WO2012019528A1 - Method for outward expanding single edge of circuit of touch panel - Google Patents
Method for outward expanding single edge of circuit of touch panel Download PDFInfo
- Publication number
- WO2012019528A1 WO2012019528A1 PCT/CN2011/078107 CN2011078107W WO2012019528A1 WO 2012019528 A1 WO2012019528 A1 WO 2012019528A1 CN 2011078107 W CN2011078107 W CN 2011078107W WO 2012019528 A1 WO2012019528 A1 WO 2012019528A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- conductive material
- metal
- photoresist film
- etching
- micrometers
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
Definitions
- the invention relates to a method for single-sided expansion of a touch panel line, and belongs to the technical field of touch panel fabrication.
- the invention can perform photoresist etching on different depth layers of the touch panel by using a photoresist process to obtain a corresponding pattern.
- a transparent conductive material is directly plated with a metal conductive material, a photoresist film is attached to the metal conductive material, and a metal trace is formed by exposure and development etching; the operation method is strong in controllability, the process flow is simple, and the manufacturing cost can be reduced.
- the transparent conductive material is etched using a photoresist technology to form a grid pattern non-conductive region to reduce etching traces, and the etching waste liquid is environmentally friendly.
- the organic combination of the electroplating process and the photoresist process avoids the complicated bonding process for processing the touch panel, thereby effectively reducing the thickness and weight of the touch panel, and improving the transmittance and touch sensitivity.
- the invention directly etches a metal conductive material on a transparent conductive material, sticks a photoresist film on the metal conductive material, forms a metal trace by exposure and development etching, and eliminates the phenomenon that the metal line electrode deviates from the end of the conductive region.
- the photoresist film is expanded outward with respect to the metal trace to ensure the integrity of the metal trace facilitates the transmission of electrical signals.
- the invention uses the photoresist technology to etch the transparent conductive material to obtain the grid pattern non-conductive region to reduce the etching trace and reduce the etching waste liquid to promote environmental protection.
- the invention discloses a method for unilaterally expanding a touch panel line, comprising the following steps: performing under dust-free drying conditions;
- Step 1 plating a metal conductive material on the surface of the transparent conductive material
- Step 2 attaching a photoresist film on the metal conductive material, exposing and developing etching to form a metal trace; and etching the metal conductive material with a mixed solution of hydrogen peroxide in a room temperature to obtain a metal trace;
- Step 3 first attach a photoresist film on the metal trace, wherein the metal trace width is smaller than the width of the photoresist film; then, the transparent conductive material is exposed and exposed; and the transparent conductive material is etched with hydrochloric acid at a temperature of 40 degrees Celsius to form Inductive lines and grid patterns are non-conductive areas;
- Step 4 Lay the nameplate layer on the metal traces and the transparent conductive material with a transparent optical adhesive.
- the molar concentration range of hydrochloric acid in the above step 3 is between 4.1 MOL/L and 4.5 MOL/L; the molar concentration of the sulfuric acid hydrogen peroxide mixture in the second step is 1 MOL/L.
- the grid pattern is a matrix of squares; wherein the single square has a side length of 0.35 mm and an etch line width of 60 ⁇ m; in step 3, the width of the photoresist film is extended from 5 ⁇ m to 10 ⁇ m with respect to the metal trace.
- the photoresist film has a thickness ranging between 15 microns and 20 microns.
- the etching reaction time is from 30 seconds to 60 seconds.
- the metal conductive material is copper; in the second step, the metal trace width is 50 micrometers; and the transparent conductive material is indium tin oxide.
- the thickness of the transparent optical adhesive in step 4 ranges from 50 microns to 100 microns.
- the invention discloses a method for unilaterally expanding a touch panel line.
- photoresist etching can be performed on different depth layers of the touch panel to obtain a corresponding pattern, and a transparent conductive material is formed by photoresist etching to form a network.
- the non-conducting area of the grid pattern reduces the etching trace, reduces the etching waste liquid to be environmentally friendly; directly electroplating the metal conductive material on the transparent conductive material, sticking the photoresist film on the metal conductive material, exposing and developing the etching to form the metal trace, and avoiding the deviation of the metal line electrode
- the phenomenon at the end of the conductive region The width of the photoresist film is extended from 5 micrometers to 10 micrometers with respect to the single side of the metal trace, which makes the metal trace intact and facilitates electrical signal transmission.
- the invention has strong controllability, simple process flow, and can reduce manufacturing cost.
- Figure 1 is a schematic block diagram of a partial structure pattern of the present invention.
- FIG. 2 is a schematic block diagram of a non-conductive region of a partial grid pattern of the present invention.
- Figure 3 is a schematic block diagram of the production flow of the present invention.
- the present invention discloses a method for unilaterally expanding a touch panel line, including the following steps: performing dust-free drying conditions;
- Step 1 plating a metal conductive material on the surface of the transparent conductive material
- Step 2 attaching a photoresist film on the metal conductive material, exposing and developing etching to form a metal trace; and etching the metal conductive material with a mixed solution of hydrogen peroxide in a room temperature to obtain a metal trace;
- Step 3 first attach a photoresist film on the metal trace, wherein the metal trace width is smaller than the width of the photoresist film; then, the transparent conductive material is exposed and exposed; and the transparent conductive material is etched with hydrochloric acid at a temperature of 40 degrees Celsius to form Inductive lines and grid patterns are non-conductive areas;
- Step 4 Lay the nameplate layer on the metal traces and the transparent conductive material with a transparent optical adhesive.
- the molar concentration range of hydrochloric acid in the above step 3 is between 4.1 MOL/L and 4.5 MOL/L; the molar concentration of the sulfuric acid hydrogen peroxide mixture in the second step is 1 MOL/L.
- the grid pattern is a matrix of squares; wherein the single square has a side length of 0.35 mm and an etch line width of 60 ⁇ m; in step 3, the width of the photoresist film is 5 to 10 ⁇ m larger than the single side of the metal trace.
- the photoresist film has a thickness ranging between 15 microns and 20 microns.
- the etching reaction time is from 30 seconds to 60 seconds.
- the metal conductive material is copper; the transparent conductive material is indium tin oxide.
- the thickness of the transparent optical adhesive in step 4 ranges from 50 microns to 100 microns.
- the thickness of the nameplate layer is 0.7 mm; the thickness of the metallic conductive material is 0.05 micrometer; the thickness of the transparent conductive material is 0.045 micrometer; the thickness of the substrate layer is 50 micrometers, and the substrate layer is polycarbonate resin.
- the method for unilaterally expanding the touch panel line includes the following steps: performing dust-free drying conditions;
- Step 1 plating a metal conductive material on the surface of the transparent conductive material
- Step 2 attaching a photoresist film on the metal conductive material, exposing and developing etching to form a metal trace; and etching the metal conductive material with a mixed solution of hydrogen peroxide in a room temperature to obtain a metal trace;
- Step 3 first attach a photoresist film on the metal trace, wherein the width of the photoresist film on the single metal trace is 65 micrometers; then, the transparent conductive material is exposed by exposure and development; transparent conductive is performed with hydrochloric acid at a temperature of 40 degrees Celsius The material is etched to form a non-conductive region of the sensing line and the grid pattern;
- Step 4 Lay the nameplate layer on the metal traces and the transparent conductive material with a transparent optical adhesive.
- the molar concentration of hydrochloric acid in the above step 3 is 4.1. MOL/L; the molar concentration of the sulfuric acid hydrogen peroxide mixture in the second step is 1.0 MOL/L.
- the grid pattern is a matrix of squares; wherein, the individual squares have an etched side length of 0.35 mm and an etched line width of 60 microns.
- the thickness of the photoresist film is 15 microns.
- the etching reaction time was 30 seconds.
- the thickness of the transparent optical adhesive in step 4 is 50 microns.
- the width of a single metal trace is 50 microns.
- the thickness of the nameplate layer is 1.8 mm; the thickness of the metallic conductive material is 0.1 micrometer; the thickness of the transparent conductive material is 0.1 micrometer; the thickness of the substrate layer is 180 micrometers, and the substrate layer is hardened glass.
- the method for unilaterally expanding the touch panel line includes the following steps: performing dust-free drying conditions;
- Step 1 plating a metal conductive material on the surface of the transparent conductive material
- Step 2 attaching a photoresist film on the metal conductive material, exposing and developing etching to form a metal trace; and etching the metal conductive material with a mixed solution of hydrogen peroxide in a room temperature to obtain a metal trace;
- Step 3 first attach a photoresist film on the metal trace, wherein the width of the photoresist film on the single metal trace is 75 micrometers; then, the transparent conductive material is exposed and exposed; at 40 degrees Celsius, transparent conductive with hydrochloric acid The material is etched to form a non-conductive region of the sensing line and the grid pattern;
- Step 4 Lay the nameplate layer on the metal traces and the transparent conductive material with a transparent optical adhesive.
- the molar concentration of hydrochloric acid in the above step 3 is 4.5. MOL/L; the molar concentration of the sulfuric acid hydrogen peroxide mixture in the second step is 1.0 MOL/L.
- the grid pattern is a matrix of squares; wherein, the individual squares have an etched side length of 0.35 mm and an etched line width of 60 ⁇ m; and the thickness of the photoresist film is 20 ⁇ m.
- the etching reaction time was 60 seconds.
- the thickness of the transparent optical glue in step 4 is 100 microns.
- the width of a single metal trace is 50 microns.
- the thickness of the nameplate layer is 1.1 mm; the thickness of the metal conductive material is 0.09 ⁇ m; the thickness of the transparent conductive material is 0.08 ⁇ m; the thickness of the substrate layer is 125 ⁇ m, and the substrate layer is polycarbonate resin.
- the method for unilaterally expanding the touch panel line includes the following steps: performing dust-free drying conditions;
- Step 1 plating a metal conductive material on the surface of the transparent conductive material
- Step 2 attaching a photoresist film on the metal conductive material, exposing and developing etching to form a metal trace; and etching the metal conductive material with a mixed solution of hydrogen peroxide in a room temperature to obtain a metal trace;
- Step 3 first attach a photoresist film on the metal trace, wherein the width of the photoresist film on the single metal trace is 70 micrometers; then, the transparent conductive material is exposed and exposed; and the transparent conductive layer is treated with hydrochloric acid at a temperature of 40 degrees Celsius. The material is etched to form a non-conductive region of the sensing line and the grid pattern;
- Step 4 Lay the nameplate layer on the metal traces and the transparent conductive material with a transparent optical adhesive.
- the molar concentration of hydrochloric acid in the above step 3 is 4.3 MOL/L; the molar concentration of the sulfuric acid hydrogen peroxide mixture in the second step is 1.0 MOL/L.
- the grid pattern is a matrix of squares; wherein, a single square has an etched side length of 0.35 mm and an etched line width of 60 ⁇ m; and the thickness of the photoresist film is 18 ⁇ m.
- the etching reaction time was 45 seconds.
- the thickness of the transparent optical adhesive in step four is 75 microns.
- the width of a single metal trace is 50 microns.
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing Of Electric Cables (AREA)
- Push-Button Switches (AREA)
- Manufacture Of Switches (AREA)
- Position Input By Displaying (AREA)
- Materials For Photolithography (AREA)
Abstract
The present invention relates to a method for outward expanding a single edge of a circuit of a touch panel, and belongs to the technical field of touch panel fabrication. In the present invention, a transparent conductive material is directly electroplated with a metal conductive material, and a photoresist film is attached to the metal conductive material. Exposure, development and etching are performed to form a metal trace. The operating method is highly controllable and has a simple process, thereby reducing the manufacturing cost. The outward expansion of the width of the photoresist film relative to the width of the metal trace effectively protects the metal trace from erosion and facilitates signal transmission.
Description
本发明 涉及一种触控面板线路单边外扩的方法，属于触控面板制作技术领域。 The invention relates to a method for single-sided expansion of a touch panel line, and belongs to the technical field of touch panel fabrication.
在加工触控面板过程中，很容易出现金属线路电极偏离导电区域端的现象。本发明通过采用光阻工艺可以对触控面板的不同深度层面进行光阻蚀刻得到相应的图案。比如，透明导电材料上直接电镀金属导电材料，在金属导电材料上贴光阻膜，曝光显影蚀刻形成金属走线；此操作方法可控性强，工序流程简单，可以降低制造成本。In the process of processing the touch panel, the phenomenon that the metal line electrode deviates from the end of the conductive region is likely to occur. The invention can perform photoresist etching on different depth layers of the touch panel by using a photoresist process to obtain a corresponding pattern. For example, a transparent conductive material is directly plated with a metal conductive material, a photoresist film is attached to the metal conductive material, and a metal trace is formed by exposure and development etching; the operation method is strong in controllability, the process flow is simple, and the manufacturing cost can be reduced.
对透明导电材料加工时，使用光阻技术对透明导电材料蚀刻形成网格图案非导电区域来降低蚀刻痕迹，减少蚀刻废液利于环保。电镀工艺与光阻工艺的有机结合，避免了用复杂的贴合工序来加工触控面板，从而有效降低触控面板的厚度和重量，提高透光度和触控敏感度。When processing transparent conductive materials, the transparent conductive material is etched using a photoresist technology to form a grid pattern non-conductive region to reduce etching traces, and the etching waste liquid is environmentally friendly. The organic combination of the electroplating process and the photoresist process avoids the complicated bonding process for processing the touch panel, thereby effectively reducing the thickness and weight of the touch panel, and improving the transmittance and touch sensitivity.
本发明通过直接在透明导电材料上电镀金属导电材料，金属导电材料上贴光阻膜，曝光显影蚀刻形成金属走线，消除金属线路电极偏离导电区域端的现象。其中，光阻膜相对于金属走线单边外扩，保证金属走线的完整性利于电信号传输。本发明使用光阻技术对透明导电材料蚀刻得到网格图案非导电区域来降低蚀刻痕迹，减少蚀刻废液利于环保。
The invention directly etches a metal conductive material on a transparent conductive material, sticks a photoresist film on the metal conductive material, forms a metal trace by exposure and development etching, and eliminates the phenomenon that the metal line electrode deviates from the end of the conductive region. Among them, the photoresist film is expanded outward with respect to the metal trace to ensure the integrity of the metal trace facilitates the transmission of electrical signals. The invention uses the photoresist technology to etch the transparent conductive material to obtain the grid pattern non-conductive region to reduce the etching trace and reduce the etching waste liquid to promote environmental protection.
本发明公开一种触控面板线路单边外扩的方法，包括如下步骤在无尘干燥条件下进行；The invention discloses a method for unilaterally expanding a touch panel line, comprising the following steps: performing under dust-free drying conditions;
步骤一：在透明导电材料表面电镀金属导电材料；Step 1: plating a metal conductive material on the surface of the transparent conductive material;
步骤二：在金属导电材料上贴光阻膜，曝光显影蚀刻形成金属走线；在室温状态下，用硫酸双氧水混合溶液蚀刻金属导电材料得到金属走线；Step 2: attaching a photoresist film on the metal conductive material, exposing and developing etching to form a metal trace; and etching the metal conductive material with a mixed solution of hydrogen peroxide in a room temperature to obtain a metal trace;
步骤三：先在金属走线上贴光阻膜，其中，金属走线宽度小于光阻膜宽度；然后，曝光显影蚀刻透明导电材料；在40摄氏度温度下，用盐酸对透明导电材料蚀刻，形成感应线和网格图案非导电区域；Step 3: first attach a photoresist film on the metal trace, wherein the metal trace width is smaller than the width of the photoresist film; then, the transparent conductive material is exposed and exposed; and the transparent conductive material is etched with hydrochloric acid at a temperature of 40 degrees Celsius to form Inductive lines and grid patterns are non-conductive areas;
步骤四：用透明光学胶将铭板层贴合在金属走线和透明导电材料上。Step 4: Lay the nameplate layer on the metal traces and the transparent conductive material with a transparent optical adhesive.
上述步骤三中盐酸的摩尔浓度范围值在4.1MOL/L到4.5MOL/L之间；步骤二中硫酸双氧水混合液的摩尔浓度值是1MOL/L。步骤三中网格图案为方块矩阵；其中，单个方块蚀刻边长0.35毫米，蚀刻线宽60微米；步骤三中光阻膜的宽度相对于金属走线单边外扩5微米到10微米。所述光阻膜的厚度范围值在15微米到20微米之间。蚀刻反应时间为30秒钟到60秒钟。金属导电材料是铜；步骤二中金属走线线宽是50微米；透明导电材料是氧化铟锡。步骤四中透明光学胶的厚度范围值在50微米到100微米之间。最后，各线路图案成形后用光阻剂清除残余光阻膜，提高产品外观品质。The molar concentration range of hydrochloric acid in the above step 3 is between 4.1 MOL/L and 4.5 MOL/L; the molar concentration of the sulfuric acid hydrogen peroxide mixture in the second step is 1 MOL/L. In the third step, the grid pattern is a matrix of squares; wherein the single square has a side length of 0.35 mm and an etch line width of 60 μm; in step 3, the width of the photoresist film is extended from 5 μm to 10 μm with respect to the metal trace. The photoresist film has a thickness ranging between 15 microns and 20 microns. The etching reaction time is from 30 seconds to 60 seconds. The metal conductive material is copper; in the second step, the metal trace width is 50 micrometers; and the transparent conductive material is indium tin oxide. The thickness of the transparent optical adhesive in step 4 ranges from 50 microns to 100 microns. Finally, after the pattern of each line is formed, the photoresist is removed by a photoresist to improve the appearance quality of the product.
本发明公开了一种触控面板线路单边外扩的方法，通过采用光阻工艺可以对触控面板的不同深度层面进行光阻蚀刻得到相应的图案，使用光阻蚀刻加工透明导电材料形成网格图案非导电区域来降低蚀刻痕迹，减少蚀刻废液利于环保；透明导电材料上直接电镀金属导电材料，在金属导电材料上贴光阻膜，曝光显影蚀刻形成金属走线，避免金属线路电极偏离导电区域端的现象。光阻膜的宽度相对于金属走线的单边外扩5微米到10微米，能够使金属走线完好无损，有利于电信号传输。本发明操作可控性强，工序流程简单，可以降低制造成本。
The invention discloses a method for unilaterally expanding a touch panel line. By using a photoresist process, photoresist etching can be performed on different depth layers of the touch panel to obtain a corresponding pattern, and a transparent conductive material is formed by photoresist etching to form a network. The non-conducting area of the grid pattern reduces the etching trace, reduces the etching waste liquid to be environmentally friendly; directly electroplating the metal conductive material on the transparent conductive material, sticking the photoresist film on the metal conductive material, exposing and developing the etching to form the metal trace, and avoiding the deviation of the metal line electrode The phenomenon at the end of the conductive region. The width of the photoresist film is extended from 5 micrometers to 10 micrometers with respect to the single side of the metal trace, which makes the metal trace intact and facilitates electrical signal transmission. The invention has strong controllability, simple process flow, and can reduce manufacturing cost.
图1是本发明的局部结构图案示意框图。BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic block diagram of a partial structure pattern of the present invention.
图2是本发明的局部网格图案非导电区域示意框图。2 is a schematic block diagram of a non-conductive region of a partial grid pattern of the present invention.
图3是本发明的制作流程示意框图。Figure 3 is a schematic block diagram of the production flow of the present invention.
下面是本发明的具体实施例来进一步描述：The following is a specific embodiment of the invention to further describe:
图3所示，本发明公开一种触控面板线路单边外扩的方法，包括如下步骤在无尘干燥条件下进行；As shown in FIG. 3, the present invention discloses a method for unilaterally expanding a touch panel line, including the following steps: performing dust-free drying conditions;
步骤一：在透明导电材料表面电镀金属导电材料；Step 1: plating a metal conductive material on the surface of the transparent conductive material;
步骤二：在金属导电材料上贴光阻膜，曝光显影蚀刻形成金属走线；在室温状态下，用硫酸双氧水混合溶液蚀刻金属导电材料得到金属走线；Step 2: attaching a photoresist film on the metal conductive material, exposing and developing etching to form a metal trace; and etching the metal conductive material with a mixed solution of hydrogen peroxide in a room temperature to obtain a metal trace;
步骤三：先在金属走线上贴光阻膜，其中，金属走线宽度小于光阻膜宽度；然后，曝光显影蚀刻透明导电材料；在40摄氏度温度下，用盐酸对透明导电材料蚀刻，形成感应线和网格图案非导电区域；Step 3: first attach a photoresist film on the metal trace, wherein the metal trace width is smaller than the width of the photoresist film; then, the transparent conductive material is exposed and exposed; and the transparent conductive material is etched with hydrochloric acid at a temperature of 40 degrees Celsius to form Inductive lines and grid patterns are non-conductive areas;
步骤四：用透明光学胶将铭板层贴合在金属走线和透明导电材料上。Step 4: Lay the nameplate layer on the metal traces and the transparent conductive material with a transparent optical adhesive.
上述步骤三中盐酸的摩尔浓度范围值在4.1MOL/L到4.5MOL/L之间；步骤二中硫酸双氧水混合液的摩尔浓度值是1MOL/L。步骤三中网格图案为方块矩阵；其中，单个方块蚀刻边长0.35毫米，蚀刻线宽60微米；步骤三中光阻膜的宽度比金属走线的单边外扩5微米到10微米。所述光阻膜的厚度范围值在15微米到20微米之间。蚀刻反应时间为30秒钟到60秒钟。金属导电材料是铜；透明导电材料是氧化铟锡。步骤四中透明光学胶的厚度范围值在50微米到100微米之间。The molar concentration range of hydrochloric acid in the above step 3 is between 4.1 MOL/L and 4.5 MOL/L; the molar concentration of the sulfuric acid hydrogen peroxide mixture in the second step is 1 MOL/L. In the third step, the grid pattern is a matrix of squares; wherein the single square has a side length of 0.35 mm and an etch line width of 60 μm; in step 3, the width of the photoresist film is 5 to 10 μm larger than the single side of the metal trace. The photoresist film has a thickness ranging between 15 microns and 20 microns. The etching reaction time is from 30 seconds to 60 seconds. The metal conductive material is copper; the transparent conductive material is indium tin oxide. The thickness of the transparent optical adhesive in step 4 ranges from 50 microns to 100 microns.
实施例1：Example 1:
铭板层的厚度是0.7毫米；金属导电材料的厚度是0.05微米；透明导电材料的厚度是0.045微米；基板层的厚度是50微米，基板层是聚碳酸树脂。The thickness of the nameplate layer is 0.7 mm; the thickness of the metallic conductive material is 0.05 micrometer; the thickness of the transparent conductive material is 0.045 micrometer; the thickness of the substrate layer is 50 micrometers, and the substrate layer is polycarbonate resin.
触控面板线路单边外扩的方法，包括如下步骤在无尘干燥条件下进行；The method for unilaterally expanding the touch panel line includes the following steps: performing dust-free drying conditions;
步骤一：在透明导电材料表面电镀金属导电材料；Step 1: plating a metal conductive material on the surface of the transparent conductive material;
步骤二：在金属导电材料上贴光阻膜，曝光显影蚀刻形成金属走线；在室温状态下，用硫酸双氧水混合溶液蚀刻金属导电材料得到金属走线；Step 2: attaching a photoresist film on the metal conductive material, exposing and developing etching to form a metal trace; and etching the metal conductive material with a mixed solution of hydrogen peroxide in a room temperature to obtain a metal trace;
步骤三：先在金属走线上贴光阻膜，其中，单条金属走线上的光阻膜宽度是65微米；然后，曝光显影蚀刻透明导电材料；在40摄氏度温度下，用盐酸对透明导电材料蚀刻，形成感应线和网格图案非导电区域；Step 3: first attach a photoresist film on the metal trace, wherein the width of the photoresist film on the single metal trace is 65 micrometers; then, the transparent conductive material is exposed by exposure and development; transparent conductive is performed with hydrochloric acid at a temperature of 40 degrees Celsius The material is etched to form a non-conductive region of the sensing line and the grid pattern;
步骤四：用透明光学胶将铭板层贴合在金属走线和透明导电材料上。Step 4: Lay the nameplate layer on the metal traces and the transparent conductive material with a transparent optical adhesive.
上述步骤三中盐酸的摩尔浓度是4.1
MOL/L；步骤二中硫酸双氧水混合液的摩尔浓度是1.0MOL/L。步骤三中网格图案为方块矩阵；其中，单个方块蚀刻边长0.35毫米，蚀刻线宽60微米。光阻膜的厚度是15微米。蚀刻反应时间为30秒钟。步骤四中透明光学胶的厚度是50微米。步骤二中单条金属走线线宽是50微米。The molar concentration of hydrochloric acid in the above step 3 is 4.1.
MOL/L; the molar concentration of the sulfuric acid hydrogen peroxide mixture in the second step is 1.0 MOL/L. In step 3, the grid pattern is a matrix of squares; wherein, the individual squares have an etched side length of 0.35 mm and an etched line width of 60 microns. The thickness of the photoresist film is 15 microns. The etching reaction time was 30 seconds. The thickness of the transparent optical adhesive in step 4 is 50 microns. In step two, the width of a single metal trace is 50 microns.
实施例2：Example 2:
铭板层的厚度是1.8毫米；金属导电材料的厚度是0.1微米；透明导电材料的厚度是0.1微米；基板层的厚度是180微米，基板层是硬化玻璃。The thickness of the nameplate layer is 1.8 mm; the thickness of the metallic conductive material is 0.1 micrometer; the thickness of the transparent conductive material is 0.1 micrometer; the thickness of the substrate layer is 180 micrometers, and the substrate layer is hardened glass.
触控面板线路单边外扩的方法，包括如下步骤在无尘干燥条件下进行；The method for unilaterally expanding the touch panel line includes the following steps: performing dust-free drying conditions;
步骤一：在透明导电材料表面电镀金属导电材料；Step 1: plating a metal conductive material on the surface of the transparent conductive material;
步骤二：在金属导电材料上贴光阻膜，曝光显影蚀刻形成金属走线；在室温状态下，用硫酸双氧水混合溶液蚀刻金属导电材料得到金属走线；Step 2: attaching a photoresist film on the metal conductive material, exposing and developing etching to form a metal trace; and etching the metal conductive material with a mixed solution of hydrogen peroxide in a room temperature to obtain a metal trace;
步骤三：先在金属走线上贴光阻膜，其中，单条金属走线上的光阻膜宽度是75微米；然后，曝光显影蚀刻透明导电材料；在40摄氏度温度下，用盐酸对透明导电材料蚀刻，形成感应线和网格图案非导电区域；Step 3: first attach a photoresist film on the metal trace, wherein the width of the photoresist film on the single metal trace is 75 micrometers; then, the transparent conductive material is exposed and exposed; at 40 degrees Celsius, transparent conductive with hydrochloric acid The material is etched to form a non-conductive region of the sensing line and the grid pattern;
步骤四：用透明光学胶将铭板层贴合在金属走线和透明导电材料上。Step 4: Lay the nameplate layer on the metal traces and the transparent conductive material with a transparent optical adhesive.
上述步骤三中盐酸的摩尔浓度是4.5
MOL/L；步骤二中硫酸双氧水混合液的摩尔浓度是1.0MOL/L。步骤三中网格图案为方块矩阵；其中，单个方块蚀刻边长0.35毫米，蚀刻线宽60微米；光阻膜的厚度是20微米。蚀刻反应时间为60秒钟。步骤四中透明光学胶的厚度是100微米。步骤二中单条金属走线线宽是50微米。The molar concentration of hydrochloric acid in the above step 3 is 4.5.
MOL/L; the molar concentration of the sulfuric acid hydrogen peroxide mixture in the second step is 1.0 MOL/L. In step 3, the grid pattern is a matrix of squares; wherein, the individual squares have an etched side length of 0.35 mm and an etched line width of 60 μm; and the thickness of the photoresist film is 20 μm. The etching reaction time was 60 seconds. The thickness of the transparent optical glue in step 4 is 100 microns. In step two, the width of a single metal trace is 50 microns.
实施例3：Example 3:
铭板层的厚度是1.1毫米；金属导电材料的厚度是0.09微米；透明导电材料的厚度是0.08微米；基板层的厚度是125微米，基板层是聚碳酸树脂。The thickness of the nameplate layer is 1.1 mm; the thickness of the metal conductive material is 0.09 μm; the thickness of the transparent conductive material is 0.08 μm; the thickness of the substrate layer is 125 μm, and the substrate layer is polycarbonate resin.
触控面板线路单边外扩的方法，包括如下步骤在无尘干燥条件下进行；The method for unilaterally expanding the touch panel line includes the following steps: performing dust-free drying conditions;
步骤一：在透明导电材料表面电镀金属导电材料；Step 1: plating a metal conductive material on the surface of the transparent conductive material;
步骤二：在金属导电材料上贴光阻膜，曝光显影蚀刻形成金属走线；在室温状态下，用硫酸双氧水混合溶液蚀刻金属导电材料得到金属走线；Step 2: attaching a photoresist film on the metal conductive material, exposing and developing etching to form a metal trace; and etching the metal conductive material with a mixed solution of hydrogen peroxide in a room temperature to obtain a metal trace;
步骤三：先在金属走线上贴光阻膜，其中，单条金属走线上的光阻膜宽度是70微米；然后，曝光显影蚀刻透明导电材料；在40摄氏度温度下，用盐酸对透明导电材料蚀刻，形成感应线和网格图案非导电区域；Step 3: first attach a photoresist film on the metal trace, wherein the width of the photoresist film on the single metal trace is 70 micrometers; then, the transparent conductive material is exposed and exposed; and the transparent conductive layer is treated with hydrochloric acid at a temperature of 40 degrees Celsius. The material is etched to form a non-conductive region of the sensing line and the grid pattern;
步骤四：用透明光学胶将铭板层贴合在金属走线和透明导电材料上。Step 4: Lay the nameplate layer on the metal traces and the transparent conductive material with a transparent optical adhesive.
上述步骤三中盐酸的摩尔浓度是4.3MOL/L；步骤二中硫酸双氧水混合液的摩尔浓度是1.0MOL/L。步骤三中网格图案为方块矩阵；其中，单个方块蚀刻边长0.35毫米，蚀刻线宽60微米；光阻膜的厚度是18微米。蚀刻反应时间为45秒钟。步骤四中透明光学胶的厚度是75微米。步骤二中单条金属走线线宽是50微米。The molar concentration of hydrochloric acid in the above step 3 is 4.3 MOL/L; the molar concentration of the sulfuric acid hydrogen peroxide mixture in the second step is 1.0 MOL/L. In the third step, the grid pattern is a matrix of squares; wherein, a single square has an etched side length of 0.35 mm and an etched line width of 60 μm; and the thickness of the photoresist film is 18 μm. The etching reaction time was 45 seconds. The thickness of the transparent optical adhesive in step four is 75 microns. In step two, the width of a single metal trace is 50 microns.
Claims (6)
- 一种触控面板线路单边外扩的方法，包括如下步骤，其特征在于：所述步骤在无尘干燥条件下进行； A method for unilaterally expanding a touch panel line includes the following steps, wherein the step is performed under dust-free drying conditions;步骤一：在透明导电材料表面电镀金属导电材料；Step 1: plating a metal conductive material on the surface of the transparent conductive material;步骤二：在金属导电材料上贴光阻膜，曝光显影蚀刻形成金属走线；在室温状态下，用硫酸双氧水混合溶液蚀刻金属导电材料得到金属走线；Step 2: attaching a photoresist film on the metal conductive material, exposing and developing etching to form a metal trace; and etching the metal conductive material with a mixed solution of hydrogen peroxide in a room temperature to obtain a metal trace;步骤三：先在金属走线上贴光阻膜，其中，金属走线宽度小于光阻膜宽度；然后，曝光显影蚀刻透明导电材料；在40摄氏度温度下，用盐酸对透明导电材料蚀刻，形成感应线和网格图案非导电区域；Step 3: first attach a photoresist film on the metal trace, wherein the metal trace width is smaller than the width of the photoresist film; then, the transparent conductive material is exposed and exposed; and the transparent conductive material is etched with hydrochloric acid at a temperature of 40 degrees Celsius to form Inductive lines and grid patterns are non-conductive areas;步骤四：用透明光学胶将铭板层贴合在金属走线和透明导电材料上。Step 4: Lay the nameplate layer on the metal traces and the transparent conductive material with a transparent optical adhesive.
- 如权利要求1所述触控面板线路单边外扩的方法，其特征在于：所述步骤三中盐酸的摩尔浓度范围值在4.1MOL/L到4.5MOL/L之间；步骤二中硫酸双氧水混合液的摩尔浓度值是1MOL/L。The method for unilaterally expanding a touch panel line according to claim 1, wherein the molar concentration range of hydrochloric acid in the third step is between 4.1 MOL/L and 4.5 MOL/L; and the sulfuric acid hydrogen peroxide in the second step The molar concentration of the mixed solution was 1 MOL/L.
- 如权利要求1所述触控面板线路单边外扩的方法，其特征在于：所述光阻膜的厚度范围值在15微米到20微米之间；步骤三中网格图案为方块矩阵；其中，单个方块蚀刻边长0.35毫米，蚀刻线宽60微米；步骤三中光阻膜相对于金属走线单边外扩5微米到10微米。The method of claim 1 , wherein the thickness of the photoresist film ranges from 15 micrometers to 20 micrometers; and in step three, the grid pattern is a matrix of squares; The single square etching side length is 0.35 mm, and the etching line width is 60 micrometers; in the third step, the photoresist film is outwardly expanded by 5 micrometers to 10 micrometers with respect to the metal wiring.
- 如权利要求1所述触控面板线路单边外扩的方法，其特征在于：所述蚀刻反应时间为30秒钟到60秒钟。The method for unilaterally expanding a touch panel line according to claim 1, wherein the etching reaction time is 30 seconds to 60 seconds.
- 如权利要求1所述触控面板线路单边外扩的方法，其特征在于：所述金属导电材料是铜；透明导电材料是氧化铟锡。The method of claim 1 , wherein the metal conductive material is copper; and the transparent conductive material is indium tin oxide.
- 如权利要求1所述触控面板线路单边外扩的方法，其特征在于：所述步骤四中透明光学胶的厚度范围值在50微米到100微米之间。 The method of claim 1 , wherein the thickness of the transparent optical adhesive in the step 4 ranges from 50 micrometers to 100 micrometers.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102521274A CN101907946A (en) | 2010-08-13 | 2010-08-13 | Method for externally expanding single edge of circuit of touch panel |
| CN201010252127.4 | 2010-08-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2012019528A1 true WO2012019528A1 (en) | 2012-02-16 |
Family
ID=43263420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2011/078107 WO2012019528A1 (en) | 2010-08-13 | 2011-08-08 | Method for outward expanding single edge of circuit of touch panel |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN101907946A (en) |
| WO (1) | WO2012019528A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101907946A (en) * | 2010-08-13 | 2010-12-08 | 牧东光电（苏州）有限公司 | Method for externally expanding single edge of circuit of touch panel |
| CN102768586A (en) * | 2011-05-06 | 2012-11-07 | 许明松 | Touch panel and manufacturing method thereof |
| CN103309510B (en) * | 2013-06-08 | 2016-06-08 | 南昌欧菲光科技有限公司 | Touch screen electrode preparation method |
| CN107908304B (en) * | 2017-09-29 | 2021-06-01 | 信利（惠州）智能显示有限公司 | Wiring method of touch wire |
| CN109992163B (en) * | 2019-04-15 | 2023-01-03 | 业成科技（成都）有限公司 | Touch sensing module, manufacturing method thereof and electronic device applying touch sensing module |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101365300A (en) * | 2007-08-08 | 2009-02-11 | 富葵精密组件(深圳)有限公司 | Manufacturing method of circuit board conductive wire |
| JP2009129604A (en) * | 2007-11-21 | 2009-06-11 | Seiko Epson Corp | Method for manufacturing display device and organic el device, organic el device and electronic equipment |
| US20090246704A1 (en) * | 2008-03-28 | 2009-10-01 | Wei-Ping Chou | Manufacturing Method for Conducting Films on Two Surfaces of Transparent Substrate of Touch Control Circuit |
| CN101907946A (en) * | 2010-08-13 | 2010-12-08 | 牧东光电（苏州）有限公司 | Method for externally expanding single edge of circuit of touch panel |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101298940B1 (en) * | 2005-08-23 | 2013-08-22 | 주식회사 동진쎄미켐 | Photoresist composition and method of manufacturing thin film transistor substrate using the same |
| CN101024484B (en) * | 2007-03-23 | 2010-07-21 | 中国科学院光电技术研究所 | Method for realizing surface plasma structure forming |
| CN101261560A (en) * | 2008-04-17 | 2008-09-10 | 张树峰 | Touch screen electrode preparation method |
| KR101329638B1 (en) * | 2008-07-31 | 2013-11-14 | 군제 가부시키가이샤 | Planar element, and touch switch |
-
2010
- 2010-08-13 CN CN2010102521274A patent/CN101907946A/en active Pending
-
2011
- 2011-08-08 WO PCT/CN2011/078107 patent/WO2012019528A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101365300A (en) * | 2007-08-08 | 2009-02-11 | 富葵精密组件(深圳)有限公司 | Manufacturing method of circuit board conductive wire |
| JP2009129604A (en) * | 2007-11-21 | 2009-06-11 | Seiko Epson Corp | Method for manufacturing display device and organic el device, organic el device and electronic equipment |
| US20090246704A1 (en) * | 2008-03-28 | 2009-10-01 | Wei-Ping Chou | Manufacturing Method for Conducting Films on Two Surfaces of Transparent Substrate of Touch Control Circuit |
| CN101907946A (en) * | 2010-08-13 | 2010-12-08 | 牧东光电（苏州）有限公司 | Method for externally expanding single edge of circuit of touch panel |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101907946A (en) | 2010-12-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2012019531A1 (en) | Method for manufacturing grid-pattern type touch panel | |
| WO2018030712A1 (en) | Metal mesh-type transparent conductive film manufacturing method using photoresist intaglio pattern and surface modification and transparent conductive film manufactured thereby | |
| WO2012019528A1 (en) | Method for outward expanding single edge of circuit of touch panel | |
| WO2012019530A1 (en) | Touch panel with intermediate conductive layer and method for manufacturing same | |
| CN102880369B (en) | A kind of monolithic capacitive touch screen and preparation method thereof | |
| CN102821553B (en) | Method for manufacturing key position partial electro-gold-plated PCB (printed circuit board) | |
| TW202031506A (en) | Electrode structure and touch panel thereof | |
| WO2016074275A1 (en) | Mutual capacitance type ogs touch panel and manufacturing method therefor | |
| TWM579326U (en) | Touch sensing panel | |
| WO2020040518A1 (en) | Embedded electrode substrate for transparent light-emitting element display, and method for manufacturing same | |
| WO2015182881A1 (en) | Directly-plated conductive thin film material and method for manufacturing same | |
| WO2019052008A1 (en) | Array substrate and manufacturing method therefor, and display apparatus | |
| WO2019041476A1 (en) | Array substrate and manufacturing method thereof, and display panel | |
| CN109041425B (en) | Method for manufacturing COF double-sided flexible substrate fine circuit and product thereof | |
| CN103747614B (en) | Plate and its production technology are merged based on several samples | |
| JP2011129272A (en) | Double-sided transparent conductive film sheet and method of manufacturing the same | |
| US20210157447A1 (en) | Touch panel and manufacturing method thereof | |
| CN105208778A (en) | Manufacturing mode for producing high-density flexible printed circuit board in sheet mode | |
| CN102280407A (en) | Manufacturing method of component with patterned side wall | |
| WO2023182819A1 (en) | Method for manufacturing fine metal mask | |
| CN209168059U (en) | Touch panel and touch sensing winding | |
| CN110402033B (en) | Circuit processing method of 10oz thick copper circuit board | |
| CN208459988U (en) | Touch panel | |
| CN116916532A (en) | Method for manufacturing pattern circuit of carrier-like plate | |
| WO2018188142A1 (en) | Method for improving efficiency of mask stripping of array substrate, array substrate and display panel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 11816086 Country of ref document: EP Kind code of ref document: A1 |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 11816086 Country of ref document: EP Kind code of ref document: A1 |