WO2011160257A1 - Procédé et appareil pour assembler une structure de cellule solaire composite - Google Patents
Procédé et appareil pour assembler une structure de cellule solaire composite Download PDFInfo
- Publication number
- WO2011160257A1 WO2011160257A1 PCT/CN2010/000932 CN2010000932W WO2011160257A1 WO 2011160257 A1 WO2011160257 A1 WO 2011160257A1 CN 2010000932 W CN2010000932 W CN 2010000932W WO 2011160257 A1 WO2011160257 A1 WO 2011160257A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- solar cell
- bonding
- cell structure
- bonding material
- substrate
- Prior art date
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 66
- 238000000034 method Methods 0.000 title claims abstract description 43
- 239000000758 substrate Substances 0.000 claims abstract description 101
- 239000000463 material Substances 0.000 claims abstract description 86
- 239000010426 asphalt Substances 0.000 claims abstract description 22
- JOQJJORTANSCOY-UHFFFAOYSA-N C=CC1=CC=CC=C1.CCCCC=CC1=CC=CC=C1 Chemical compound C=CC1=CC=CC=C1.CCCCC=CC1=CC=CC=C1 JOQJJORTANSCOY-UHFFFAOYSA-N 0.000 claims description 9
- 238000002360 preparation method Methods 0.000 abstract description 12
- 230000008569 process Effects 0.000 description 19
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 16
- 238000004519 manufacturing process Methods 0.000 description 12
- 239000005038 ethylene vinyl acetate Substances 0.000 description 8
- 229910021417 amorphous silicon Inorganic materials 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 229910021424 microcrystalline silicon Inorganic materials 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 235000015096 spirit Nutrition 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to a method and apparatus for bonding a composite solar cell structure and, more particularly, to a method and apparatus for bonding a composite solar cell structure using an asphalt-based and/or tar-based bonding material.
- PV Photovoltaic devices
- solar cells are devices which convert sunlight into direct current (DC) electrical power.
- PV or solar cells typically have one or more p-i-n junctions. Each p-i-n junction includes a p-type layer, an intrinsic type layer, and a n-type layer.
- the sunlight is converted to electricity through the PV effect.
- PV solar cells may be tiled into larger modules. PV modules are created by connecting a number of PV solar cells and are then joined into panels with specific frames and connectors.
- a PV solar cell typically includes active regions and a transparent conductive oxide (TCO) film disposed as a front electrode and/or as a back electrode.
- the photoelectric conversion unit includes a p-type silicon layer, a n-type silicon layer, and an intrinsic type (i-type) silicon layer sandwiched between the p-type and n-type silicon layers.
- Several types of silicon films including microcrystalline silicon film ⁇ c-Si), amorphous silicon film (a-Si), polycrystalline silicon film (poly-Si) and the like may be utilized to form the p-type, n-type, and/or i-type layers of the photoelectric conversion unit.
- the backside contact may contain one or more conductive layers.
- solar cell devices such as the transparent conductive oxide, the active regions, the backside contact and the like are built on a substrate thus becoming a device substrate. Furthermore, the device substrate is bonded to a back substrate using a bonding material. [0005] To bond a solar cell composite structure, the device substrate, the back substrate, and the bonding material are transported into a bonding module to bond the back substrate to the device substrate. During the bonding process, the bonding material, such as Polyvinyl Butyral (PVB) or Ethylene Vinyl Acetate (EVA), is sandwiched between the back substrate and the device substrate.
- PV solar cell devices such as the transparent conductive oxide, the active regions, the backside contact and the like are built on a substrate thus becoming a device substrate. Furthermore, the device substrate is bonded to a back substrate using a bonding material.
- the bonding material such as Polyvinyl Butyral (PVB) or Ethylene Vinyl Acetate (EVA) is sandwiched between the back substrate and the device substrate.
- Heat and pressure are applied to the structure to form a bonded and sealed device using various heating elements and other devices found in the bonding module.
- the device substrate, the back substrate, and the bonding material thus form a composite solar cell structure that at least partially encapsulates the active regions of the solar cell device.
- PVB Polyvinyl Butyral
- EVA Ethylene Vinyl Acetate
- the composite solar cell structure may be further put into a separate autoclave module to remove trapped gasses in the bonded structure and assure that a sufficient bond is formed.
- a bonded solar cell structure is placed in the autoclave module where heat is delivered to reduce the amount of trapped gas and improve the properties of the bond between the device substrate, the back substrate, and the bonding material.
- the processes performed in the autoclave are also useful to assure that the stress in the glass and bonding layer (e.g., PVB layer) are more controlled to prevent future failures of the hermetic seal or failure of the glass due to the stress induced during the bonding process.
- the present invention generally relates to a method and apparatus for bonding a composite solar cell structure. More particularly, the invention provides a method and apparatus for bonding a composite solar cell structure using an asphalt-based and/or tar-based bonding material.
- One aspect of the invention generally provides an apparatus for bonding a composite solar cell structure.
- an apparatus for bonding a solar cell structure includes a preparation module and a bonding module.
- the preparation module is configured to prepare the composite solar cell structure by placing a bonding material over a device substrate having solar cell devices formed thereon and placing a back substrate over the bonding material and the device substrate, wherein the bonding material is an asphalt-based and/or tar-based material.
- the bonding module is configured to apply heat and pressure to the composite solar cell structure to bond the back substrate to the device substrate.
- Another aspect of the invention generally provides a method for bonding a composite solar cell structure.
- a method for bonding a composite solar cell structure includes preparing the composite solar cell structure and applying heat and pressure to the composite solar cell structure to bond the back substrate to the device substrate.
- Preparing the composite solar cell structure includes preparing a device substrate having solar cell devices formed thereon, placing a bonding material over the device substrate wherein the bonding material is an asphalt-based and/or tar-based material and placing a back substrate over the bonding material and the device substrate.
- the composite solar cell structure includes a device substrate having solar cell devices formed thereon, a bonding material formed over the device substrate wherein the bonding material is an asphalt-based and/or tar-based material, and a back substrate formed over the bonding material and the device substrate, wherein the back substrate is bonded to the device substrate using the bonding material.
- the method and apparatus according to the invention is used for bonding a composite solar cell structure. More particularly, the method and apparatus according to the invention bonds the composite solar cell structure using an asphalt-based and/or tar-based bonding material. Compared with typically used bonding materials such as PVB or EVA, the asphalt-based and/or tar-based bonding material is less expensive and has good moisture resistance, thus it costs less and the device yield is improved.
- FIG. 1 is a plan view of an apparatus for bonding a composite solar cell structure according to an embodiment of the invention.
- FIG. 2 is a simplified schematic diagram of a solar cell device formed by a solar cell production system.
- FIG. 3 is a plan view that schematically illustrates an example of the rear surface of the formed solar cell.
- FIG. 4 is a flow diagram depicting a method for bonding a composite solar cell structure according to a preferred embodiment of the invention.
- FIG. 5 is a flow diagram depicting sub-steps of the preparing step in FIG. 4.
- Embodiments of the invention generally provide a method and apparatus for bonding a composite solar cell structure using an asphalt-based and/or tar-based bonding material, which has the advantage of lowering the cost and increasing device yield without an expensive autoclaving process requirement.
- FIG. 1 is a plan view of an apparatus 100 for bonding a composite solar cell structure according to an embodiment of the invention.
- the apparatus 100 for bonding a composite solar cell structure is a portion (for example, a lamination module) of a solar cell production system (not shown) which is used for forming a solar cell device.
- a solar cell production system not shown
- FIG. 1 is a plan view of an apparatus 100 for bonding a composite solar cell structure according to an embodiment of the invention.
- the apparatus 100 for bonding a composite solar cell structure is a portion (for example, a lamination module) of a solar cell production system (not shown) which is used for forming a solar cell device.
- a solar cell production system not shown
- FIG. 1 is a plan view of an apparatus 100 for bonding a composite solar cell structure according to an embodiment of the invention.
- the apparatus 100 for bonding a composite solar cell structure is a portion (for example, a lamination module) of a solar cell production system (not shown) which is
- FIG. 2 is a simplified schematic diagram of a solar cell device 300 that can be formed by aforesaid solar cell production system.
- the solar cell 300 may include a substrate 302, such as a glass substrate, polymer substrate, metal substrate, or other suitable substrate, with thin films formed thereover. While a single junction type solar cell is illustrated in FIG. 2 this configuration is not intended to limit the scope of the invention described herein.
- the solar cell 300 further includes a first transparent conducting oxide (TCO) layer 310 (e.g., zinc oxide (ZnO), tin oxide (SnO)) formed over the substrate 302, a p-i-n junction 320 formed over the first TCO layer 310, a second TCO layer 340 formed over the first p-i-n junction 320, and a back contact layer 350 formed over the second TCO layer 340.
- TCO transparent conducting oxide
- ZnO zinc oxide
- SnO tin oxide
- the first p-i-n junction 320 may comprise a p-type amorphous silicon layer 322 , an intrinsic type amorphous silicon layer 324 formed over the p-type amorphous silicon layer 322 , and an n-type microcrystalline silicon layer 326 formed over the intrinsic type amorphous silicon layer 324.
- the solar cell 300 includes the substrate 302, the solar cell device elements (e.g., reference numerals 310 - 350), one or more internal electrical connections (e.g., side buss 355, cross-buss 356), a layer of bonding material 360, a back substrate 361, and a junction box 370.
- the solar cell device elements e.g., reference numerals 310 - 350
- one or more internal electrical connections e.g., side buss 355, cross-buss 356
- a layer of bonding material 360 e.g., a back substrate 361, and a junction box 370.
- the junction box 370 may generally contain two junction box terminals 371, 372 that are electrically connected to portions of the solar cell 300 through the side buss 355 and the cross-buss 356, which are in electrical communication with the back contact layer 350 and active regions of the solar cell 300.
- a substrate 302 having one or more of the deposited layers (e.g., reference numerals 310 - 350) and/or one or more internal electrical connections (e.g., side buss 355 , cross-buss 356) disposed thereon is generally referred to as a device substrate 303.
- the device substrate 303 that has been bonded to a back substrate 361 using a bonding material 360 is referred to as a composite solar cell structure 304.
- the bonding material 360 formed over the device substrate 303 is an asphalt-based and/or tar-based material, such as a Styrene-Butyl-Styrene material. Additionally, the back substrate 361 is bonded to the device substrate 303 using the bonding material 360, in one embodiment, using apparatus and method described below.
- the apparatus 100 for bonding the composite solar cell structure 304 includes a preparation module 102 and a bonding module 104.
- the apparatus 100 is used for bonding the back substrate 361 onto the device substrate 303.
- the device substrate 303 is formed by other processing modules of the solar cell production system and is transported to the preparation module 102 of the apparatus 100.
- the bonding material 360 is prepared to be placed between the back substrate 361 and the deposited layers on the device substrate 303 to form a hermetic seal to prevent the environment from attacking the solar cell during its life.
- the preparation module 102 is configured to prepare the composite solar cell structure 304. As shown in FIG. 1, the preparation module 102 includes a material preparation module 102 A, a glass loading module 102B, and a glass cleaning module 102C. 3 ⁇ 4.
- the bonding material 360 is prepared in the material preparation module 102 A and placed over the device substrate 303.
- the back substrate 361 is loaded into the loading module 102B and washed by the cleaning module 102C, and the back substrate 361 is then placed over the bonding material 360 and the device substrate 303.
- the bonding material 360 is an asphalt-based and/or tar-based material.
- the bonding material 360 can be made of a Styrene-Butyl-Styrene material.
- the asphalt-based and/or tar-based bonding materials are significantly less expensive, and have good moisture resistance, and thus help drive down the cost of solar module manufacturing.
- the bonding module 104 is configured to apply heat and pressure to the composite solar cell structure 304 to bond the back substrate 361 to the device substrate 303.
- the bonding material 360 such as Styrene-Butyl-Styrene (SBS)
- SBS Styrene-Butyl-Styrene
- the bonding module 104 heats the composite solar cell structure 304 up to at least 100 degrees Celsius and holds the composite solar cell structure 304 at least about 100 degrees for at least about ten minutes.
- sufficient bonding of the composite solar cell structure 304 can be established using the Styrene-Butyl-Styrene (SBS) bonding material 360.
- SBS Styrene-Butyl-Styrene
- pressure may be applied forcing the back substrate 361 against the device substrate 303 utilizing mechanical means such as a press, piston or rollers.
- a vacuum may be established within the bonding module 104 to pull the back substrate 361 and device substrate 303 together.
- the mechanical and/or vacuum develops a force of about 14.5 psi on the surface of the back substrate 361 to urge the back substrate 361 and device substrate 303 together.
- At least one hole formed in the back substrate 361 remains at least partially uncovered by the bonding material 360 to allow portions of the cross-buss 356 or the side buss 355 to remain exposed so that electrical connections of these regions of the solar cell structure 304 with the junction box 370 can be made in future processes.
- the composite solar cell structure 304 is transported to other processing modules of the solar cell production system for follow-up processes, so as to finish a complete solar cell device.
- FIG. 4 is a flow diagram depicting a method for bonding a composite solar cell structure according to a preferred embodiment of the invention
- FIG. 5 is a flow diagram depicting sub-steps of the preparing step in FIG. 4.
- the method of the invention can be practiced, but not limited to, in the above-mentioned apparatus 100 for bonding the composite solar cell structure.
- step 500 is performed to prepare a composite solar cell structure 304.
- step 500 further includes sub-steps 502, 504 and 506, as shown in FIG. 5.
- a device substrate 303 having solar cell devices formed thereon is provided.
- the device substrate 303 may be prepared by other processing modules of the solar cell production system.
- sub-step 504 is performed to place a bonding material 360 over the device substrate 303.
- the bonding material 360 is an asphalt-based and/or tar-based material.
- the bonding material 360 can be made of a Styrene-Butyl-Styrene material.
- sub-step 506 is performed to place a back substrate 361 over the bonding material 360 and the device substrate 303.
- the preparation step 500 including sub-steps 502, 504 and 506, may be performed in the preparation module 102 mentioned above to prepare the composite solar cell structure 304.
- step 510 is performed to apply heat and pressure to the composite solar cell structure 304 to bond the back substrate 361 to the device substrate 303.
- the bonding material 360 such as Styrene-Butyl-Styrene (SBS)
- SBS Styrene-Butyl-Styrene
- the heating elements may be in the form of IR lights, resistive heaters, and the like.
- step 510 the composite solar cell structure 304 is heated up to at least 100 degrees Celsius and the composite solar cell structure 304 is held at least about 100 degrees for at least about ten minutes.
- sufficient bonding of the composite solar cell structure 304 can be established using the Styrene-Butyl-Styrene (SBS) bonding material 360.
- SBS Styrene-Butyl-Styrene
- step 510 pressure may be applied forcing the back substrate
- a vacuum may be established within the bonding module 104 to pull the back substrate 361 and device substrate 303 together.
- the vacuum and/or mechanical means develops a force at least about 14.5 psi, on the surface of the back substrate 361 to urge the back substrate 361 against the device substrate 303.
- step 510 since the bonding established in step 510 using the asphalt-based and/or tar-based bonding material is sufficient for the composite solar cell structure 304, there is no need for a separate autoclaving process, which was required when using conventional PVB or EVA as the bonding material. Accordingly, the cost regarding autoclaving (e.g., autoclave tool cost, energy cost and time consumption) is eliminated.
- autoclaving e.g., autoclave tool cost, energy cost and time consumption
- the composite solar cell structure 304 is transported to other processing modules of the solar cell production system for follow-up processes, so as to finish a complete solar cell device.
- PVB Polyvinyl Butyl
- EVA Ethylene Vinyl Acetate
- the method and apparatus according to the invention bond the composite solar cell structure using an asphalt-based and/or tar-based bonding material. Since the asphalt-based and/or tar-based bonding material is less expensive and has good moisture resistance, the cost is lower and device yield is also improved. Additionally, bonding with the asphalt-based and/or tar-based bonding material in general requires lower process temperatures and shorter process time, thus further reducing the cost and power consumption required to fabricate a solar device.
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
Abstract
L'invention concerne un procédé et un appareil pour assembler une structure de cellule solaire composite. Dans un mode de réalisation, l'appareil pour assembler une structure de cellule solaire comprend un module de préparation et un module d'assemblage. Le module de préparation est configuré pour préparer la structure de cellule solaire composite en plaçant un liant sur un substrat de dispositif sur lequel sont formés des dispositifs de cellule solaire et placer un substrat arrière sur le liant et le substrat de dispositif, le liant étant un matériau à base de bitume et/ou de goudron. Le module d'assemblage est configuré pour appliquer de la chaleur et de la pression à la structure de cellule solaire composite afin de coller le substrat arrière au substrat de dispositif.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2010/000932 WO2011160257A1 (fr) | 2010-06-24 | 2010-06-24 | Procédé et appareil pour assembler une structure de cellule solaire composite |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/CN2010/000932 WO2011160257A1 (fr) | 2010-06-24 | 2010-06-24 | Procédé et appareil pour assembler une structure de cellule solaire composite |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2011160257A1 true WO2011160257A1 (fr) | 2011-12-29 |
Family
ID=45370806
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2010/000932 WO2011160257A1 (fr) | 2010-06-24 | 2010-06-24 | Procédé et appareil pour assembler une structure de cellule solaire composite |
Country Status (1)
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WO (1) | WO2011160257A1 (fr) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001094719A1 (fr) * | 2000-06-09 | 2001-12-13 | United Solar System Corporation | Module photovoltaique auto-adhesif |
CN1412861A (zh) * | 2001-10-12 | 2003-04-23 | 拜尔公司 | 具有热塑性热熔融体粘合剂层的光电组件和其生产方法 |
WO2009071627A2 (fr) * | 2007-12-04 | 2009-06-11 | Parabel Ag | Élément solaire multicouche |
CN101465386A (zh) * | 2007-12-18 | 2009-06-24 | 高岛株式会社 | 挠性膜状太阳能电池复层体 |
-
2010
- 2010-06-24 WO PCT/CN2010/000932 patent/WO2011160257A1/fr active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001094719A1 (fr) * | 2000-06-09 | 2001-12-13 | United Solar System Corporation | Module photovoltaique auto-adhesif |
CN1412861A (zh) * | 2001-10-12 | 2003-04-23 | 拜尔公司 | 具有热塑性热熔融体粘合剂层的光电组件和其生产方法 |
WO2009071627A2 (fr) * | 2007-12-04 | 2009-06-11 | Parabel Ag | Élément solaire multicouche |
CN101465386A (zh) * | 2007-12-18 | 2009-06-24 | 高岛株式会社 | 挠性膜状太阳能电池复层体 |
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