WO2018016699A1 - Thermal bonding adhesive composition, thermal bonding double-sided adhesive tape, method for manufacturing thermal bonding double-sided adhesive tape, and method for using thermal bonding double-sided adhesive tape - Google Patents

Abstract

The present invention provides a thermal bonding adhesive composition comprising: a rubber-based binder resin; an epoxy-based thermosetting resin; and a thermoplastic elastomer polyurethane resin.

Description

Manufacturing method of heat-sealing adhesive composition, heat-sealing double-sided adhesive tape and heat-sealing double-sided adhesive tape and method of using heat-sealed double-sided adhesive tape

The present invention relates to a method for producing a heat-sealed adhesive composition, a heat-sealed double-sided adhesive tape and a heat-sealed double-sided adhesive tape, and a method for using a heat-sealed double-sided adhesive tape.

The heat-sealed adhesive may be formed of a resin that generates adhesive force by heat and pressure when heated to a predetermined temperature, and such resin may generate adhesive force by a curing agent when heat is applied to a thermoplastic resin system that is melted by heat to generate adhesive force. Thermosetting resins.

In general, a thermosetting resin is used or a thermoplastic resin is used in consideration of the characteristics of the applied product. Thermosetting resin has a disadvantage in that the time to stabilize the adhesive resin is stabilized, the thermoplastic resin has the advantage of relatively low temperature fusion, but may be a problem in high temperature durability.

One embodiment of the present invention provides a heat-sealed adhesive composition excellent in high temperature durability, excellent adhesion.

Another embodiment of the present invention provides a heat-sealed double-sided adhesive tape having excellent high temperature durability and excellent adhesion.

Another embodiment of the present invention provides a method of manufacturing a heat-sealed double-sided adhesive tape having excellent high temperature durability and excellent adhesion.

Another embodiment of the present invention provides a method of using a heat-sealed double-sided adhesive tape excellent in high temperature durability, excellent adhesion.

In one embodiment of the invention, rubber-based binder resin; Epoxy thermosetting resins; And it provides a heat-sealed adhesive composition comprising a thermoplastic elastomer polyurethane resin.

In another embodiment of the present invention, a heat-sealed adhesive layer, wherein the heat-sealed adhesive layer provides a heat-sealed double-sided adhesive tape comprising a rubber-based binder resin, an epoxy-based thermosetting resin and a thermoplastic elastomer polyurethane resin.

In another embodiment of the present invention, on a release film layer: provides a method for producing a double-sided adhesive tape comprising the step of applying the heat-sealing adhesive composition, and drying to form a heat-sealing adhesive layer.

In another embodiment of the present invention, after attaching one surface of the heat-sealed adhesive layer of the heat-sealed double-sided adhesive tape to the first adherend, the heat-sealed adhesive layer is pre-tacked by first heating and pressing ; And bonding the other surface of the heat fusion adhesive layer to a second adherend, and then activating the heat fusion adhesive layer by secondary heating and pressing of the heat fusion adhesive layer. It includes, and provides a method of using a heat-sealed double-sided adhesive tape for bonding the first adherend and the second adherend through the heat-sealed adhesive layer.

The heat-sealed double-sided adhesive tape including a heat-sealed adhesive layer prepared from the heat-sealed adhesive composition is excellent in high-temperature durability while at the same time excellent in adhesive strength.

1 is a schematic cross-sectional view of a heat-sealed double-sided adhesive tape according to an embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

In order to clearly describe the present invention, parts irrelevant to the description are omitted, and like reference numerals designate like elements throughout the specification.

In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. In the drawings, the thicknesses of layers and regions are exaggerated for clarity.

In one embodiment of the invention, rubber-based binder resin; Epoxy thermosetting resins; And it provides a heat-sealed adhesive composition comprising a thermoplastic elastomer polyurethane resin.

The rubber binder resin serves to improve the coating property, punching processability, high temperature dimensional stability, and pre-tacking of the heat-sealing adhesive composition.

Since the rubber-based binder resin can maintain a high viscosity at a relatively high temperature compared to other materials used as a binder component of the adhesive, it serves to hold the epoxy-based thermosetting resin with a low viscosity at a high temperature does not flow.

According to the type of the rubber binder resin, it is possible to adjust the modulus of the heat-sealed adhesive prepared from the heat-sealed adhesive composition.

Examples of the rubber-based binder resin capable of realizing predetermined modulus properties include nitrile butadiene rubber, styrene-butadiene-styrene (SBS) rubber, styrene-ethylene-butylene-styrene (SEBS) rubber, styrene-isobutylene -Styrene (SIBS) rubber, hydroxy-containing styrene-butadiene-styrene (SBS-OH) -based rubber, hydroxy-containing nitrile butadiene (NBR-OH) rubber, and the like.

In one embodiment, the rubber binder resin may be a hydroxy-containing styrene-butadiene-styrene (SBS-OH) -based rubber or a hydroxy-containing nitrile butadiene rubber (NBR-OH) rubber. When the rubber-based binder resin contains a hydroxy group, since the hydroxy group is connected with the epoxy group of the epoxy-based thermosetting resin, the rubber-based binder resin may not only serve as a physical binder but also as a chemical binder.

Since the thermoplastic elastomer polyurethane resin is a thermoplastic resin and used together with the epoxy-based thermosetting resin, the heat-sealing adhesive composition includes both the thermoplastic resin of the thermoplastic elastomer polyurethane resin and the thermosetting resin of the epoxy-based thermosetting resin. do. The heat fusion adhesive composition may improve adhesion by increasing the toughness and impact resistance characteristics by the thermoplastic resin while imparting high temperature durability characteristics by the thermosetting resin.

The thermoplastic elastomer polyurethane resin is also referred to as TPU (Thermoplastic polyurethane), and is a material having moldability at a high temperature but a rubber elastomer at room temperature.

As the size of the thermoplastic elastomer polyurethane resin particles, particles having an appropriate particle size are used in consideration of the thickness of the adhesive layer to be formed.

In one embodiment, the thermoplastic elastomer polyurethane resin may be particles having an average particle diameter of 5㎛ 20㎛. The heat-sealing adhesive composition includes a thermoplastic elastomer polyurethane resin having an average particle diameter in a range, so that when the adhesive layer has a predetermined thickness, for example, 25 µm to 150 µm, the thermoplastic elastomer polyurethane resin is formed on the surface of the adhesive layer. It is easy to disperse evenly in the adhesive layer without being exposed to

The average particle diameter of the thermoplastic elastomer polyurethane resin may be measured as a number average particle diameter through SEM.

The epoxy-based thermosetting resin is a thermosetting resin added so that the heat-sealing adhesive prepared from the heat-sealing adhesive composition can be thermally cured.

Specifically, the epoxy-based thermosetting resin may be a polyfunctional epoxy resin, a bisphenol-based epoxy resin, a novolak-type epoxy resin, a naphthalene-type epoxy resin, a trisphenol methane-type epoxy resin, a glycidyl amine-type epoxy resin, or a combination thereof. It may include one selected from the group consisting of.

The thermal fusion adhesive composition may include 1 to 25 parts by weight, specifically, 5 to 22 parts by weight of the thermoplastic elastomer polyurethane resin, relative to 100 parts by weight of the epoxy-based thermosetting resin. The heat fusion adhesive composition may include the thermoplastic elastomer polyurethane resin in the content range to impart a certain level of rigidity to the heat fusion adhesive prepared from the heat fusion adhesive composition.

The weight ratio of the rubber-based binder resin to the epoxy-based thermosetting resin in the heat fusion adhesive composition may be 0.5: 1 to 0.7: 1, specifically, 0.60: 1 to 0.63: 1. The heat-sealed adhesive composition may mix the rubber-based binder resin and the epoxy-based thermosetting resin in the content ratio, impart a predetermined modulus to the heat-sealed adhesive to be manufactured, improve high temperature durability, and at the same time, realize excellent adhesion. . Specifically, since the epoxy-based thermosetting resin is higher in content than the rubber-based binder, it is possible to implement excellent adhesion, and because the epoxy-based thermosetting resin has a relatively high modulus, the rubber-based binder resin is blended to lower the modulus. The modulus of the adhesive differs in the required level depending on the application. For example, a low modulus adhesive is suitable for soft fibers, and a high modulus adhesive is suitable for hard construction. Therefore, when a low modulus is to be realized, for example, a rubber-based binder resin such as NBR can be used to lower the modulus a lot, and when a high modulus is to be realized, a modulus can be slightly reduced by using a rubber-based binder resin such as SBS. Can be.

The heat fusion adhesive composition may further include a thermosetting agent. The thermosetting agent is the epoxy-based thermosetting resin when the thermal fusion adhesive prepared from the thermal fusion adhesive composition is heated to heat activation (in the present specification, "heat activation" means to exert adhesive force by applying heat). The heat curing reaction is allowed to exhibit an adhesive force. In order for the thermal fusion adhesive prepared from the thermal fusion adhesive composition to thermally activate only at a high temperature, so that an unwanted thermal activation reaction does not occur, a thermosetting agent may be selected according to a desired thermal curing temperature. That is, according to the curing temperature of the thermosetting agent, the heat activation temperature of the heat fusion adhesive can be adjusted. For example, when a thermosetting agent having a high curing temperature is used, the heat treatment temperature for the film formation is lower than the curing temperature of the thermosetting agent during the heat treatment in the drying process for forming the heat-sealing adhesive composition. It may be easy to maintain the adhesive inactive state so as not to unnecessarily heat activate.

Specific examples of the thermosetting agent include an imidazole series thermosetting agent having a curing temperature of about 130 ° C., or an aromatic amine thermosetting agent and a diamine toluene thermosetting agent having a curing temperature of about 180 ° C. And combinations thereof, but is not limited thereto.

The heat fusion adhesive composition may control the thermal curing rate and the thermal curing start temperature during thermal activation by adjusting the type and content of the thermal curing agent. For example, in order to adjust the thermosetting initiation temperature of the thermal fusion adhesive composition, a thermosetting agent having a predetermined thermosetting initiation temperature may be selected, and in addition, by adjusting the content of the thermosetting agent, the thermal fusion adhesive composition The thermosetting start temperature can be adjusted.

In one embodiment, the heat fusion adhesive composition may include 1 to 20 parts by weight of the thermosetting agent relative to 100 parts by weight of the epoxy-based thermosetting resin.

As described above, the thermal fusion adhesive composition is used together with the thermosetting resin of the epoxy-based thermosetting resin and the thermoplastic resin of the thermoplastic elastomer polyurethane resin to improve the adhesion reliability according to the high temperature durability characteristics, and at the same time excellent rigidity and impact resistance Can secure the characteristics. The heat-sealing adhesive composition can adjust the required balance between the respective physical properties more precisely, depending on the specific use thereof, such adjustment is the above-described components, rubber-based binder resin, epoxy-based thermosetting resin and thermoplastic elastomer polyurethane It may be possible by adjusting each specific kind and content of the resin.

In addition, the heat-sealing adhesive composition, in order to implement suitable physical properties according to the purpose, an additive comprising one selected from the group consisting of a solvent, a silane coupling agent, a brightening agent, a wettability improving agent, an antifoaming agent, an antioxidant, a thickener and combinations thereof It may further include.

In another embodiment of the present invention, there is provided a heat-sealed double-sided adhesive tape comprising a heat-sealed adhesive layer, the heat-sealed adhesive layer comprises a rubber-based binder resin, an epoxy-based thermosetting resin and a thermoplastic elastomer polyurethane resin.

The heat fusion adhesive layer is prepared from the heat fusion adhesive composition described in detail above.

The heat-sealed double-sided adhesive tape is formed before the heat-sealed adhesive layer is heat activated, the heat-sealed double-sided adhesive tape may further include a release film layer on one side or both sides. Since the heat fusion adhesive layer is before heat activation, it does not necessarily require a release film layer because it does not exert an adhesive force, but is wound and stored with a heat fusion double-sided adhesive tape including a release film layer formed on one surface of the heat fusion adhesive layer. It is preferable because the heat-sealing adhesive layer can be prevented from contacting each other.

In order to apply the heat-sealed double-sided adhesive tape to bond two different adherends, the heat-sealed adhesive layer must be thermally activated. It is advantageous in the heat activation process to thermally activate the heat fusion adhesive layer by indirectly applying heat and pressure to the heat fusion adhesive layer through the release film of the heat fusion double-sided adhesive tape.

The release film layer may be used a conventional release film used to protect the adhesive surface, such as adhesive or double-sided adhesive tape, can be prepared using a known material.

1 is a cross-sectional view of a heat-sealed double-sided adhesive tape 100 including a heat-sealed adhesive layer 10 and a release film layer 20 formed on one surface thereof.

In the double-sided adhesive tape 100, the heat-sealed adhesive layer 10, as described above, is provided in an adhesive inactive state, it can be used to exert the adhesive force by applying heat and pressure when applied to the adherend to heat activation. .

When the heat-sealing adhesive layer 10 is heated to thermally activate, the epoxy-based thermosetting resin is thermally cured to form a thermoset matrix having a network structure, and the thermoplastic elastomer polyurethane resin is dispersed in the thermoset matrix of the network structure. do. As the epoxy-based thermosetting resin is thermoset, the thermal fusion adhesive layer 10 exerts an adhesive force.

Detailed descriptions of the rubber binder resin and the epoxy thermosetting resin are as described above.

For example, the rubber binder resin may be nitrile butadiene rubber, styrene-butadiene-styrene (SBS) rubber, styrene-ethylene-butylene_styrene (SEBS) rubber, styrene-isobutylene-styrene (SIBS) rubber And hydroxy-containing styrene-butadiene-styrene (SBS-OH) rubbers, hydroxy-containing nitrile butadiene rubber (NBR-OH) rubbers, and the like.

For example, the epoxy thermosetting resin may be a polyfunctional epoxy resin, a bisphenol epoxy resin, a novolac epoxy resin, a naphthalene epoxy resin, a trisphenol methane type epoxy resin, a glycidyl amine type epoxy resin, or a combination thereof. It may be selected from the group consisting of.

The thermal fusion adhesive layer 10 may include 1 to 25 parts by weight, specifically, 5 to 20 parts by weight of the thermoplastic elastomer polyurethane resin, relative to 100 parts by weight of the epoxy-based thermosetting resin. The thermal fusion adhesive layer 10 may include a thermoplastic elastomer polyurethane resin in the content range, and may be given a predetermined level of rigidity.

The weight ratio of the rubber-based binder resin to the epoxy-based thermosetting resin in the thermal fusion adhesive layer 10 may be 0.5: 1 to 0.7: 1, specifically, 0.60: 1 to 0.63: 1. The heat-sealed adhesive composition may mix the rubber-based binder resin and the epoxy-based thermosetting resin in the content ratio, impart a predetermined modulus to the heat-sealed adhesive to be manufactured, improve high temperature durability, and at the same time, realize excellent adhesion. .

The thermal fusion adhesive layer 10 may further include a thermosetting agent. The thermosetting agent may cause the heat-sealing adhesive layer 10 to exhibit an adhesive force by causing the epoxy-based thermosetting resin to undergo a thermosetting reaction when the heat-sealing adhesive layer 10 is heated.

Detailed description of the thermosetting agent is as described above. The thermosetting agent may include, for example, one selected from the group consisting of imidazole-based thermosetting agents, aromatic amine-based thermosetting agents, diamine toluene-based thermosetting agents, and combinations thereof.

By selecting the type of the thermosetting agent in accordance with the curing temperature, it is possible to control the temperature at which the epoxy-based thermosetting resin of the thermal fusion adhesive layer 10 the thermosetting reaction.

In one embodiment, the heat-sealing adhesive layer may be a thermosetting reaction of the epoxy-based thermosetting resin at 130 to 180 ℃.

When the heat-sealing adhesive layer 10 is heated, the epoxy-based thermosetting resin is thermally cured to form a thermosetting matrix having a network structure, and the thermoplastic elastomer polyurethane resin in a granular state is melted, and is further contained in the thermosetting matrix of the network structure. It will be distributed evenly. The thermoplastic elastomer polyurethane resin may be completely melted after adhesion activation by heating, and thus may not maintain a particulate state.

The thickness of the thermal fusion adhesive layer 10 can be appropriately adjusted according to the use. For example, the heat fusion adhesive layer 10 may have a thickness of 25 μm to 150 μm.

Since the double-sided adhesive tape has excellent adhesive strength and high temperature durability, it can exhibit excellent adhesion to various materials. For example, the double-sided adhesive tape exhibits excellent adhesion and excellent heat resistance even in difficult materials such as FPCB, nonwoven filter, and plastic. As a result, it is very useful for bonding two different materials. For example, the present invention can be applied to a wide range of applications, such as a medium for bonding components in an electronic device, such as adhesion of a printed circuit board in an electronic device, and a medium for attaching a plastic interior material of a vehicle to a metal exterior material. It is not limited.

In another embodiment of the present invention, on a release film layer: provides a method for producing a double-sided adhesive tape comprising the step of applying and drying the heat-sealed adhesive composition to form a heat-sealed adhesive layer.

By the manufacturing method of the said double-sided adhesive tape, the said double-sided adhesive tape can be manufactured.

The heat fusion adhesive layer is formed into a film while the heat fusion adhesive composition is dried by heat treatment while a solvent or the like is volatilized, and the heat curing reaction of the epoxy-based thermosetting resin should not occur during film formation. Therefore, the temperature of the heat treatment process for drying the heat-sealing adhesive composition, that is, forming the heat-sealing adhesive layer, should then be lower than the heat treatment temperature for thermally activating the heat-sealing adhesive layer.

For example, the heat fusion adhesive layer may be thermally activated at 130 to 200 ° C. according to the heat curing start temperature of the thermal initiator, and the drying process for forming the heat fusion adhesive layer may be performed at a temperature lower than the heat curing start temperature, for example. For example, it may be carried out at a temperature of 80 to 110 ℃.

In another embodiment of the present invention, after attaching one surface of the heat-sealed adhesive layer of the heat-sealed double-sided adhesive tape to the first adherend, the heat-sealed adhesive layer is pre-tacked by first heating and pressing ; And a bonding step of activating the heat fusion adhesive layer by attaching the other surface of the heat fusion adhesive layer to the second adherend, and subsequently heating and pressing the heat fusion adhesive layer secondly. It provides a method of using a heat-sealed double-sided adhesive tape for bonding the first adherend and the second adherend through the media.

The epoxy-based thermosetting resin is thermoset during the bonding process. In the temporary welding step, the primary heating temperature of the temporary welding step should be lower than the secondary heating temperature of the temporary contact step so that thermosetting of the epoxy-based thermosetting resin is not started.

For example, the primary heating of the juncture step may be performed at 70 to 120 ° C., and the secondary heating of the juncture step may be performed at 130 to 230 ° C.

The method of using the heat-sealed double-sided adhesive tape further includes a first cooling step of cooling the heat-sealed adhesive layer after the temporary welding step and before the contacting step, and a second cooling step of cooling the heat-sealed adhesive layer after the welding step. can do.

In one embodiment, according to the method of using the heat-sealed double-sided adhesive tape, it is possible to adhere the first adherend and the second adherend using the heat-sealed double-sided adhesive tape. As described above, the heat fusion double-sided adhesive tape may be a product in which a release film layer is laminated on one surface of the heat fusion adhesive layer. First, one surface of the heat-sealed adhesive layer on which a release film layer is not formed is attached to the first adherend, and heat and pressure are applied to the heat-sealed adhesive layer through a release film layer to perform a temporary welding step. Through the temporary welding step, the heat-sealing adhesive layer generates a preliminary level of adhesion. After performing the provisional step, a first cooling step is performed for convenience of handling. Next, the release film layer is removed, and the second adherend is attached to the surface from which the release film layer is removed. For the heat-sealed adhesive layer to which the first adherend and the second adherend are attached, heat and pressure are applied through the first adherend or the second adherend to perform a bonding step. Subsequently, a second cooling step is performed.

Hereinafter, examples and comparative examples of the present invention are described. Such following examples are only examples of the present invention, and the present invention is not limited to the following examples.

(Example)

Example 1

60 parts by weight of nitrile butadiene (NBR) rubber, 100 parts by weight of novolac epoxy resin, 5 parts by weight of thermoplastic elastomer polyurethane resin (TPU, average particle diameter: 15 μm), 5 parts by weight of imidazole series thermosetting agent and solvent (toluene and methyl Mixed solvent of ethyl ketone) was mixed to prepare a heat-sealed adhesive composition.

Applying the heat-sealing adhesive composition to a 100 μm thick release film layer prepared separately, hot-air dried at 110 ℃ for about 3 minutes to form a 50 μm thick heat-sealed adhesive layer to the heat-sealed double-sided structure as shown in FIG. An adhesive tape was prepared.

Example 2

61 parts by weight of hydroxy-containing styrene-butylene-styrene (SBS-OH) rubber, 100 parts by weight of novolak epoxy resin, 21 parts by weight of thermoplastic elastomer polyurethane resin (TPU, average particle diameter: 15 μm), imidazole thermal curing agent 8 parts by weight and a solvent (a mixed solvent of toluene and methyl ethyl ketone) were mixed to prepare a heat seal adhesive composition.

Applying the heat-sealing adhesive composition to a separately prepared 100 μm thick release film layer, and further laminated another 100 μm thick release film layer on the applied heat-sealed adhesive composition, and then hot air at 110 ℃ for about 3 minutes Drying to form a 50 μm-thick heat-sealed adhesive layer to prepare a heat-sealed double-sided adhesive tape having a structure as shown in FIG.

Comparative Example 1

60 parts by weight of nitrile butadiene (NBR) rubber, 100 parts by weight of a novolak epoxy resin, 5 parts by weight of an imidazole series thermosetting agent, and a solvent (a mixed solvent of toluene and methyl ethyl ketone) were mixed to prepare a heat-sealed adhesive composition.

Applying the heat-sealing adhesive composition to a separately prepared 100 μm thick release film layer, and further laminated another 100 μm thick release film layer on the applied heat-sealed adhesive composition, and then hot air at 110 ℃ for about 3 minutes Drying to form a 50 μm-thick heat-sealed adhesive layer to prepare a heat-sealed double-sided adhesive tape having a structure as shown in FIG.

Comparative Example 2

Only the thermoplastic elastomer polyurethane resin (TPU, average particle diameter: (15) mu m) was mixed with a solvent (a mixed solvent of toluene and methyl ethyl ketone) to prepare a heat-sealed adhesive composition.

Applying the heat-sealing adhesive composition to a separately prepared 100 μm thick release film layer, and further laminated another 100 μm thick release film layer on the applied heat-sealed adhesive composition, and then hot air at 110 ℃ for about 3 minutes Drying to form a 50 μm-thick heat-sealed adhesive layer to prepare a heat-sealed double-sided adhesive tape having a structure as shown in FIG.

Comparative Example 3

Hydroxy group-containing styrene-butylene-styrene (SBS-OH) rubber 61 parts by weight, novolac epoxy resin 100 parts by weight, imidazole-based thermosetting agent 8 parts by weight and a solvent (mixed solvent of toluene and methyl ethyl ketone) A thermal fusion adhesive composition was prepared.

Applying the heat-sealing adhesive composition to a separately prepared 100 μm thick release film layer, and further laminated another 100 μm thick release film layer on the applied heat-sealed adhesive composition, and then hot air at 110 ℃ for about 3 minutes Drying to form a 50 μm-thick heat-sealed adhesive layer to prepare a heat-sealed double-sided adhesive tape having a structure as shown in FIG.

evaluation

Experimental Example 1: Adhesive force (peel force) characteristics

In the heat-sealed double-sided adhesive tapes prepared in Example 1 and Comparative Examples 1-2, a 2.5 cm wide heat-sealed adhesive layer, in which no release film layer was formed, was attached to a 2.5 cm wide, 30 μm thick aluminum foil layer, and 90 degreeC heat and pressure were applied to the film layer upper part, and it was made to contact, and it cooled. The other surface from which the release film layer of the heat fusion adhesive layer was removed was attached to a glass plate having a thickness of 1 mm. After heat and pressure of 200 ° C. was applied to the aluminum foil layer, the thermal fusion adhesive layer was thermally activated and bonded, and then cooled. The adhesive of the aluminum foil layer-thermal fusion adhesive layer-glass plate was peeled off under the following conditions, and the adhesive force was evaluated, and the results are shown in Table 1 below.

Peel force test conditions: room temperature, 180 degrees (angle), 300 mm / min (speed)

Experimental Example 2 (shear strength and modulus characteristics with curing time)

In the heat-sealed double-sided adhesive tapes prepared in Example 2 and Comparative Example 3, a heat-sealed adhesive layer having a width of 2 cm * 2 cm, in which no release film layer was formed, was attached to a stainless steel metal plate, and the heat of 90 ° C. was applied to the release film layer. It was allowed to cool after cooling. On the other side, the release film layer of the heat-sealing adhesive layer was removed and attached to another stainless steel metal plate. Heat was applied to the upper portion of the stainless metal plate at 200 ° C. to heat bond the thermal fusion adhesive layer. With respect to the adhesive of the stainless steel plate-heat fusion adhesive layer-stainless metal plate, the shear strength and modulus according to the curing time of the heat fusion adhesive layer were measured under the following conditions, and the results are shown in Table 2 below.

Shear strength and modulus measurement conditions:

-Measurement equipment: Texture Analyzer (Stable Micro Systems)

Measurement conditions: 140 ° C, 6mm / min (speed)

division	Adhesion (Peeling) [g / in]
Example 1	1823
Comparative Example 1	1056
Comparative Example 2	1300

From the results of Table 1, it was confirmed that the heat-sealed double-sided adhesive tape of Example 1 implements a high adhesive strength.

division	Curing time [min]	Face vertical direction		Plane horizontal direction
		Shear strength [g]	Modulus [g / mm]	Shear strength [g]	Modulus [g / mm]	Stiffness [gmm]
Example 2	15	38262	36083	-	-	-
	30	39787	35616	-	-	-
	45	39791	35599	4212	18868	1760
Comparative Example 3	15	16812	34531	-	-	-
	30	31347	35597	-	-	-
	45	39821	37062	3516	13950	950

From the results of Table 2, it was confirmed that the heat-sealed double-sided adhesive tape of Example 2 will increase the adhesive strength by implementing a high shear strength and modulus. In addition, when Example 2 evaluated the adhesiveness in the plane horizontal direction than Comparative Example 3, it was confirmed that the rigidity is higher, which may be due to the impact of the thermoplastic elastomer polyurethane resin. Among the above results, only the modulus value of the curing time of 45 minutes was shown that Comparative Example 3 had a higher result than Example 2, but the modulus value of the curing time of 45 minutes of Example 2 does not mean an absolutely inferior result, except for this. It should be noted that the remaining values showed better results than Comparative Example 3.

Although the preferred embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concepts of the present invention defined in the following claims are also provided. It belongs to the scope of the invention.

[Description of the code]

10: heat seal adhesive layer

20: release film layer

100: double sided adhesive tape

Claims (26)

1. Rubber binder resins;

   Epoxy thermosetting resins; And

   Thermoplastic elastomer composition; comprising a thermoplastic elastomer polyurethane resin.
2. The method of claim 1,

   The rubber binder resin is nitrile butadiene rubber, styrene-butadiene-styrene (SBS) rubber, styrene-ethylene-butylene_styrene (SEBS) rubber, hydroxy-containing styrene-butadiene-styrene (SBS-OH) rubber, Styrene-isobutylene-styrene (SIBS) based rubber, hydroxy-containing nitrile butadiene rubber (NBR-OH) rubber, and combinations thereof.

   Heat Fusion Adhesive Compositions.
3. The method of claim 1,

   The thermoplastic elastomer polyurethane resin is a particle having an average particle diameter of 5㎛ 20㎛

   Heat Fusion Adhesive Compositions.
4. The method of claim 1,

   The epoxy-based thermosetting resin is selected from the group consisting of polyfunctional epoxy resins, bisphenol-based epoxy resins, novolac-type epoxy resins, naphthalene-type epoxy resins, tris phenol methane-type epoxy resins, glycidyl amine-type epoxy resins and combinations thereof Containing one

   Heat Fusion Adhesive Compositions.
5. The method of claim 1,

   The heat-sealing adhesive composition is 1 to 25 parts by weight of the thermoplastic elastomer polyurethane resin, compared to 100 parts by weight of the total of the epoxy-based thermosetting resin

   Heat Fusion Adhesive Compositions.
6. The method of claim 5,

   The weight ratio of the rubber-based binder resin to the epoxy-based thermosetting resin is 0.5: 1 to 0.7: 1

   Heat Fusion Adhesive Compositions.
7. The method of claim 1,

   The heat fusion adhesive composition further comprises a thermosetting agent

   Heat Fusion Adhesive Compositions.
8. The method of claim 7, wherein

   The thermosetting agent includes one selected from the group consisting of imidazole-based thermosetting agent, aromatic amine-based thermosetting agent, diamine toluene-based thermosetting agent and combinations thereof

   Heat Fusion Adhesive Compositions.
9. The method of claim 1,

   The heat-sealing adhesive composition further comprises an additive comprising one selected from the group consisting of a solvent, a silane coupling agent, a brightener, a wettability improving agent, an antifoaming agent, an antioxidant, a thickener, and a combination thereof.

   Heat Fusion Adhesive Compositions.
10. A heat-sealed adhesive layer,

    The heat fusion adhesive layer includes a rubber binder resin, an epoxy thermosetting resin, and a thermoplastic elastomer polyurethane resin.

    Heat Seal Double Sided Adhesive Tape.
11. The method of claim 10,

    The rubber binder resin includes nitrile butadiene rubber, styrene-butadiene-styrene (SBS) rubber, styrene-ethylene-butylene_styrene (SEBS) rubber, styrene-isobutylene-styrene (SIBS) rubber, hydroxy-containing Styrene-butadiene-styrene (SBS-OH) -based rubber, hydroxy-containing nitrile butadiene rubber (NBR-OH) rubber, and combinations thereof

    Heat Seal Double Sided Adhesive Tape.
12. The method of claim 10,

    The epoxy-based thermosetting resin is selected from the group consisting of polyfunctional epoxy resins, bisphenol-based epoxy resins, novolac-type epoxy resins, naphthalene-type epoxy resins, tris phenol methane-type epoxy resins, glycidyl amine-type epoxy resins and combinations thereof Containing one

    Heat Seal Double Sided Adhesive Tape.
13. The method of claim 10,

    The heat-sealing adhesive layer is included in an amount ratio of 1 to 25 parts by weight of the thermoplastic elastomer polyurethane resin with respect to 100 parts by weight of the total of the epoxy-based thermosetting resin.

    Heat Seal Double Sided Adhesive Tape.
14. The method of claim 10,

    In the heat-sealing adhesive layer, the weight ratio of the rubber-based binder resin to the epoxy-based thermosetting resin is 0.5: 1 to 0.7: 1

    Heat Seal Double Sided Adhesive Tape.
15. The method of claim 10,

    The heat fusion adhesive composition further comprises a thermosetting agent

    Heat Seal Double Sided Adhesive Tape.
16. The method of claim 15,

    The thermosetting agent includes one selected from the group consisting of imidazole-based thermosetting agent, aromatic amine-based thermosetting agent, diamine toluene-based thermosetting agent and combinations thereof

    Heat Seal Double Sided Adhesive Tape.
17. The method of claim 10,

    When the heat-sealing adhesive layer is heated, the epoxy-based thermosetting resin is thermoset to form a thermosetting matrix having a network structure, and the thermoplastic elastomer polyurethane resin is dispersed in the thermosetting matrix of the network structure.

    Heat Seal Double Sided Adhesive Tape.
18. The method of claim 10,

    The heat-sealed adhesive layer has a thickness of 25 μm to 150 μm

    Heat Seal Double Sided Adhesive Tape.
19. The method of claim 10,

    In the heat-sealing adhesive layer, the epoxy-based thermosetting resin starts a thermosetting reaction at 130 to 180 ° C.

    Heat Seal Double Sided Adhesive Tape.
20. The method of claim 10,

    The release film layer is laminated on one side or both sides of the heat-sealing adhesive layer

    Heat Seal Double Sided Adhesive Tape.
21. On the release film layer: A method for producing a double-sided adhesive tape comprising the step of applying the heat-sealed adhesive composition according to any one of claims 1 to 9, and drying to form a heat-sealed adhesive layer.
22. Attaching one surface of the heat-sealed adhesive layer of the heat-sealed double-sided adhesive tape according to claim 10 to a first adherend, and then pre-tacking the heat-sealed adhesive layer by primary heating and pressing; And

    A bonding step of activating the heat fusion adhesive layer by attaching the other surface of the heat fusion adhesive layer to a second adherend, and subsequently heating and pressing the heat fusion adhesive layer;

    A method of using a heat-sealed double-sided adhesive tape comprising a, wherein the heat-bonded adhesive layer is bonded to the first adherend and the second adherend.
23. The method of claim 22,

    The primary heating of the temporary step is carried out at 70 to 120 ℃,

    Second heating of the bonding step is carried out at 130 to 230 ℃

    Then, cooling the heat-sealed adhesive layer

    How to use heat-sealed double-sided adhesive tape.
24. The method of claim 22,

    A first cooling step of cooling the thermal fusion adhesive layer after the temporary welding step and before the bonding step, and a second cooling step of cooling the heat fusion adhesive layer after the adhesion step;

    How to use heat-sealed double-sided adhesive tape.
25. The method of claim 22,

    The heat-sealed double-sided adhesive tape further includes a release film layer laminated on the one surface of the heat-sealed adhesive layer,

    The welding step is performed by applying heat and pressure to the release film layer,

    The bonding step is performed by applying heat and pressure to the first adherend or the second adherend.

    How to use heat-sealed double-sided adhesive tape.
26. The method of claim 22,

    The epoxy-based thermosetting resin is thermoset during the bonding process

    How to use heat-sealed double-sided adhesive tape.

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