WO2011155529A1

WO2011155529A1 - Measurement member, stage device, exposure apparatus, exposure method, and method for manufacturing device

Info

Publication number: WO2011155529A1
Application number: PCT/JP2011/063139
Authority: WO
Inventors: 直正白石
Original assignee: 株式会社ニコン
Priority date: 2010-06-10
Filing date: 2011-06-08
Publication date: 2011-12-15

Abstract

Disclosed is a measurement member which is used for an exposure apparatus wherein a substrate is exposed to exposure light through a liquid. The measurement member comprises: a base that is capable of transmitting the exposure light; a conductive light-blocking film that is formed on the base and defines an opening into which the exposure light can enter through the liquid; and a conductive member that is connected to at least a part of the light-blocking film for the purpose of grounding the light-blocking film.

Description

Measuring member, stage apparatus, exposure apparatus, exposure method, and device manufacturing method

The present invention relates to a measurement member, a stage apparatus, an exposure apparatus, an exposure method, and a device manufacturing method.
This application claims priority based on Japanese Patent Application No. 2010-133200 filed on Jun. 10, 2010, the contents of which are incorporated herein.

In an exposure apparatus used in a photolithography process, an immersion exposure apparatus has been devised that exposes a substrate with exposure light through a liquid. The following patent document discloses an example of a technique related to an immersion exposure apparatus including a measurement member.

US Patent Application Publication No. 2007/242242

If the measurement member deteriorates, the measurement accuracy using the measurement member may be reduced. For example, when the measurement member has a measurement opening (pattern), if the measurement member deteriorates and the shape of the opening changes, the measurement accuracy using the measurement member may decrease. When exposure is performed based on a measurement result using a measurement member, if measurement accuracy decreases, an exposure failure may occur and a defective device may occur.

An object of an aspect of the present invention is to provide a measurement member and a stage device that can suppress a decrease in measurement accuracy. Another object of the present invention is to provide an exposure apparatus and an exposure method that can suppress the occurrence of exposure failure. Another object of the present invention is to provide a device manufacturing method that can suppress the occurrence of defective devices.

According to the first aspect of the present invention, there is provided a measuring member used in an exposure apparatus that exposes a substrate with exposure light through a liquid, the base member being capable of transmitting the exposure light, and the liquid formed on the base material. There is provided a measuring member comprising a conductive light shielding film that defines an opening through which exposure light can be incident, and a conductive member that is connected to at least a part of the light shielding film and grounds the light shielding film.

According to the second aspect of the present invention, there is provided a stage apparatus for an exposure apparatus that exposes a substrate with exposure light through a liquid, the holding part holding the measurement member of the first aspect, and a holding part. A movable part that can move the measurement member held by the holding part to a position where exposure light can be irradiated; and a ground part that contacts the conductive member of the measurement member held by the holding part to ground the light shielding film; A stage apparatus is provided.

According to a third aspect of the present invention, there is provided a stage apparatus for an exposure apparatus that exposes a substrate with exposure light through a liquid, the base material being capable of transmitting the exposure light, and formed on the base material through the liquid. A measuring member having a conductive light-shielding film that defines an opening through which exposure light can be incident, a holding unit that holds the measuring member, and a holding unit, and the exposure light passes through the measuring member held by the holding unit. A stage device is provided that includes a movable part that can be moved to an irradiable position and a grounding part that grounds the light shielding film of the measurement member held by the holding part.

According to the fourth aspect of the present invention, there is provided an exposure apparatus that exposes a substrate with exposure light through a liquid, the exposure apparatus including the measurement member of the first aspect.

According to the fifth aspect of the present invention, there is provided an exposure apparatus that exposes a substrate with exposure light through a liquid, and that includes at least one stage apparatus of the second and third aspects.

According to a sixth aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using at least one of the fourth and fifth exposure apparatuses and developing the exposed substrate. The

According to a seventh aspect of the present invention, there is provided a method for manufacturing a measuring member used in an exposure apparatus that exposes a substrate with exposure light through a liquid, wherein the first surface of a substrate that can transmit exposure light is electrically conductive. Forming a light-shielding film, forming an opening through which the exposure light can enter, forming a protective film so as to cover at least a part of the opening and the light-shielding film, Forming a conductive film so as to be connected to the light-shielding film on at least a part of a predetermined surface of the base material different from the first surface in a formed state, and removing the protective film Is provided.

According to an eighth aspect of the present invention, there is provided an exposure method for exposing a substrate with exposure light through a liquid, and grounding a conductive light-shielding film of a measurement member having an opening through which exposure light can be incident. And holding the liquid between the emission surface of the optical member that emits the exposure light and the measurement member, irradiating the exposure light to the opening through the liquid, and based on the measurement result using the measurement member, Exposing the substrate through a liquid.

According to the ninth aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure method according to the eighth aspect and developing the exposed substrate.

According to the aspect of the present invention, it is possible to suppress a decrease in measurement accuracy. Moreover, according to the aspect of the present invention, it is possible to suppress the occurrence of exposure failure. Moreover, according to the aspect of the present invention, the occurrence of defective devices can be suppressed.

It is a schematic block diagram which shows an example of the exposure apparatus which concerns on 1st Embodiment. It is a perspective view which shows an example of the measurement member which concerns on 1st Embodiment. It is a sectional side view which shows an example of the measuring member which concerns on 1st Embodiment. It is a perspective view which shows an example of the substrate stage and measurement stage which concern on 1st Embodiment. It is a perspective view which shows an example of the state by which the measurement member which concerns on 1st Embodiment is hold | maintained at the holding | maintenance part. It is a sectional side view which shows an example of the state by which the measuring member which concerns on 1st Embodiment is hold | maintained at the holding | maintenance part. It is a sectional side view which shows an example of the state by which the measuring member which concerns on 1st Embodiment is hold | maintained at the holding | maintenance part. It is a sectional side view which shows an example of the measuring member which concerns on 1st Embodiment. It is a sectional side view which shows an example of the measuring member which concerns on 1st Embodiment. It is a perspective view which shows an example of the measurement member which concerns on 2nd Embodiment. It is a perspective view which shows an example of the measurement member which concerns on 2nd Embodiment. It is a sectional side view which shows an example of the state by which the measurement member which concerns on 2nd Embodiment is hold | maintained at the holding | maintenance part. It is a sectional side view which shows an example of the state by which the measurement member which concerns on 2nd Embodiment is hold | maintained at the holding | maintenance part. It is a figure for demonstrating an example of the manufacturing method of the measuring member which concerns on 2nd Embodiment. It is a sectional side view which shows an example of the state by which the measurement member which concerns on 2nd Embodiment is hold | maintained at the holding | maintenance part. It is a sectional side view which shows an example of the measuring member which concerns on 2nd Embodiment. It is a perspective view which shows an example of the measurement member which concerns on 3rd Embodiment. It is a sectional side view which shows an example of the measuring member which concerns on 3rd Embodiment. It is a sectional side view which shows an example of the measuring member which concerns on 3rd Embodiment. It is a sectional side view which shows an example of the measuring member which concerns on 4th Embodiment. It is a sectional side view which shows an example of the measuring member which concerns on 4th Embodiment. It is a sectional side view which shows an example of the measuring member which concerns on 4th Embodiment. It is a sectional side view which shows an example of the measuring member which concerns on 5th Embodiment. It is a sectional side view which shows an example of the measurement stage which concerns on 6th Embodiment. It is a flowchart for demonstrating an example of the manufacturing process of a microdevice.

Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each part will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as an X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as a Y-axis direction, and a direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, a vertical direction) is defined as a Z-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

<First Embodiment>
A first embodiment will be described. FIG. 1 is a schematic block diagram that shows an example of an exposure apparatus EX according to the first embodiment. The exposure apparatus EX of the present embodiment is an immersion exposure apparatus that exposes a substrate P with exposure light EL through a liquid LQ. In the present embodiment, the exposure apparatus EX is an exposure apparatus having a substrate stage and a measurement stage as disclosed in, for example, US Pat. No. 6,897,963 and European Patent Application Publication No. 1713113. Will be described as an example.

In FIG. 1, the exposure apparatus EX holds a mask stage 1 that can move while holding a mask M, a substrate stage 2 that can move while holding a substrate P, and a measurement member C without holding the substrate P. A movable measurement stage 3, an illumination system IL that illuminates the mask M with the exposure light EL, a projection optical system PL that projects an image of the pattern of the mask M illuminated with the exposure light EL onto the substrate P, and a projection The liquid immersion member 4 capable of forming the liquid immersion space LS so that the optical path of the exposure light EL emitted from the optical system PL is filled with the liquid LQ, and the control device 5 that controls the operation of the entire exposure apparatus EX. Yes.

The immersion space is a space filled with liquid. In the present embodiment, water (pure water) is used as the liquid LQ. The mask M includes a reticle on which a device pattern projected onto the substrate P is formed. The substrate P is a substrate for manufacturing a device. The substrate P includes, for example, a semiconductor wafer and a photosensitive material film formed on the semiconductor wafer.

The illumination system IL irradiates the predetermined illumination area IR with the exposure light EL. The illumination area IR includes a position where the exposure light EL emitted from the illumination system IL can be irradiated. In the present embodiment, ArF excimer laser light is used as the exposure light EL emitted from the illumination system IL. Note that KrF excimer laser light may be used as the exposure light EL.

The mask stage 1 is movable on the guide surface 6G of the first surface plate 6. The mask stage 1 has a holding unit 7 that holds the mask M so as to be releasable. The mask stage 1 can move the mask M held by the holding unit 7 to a position where the exposure light EL emitted from the illumination system IL can be irradiated.

Projection optical system PL irradiates exposure light EL to a predetermined projection region PR. The projection optical system PL has an exit surface 9 that emits the exposure light EL toward the image plane of the projection optical system PL. Of the plurality of optical elements of the projection optical system PL, the terminal optical element 10 closest to the image plane of the projection optical system PL has the exit surface 9. The projection region PR includes a position where the exposure light EL emitted from the emission surface 9 can be irradiated. The projection optical system PL projects an image of the pattern of the mask M at a predetermined projection magnification onto at least a part of the substrate P arranged in the projection region PR. In the present embodiment, the exposure light EL emitted from the emission surface 9 travels in the −Z direction.

The substrate stage 2 and the measurement stage 3 are movable on the guide surface 11G of the second surface plate 11. The substrate stage 2 includes a holding unit 12 that holds the substrate P in a releasable manner. The substrate stage 2 can move the substrate P held by the holding unit 12 to a position where the exposure light EL emitted from the projection optical system PL can be irradiated. The measurement stage 3 includes a holding unit 13 that holds the measurement member C so as to be releasable. The measurement stage 3 can move the measurement member C held by the holding unit 13 to a position where the exposure light EL emitted from the projection optical system PL can be irradiated.

In this embodiment, the substrate stage 2 is disposed at least at a part around the holding unit 12 as disclosed in US Patent Application Publication No. 2007/0177125, US Patent Application Publication No. 2008/0049209, and the like. The holding member 14 holds the plate member T so as to be releasable. The measurement stage 3 includes a holding unit 15 that is disposed at least partially around the holding unit 13 and holds the plate member S in a releasable manner. In the present embodiment, the substrate stage 2, the plate member T, the measurement stage 3, and the plate member S having the holding unit 14 are formed of metal, for example, conductive ceramics. Note that at least one of the substrate stage 2, the plate member T, the measurement stage 3, and the plate member S may be formed of another conductive metal such as titanium. Further, the substrate stage 2, the plate member T, the measurement stage 3, and the plate member S may not be formed of the same conductive material.

The mask stage 1 can be moved by the operation of the drive system 8. The drive system 8 includes a planar motor having a mover 8 A disposed on the mask stage 1 and a stator 8 C disposed on the first surface plate 6. The mask stage 1 can move in six directions on the guide surface 6G in the X axis, Y axis, Z axis, θX, θY, and θZ directions by the operation of the drive system 8. Each of the substrate stage 2 and the measurement stage 3 can be moved by the operation of the drive system 16. The drive system 16 includes a planar motor having a mover 16 A disposed on the substrate stage 2, a mover 16 B disposed on the measurement stage 3, and a stator 16 C disposed on the second surface plate 11. Each of the substrate stage 2 and the measurement stage 3 can move in six directions on the guide surface 11G in the X axis, Y axis, Z axis, θX, θY, and θZ directions by the operation of the drive system 16. An example of a flat motor is disclosed in, for example, US Pat. No. 6,452,292.

The positions of the mask stage 1, the substrate stage 2, and the measurement stage 3 are measured by the interferometer system 17. When executing the exposure process of the substrate P or when executing a predetermined measurement process, the control device 5 operates the

drive systems

8 and 16 based on the measurement result of the interferometer system 17 to thereby perform the mask stage 1 (mask M ), Position control of the substrate stage 2 (substrate P) and the measurement stage 3 (measurement member C) is executed.

In the present embodiment, the exposure apparatus EX includes an aerial image measurement system 18 capable of measuring an aerial image (imaging characteristic) of the projection optical system PL as disclosed in, for example, US Patent Application Publication No. 2002/0041377. I have. In the present embodiment, the measurement member C constitutes a part of the aerial image measurement system 18.

Next, the measurement member C will be described. FIG. 2 is a perspective view showing an example of the measuring member C according to the present embodiment, and FIG. 3 is a side sectional view.

2 and 3, the measuring member C has a base material 21 that can transmit the exposure light EL, and a conductivity that is formed on the base material 21 and that defines the opening 22 through which the exposure light EL can enter through the liquid LQ. And a conductive member 24 that is connected to at least a part of the light shielding film 23 and grounds (grounds) the light shielding film 23. In the present embodiment, the conductive member 24 is formed of the same metal material as the plate member S, for example. The plate member S may be made of a different metal material, or may be made of the same metal material as the light shielding film.

In the present embodiment, the base material 21 is made of quartz glass. Quartz glass can transmit the exposure light EL. The base material 21 may be formed of a meteorite capable of transmitting the exposure light EL.

In the present embodiment, the base material 21 is substantially a rectangular parallelepiped. 2 and 3, the base material 21 includes an upper surface 25 facing the + Z direction, a lower surface 26 facing the −Z direction opposite to the upper surface 25, and a side surface 27 connecting the edge of the upper surface 25 and the edge of the lower surface 26. Have. The side surface 27 includes a first side surface 27A facing the + Y direction, a second side surface 27B facing the −Y direction, a third side surface 27C facing the + X direction, and a fourth side surface 27D facing the −X direction.

The light shielding film 23 is provided on the upper surface 25 of the substrate 21. The light shielding film 23 is conductive. The light shielding film 23 is light shielding with respect to the exposure light EL. In the present embodiment, the light shielding film 23 is made of chromium (Cr). In the present embodiment, the light shielding film 23 is disposed so that the lower surface 23B and the upper surface 25 of the light shielding film 23 are in contact with each other.

The light shielding film 23 blocks the passage of the exposure light EL irradiated to the upper surface 23A of the light shielding film 23. The light shielding film 23 may or may not block the irradiated exposure light EL. That is, the transmittance of the light shielding film 23 with respect to the exposure light EL may be 0%, or the light shielding film 23 may slightly transmit the exposure light EL as long as the exposure light EL can be measured with a desired accuracy. .

The opening 22 is defined by the light shielding film 23. The opening 22 is a portion where the light shielding film 23 is not provided on the upper surface 25. In the present embodiment, the opening 22 is disposed substantially at the center of the upper surface 25. In the present embodiment, the shape of the opening 22 in the XY plane parallel to the upper surface 25 is a slit shape that is long in the X-axis direction. In the present embodiment, a part of the base material 21 is exposed inside the opening 22. A part of the base material 21 may be covered with a member (film) that can transmit the exposure light EL inside the opening 22.

The conductive member 24 is connected to the light shielding film 23. The conductive member 24 is a member for grounding the light shielding film 23. In the present embodiment, the conductive member 24 includes a protruding portion 28 that at least partially protrudes to the outside of the base material 21. In the present embodiment, the conductive member 24 includes a pin member connected to the light shielding film 23 so that at least a part protrudes outside the light shielding film 23.

In the present embodiment, a plurality of conductive members 24 are arranged. In the present embodiment, a plurality of conductive members 24 are arranged around the opening 22. In the present embodiment, four conductive members 24 are arranged.

In the present embodiment, the conductive member 24 is connected to the upper surface 23A. Note that at least a part of the conductive member 24 may be disposed between the upper surface 25 and the lower surface 23B. That is, at least a part of the conductive member 24 may be disposed so as to be sandwiched between the base material 21 and the light shielding film 23.

4 is a perspective view illustrating an example of the substrate stage 2 and the measurement stage 3 according to the present embodiment, FIG. 5 is a perspective view illustrating the vicinity of the measurement member C held by the holding unit 13, and FIG. 6 is a holding unit. 13 is a side cross-sectional view showing the vicinity of a measurement member C held in FIG.

In this embodiment, the holding unit 13 includes a so-called pin chuck mechanism, and holds the measuring member C so as to be releasable. The holding unit 13 holds the measurement member C so that the upper surface FC of the measurement member C faces the + Z direction. In the present embodiment, the upper surface FC includes the upper surface 23 A and the upper surface 25 in the opening 22. In the present embodiment, the holding unit 13 holds the measurement member C so that the upper surface FC and the XY plane are substantially parallel. By holding the measuring member C on the holding unit 13, the opening 22 and the upper surface 23 A can face the emission surface 9.

The holding unit 15 includes a so-called pin chuck mechanism and holds the plate member S so as to be releasable. In the present embodiment, the holding unit 15 holds the plate member S so that the upper surface FS of the plate member S and the XY plane are substantially parallel to each other. In the present embodiment, the upper surface FC (upper surface 23A) of the measurement member C held by the holding unit 13 and the upper surface FS of the plate member S held by the holding unit 15 are arranged in substantially the same plane. (It is the same). Note that at least a part of the upper surface FS may be non-parallel to the XY plane or may include a curved surface. Further, at least a part of the upper surface FC may be non-parallel to the XY plane, or may include a curved surface.

The measurement member C is held by the holding unit 13 and mounted on the measurement stage 3. The plate member S held by the holding unit 15 is disposed around the measurement member C held by the holding unit 13. The plate member S has an opening 29 in which the measuring member C can be disposed. The measuring member C held by the holding unit 13 is disposed inside the opening 29 of the plate member S held by the holding unit 15.

In a state where the measurement member C is held by the holding unit 13, the conductive member 24 comes into contact with at least a part of the measurement stage 3. In the present embodiment, the conductive member 24 comes into contact with the plate member S held by the holding unit 15. In the present embodiment, the protruding portion 28 of the conductive member 24 is in contact with the plate member S. The light shielding film 23 is grounded when the conductive member 24 contacts at least a part of the measurement stage 3 (plate member S). In the present embodiment, the measurement stage 3 is grounded via the second surface plate 11. Further, the plate member S is in contact with the holding unit 15 of the measurement stage 3. When the conductive member 24 comes into contact with at least a part of the plate member S, the light shielding film 23 is grounded.

In the present embodiment, the base member 21 and the light shielding film 23 of the measuring member C held by the holding unit 13 and the plate member S held by the holding unit 15 are separated from each other. That is, a gap is formed between the side surface 27 of the base material 21 held by the holding unit 13 and the inner side surface 30 of the opening 29 of the plate member S held by the holding unit 15. Similarly, a gap is also formed between the light shielding film 23 and the plate member S. Note that at least a part of the substrate 21 and the plate member S may be in contact with each other, or at least a part of the light shielding film 23 and the plate member S may be in contact with each other.

In the present embodiment, the conductive member 24 is in contact with the upper surface FS, but may be in contact with the inner surface 30, for example.

As shown in FIG. 6, in the present embodiment, the exposure light EL emitted from the emission surface 9 is applied to the measuring member C via the liquid LQ in the immersion space LS. In the measurement process using the measurement member C, the liquid LQ is held between the last optical element 10 and the liquid immersion member 4 and the measurement member C. With the held liquid LQ, an immersion space LS is formed so that the optical path of the exposure light EL emitted from the emission surface 9 is filled with the liquid LQ.

The immersion member 4 is disposed at least at a part around the terminal optical element 10. The liquid immersion member 4 includes an opening 31 through which the exposure light EL emitted from the emission surface 9 can pass, and a lower surface 32 that is disposed around the opening 31 and can face the upper surface FC. The liquid immersion member 4 can hold the liquid LQ between the lower surface 32 and the upper surface FC facing the lower surface 32. The liquid immersion member 4 is made of a conductive metal such as titanium.

Further, the liquid immersion member 4 includes a supply port 33 capable of supplying the liquid LQ and a recovery port 34 capable of recovering the liquid LQ. The supply port 33 can supply the liquid LQ to the optical path of the exposure light EL emitted from the emission surface 9. In the present embodiment, the supply port 33 is disposed at a predetermined position of the liquid immersion member 4 so as to face the optical path of the exposure light EL. The supply port 33 is connected to the liquid supply device 35 via a supply channel. The liquid supply device 35 can deliver the liquid LQ. The supply port 33 supplies the liquid LQ supplied from the liquid supply device 35 to the optical path of the exposure light EL.

The recovery port 34 can recover at least a part of the liquid LQ on the measurement member C facing the lower surface 32. In the present embodiment, the recovery port 34 is disposed at a predetermined position of the liquid immersion member 4 so as to face the upper surface FC. In the present embodiment, a porous member 36 is disposed in the recovery port 34. The porous member 36 has a plurality of holes (openings or pores) through which the liquid LQ can pass. In the present embodiment, the liquid LQ on the measurement member C is collected through the hole of the porous member 36. In the present embodiment, the porous member 36 is a plate-like member. In the present embodiment, the lower surface 32 includes a flat surface disposed around the opening 31 and a lower surface of the porous member 36 disposed around the flat surface. Note that the porous member 36 may not be disposed in the recovery port 34. The recovery port 34 is connected to a liquid recovery device 37 via a recovery channel. The liquid recovery device 37 includes a vacuum system and can suck the liquid LQ. The liquid LQ recovered from the recovery port 34 is recovered by the liquid recovery device 37.

In the present embodiment, the recovery operation of the liquid LQ from the recovery port 34 is executed in parallel with the supply operation of the liquid LQ from the supply port 33, whereby the last optical element 10, the liquid immersion member 4, and the measurement member An immersion space LS is formed between C and C.

Note that the object that can form the immersion space LS by holding the liquid LQ between the terminal optical element 10 and the immersion member 4 is not limited to the measurement member C. An object that can move to a position facing the emission surface 9 and the lower surface 32 can hold the liquid LQ between the last optical element 10 and the liquid immersion member 4 to form the liquid immersion space LS. In the present embodiment, at least one of the plate member T (substrate stage 2), the substrate P held on the substrate stage 2, and the plate member S (measurement stage 3) is formed by the terminal optical element 10 and the liquid immersion member 4. The liquid immersion space LS can be formed while holding the liquid LQ therebetween. For example, in the exposure of the substrate P, the liquid LQ is held between the terminal optical element 10 and the liquid immersion member 4 and the substrate P so that the optical path of the exposure light EL emitted from the emission surface 9 is filled with the liquid LQ. Thus, the immersion space LS is formed.

In the present embodiment, the exposure apparatus EX employs a local liquid immersion method. As shown in FIG. 6, the interface (meniscus, edge) LG of the liquid LQ in the immersion space LS is formed between the lower surface 32 and the upper surface FC. In the present embodiment, the size of the immersion space LS in the XY plane is smaller than the measurement member C, but may be larger. For example, the interface LG may be disposed between the lower surface 32 and the upper surface FS in a state where the immersion space LS is formed so that the optical path between the emission surface 9 and the opening 22 is filled with the liquid LQ. .

Next, an example of measurement processing using the measurement member C will be described with reference to FIG. When executing the measurement process using the measurement member C, the control device 5 arranges the measurement member C at a position facing the emission surface 9. The liquid immersion space LS is formed by holding the liquid LQ supplied from the supply port 33 between the injection surface 9 and the lower surface 32 and the measurement member C. The liquid LQ in the immersion space LS contacts the emission surface 9, the lower surface 32, and the upper surface FC.

In order to measure the aerial image (imaging characteristic) of the projection optical system PL using the aerial image measurement system 18 including the measurement member C, the control device 5 emits the exposure light EL from the illumination system IL, and projects the projection optics. A measurement pattern arranged on the object plane side of the system PL is illuminated. The exposure light EL irradiated to the measurement pattern and passed through the projection optical system PL is emitted from the emission surface 9. The exposure light EL emitted from the emission surface 9 is applied to the opening 22 of the measurement member C through the liquid LQ in the immersion space LS.

The exposure light EL that has entered the opening 22 via the liquid LQ passes through the substrate 21 and is emitted from the lower surface 26. In the present embodiment, the optical element 38 of the aerial image measurement system 18 is disposed so as to contact the lower surface 26. The exposure light EL emitted from the lower surface 26 and passing through the optical element 38 is received by the light receiving element 39 of the aerial image measurement system 18. The control device 5 obtains an aerial image (imaging characteristic) of the projection optical system PL via the liquid LQ based on the light reception result of the light receiving element 39.

In the present embodiment, since the light shielding film 23 is grounded, deterioration of at least one of the light shielding film 23 and the opening 22 defined by the light shielding film 23 can be suppressed. For example, the deterioration (damage) of the light shielding film 23 in the vicinity of the opening 22 can be suppressed, and the change in the shape of the opening 22 can be suppressed.

For example, there is a possibility that electric charges (static electricity) are generated when the measuring member C and the liquid LQ come into contact with each other. For example, there is a possibility that electric charges are generated due to friction between the base material 21 exposed in the opening 22 and the liquid LQ. In addition, electric charges may be generated due to friction between the light shielding film 23 and the liquid LQ.

Further, there is a possibility that electric charges are generated when the measurement member C is irradiated with the exposure light EL. For example, irradiation of the exposure light EL with respect to the light shielding film 23 excites electrons inside the light shielding film 23, and accordingly electrons (photoelectrons) may be emitted, thereby generating charges. That is, there is a possibility that charges are generated by the photoelectric effect (external photoelectric effect) due to the exposure light EL irradiation. In addition, electric charges may be generated by the plasmon effect. Note that the charge generated by the exposure light EL irradiation may be generated not only in a state where the liquid LQ and the measurement member C are in contact but also in a state where they are not in contact.

If the generated charge is stored in the light-shielding film 23, that is, the state where the light-shielding film 23 is charged is left unattended, at least a part of the light-shielding film 23 may be damaged by, for example, discharge. For example, if the shape of the opening 22 changes or a hole is formed in a part of the light shielding film 23, the measurement accuracy using the measurement member C may be reduced.

According to the present embodiment, it is possible to suppress the measurement member C (light shielding film 23) from being charged by grounding the light shielding film 23. Therefore, it is possible to suppress the deterioration (damage) of the light shielding film 23.

Further, since components (such as the liquid immersion member 4) formed of the metal material of the exposure apparatus EX are grounded, the components and the light shielding film 23 are grounded by grounding the light shielding film 23 as in the present embodiment. And the discharge between the components and the light shielding film 23 can be suppressed. Note that not all of the components formed of the metal material of the exposure apparatus EX may be grounded. For example, the liquid immersion member 4 may not be grounded.

Next, an example of the operation of the exposure apparatus EX including the immersion exposure processing for the substrate P will be described.

After the measurement using the measurement member C is completed, the control device 5 starts exposure of the substrate P. The controller 5 exposes the exposure light EL emitted from the illumination system IL in a state where the immersion space LS is formed so that the optical path of the exposure light EL between the last optical element 10 and the substrate P is filled with the liquid LQ. The mask M is illuminated with. The exposure light EL that passes through the mask M illuminates the projection optical system PL and the liquid LQ in the immersion space LS. The exposure light EL that has passed through the mask M and the projection optical system PL is emitted from the emission surface 9. The exposure light EL emitted from the emission surface 9 is applied to the substrate P through the liquid LQ in the immersion space LS. Thereby, the pattern image of the mask M is projected onto the substrate P, and the substrate P is exposed with the exposure light EL.

The exposure apparatus EX of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that projects an image of the pattern of the mask M onto the substrate P while moving the mask M and the substrate P synchronously in a predetermined scanning direction. In the present embodiment, the scanning direction (synchronous movement direction) of the substrate P is the Y-axis direction, and the scanning direction (synchronous movement direction) of the mask M is also the Y-axis direction. The control device 5 moves the substrate P in the Y-axis direction with respect to the projection region PR of the projection optical system PL, and in the illumination region IR of the illumination system IL in synchronization with the movement of the substrate P in the Y-axis direction. On the other hand, the substrate P is exposed by irradiating the substrate P with the exposure light EL through the projection optical system PL and the liquid LQ while moving the mask M in the Y-axis direction.

In the present embodiment, the control device 5 exposes the substrate P through the liquid LQ based on the measurement result using the measurement member C. For example, the control device 5 adjusts the exposure condition based on the measurement result of the aerial image of the projection optical system PL measured using the measurement member C, and exposes the substrate P under the adjusted exposure condition. The exposure conditions include, for example, at least one of irradiation conditions of the exposure light EL and movement conditions of the substrate stage 2 (substrate P) with respect to the projection region PR.

As described above, according to the present embodiment, the grounding of the light shielding film 23 can suppress the deterioration of the light shielding film 23 or the change in the shape of the opening 22 defined by the light shielding film 23. Therefore, it is possible to suppress a decrease in measurement accuracy using the measurement member C, and it is possible to suppress the occurrence of defective exposure and the generation of defective devices.

In addition, as shown in FIG. 4, the measurement members Cb and Cc mounted on the measurement stage 3 may be grounded. In the present embodiment, the measurement member Cb constitutes a part of the illuminance unevenness measurement system 19 that can measure the illuminance unevenness of the exposure light EL as disclosed in, for example, US Pat. No. 4,465,368. The measurement member Cc has a reference mark measured by the alignment system 20 capable of measuring the alignment mark of the substrate P as disclosed in, for example, US Pat. No. 5,493,403. Note that the measurement member Cb is a wavefront as disclosed in, for example, an irradiation measurement system (illuminance measurement system) disclosed in, for example, US Patent Application Publication No. 2002/0061469, and in, for example, European Patent No. 1079223. It may constitute a part of a measurement system that measures the exposure light EL of the exposure light EL, such as an aberration measurement system.

In this embodiment, the shape of the measurement member Cb in the XY plane is substantially circular. The measurement member Cb includes a base material that can transmit the exposure light EL, and a conductive light shielding film 41 that is formed on the base material and defines an opening 40 through which the exposure light EL can enter through the liquid LQ. . In the present embodiment, the opening 40 is substantially circular. By grounding the light shielding film 41, deterioration of the light shielding film 41, deformation of the opening 40, and the like can be suppressed.

In the present embodiment, the measurement stage 3 has the holding portion 15 that holds the plate member S so as to be releasable, and the conductive member 24 contacts the plate member S. However, for example, the measurement stage 3 and the plate member S may be integrated. In this case, for example, as shown in FIG. 7, the conductive member 24 may come into contact with the upper surface F3 of the measurement stage 3B.

Note that the conductive member 24B may be provided on at least a part of the side surface 27, for example, like the measurement member C2 shown in FIG. In FIG. 8, the protrusion 28B of the conductive member 24B protrudes from the side surface 27 in each of the + Y direction and the −Y direction. Further, like the measurement member C3 illustrated in FIG. 9, the conductive member 24C may be provided on at least a part of the lower surface 26. In FIG. 9, the protruding portion 28C of the conductive member 24C protrudes from the lower surface 26 in the −Z direction. The light shielding film 23 is grounded by the

projections

28B and 28C coming into contact with the measurement stage 3 (plate member S).

In the present embodiment, the light shielding film 23 is provided so as to be in contact with the upper surface 25 of the base material 21, but a predetermined film may be disposed between the base material 21 and the light shielding film 23. The predetermined film may be, for example, a film for improving the adhesion between the base material 21 and the light shielding film 23, or may be a light shielding film different from the light shielding film 23. In the embodiment shown in FIGS. 8 and 9, a predetermined film may be disposed between the base material 21 and the

conductive members

24B and 24C.

In other words, the surface of the base material 21 (including at least one of the upper surface 25, the lower surface 26, and the side surface 27) may be a surface of quartz glass (or fluorite), or a surface of quartz glass (or fluorite). It may be a concept including the surface of a predetermined film covering the film.

Second Embodiment
Next, a second embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

FIG. 10 is a perspective view showing an example of the measuring member C4 according to the second embodiment. In FIG. 10, the measuring member C4 is connected to at least a part of the base material 21, the conductive light shielding film 23 that is formed on the base material 21 and defines the opening 22, and the light shielding film 23 is grounded. And a conductive member 24D. In the second embodiment, the conductive member 24 D is a conductive film provided on the base material 21. In the following description, the conductive member 24D is appropriately referred to as a conductive film 24D.

In the present embodiment, the conductive film 24D is provided on at least a part of the side surface 27. In the present embodiment, the conductive film 24D is disposed on the first side surface 27A and the second side surface 27B. In the present embodiment, the conductive film 24 D is in contact with the base material 21. A predetermined film may be disposed between the conductive film 24D and the base material 21.

Note that the conductive film 24D may be disposed on at least one of the third side surface 27C and the fourth side surface 27D.

Note that, like the measurement member C5 illustrated in FIG. 11, the conductive film 24E may be provided on a part of the second side surface 27B, or may be provided on a part of the fourth side surface 27D. Of course, the conductive film 24E may be provided not on the entire first side surface 27A but on a part of the first side surface 27A, or not on the entire surface of the third side surface 27C but on a part of the third side surface 27C. May be.

FIG. 12 is a side sectional view showing a state in which the measurement member C4 (C5) is held by the holding unit 13. In FIG. 12, the measurement stage 3 has a holding portion 15 that holds the plate member Sb. Also in this embodiment, the measurement stage 3 having the holding unit 13 and the holding unit 15 and the plate member Sb are formed of metal, for example, conductive ceramics. Further, the measurement stage 3 and the plate member Sb may be formed of other conductive metals such as titanium. Further, the measurement stage 3 and the plate member Sb may be formed of different metal materials. The plate member Sb has a grounding portion 45 for grounding the light shielding film 23 of the measuring member C4 (C5) held by the holding portion 15. In the present embodiment, the ground portion 45 is disposed on the inner side surface 30b of the plate member Sb. The ground portion 45 is disposed so as to protrude from the inner side surface 30b toward the center of the opening 29b of the plate member Sb. The ground part 45 is in contact with the conductive film 24D (24E). Thereby, the light shielding film 23 is grounded.

For example, the measurement stage 3 and the plate member Sb may be integrated. For example, as in the measurement stage 3C shown in FIG. 13, the ground portion 45B may be arranged on the inner surface 47 of the opening 46 of the measurement stage 3C on which the measurement member C4 (C5) can be arranged.

Next, an example of a method for manufacturing the measuring member C4 will be described with reference to FIG.

As shown in FIG. 14A, a process of forming a light shielding film 23 on the upper surface 25 of the substrate 21 is executed. In the present embodiment, a chromium (Cr) film having light shielding properties and conductivity is formed on the upper surface 25 by, for example, sputtering.

Next, as shown in FIG. 14B, a process of forming the opening 22 in the light shielding film 23 is executed. For example, a part of the light shielding film 23 is removed by using a photolithography method and an etching method. Thereby, an opening 22 is formed in the light shielding film 23.

Next, as shown in FIG. 14C, a protective film (mask member) 48 is formed so as to cover at least part of the opening 22 and the light shielding film 23.

Next, as shown in part (D) of FIG. 14, with the protective film 48 formed, the conductive film 24 D is connected to the light shielding film 23 on at least a part of the side surface 27 of the base material 21. It is formed. For example, a conductive film 24D is formed by forming a chromium film on the side surface 27 by at least one of a vapor deposition method and a sputtering method.

Thereafter, as shown in FIG. 14E, the protective film 48 is removed, whereby the measuring member C4 is manufactured.

Note that the conductive film 24 F may be formed on at least a part of the lower surface 26 of the base material 21 as in the measurement member C 6 illustrated in FIG. In the example shown in FIG. 15, the holding part 13 functions as a ground part in contact with the conductive film 24F.

In addition, like the measurement member C7 shown in FIG. 16, the protrusion part 28F is provided in at least one part of the base material 21F, and the electrically conductive film 24F may be arrange | positioned so that the protrusion part 28F may be covered.

<Third Embodiment>
Next, a third embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

FIG. 17 is a perspective view showing an example of the measuring member C8 according to the third embodiment, and FIG. 18 is a side sectional view. 17 and 18, the measurement member C8 includes a base material 21, a light shielding film 23 formed on the base material 21 to define the opening 22, a conductive member 24 for grounding the light shielding film 23, and the light shielding film 23. And a liquid repellent film 50 that is liquid repellent with respect to the liquid LQ.

In the present embodiment, the liquid repellent film 50 is insulative. In the present embodiment, the liquid repellent film 50 can transmit the exposure light EL. In the present embodiment, the liquid repellent film 50 is disposed so as to cover at least a part of the upper surface 23 A of the light shielding film 23 and the opening 22. The liquid repellent film 50 may not be disposed in the opening 22.

In the present embodiment, the liquid repellent film 50 includes an amorphous fluororesin as disclosed in, for example, International Publication No. 2005/055296. In the present embodiment, the liquid repellent film 50 is formed by “Cytop” manufactured by Asahi Glass Co., Ltd.

The liquid-repellent film 50 is, for example, “Vertrel® NC”, “Teflon® AF”, “Zonyl® TC” manufactured by Dupont, “Novec® EGC” manufactured by 3M, “Substance” manufactured by Merck, “Fluorosurf” manufactured by Fluoro Technology, It can also be formed by “Marvel Coat” manufactured by Hishoe Chemical Co., Ltd.

Note that the liquid repellent film 50 may not be able to transmit the exposure light EL. For example, when the liquid repellent film 50 is not disposed in the opening 22, the liquid repellent film 50 may not transmit the exposure light EL.

In the example shown in FIG. 17, the liquid repellent film 50 is disposed so as not to cover the conductive member 24, but may be disposed so as to cover the conductive member 24.

In the present embodiment, at least a part of the upper surface FCh of the measurement member C8 includes the surface of the liquid repellent film 50. The surface of the liquid repellent film 50 is in contact with the liquid LQ in the immersion space LS. Since at least a part of the upper surface FCh is the surface of the liquid repellent film 50, the measuring member C8 can satisfactorily form the immersion space LS between the upper surface FCh and the last optical element 10 and the liquid immersion member 4. . Further, after the immersion space LS has retreated from the upper surface FCh, the liquid LQ is suppressed from remaining on the upper surface FCh.

A measuring member C9 shown in FIG. 19 is a modification of the measuring member C8. The measurement member C9 includes the conductive film 24D described with reference to FIG. 10, and the liquid repellent film 50 is disposed so as to cover the light shielding film 23 connected to the conductive film 24D.

In the present embodiment, the upper surface FCh of the measurement member C8 (C9) that can face the emission surface 9 may include both the surface of the light shielding film 23 and the surface of the liquid repellent film 50. For example, the liquid repellent film 50 may be disposed on at least a part of the periphery of the opening 22 or may be disposed so as to surround the opening 22. Further, the liquid repellent film 50 is applied to at least a part of the periphery of the opening 22 so that the exposure light EL emitted from the emission surface 9 is not irradiated to the liquid repellent film 50 and is irradiated to the light shielding film 23 including the opening 22. It may be arranged.

<Fourth embodiment>
Next, a fourth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

FIG. 20 is a side sectional view showing an example of the measuring member C10 according to the fourth embodiment. The measuring member C10 has a light shielding film 23J formed on the base material 21. The light shielding film 23 J includes a first light shielding film 231 disposed on the upper surface 25 of the substrate 21 and a second light shielding film 232 that covers at least a part of the first light shielding film 231.

The first light shielding film 231 defines the first opening 221 and the second light shielding film 232 defines the second opening 222. In FIG. 20, the second opening 222 is larger than the first opening 221. The second opening 222 may be substantially the same size as the first opening 221 or may be smaller than the first opening 221. The exposure light EL emitted from the emission surface 9 is incident on the first and

second openings

221 and 222. The exposure light EL that has entered the first and

second openings

221 and 222 can pass through the substrate 21.

In the present embodiment, the first light shielding film 231 includes a material different from that of the second light shielding film 232. In the present embodiment, the first light shielding film 231 is made of chromium (Cr). The second light shielding film 232 is made of platinum (Pt). The first light shielding film 231 may be formed of platinum, and the second light shielding film 232 may be formed of chromium. Note that the first light shielding film 231 and the second light shielding film 232 may be formed of the same material.

In the present embodiment, since the light shielding film 23J is formed of two light shielding films, the first light shielding film 231 and the second light shielding film 232, the transmission of light can be sufficiently suppressed.

In the example shown in FIG. 20, the conductive member 24 is connected to the second light shielding film 232, but may be connected to the first light shielding film 231. Further, at least a part of the conductive member 24 may be sandwiched between the first light shielding film 231 and the second light shielding film 232.

Note that the conductive film 24K may be formed so as to be connected to the first light shielding film 231 as in the measurement member C11 illustrated in FIG. Note that, as illustrated in FIG. 22, the conductive film 24 L may be formed so as to be connected to the second light shielding film 232.

Note that an arbitrary number of three or more light shielding films may be stacked on the substrate 21.
Further, as in the third embodiment, a liquid repellent film may be formed so as to cover the first light shielding film 231 and the second light shielding film 232. In this case, a liquid repellent film may be formed so as to cover the

openings

221 and 222, or a liquid repellent film may be formed so that the exposure light EL is not irradiated.

<Fifth Embodiment>
Next, a fifth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

FIG. 23 is a diagram illustrating an example of the measurement member C13 according to the third embodiment. In FIG. 23, the measuring member C13 includes a base material 21, a light shielding film 23 formed on the base material 21, a liquid repellent film 50, and an insulating film 70 provided between the light shielding film 23 and the liquid repellent film 50. And have. At least a part of the upper surface FCm of the measuring member C13 includes the surface of the liquid repellent film 50.

An opening 71 is formed in a part of the insulating film 70. The insulating film 70 defines the opening 71. The opening 22 of the light shielding film 23 is disposed inside the opening 71 of the insulating film 70. Note that the insulating film 70 may cover the opening 22. For example, in the example shown in FIG. 23, the liquid repellent film 50 is disposed inside the opening 22, but the liquid repellent film 50 is not disposed inside the opening 22, and the insulating film 70 is disposed inside the opening 22. May be. For example, the insulating film 70 may be disposed inside the opening 22 so as to be in contact with the base material 21.

The upper surface FCm of the measurement member C13 that can face the emission surface 9 may include both the surface of the insulating film 70 and the surface of the liquid repellent film 50. For example, the liquid repellent film 50 is formed so that the exposure light EL from the emission surface 9 is irradiated to the opening 22 (light shielding film 23) through the insulating film 70 and the liquid repellent film 50 is not irradiated with the exposure light EL. May be.

In the present embodiment, the insulating film 70 includes silicon dioxide (SiO ₂ ). In the present embodiment, silicon dioxide includes SiO ₂ formed by a wet film forming method. The adhesion between the liquid repellent film 50 and the insulating film 70 is high. Also, the adhesion between the light shielding film 23 and the insulating film 70 is high. Adhesion to the liquid repellent film 50 can be enhanced by the insulating film 70 containing fine particles made of SiO ₂ . Even if the insulating film 70 includes fine particles made of magnesium fluoride (MgF ₂ ) or calcium fluoride (CaF ₂ ), the adhesion to the liquid repellent film 50 can be improved.
Note that the liquid repellent film 50 may not be provided on the insulating film 70.
Further, the light transmissive film 70 formed on the light shielding film 23 may not be insulating.
In the first to fourth embodiments described above, the light transmissive film 70 may be formed on the light shielding film so as to cover the light shielding film.

In the first to third and fifth embodiments described above, the light shielding film 23 is formed of chromium. However, a material other than chromium may be used. For example, the light shielding film 23 may be formed of at least one of gold, platinum, palladium, rhodium, ruthenium, iridium, tantalum, niobium, titanium, hafnium, zirconium, and nickel.

In the above-described fourth embodiment, one of the first light-shielding film 231 and the second light-shielding film 232 is chromium and the other is platinum. Of course, it is made of another conductive material. May be. For example, at least one of the first light-shielding film 231 and the second light-shielding film 232 may be formed of at least one of gold, palladium, rhodium, ruthenium, iridium, tantalum, niobium, titanium, hafnium, zirconium, and nickel. Good.

In the first to fifth embodiments described above, the light shielding film 23 may include a plurality of metals having light shielding properties. In other words, the light shielding film 23 may be made of an alloy. Further, the light shielding film 23 may include an insulating material such as a synthetic resin as long as it is light-shielding with respect to the exposure light EL and conductive. For example, the light shielding film 23 may include a so-called conductive resin.

<Sixth Embodiment>
Next, a sixth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

FIG. 24 is a side sectional view showing an example of the measurement stage 3 that holds the plate member Sc according to the sixth embodiment. Also in this embodiment, the measurement stage 3 having the holding part 13 and the holding part 15 and the plate member Sc are formed of metal, for example, conductive ceramics. Further, the measurement stage 3 and the plate member Sc may be formed of other conductive metals such as titanium. Moreover, the measurement stage 3 and the plate member Sc may be formed of different metal materials.

In the first to fifth embodiments described above, a conductive member (24 or the like) that contacts the light shielding film 23 is provided, and the light shielding film 23 is grounded by contacting the conductive member and the measurement stage 3 (plate member S). It was decided. As shown in FIG. 24, the conductive member of the measurement member C14 may be omitted. In the present embodiment, the plate member Sc includes a ground portion 45 C that contacts the light shielding film 23 of the measurement member C 14 held by the holding portion 13. By doing so, the light shielding film 23 can be grounded.

In each of the above-described embodiments, the measurement member (C or the like) is mounted on the measurement stage 3, but may be mounted on the substrate stage 2. When a plurality of measurement members are provided, some measurement members may be mounted on the substrate stage 2 and some measurement members may be mounted on the measurement stage 3.

In each of the above-described embodiments, the optical path on the exit side (image plane side) of the terminal optical element 10 of the projection optical system PL is filled with the liquid LQ. For example, this is disclosed in International Publication No. 2004/019128. As described above, it is possible to employ the projection optical system PL in which the optical path on the incident side (object plane side) of the last optical element 10 is also filled with the liquid LQ.

In each of the above embodiments, water is used as the liquid LQ, but a liquid other than water may be used. The liquid LQ is a film such as a photosensitive material (photoresist) that is transmissive to the exposure light EL, has a high refractive index with respect to the exposure light EL, and forms the surface of the projection optical system PL or the substrate P. Stable ones are preferable. For example, as the liquid LQ, a fluorine-based liquid such as hydrofluoroether (HFE), perfluorinated polyether (PFPE), or fomblin oil can be used. In addition, various fluids such as a supercritical fluid can be used as the liquid LQ.

As the substrate P in each of the above embodiments, not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

Further, in the step-and-repeat exposure, after the reduced image of the first pattern is transferred onto the substrate P using the projection optical system in a state where the first pattern and the substrate P are substantially stationary, In a state where the two patterns and the substrate P are substantially stationary, a reduced image of the second pattern may be partially exposed to the first pattern using the projection optical system and may be collectively exposed on the substrate P (stitch method). Lump exposure equipment). Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially overlapped and transferred on the substrate P, and the substrate P is sequentially moved.

Further, as disclosed in, for example, US Pat. No. 6,611,316, two mask patterns are synthesized on a substrate via a projection optical system, and one shot area on the substrate is substantially formed by one scanning exposure. In particular, the present invention can be applied to an exposure apparatus that performs double exposure simultaneously. The present invention can also be applied to proximity type exposure apparatuses, mirror projection aligners, and the like.

Further, the exposure apparatus EX may be a twin stage type exposure apparatus having a plurality of substrate stages as disclosed in, for example, US Pat. No. 6,341,007, US Pat. No. 6,208,407, US Pat. No. 6,262,796, and the like.

The type of exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern onto a substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). In addition, the present invention can be widely applied to an exposure apparatus for manufacturing a micromachine, MEMS, DNA chip, reticle, mask, or the like.

In each of the above-described embodiments, the position information of each stage is measured using an interferometer system including a laser interferometer. However, the present invention is not limited to this. For example, a scale (diffraction grating) provided in each stage You may use the encoder system which detects this.

In the above-described embodiment, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in US Pat. No. 6,778,257, a variable shaping mask (also called an electronic mask, an active mask, or an image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. It may be used. Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element.

In each of the above-described embodiments, the exposure apparatus provided with the projection optical system PL has been described as an example. However, the present invention can be applied to an exposure apparatus and an exposure method that do not use the projection optical system PL. For example, an immersion space can be formed between an optical member such as a lens and the substrate, and the substrate can be irradiated with exposure light through the optical member.

For example, as disclosed in International Publication No. 2001/035168, an exposure apparatus (lithography system) that exposes a line-and-space pattern on a substrate P by forming interference fringes on the substrate P. The present invention can also be applied.

The exposure apparatus EX of the above-described embodiment is manufactured by assembling various subsystems including the above-described components so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

As shown in FIG. 25, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate as a base material of the device. Substrate processing step 204, including substrate processing (exposure processing) including exposing the substrate with exposure light from the pattern of the mask and developing the exposed substrate according to the above-described embodiment, It is manufactured through a device assembly step (including processing processes such as a dicing process, a bonding process, and a packaging process) 205, an inspection step 206, and the like.

Note that the requirements of the above-described embodiments can be combined as appropriate. Some components may not be used. In addition, as long as it is permitted by law, the disclosure of all published publications and patent publications related to the exposure apparatus and the like cited in each of the above-described embodiments and modifications is used as a part of the description of the text.

DESCRIPTION OF SYMBOLS 2 ... Substrate stage, 3 ... Measurement stage, 9 ... Ejection surface, 10 ... Terminal optical element, 13 ... Holding part, 15 ... Holding part, 21 ... Base material, 22 ... Opening, 23 ... Light shielding film, 24 ... Conductive member, 25 ... Upper surface, 26 ... Lower surface, 27 ... Side surface, 28 ... Projection, 50 ... Liquid repellent film, 70 ... Insulating film, EL ... Exposure light, EX ... Exposure apparatus, LQ ... Liquid, LS ... Immersion space, P ... substrate

Claims

A measuring member used in an exposure apparatus that exposes a substrate with exposure light through a liquid,
A substrate capable of transmitting the exposure light;
A conductive light-shielding film that is formed on the substrate and defines an opening through which the exposure light can enter through the liquid;
And a conductive member connected to at least a part of the light shielding film for grounding the light shielding film.
The exposure apparatus includes a movable member movable to a position where the exposure light can be irradiated,
The measuring member according to claim 1, wherein the light shielding film is grounded when the conductive member contacts at least a part of the movable member.
3. The measuring member according to claim 2, wherein the conductive member includes a protrusion that contacts at least a part of the movable member.
The measuring member according to any one of claims 1 to 3, wherein the conductive member includes a conductive film provided on the base material.
The light shielding film is provided on the first surface of the substrate,
The measuring member according to any one of claims 1 to 4, wherein the conductive member is provided on at least a part of a predetermined surface different from the first surface of the base material.
The measurement member according to claim 5, wherein the predetermined surface includes at least one of a second surface facing in a direction opposite to the first surface and a third surface connecting an edge of the first surface and an edge of the second surface. .
The measuring member according to any one of claims 1 to 6, further comprising a liquid repellent film that is disposed so as to cover at least part of the light shielding film and is liquid repellent with respect to the liquid.
The measuring member according to claim 7, further comprising an insulating film provided between the light shielding film and the liquid repellent film.
The measurement member according to any one of claims 1 to 8, wherein the light shielding film includes a first light shielding film and a second light shielding film covering at least a part of the first light shielding film.
The measurement member according to claim 9, wherein the first light shielding film includes a material different from that of the second light shielding film.
A stage device of an exposure apparatus that exposes a substrate with exposure light through a liquid,
A holding part for holding the measuring member according to any one of claims 1 to 10,
A movable part provided with the holding part, and movable to a position where exposure light can be irradiated to the measurement member held by the holding part;
A stage device comprising: an earthing part that contacts the conductive member of the measuring member held by the holding part and grounds the light shielding film.
A stage device of an exposure apparatus that exposes a substrate with exposure light through a liquid,
A measuring member having a base material capable of transmitting the exposure light, and a conductive light-shielding film that is formed on the base material and defines an opening through which the exposure light can enter through the liquid;
A holding unit for holding the measurement member;
A movable part provided with the holding part, and movable to a position where exposure light can be irradiated to the measurement member held by the holding part;
A stage device comprising: an earthing portion for earthing the light shielding film of the measuring member held by the holding portion.
13. The stage apparatus according to claim 12, wherein the ground portion is in contact with the light shielding film.
An exposure apparatus that exposes a substrate with exposure light through a liquid,
An exposure apparatus comprising the measurement member according to any one of claims 1 to 10.
An exposure apparatus that exposes a substrate with exposure light through a liquid,
An exposure apparatus comprising the stage apparatus according to any one of claims 11 to 13.
Exposing the substrate using the exposure apparatus according to claim 14 or 15,
Developing the exposed substrate; and a device manufacturing method.
A method of manufacturing a measuring member used in an exposure apparatus that exposes a substrate with exposure light through a liquid,
Forming a conductive light-shielding film on the first surface of the substrate capable of transmitting exposure light;
Forming an opening through which the exposure light can enter in the light shielding film;
Forming a protective film so as to cover at least a part of the opening and the light shielding film;
Forming a conductive film so as to be connected to the light shielding film on at least a part of the predetermined surface of the base material different from the first surface in a state where the protective film is formed;
Removing the protective film.
An exposure method for exposing a substrate with exposure light through a liquid,
Grounding the conductive light-shielding film of the measurement member in which an opening through which the exposure light can be incident is formed;
Holding a liquid between the exit surface of the optical member that emits the exposure light and the measurement member, and irradiating the opening with the exposure light through the liquid;
Exposing the substrate through the liquid based on a measurement result using the measurement member.
Exposing the substrate using the exposure method according to claim 18;
Developing the exposed substrate. A device manufacturing method.