CN112813473A - Gold plating process for improving gold plating function by solving diffusion of selective gold plating area - Google Patents
Gold plating process for improving gold plating function by solving diffusion of selective gold plating area Download PDFInfo
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- CN112813473A CN112813473A CN202011642728.6A CN202011642728A CN112813473A CN 112813473 A CN112813473 A CN 112813473A CN 202011642728 A CN202011642728 A CN 202011642728A CN 112813473 A CN112813473 A CN 112813473A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/06—Filtering particles other than ions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
Abstract
The invention discloses a gold plating process for improving a gold plating function by solving diffusion of a selective gold plating area, which belongs to the technical field of surface treatment solution, and S1 is used for preparing a gold plating solution; s2, preparing an auxiliary solution; s3, preparing a gold-plated product; s4, nickel plating; s5, coating a gold plating solution; and S6, performing salt spray functionality test. According to the invention, the boundary of a gold-plating area is clear, no outer invalid area diffuses to improve the functional test of a gold-plating layer and reduce the cost of gold-plating usage, and the developed special inhibitor additive is added into gold-plating liquid medicine to ensure that the effective area after gold-plating is clear, so that the salt spray functional test is carried out to reduce the corrosion of a primary battery generated in the salt spray test due to the diffusion of the gold-plating area, improve the salt spray test capability and improve the product quality, and on the other hand, the consumption of noble metal gold is greatly reduced due to the gold-plating diffusion with the invalid area solved by the inhibitor addition, and the cost is greatly reduced.
Description
Technical Field
The invention belongs to the technical field of surface treatment solutions, and particularly relates to a gold plating process for improving a gold plating function by solving the problem of selective gold plating area diffusion.
Background
In order to protect and decorate the surface of a metal product, the surface of the metal product is generally plated with gold through a surface treatment chemical solution, in a gold plating process, the surface treatment is the proportioning treatment of the gold plating chemical solution, namely the process of plating a thin layer of other metals or alloys on the surface of some metals by utilizing the electrolysis principle, and the process of attaching a layer of metal film on the surface of a metal or other material workpiece by utilizing the electrolysis action is used for preventing the metal from being oxidized.
In the prior art, due to the lack of inhibitors in the gold plating solution, after the surface treatment solution is used for local gold plating in a gold plating area, due to the flowability and ductility of the solution, gold plating is prone to generate an overflow area on the surface of a product, which affects the division and display of the surface area of the gold-plated product, and further affects the attractiveness and wear resistance of the product in the gold plating process, and the product in the gold plating process lacks wear resistance, which affects the subsequent wear resistance of the product and cannot meet the use requirement.
Disclosure of Invention
The invention aims to: the gold plating process aims to solve the problems that after a gold plating solution is mostly lack of an inhibitor in a gold plating solution, the surface treatment solution is subjected to local gold plating in a gold plating area, gold plating is easy to generate an overflow area on the surface of a product due to the flowability and the ductility of the solution, the division and the display of the surface area of the gold-plated product are influenced, the attractiveness and the wear resistance of the product in the gold plating process are influenced, the product in the gold plating process is lack of wear resistance, and the subsequent wear resistance of the product is influenced, so that the gold plating process for improving the gold plating function by selective gold plating area diffusion is provided.
In order to achieve the purpose, the invention adopts the following technical scheme:
a gold plating process for solving diffusion of a selective gold plating area and improving a gold plating function specifically comprises the following steps: s1, preparing a gold plating solution, putting a gold plating solution raw material into a mixing kettle, heating, fully stirring and defoaming, fully mixing, fully filtering through continuous filtering equipment, and standing the filtered solution for later use;
s2, preparing an auxiliary solution, namely preparing a gold plating inhibitor, putting a gold plating inhibitor raw material into a stirring kettle for fully stirring, putting the gold plating solution after standing into the stirring kettle for fully mixing the gold plating inhibitor and the gold plating solution after stirring is finished, and detecting the mixed solution through a ph meter;
s3, preparing a gold-plated product, namely, finely grinding the product with gold plating by a polishing machine, removing most air holes and casting groove marks on the surface after polishing, fully mixing a gold-plating solution and a gold-plating inhibitor, carrying out lead line scribing partition on a gold-plating control area, solidifying the gold-plated product in a coating groove, fixing the gold-plated product by a clamp tool, and waiting for gold plating;
s4, nickel plating, namely coating nickel plating solution on the surface of the product according to the scribing areas, putting the product coated with the nickel plating solution into electrolyte and introducing direct current, and depositing a uniform and compact nickel plating layer on the surface of a cathode product, wherein the nickel plating layer can seal bubbles on the surface of the product and ensure smoothness;
s5, coating a gold-plating solution, selectively coating the gold-plating solution in the divided gold-plating effective areas to make the boundary line of the gold-plating area clear, then putting the coating groove and the coating groove into a gold-plating solution groove and electrifying, and depositing gold ions out of a gold-plating mold layer through the displacement of the gold-plating solution, thus completing the coating;
s6, performing salt spray functional test, putting the product into a salt spray detector, waiting for detection time, observing the galvanic cell corrosion phenomenon generated by the diffusion condition of the gold layer area on the surface, and effectively reducing the galvanic cell corrosion generated in the salt spray test due to the diffusion of the gold layer area by the inhibitor.
As a further description of the above technical solution:
the gold plating solution is a gold-cobalt alloy plating solution, and the gold-cobalt alloy plating solution comprises gold potassium cyanide, cobalt ions, a chelating agent, hexamethylenetetramine and a hardening agent.
As a further description of the above technical solution:
the gold plating inhibitor in S2 is ethylene oxide-propylene oxide random copolymer.
As a further description of the above technical solution:
the hardener is dimethyl imidazole.
As a further description of the above technical solution:
the nickel plating solution adopts nickel sulfamate matte nickel polish, so that the deposited nickel plating layer can be ensured to be a matte nickel layer.
As a further description of the above technical solution:
the scribe partition line beam of S3 may be at least one of an arc, a straight line, and a wave.
As a further description of the above technical solution:
and the temperature of the mixing kettle in the S1 is 50-100 ℃.
As a further description of the above technical solution:
the inner cavity of the coating groove is provided with polyvinyl fluoride or rubber.
As a further description of the above technical solution:
and in the step S2, when the ph value of the mixed solution does not meet the preparation requirement, adding a solvent to adjust the ph value.
As a further description of the above technical solution:
the pH value of the solution is 8.5-9.0, and the pH value adjusting solvent is 20% potassium hydroxide or 20% pyrophosphoric acid.
In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:
1. according to the invention, the chelating ability of the special inhibitor liquid medicine is improved, so that a gold-plating effective area selectively plated with gold in a production process is solved, the boundary of a gold-plating area is clear, diffusion of an outer ineffective area is avoided, the functionality test of a gold-plating layer is improved, the gold-plating use amount cost is reduced, the regular boundary of the effective area after gold-plating is clear by adding the developed special inhibitor additive into the gold-plating liquid medicine, the salt spray functionality test is carried out, the corrosion of a primary battery generated in the salt spray test is reduced due to the diffusion of the gold area, the salt spray test capability is improved, and the product quality is improved. On the other hand, the addition of the inhibitor can greatly reduce the consumption of noble metal gold and the cost because the gold layer diffusion of an invalid area is solved.
2. In the invention, through the developed chemical laboratory sample test experiment, the boundary line of the product after the local gold plating of the chemical solution sample added with the inhibitor and without the inhibitor is obviously reduced to a great extent compared with the chemical solution gold plating area without the inhibitor and the area and the interface is clear, and from the experimental test result, compared with the appearance gold overflowing area after the local gold plating of the sample added with the inhibitor and without the inhibitor, the gold plating area is smaller in the front and back side areas of the sample added with the inhibitor and the interface is relatively clear, while the sample without the inhibitor is more fuzzy and larger regardless of the area and the interface, so the gold plating inhibitor is very effectively developed.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
The invention provides a technical scheme that: a gold plating process for solving diffusion of a selective gold plating area and improving a gold plating function specifically comprises the following steps: s1, preparing a gold plating solution, putting a gold plating solution raw material into a mixing kettle, heating, fully stirring and defoaming, fully mixing, fully filtering through continuous filtering equipment, and standing the filtered solution for later use;
s2, preparing an auxiliary solution, namely preparing a gold plating inhibitor, putting a gold plating inhibitor raw material into a stirring kettle for fully stirring, putting the gold plating solution after standing into the stirring kettle for fully mixing the gold plating inhibitor and the gold plating solution after stirring is finished, and detecting the mixed solution through a ph meter;
s3, preparing a gold-plated product, namely, finely grinding the product with gold plating by a polishing machine, removing most air holes and casting groove marks on the surface after polishing, fully mixing a gold-plating solution and a gold-plating inhibitor, carrying out lead line scribing partition on a gold-plating control area, solidifying the gold-plated product in a coating groove, fixing the gold-plated product by a clamp tool, and waiting for gold plating;
s4, nickel plating, namely coating nickel plating solution on the surface of the product according to the scribing areas, putting the product coated with the nickel plating solution into electrolyte and introducing direct current, and depositing a uniform and compact nickel plating layer on the surface of a cathode product, wherein the nickel plating layer can seal bubbles on the surface of the product and ensure smoothness;
s5, coating a gold-plating solution, selectively coating the gold-plating solution in the divided gold-plating effective areas to make the boundary line of the gold-plating area clear, then putting the coating groove and the coating groove into a gold-plating solution groove and electrifying, and depositing gold ions out of a gold-plating mold layer through the displacement of the gold-plating solution, thus completing the coating;
s6, performing salt spray functional test, putting the product into a salt spray detector, waiting for detection time, observing the galvanic cell corrosion phenomenon generated by the diffusion condition of the gold layer area on the surface, and effectively reducing the galvanic cell corrosion generated in the salt spray test due to the diffusion of the gold layer area by the inhibitor.
The gold plating solution is gold-cobalt alloy plating solution, the gold-cobalt alloy plating solution comprises gold potassium cyanide, cobalt ions, a chelating agent, hexamethylenetetramine and a hardening agent, the gold plating inhibitor in S2 is ethylene oxide-propylene oxide random copolymer, the hardening agent is dimethyl imidazole, the nickel plating solution is nickel sulfamate matte nickel polish, the deposited nickel plating layer can be guaranteed to be matte nickel, the scribing subarea wiring harness in S3 can be at least one of arc, straight and wave shapes, the temperature of the mixing kettle in S1 is 50 ℃, rubber is arranged in the inner cavity of the coating tank, when the pH value of the mixed solution in S2 does not meet the preparation requirement, the pH value is adjusted by adding a solvent, the pH value of the solution is 8.5-9.0, and the pH value adjusting solvent is 20% potassium hydroxide or 20% pyrophosphoric acid.
The implementation mode is specifically as follows: in the embodiment, the whole strength of a gold-plating precipitation layer can be effectively improved through a hardening agent, a nickel sulfamate matte nickel polish agent of a nickel plating solution can protect a matte nickel layer after coating, a gold-plating inhibitor can delay the extension efficiency of the gold-plating solution, a special inhibitor liquid medicine improves the chelating capacity of a gold-plating liquid medicine, solves the problem of a gold-plating effective area selectively plated with gold in the production process, ensures that the boundary of a gold-plating area is clear, improves the functional test of the gold-plating layer and reduces the cost of gold-plating usage amount without external ineffective area diffusion, ensures that the effective area is clear after gold-plating by adding a developed special inhibitor additive into the gold-plating liquid medicine, reduces the corrosion of an original battery generated in a salt spray test due to the reduction of the diffusion of the gold area in the salt spray functional test, improves the salt spray test capacity, improves the product quality, and greatly reduces the usage amount of noble metal gold due to the, the cost is greatly reduced.
Example two
Different from the first embodiment, the present embodiment further provides a gold plating process for improving a gold plating function by solving diffusion of a selective gold plating region, which specifically includes the following steps: s1, preparing a gold plating solution, putting a gold plating solution raw material into a mixing kettle, heating, fully stirring and defoaming, fully mixing, fully filtering through continuous filtering equipment, and standing the filtered solution for later use;
s2, preparing an auxiliary solution, namely preparing a gold plating inhibitor, putting a gold plating inhibitor raw material into a stirring kettle for fully stirring, putting the gold plating solution after standing into the stirring kettle for fully mixing the gold plating inhibitor and the gold plating solution after stirring is finished, and detecting the mixed solution through a ph meter;
s3, preparing a gold-plated product, namely, finely grinding the product with gold plating by a polishing machine, removing most air holes and casting groove marks on the surface after polishing, fully mixing a gold-plating solution and a gold-plating inhibitor, carrying out lead line scribing partition on a gold-plating control area, solidifying the gold-plated product in a coating groove, fixing the gold-plated product by a clamp tool, and waiting for gold plating;
s4, nickel plating, namely coating nickel plating solution on the surface of the product according to the scribing areas, putting the product coated with the nickel plating solution into electrolyte and introducing direct current, and depositing a uniform and compact nickel plating layer on the surface of a cathode product, wherein the nickel plating layer can seal bubbles on the surface of the product and ensure smoothness;
s5, coating a gold-plating solution, selectively coating the gold-plating solution in the divided gold-plating effective areas to make the boundary line of the gold-plating area clear, then putting the coating groove and the coating groove into a gold-plating solution groove and electrifying, and depositing gold ions out of a gold-plating mold layer through the displacement of the gold-plating solution, thus completing the coating;
s6, performing salt spray functional test, putting the product into a salt spray detector, waiting for detection time, observing the galvanic cell corrosion phenomenon generated by the diffusion condition of the gold layer area on the surface, and effectively reducing the galvanic cell corrosion generated in the salt spray test due to the diffusion of the gold layer area by the inhibitor.
The gold plating solution is a gold-cobalt alloy plating solution, the gold-cobalt alloy plating solution comprises gold potassium cyanide, cobalt ions, a chelating agent, hexamethylenetetramine and a hardening agent, the gold plating inhibitor in S2 is an ethylene oxide-propylene oxide random copolymer, the hardening agent is dimethyl imidazole, the nickel plating solution is a nickel sulfamate matte nickel polishing agent, the deposited nickel plating layer can be guaranteed to be a matte nickel layer, the scribing subarea wiring harness in S3 can be at least one of arc, straight and wave shapes, the temperature of the mixing kettle in S1 is 100 ℃, the inner cavity of the coating tank is provided with polyfluoroethylene, when the mixed solution ph value in S2 does not meet the preparation requirement, the ph value is adjusted by adding a solvent, the solution ph value is 8.5-9.0, and the ph value adjusting solvent is 20% potassium hydroxide or 20% pyrophosphoric acid.
The implementation mode is specifically as follows: in the embodiment, through a developed chemical laboratory sample test experiment, the boundary line of a product after the local gold plating of a chemical solution sample added with an inhibitor and without the inhibitor is obviously reduced to a great extent compared with a chemical solution gold plating area without the inhibitor and the area and has a clear interface, and from the experimental test result, compared with the appearance gold overflow area after the local gold plating of the sample added with the inhibitor and without the inhibitor, the gold plating area is smaller in the front and back side areas of the sample added with the inhibitor and the interface is relatively clear, and the sample without the inhibitor is more fuzzy and larger regardless of the area and the interface, so the gold plating inhibitor is very effectively developed.
EXAMPLE III
Different from the first embodiment, the present embodiment further provides a gold plating process for improving a gold plating function by solving diffusion of a selective gold plating region, which specifically includes the following steps: s1, preparing a gold plating solution, putting a gold plating solution raw material into a mixing kettle, heating, fully stirring and defoaming, fully mixing, fully filtering through continuous filtering equipment, and standing the filtered solution for later use;
s2, preparing an auxiliary solution, namely preparing a gold plating inhibitor, putting a gold plating inhibitor raw material into a stirring kettle for fully stirring, putting the gold plating solution after standing into the stirring kettle for fully mixing the gold plating inhibitor and the gold plating solution after stirring is finished, and detecting the mixed solution through a ph meter;
s3, preparing a gold-plated product, namely, finely grinding the product with gold plating by a polishing machine, removing most air holes and casting groove marks on the surface after polishing, fully mixing a gold-plating solution and a gold-plating inhibitor, carrying out lead line scribing partition on a gold-plating control area, solidifying the gold-plated product in a coating groove, fixing the gold-plated product by a clamp tool, and waiting for gold plating;
s4, nickel plating, namely coating nickel plating solution on the surface of the product according to the scribing areas, putting the product coated with the nickel plating solution into electrolyte and introducing direct current, and depositing a uniform and compact nickel plating layer on the surface of a cathode product, wherein the nickel plating layer can seal bubbles on the surface of the product and ensure smoothness;
s5, coating a gold-plating solution, selectively coating the gold-plating solution in the divided gold-plating effective areas to make the boundary line of the gold-plating area clear, then putting the coating groove and the coating groove into a gold-plating solution groove and electrifying, and depositing gold ions out of a gold-plating mold layer through the displacement of the gold-plating solution, thus completing the coating;
s6, performing salt spray functional test, putting the product into a salt spray detector, waiting for detection time, observing the galvanic cell corrosion phenomenon generated by the diffusion condition of the gold layer area on the surface, and effectively reducing the galvanic cell corrosion generated in the salt spray test due to the diffusion of the gold layer area by the inhibitor.
The gold plating solution is gold-cobalt alloy plating solution, the gold-cobalt alloy plating solution comprises gold potassium cyanide, cobalt ions, a chelating agent, hexamethylenetetramine and a hardening agent, the gold plating inhibitor in S2 is ethylene oxide-propylene oxide random copolymer, the hardening agent is dimethyl imidazole, the nickel plating solution adopts nickel sulfamate matte nickel polish, the deposited nickel plating layer can be guaranteed to be a matte nickel layer, the scribing subarea wiring harness in S3 can be arc-shaped, the temperature of a mixing kettle in S1 is 75 ℃, polyvinyl fluoride is arranged in an inner cavity of a coating tank, the pH value of the mixed solution in S2 is adjusted by adding a solvent when the pH value does not meet the preparation requirement, the pH value of the solution is 8.5-9.0, and the pH value adjusting solvent is 20% potassium hydroxide or 20% pyrophosphoric acid.
The implementation mode is specifically as follows: in this embodiment, the temperature regulation of mixing kettle is to 75 degrees centigrade, and the subregion pencil is the arc linear, guarantees subregion stability.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (10)
1. A gold plating process for solving diffusion of a selective gold plating area and improving a gold plating function is characterized by comprising the following steps: s1, preparing a gold plating solution, putting a gold plating solution raw material into a mixing kettle, heating, fully stirring and defoaming, fully mixing, fully filtering through continuous filtering equipment, and standing the filtered solution for later use;
s2, preparing an auxiliary solution, namely preparing a gold plating inhibitor, putting a gold plating inhibitor raw material into a stirring kettle for fully stirring, putting the gold plating solution after standing into the stirring kettle for fully mixing the gold plating inhibitor and the gold plating solution after stirring is finished, and detecting the mixed solution through a ph meter;
s3, preparing a gold-plated product, namely, finely grinding the product with gold plating by a polishing machine, removing most air holes and casting groove marks on the surface after polishing, fully mixing a gold-plating solution and a gold-plating inhibitor, carrying out lead line scribing partition on a gold-plating control area, solidifying the gold-plated product in a coating groove, fixing the gold-plated product by a clamp tool, and waiting for gold plating;
s4, nickel plating, namely coating nickel plating solution on the surface of the product according to the scribing areas, putting the product coated with the nickel plating solution into electrolyte and introducing direct current, and depositing a uniform and compact nickel plating layer on the surface of a cathode product, wherein the nickel plating layer can seal bubbles on the surface of the product and ensure smoothness;
s5, coating a gold-plating solution, selectively coating the gold-plating solution in the divided gold-plating effective areas to make the boundary line of the gold-plating area clear, then putting the coating groove and the coating groove into a gold-plating solution groove and electrifying, and depositing gold ions out of a gold-plating mold layer through the displacement of the gold-plating solution, thus completing the coating;
s6, performing salt spray functional test, putting the product into a salt spray detector, waiting for detection time, observing the galvanic cell corrosion phenomenon generated by the diffusion condition of the gold layer area on the surface, and effectively reducing the galvanic cell corrosion generated in the salt spray test due to the diffusion of the gold layer area by the inhibitor.
2. The gold plating process for improving gold plating function by solving the problem of diffusion of the selective gold plating area according to claim 1, wherein the gold plating solution is a gold-cobalt alloy plating solution, and the gold-cobalt alloy plating solution comprises gold potassium cyanide, cobalt ions, a chelating agent, hexamethylenetetramine and a hardening agent.
3. The gold plating process for improving gold plating function by solving diffusion of the selective gold plating area as claimed in claim 1, wherein the gold plating inhibitor in S2 is ethylene oxide-propylene oxide random copolymer.
4. The gold plating process for improving gold plating function by solving diffusion of selective gold plating area as claimed in claim 1, wherein said hardening agent is dimethyl imidazole.
5. The gold plating process for improving the gold plating function by solving the problem of diffusion of the selective gold plating area according to claim 1, wherein the nickel plating solution is a nickel sulfamate matte nickel polish which can ensure that the deposited nickel plating layer is a matte nickel layer.
6. The process of claim 1, wherein the scribe line partition line beam of S3 is at least one of a curved line, a straight line and a wave.
7. The gold plating process for improving gold plating function by solving diffusion of the selective gold plating area as claimed in claim 1, wherein the temperature of the mixing tank in S1 is 50-100 ℃.
8. The gold plating process for improving gold plating function by solving diffusion of the selective gold plating area as claimed in claim 1, wherein the inner cavity of the coating tank is provided with polyvinyl fluoride or rubber.
9. The gold plating process for improving gold plating function by solving diffusion of the selective gold plating area as claimed in claim 1, wherein in S2, when the ph value of the mixed solution does not satisfy the preparation requirement, the ph value is adjusted by adding a solvent.
10. The process of claim 9, wherein the ph of the solution is 8.5-9.0, and the ph adjusting solvent is 20% potassium hydroxide or 20% pyrophosphoric acid.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113733380A (en) * | 2021-08-30 | 2021-12-03 | 深圳市长龙点金科技有限公司 | Colloidal particle structure for enhancing noble metal covering efficiency |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103233250A (en) * | 2013-04-28 | 2013-08-07 | 胜宏科技（惠州）股份有限公司 | Method for electroplating goldfinger with thick gold layer |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103233250A (en) * | 2013-04-28 | 2013-08-07 | 胜宏科技（惠州）股份有限公司 | Method for electroplating goldfinger with thick gold layer |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113733380A (en) * | 2021-08-30 | 2021-12-03 | 深圳市长龙点金科技有限公司 | Colloidal particle structure for enhancing noble metal covering efficiency |
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