WO2012019531A1

WO2012019531A1 - Method for manufacturing grid-pattern type touch panel

Info

Publication number: WO2012019531A1
Application number: PCT/CN2011/078117
Authority: WO
Inventors: 陈栋南
Original assignee: 牧东光电（苏州）有限公司
Priority date: 2010-08-13
Filing date: 2011-08-08
Publication date: 2012-02-16
Also published as: CN101968697B; CN101968697A

Abstract

Disclosed is a method for manufacturing a touch panel of the grid-pattern type, comprising the steps of: etching a transparent conductive material to form nonconductive regions in a grid pattern by using photoresist technology, then electroplating a metallic conductive material thereon, affixing a photoresist film onto the metallic conductive material, and forming metal wiring by exposing, developing and etching thereon. The method can reduce the etching traces, and decrease the etching waste liquid so that it is beneficial for environmental protection, and it is simple to operate, which can reduce manufacturing costs.

Description

Method for manufacturing grid pattern type touch panel

Technical field

The invention relates to a method for manufacturing a grid pattern type touch panel, and belongs to the technical field of touch panel process.

Background technique

If the processing method of the touch panel is to adopt a layer-by-layer bonding process, the bonding position is inaccurate, and the thickness and weight of the touch panel are increased, and the transmittance and touch sensitivity of the touch product are reduced. Quality is hard to get much improved. When processing a transparent conductive material, a large amount of etching waste liquid is required to be etched due to the formation of a corresponding sensing line pattern, resulting in a large amount of etching waste liquid, and the environmental pollution is serious; and the color difference of the touch panel is large, and the etching trace is obvious.

The invention can perform photoresist etching on different depth layers of the touch panel by using a photoresist process to obtain a corresponding pattern; then plating a metal conductive material, attaching a photoresist film on the metal conductive material, exposing and developing etching to form a metal trace, and operating Simple can reduce manufacturing costs. Therefore, the organic combination of the electroplating process and the photoresist process can eliminate the complicated bonding process to process the touch panel, thereby effectively reducing the thickness and weight of the touch panel, and improving the transmittance and touch sensitivity.

technical problem

The invention uses a photoresist technology to etch a transparent conductive material to form a grid pattern non-conductive region to reduce etching traces, reduce etching waste liquid to facilitate environmental protection; and then electroplating a metal conductive material, attaching a photoresist film on the metal conductive material, exposing and developing etching Metal routing, simple operation can reduce manufacturing costs.

Technical solution

The invention discloses a method for manufacturing a grid pattern type touch panel, comprising the following steps: performing under dust-free drying conditions;

Step 1: aging and crystallizing the transparent conductive material;

Step 2: exposing and etching the crystallization transparent conductive material, etching the transparent conductive material with hydrochloric acid at a temperature of 40 degrees Celsius to form a non-conductive region of the sensing line and the grid pattern;

Step 3: plating the metal conductive material on the surface of the transparent conductive material in the second step;

Step 4: attaching a photoresist film on the metal conductive material, exposing and developing etching to form a metal trace; wherein, at room temperature, etching the metal conductive material with a mixed solution of hydrogen peroxide to obtain a metal trace;

Step 5: Lay the nameplate layer on the metal traces and the transparent conductive material with a transparent optical adhesive.

The molar concentration range of hydrochloric acid in the above step 2 is between 4.1 MOL/L and 4.5 MOL/L; the molar concentration of the sulfuric acid hydrogen peroxide mixture in the fourth step is 1 MOL/L. In the second step, the grid pattern is a matrix of squares; wherein the single square has a side length of 0.35 mm and an etch line width of 60 μm; and in step 4, the thickness of the photoresist film ranges from 15 μm to 20 μm. The etching reaction time is from 30 seconds to 60 seconds. The metal conductive material is copper; the transparent conductive material is indium tin oxide. In step 5, the transparent optical adhesive has a thickness ranging from 50 micrometers to 100 micrometers. Finally, after the pattern of each line is formed, the photoresist is used to remove the residual photoresist film to improve the appearance quality of the product.

Beneficial effect

The invention discloses a method for manufacturing a grid pattern type touch panel, which can perform photoresist etching on different depth layers of the touch panel by using a photoresist process to obtain a corresponding pattern, and etch a transparent conductive material into a grid by using a photoresist technology. The pattern non-conducting area is used to reduce the etching trace, and the etching waste liquid is reduced to be environmentally friendly; the metal conductive material is electroplated, the photoresist film is adhered on the metal conductive material, and the metal trace is formed by exposure and development etching, and the operation cost is simple to reduce the manufacturing cost. The organic combination of the electroplating process and the photoresist process can eliminate the complicated bonding process to process the touch panel, thereby effectively reducing the thickness and weight of the touch product, and improving the transmittance and touch sensitivity.

DRAWINGS

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic block diagram of a partial structure pattern of the present invention.

2 is a schematic block diagram of a non-conductive region of a partial grid pattern of the present invention.

Figure 3 is a schematic block diagram of the production flow of the present invention.

Embodiments of the invention

The following is a specific embodiment of the invention to further describe:

As shown in FIG. 3, the present invention discloses a method for manufacturing a grid pattern type touch panel, which comprises the following steps under dust-free drying conditions;

Step 1: aging and crystallizing the transparent conductive material;

The molar concentration range of hydrochloric acid in the above step 2 is between 4.1 MOL/L and 4.5 MOL/L; the molar concentration of the sulfuric acid hydrogen peroxide mixture in the fourth step is 1 MOL/L. In the second step, the grid pattern is a matrix of squares; wherein the single square has a side length of 0.35 mm and an etch line width of 60 μm; and in step 4, the thickness of the photoresist film ranges from 15 μm to 20 μm. The etching reaction time is from 30 seconds to 60 seconds. The metal conductive material is copper; the transparent conductive material is indium tin oxide. In step 5, the transparent optical adhesive has a thickness ranging from 50 micrometers to 100 micrometers.

Example 1:

The thickness of the nameplate layer is 0.7 mm; the thickness of the metallic conductive material is 0.04 μm; the thickness of the transparent conductive material is 0.045 mm; the thickness of the substrate layer is 50 μm, and the substrate layer is polycarbonate.

A method for manufacturing a grid pattern type touch panel, comprising the following steps: performing under dust-free drying conditions;

Step 1: aging and crystallizing the transparent conductive material;

The molar concentration of hydrochloric acid in the above step 2 is 4.1. MOL/L; the molar concentration of the sulfuric acid hydrogen peroxide mixture in the fourth step is 1.0 MOL/L. In the second step, the grid pattern is a matrix of squares; wherein the single square has a side length of 0.35 mm and an etch line width of 60 μm; and the thickness of the photoresist film in step 4 is 15 μm. Among them, the etching reaction time was 30 seconds. The thickness of the transparent optical adhesive in step 5 is 50 microns.

Example 2:

The thickness of the nameplate layer is 1.8 mm; the thickness of the metallic conductive material is 0.1 micrometer; the thickness of the transparent conductive material is 0.1 micrometer; the thickness of the substrate layer is 180 micrometers, and the substrate layer is hardened glass.

Step 1: aging and crystallizing the transparent conductive material;

The molar concentration of hydrochloric acid in the above step 2 is 4.5. MOL/L; the molar concentration of the sulfuric acid hydrogen peroxide mixture in the fourth step is 1.0 MOL/L. In the second step, the grid pattern is a matrix of squares; wherein the single square has a side length of 0.35 mm and an etch line width of 60 μm; and the thickness of the photoresist film in step 4 is 20 μm. Among them, the etching reaction time was 60 seconds. The thickness of the transparent optical adhesive in step 5 is 100 micrometers.

Example 3:

The thickness of the nameplate layer is 1.1 mm; the thickness of the metal conductive material is 0.08 μm; the thickness of the transparent conductive material is 0.07 μm; the thickness of the substrate layer is 125 μm, and the substrate layer is polycarbonate resin.

Step 1: aging and crystallizing the transparent conductive material;

The molar concentration of hydrochloric acid in the above step 2 is 4.3 MOL/L; the molar concentration of the sulfuric acid hydrogen peroxide mixture in the fourth step is 1.0 MOL/L. In the second step, the grid pattern is a matrix of squares; wherein the single square has a side length of 0.35 mm and an etch line width of 60 μm; and the thickness of the photoresist film in step 4 is 18 μm. Among them, the etching reaction time was 45 seconds. The thickness of the transparent optical adhesive in step 5 is 75 microns.

Claims

A method for manufacturing a grid pattern type touch panel, comprising the steps of: performing the step under dust-free drying conditions;

Step 1: aging and crystallizing the transparent conductive material;

Step 2: exposing and etching the crystallization transparent conductive material, etching the transparent conductive material with hydrochloric acid at a temperature of 40 degrees Celsius to form a non-conductive region of the sensing line and the grid pattern;

Step 3: plating the metal conductive material on the surface of the transparent conductive material in the second step;

Step 4: attaching a photoresist film on the metal conductive material, exposing and developing etching to form a metal trace; wherein, at room temperature, etching the metal conductive material with a mixed solution of hydrogen peroxide to obtain a metal trace;

Step 5: Lay the nameplate layer on the metal traces and the transparent conductive material with a transparent optical adhesive.
The method for manufacturing a grid pattern type touch panel according to claim 1, wherein the molar concentration range of hydrochloric acid in the second step is between 4.1 MOL/L and 4.5 MOL/L; and the sulfuric acid hydrogen peroxide in the fourth step The molar concentration of the mixed solution was 1 MOL/L.
The method for fabricating a grid pattern type touch panel according to claim 1, wherein the grid pattern in the second step is a matrix of squares; wherein a single square has a side length of 0.35 mm and an etch line width of 60 μm; The thickness of the four-thin photoresist film ranges from 15 microns to 20 microns.
A method of manufacturing a grid pattern type touch panel according to claim 1, wherein said etching reaction time is from 30 seconds to 60 seconds.
The method of manufacturing a grid pattern type touch panel according to claim 1, wherein the metal conductive material is copper; and the transparent conductive material is indium tin oxide.
The method of fabricating a grid pattern type touch panel according to claim 1, wherein the thickness of the transparent optical glue in the step 5 is between 50 micrometers and 100 micrometers.