WO2011145853A2 - Ultrasonic bonding method using adhesive film - Google Patents

Ultrasonic bonding method using adhesive film Download PDF

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Publication number
WO2011145853A2
WO2011145853A2 PCT/KR2011/003600 KR2011003600W WO2011145853A2 WO 2011145853 A2 WO2011145853 A2 WO 2011145853A2 KR 2011003600 W KR2011003600 W KR 2011003600W WO 2011145853 A2 WO2011145853 A2 WO 2011145853A2
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WO
WIPO (PCT)
Prior art keywords
adhesive film
bonding method
film
ultrasonic bonding
resin
Prior art date
Application number
PCT/KR2011/003600
Other languages
French (fr)
Korean (ko)
Other versions
WO2011145853A3 (en
Inventor
김석진
윤성호
송철규
공예순
안덕모
Original Assignee
주식회사 아이케이엠
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Publication date
Priority claimed from KR1020110018260A external-priority patent/KR101116144B1/en
Application filed by 주식회사 아이케이엠 filed Critical 주식회사 아이케이엠
Publication of WO2011145853A2 publication Critical patent/WO2011145853A2/en
Publication of WO2011145853A3 publication Critical patent/WO2011145853A3/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/481—Non-reactive adhesives, e.g. physically hardening adhesives
    • B29C65/4815—Hot melt adhesives, e.g. thermoplastic adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
    • B29C65/4835—Heat curing adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
    • B29C65/5057—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like positioned between the surfaces to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/12—Joint cross-sections combining only two joint-segments; Tongue and groove joints; Tenon and mortise joints; Stepped joint cross-sections
    • B29C66/122—Joint cross-sections combining only two joint-segments, i.e. one of the parts to be joined comprising only two joint-segments in the joint cross-section
    • B29C66/1222—Joint cross-sections combining only two joint-segments, i.e. one of the parts to be joined comprising only two joint-segments in the joint cross-section comprising at least a lapped joint-segment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/12—Joint cross-sections combining only two joint-segments; Tongue and groove joints; Tenon and mortise joints; Stepped joint cross-sections
    • B29C66/122—Joint cross-sections combining only two joint-segments, i.e. one of the parts to be joined comprising only two joint-segments in the joint cross-section
    • B29C66/1224—Joint cross-sections combining only two joint-segments, i.e. one of the parts to be joined comprising only two joint-segments in the joint cross-section comprising at least a butt joint-segment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/20—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines
    • B29C66/24—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight
    • B29C66/242—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours
    • B29C66/2424—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours being a closed polygonal chain
    • B29C66/24243—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours being a closed polygonal chain forming a quadrilateral
    • B29C66/24244—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours being a closed polygonal chain forming a quadrilateral forming a rectangle
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/53—Joining single elements to tubular articles, hollow articles or bars
    • B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
    • B29C66/5346—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat
    • B29C66/53461—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat joining substantially flat covers and/or substantially flat bottoms to open ends of container bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/61—Joining from or joining on the inside
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools
    • B29C66/8322—Joining or pressing tools reciprocating along one axis
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive

Definitions

  • the present invention relates to an ultrasonic bonding method, and more particularly to an ultrasonic bonding method using an adhesive film.
  • any one of the two adherends must be made of a material capable of transferring heat (SUS, metal, etc.). That is, since heat must be transferred to the heat-sealed film between the adherends, one of the adherends should be a material having high thermal conductivity.
  • Such a conventional heat-sealed film has a problem that the adherend is deformed by heat before the first and second fusion films are melted when the two adherends have low thermal conductivity, for example, a synthetic resin. Therefore, other bonding methods should be used.
  • adhesive can be used instead of double-sided tape, but in the case of adhesive, it is pressed to the jig for more than 6 hours after bonding, and post-processing is performed. Complete curing takes more than 24 hours after pressing, and productivity decreases considerably due to time problems. There was a problem.
  • Republic of Korea Patent No. 10-0936740 and the heated film made of a conductor A first fusion film bonded to one surface of the film to be heated; A second fusion film bonded to the other surface of the film to be heated;
  • a bonding method for bonding a case for a mobile terminal and a liquid crystal cover to each other using a high frequency heat-sealing film comprising a base film detachably attached to a second fusion film in a direction opposite to a film to be heated has been disclosed.
  • a heat fusion film containing a conductor In the conventional bonding method using high frequency induction heating, a heat fusion film containing a conductor must be used in such a manner as to generate heat in a heated film made of a conductor using a current generated by induction heating on the conductor to melt the heat fusion film. do. Therefore, the heat-sealing film may be damaged due to the conductor during the production of the heat-sealed film, and in the first welding operation, the conductor connection part, which is an intermediate substrate, may be cut even after minute pressurization after setting the jig. This melting phenomenon may occur and rework is impossible. In addition, the conductor must be used and the production process of the heat-sealed film is complicated, there is a problem that the production cost increases.
  • An object of the present invention is to melt the adhesive film selectively by using an ultrasonic bonding method using a thermoplastic adhesive film or a thermosetting adhesive film to simultaneously change the appearance and quality of the first coating member and the second coating member without changing the first coating
  • An object of the present invention is to provide a bonding method for improving adhesion between the member and the second adherend member.
  • Another object of the present invention is easily converted operation for forming the shape of the adhesive film for the adhesive film by using an adhesive film that does not use a conductor deposition member to be bonded using a PRESS or SEALING equipment and, when gajeop process
  • the purpose of the present invention is to provide a method of joining in which defects are significantly reduced after jig setting.
  • Still another object of the present invention is to provide an ultrasonic bonding method capable of reworking when a problem occurs by using a thermoplastic adhesive film.
  • step (a)
  • the second deposition member is formed to be in contact with the bonded adhesive film, the second deposition member is pressed in the direction of the first deposition member, and the ultrasonic vibration is applied to the first deposition member by using an ultrasonic generator. It is applied to at least one selected from the film and the second adhesion member is characterized in that the bonding step of bonding or bonding the second adhesion member and the first adhesion member by melting or curing the adhesive film.
  • the display cover or decorative member is formed to be in contact with the bonded adhesive film, the display cover or decorative member is pressed in the direction of the case, and the ultrasonic vibration is selected using a ultrasonic generator to select the case, the display cover or the decorative member, and the adhesive film. Applying at least one melted or cured adhesive film bonding step of bonding the display cover or decorative member with the case;
  • Ultrasonic bonding method using an adhesive film characterized in that it may be provided.
  • the amplitude of the ultrasonic wave is characterized in that 10 to 50 ⁇ m, more preferably 25 to 40 ⁇ m.
  • the melting point of the adhesive film is characterized in that the melting point of the first and second adhesion members and lower than any one of the lower melting point.
  • the melting point of the adhesive film is 20 °C or more, more preferably 20 to 100 °C, even more preferred than any one of the first melting point and the lower melting point of the second adhered member. Preferably it is characterized by low 20 to 50 °C.
  • the adhesive film is characterized in that at least one selected from a thermoplastic adhesive film and a thermosetting adhesive film.
  • the thermoplastic adhesive film is polyester, polyolefin, polyethylene, polypropylene, ethylene-propylene copolymer, ethylene- ⁇ -olefin copolymer, polystyrene, vinyl chloride resin, polycarbonate, polyimide, poly Amide (nylon), phenoxy resin, acrylic resin, acrylonitrile butadiene styrene, butadiene styrene, polyarylate, polyacetal, polyethylene terephthalate, polybutylene terephthalate, polyether ether ketone, polyphenylene sulfide, polybenzo It may include one or more selected from the group consisting of imidazole, polyetherimide, polyethersulfone, polyetheretherketone, acrylic resin and ethylene-acryl copolymer.
  • thermosetting adhesive film may include a thermosetting component.
  • thermosetting adhesive film is
  • thermosetting component At least one selected from a thermosetting component and a curing agent
  • thermoplastic components At least one selected from thermoplastic components and rubber components;
  • the thermosetting component is phenolic resin, melamine resin, melamineisocyanaturate addut, epoxy resin, polycaprolactone modified epoxy resin, glycidyl ethylene copolymer and melamine It may be at least one selected from the group consisting of a cyanouric acid composite.
  • the curing agent is an aromatic amine compound, anhydride, phenol resin, polyamide, dicyanamide (DICY), dihydride compound, amine duct compound, imidazole compound, hydrazine compound, Urea compound, 2-phenyl-4-methyl-5-hydroxy methylimidazole, 3- (3,4-dichlorophenyl) -1,1-dimethylurea (DCMU), sulfonium salt, phosphonium salt, biphenyl It may be at least one member selected from the group consisting of ether blockcarboxylic acid and polycarboxylic acid active ester.
  • the thermoplastic component may be polyester, polyolefin, polyethylene, polypropylene, ethylene-propylene copolymer, ethylene- ⁇ -olefin copolymer, polystyrene, vinyl chloride resin, polycarbonate, polyimide, polyamide ( Nylon), phenoxy resin, acrylic resin, acrylonitrile butadiene styrene, butadiene styrene, polyarylate, polyacetal, polyethylene terephthalate, polybutylene terephthalate, polyether ether ketone, polyphenylene sulfide, polybenzoimidazole It may be at least one selected from the group consisting of liquid crystal polymer, polyetherimide, polyethersulfone, polyetheretherketone, acrylic resin and ethylene-acryl copolymer.
  • the rubber component is ethylene propylene diene rubber (EPDM), nitrile rubber (acrylonitrile butadiene rubber), styrene-butadiene resin (styrene butadiene resin), butyl rubber, natural rubber, styrene-butadiene-acrylic resin ( styrene butadiene arcryl resin), chloroprene rubber, ultra low density ethylene- ⁇ -olefin copolymer and silicone rubber.
  • EPDM ethylene propylene diene rubber
  • nitrile rubber acrylonitrile butadiene rubber
  • styrene-butadiene resin styrene butadiene resin
  • butyl rubber natural rubber
  • styrene-butadiene-acrylic resin styrene butadiene arcryl resin
  • chloroprene rubber ultra low density ethylene- ⁇ -olefin copolymer and silicone rubber.
  • the ultrasonic bonding method using a thermoplastic adhesive film or a thermosetting adhesive film may be selectively melted and / or cured a thermoplastic or thermosetting adhesive film to change the appearance and quality of a member such as a case and a display cover. It is possible to provide a bonding method that improves adhesion without giving.
  • the ultrasonic bonding method using the thermoplastic adhesive film or the thermosetting adhesive film according to the present invention is the shape of the adhesive film for the adhered member to be bonded to the adhesive film by using the PRESS or SEALING equipment by using the adhesive film not using a conductor the converting operation of forming can be easily and to provide a bonding method is significantly less defects after setting jig at gajeop process.
  • the ultrasonic bonding method using the adhesive film according to the present invention can provide an ultrasonic bonding method that can be reworked if a problem occurs by using a thermoplastic adhesive film.
  • FIG. 1 is a schematic process diagram showing an ultrasonic bonding method using an adhesive film according to an embodiment of the present invention.
  • FIG. 2 is a view showing an ultrasonic bonding method using an adhesive film according to an embodiment of the present invention.
  • FIG 3 is a view showing a temporary welding step using an adhesive film according to an embodiment of the present invention.
  • FIG. 4 is a view showing a part of the mobile phone bonded using an adhesive film according to an embodiment of the present invention.
  • FIG. 5 is a view showing a bonding step using an adhesive film according to an embodiment of the present invention.
  • the present invention relates to an ultrasonic bonding method using an adhesive film.
  • an ultrasonic bonding method of the first deposition member and the second deposition member using an adhesive film and as an embodiment of the case and display cover or decorative member for IT-related electronic products and mobile terminals It provides an ultrasonic bonding method, which will be described in detail below.
  • the adhesive film in the present invention means a thermoplastic adhesive film and / or a thermosetting adhesive film.
  • FIG. 1 is a schematic process chart showing a bonding method using an adhesive film according to an embodiment of the present invention.
  • the bonding method using the adhesive film according to the exemplary embodiment of the present invention includes a temporary welding step S10, a degreasing step S20, and a bonding step S30.
  • FIG. 2 is a view showing a bonding method using an adhesive film according to an embodiment of the present invention.
  • Figure 3 shows the temporary welding step (S10)
  • Figure 4 is a view showing the case structure and parts of the electronic products bonded using the adhesive film according to an embodiment of the present invention
  • Figure 5 shows the contact step (S30) It is shown.
  • one embodiment of the present invention comprises the steps of (a) forming the adhesive film 20 in contact with the first adhered member 10; And
  • step (a)
  • the second adhesion member 40 is formed to be in contact with the adhesive film 20, and the second adhesion member 40 is pressed in the direction of the first adhesion member 10, and the ultrasonic generator Ultrasonic vibration is applied to at least one selected from the first adherent member 10, the adhesive film 20, and the second adherent member 40 by using the melted and / or cured adhesive film 20 to the second adherent.
  • Ultrasonic bonding method using an adhesive film characterized in that the bonding step of bonding the member 40 and the first adhered member 10 to each other.
  • the adhesive film 130 is in the mounting groove of the case 110 together with the base film 150 Inserted and disposed, the adhesive film 130 is disposed to face one surface of the case (110).
  • the base film 150 is pressed and heated in the direction of the case 110 for about 0.5 to 10 seconds with the heated mold 50.
  • the lower part of the case 110 is mounted with a jig 160 to fit the product to be set so that the case 110 is not bent.
  • the mold 50 is heated to 100 to 170 ° C. and compressed for 0.5 to 10 seconds, and the temperature of the mold 50 is lower than the melting point of the base film 150 and the adhesive film 130.
  • the melting point of the base film 150 is higher than the melting point of the adhesive film 130.
  • the temperature of the mold 50 is lower than the melting point of the base film 150 and the adhesive film 130, but is closer to the melting point of the adhesive film 130 than the base film 150.
  • the base film 150 when the base film 150 is pressed and heated with the mold 50, the base film 150 is not melted, and the adhesive film 130 receives the pressure and heat of the mold 50 transferred through the base film 150. It is heated for a time of 0.5 ⁇ 10 seconds according to the time of the temporary welding equipment is welded to the case 110.
  • the melting point of the base film 150 is higher than the melting point of the adhesive film 130, and the temperature of the mold 50 is smaller than the melting point of the base film 150 and the adhesive film 130 in the temporary welding step S10.
  • the deformation of the base film 150 may be minimized by bringing the temperature of the mold 50 closer to the melting point of the adhesive film 130 than the melting point of the base film 150.
  • the base film 150 is removed from the adhesive film 130.
  • the base film 150 is easily attached to the adhesive film so that it falls off easily.
  • the base film 150 is detachably attached to the adhesive film 130, thereby facilitating the removal of the base film 150 during assembly work, thereby improving workability.
  • one surface of the adhesive film 130 from which the base film 150 has been removed from the display cover 120 or the decorative member and the horn 60 of the ultrasonic equipment is removed.
  • the adhesive film 130 is melted and / or hardened to bond to the case 110.
  • an embodiment of the present invention may provide a method of adhering a mobile phone case and a display cover or a decorative member.
  • the display cover is used to protect the display or to cover the display for decorative purposes
  • the decorative member is used to enhance the appearance of the case of an electronic product such as a mobile phone or to increase the strength of the case.
  • the decorative member 125 may be bonded to the case by the ultrasonic bonding method of the present invention in the same manner as for bonding the display cover 120 and the case.
  • the display cover 120 is inserted into the mounting groove so as to be in contact with the adhesive film 130, and the display cover 120 is pressed in the direction of the case 110 by the horn 60 of the ultrasonic wave generating equipment. .
  • the jig 160 of the product is disposed under the case 110 so that the case 110 is not bent.
  • the ultrasonic generator to apply the ultrasonic vibration to the display cover 120, the adhesive film 130 and the case 110 from the horn 60 through the horn 60 and transfer the vibration energy to the display cover 120 and
  • the adhesive film 130 having a lower melting point than that of the case 110 is selectively melted and / or cured.
  • the amplitude of the ultrasonic waves generated by the ultrasonic generator is 10 to 50 ⁇ m, more preferably 25 to 40 ⁇ m. If the amplitude is less than 10 ⁇ m, the friction temperature is low, and if it exceeds 50 ⁇ m, the adhered member may be damaged.
  • the time for applying the ultrasound may be 0.5 to 30 seconds. If the ultrasonic application time is less than 0.5 seconds may not generate sufficient frictional heat, if it exceeds 30 seconds may cause deformation of the product.
  • the melting point of the adhesive film of the present invention is characterized in that the melting point of the first coating member and the second coating member is lower than any one of the lower melting point, more preferably the adhesive film
  • the melting point of is preferably 20 ° C. or more, more preferably 20 to 100 ° C., even more preferably 20 to 50 ° C. lower than any one of the melting points of the first and second adherends. If the melting point of the adhesive film is higher than that of the first or second deposition member, when the ultrasonic wave is applied, the first deposition member or the second deposition member is melted first, and the adhesive film is not melted. May not be bonded.
  • thermoplastic adhesive film or a thermosetting adhesive film may be used alone or in combination of two or more.
  • the thermoplastic adhesive film is polyester, polyolefin, polyethylene, polypropylene, ethylene-propylene copolymer, ethylene- ⁇ -olefin copolymer, polystyrene, vinyl chloride resin, polycarbonate, polyimide, Polyamide (nylon), phenoxy resin, acrylic resin, acrylonitrile butadiene styrene, butadiene styrene, polyarylate, polyacetal, polyethylene terephthalate, polybutylene terephthalate, polyether ether ketone, polyphenylene sulfide, poly Benzimidazole, polyetherimide, polyethersulfone, polyetheretherketone, acrylic resin or ethylene-acryl copolymer may be included alone or in combination of two or more.
  • thermosetting adhesive film may include a thermosetting component.
  • the thermosetting adhesive film is at least one selected from a thermosetting component and a curing agent; Or at least one selected from thermoplastic components and rubber components; alone or two or more kinds thereof may be included.
  • the thermosetting component is a phenol resin, melamine resin, melamine-isocyanaturate addut, epoxy resin, polycaprolactone modified epoxy resin, glycidyl ethylene copolymer or melamine
  • the cyanouric acid composite may be used alone or in combination of two or more thereof.
  • an aromatic amine compound, anhydride, phenol resin, polyamide, dicyandiamide (DICY), dihydride compound, amine duct compound, imidazole compound, hydrazine compound, Urea compound, 2-phenyl-4-methyl-5-hydroxy methylimidazole, 3- (3,4-dichlorophenyl) -1,1-dimethylurea (DCMU), sulfonium salt, phosphonium salt, biphenyl Ethelblockcarboxylic acid or a polycarboxylic acid active ester can be used individually or in combination of 2 or more types.
  • the thermoplastic component is polyester, polyolefin, polyethylene, polypropylene, ethylene-propylene copolymer, ethylene- ⁇ -olefin copolymer, polystyrene, vinyl chloride resin, polycarbonate, polyimide, polyamide ( Nylon), phenoxy resin, acrylic resin, acrylonitrile butadiene styrene, butadiene styrene, polyarylate, polyacetal, polyethylene terephthalate, polybutylene terephthalate, polyether ether ketone, polyphenylene sulfide, polybenzoimidazole , Liquid crystal polymer, polyetherimide, polyethersulfone, polyetheretherketone, acrylic resin or ethylene-acryl copolymer can be used alone or in combination of two or more thereof.
  • the rubber component is ethylene propylene diene rubber (EPDM), nitrile rubber (acrylonitrile butadiene rubber), styrene-butadiene resin (styrene butadiene resin), butyl rubber, natural rubber, styrene-butadiene-acrylic resin ( styrene butadiene arcryl resin), chloroprene rubber, ultra low density ethylene- ⁇ -olefin copolymer or silicone rubber may be used alone or in combination of two or more thereof.
  • EPDM ethylene propylene diene rubber
  • nitrile rubber acrylonitrile butadiene rubber
  • styrene-butadiene resin styrene butadiene resin
  • butyl rubber natural rubber
  • styrene-butadiene-acrylic resin styrene butadiene arcryl resin
  • chloroprene rubber ultra low density ethylene- ⁇ -olefin copolymer or
  • a base-thermoplastic adhesive film was prepared by attaching a detachable base film to a 3M Thermo-Bond Film 615 series, which is a polyester thermoplastic adhesive film. Cut the base-thermoplastic adhesive film into a shape that fits the case of FIGS. 3 to 5 and place the base-adhesive film so that the adhesive film is in contact with the case, and then use a mold temperature of 120 ° C. and a timer of 1 to 2 seconds. It was temporary.
  • the base film attached to the tack-adhesive adhesive film was removed by removing from the 3M Thermo-Bond Film 615 series of adhesive films.
  • the display cover was placed on the case so as to contact the adhesive film, and the display cover was pressed through the horn at a pressure of 84 kgf in the case direction.
  • the ultrasonic generator was operated under pressure to apply ultrasonic vibration to the display cover, the thermoplastic adhesive film, and the case for 1.1 seconds at an amplitude of 28.5 ⁇ m, thereby contacting the ultrasonic generator.
  • the adhesive film made of 3M Thermo-Bond Film 615 series was melted to bond the display cover and the case.
  • the adhesive force between the display cover and the case was measured using a push-pull tester and found to be 14 kgf.
  • Example 2 It is the same as Example 1 except it pressurized through the horn at 83kgf and ultrasonic vibration was applied for 1 second.
  • the adhesive force between the display cover and the case was measured using a push-pull tester, and the result was 13 kgf.
  • a base-thermosetting adhesive film was prepared by attaching a detachable base film to TESA's # 8451 product, which is a phenol resin thermosetting adhesive film containing nitrile rubber. Cut the base-thermoplastic adhesive film into a shape that fits the case of FIGS. 3 to 5, place the thermosetting adhesive film TESA's # 8451 product so that the adhesive film contacts the case, and place the mold temperature of 150 ° C. and 3.5 to 3 seconds. A second timer was used to glue the case to it.
  • the base film attached to the temporary thermosetting adhesive film was removed from TESA's # 8451 product, which is a thermosetting adhesive film, and degreased.
  • thermosetting adhesive film made of TESA's # 8451 product was melted and cured to bond the display cover and the case.
  • the adhesive force between the display cover and the case was measured using a push-pull tester and found to be 17 kgf.
  • Example 3 Same as Example 3 except that ultrasonic vibration was applied to the display cover for 15 seconds.
  • the adhesive force between the display cover and the case was measured using a push-pull tester, and the result was 16 kgf.
  • TES 4967 was used as a general method for joining double-sided tape. After cutting the double-sided tape into the shape of the product, remove the bottom of the double-sided tape and manually attach it to the case. After stripping the top of the double-sided tape, use a mold of heatless presser for 4 seconds using a timer of 2-4 seconds. It was pressed with air pressure of 5kgf / cm 2 and adhered to the display cover.
  • the adhesive force between the display cover and the case was measured using a push-pull tester, and the result was 2.5 kgf.
  • Example 1 The case and display cover used in Example 1 were bonded using 3M PBA 2665 bond.
  • a container containing 3M PBA 2665 Bond is mounted on a dispenser device which is manufactured to discharge the bond quantitatively, and the 3M PBA 2665 Bond is discharged along the case bonding line.
  • the display cover is placed on the case in the same manner as the double-sided tape bonding method, and the display cover is pressed onto the display cover by pressing at a pressure of 5 kgf for 37 seconds using a timer of 24 to 47 seconds using a mold of a heatless press. After drying at room temperature with a curing time of 12 hours was finished.
  • the adhesive force between the display cover and the case was measured using a push-pull tester and found to be 8.5 kgf.
  • the bonding method using 3M PBA 2665 Bond has a disadvantage in that the work efficiency is lowered since the drying process must be performed at room temperature for at least 12 hours to maintain mutual adhesive strength after pressing the double-sided case and the display cover, and the adhesion strength is smaller than that of the ultrasonic bonding method.
  • Adhesion was measured using a push-pull tester (Model SLJ 500N manufactured by Wenzhou Sundoo Instruments).
  • the jig was fixed to the push-pull meter and the bonded display cover and case were seated on the jig.
  • the gauge rod of the push-pull meter is positioned 5 mm from the top and left side of the display cover so that the gauge rod of the push-pull meter is in contact with the display cover.
  • the adhesion force at the moment of separation was measured.
  • the gauge rod of the push-pull meter is positioned 5 mm from the top and left side of the display cover, respectively, so that the gauge rod of the push-pull meter contacts the display cover, and then moves vertically upward and downward to apply a force to the case. The adhesion force at the moment of disassembly of the display cover was measured.
  • the gauge rod of the push-pull meter is positioned 5 mm from the top and the left side of the display cover so that the gauge rod of the push-pull meter is in contact with the display cover, and then vertically moved upwards and downwards to apply the force to the case. The adhesion force at the moment of disassembly of the display cover was measured.
  • the gauge rod of the push-pull meter is positioned 5 mm from the top and the left side of the display cover so that the gauge rod of the push-pull meter is in contact with the display cover. The adhesion force at the moment of disassembly of the display cover was measured.
  • Table 1 shows the average values of the adhesive forces measured at positions (a), (b), (c) and (d).
  • the display cover and the case were separated by applying an ultrasonic vibration by operating the ultrasonic generator for 1 to 10 seconds with an amplitude of 28 to 35 ⁇ m to the display cover and the case bonded with the adhesive film prepared in Examples 1 to 4.
  • the separated display cover and the case were bonded again in the same manner as in Examples 1 to 4, respectively. Bonding and separating were repeated until the exterior of the case and the display cover were deformed to separate the bonded display cover and the case in the same manner as the separation method.
  • Table 1 shows the number of repetitions of bonding and separating until the appearance of the case and the display cover is deformed.
  • Comparative Example 1 the case of the display cover and the display cover were separated from each other by separating the display cover and the case bonded to the double-sided tape at room temperature and then bonding the separated display cover and the case to the double-sided tape in the same manner as in Comparative Example 1. Repeat until deformed. Table 1 shows the number of repetitions of bonding and separating until the appearance of the case and the display cover is deformed.
  • the bonding method using a double-sided tape the bonding method using a bond as an adhesive as the prior art was significantly lower than the ultrasonic bonding method using an adhesive film.
  • the adhesive method using the thermoplastic adhesive film was excellent in reworkability, and the bonding method using the thermosetting adhesive film, the double-sided tape or the bond was difficult to rework due to the characteristics of the adhesive material.

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Abstract

The present invention provides an ultrasonic bonding method using an adhesive film, comprising the following steps: (a) allowing an adhesive film to be in contact with a first member to be bonded; and (b) allowing a second member to be bonded to come into contact with the adhesive film in contact with the first member to be bonded, and melting or curing the adhesive film by using an ultrasonic generator to bond the first member to be bonded and the second member to be bonded. According to the present invention, it is possible to provide a bonding method capable of remarkably improving an adhesive force between a first member to be bonded and a second member to be bonded without change in the appearance and quality of the first member to be bonded and the second member to be bonded, through selective melting of an adhesive film by using an ultrasonic bonding method using an adhesive film.

Description

접착 필름을 이용한 초음파 접합방법Ultrasonic Bonding Method Using Adhesive Film
본 발명은 초음파 접합방법에 관한 것으로, 더욱 상세하게는 접착필름을 이용한 초음파 접합방법에 관한 것이다.The present invention relates to an ultrasonic bonding method, and more particularly to an ultrasonic bonding method using an adhesive film.
종래기술인 열융착 필름을 이용하여 2개의 피착물을 상호 접합할 때에는, 먼저 피착물 사이의 가운데 열융착필름을 기준으로 양면에 각각 제1 및 제2 융착 필름이 구비된 열융착 필름을 배치하고, 열융착 장비를 이용하여 피착물에 직접 열을 가하고, 그 열기가 피착물을 통해 제1융착필름과 제2융착필름에 전달되어 제1융착필름과 제2융착필름이 녹아 피착물과 융착되는 방식이다.When the two adherends are bonded to each other using a conventional heat-sealed film, first, a heat-sealed film having first and second melted films provided on both sides with respect to the middle heat-sealed film between the adherends is disposed, The heat is directly applied to the adherend using a thermal fusion apparatus, and the heat is transferred to the first fusion film and the second fusion film through the adherend, and the first fusion film and the second fusion film are melted and fused with the adherend. to be.
따라서 종래의 열융착 필름을 열융착 방법을 이용하여 피착물에 접합할 때에는 2개의 피착물 중 어느 하나는 반드시 열을 전달할 수 있는 물질(SUS, 금속 등)로 이루어져야 한다. 즉 피착물 사이에 있는 열융착 필름까지 열이 전달돼야 하기 때문에 피착물 중 어느 하나는 열전도율이 높은 물질이어야 한다.Therefore, when the conventional heat-sealed film is bonded to the adherend using the heat-sealing method, any one of the two adherends must be made of a material capable of transferring heat (SUS, metal, etc.). That is, since heat must be transferred to the heat-sealed film between the adherends, one of the adherends should be a material having high thermal conductivity.
이러한 종래의 열융착 필름은 2개의 피착물이 모두 열전도율이 낮은 물질, 예를 들어 합성수지 간의 접착 시에는 제1융착필름이나 제2융착필름이 용융되기 전에 피착물이 열에 의해 변형되는 등의 문제가 있어 다른 접착방법을 사용하여야 한다.Such a conventional heat-sealed film has a problem that the adherend is deformed by heat before the first and second fusion films are melted when the two adherends have low thermal conductivity, for example, a synthetic resin. Therefore, other bonding methods should be used.
또 다른 종래 기술인 일반 양면테이프을 이용하는 방법에 따르면, 휴대단말기용 액정커버가 장착된 휴대단말기용 케이스에서, 휴대단말기 및 소형가전제품의 케이스와 액정커버는 양면테이프로 부착되고 있었다. 최근에는 휴대 단말기의 소형화와 디스플레이(LCD)의 크기의 확대로 인해 액정커버 및 케이스와 접하는 양면테이프의 면적이 줄어들게 되었다.  According to another conventional technique using a double-sided tape, in the case for a mobile terminal equipped with a liquid crystal cover for a mobile terminal, the case and the liquid crystal cover of the mobile terminal and small household appliances were attached to the double-sided tape. Recently, due to the miniaturization of portable terminals and the expansion of the size of the display (LCD), the area of the double-sided tape in contact with the liquid crystal cover and the case has been reduced.
그러나 양면테이프의 부착면적이 줄어들면 액정커버와 케이스를 결합시키기 위한 접착력이 부족하여 액정커버가 케이스에서 쉽게 떨어지는 문제점이 있었다.However, when the adhesion area of the double-sided tape is reduced, there is a problem in that the liquid crystal cover falls easily from the case due to the lack of adhesive force for bonding the liquid crystal cover and the case.
또한 양면테이프 대신에 접착제를 사용하여 접착할 수도 있지만, 접착제의 경우 본딩 작업 후 6시간 이상 지그에 압착 시키고 후공정이 이루어지며 완전경화는 압착 후 24시간 이상 소요되며 시간적인 문제 때문에 생산성이 현저히 떨어지는 문제가 있었다. In addition, adhesive can be used instead of double-sided tape, but in the case of adhesive, it is pressed to the jig for more than 6 hours after bonding, and post-processing is performed. Complete curing takes more than 24 hours after pressing, and productivity decreases considerably due to time problems. There was a problem.
대한민국 등록특허 10-0936740에는 도체로 이루어진 피가열필름과; 피가열필름의 일면에 접합되는 제1융착필름과; 피가열필름의 타면에 접합되는 제2융착필름과; 제2융착필름에 피가열필름의 반대방향으로 탈부착 가능하게 구비된 베이스필름을 포함하여 이루어지는 열융착 필름을 고주파를 이용하여 휴대단말기용 케이스와 액정커버를 상호 접합하는 접합방법이 개시되었다.Republic of Korea Patent No. 10-0936740 and the heated film made of a conductor; A first fusion film bonded to one surface of the film to be heated; A second fusion film bonded to the other surface of the film to be heated; A bonding method for bonding a case for a mobile terminal and a liquid crystal cover to each other using a high frequency heat-sealing film comprising a base film detachably attached to a second fusion film in a direction opposite to a film to be heated has been disclosed.
이러한 종래의 고주파 유도가열을 이용한 접합방법은 도체에 유도가열로 생긴 전류를 이용하여 도체로 이루어진 피가열 필름에 열을 발생시켜 열융착필름을 녹이는 방식으로 도체를 반드시 포함하는 열융착 필름을 사용하여야 한다. 따라서 열융착 필름 제작 시 도체로 인하여 열융착 필름의 손상이 발생될 수 있으며, 1차 가접 작업 시 지그 셋팅 후 미세한 가압으로도 중간기재인 도체 연결 부분이 절단될 수 있어 열이 전달되지 않아 융착 필름이 녹지 않는 현상이 발생할 수 있고 또한 재작업이 불가능하다. 또한 도체를 사용하여야 하고 열융착 필름의 생산 공정이 복잡하므로 생산비용이 증가하는 문제점이 있었다.In the conventional bonding method using high frequency induction heating, a heat fusion film containing a conductor must be used in such a manner as to generate heat in a heated film made of a conductor using a current generated by induction heating on the conductor to melt the heat fusion film. do. Therefore, the heat-sealing film may be damaged due to the conductor during the production of the heat-sealed film, and in the first welding operation, the conductor connection part, which is an intermediate substrate, may be cut even after minute pressurization after setting the jig. This melting phenomenon may occur and rework is impossible. In addition, the conductor must be used and the production process of the heat-sealed film is complicated, there is a problem that the production cost increases.
본 발명의 목적은 열가소성 접착필름 또는 열경화성 접착 필름을 이용한 초음파 접합방법을 사용함으로서 접착필름을 선택적으로 용융시켜 제1피착부재 및 제2피착부재의 외형과 품질에 변화를 주지 않으면서 동시에 제1피착부재와 제2피착부재 사이의 접착력을 향상시키는 접합방법을 제공하고자 하는 것이다.An object of the present invention is to melt the adhesive film selectively by using an ultrasonic bonding method using a thermoplastic adhesive film or a thermosetting adhesive film to simultaneously change the appearance and quality of the first coating member and the second coating member without changing the first coating An object of the present invention is to provide a bonding method for improving adhesion between the member and the second adherend member.
본 발명의 다른 목적은 도체를 사용하지 않는 접착필름을 이용함으로써 접착필름을 PRESS 혹은 SEALING 장비를 이용하여 접착하고자 하는 피착부재에 맞는 접착필름의 형상을 형성하는 컨버팅 작업이 용이하고, 가접 공정 시에 지그 셋팅 후 불량 발생이 현저히 적은 접합방법을 제공하고자 하는 것이다.Another object of the present invention is easily converted operation for forming the shape of the adhesive film for the adhesive film by using an adhesive film that does not use a conductor deposition member to be bonded using a PRESS or SEALING equipment and, when gajeop process The purpose of the present invention is to provide a method of joining in which defects are significantly reduced after jig setting.
본 발명의 또 다른 목적은 열가소성 접착필름을 사용함으로써 문제가 발생할 경우 재작업이 가능한 초음파 접합방법을 제공하고자 하는 것이다.Still another object of the present invention is to provide an ultrasonic bonding method capable of reworking when a problem occurs by using a thermoplastic adhesive film.
본 발명의 일 구현예는 상기한 목적을 달성하기 위하여,One embodiment of the present invention to achieve the above object,
(a) 접착필름을 제1피착부재와 접하도록 형성하는 단계; 및(a) forming an adhesive film to be in contact with the first adhesion member; And
(b) 제2피착부재를, 제1피착부재와 접하도록 형성된 접착필름에 접하도록 형성하고, 초음파 발생기를 사용하여 접착필름을 용융 또는 경화시켜 제1피착부재와 제2피착부재를 접합시키는 단계;를 (b) forming the second adhered member to contact the adhesive film formed to contact the first adhered member, and melting or curing the adhesive film using an ultrasonic generator to bond the first adhered member to the second adhered member. ;
포함하는 접착필름을 이용한 초음파 접합방법을 제공한다.It provides an ultrasonic bonding method using an adhesive film comprising.
본 발명의 일 실시예에 따르면, According to one embodiment of the invention,
상기 (a)단계는, In step (a),
접착필름과 접착필름에 탈부착 가능하게 구비된 베이스필름을 포함하는 베이스-접착필름을 제1피착부재에 가접하는 가접단계; 및A temporary welding step of welding the base-adhesive film including the adhesive film and a base film detachably attached to the adhesive film to the first adhered member; And
베이스 필름을 가접된 베이스-접착필름에서 제거하는 탈지단계;를 Degreasing step of removing the base film from the bonded base-adhesive film;
포함하여 이루어지고,Made, including
상기 (b)단계는 제2피착부재를, 가접된 접착필름에 접하도록 형성하고, 제2피착부재를 제1피착부재 방향으로 압착하며, 초음파 발생기를 사용하여 초음파 진동을 제1피착부재, 접착필름 및 제2피착부재 중 선택된 1종 이상에 인가하여 접착필름을 용융 또는 경화시켜 제2피착부재를 제1피착부재와 상호 결합시키는 본접단계인 것을 특징으로 한다.In the step (b), the second deposition member is formed to be in contact with the bonded adhesive film, the second deposition member is pressed in the direction of the first deposition member, and the ultrasonic vibration is applied to the first deposition member by using an ultrasonic generator. It is applied to at least one selected from the film and the second adhesion member is characterized in that the bonding step of bonding or bonding the second adhesion member and the first adhesion member by melting or curing the adhesive film.
본 발명의 일 실시예에 따르면,According to one embodiment of the invention,
접착필름과 접착필름에 탈부착 가능하게 구비된 베이스필름을 포함하는 베이스-접착필름을 전자제품의 케이스에 가접하는 가접단계;A temporary step of welding a base-adhesive film including an adhesive film and a base film detachably attached to the adhesive film to a case of an electronic product;
베이스 필름을 가접된 베이스-접착필름에서 제거하는 탈지단계; 및A degreasing step of removing the base film from the welded base-adhesive film; And
디스플레이커버 또는 장식부재를, 가접된 접착필름에 접하도록 형성하고, 디스플레이커버 또는 장식부재를 케이스 방향으로 압착하며, 초음파 발생기를 사용하여 초음파 진동을 케이스, 디스플레이커버 또는 장식부재, 및 접착필름 중 선택된 1종 이상에 인가하여 접착필름을 용융 또는 경화시켜 디스플레이커버 또는 장식부재를 케이스와 상호 결합시키는 본접단계;를 The display cover or decorative member is formed to be in contact with the bonded adhesive film, the display cover or decorative member is pressed in the direction of the case, and the ultrasonic vibration is selected using a ultrasonic generator to select the case, the display cover or the decorative member, and the adhesive film. Applying at least one melted or cured adhesive film bonding step of bonding the display cover or decorative member with the case;
포함하는 것을 특징으로 하는 접착필름을 이용한 초음파 접합방법이 제공될 수 있다.Ultrasonic bonding method using an adhesive film, characterized in that it may be provided.
본 발명의 일 실시예에서, 초음파의 진폭은 10 내지 50μm, 보다 바람직하게는 25 내지 40μm인 것을 특징으로 한다.In one embodiment of the invention, the amplitude of the ultrasonic wave is characterized in that 10 to 50μm, more preferably 25 to 40μm.
본 발명의 일 실시예에서, 접착필름의 녹는점은 제1피착부재 및 제2피착부재 중 녹는점이 더 낮은 어느 하나의 녹는점 보다 낮은 것을 특징으로 한다.In one embodiment of the present invention, the melting point of the adhesive film is characterized in that the melting point of the first and second adhesion members and lower than any one of the lower melting point.
본 발명의 일 실시예에서, 접착필름의 녹는점은 제1피착부재 및 제2피착부재 중 녹는점이 더 낮은 어느 하나의 녹는점 보다 20℃ 이상, 보다 바람직하게는 20 내지 100℃, 보다 더욱 바람직하게는 20 내지 50℃ 낮은 것을 특징으로 한다.In one embodiment of the present invention, the melting point of the adhesive film is 20 ℃ or more, more preferably 20 to 100 ℃, even more preferred than any one of the first melting point and the lower melting point of the second adhered member. Preferably it is characterized by low 20 to 50 ℃.
본 발명의 일 실시예에 따르면, 접착필름은 열가소성 접착필름 및 열경화성 접착필름 중에서 선택된 1종 이상인 것을 특징으로 한다.According to one embodiment of the invention, the adhesive film is characterized in that at least one selected from a thermoplastic adhesive film and a thermosetting adhesive film.
본 발명의 일 실시예에 따르면, 열가소성 접착필름은 폴리에스터, 폴리올레핀, 폴리에틸렌, 폴리프로필렌, 에틸렌-프로필렌 공중합체, 에틸렌-α-올레핀 공중합체, 폴리스티렌, 염화비닐수지, 폴리카보네이트, 폴리이미드, 폴리아미드(나일론), 페녹시수지, 아크릴수지, 아크릴로니트릴부타디엔스티렌, 부타디엔스티렌, 폴리아릴레이트, 폴리아세탈, 폴리에틸렌테레프탈레이트, 폴리부틸렌테레프탈레이트, 폴리에테르에테르케톤, 폴리페닐렌설피드, 폴리벤조이미다졸, 폴리에테르이미드, 폴리에테르설폰, 폴리에테르에테르케톤, 아크릴 수지 및 에틸렌-아크릴 공중합체로 이루어진 군으로부터 선택된 1종 이상을 포함할 수 있다.According to one embodiment of the invention, the thermoplastic adhesive film is polyester, polyolefin, polyethylene, polypropylene, ethylene-propylene copolymer, ethylene-α-olefin copolymer, polystyrene, vinyl chloride resin, polycarbonate, polyimide, poly Amide (nylon), phenoxy resin, acrylic resin, acrylonitrile butadiene styrene, butadiene styrene, polyarylate, polyacetal, polyethylene terephthalate, polybutylene terephthalate, polyether ether ketone, polyphenylene sulfide, polybenzo It may include one or more selected from the group consisting of imidazole, polyetherimide, polyethersulfone, polyetheretherketone, acrylic resin and ethylene-acryl copolymer.
본 발명의 일 실시예에 따르면, 열경화성 접착필름은 열경화성 성분을 포함할 수 있다.According to one embodiment of the invention, the thermosetting adhesive film may include a thermosetting component.
본 발명의 일 실시예에서, 열경화성 접착필름은 In one embodiment of the invention, the thermosetting adhesive film is
열경화성 성분 및 경화제 중에서 선택된 1종 이상; 및 At least one selected from a thermosetting component and a curing agent; And
열가소성 성분 및 고무 성분 중에서 선택된 1종 이상;을 At least one selected from thermoplastic components and rubber components;
포함할 수 있다.It may include.
본 발명의 일 실시예에서, 열경화성 성분은 페놀수지, 멜라민수지, 멜라민-이소시아네잇튜레잇 부가 생성물(melamineisocyanaturate addut), 에폭시수지, 폴리카프로락톤 변성 에폭시수지, 글리시딜 에틸렌 공중합체 및 멜라민이소시아누릭산 합성물로 이루어진 군으로부터 선택된 1종 이상일 수 있다.In one embodiment of the present invention, the thermosetting component is phenolic resin, melamine resin, melamineisocyanaturate addut, epoxy resin, polycaprolactone modified epoxy resin, glycidyl ethylene copolymer and melamine It may be at least one selected from the group consisting of a cyanouric acid composite.
본 발명의 일 실시예에서, 경화제는 방향족 아민 화합물, 산무수물(anhydride), 페놀수지, 폴리아미드, 디시안디아마이드(DICY), 디하이드라이드 화합물, 아민덕트계 화합물, 이미다졸 화합물, 하이드라진 화합물, 우레아 화합물, 2-페닐-4-메틸-5-하이드록시 메틸이미다졸, 3-(3,4-디클로로페닐)-1,1-디메틸우레아(DCMU), 설포늄염, 포스포늄염, 비페닐에테를블락카본산 및 다가카본산 활성에스테르로 이루어진 군으로부터 선택된 1종 이상일 수 있다.In one embodiment of the present invention, the curing agent is an aromatic amine compound, anhydride, phenol resin, polyamide, dicyanamide (DICY), dihydride compound, amine duct compound, imidazole compound, hydrazine compound, Urea compound, 2-phenyl-4-methyl-5-hydroxy methylimidazole, 3- (3,4-dichlorophenyl) -1,1-dimethylurea (DCMU), sulfonium salt, phosphonium salt, biphenyl It may be at least one member selected from the group consisting of ether blockcarboxylic acid and polycarboxylic acid active ester.
본 발명의 일 실시예에서, 열가소성 성분은 폴리에스터, 폴리올레핀, 폴리에틸렌, 폴리프로필렌, 에틸렌-프로필렌 공중합체, 에틸렌-α-올레핀 공중합체, 폴리스티렌, 염화비닐수지, 폴리카보네이트, 폴리이미드, 폴리아미드(나일론), 페녹시수지, 아크릴수지, 아크릴로니트릴부타디엔스티렌, 부타디엔스티렌, 폴리아릴레이트, 폴리아세탈, 폴리에틸렌테레프탈레이트, 폴리부틸렌테레프탈레이트, 폴리에테르 에테르 케톤, 폴리페닐렌설피드, 폴리벤조이미다졸, 액정고분자, 폴리에테르이미드, 폴리에테르설폰, 폴리에테르에테르케톤, 아크릴 수지 및 에틸렌-아크릴 공중합체로 이루어진 군으로부터 선택된 1종 이상일 수 있다.In one embodiment of the present invention, the thermoplastic component may be polyester, polyolefin, polyethylene, polypropylene, ethylene-propylene copolymer, ethylene-α-olefin copolymer, polystyrene, vinyl chloride resin, polycarbonate, polyimide, polyamide ( Nylon), phenoxy resin, acrylic resin, acrylonitrile butadiene styrene, butadiene styrene, polyarylate, polyacetal, polyethylene terephthalate, polybutylene terephthalate, polyether ether ketone, polyphenylene sulfide, polybenzoimidazole It may be at least one selected from the group consisting of liquid crystal polymer, polyetherimide, polyethersulfone, polyetheretherketone, acrylic resin and ethylene-acryl copolymer.
본 발명의 일 실시예에서, 고무성분은 에틸렌프로필렌디엔고무(EPDM), 니트릴 고무(acrylonitrile butadiene rubber), 스티렌-부타디엔 수지(styrene butadiene resin), 부틸고무, 천연고무, 스티렌-부타디엔-아크릴 수지(styrene butadiene arcryl resin), 클로로프렌 고무, 초저밀도 에틸렌-α-올레핀 공중합체 및 실리콘 고무로 이루어진 군으로부터 선택된 1종 이상일 수 있다.In one embodiment of the present invention, the rubber component is ethylene propylene diene rubber (EPDM), nitrile rubber (acrylonitrile butadiene rubber), styrene-butadiene resin (styrene butadiene resin), butyl rubber, natural rubber, styrene-butadiene-acrylic resin ( styrene butadiene arcryl resin), chloroprene rubber, ultra low density ethylene-α-olefin copolymer and silicone rubber.
본 발명의 일 실시예에 따르면 열가소성 접착필름 또는 열경화성 접착필름을 이용한 초음파 접합방법은 열가소성 또는 열경화성 접착필름을 선택적으로 용융 및/또는 경화시켜 케이스와 디스플레이커버 등의 피착부재의 외형과 품질에 변화를 주지 않으며 접착력을 향상시키는 접합방법을 제공할 수 있다.According to an embodiment of the present invention, the ultrasonic bonding method using a thermoplastic adhesive film or a thermosetting adhesive film may be selectively melted and / or cured a thermoplastic or thermosetting adhesive film to change the appearance and quality of a member such as a case and a display cover. It is possible to provide a bonding method that improves adhesion without giving.
또한, 본 발명에 따른 열가소성 접착필름 또는 열경화성 접착필름을 이용한 초음파 접합방법은 도체를 사용하지 않는 접착필름을 이용함으로써 접착필름을 PRESS 혹은 SEALING 장비를 이용하여 접착하고자 하는 피착부재에 맞는 접착필름의 형상을 형성하는 컨버팅 작업이 용이하고, 가접 공정 시에 지그 셋팅 후 불량 발생이 현저히 적은 접합방법을 제공할 수 있다.In addition, the ultrasonic bonding method using the thermoplastic adhesive film or the thermosetting adhesive film according to the present invention is the shape of the adhesive film for the adhered member to be bonded to the adhesive film by using the PRESS or SEALING equipment by using the adhesive film not using a conductor the converting operation of forming can be easily and to provide a bonding method is significantly less defects after setting jig at gajeop process.
또한, 본 발명에 따른 접착필름을 이용한 초음파 접합방법은 열가소성 접착필름을 사용함으로써 문제가 발생할 경우 재작업이 가능한 초음파 접합방법을 제공할 수 있다.In addition, the ultrasonic bonding method using the adhesive film according to the present invention can provide an ultrasonic bonding method that can be reworked if a problem occurs by using a thermoplastic adhesive film.
도 1은 본 발명의 일 실시예에 따른 접착필름을 이용한 초음파 접합방법을 나타낸 개략적인 공정도이다.1 is a schematic process diagram showing an ultrasonic bonding method using an adhesive film according to an embodiment of the present invention.
도 2는 본 발명의 일 실시예에 따른 접착필름을 이용한 초음파 접합방법을 나타낸 도면이다.2 is a view showing an ultrasonic bonding method using an adhesive film according to an embodiment of the present invention.
도 3은 본 발명의 일 실시예에 따른 접착필름을 이용한 가접단계를 나타낸 도면이다.3 is a view showing a temporary welding step using an adhesive film according to an embodiment of the present invention.
도 4는 본 발명의 실시예에 따른 접착필름을 이용하여 접합되는 휴대전화의 부품을 나타낸 도면이다.4 is a view showing a part of the mobile phone bonded using an adhesive film according to an embodiment of the present invention.
도 5는 본 발명의 실시예에 따른 접착필름을 이용한 본접단계를 나타낸 도면이다.5 is a view showing a bonding step using an adhesive film according to an embodiment of the present invention.
본 발명은 접착필름을 이용한 초음파 접합방법에 관한 것이다.The present invention relates to an ultrasonic bonding method using an adhesive film.
본 발명의 일 구현예에 따르면, 접착필름을 이용한 제1피착부재와 제2피착부재의 초음파 접합방법을 제공하며, 일 실시예로서 IT관련 전자제품 및 휴대단말기용 케이스와 디스플레이 커버 또는 장식부재의 초음파 접합방법을 제공하며, 이하 자세히 설명한다. 특별하게 언급하지 않는 한 본 발명에서 접착필름은 열가소성 접착필름 및/또는 열경화성 접착필름을 의미한다.According to an embodiment of the present invention, there is provided an ultrasonic bonding method of the first deposition member and the second deposition member using an adhesive film, and as an embodiment of the case and display cover or decorative member for IT-related electronic products and mobile terminals It provides an ultrasonic bonding method, which will be described in detail below. Unless specifically stated, the adhesive film in the present invention means a thermoplastic adhesive film and / or a thermosetting adhesive film.
도 1은 본 발명의 실시예에 따른 접착필름을 이용한 접합방법을 나타낸 개략적인 공정도이다.1 is a schematic process chart showing a bonding method using an adhesive film according to an embodiment of the present invention.
도 1에 도시된 바와 같이 본 발명의 실시예에 따른 접착필름을 이용한 접합방법은 가접단계(S10), 탈지단계(S20), 본접단계(S30) 순으로 이루어진다.As shown in FIG. 1, the bonding method using the adhesive film according to the exemplary embodiment of the present invention includes a temporary welding step S10, a degreasing step S20, and a bonding step S30.
도 2는 본 발명의 실시예에 따른 접착필름을 이용한 접합방법을 나타낸 도면이다.2 is a view showing a bonding method using an adhesive film according to an embodiment of the present invention.
도 3은 가접단계(S10)를 나타낸 것이고, 도 4는 본 발명의 실시예에 따른 접착필름을 이용하여 접합되는 전자제품의 케이스 구조 및 부품을 나타낸 도면이고, 도 5는 본접단계(S30)를 나타낸 것이다.Figure 3 shows the temporary welding step (S10), Figure 4 is a view showing the case structure and parts of the electronic products bonded using the adhesive film according to an embodiment of the present invention, Figure 5 shows the contact step (S30) It is shown.
도 2를 참고하면, 본 발명의 일 구현예는 (a) 접착필름(20)을 제1피착부재(10)와 접하도록 형성하는 단계; 및Referring to Figure 2, one embodiment of the present invention comprises the steps of (a) forming the adhesive film 20 in contact with the first adhered member 10; And
(b) 제2피착부재(40)를, 제1피착부재와 접하도록 형성된 접착필름(20)에 접하도록 형성하고, 초음파 발생기를 사용하여 접착필름을 용융 또는 경화시켜 제1피착부재(10)와 제2피착부재(40)를 접합시키는 단계;를 (b) forming the second adherent member 40 in contact with the adhesive film 20 formed to be in contact with the first adherent member, and melting or curing the adhesive film using an ultrasonic generator to form the first adherent member 10. And bonding the second adhered member 40 to the
포함하는 접착필름을 이용한 초음파 접합방법을 제공한다.It provides an ultrasonic bonding method using an adhesive film comprising.
본 발명의 일 실시예에 따르면, According to one embodiment of the invention,
제1항에 있어서, 상기 (a)단계는, According to claim 1, wherein step (a),
접착필름(20)과 접착필름에 탈부착 가능하게 구비된 베이스필름(30)을 포함하는 베이스-접착필름(30, 20)을 제1피착부재(10)에 가접하는 가접단계; 및A temporary welding step of welding the base- adhesive films 30 and 20 including the adhesive film 20 and the base film 30 detachably attached to the adhesive film to the first adhesion member 10; And
베이스 필름(30)을 가접된 베이스-접착필름(30, 20)에서 제거하는 탈지단계;를 Degreasing step of removing the base film 30 from the welded base-adhesive film (30, 20);
포함하여 이루어지고,Made, including
상기 (b)단계는 제2피착부재(40)를, 가접된 접착필름(20)에 접하도록 형성하고, 제2피착부재(40)를 제1피착부재 방향(10)으로 압착하며, 초음파 발생기를 사용하여 초음파 진동을 제1피착부재(10), 접착필름(20) 및 제2피착부재(40) 중 선택된 1종 이상에 인가하여 접착필름(20)을 용융 및/또는 경화시켜 제2피착부재(40)를 제1피착부재(10)와 상호 결합시키는 본접단계인 것을 특징으로 하는 접착필름을 이용한 초음파 접합방법을 제공할 수 있다.In the step (b), the second adhesion member 40 is formed to be in contact with the adhesive film 20, and the second adhesion member 40 is pressed in the direction of the first adhesion member 10, and the ultrasonic generator Ultrasonic vibration is applied to at least one selected from the first adherent member 10, the adhesive film 20, and the second adherent member 40 by using the melted and / or cured adhesive film 20 to the second adherent. Ultrasonic bonding method using an adhesive film, characterized in that the bonding step of bonding the member 40 and the first adhered member 10 to each other.
본 발명의 일 실시예에 따른 휴대전화 케이스와 디스플레이 커버 또는 장식부재의 접착방법을 도 3을 참고하여 설명하면, 접착 필름(130)은 베이스필름(150)과 함께 케이스(110)의 장착 홈에 삽입 배치되며, 접착필름(130)이 케이스(110)의 일면과 마주보게 배치된다. 그리고 가열된 금형(50)으로 약 0.5~10초간 베이스필름(150)을 케이스(110) 방향으로 압착 및 가열한다.Referring to Figure 3, the method for bonding the mobile phone case and the display cover or decorative member according to an embodiment of the present invention, the adhesive film 130 is in the mounting groove of the case 110 together with the base film 150 Inserted and disposed, the adhesive film 130 is disposed to face one surface of the case (110). The base film 150 is pressed and heated in the direction of the case 110 for about 0.5 to 10 seconds with the heated mold 50.
케이스(110)의 하부에는 케이스(110)가 휘어지지 않도록 셋팅하고자 하는 제품에 맞게 지그(160)를 장착한다.The lower part of the case 110 is mounted with a jig 160 to fit the product to be set so that the case 110 is not bent.
금형(50)은 100~170℃로 가열되어 0.5~10초 사이로 압착하며, 금형(50)의 온도는 베이스필름(150)과 접착필름(130)의 녹는점보다 낮다.The mold 50 is heated to 100 to 170 ° C. and compressed for 0.5 to 10 seconds, and the temperature of the mold 50 is lower than the melting point of the base film 150 and the adhesive film 130.
또한 베이스필름(150)의 녹는점은 접착필름(130)의 녹는점보다 높다.In addition, the melting point of the base film 150 is higher than the melting point of the adhesive film 130.
즉 금형(50)의 온도는 베이스필름(150)과 접착필름(130)의 녹는점보다 낮지만 베이스필름(150)보다 접착필름(130)의 녹는점에 근접한다.That is, the temperature of the mold 50 is lower than the melting point of the base film 150 and the adhesive film 130, but is closer to the melting point of the adhesive film 130 than the base film 150.
따라서 금형(50)으로 베이스필름(150)을 압착 및 가열할 때 베이스필름(150)은 녹지 않고, 접착필름(130)은 베이스필름(150)을 통해 전달된 금형(50)의 압력 및 열을 이용하여 가접장비의 시간에 맞춰진 0.5~10초의 시간동안 가열되어 케이스(110)와 가접된다.Therefore, when the base film 150 is pressed and heated with the mold 50, the base film 150 is not melted, and the adhesive film 130 receives the pressure and heat of the mold 50 transferred through the base film 150. It is heated for a time of 0.5 ~ 10 seconds according to the time of the temporary welding equipment is welded to the case 110.
물론 접착필름(130)은 완전히 용융된 것이 아니기 때문에 케이스(110)와 접착력은 크지 않다.Of course, since the adhesive film 130 is not completely melted, the case 110 and the adhesive force are not large.
이와 같이 베이스필름(150)의 녹는점이 접착필름(130)의 녹는점보다 높고, 가접단계(S10)에서 금형(50)의 온도를 베이스필름(150)과 접착필름(130)의 녹는점보다 작게 함으로써, 금형(50)의 온도를 베이스필름(150)의 녹는점보다 접착필름(130)의 녹는점에 근접하여 베이스필름(150)이 변형되는 것을 최소화할 수 있다.As such, the melting point of the base film 150 is higher than the melting point of the adhesive film 130, and the temperature of the mold 50 is smaller than the melting point of the base film 150 and the adhesive film 130 in the temporary welding step S10. As a result, the deformation of the base film 150 may be minimized by bringing the temperature of the mold 50 closer to the melting point of the adhesive film 130 than the melting point of the base film 150.
가접단계(S10)가 끝난 후 탈지단계(S20)에서는 베이스필름(150)을 접착필름(130)에서 제거한다.In the degreasing step S20 after the temporary step S10 is completed, the base film 150 is removed from the adhesive film 130.
베이스필름(150)은 접착필름에 잘 떨어지게 부착되어 있으므로 쉽게 떨어진다.The base film 150 is easily attached to the adhesive film so that it falls off easily.
이와 같이 베이스필름(150)을 접착 필름(130)에 탈착 가능하게 장착함으로써, 조립 작업시 베이스필름(150)의 제거를 용이하게 하여 작업성을 향상시키는 효과가 있다.As such, the base film 150 is detachably attached to the adhesive film 130, thereby facilitating the removal of the base film 150 during assembly work, thereby improving workability.
이 후 도 4 및 5에 도시된 바와 같이 본접단계(S30)에서는 디스플레이커버(120) 또는 장식부재를 베이스필름(150)이 제거된 접착필름(130)의 일면과 초음파장비의 혼(60)을 이용하여 접착필름(130)을 용융 및/또는 경화시켜 케이스(110)에 접착시킨다.Then, as shown in FIGS. 4 and 5, in the bonding step (S30), one surface of the adhesive film 130 from which the base film 150 has been removed from the display cover 120 or the decorative member and the horn 60 of the ultrasonic equipment is removed. The adhesive film 130 is melted and / or hardened to bond to the case 110.
도 4 및 도 5를 참고하면, 본 발명의 일 실시예는 휴대전화 케이스와 디스플레이 커버 또는 장식부재의 접착방법을 제공할 수 있다. 상기 디스플레이 커버는 디스플레이를 보호하거나 장식적인 목적으로 디스플레이를 커버하기 위해 사용하는 것이고, 상기 장식부재는 휴대전화 등의 전자제품의 케이스의 외관을 멋있게 하거나 케이스를 강도를 높이기 위하여 사용하는 것이다. 본 발명에서 장식부재(125)는 디스플레이커버(120)를 케이스와 접합시키는 것과 동일하게 본 발명의 초음파 접합방법으로 케이스에 접합될 수 있다.4 and 5, an embodiment of the present invention may provide a method of adhering a mobile phone case and a display cover or a decorative member. The display cover is used to protect the display or to cover the display for decorative purposes, and the decorative member is used to enhance the appearance of the case of an electronic product such as a mobile phone or to increase the strength of the case. In the present invention, the decorative member 125 may be bonded to the case by the ultrasonic bonding method of the present invention in the same manner as for bonding the display cover 120 and the case.
구체적으로 살펴보면, 디스플레이 커버(120)를 가접된 접착필름(130)에 접하도록 장착 홈에 삽입 배치하고, 초음파 발생 장비의 혼(60)으로 디스플레이 커버(120)를 케이스(110) 방향으로 압착한다.Specifically, the display cover 120 is inserted into the mounting groove so as to be in contact with the adhesive film 130, and the display cover 120 is pressed in the direction of the case 110 by the horn 60 of the ultrasonic wave generating equipment. .
케이스(110)의 하부에는 케이스(110)가 휘어지지 않도록 해당 제품의 지그(160)를 배치한다.The jig 160 of the product is disposed under the case 110 so that the case 110 is not bent.
또한 초음파 발생기를 이용하여 혼(60)으로부터 디스플레이 커버(120), 접착 필름(130) 및 케이스(110)에 초음파 진동을 혼(60)을 통해 인가하고 진동에너지를 전달하여 디스플레이 커버(120) 및 케이스(110)보다 융점이 낮은 접착 필름(130)을 선택적으로 용융 및/또는 경화시킨다.In addition, by using the ultrasonic generator to apply the ultrasonic vibration to the display cover 120, the adhesive film 130 and the case 110 from the horn 60 through the horn 60 and transfer the vibration energy to the display cover 120 and The adhesive film 130 having a lower melting point than that of the case 110 is selectively melted and / or cured.
본 발명의 일 실시예에 따르면, 초음파 발생기를 통하여 발생되는 초음파의 진폭은 10 내지 50μm, 보다 바람직하게는 25 내지 40μm이다. 진폭이 10μm 미만인 경우에는 마찰온도가 낮고, 50μm를 초과하는 경우에는 피착부재가 손상될 수 있다.According to one embodiment of the invention, the amplitude of the ultrasonic waves generated by the ultrasonic generator is 10 to 50μm, more preferably 25 to 40μm. If the amplitude is less than 10μm, the friction temperature is low, and if it exceeds 50μm, the adhered member may be damaged.
본 발명의 일 실시예에 따르면, 초음파를 인가하는 시간은 0.5 내지 30초일 수 있다. 초음파 인가 시간이 0.5초 미만인 경우에는 충분한 마찰열을 발생하지 않을 수 있고, 30초를 초과하는 경우에는 제품의 변형을 일으킬 수 있다.According to an embodiment of the present invention, the time for applying the ultrasound may be 0.5 to 30 seconds. If the ultrasonic application time is less than 0.5 seconds may not generate sufficient frictional heat, if it exceeds 30 seconds may cause deformation of the product.
본 발명의 일 실시예에 따르면, 본 발명의 접착필름의 녹는점은 제1피착부재 및 제2피착부재 중 녹는점이 더 낮은 어느 하나의 녹는점 보다 낮은 것을 특징으로 하며, 보다 바람직하게는 접착필름의 녹는점은 제1피착부재 및 제2피착부재 중 녹는점이 더 낮은 어느 하나의 녹는점 보다 20℃ 이상, 보다 바람직하게는 20 내지 100℃, 보다 더욱 바람직하게는 20 내지 50℃ 낮은 것이 좋다. 접착필름의 녹는점이 제1피착부재 또는 제2피착부재 보다 높으면 초음파가 인가될 경우 제1피착부재 또는 제2피착부재가 먼저 용융되고 접착 필름이 용융되지 않아 제1피착부재와 제2피착부재가 접합되지 않을 수 있다.According to an embodiment of the present invention, the melting point of the adhesive film of the present invention is characterized in that the melting point of the first coating member and the second coating member is lower than any one of the lower melting point, more preferably the adhesive film The melting point of is preferably 20 ° C. or more, more preferably 20 to 100 ° C., even more preferably 20 to 50 ° C. lower than any one of the melting points of the first and second adherends. If the melting point of the adhesive film is higher than that of the first or second deposition member, when the ultrasonic wave is applied, the first deposition member or the second deposition member is melted first, and the adhesive film is not melted. May not be bonded.
본 발명의 일 실시예에 따르면, 접착필름으로서 열가소성 접착필름 또는 열경화성 접착필름을 단독 또는 2종 이상 병행하여 사용할 수 있다.According to one embodiment of the present invention, as the adhesive film, a thermoplastic adhesive film or a thermosetting adhesive film may be used alone or in combination of two or more.
또한 본 발명의 일 실시예에 따르면, 열가소성 접착필름은 폴리에스터, 폴리올레핀, 폴리에틸렌, 폴리프로필렌, 에틸렌-프로필렌 공중합체, 에틸렌-α-올레핀 공중합체, 폴리스티렌, 염화비닐수지, 폴리카보네이트, 폴리이미드, 폴리아미드(나일론), 페녹시수지, 아크릴수지, 아크릴로니트릴부타디엔스티렌, 부타디엔스티렌, 폴리아릴레이트, 폴리아세탈, 폴리에틸렌테레프탈레이트, 폴리부틸렌테레프탈레이트, 폴리에테르에테르케톤, 폴리페닐렌설피드, 폴리벤조이미다졸, 폴리에테르이미드, 폴리에테르설폰, 폴리에테르에테르케톤, 아크릴 수지 또는 에틸렌-아크릴 공중합체를 단독 또는 2종 이상 포함할 수 있다.In addition, according to an embodiment of the present invention, the thermoplastic adhesive film is polyester, polyolefin, polyethylene, polypropylene, ethylene-propylene copolymer, ethylene-α-olefin copolymer, polystyrene, vinyl chloride resin, polycarbonate, polyimide, Polyamide (nylon), phenoxy resin, acrylic resin, acrylonitrile butadiene styrene, butadiene styrene, polyarylate, polyacetal, polyethylene terephthalate, polybutylene terephthalate, polyether ether ketone, polyphenylene sulfide, poly Benzimidazole, polyetherimide, polyethersulfone, polyetheretherketone, acrylic resin or ethylene-acryl copolymer may be included alone or in combination of two or more.
본 발명의 일 실시예에 따르면, 열경화성 접착필름은 열경화성 성분을 포함할 수 있다.According to one embodiment of the invention, the thermosetting adhesive film may include a thermosetting component.
본 발명의 일 실시예에서, 열경화성 접착필름은 열경화성 성분 및 경화제 중에서 선택된 1종 이상; 또는 열가소성 성분 및 고무 성분 중에서 선택된 1종 이상;을 단독 또는 2종 이상을 포함할 수 있다.In one embodiment of the present invention, the thermosetting adhesive film is at least one selected from a thermosetting component and a curing agent; Or at least one selected from thermoplastic components and rubber components; alone or two or more kinds thereof may be included.
본 발명의 일 실시예에서, 열경화성 성분으로서 페놀수지, 멜라민수지, 멜라민-이소시아네잇튜레잇 부가 생성물(melamineisocyanaturate addut), 에폭시수지, 폴리카프로락톤 변성 에폭시수지, 글리시딜 에틸렌 공중합체 또는 멜라민이소시아누릭산 합성물을 단독 또는 2종 이상 병행하여 사용할 수 있다.In one embodiment of the present invention, the thermosetting component is a phenol resin, melamine resin, melamine-isocyanaturate addut, epoxy resin, polycaprolactone modified epoxy resin, glycidyl ethylene copolymer or melamine The cyanouric acid composite may be used alone or in combination of two or more thereof.
본 발명의 일 실시예에서, 경화제로서 방향족 아민 화합물, 산무수물(anhydride), 페놀수지, 폴리아미드, 디시안디아마이드(DICY), 디하이드라이드 화합물, 아민덕트계 화합물, 이미다졸 화합물, 하이드라진 화합물, 우레아 화합물, 2-페닐-4-메틸-5-하이드록시 메틸이미다졸, 3-(3,4-디클로로페닐)-1,1-디메틸우레아(DCMU), 설포늄염, 포스포늄염, 비페닐에테를블락카본산 또는 다가카본산 활성에스테르를 단독 또는 2종 이상 병행하여 사용할 수 있다.In one embodiment of the present invention, an aromatic amine compound, anhydride, phenol resin, polyamide, dicyandiamide (DICY), dihydride compound, amine duct compound, imidazole compound, hydrazine compound, Urea compound, 2-phenyl-4-methyl-5-hydroxy methylimidazole, 3- (3,4-dichlorophenyl) -1,1-dimethylurea (DCMU), sulfonium salt, phosphonium salt, biphenyl Ethelblockcarboxylic acid or a polycarboxylic acid active ester can be used individually or in combination of 2 or more types.
본 발명의 일 실시예에서, 열가소성 성분으로서 폴리에스터, 폴리올레핀, 폴리에틸렌, 폴리프로필렌, 에틸렌-프로필렌 공중합체, 에틸렌-α-올레핀 공중합체, 폴리스티렌, 염화비닐수지, 폴리카보네이트, 폴리이미드, 폴리아미드(나일론), 페녹시수지, 아크릴수지, 아크릴로니트릴부타디엔스티렌, 부타디엔스티렌, 폴리아릴레이트, 폴리아세탈, 폴리에틸렌테레프탈레이트, 폴리부틸렌테레프탈레이트, 폴리에테르 에테르 케톤, 폴리페닐렌설피드, 폴리벤조이미다졸, 액정고분자, 폴리에테르이미드, 폴리에테르설폰, 폴리에테르에테르케톤, 아크릴 수지 또는 에틸렌-아크릴 공중합체를 단독 또는 2종 이상 병행하여 사용할 수 있다.In one embodiment of the present invention, the thermoplastic component is polyester, polyolefin, polyethylene, polypropylene, ethylene-propylene copolymer, ethylene-α-olefin copolymer, polystyrene, vinyl chloride resin, polycarbonate, polyimide, polyamide ( Nylon), phenoxy resin, acrylic resin, acrylonitrile butadiene styrene, butadiene styrene, polyarylate, polyacetal, polyethylene terephthalate, polybutylene terephthalate, polyether ether ketone, polyphenylene sulfide, polybenzoimidazole , Liquid crystal polymer, polyetherimide, polyethersulfone, polyetheretherketone, acrylic resin or ethylene-acryl copolymer can be used alone or in combination of two or more thereof.
본 발명의 일 실시예에서, 고무성분으로서 에틸렌프로필렌디엔고무(EPDM), 니트릴 고무(acrylonitrile butadiene rubber), 스티렌-부타디엔 수지(styrene butadiene resin), 부틸고무, 천연고무, 스티렌-부타디엔-아크릴 수지(styrene butadiene arcryl resin), 클로로프렌 고무, 초저밀도 에틸렌-α-올레핀 공중합체 또는 실리콘 고무를 단독 또는 2종 이상 병행하여 사용할 수 있다.In one embodiment of the present invention, the rubber component is ethylene propylene diene rubber (EPDM), nitrile rubber (acrylonitrile butadiene rubber), styrene-butadiene resin (styrene butadiene resin), butyl rubber, natural rubber, styrene-butadiene-acrylic resin ( styrene butadiene arcryl resin), chloroprene rubber, ultra low density ethylene-α-olefin copolymer or silicone rubber may be used alone or in combination of two or more thereof.
이하, 실시예를 참조하여 본 발명을 상세히 설명한다.Hereinafter, the present invention will be described in detail with reference to Examples.
이하의 실시예들은 본 발명을 예시하기 위한 것으로서, 본 발명을 국한시키는 것으로 이해되어서는 안 될 것이다.The following examples are intended to illustrate the invention and should not be construed as limiting the invention.
[실시예]EXAMPLE
아래의 실시예 1 내지 4 및 비교예 1, 2에서 디스플레이커버와 케이스는 모두 동일한 종류의 것을 사용하였다.In Examples 1 to 4 and Comparative Examples 1 and 2 below, the same type of display cover and case were used.
실시예 1Example 1
폴리에스터 열가소성 접착필름인 3M의 Thermo-Bond Film 615계열에 탈부착이 가능한 베이스 필름을 부착하여 베이스-열가소성 접착필름을 제조하였다. 베이스-열가소성 접착필름을 도 3 내지 5의 케이스에 맞는 형상으로 절단하여 접착필름 쪽이 케이스에 접하도록 상기 베이스-접착필름이 위치하도록 놓은 후 120℃의 금형온도와 1 내지 2초의 타이머를 사용하여 가접하였다.A base-thermoplastic adhesive film was prepared by attaching a detachable base film to a 3M Thermo-Bond Film 615 series, which is a polyester thermoplastic adhesive film. Cut the base-thermoplastic adhesive film into a shape that fits the case of FIGS. 3 to 5 and place the base-adhesive film so that the adhesive film is in contact with the case, and then use a mold temperature of 120 ° C. and a timer of 1 to 2 seconds. It was temporary.
가접된 접착필름에 부착된 베이스 필름을 접착필름인 3M의 Thermo-Bond Film 615계열부터 제거하여 탈지하였다.The base film attached to the tack-adhesive adhesive film was removed by removing from the 3M Thermo-Bond Film 615 series of adhesive films.
디스플레이커버를 접착필름과 접하도록 케이스에 안착하고, 디스플레이커버를 케이스 방향으로 84kgf의 압력으로 혼을 통하여 가압하였다. 가압된 상태에서 초음파 발생기를 작동하여 28.5μm의 진폭으로 1.1 초 동안 초음파 진동을 디스플레이 커버, 열가소성 접착필름, 및 케이스에 인가하여 본접하였다. 이때 3M의 Thermo-Bond Film 615계열로 이루어진 접착필름이 용융되어 디스플레이커버와 케이스가 접합되었다.The display cover was placed on the case so as to contact the adhesive film, and the display cover was pressed through the horn at a pressure of 84 kgf in the case direction. The ultrasonic generator was operated under pressure to apply ultrasonic vibration to the display cover, the thermoplastic adhesive film, and the case for 1.1 seconds at an amplitude of 28.5 μm, thereby contacting the ultrasonic generator. At this time, the adhesive film made of 3M Thermo-Bond Film 615 series was melted to bond the display cover and the case.
디스플레이커버와 케이스의 접착력을 push-pull tester기를 이용하여 측정한 결과 14kgf이었다.The adhesive force between the display cover and the case was measured using a push-pull tester and found to be 14 kgf.
재작업성을 측정한 결과 3회까지 재작업하여 접합된 디스플레이커버와 케이스의 외관의 변형이 관찰되지 않았다.As a result of measuring the reworkability, no deformation of the appearance of the bonded display cover and the case was observed by reworking up to three times.
실시예 2Example 2
83kgf의 압력으로 혼을 통하여 가압하고 1초 동안 초음파 진동을 인가한 것을 제외하고는 실시예 1과 동일하다.It is the same as Example 1 except it pressurized through the horn at 83kgf and ultrasonic vibration was applied for 1 second.
디스플레이커버와 케이스의 접착력을 push-pull tester기를 이용하여 측정한 결과 13kgf이었다.The adhesive force between the display cover and the case was measured using a push-pull tester, and the result was 13 kgf.
재작업성을 측정한 결과 3회까지 재작업하여 접합된 디스플레이커버와 케이스의 외관의 변형이 관찰되지 않았다.As a result of measuring the reworkability, no deformation of the appearance of the bonded display cover and the case was observed by reworking up to three times.
실시예 3Example 3
니트릴고무를 포함하는 페놀수지 열경화성 접착필름인 TESA사의 #8451 제품에 탈부착이 가능한 베이스 필름을 부착하여 베이스-열경화성 접착필름을 제조하였다. 베이스-열가소성 접착필름을 도 3 내지 5의 케이스에 맞는 형상으로 절단하여 접착필름 쪽이 케이스에 접하도록 열경화성 접착필름인 TESA사의 #8451제품이 위치하도록 놓은 후 150℃의 금형온도와 3초에서 3.5초의 타이머를 사용하여 상기 케이스에 접착시켜 가접하였다.A base-thermosetting adhesive film was prepared by attaching a detachable base film to TESA's # 8451 product, which is a phenol resin thermosetting adhesive film containing nitrile rubber. Cut the base-thermoplastic adhesive film into a shape that fits the case of FIGS. 3 to 5, place the thermosetting adhesive film TESA's # 8451 product so that the adhesive film contacts the case, and place the mold temperature of 150 ° C. and 3.5 to 3 seconds. A second timer was used to glue the case to it.
가접된 열경화성 접착필름에 부착된 베이스 필름을 열경화성 접착필름인 TESA의 #8451제품으로 부터 제거하여 탈지하였다.The base film attached to the temporary thermosetting adhesive film was removed from TESA's # 8451 product, which is a thermosetting adhesive film, and degreased.
디스플레이 커버를 상기 열경화성 접착필름과 접하도록 상기 케이스에 안착하고, 상기 디스플레이 커버를 상기 케이스 방향으로 120kgf의 압력으로 혼을 통하여 가압하였다. 가압된 상태에서 초음파 발생기를 작동하여 35μm의 진폭으로 10초 동안 초음파 진동을 디스플레이 커버, 열경화성 접착필름 및 케이스에 인가하여 본접하였다. 이때 TESA사의 #8451제품으로 이루어진 열경화성 접착필름이 용융되고 경화되어 디스플레이 커버와 케이스가 접합되었다.A display cover was placed on the case so as to contact the thermosetting adhesive film, and the display cover was pressed through the horn at a pressure of 120 kgf in the case direction. Ultrasonic vibration was applied to the display cover, the thermosetting adhesive film, and the case for 10 seconds at an amplitude of 35 μm by operating the ultrasonic generator in a pressurized state, thereby bonding. At this time, the thermosetting adhesive film made of TESA's # 8451 product was melted and cured to bond the display cover and the case.
디스플레이 커버와 케이스의 접착력을 push-pull tester기를 이용하여 측정한 결과 17kgf이었다.The adhesive force between the display cover and the case was measured using a push-pull tester and found to be 17 kgf.
실시예 4Example 4
15초 동안 초음파 진동을 디스플레이 커버에 인가한 것을 제외하고는 실시예 3과 동일하다.Same as Example 3 except that ultrasonic vibration was applied to the display cover for 15 seconds.
디스플레이 커버와 케이스의 접착력을 push-pull tester기를 이용하여 측정한 결과 16kgf이었다.The adhesive force between the display cover and the case was measured using a push-pull tester, and the result was 16 kgf.
비교예 1Comparative Example 1
일반적인 산업용 양면 Tape을 이용하는 접합방법은 테사(TESA) 4967을 사용하였다. 양면 Tape을 제품의 형상으로 절단하여 양면 tape의 하단을 탈지 후 케이스에 위치하도록 수작업으로 붙인 후 양면 tape 상단을 탈지 후 열이 없는 압착기의 금형을 이용하여 2내지 4초의 타이머를 사용하여 4초 동안 5kgf/cm2의 공기압으로 압착하여 디스플레이커버에 접착시켰다.TES 4967 was used as a general method for joining double-sided tape. After cutting the double-sided tape into the shape of the product, remove the bottom of the double-sided tape and manually attach it to the case. After stripping the top of the double-sided tape, use a mold of heatless presser for 4 seconds using a timer of 2-4 seconds. It was pressed with air pressure of 5kgf / cm 2 and adhered to the display cover.
디스플레이커버와 케이스의 접착력을 push-pull tester기를 이용하여 측정한 결과 2.5 kgf이었다.The adhesive force between the display cover and the case was measured using a push-pull tester, and the result was 2.5 kgf.
재작업성을 측정한 결과 케이스와 디스플레이커버의 분리 시 외관의 변형이 일어나 재작업할 수 없었다. 그리고 접착력에 있어 초음파 접착방법에 비해 현저히 떨어졌다.As a result of measuring the reworkability, when the case and the display cover were separated, the appearance was deformed and rework was not possible. In addition, the adhesion was significantly lower than the ultrasonic bonding method.
비교예 2Comparative Example 2
실시예 1에서 사용한 케이스 및 디스플레이커버를 3M PBA 2665 본드를 이용하여 접합시켰다.The case and display cover used in Example 1 were bonded using 3M PBA 2665 bond.
본드를 정량 토출할 수 있도록 제작되어진 디스펜서 장비에 3M PBA 2665 Bond가 담겨진 용기를 장착하고, 케이스 접합라인을 따라서 3M PBA 2665 Bond를 토출한다. 또한 작업이 끝나면 양면 tape의 접합방법과 동일하게 디스플레이커버를 케이스에 위치시키고 열이 없는 압착기의 금형을 이용하여 24 내지 47초의 타이머를 사용하여 37초 동안 5kgf의 압력으로 압착하여 디스플레이커버에 접착시킨 후 상온에서 12시간의 경화시간을 두고 건조 작업을 하면 마무리 하였다. A container containing 3M PBA 2665 Bond is mounted on a dispenser device which is manufactured to discharge the bond quantitatively, and the 3M PBA 2665 Bond is discharged along the case bonding line. In addition, after the work is completed, the display cover is placed on the case in the same manner as the double-sided tape bonding method, and the display cover is pressed onto the display cover by pressing at a pressure of 5 kgf for 37 seconds using a timer of 24 to 47 seconds using a mold of a heatless press. After drying at room temperature with a curing time of 12 hours was finished.
디스플레이커버와 케이스의 접착력을 push-pull tester기를 이용하여 측정한 결과 8.5kgf이었다.The adhesive force between the display cover and the case was measured using a push-pull tester and found to be 8.5 kgf.
재작업성을 측정한 결과 케이스와 디스플레이커버의 분리 시 외관의 변형이 일어나 재작업할 수 없었다. 또한 3M PBA 2665 Bond을 이용한 접합방법은 양면 케이스와 디스플레이커버를 압착 후 상호 접착력 유지를 위해 상온에서 12시간 이상의 건조작업이 이루어져야 하므로 작업능률이 떨어지는 단점이 있으며 초음파 접착방법에 비해 접착력이 작게 나타났다. As a result of measuring the reworkability, when the case and the display cover were separated, the appearance was deformed and rework was not possible. In addition, the bonding method using 3M PBA 2665 Bond has a disadvantage in that the work efficiency is lowered since the drying process must be performed at room temperature for at least 12 hours to maintain mutual adhesive strength after pressing the double-sided case and the display cover, and the adhesion strength is smaller than that of the ultrasonic bonding method.
1) 접착력 측정1) Adhesion Measurement
접착력은 푸쉬-풀 측정기(push-pull tester, Wenzhou Sundoo Instruments 사의 모델 SLJ 500N)를 이용하여 측정하였다. 푸쉬-풀 측정기에 지그를 고정하고 접합된 디스플레이 커버와 케이스를 지그에 안착하였다. 푸쉬-풀 측정기의 게이지 봉이 디스플레이 커버의 상단 및 좌측으로부터 각각 5mm 거리의 위치(a)에 푸쉬-풀 측정기의 게이지 봉이 디스플레이 커버에 접하도록 위치시킨 후 상하로 수직 이동하며 힘을 가하여 케이스와 디스플레이 커버가 분리되는 순간의 접착력을 측정하였다.Adhesion was measured using a push-pull tester (Model SLJ 500N manufactured by Wenzhou Sundoo Instruments). The jig was fixed to the push-pull meter and the bonded display cover and case were seated on the jig. The gauge rod of the push-pull meter is positioned 5 mm from the top and left side of the display cover so that the gauge rod of the push-pull meter is in contact with the display cover. The adhesion force at the moment of separation was measured.
또한, 푸쉬-풀 측정기의 게이지 봉이 디스플레이 커버의 상단 및 좌측으로부터 각각 5mm 거리의 위치(b)에 푸쉬-풀 측정기의 게이지 봉이 디스플레이 커버에 접하도록 위치시킨 후 상하로 수직 이동하며 힘을 가하여 케이스와 디스플레이 커버가 분리되는 순간의 접착력을 측정하였다.In addition, the gauge rod of the push-pull meter is positioned 5 mm from the top and left side of the display cover, respectively, so that the gauge rod of the push-pull meter contacts the display cover, and then moves vertically upward and downward to apply a force to the case. The adhesion force at the moment of disassembly of the display cover was measured.
또한, 푸쉬-풀 측정기의 게이지 봉이 디스플레이 커버의 상단 및 좌측으로부터 각각 5mm 거리의 위치(c)에 푸쉬-풀 측정기의 게이지 봉이 디스플레이 커버에 접하도록 위치시킨 후 상하로 수직 이동하며 힘을 가하여 케이스와 디스플레이 커버가 분리되는 순간의 접착력을 측정하였다.In addition, the gauge rod of the push-pull meter is positioned 5 mm from the top and the left side of the display cover so that the gauge rod of the push-pull meter is in contact with the display cover, and then vertically moved upwards and downwards to apply the force to the case. The adhesion force at the moment of disassembly of the display cover was measured.
또한, 푸쉬-풀 측정기의 게이지 봉이 디스플레이 커버의 상단 및 좌측으로부터 각각 5mm 거리의 위치(d)에 푸쉬-풀 측정기의 게이지 봉이 디스플레이 커버에 접하도록 위치시킨 후 상하로 수직 이동하며 힘을 가하여 케이스와 디스플레이 커버가 분리되는 순간의 접착력을 측정하였다.In addition, the gauge rod of the push-pull meter is positioned 5 mm from the top and the left side of the display cover so that the gauge rod of the push-pull meter is in contact with the display cover. The adhesion force at the moment of disassembly of the display cover was measured.
위치(a), (b), (c) 및 (d)에서 측정한 접착력의 평균값을 표 1에 나타내었다.Table 1 shows the average values of the adhesive forces measured at positions (a), (b), (c) and (d).
2) 재작업성 측정2) Reworkability Measurement
실시예 1 내지 4에서 제작한 접착필름으로 접합된 디스플레이 커버와 케이스에 28 내지 35μm의 진폭으로 1 내지 10초 동안 초음파 발생기를 작동하여 초음파 진동을 인가한 후 디스플레이 커버와 케이스를 분리하였다. 분리된 디스플레이 커버와 케이스를 각각 실시예 1 내지 4와 동일한 방법으로 다시 접합하였다. 다시 접합된 디스플레이 커버와 케이스를 상기 분리방법과 동일한 방법으로 분리하는 것을 케이스와 디스플레이커버의 외관이 변형될 때 까지 접합과 분리를 반복하였다. 상기 케이스와 디스플레이 커버의 외관이 변형되기 바로 전까지의 접합과 분리의 반복횟수를 측정하여 표 1에 나타내었다.The display cover and the case were separated by applying an ultrasonic vibration by operating the ultrasonic generator for 1 to 10 seconds with an amplitude of 28 to 35 μm to the display cover and the case bonded with the adhesive film prepared in Examples 1 to 4. The separated display cover and the case were bonded again in the same manner as in Examples 1 to 4, respectively. Bonding and separating were repeated until the exterior of the case and the display cover were deformed to separate the bonded display cover and the case in the same manner as the separation method. Table 1 shows the number of repetitions of bonding and separating until the appearance of the case and the display cover is deformed.
비교예 1의 경우, 상온에서 상기 양면테이프로 접합된 디스플레이 커버와 케이스를 분리하고 분리된 디스플레이 커버와 케이스를 다시 상기 양면테이프로 비교예 1과 동일한 방법으로 접합하는 것을 케이스와 디스플레이커버의 외관이 변형될 때 까지 반복하였다. 상기 케이스와 디스플레이 커버의 외관이 변형되기 바로 전까지의 접합과 분리의 반복횟수를 측정하여 표 1에 나타내었다.In Comparative Example 1, the case of the display cover and the display cover were separated from each other by separating the display cover and the case bonded to the double-sided tape at room temperature and then bonding the separated display cover and the case to the double-sided tape in the same manner as in Comparative Example 1. Repeat until deformed. Table 1 shows the number of repetitions of bonding and separating until the appearance of the case and the display cover is deformed.
비교예 2의 경우, 상온에서 상기 접착제로 접합된 디스플레이 커버와 케이스를 분리하고, 분리된 디스플레이 커버와 케이스를 다시 상기 접착제로 비교예 2와 동일한 방법으로 접합하는 것을 케이스와 디스플레이커버의 외관이 변형될 때 까지 반복하였다. 상기 디스플레이 커버와 케이스의 외관이 변형되기 바로 전까지의 접합과 분리의 반복횟수를 측정하여 표 1에 나타내었다.In the case of Comparative Example 2, the display cover and the case separated by the adhesive at room temperature were separated, and the appearance of the case and the display cover was modified by bonding the separated display cover and the case again with the adhesive in the same manner as in Comparative Example 2. Repeat until Table 1 shows the number of repetitions of bonding and detachment until the appearance of the display cover and the case is deformed.
표 1
접착필름 접합방법 접착력(kgf) 재작업성(반복회수)
실시예 1 열가소성 초음파법 14.0 3
실시예 2 열가소성 초음파법 13.0 3
실시예 3 열경화성 초음파법 17.0 0
실시예 4 열경화성 초음파법 16.0 0
비교예 1 양면테이프 양면테이프법 2.5 0
비교예 2 본드 본드법 8.5 0
Table 1
Adhesive film Joining method Adhesive force (kgf) Reworkability (Repeat Count)
Example 1 Thermoplastic Ultrasonography 14.0 3
Example 2 Thermoplastic Ultrasonography 13.0 3
Example 3 Thermosetting Ultrasonography 17.0 0
Example 4 Thermosetting Ultrasonography 16.0 0
Comparative Example 1 Double-sided tape Double sided tape method 2.5 0
Comparative Example 2 bond Bond Law 8.5 0
표 1을 참고하면, 종래기술로서 양면테이프을 이용하는 접합방법, 접착제인 본드를 이용하는 접합방법은 접착력이 접착 필름을 이용한 초음파 접합방법에 비하여 현저히 떨어졌다. 또한 열가소성 접착필름을 사용하는 접착방법은 재작업성이 우수하였으며, 열경화성 접착필름, 양면테이프 또는 본드를 사용하는 접합방법은 접착재료의 특성으로 인하여 재작업하는 것이 어려웠다.Referring to Table 1, the bonding method using a double-sided tape, the bonding method using a bond as an adhesive as the prior art was significantly lower than the ultrasonic bonding method using an adhesive film. In addition, the adhesive method using the thermoplastic adhesive film was excellent in reworkability, and the bonding method using the thermosetting adhesive film, the double-sided tape or the bond was difficult to rework due to the characteristics of the adhesive material.

Claims (14)

  1. (a) 접착필름을 제1피착부재와 접하도록 형성하는 단계; 및(a) forming an adhesive film to be in contact with the first adhesion member; And
    (b) 제2피착부재를, 제1피착부재와 접하도록 형성된 접착필름에 접하도록 형성하고, 초음파 발생기를 사용하여 접착필름을 용융 또는 경화시켜 제1피착부재와 제2피착부재를 접합시키는 단계;를 (b) forming the second adhered member to contact the adhesive film formed to contact the first adhered member, and melting or curing the adhesive film using an ultrasonic generator to bond the first adhered member to the second adhered member. ;
    포함하는 접착필름을 이용한 초음파 접합방법.Ultrasonic bonding method using an adhesive film containing.
  2. 제1항에 있어서, (a)단계는, The method of claim 1, wherein step (a)
    접착필름과 접착필름에 탈부착 가능하게 구비된 베이스필름을 포함하는 베이스-접착필름을 제1피착부재에 가접하는 가접단계; 및A temporary welding step of welding the base-adhesive film including the adhesive film and a base film detachably attached to the adhesive film to the first adhered member; And
    베이스 필름을 가접된 베이스-접착필름에서 제거하는 탈지단계;를 Degreasing step of removing the base film from the bonded base-adhesive film;
    포함하여 이루어지고,Made, including
    (b)단계는 제2피착부재를, 가접된 접착필름에 접하도록 형성하고, 제2피착부재를 제1피착부재 방향으로 압착하며, 초음파 발생기를 사용하여 초음파 진동을 제1피착부재, 접착필름 및 제2피착부재 중 선택된 1종 이상에 인가하여 접착필름을 용융 또는 경화시켜 제2피착부재를 제1피착부재와 상호 결합시키는 본접단계인 것을 특징으로 하는 접착필름을 이용한 초음파 접합방법. In step (b), the second adherent member is formed to be in contact with the bonded adhesive film, the second adherent member is pressed in the direction of the first adherent member, and ultrasonic vibration is applied to the first adherent member and the adhesive film using an ultrasonic generator. And a bonding step in which the adhesive film is melted or cured by applying to at least one selected from the second coating members to bond the second coating member to the first coating member.
  3. 접착필름과 접착필름에 탈부착 가능하게 구비된 베이스필름을 포함하는 베이스-접착필름을 전자제품의 케이스에 가접하는 가접단계;A temporary step of welding a base-adhesive film including an adhesive film and a base film detachably attached to the adhesive film to a case of an electronic product;
    베이스 필름을 가접된 베이스-접착필름에서 제거하는 탈지단계; 및A degreasing step of removing the base film from the welded base-adhesive film; And
    디스플레이커버 또는 장식부재를, 가접된 접착필름에 접하도록 형성하고, 디스플레이커버 또는 장식부재를 케이스 방향으로 압착하며, 초음파 발생기를 사용하여 초음파 진동을 케이스, 디스플레이커버 또는 장식부재, 및 접착필름 중 선택된 1종 이상에 인가하여 접착필름을 용융 또는 경화시켜 디스플레이커버 또는 장식부재를 케이스와 상호 결합시키는 본접단계;를 The display cover or decorative member is formed to be in contact with the bonded adhesive film, the display cover or decorative member is pressed in the direction of the case, and the ultrasonic vibration is selected using a ultrasonic generator to select the case, the display cover or the decorative member, and the adhesive film. Applying at least one melted or cured adhesive film bonding step of bonding the display cover or decorative member with the case;
    포함하는 것을 특징으로 하는 접착필름을 이용한 초음파 접합방법.Ultrasonic bonding method using an adhesive film comprising a.
  4. 제1항 또는 제2항에 있어서, 초음파의 진폭은 10 내지 50μm인 것을 특징으로 하는 접착필름을 이용한 초음파 접합방법.The ultrasonic bonding method according to claim 1 or 2, wherein the amplitude of the ultrasonic waves is 10 to 50 µm.
  5. 제1항 또는 제2항에 있어서, 접착필름의 녹는점은 제1피착부재 및 제2피착부재 중 녹는점이 더 낮은 어느 하나의 녹는점 보다 낮은 것을 특징으로 하는 접착필름을 이용한 초음파 접합방법.The ultrasonic bonding method according to claim 1 or 2, wherein the melting point of the adhesive film is lower than any one of the lower melting points of the first and second adherend members.
  6. 제5항에 있어서, 접착필름의 녹는점은 제1피착부재 및 제2피착부재 중 녹는점이 더 낮은 어느 하나의 녹는점 보다 20℃ 이상 낮은 것을 특징으로 하는 접착필름을 이용한 초음파 접합방법.The method of claim 5, wherein the melting point of the adhesive film is an ultrasonic bonding method using an adhesive film, characterized in that 20 ° C or more lower than any one of the lower melting point of the first and second adherend members.
  7. 제1항에 있어서, 접착필름은 열가소성 접착필름 및 열경화성 접착필름 중에서 선택된 1종 이상인 것을 특징으로 하는 접착필름을 이용한 초음파 접합방법.The method of claim 1, wherein the adhesive film is an ultrasonic bonding method using an adhesive film, characterized in that at least one selected from a thermoplastic adhesive film and a thermosetting adhesive film.
  8. 제7항에 있어서, 열가소성 접착필름은 폴리에스터, 폴리올레핀, 폴리에틸렌, 폴리프로필렌, 에틸렌-프로필렌 공중합체, 에틸렌-α-올레핀 공중합체, 폴리스티렌, 염화비닐수지, 폴리카보네이트, 폴리이미드, 폴리아미드(나일론), 페녹시수지, 아크릴수지, 아크릴로니트릴부타디엔스티렌, 부타디엔스티렌, 폴리아릴레이트, 폴리아세탈, 폴리에틸렌테레프탈레이트, 폴리부틸렌테레프탈레이트, 폴리에테르에테르케톤, 폴리페닐렌설피드, 폴리벤조이미다졸, 폴리에테르이미드, 폴리에테르설폰, 폴리에테르에테르케톤, 아크릴 수지 및 에틸렌-아크릴 공중합체로 이루어진 군으로부터 선택된 1종 이상을 포함하는 것을 특징으로 하는 접착필름을 이용한 초음파 접합방법.The method of claim 7, wherein the thermoplastic adhesive film is polyester, polyolefin, polyethylene, polypropylene, ethylene-propylene copolymer, ethylene-α-olefin copolymer, polystyrene, vinyl chloride resin, polycarbonate, polyimide, polyamide (nylon ), Phenoxy resin, acrylic resin, acrylonitrile butadiene styrene, butadiene styrene, polyarylate, polyacetal, polyethylene terephthalate, polybutylene terephthalate, polyether ether ketone, polyphenylene sulfide, polybenzoimidazole, Ultrasonic bonding method using an adhesive film comprising at least one selected from the group consisting of polyetherimide, polyethersulfone, polyetheretherketone, acrylic resin and ethylene-acryl copolymer.
  9. 제7항에 있어서, 열경화성 접착필름은 열경화성 성분을 포함하는 것을 특징으로 하는 접착필름을 이용한 초음파 접합방법.The ultrasonic bonding method using an adhesive film according to claim 7, wherein the thermosetting adhesive film comprises a thermosetting component.
  10. 제7항에 있어서, 열경화성 접착필름은 The method of claim 7, wherein the thermosetting adhesive film
    열경화성 성분 및 경화제 중에서 선택된 1종 이상; 및 At least one selected from a thermosetting component and a curing agent; And
    열가소성 성분 및 고무 성분 중에서 선택된 1종 이상;을 At least one selected from thermoplastic components and rubber components;
    포함하는 것을 특징으로 하는 접착필름을 이용한 초음파 접합방법.Ultrasonic bonding method using an adhesive film comprising a.
  11. 제9항 또는 제10항에 있어서, 열경화성 성분은 페놀수지, 멜라민수지, 멜라민-이소시아네잇튜레잇 부가 생성물(melamineisocyanaturate addut), 에폭시수지, 폴리카프로락톤 변성 에폭시수지, 글리시딜 에틸렌 공중합체 및 멜라민이소시아누릭산 합성물로 이루어진 군으로부터 선택된 1종 이상인 것을 특징으로 하는 접착필름을 이용한 초음파 접합방법.The thermosetting component according to claim 9 or 10, wherein the thermosetting component is phenol resin, melamine resin, melamineisocyanaturate addut, epoxy resin, polycaprolactone modified epoxy resin, glycidyl ethylene copolymer and Ultrasonic bonding method using an adhesive film, characterized in that at least one member selected from the group consisting of melamine isocyanuric acid composite.
  12. 제10항에 있어서, 경화제는 방향족 아민 화합물, 산무수물(anhydride), 페놀수지, 폴리아미드, 디시안디아마이드(DICY), 디하이드라이드 화합물, 아민덕트계 화합물, 이미다졸 화합물, 하이드라진 화합물, 우레아 화합물, 2-페닐-4-메틸-5-하이드록시 메틸이미다졸, 3-(3,4-디클로로페닐)-1,1-디메틸우레아(DCMU), 설포늄염, 포스포늄염, 비페닐에테를블락카본산 및 다가카본산 활성에스테르로 이루어진 군으로부터 선택된 1종 이상인 것을 특징으로 하는 접착필름을 이용한 초음파 접합방법.The curing agent according to claim 10, wherein the curing agent is an aromatic amine compound, anhydride, phenol resin, polyamide, dicyandiamide (DICY), dihydride compound, amine duct compound, imidazole compound, hydrazine compound, urea compound , 2-phenyl-4-methyl-5-hydroxy methylimidazole, 3- (3,4-dichlorophenyl) -1,1-dimethylurea (DCMU), sulfonium salt, phosphonium salt, biphenyl ether Ultrasonic bonding method using an adhesive film, characterized in that at least one member selected from the group consisting of block carboxylic acid and polycarboxylic acid active ester.
  13. 제10항에 있어서, 열가소성 성분은 폴리에스터, 폴리올레핀, 폴리에틸렌, 폴리프로필렌, 에틸렌-프로필렌 공중합체, 에틸렌-α-올레핀 공중합체, 폴리스티렌, 염화비닐수지, 폴리카보네이트, 폴리이미드, 폴리아미드(나일론), 페녹시수지, 아크릴수지, 아크릴로니트릴부타디엔스티렌, 부타디엔스티렌, 폴리아릴레이트, 폴리아세탈, 폴리에틸렌테레프탈레이트, 폴리부틸렌테레프탈레이트, 폴리에테르 에테르 케톤, 폴리페닐렌설피드, 폴리벤조이미다졸, 액정고분자, 폴리에테르이미드, 폴리에테르설폰, 폴리에테르에테르케톤, 아크릴 수지 및 에틸렌-아크릴 공중합체로 이루어진 군으로부터 선택된 1종 이상인 것을 특징으로 하는 접착필름을 이용한 초음파 접합방법.The thermoplastic component according to claim 10, wherein the thermoplastic component is polyester, polyolefin, polyethylene, polypropylene, ethylene-propylene copolymer, ethylene-α-olefin copolymer, polystyrene, vinyl chloride resin, polycarbonate, polyimide, polyamide (nylon) , Phenoxy resin, acrylic resin, acrylonitrile butadiene styrene, butadiene styrene, polyarylate, polyacetal, polyethylene terephthalate, polybutylene terephthalate, polyether ether ketone, polyphenylene sulfide, polybenzoimidazole, liquid crystal Ultrasonic bonding method using an adhesive film, characterized in that at least one selected from the group consisting of a polymer, polyetherimide, polyethersulfone, polyetheretherketone, acrylic resin and ethylene-acryl copolymer.
  14. 제10항에 있어서, 고무성분은 에틸렌프로필렌디엔고무(EPDM), 니트릴 고무(acrylonitrile butadiene rubber), 스티렌-부타디엔 수지(styrene butadiene resin), 부틸고무, 천연고무, 스티렌-부타디엔-아크릴 수지(styrene butadiene arcryl resin), 클로로프렌 고무, 초저밀도 에틸렌-α-올레핀 공중합체 및 실리콘 고무로 이루어진 군으로부터 선택된 1종 이상인 것을 특징으로 하는 접착필름을 이용한 초음파 접합방법.The rubber component according to claim 10, wherein the rubber component is ethylene propylene diene rubber (EPDM), nitrile rubber (acrylonitrile butadiene rubber), styrene-butadiene resin, butyl rubber, natural rubber, styrene-butadiene-acrylic resin (styrene butadiene) arcryl resin), chloroprene rubber, ultra-low density ethylene-α-olefin copolymer and silicone rubber, the ultrasonic bonding method using an adhesive film, characterized in that at least one member selected from the group consisting of.
PCT/KR2011/003600 2010-05-18 2011-05-16 Ultrasonic bonding method using adhesive film WO2011145853A2 (en)

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