WO2012019530A1

WO2012019530A1 - Touch panel with intermediate conductive layer and method for manufacturing same

Info

Publication number: WO2012019530A1
Application number: PCT/CN2011/078112
Authority: WO
Inventors: 陈栋南
Original assignee: 牧东光电（苏州）有限公司
Priority date: 2010-08-13
Filing date: 2011-08-08
Publication date: 2012-02-16
Also published as: CN101893966A

Abstract

Disclosed in the present invention are a touch panel with an intermediate conductive layer and a method for manufacturing the same, which belong to the technical field of touch panel composite layer structure and the manufacturing processes therefor. In the present invention, nonconductive regions in a grid pattern are introduced while etching an induction layer, so as to reduce etching traces and decrease etching waste liquid, which is beneficial for environmental protection. During the processing of the touch panel, full use is made of photoresist etching technology to achieve precise processing of the touch panel at different depth levels, and an intermediate conductive layer is added therein which serves to protect conductive materials, and also to enhance the adhesion of the conductive materials.

Description

Touch panel with intermediate conductive layer and manufacturing method thereof

Technical field

The invention relates to a touch panel with an intermediate conductive layer and a manufacturing method thereof, belonging to a touch panel composite layer Structure and process technology field.

Background technique

In general, the processing method of the touch panel is to adopt a layer-by-layer bonding process, which is easy to cause inaccurate alignment, and increases the thickness and weight of the touch panel, and reduces the transmittance and touch sensitivity of the touch product. Degree, product quality is difficult to get much improved. When processing the sensing layer, a large amount of etching waste liquid is required to be etched away due to the formation of a corresponding sensing line pattern, which causes serious environmental pollution; and the color difference of the touch panel is large, and the etching trace is obvious.

With the continuous development of photoresist technology, the photoresist process has also been applied in the precision process of touch panels. By using a photoresist process, different depth layers of the touch panel can be photoresist etched to obtain a corresponding pattern. Therefore, the organic combination of the electroplating process and the photoresist process can eliminate the complicated bonding process to process the touch panel, thereby effectively reducing the thickness and weight of the touch panel, and improving the transmittance and touch sensitivity. The invention introduces a grid pattern non-conductive region in the etching of the sensing layer to reduce the etching trace, and reduces the etching waste liquid to be environmentally friendly.

technical problem

The invention fully utilizes the photoresist etching technology to realize precision processing on different depth layers of the touch panel, and adding an intermediate conductive layer on the transparent conductive layer serves to protect the conductive material and also improves the adhesion of the conductive material. In the etching of the sensing layer, a grid pattern non-conductive region is introduced to eliminate the etching trace, and the etching waste liquid is reduced to be environmentally friendly.

Technical solution

Technical Solution: The present invention discloses a touch panel having an intermediate conductive layer, wherein the first layer is a nameplate layer, the second layer is a metal circuit layer, the third layer is an intermediate conductive layer, and the fourth layer is a transparent conductive layer. The fifth layer is a substrate layer which is sequentially stacked. The thickness of the nameplate layer ranges from 0.7 mm to 1.8 mm; the thickness of the metal wiring layer ranges from 0.04 micrometers to 0.1 micrometers; and the thickness of the intermediate conductive layer or the transparent conductive layer ranges from 0.04 micrometers to 0.1 millimeters. Between microns; the thickness of the substrate layer ranges from 50 microns to 180 microns. The intermediate conductive layer is indium oxide; the metal wiring layer is copper wire; the transparent conductive layer is indium tin oxide; and the substrate layer is hardened glass or polycarbonate resin.

The method for fabricating a touch panel having an intermediate conductive layer of the present invention comprises the following steps: performing under dust-free drying conditions;

Step 1: one side of the substrate layer covers the transparent conductive layer, and the intermediate conductive layer is covered on the transparent conductive layer;

Step 2: plating a metal circuit layer on the intermediate conductive layer, and sticking a photoresist film on the metal circuit layer; wherein the hollow pattern on the photoresist film is consistent with the traces of the metal trace, the sensing line and the grid-shaped etching line;

Step 3: first exposing and developing the operating area of the surface of the metal circuit layer, and etching the intermediate conductive layer and the transparent conductive layer with a mixed line of sulfuric acid hydrogen peroxide at room temperature to form a non-conductive region of the sensing line and the grid pattern;

Step 4: forming a metal trace on the periphery of the metal circuit layer in the third step;

Step 5: Lay the nameplate layer on the metal trace and the transparent conductive layer in step three with a transparent optical adhesive.

In the third step, the molar concentration range of the sulfuric acid hydrogen peroxide mixture is between 4.0 MOL/L and 4.5 MOL/L. In the third step, the grid pattern is a matrix of squares; wherein the single square has a side length of 0.35 mm and an etch line width of 60 μm; in step 2, the thickness of the photoresist film ranges from 15 μm to 20 μm; in step 5, transparent optics The thickness of the glue ranges from 50 microns to 100 microns. The etching reaction time is from 30 seconds to 60 seconds. Finally, after the pattern of each line is formed, the photoresist is used to remove the residual photoresist film to improve the appearance quality of the product.

Beneficial effect

The invention discloses a touch panel with an intermediate conductive layer and a manufacturing method thereof. By using a photoresist process, photoresist etching can be performed on different depth layers of the touch panel to obtain a corresponding pattern, and an intermediate conductive layer is added to protect the conductive material. The role also increases the adhesion of the conductive material. Therefore, the organic combination of the electroplating process and the photoresist process can eliminate the complicated bonding process to process the touch panel, thereby effectively reducing the thickness and weight of the touch product, and improving the transmittance and the touch sensitivity. The invention introduces a grid pattern non-conductive region in the etching of the sensing layer to reduce the etching trace, and reduces the etching waste liquid to be environmentally friendly.

DRAWINGS

1 is a schematic view showing the structure of a cross-sectional structure of a touch panel having an intermediate conductive layer of the present invention. Among them are: nameplate layer 1, metal circuit layer 2, intermediate conductive layer 3, transparent conductive layer 4, and substrate layer 5.

Figure 2 is a schematic block diagram of a partial structure pattern of the present invention.

Figure 3 is a schematic block diagram of the production flow of the present invention.

4 is a schematic block diagram of a non-conductive region of a partial grid pattern of the present invention.

Embodiments of the invention

The following is a specific embodiment of the invention to further describe:

As shown in FIG. 1, the touch panel with an intermediate conductive layer of the present invention comprises a first layer which is a nameplate layer 1, a second layer which is a metal wiring layer 2, a third layer which is an intermediate conductive layer 3, and a fourth layer which is transparent. The conductive layer 4 and the fifth layer are the substrate layers 5, which are sequentially stacked. The thickness of the nameplate layer 1 ranges from 0.7 mm to 1.8 mm; the thickness of the metal wiring layer 2 ranges from 0.04 micrometers to 0.1 micrometers; and the thickness of the intermediate conductive layer 3 or the transparent conductive layer 4 ranges from 0.04 micrometers. Between 0.1 microns; the thickness of the substrate layer 5 ranges from 50 microns to 180 microns. The intermediate conductive layer 3 is indium oxide; the metal wiring layer 2 is copper wire; the transparent conductive layer 4 is indium tin oxide; and the substrate layer 5 is hardened glass or polycarbonate resin.

FIG. 3 shows a method of fabricating a touch panel having an intermediate conductive layer, and each step is performed under dust-free drying conditions;

Step 1: one side of the substrate layer 5 covers the transparent conductive layer 4, and covers the intermediate conductive layer 3 on the transparent conductive layer 4;

Step 2: plating the metal circuit layer 2 on the intermediate conductive layer 3, and sticking the photoresist film on the metal circuit layer 2; wherein the hollow pattern on the photoresist film is consistent with the traces of the metal traces, the sensing lines and the grid-shaped etch lines ;

Step 3: After exposing and developing the surface operation area of the metal circuit layer 2, the intermediate conductive layer 3 and the transparent conductive layer 4 are etched with a sulfuric acid hydrogen peroxide mixture line at room temperature to form a non-conductive region of the sensing line and the grid pattern;

Step 4: in the third step, the metal circuit layer 2 is exposed and developed to form a metal trace;

Step 5: The nameplate layer 1 is adhered to the metal trace and the transparent conductive layer 4 in the third step with a transparent optical adhesive.

The molar concentration range of the mixture of sulfuric acid and hydrogen peroxide in the above step 3 is between 4.0 MOL/L and 4.5 MOL/L. In the third step, the grid pattern is a matrix of squares; wherein the single square has a side length of 0.35 mm and an etch line width of 60 μm; in step 2, the thickness of the photoresist film ranges from 15 μm to 20 μm; in step 5, transparent optics The thickness of the glue ranges from 50 microns to 100 microns. Among them, the etching reaction time is 30 seconds to 60 seconds.

Example 1:

The thickness of the nameplate layer 1 is 0.7 mm; the thickness of the metal wiring layer 2 is 0.04 μm; the thickness of the intermediate conductive layer 3 is 0.04 μm, the thickness of the transparent conductive layer 4 is 0.04 μm; the thickness of the substrate layer 5 is 50 μm, the substrate Layer 5 is a polycarbonate resin.

a method of fabricating a touch panel having an intermediate conductive layer, each step being performed under dust-free drying conditions;

Step 2: plating the metal circuit layer 2 on the intermediate conductive layer 3, and sticking the photoresist film on the metal circuit layer 2; wherein the hollow pattern on the photoresist film is consistent with the traces of the metal traces and the traces of the grid-shaped etch lines;

The molar concentration of the sulfuric acid hydrogen peroxide mixture in the above step 3 is 4.0 MOL/L. In the third step, the grid pattern is a matrix of squares; wherein the single square has a side length of 0.35 mm and an etch line width of 60 μm; and in step two, the thickness of the photoresist film is 15 μm. Among them, the etching reaction time was 30 seconds. The thickness of the transparent optical adhesive in step 5 is 50 microns.

Example 2:

The thickness of the nameplate layer 1 is 1.8 mm; the thickness of the metal wiring layer 2 is 0.07 μm; the thickness of the intermediate conductive layer 3 is 0.08 μm, the thickness of the transparent conductive layer 4 is 0.08 μm; the thickness of the substrate layer 5 is 180 μm, the substrate Layer 5 is a hardened glass.

The molar concentration of the sulfuric acid hydrogen peroxide mixture in the above step 3 is 4.5 MOL/L. In the third step, the grid pattern is a matrix of squares; wherein the single square has a side length of 0.35 mm and an etch line width of 60 μm; and in step 2, the thickness of the photoresist film is 20 μm. Among them, the etching reaction time was 60 seconds. The thickness of the transparent optical adhesive in step 5 is 100 micrometers.

Example 3:

The thickness of the nameplate layer 1 is 1.1 mm; the thickness of the metal wiring layer 2 is 0.1 micrometer; the thickness of the intermediate conductive layer 3 is 0.1 micrometer, the thickness of the transparent conductive layer 4 is 0.1 micrometer; the thickness of the substrate layer 5 is 125 micrometers, the substrate Layer 5 is a polycarbonate resin.

The molar concentration of the sulfuric acid hydrogen peroxide mixture in the above step 3 is 4.2 MOL/L. In the third step, the grid pattern is a square matrix; wherein, the single square etching side length is 0.35 mm, and the etching line width is 60 micrometers; in the second step, the thickness of the photoresist film is 18 micrometers. Among them, the etching reaction time was 45 seconds. The thickness of the transparent optical adhesive in step 5 is 75 microns.

Claims

A touch panel having an intermediate conductive layer, comprising a first layer is a nameplate layer (1), characterized in that: the second layer is a metal circuit layer (2), and the third layer is an intermediate conductive layer (3), The fourth layer is a transparent conductive layer (4), and the fifth layer is a substrate layer (5), which are sequentially stacked.
The touch panel with an intermediate conductive layer according to claim 1, wherein the thickness of the nameplate layer (1) ranges from 0.7 mm to 1.8 mm; and the thickness range of the metal wiring layer (2) Between 0.04 micrometers and 0.1 micrometers; the thickness of the intermediate conductive layer (3) or the transparent conductive layer (4) ranges from 0.04 micrometers to 0.1 micrometers; the thickness of the substrate layer (5) ranges from 50 micrometers to 180 micrometers. between.
The touch panel with an intermediate conductive layer according to claim 1, wherein the intermediate conductive layer (3) is indium oxide; the metal wiring layer (2) is copper wire; and the transparent conductive layer (4) is indium oxide. Tin; the substrate layer (5) is a hardened glass or a polycarbonate resin.
A method of fabricating a touch panel having an intermediate conductive layer according to claim 1, comprising the steps of: said step being performed under dust-free drying conditions;

Step 1: one side of the substrate layer (5) covers the transparent conductive layer (4), and covers the intermediate conductive layer (3) on the transparent conductive layer (4);

Step 2: plating the metal circuit layer (2) on the intermediate conductive layer (3), and sticking the photoresist film on the metal circuit layer (2); wherein the hollow pattern on the photoresist film is respectively related to the metal trace, the sensing line and the net The lattice etching line traces are consistent;

Step 3: After exposing and developing the surface operation area of the metal circuit layer (2), the intermediate conductive layer (3) and the transparent conductive layer (4) are etched with a mixture of sulfuric acid hydrogen peroxide at room temperature to form a sensing line and a grid pattern. Non-conductive area;

Step 4: forming a metal trace on the periphery of the metal circuit layer (2) in the third step;

Step 5: Lay the nameplate layer (1) on the metal trace and the transparent conductive layer (4) in step three with a transparent optical adhesive.
The method of claim 4, wherein the molar concentration range of the sulfuric acid hydrogen peroxide mixture in the third step is between 4.0 MOL/L and 4.5 MOL/L.
The method of fabricating a touch panel having an intermediate conductive layer according to claim 4, wherein the grid pattern in the third step is a matrix of squares; wherein a single square has a side length of 0.35 mm and an etch line width of 60 μm; The thickness of the photoresist film in the second step ranges from 15 micrometers to 20 micrometers.
A method of fabricating a touch panel having an intermediate conductive layer according to claim 4, wherein the etching reaction time is from 30 seconds to 60 seconds.