WO2012023764A3 - Led 모듈 제조방법 - Google Patents

Led 모듈 제조방법 Download PDF

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Publication number
WO2012023764A3
WO2012023764A3 PCT/KR2011/005944 KR2011005944W WO2012023764A3 WO 2012023764 A3 WO2012023764 A3 WO 2012023764A3 KR 2011005944 W KR2011005944 W KR 2011005944W WO 2012023764 A3 WO2012023764 A3 WO 2012023764A3
Authority
WO
WIPO (PCT)
Prior art keywords
package
phosphor
led module
manufacturing
led
Prior art date
Application number
PCT/KR2011/005944
Other languages
English (en)
French (fr)
Other versions
WO2012023764A2 (ko
Inventor
박용규
Original Assignee
(주)아이셀론
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)아이셀론 filed Critical (주)아이셀론
Publication of WO2012023764A2 publication Critical patent/WO2012023764A2/ko
Publication of WO2012023764A3 publication Critical patent/WO2012023764A3/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

본 발명은 LED 모듈 제조방법에 관한 것으로, 본 발명에 따른 LED모듈 제조방법은, 하우징 내부에 LED칩이 실장되고, 상기 LED 칩이 실장된 하우징 내부에 제1형광체가 도포되며, 청색 또는 백색계열의 색좌표를 가지고, 10000~16000°K(캘빈온도)의 색온도를 가지는 제1패키지를 준비하는 단계와; 상기 제1패키지의 상기 제1형광체 상부면의 수분, 산화막 및 이물질 제거를 위해 플라즈마 클리닝(cleaning) 공정을 수행하는 단계와; 상기 플라즈마 클리닝 공정이 수행된 상기 제1패키지의 상기 제1형광체의 상부면에 제2형광체를 도포하여, 상기 제1패키지의 색온도 및 색좌표를 변화시킨 제2패키지를 형성하는 단계를 구비한다. 본 발명에 따르면, 형광체를 이용한 색온도 및 색좌표 변경을 통해 LED 패키지의 재활용이 가능하며, 조명용 또는 광고용 LED 모듈의 제조비용을 절감할 수 있다.
PCT/KR2011/005944 2010-08-16 2011-08-12 Led 모듈 제조방법 WO2012023764A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20100078799A KR101164926B1 (ko) 2010-08-16 2010-08-16 Ｌｅｄ 모듈 제조방법
KR10-2010-0078799 2010-08-16

Publications (2)

Publication Number Publication Date
WO2012023764A2 WO2012023764A2 (ko) 2012-02-23
WO2012023764A3 true WO2012023764A3 (ko) 2012-05-31

Family

ID=45605534

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/005944 WO2012023764A2 (ko) 2010-08-16 2011-08-12 Led 모듈 제조방법

Country Status (2)

Country Link
KR (1) KR101164926B1 (ko)
WO (1) WO2012023764A2 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013104776A1 (de) * 2013-05-08 2014-11-13 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines Wellenlängenkonversionselements, Wellenlängenkonversionselement und Bauelement aufweisend das Wellenlängenkonversionselement
KR101607400B1 (ko) 2014-10-29 2016-03-29 엘지전자 주식회사 발광 장치
CN107256912A (zh) * 2017-06-06 2017-10-17 江苏鸿利国泽光电科技有限公司 提高led光效的分层封装方法及分层封装led灯

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1146019A (ja) * 1997-07-28 1999-02-16 Nichia Chem Ind Ltd 発光ダイオード及びｌｅｄ表示器の形成方法
WO2003107441A2 (en) * 2002-06-13 2003-12-24 Cree, Inc. Saturated phosphor solid emitter
JP2006286896A (ja) * 2005-03-31 2006-10-19 Toshiba Lighting & Technology Corp 発光ダイオード装置
KR20070088848A (ko) * 2006-02-27 2007-08-30 엘지이노텍 주식회사 발광장치 및 이를 구비하는 영상표시장치
KR20100088830A (ko) * 2009-02-02 2010-08-11 삼성전자주식회사 발광 다이오드 유닛, 이를 포함하는 표시 장치 및 발광 다이오드 유닛 제조 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1146019A (ja) * 1997-07-28 1999-02-16 Nichia Chem Ind Ltd 発光ダイオード及びｌｅｄ表示器の形成方法
WO2003107441A2 (en) * 2002-06-13 2003-12-24 Cree, Inc. Saturated phosphor solid emitter
JP2006286896A (ja) * 2005-03-31 2006-10-19 Toshiba Lighting & Technology Corp 発光ダイオード装置
KR20070088848A (ko) * 2006-02-27 2007-08-30 엘지이노텍 주식회사 발광장치 및 이를 구비하는 영상표시장치
KR20100088830A (ko) * 2009-02-02 2010-08-11 삼성전자주식회사 발광 다이오드 유닛, 이를 포함하는 표시 장치 및 발광 다이오드 유닛 제조 방법

Also Published As

Publication number Publication date
KR20120016438A (ko) 2012-02-24
KR101164926B1 (ko) 2012-07-12
WO2012023764A2 (ko) 2012-02-23

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