CN109267130A - The electroplating system and electro-plating method of diamond cutting secant - Google Patents
The electroplating system and electro-plating method of diamond cutting secant Download PDFInfo
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- CN109267130A CN109267130A CN201811133879.1A CN201811133879A CN109267130A CN 109267130 A CN109267130 A CN 109267130A CN 201811133879 A CN201811133879 A CN 201811133879A CN 109267130 A CN109267130 A CN 109267130A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0607—Wires
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
- C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
Abstract
The electroplating system of diamond cutting secant of the present invention includes feeding device, material collecting device and the pre-electroplating treatment device being set in turn between the feeding device and the material collecting device, electronickelling device, composite electroplating device, plating thick nickel device and plating posttreatment device；The electroplating system further includes diadust processing unit, the electroplating system further includes diadust processing unit, by the diadust processing unit in diadust chemical plating nickel-phosphorus alloy on surface, and chemical Ni-plating layer is formed on ni-p alloy coating, through diadust processing unit treated diadust is placed in composite electroplating device progress electroplated diamond micro mist, diamond cutting secant is made.The invention further relates to electro-plating method, this electroplating system and electro-plating method process flow are simple, are advantageously implemented the production steady in a long-term of diamond cutting secant.
Description
Technical field
The invention belongs to electroplating technologies, and in particular to a kind of electroplating system and electro-plating method of diamond cutting secant.
Background technique
Diamond cutting secant refers to the cutting tool being bonded to diamond with bonding agent on steel wire matrix, is mainly used in
The cutting processing of the hard brittle materials such as silicon crystal, sapphire crystal.The general manufacturing process of electroplated diamond cutting line mainly includes
Following steps: preplating, upper sand and thickening, wherein preplating refers to one layer of gold of plating on the metal wire Jing Guo oil removing, derusting
Belong to.Upper sand refers to tentatively to be bonded on metal wire by electric plating method general and diamond particles.Thickening refers to sand laggard one
Step plating, to improve coating to the holding power of diamond particles.
Upper sand process is the critical process of electroplated diamond cutting line manufacturing process, and currently used upper sand method is to pass through
Stirring is suspended in diamond particles in electroplate liquid, the diamond of metal wire continuous operation and metal wire contact in electroplate liquid
Particle is adhered to metal line surface under the action of electro-deposition to complete upper sand process.During upper sand, metal wire connects sand
The cathode of power supply.In order to improve electroplated diamond cutting line production efficiency and electroplated layer to the holding powers of diamond particles,
The method that diamond particles generally use chemical nickel plating forms one layer of ni-p alloy coating, which adsorbs in electroplate liquid
Cation in electroplate liquid, to make diamond particle surfaces with positive charge, the diamond particles with positive charge are in metal
It is easy to be adsorbed onto metal line surface under the action of electric field force near line, upper sand process is completed under the action of electro-deposition.The production
Method is disadvantageous in that: (1) diamond particle surfaces chemical Ni-P alloy-layer is conductive, once during upper sand
It is bonded on metal wire, the ni-p alloy coating of diamond particle surfaces will become a part of cathode, participate in the electrification of cathode
Reaction is learned, exoelectrical reaction is generated.Since the diamond particles being bonded on metal wire are higher by the surface of metal wire, meeting when electric discharge
Forming point effect makes other diamond particles be easy to be adsorbed under the action of electric field force in upper sand to be bonded to metal wire
Diamond particles on, cause multiple diamond particles to accumulate, form so-called " reunion " phenomenon, and metal wire is elsewhere
Diamond particles it is rare, cause diamond particles to be unevenly distributed.(2) ni-p alloy coating surface corrosion resistance is not high enough, in electricity
Impregnating for a long time in plating solution will cause corrosion, influence diamond cutting secant quantity-produced stability and diamond cut line mass
Homogeneity；(3) wearability of ni-p alloy coating is inadequate, due to needing to be realized in electroplated diamond cutting line production process with pump
Electroplate liquid circulates, and the ni-p alloy coating of diamond particle surfaces is be easy to cause to wear, fall off in the cyclic process of electroplate liquid,
Electroplated diamond cutting line is set to can not achieve long-term continuous and stable production.
Summary of the invention
The purpose of the present invention is to provide a kind of electroplating systems of diamond cutting secant, and structure is simple, are conducive to improve
Electroplating efficiency reduces cost, and diadust is evenly distributed, so that the electroplating system through thus diamond cut line is electroplated
Diamond cutting secant can be realized production steady in a long-term.
Another object of the present invention is to provide a kind of electro-plating methods of diamond cutting secant, and process flow is simple, has
Conducive to electroplating efficiency is improved, cost is reduced, diadust is evenly distributed, so that the plating through thus diamond cut line
The diamond cutting secant of method plating can be realized production steady in a long-term.
The present invention is to solve its technical problem, is adopted the following technical scheme that
A kind of electroplating system of diamond cutting secant comprising feeding device, material collecting device and be set in turn in the confession
Expect pre-electroplating treatment device between device and the material collecting device, electronickelling device, composite electroplating device, plating thick nickel device with
And plating posttreatment device；The feeding device and the material collecting device for roll up set metal base and by metal base be sequentially transmitted by
The pre-electroplating treatment device, the electronickelling device, the composite electroplating device, the plating thick nickel device and the plating posttreatment device
To carry out pre-electroplating treatment, electronickelling, composite electroplating, plating thick nickel and plating post-processing；The electroplating system further includes Buddha's warrior attendant
Stone micropowder processing device, by the diadust processing unit in diadust chemical plating nickel-phosphorus alloy on surface, and in nickel
Chemical Ni-plating layer is formed on phosphorous alloy layer；Through diadust processing unit, treated that diadust is placed in the composite electroplating
Electroplated diamond micro mist is carried out in device, and diamond cutting secant is made.
Further, the processing unit of the diadust includes the degreasing unit set gradually, activation device, chemical plating
Nickel-phosphorus alloy device and chemical nickel plating device, after diadust oil removing, the activation, after Ni-P Chemical Plating Layer, in Buddha's warrior attendant
Stone micro mist chemical plating nickel-phosphorus alloy layer surface chemical nickel plating forms one layer of chemical Ni-plating layer outside ni-p alloy coating；
Further, nickel ion concentration in plating solution when diadust chemical nickel plating: 75~85g/L；Boric acid concentration: 35
~45g/L；Temperature: 45~55 °；Voltage: 1.5~5.5V；Electric current: 0.08A~0.14A/dm2。
Further, which includes paying out machine and buffering stand.
Further, which includes being successively set between the feeding device and the electronickelling device
Degreasing unit and activation device.
Further, which includes the baking being successively set between the electronickelling device and the material collecting device
Equipment for drying and detection device.
Further, diadust is placed in degreasing unit and impregnates removal surface and oil contaminant, impregnated in activation device
Activation, the chemical plating nickel-phosphorus alloy in chemical plating nickel-phosphorus alloy device, the chemical nickel plating in chemical nickel plating device, in nickel-phosphorus alloy
Layer surface forms electroless nickel layer.
Further, which includes electroplating bath, which provides electroplate liquid, by Buddha's warrior attendant after processing
Stone micro mist is placed in electroplate liquid and stirring is suspended in diadust in electroplate liquid.
A kind of electro-plating method of diamond cutting secant, includes the following steps:
1), diadust is handled: diadust being placed in degreasing unit and impregnates removing surface and oil contaminant, is filled in activation
Middle immersion activation is set, chemical plating nickel-phosphorus alloy is carried out in chemical plating nickel-phosphorus alloy device, is changed in chemical nickel plating device
Learn nickel plating；
Nickel ion concentration in chemical nickel-plating solution: 75~85g/L；Boric acid concentration: 35~45g/L；Temperature: 45~55 °；Electricity
Pressure: 1.5~5.5V；Electric current: 0.08A~0.14A/dm2；
2), by treated, diadust is placed in the electroplating bath of the composite electroplating device, and stirring keeps diamond micro-
Powder is suspended in electroplate liquid；
3) metal base, is provided by feeding device and sequentially passes through the pre-electroplating treatment device, the electronickelling device, the electricity
Sand device, the plating thick nickel device and the plating posttreatment device are plated, and diamond cut obtained is furled by material collecting device
Line.
Diamond cutting secant electroplating system and electro-plating method, metal base provided by the invention successively pass through pre-electroplating treatment
Before device, electronickelling device, composite electroplating device, plating thick nickel device and plating posttreatment device carry out the plating of metal base
Step, electronickelling step, composite electroplating step, plating thick nickel step and plating posttreatment step are managed, wherein walking in composite electroplating
In rapid, needing first to handle diadust, diadust is after oil removing, activation, Ni-P Chemical Plating Layer,
Then in nickel-phosphorus alloy layer surface one layer of metal nickel layer of chemical plating again, the diadust handled well is placed in electroplating bath and is stirred
Mixing is suspended in diadust in electroplate liquid, to carry out composite electroplating to metal base.The chemical plating on diadust surface
Nickel layer can protect diadust in electroplate liquid, avoid diadust from being immersed in electroplate liquid for a long time and corrode the conjunction of nickel phosphorus
Layer gold also helps to influence the homogeneity of diamond cutting secant quantity-produced stability and diamond cut line mass
It improves electroplating efficiency, reduce cost, diadust obtained is evenly distributed, so that the electricity through thus diamond cut line
The diamond cutting secant of electroplating method plating can be realized production steady in a long-term.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the electroplating system of the diamond cutting secant of one embodiment of the invention.
Fig. 2 is the structural schematic diagram of diadust processing unit in electroplating system shown in FIG. 1.
Fig. 3 is the flow diagram of the electro-plating method of the diamond cutting secant of one embodiment of the invention.
Specific embodiment
Further to illustrate the present invention to reach the technical means and efficacy that predetermined purpose is taken, below in conjunction with attached drawing
And preferred embodiment, to a specific embodiment of the invention, structure, feature and effect, detailed description are as follows.
Fig. 1 is the structural schematic diagram of the electroplating system 100 of the diamond cutting secant of one embodiment of the invention.Please refer to figure
1, the electroplating system 100 of the diamond cutting secant of the present embodiment includes feeding device 110, material collecting device 170 and sets gradually
Pre-electroplating treatment device 120, electronickelling device 130, composite electroplating between the feeding device 110 and the material collecting device 170
Device 140, plating thick nickel device 150 and plating posttreatment device 160.The feeding device 110 is used to furl metal base and will
Metal base is sequentially delivered to the pre-electroplating treatment device 120, the electronickelling device 130, the composite electroplating device 140, the electricity
Plate thick nickel device 150 and the plating posttreatment device 160, with carry out pre-electroplating treatment, electronickelling, composite electroplating, plating thick nickel,
And plating post-processing, finally the diamond cutting secant that plating is completed is furled via the material collecting device 170.
As shown in Fig. 2, the electroplating system 100 further includes diadust processing unit 180, the processing of the diadust
Device includes the degreasing unit 182 set gradually, activation device 184, chemical plating nickel-phosphorus alloy device 186 and chemical nickel plating device
188.The diadust is after oil removing, activation, after Ni-P Chemical Plating Layer, in diadust Ni-P Chemical Plating Layer
Chemical nickel plating on surface forms one layer of chemical Ni-plating layer outside ni-p alloy coating.Through diadust processing unit 180, treated
Diadust is placed in progress electroplated diamond micro mist in the composite electroplating device 140, and diamond cutting secant is made.
In the present embodiment, in diadust chemical plating nickel-phosphorus alloy on surface, make the conductive energy of diadust, and
The electric conductivity that diadust further can be then further increased in Ni-P Chemical Plating Layer chemical nickel plating on surface, can mention
The binding force of high diadust and metal base.It can be used as protective layer, diadust long-time in electroplate liquid
Immersion easily corrodes and influences electroplating effect, also can avoid in the cyclic process of electroplate liquid, and diadust phase mutual friction is touched
It hits and ni-p alloy coating abrasion is caused to fall off.
Fig. 2 is the flow diagram of the electro-plating method of the diamond cutting secant of one embodiment of the invention.It please join Fig. 2, this reality
Apply the diamond cutting secant of example electro-plating method be using above-mentioned diamond cutting secant electroplating system 100 carry out, but not with
This is limited, and the electroplating system 100 of the electro-plating method of other diamond cutting secants that the present embodiment may be implemented is also applicable.Below
Electroplating system 100 of the electro-plating method of bonded diamond cutting line to diamond cutting secant is described further.Further,
The feeding device 110 includes paying out machine 112 and buffering stand 114.
The electro-plating method of the diamond cutting secant of the present embodiment, is feeding step first, namely utilizes diamond cutting secant
Electroplating system 100 feeding device 110 for example paying out machine 112 provide metal base.The feeding device 110 includes paying out machine
112 and buffering stand 114, metal base carries out feed transmission such as at the uniform velocity cabling on paying out machine 112, utilizes buffering branch
The tension of metal base is adjusted in frame 114, avoids metal base draw tension from changing and occurs elongating or the phenomenon that fracture of wire, and
Rewinding is carried out by take-up such as take-up pulley winding, during which metal base successively passes through pre-electroplating treatment device 120, the plating
Nickel device 130, the composite electroplating device 140, the plating thick nickel device 150 and the plating posttreatment device 160.It wherein, is guarantor
Card metal base can remain a constant speed cabling in entire electroplating process, for example be fed dress in the appropriate location of electroplating system 100
Motor can be installed by setting 110, electronickelling device 130 and material collecting device 170 etc..
Specifically, pre-electroplating treatment device 120 is first passed around by the metal base that feeding device 110 provides be electroplated entirely
Processing step, to remove the greasy dirt etc. on metal base surface.In the present embodiment, pre-electroplating treatment device 120 includes degreasing unit
122 and activation device 124, pre-electroplating treatment step includes the oil removing and activation successively carried out, but is not limited thereto.This implementation
It is that electrolytic degreasing is carried out to metal base in degreasing unit 122 such as electrolytic degreasing slot in example, to remove metal base surface
Greasy dirt.Electrolytic degreasing parameter is, for example, concentration of sodium hydroxide solution: 25~35g/L；Temperature: 45~55 °；Electric current: 0.02A/
dm2；Voltage: 1~3V.The present embodiment is to carry out in the activation such as acid-wash activation slot of device 124 to the metal base after oil removing
Acid-wash activation further removes the greasy dirt on metal base surface using acid-base neutralization effect.Acid-wash activation parameter is, for example, amino
Sulfonic acid concentrations: 20~40g/L；Temperature: 45~55 °.Water-washing step can be carried out, after activation step to avoid subsequent plating is polluted
Liquid.
Metal base is transferred into the progress of electronickelling device 130 after the pre-electroplating treatment of pre-electroplating treatment device 120
Electronickelling step, to form electroless nickel layer on the surface of metal base.It in the present embodiment, is for example plated in electronickelling device 130
Metal base carries out electronickelling in nickel electroplating bath, to enhance the binding force of subsequent plating layer and metal base.Nickel plating parameter is, for example,
Nickel ion in electroplate liquid: 75~85g/L；Boric acid concentration: 35~45g/L；Temperature: 45~55 °；Voltage: 1.5~5.5V；Electric current:
0.08A~0.14A/dm2；In electronickelling step, metal base is electrically connected with power cathode, and anode plate is electrically connected with power anode
It connects.Preferably, water-washing step can be carried out, after electronickelling to avoid the pollution of plating solution.
Later, composite electroplating device 140 is transferred into carry out composite electroplating by the metal base of electronickelling device 130
Step, in the electroplating surface diamond micro mist of metal base.Diadust needs to locate in advance before plating in the present embodiment
Reason.Specifically, carrying out treatment before plating to diadust by diadust processing unit 180.The place of the diadust
Reason device 180 includes the degreasing unit 182 set gradually, activation device 184, chemical plating nickel-phosphorus alloy device 186 and chemical plating
Nickel device 188.The treatment before plating step of diadust includes oil removing and activation, but is not limited thereto.The present embodiment be by
Diadust impregnates 2h in electrolytic degreasing slot and carries out electrolytic degreasing, to remove the greasy dirt on diadust surface.Electrolysis removes
Oily parameter is, for example, naoh concentration: 25~35g/L；Temperature: 45~55 °；Electric current: 0.02A/dm2；Voltage: 1~3V.So
Acid-wash activation is carried out to the diadust after electrolytic degreasing in the activation such as acid-wash activation slot of device 184 afterwards, using soda acid
Neutralizing effect further removes the greasy dirt or solid impurity on diadust surface.Acid-wash activation parameter is, for example, hydrochloric acid: 20-
50g/L；Temperature: room temperature.Preferably, water-washing step can be carried out, after activation step to avoid subsequent plating solution is polluted.After activation
Diadust be put into chemical plating nickel-phosphorus alloy device 186 carry out chemical plating nickel-phosphorus alloy step, in diadust table
Face forms ni-p alloy coating.Chemistry is carried out in diadust investment chemical nickel plating device 188 after Ni-P Chemical Plating Layer
Nickel plating step, with nickel-phosphorus alloy layer surface formed one layer of chemical Ni-plating layer, for improve diadust corrosion resistance and
Wearability.Chemical nickel plating parameter such as nickel ion concentration: 75~85g/L；Boric acid concentration: 35~45g/L；Temperature: 45~55 °；
Voltage: 1.5~5.5V；Electric current: 0.08A~0.14A/dm2；
In the present embodiment, through treated diadust the is placed in composite electroplating dress of diadust processing unit 180
It sets in 140 and stirring is suspended in diadust in the electroplate liquid in the composite electroplating device 140, to carry out composite electroplating step
Suddenly.Composite electroplating parameter such as nickel ion concentration: 80~90g/L；Boric acid concentration: 35~45g/L；Temperature: 45~55 °；Voltage:
2.5~6.5V；Electric current: 1A~3A/dm2；Metal base is connected with power cathode, and anode plate is connected with power anode.
Then, the metal base after the composite electroplating of composite electroplating device 140 continues to be transferred into plating thick nickel dress
150 carry out thickness nickel steps are set, to form one layer of electroless nickel layer on the diadust on the surface of metal base.In the present embodiment
Metal base is transferred into progress electronickelling step, electronickelling parameter example in such as electronickelling electroplating bath of plating thick nickel device 150
Such as nickel ion concentration: 80~90g/L；Boric acid concentration: 35~45g/L；Temperature: 45~55 °；Voltage: 2.5~6.5V；Electric current: 1A
~3A/dm2；Metal base makes diamond cutting secant to avoid electroplate liquid residual by washing, ultrasonic wave hot wash after electronickelling
At corrosion.
Then, the metal base after the completion of being electroplated continues to be transferred into the progress plating posttreatment step of plating posttreatment device 160.
In the present embodiment, plating posttreatment device 160 includes the drying unit 162 set gradually and detection device 164, plating post-processing step
Rapid includes the drying and detection successively carried out.After metal base drying device 162 is dried, metal is detected by detection device 164
The distribution situation of electroplated diamond micro mist on baseline.The diamond cutting secant that last electroplated after-treatment device 160 is handled continues
It is transferred into material collecting device 170, rewinding is carried out by such as take-up pulley of material collecting device 170.
Diamond cutting secant electroplating system 100 and electro-plating method provided by the invention, before metal base successively passes through plating
Processing unit 120, electronickelling device 130, composite electroplating device 140, plating thick nickel device 150 and plating posttreatment device 160
Carry out treatment before plating step, electronickelling step, composite electroplating step, plating thick nickel step and the plating posttreatment step of metal base
Suddenly, it wherein in composite electroplating step, needs first to handle diadust, diadust is by oil removing, activation
Afterwards, Ni-P Chemical Plating Layer, then in nickel-phosphorus alloy layer surface one layer of metal nickel layer of chemical plating again, the diamond that will be handled well
Micro mist is placed in electroplating bath and stirring is suspended in diadust in electroplate liquid, to carry out composite electroplating to metal base.Gold
The chemical Ni-plating layer on hard rock micro mist surface can protect diadust in electroplate liquid, and diadust is avoided to impregnate for a long time
Corrode ni-p alloy coating in electroplate liquid, to influence diamond cutting secant quantity-produced stability and diamond cutting secant matter
The homogeneity of amount also advantageously improves electroplating efficiency, reduces cost, and diadust obtained is evenly distributed, so that through
Thus the diamond cutting secant of the electro-plating method plating of diamond cutting secant can be realized production steady in a long-term.
The above is only the preferable implementation of the electroplating system and electro-plating method of diamond cutting secant provided by the present invention
Example, is not intended to limit the present invention in any form, although the present invention has been disclosed as a preferred embodiment, simultaneously
It is non-to limit the present invention, any person skilled in the art, without departing from the scope of the present invention, when can benefit
A little change is made with the technology contents of the disclosure above or is modified to the equivalent embodiment of equivalent variations, but all without departing from this hair
Bright technical solution content, according to the technical essence of the invention it is to the above embodiments it is any it is simple modification, equivalent variations with
Modification, all of which are still within the scope of the technical scheme of the invention.
Claims (9)
1. a kind of electroplating system of diamond cutting secant, which is characterized in that including feeding device, material collecting device and set gradually
Pre-electroplating treatment device, electronickelling device, composite electroplating device, plating thick nickel between the feeding device and the material collecting device
Device and plating posttreatment device；The feeding device and the material collecting device set metal base and successively pass metal base for rolling up
After the pre-electroplating treatment device, the electronickelling device, the composite electroplating device, the plating thick nickel device and the plating are crossed in the warp let-off
Reason device is to carry out pre-electroplating treatment, electronickelling, composite electroplating, plating thick nickel and plating post-processing；
The electroplating system further includes diadust processing unit, by the diadust processing unit in diadust table
Face chemical plating nickel-phosphorus alloy, and chemical Ni-plating layer is formed on ni-p alloy coating, through diadust processing unit, treated
Diadust is placed in progress electroplated diamond micro mist in the composite electroplating device, and diamond cutting secant is made.
2. the electroplating system of diamond cutting secant as described in claim 1, which is characterized in that the processing of the diadust fills
Set including set gradually degreasing unit, activation device, chemical plating nickel-phosphorus alloy device and chemical nickel plating device, the diamond it is micro-
After powder oil removing, activation, after Ni-P Chemical Plating Layer, one layer of chemical Ni-plating layer is formed outside ni-p alloy coating.
3. the electroplating system of diamond cutting secant as described in claim 1, which is characterized in that when diadust chemical nickel plating
Plating solution in nickel ion concentration: 75~85g/L；Boric acid concentration: 35~45g/L；Temperature: 45~55 °；Voltage: 1.5~5.5V；
Electric current: 0.08A~0.14A/dm2。
4. the electroplating system of diamond cutting secant as described in claim 1, which is characterized in that the feeding device includes paying out machine
And buffering stand.
5. the electroplating system of diamond cutting secant as described in claim 1, which is characterized in that the pre-electroplating treatment device includes
The degreasing unit and activation device being successively set between the feeding device and the electronickelling device.
6. the electroplating system of diamond cutting secant as described in claim 1, which is characterized in that the plating posttreatment device include according to
The secondary drying unit being arranged between the electronickelling device and the material collecting device and detection device.
7. the electroplating system of diamond cutting secant as described in claim 1, which is characterized in that diadust is placed in oil removing
Removal surface and oil contaminant is impregnated in device, impregnates activation, the chemical nickel phosphorus plating in chemical plating nickel-phosphorus alloy device in activation device
Alloy, the chemical nickel plating in chemical nickel plating device form electroless nickel layer in nickel-phosphorus alloy layer surface.
8. the electroplating system of diamond cutting secant as claimed in claim 7, which is characterized in that the composite electroplating device includes electricity
Coating bath, the electroplating bath provide electroplate liquid, and diadust after processing, which is placed in electroplate liquid, and is stirred makes diadust
It is suspended in electroplate liquid.
9. a kind of electro-plating method of diamond cutting secant is provided just like electroplating system described in claim any one of 1-7,
It is characterized in that, includes the following steps:
1), diadust is handled: diadust being placed in degreasing unit and impregnates removing surface and oil contaminant, in activation device
Activation is impregnated, chemical plating nickel-phosphorus alloy is carried out in chemical plating nickel-phosphorus alloy device, chemical plating is carried out in chemical nickel plating device
Nickel；
Nickel ion concentration in chemical nickel-plating solution: 75~85g/L；Boric acid concentration: 35~45g/L；Temperature: 45~55 °；Voltage:
1.5~5.5V；Electric current: 0.08A~0.14A/dm2；
2), by treated, diadust is placed in the electroplating bath of the composite electroplating device, and stirring keeps diadust outstanding
Float in electroplate liquid；
3) metal base, is provided by feeding device and sequentially passes through the pre-electroplating treatment device, the electronickelling device, in the plating
Sand device, the plating thick nickel device and the plating posttreatment device, and diamond cutting secant obtained is furled by material collecting device.
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| CN2018109634246 | 2018-08-23 | ||
| CN201810963424 | 2018-08-23 |
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| CN112010300A (en) * | 2019-05-31 | 2020-12-01 | 洛阳阿特斯光伏科技有限公司 | Method for treating waste material containing abrasive particles |
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