and adjusting the pH value to 3.8-4.2.
[ third example ]
The invention provides an electroplating solution for a diamond cutting wire, which comprises the following solutes in concentration: 500g/L of main salt, 30g/L of conductive salt, 5ml/L of complexing agent, 12ml/L of stress relieving agent, 30ml/L of electroplating stabilizer, 15ml/L of plating refiner, 10ml/L of anode activator, 15g/L of diamond micro powder, 45ml/L of other auxiliary agent and a proper amount of buffer, wherein the solvent used by the solute is water;
the main salt is nickel sulfamate;
the conductive salt is any one of NaCl or KCl, can greatly improve the conductivity of the solution, and does not have a complexing effect on discharged metal ions;
the complexing agent is K4P2O7Or Na4P2O7Any one of the two can improve the dispersion capacity and the covering capacity of the plating solution;
the stress relieving agent is coumarin, so that the internal stress of the coating can be reduced, and the toughness of the coating can be improved;
the buffer is H3BO3Or Na2HPO4Any one of the two is beneficial to improving the cathode polarization so as to improve the dispersion capability and the coating quality of the plating solution;
the coating refiner is dipentaerythritol, which is favorable for refining the crystallization of the coating and has luster;
the anode activator is tartrate, and can eliminate or reduce the anode polarization phenomenon in the electroplating process so as to promote the normal dissolution of the anode and improve the current density of the anode;
the electroplating stabilizer is any one of sulfuric acid or antioxidant, can prevent hydrolysis of main salt or oxidation of metal ions in the electroplating solution, and keeps the solution clear and stable.
Further, other auxiliary agents comprise a brightening agent, a leveling agent, a wetting agent, a fog inhibitor and a soluble anode, and the dosage ratio of the brightening agent to the leveling agent to the wetting agent to the fog inhibitor to the soluble anode is 3:5:8:2:6, wherein the brightening agent can brighten a plating layer; the leveling agent can enable the coating to fill and level up the fine uneven parts on the surface of the substrate; the wetting agent can reduce the interfacial tension between the solution and the cathode, so that hydrogen bubbles are easy to separate from the surface of the cathode, thereby preventing the plating layer from generating pinholes; the fog inhibitor (namely the foaming agent) can generate a layer of thicker stable foam on the liquid surface under the action of gas or mechanical stirring to inhibit acid mist or solution spray during precipitation; the soluble anode can be used to conduct electricity and control the distribution of current on the cathode surface, and can supplement the discharged metal ions in the plating solution.
Further, the brightening agent is saccharin or 1, 4-butynediol, the leveling agent is methyl violet or thiazolidinethione, the wetting agent is sodium dodecyl sulfate, and the fog inhibitor is gemini quaternary ammonium salt.
Further, the valence of the metal ions dissolved into the solution at the soluble anode is the same as that consumed at the cathode to maintain the main salt concentration stable during electroplating.
The invention also provides a preparation method of the electroplating solution for the diamond cutting wire, which is characterized by comprising the following steps: the method specifically comprises the following operation steps:
the method comprises the following steps: soaking an electroplating solution preparation tank in a sulfuric acid solution with the concentration of 0.5%, and cleaning the preparation tank; then adding a proper amount of solvent into the preparation tank, and heating the solvent to 55-65 ℃ for later use;
step two: sequentially dissolving main salt and conductive salt in a solvent in a preparation tank, adding a complexing agent, a stress relieving agent, a coating refiner, an anode activator, diamond micro powder and other auxiliaries into the preparation tank according to a formula ratio, and fully and uniformly mixing all components in the preparation tank by using a magnetic stirrer;
step three: and (5) slowly adding a buffering agent into the preparation tank in the step two, stirring to be in a uniform state while adding, and adjusting the pH value to 3.8-4.2.
The properties of the plating solutions prepared in the three examples were measured as follows:
note: the embedding capacity refers to the combination tightness of diamond and matrix metal
As can be seen from the comparison of the data in the table above, the electroplating solution prepared by the method of the invention has various performances obviously superior to the existing electroplating solutions in the market, and if and only if the solute comprises 400g/L of main salt, 25g/L of conductive salt, 4ml/L of complexing agent, 10ml/L of stress relieving agent, 28ml/L of electroplating stabilizer, 12ml/L of plating layer refiner, 8ml/L of anode activator, 13g/L of diamond micropowder, 40ml/L of other auxiliary agents and a proper amount of buffer, and the solute uses water as solvent, the method has the following advantages:
(1) the bonding tightness between the diamond and the matrix metal reaches the best;
(2) the deposition rate of the plating layer is high, and the electroplating efficiency is improved;
(3) the internal stress of the plating layer is minimum, so that the toughness of the plating layer is optimal;
(4) the plating solution is clear and stable, the surface of the plating layer is smooth, the electroplating speed is stable, and no spray is generated during stirring.
Finally, it should be noted that: although the present invention has been described in detail with reference to the general description and the specific embodiments, on the basis of the present invention, the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (5)
1. An electroplating solution for a diamond cutting wire, which is characterized in that: including the following concentrations of solutes: 500g/L of main salt 300-500g/L, 20-30g/L of conductive salt, 3-5ml/L of complexing agent, 8-12ml/L of stress relieving agent, 25-30ml/L of electroplating stabilizer, 8-15ml/L of plating refiner, 5-10ml/L of anode activator, 10-15g/L of diamond micro powder, 35-45ml/L of other auxiliary agent and buffer agent, wherein the solvent used by the solute is water;
the main salt is nickel sulfamate;
the conductive salt is any one of NaCl or KCl;
the complexing agent is K4P2O7Or Na4P2O7Any one of the above;
the stress relief agent is coumarin;
the buffer is H3BO3Or Na2HPO4Any one of the above;
the coating refiner is dipentaerythritol;
the anode activator is tartrate;
the electroplating stabilizer is any one of sulfuric acid or an antioxidant.
2. The plating solution for a diamond cutting wire according to claim 1, wherein: the other auxiliary agents comprise a brightening agent, a leveling agent, a wetting agent, a mist inhibitor and a soluble anode, and the dosage ratio of the brightening agent, the leveling agent, the wetting agent, the mist inhibitor and the soluble anode is 3:5:8:2: 6.
3. The plating solution for a diamond cutting wire according to claim 2, wherein: the brightening agent is saccharin or 1, 4-butynediol, the leveling agent is methyl violet or thiazolidinethione, the wetting agent is sodium dodecyl sulfate, and the fog inhibitor is gemini quaternary ammonium salt.
4. The plating solution for a diamond cutting wire according to claim 2, wherein: the valence number of the metal ions dissolved into the solution on the soluble anode is the same as that consumed on the cathode.
5. The method for preparing an electroplating solution for a diamond cutting wire according to any one of claims 1 to 4, comprising the steps of:
the method comprises the following steps: soaking an electroplating solution preparation tank in a sulfuric acid solution with the concentration of 0.5%, and cleaning the preparation tank; then adding a proper amount of solvent into the preparation tank, and heating the mixture to 55-65 ℃;
step two: sequentially dissolving main salt and conductive salt in a solvent in the preparation tank, adding a complexing agent, a stress relieving agent, a coating refiner, an anode activator, diamond micro powder and other auxiliaries into the preparation tank according to a formula ratio, and fully and uniformly mixing all components in the preparation tank by using a magnetic stirrer;
step three: and (5) slowly adding a buffering agent into the preparation tank in the step two, stirring to be in a uniform state while adding, and adjusting the pH value to 3.8-4.2.
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