WO2011145530A1

WO2011145530A1 - Vacuum processing apparatus, method for processing object to be processed, and film forming apparatus

Info

Publication number: WO2011145530A1
Application number: PCT/JP2011/061087
Authority: WO
Inventors: 貴久山崎; 高博中山; 正明平川; 剛加賀美; 一誠東條; 章渡辺
Original assignee: 株式会社アルバック
Priority date: 2010-05-18
Filing date: 2011-05-13
Publication date: 2011-11-24
Also published as: TW201209915A; JPWO2011145530A1

Abstract

Disclosed are: a vacuum processing apparatus which comprises a sealing structure wherein a sealing member, which is formed from a resin, is prevented from being irradiated with light; a method for processing an object to be processed, wherein the vacuum processing apparatus is used; and a film forming apparatus which comprises the vacuum processing apparatus. Specifically disclosed is a vacuum processing apparatus which comprises: a vacuum processing chamber (41); a stage (43); a light-transmitting partition wall (44) that is affixed to the upper surface of the side wall that forms an upper opening portion of the vacuum processing chamber; and a light irradiation device (45) that is arranged outside the vacuum processing chamber. The vacuum processing apparatus also comprises: a first sealing member (46a) that is formed from a resin and provided on the upper peripheral portion of the light-transmitting partition wall; a second sealing member (46b) that is formed from a resin and provided on a portion of the upper surface of the side wall of the vacuum processing chamber, on said portion the light-transmitting partition wall is not provided; and a pressing member (47) that is a member pressing the first and second sealing members and seals the vacuum processing chamber together with the first sealing member and the second sealing member. An object to be processed is processed using the vacuum processing apparatus. A film forming apparatus comprises the vacuum processing apparatus.

Description

Vacuum processing apparatus, processing object processing method, and film forming apparatus

The present invention relates to a vacuum processing apparatus, a processing object processing method, and a film forming apparatus, and in particular, a vacuum processing apparatus having a sealing structure that prevents a sealing member for sealing a light transmissive partition wall from being irradiated with ultraviolet rays. The present invention also relates to a processing method of a processing object using the vacuum processing apparatus, and a film forming apparatus including the vacuum processing apparatus.

It is necessary to suppress signal transmission delay and increase in power consumption as semiconductor elements are miniaturized and highly integrated. For this reason, in order to reduce the capacitance between wirings, a technique has been developed that uses an interlayer insulating film made of a low dielectric constant material as a wiring film.

As a technique for producing a low dielectric constant film, a low dielectric constant film (for example, a low-k material) for producing an interlayer insulating film by applying a spin coater is applied on a processing target to form a low dielectric constant film. It is known that a low dielectric constant film having sufficient mechanical strength is produced by heating an object and irradiating the low dielectric constant film with ultraviolet rays to cure (see, for example, Patent Document 1).

Also, a low dielectric constant film having a sufficient mechanical strength is obtained by depositing a low dielectric constant film on the object to be processed by a CVD apparatus, heating the object to be processed, and curing the deposited low dielectric constant film by irradiating ultraviolet rays. It is known to produce a film on a processing object (see, for example, Patent Document 2).

When producing a low dielectric constant film as described above, the step of irradiating and curing ultraviolet rays includes a mechanism for heating the object to be processed and a mechanism for irradiating the object to be processed in the vacuum processing chamber (ultraviolet irradiation apparatus). It is implemented using the vacuum processing apparatus provided with. Some of these ultraviolet irradiation apparatuses are installed outside the vacuum processing apparatus. In this case, an ultraviolet transmission window (for example, a quartz window) is fixedly installed in the upper opening of the vacuum processing chamber. Is irradiated onto a processing object placed in the processing chamber through the transmission window. In the case of vacuum sealing with this ultraviolet light transmitting window fixed, there are many cases where a resin sealing member is used, but there is no technology that takes into account the deterioration of the sealing member.

As described above, in a vacuum processing apparatus used for treating the surface of an object to be treated by light irradiation such as ultraviolet irradiation, a light transmissive partition made of quartz is used, and light is irradiated through the partition. Since this quartz is a hard and highly plastic material, it is generally not made of a hard material such as a metal gasket as a sealing member when providing a light-transmitting partition wall in a vacuum processing apparatus. A material made of a soft and elastic resin material such as a Teflon (registered trademark) ring is used. Such a seal member is often installed on the vacuum side at the upper part of the casing 11 constituting the vacuum processing apparatus as shown in FIG. 1 and below the edge of the light transmissive partition wall 12. In addition, by using the atmospheric pressure mainly applied to the light transmissive partition wall 12, the light transmissive partition wall 12 is pressed against the resin seal member 13 and sealed. In FIG. 1, 14 is a wafer support stage, and 15 is a wafer to be processed.

However, using an ultraviolet irradiation device installed outside the vacuum processing apparatus, it is placed in the apparatus through a quartz window, which is a light-transmitting partition wall vacuum-sealed with the resin material provided above the apparatus. In the case of a vacuum processing apparatus that performs ultraviolet irradiation processing on the processed object, there are the following problems.

For example, as shown in FIG. 2, a casing 21, a quartz window 22 installed on the top thereof, and a seal member 23 (for example, installed on the vacuum side between the quartz window 22 and the top of the casing 21 (for example, , O-ring, etc.), which is sealed in the same manner as in FIG. 1, in a quartz window from an ultraviolet irradiation device 24 such as an ultraviolet lamp installed outside the device. When the ultraviolet ray is irradiated onto the wafer 26 to be processed placed on the stage 25 through 22, the ultraviolet ray is irradiated not only on the wafer 26 but also on the resin seal member 23. As a result, there is a problem that bonds such as carbon-carbon bonds in the resin are broken by ultraviolet rays, and the resin is decomposed and deteriorated. Furthermore, since organic impurities generated by the decomposition of the resin are generated in the vacuum processing apparatus, there is a problem that the inside of the apparatus and the object to be processed are contaminated.

In the vacuum processing apparatus shown in FIG. 2, if the ultraviolet irradiation apparatus is installed inside the apparatus, it is not necessary to use a quartz window. Therefore, the above problem does not occur. From the standpoint of the surface and the poor maintainability of the apparatus, the ultraviolet irradiation device is preferably installed outside the vacuum processing apparatus.

Further, as a countermeasure against the above problem, in a vacuum processing apparatus similar to FIG. 2, as shown in FIG. 3, a blocking member 37 that partially blocks ultraviolet rays on the atmosphere side of the quartz window 32 provided on the upper portion of the housing 31. It is conceivable to provide a method in which ultraviolet rays are not irradiated to the resin seal member 33 (for example, O-ring). In FIG. 3, 34 is an ultraviolet irradiation device, 35 is a wafer support stage, and 36 is a wafer.

In this case, in order to prevent the sealing member 33 from being irradiated with ultraviolet rays, it is necessary to block a corresponding area of the quartz window 32 which is a light-transmitting partition. However, since the quartz window 32 needs to be thick enough to withstand atmospheric pressure, the ultraviolet transmission area decreases as the blocking area increases, and ultraviolet light that reaches the wafer 36 that is the object to be processed. There exists a problem that intensity | strength falls and irradiation light intensity distribution will deteriorate.

For example, as shown in FIG. 3, in order to provide the blocking member 37 and prevent the sealing member 33 from being irradiated with ultraviolet rays, the ultraviolet rays passing through the quartz window 32 fall within the range of lines A and B. The light intensity of the ultraviolet rays that reach the wafer 36 is reduced. In addition, if the housing 31 and the quartz window 32 are scaled up in order to increase the ultraviolet transmission area, the cost is increased and the thickness of the quartz window 32 needs to be increased in order to maintain sufficient strength against atmospheric pressure. There is a problem that the area to be blocked is further increased, and the light intensity of ultraviolet rays reaching the wafer 36 is further decreased.

JP 2008-4628 A JP 2006-165573 A

An object of the present invention is to solve the above-described problems, and a vacuum processing apparatus having a sealing structure that prevents a resin seal member from receiving light irradiation such as ultraviolet irradiation, and the vacuum processing apparatus. An object of the present invention is to provide a processing method of a processing object to be used and a film forming apparatus provided with the vacuum processing apparatus.

The vacuum processing apparatus of the present invention is a light-transmitting device fixedly installed on the upper surface of a side wall forming a vacuum processing chamber, a stage for placing a processing object, and an upper opening of the vacuum processing chamber. A vacuum processing apparatus having a partition and a light irradiation device outside the vacuum processing chamber, the first sealing member made of resin provided on the upper surface edge of the light transmissive partition, and the vacuum processing chamber A resin-made second seal member provided in a portion of the upper surface portion of the side wall where the light-transmissive partition wall is not installed, and a pressing member for the first seal member and the second seal member, the first seal A pressing member that seals the vacuum processing chamber with the member and the second sealing member is provided.

In the above vacuum processing apparatus, the light irradiation device is an ultraviolet irradiation device.

In the above vacuum processing apparatus, the pressing member is further provided with a flange member for partitioning the first seal member and the second seal member.

The vacuum processing apparatus according to the present invention also has a light transmission that is fixedly installed on a vacuum processing chamber, a stage for placing an object to be processed, and an upper surface of a side wall that forms an upper opening of the vacuum processing chamber. A vacuum processing apparatus having a conductive partition and a light irradiation device outside the vacuum processing chamber, the clearance between the side surface of the light transmissive partition wall and the side wall of the vacuum processing chamber facing the side surface A resin sealing member provided to seal the portion and a pressing member for the sealing member are provided.

The processing target object processing method according to the present invention is an upper surface of a side wall that forms an upper opening of a vacuum processing chamber from a light irradiation device with respect to a processing target formed on a surface placed in a vacuum processing chamber. A first sealing member made of resin provided on the upper surface edge of the light-transmitting partition wall when irradiating light through a light-transmitting partition wall fixed to the part and processing the object to be processed; A resin-made second seal member provided on a portion of the upper surface of the side wall of the vacuum processing chamber where the light-transmitting partition is not installed, and a pressing member for the first seal member and the second seal member. The first sealing member and the second sealing member are provided with a pressing member that seals the vacuum processing chamber. It is characterized by treating the membrane.

In the above processing object processing method, the light irradiation device is an ultraviolet irradiation device.

In the method for processing an object to be processed, the film is a low dielectric constant film.

The film forming apparatus of the present invention includes a coating apparatus for use in forming a film on a processing target, the vacuum processing apparatus, and a processing target having a film formed by coating using the coating apparatus. A load / unload chamber for loading and unloading objects into and from the vacuum processing chamber is provided.

In the above film forming apparatus, the film formed using the coating apparatus is a low dielectric constant film.

According to the present invention, the resin sealing member is not irradiated with light energy such as ultraviolet rays, and as a result, bonds such as carbon-carbon bonds in the resin are cut by light energy such as ultraviolet rays. As a result, the degradation of the resin is solved, and organic impurities caused by the decomposition of the resin are not generated in the vacuum processing device. It is possible to achieve an effect that the problem of the problem is solved.

According to the present invention, since a specific seal structure is adopted, the transmission area of light such as ultraviolet rays is not reduced, the intensity of light reaching the object to be processed is lowered, and the irradiation light intensity distribution is deteriorated. It is possible to achieve an effect that the device cost is not reduced, and an effect that the apparatus cost is not different from the conventional one.

The conceptual diagram which shows typically an example of a structure of the conventional vacuum processing apparatus. The conceptual diagram which shows typically another example of a structure of the conventional vacuum processing apparatus. The conceptual diagram which shows typically another example of a structure of the conventional vacuum processing apparatus. The conceptual diagram which shows typically one Embodiment of the structure of the vacuum processing apparatus of this invention. The conceptual diagram which shows typically one Embodiment of the structure of the film-forming apparatus of this invention. The conceptual diagram which shows typically one Embodiment of the structure of the vacuum processing apparatus of the related invention of this invention. The conceptual diagram which shows typically another embodiment of the structure of the vacuum processing apparatus of the related invention of this invention. The conceptual diagram which shows typically another embodiment of the structure of the vacuum processing apparatus of the related invention of this invention.

Hereinafter, embodiments of the present invention will be described with reference to FIGS. 4 (a) and 4 (b) and FIG. For convenience of explanation, a case where an ultraviolet irradiation device is used as a light irradiation device, a quartz window is used as a light transmissive partition, and a wafer is used as a processing object will be described as an example.

According to FIG. 4A showing an embodiment of a vacuum processing apparatus according to the present invention, this vacuum processing apparatus includes a vacuum processing chamber 41 as a housing, a stage 43 for mounting a wafer 42, and A heating means (not shown) such as a lamp means for heating the wafer 42 installed below the stage 43 to a predetermined temperature and an upper surface of the side wall forming the upper opening of the vacuum processing chamber 41 are fixed. Light-transmitting partition walls (quartz windows) 44 (there is no limitation on the shape thereof, but examples thereof include a square shape and a disk shape), that is, at least the upper surface portion of the side wall of the vacuum processing chamber 41 A vacuum having a quartz window 44 fixed to a part (for example, an edge on the vacuum side) and a light irradiation device (ultraviolet irradiation device) 45 such as an ultraviolet lamp provided outside the vacuum processing chamber 41. A processing apparatus for the quartz window 44; A resin-made first seal member (for example, O-ring) 46a provided at the surface edge and a resin-made resin provided in a portion of the upper surface of the side wall of the vacuum processing chamber 41 where the light-transmitting partition is not provided. A second sealing member (for example, O-ring) 46b, and a pressing member 47 that seals the vacuum processing chamber 41 with the first sealing member 46a and the second sealing member 46b (both edges of the pressing member 47 include As shown in the figure, a flange member that is a protrusion is provided.), So that the vacuum processing chamber 41 can be vacuum-sealed. The lower surface edge portion of the quartz window 44 may be installed on a part of the vacuum side of the upper surface portion of the side wall of the vacuum processing chamber 41, and the quartz window 44 is a side surface of the quartz window 44 as shown in the figure. The upper surface of the side wall of the vacuum processing chamber 41 facing the upper surface of the quartz window and the upper surface of the quartz window may be placed flush with each other.

In the above case, in order to partition the two

seal members

46a and 46b, the pressing member 47 may be provided with a flange member which is a protruding portion between the two seal members.

The dimensions of the sealing

members

46a and 46b may be the same or different. For example, the first seal member 46a may be larger than the second seal member 46b.

Although not shown in FIG. 4A, only the first seal member 46a is provided as a seal member, and an ultraviolet resistant material such as metal (for example, Al, Ti, etc.) is provided at a position corresponding to the second seal member 46b. A member made of Fe, Ni, Cu, Ag, SUS, or the like may be provided. The pressing member for pressing the first seal member 46a is a pressing member provided with hook members which are protrusions on both edge portions.

Further, as shown in FIG. 4B, sealing may be performed with one sealing member 46. In this case, it is preferable to narrow the clearance between the side surface of the quartz window 44 and the side surface of the side wall of the vacuum processing chamber 41. As shown in FIG. 4B, the seal member 46 is provided so as to seal a clearance portion between the side surface of the quartz window 44 and the side surface of the side wall of the vacuum processing chamber 41 facing the side surface. Yes. In FIG. 4B, the lower surface of the protrusion of the flange member 47 a which is a protrusion provided on the edge of the pressing member 47 is fixed to the upper surface of the quartz window 44 and the upper surface of the side wall of the vacuum processing chamber 41, respectively. Thus, the seal member 46 is pressed down, and as a result, the inside of the vacuum processing chamber 41 is vacuum-sealed.

If the vacuum processing apparatus shown in FIG. 4A is used, the surface of the wafer 42 placed on the stage 43 is passed through the quartz window 44 from the ultraviolet irradiation apparatus 45 such as an ultraviolet lamp installed above the outside of the apparatus. The wafer 42 that can be irradiated with ultraviolet rays and on which various films are formed can be processed. In this case, the ultraviolet rays are irradiated only on the wafer 42, and the ultraviolet rays are not irradiated on the resin-made first sealing member 46a and the second sealing member 46b. As a result, bonds such as carbon-carbon bonds in the resin are not broken by ultraviolet rays, and the resin is not decomposed and deteriorated. Therefore, organic impurities generated by the decomposition of the resin are not generated in the vacuum processing apparatus, and the inside of the apparatus and the wafer are not contaminated. The same applies to the case of FIG.

In the case of FIGS. 4A and 4B, as described above, the sealing member is arranged at a position where the ultraviolet ray is irradiated only on the wafer 42 and not on the sealing member. However, when the sealing member is disposed at a position where ultraviolet rays may be irradiated, the pressing member 47 is made of an ultraviolet blocking material (for example, Be, B, C, Mg, Al, Si, P, Ca, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Se, As, Sr, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, In, Sn, Sb, Te, Ba, Hf, Ta, W, Re, Os, Ir, Pt, Au, Hg, Tl, Pb, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, At least one metal selected from Ho, Er, Tm, Yb, Lu, Ac, Th, Pa, U, Np, Pu, Am, Cm, Bk, Cf, Es, Fm, Md, No, and Lr; And alloys selected from at least two of these metals At least one kind, as well as oxides of these metals, nitrides, and may be made of at least one and a) of a compound selected from fluoride.

The sealing member may be made of a fluororesin (for example, Teflon (registered trademark)), fluororubber, nitrile rubber, silicon rubber, chloroprene rubber, or the like. (Registered trademark) seal member and the like.

According to the embodiment of the processing method of the processing object according to the present invention, this processing method can be performed using the vacuum processing apparatus shown in FIG. That is, the wafer 42 on which a thin film such as a low dielectric constant film placed in the vacuum processing chamber 41 is formed is irradiated with ultraviolet rays from the ultraviolet irradiation device 45 through a quartz window 44 provided in the vacuum processing chamber 41. When processing the thin film on the surface of the wafer 42, a resin-made first seal member (for example, O-ring) 46 a provided on the upper surface edge of the quartz window 44 and the upper surface of the side wall of the vacuum processing chamber 41. A resin-made second seal member (for example, O-ring) 46b and a pressing member 47 for pressing the first seal member 46a and the second seal member 46b, provided at the edge thereof. Through a quartz window of a quartz window member configured so that the vacuum processing chamber 41 can be vacuum-sealed by a sealing structure including a pressing member 47 having a flange member 47a which is a protruding portion. 42 the surface of a method of processing a thin film by performing UV irradiation. In this case, a flange member that is a protrusion for partitioning the first seal member 46a and the second seal member 46b may be provided between the two seal members. In the case of FIG. 4B, the thin film can be processed in the same manner.

By using such a quartz window member, when the wafer 42 is processed, ultraviolet rays are irradiated only to the wafer 42, and ultraviolet rays are irradiated to the resin-made first seal member 46a and the second seal member 46b. Absent. As a result, as described above, during the treatment process, bonds such as carbon-carbon bonds in the resin are not broken by ultraviolet rays, so that the resin is not decomposed and deteriorated. Therefore, organic impurities generated by the decomposition of the resin are not generated in the vacuum processing apparatus, and the inside of the apparatus and the wafer are not contaminated.

The processing method of the processing object according to the present invention will be described in more detail as follows when a low dielectric constant film is used as the processing target film and this film is cured.

In this treatment method, for example, first, a known low dielectric constant material coating solution (for example, coating solution manufactured by ULVAC, Inc .: ULKS (registered trademark)) is applied onto a wafer at a predetermined rotation speed by a spin coater. To do. This coating method is not limited, and any method that is usually used may be used as long as it can be applied uniformly. After the wafer on which the coating solution has been uniformly applied is baked at a low temperature (for example, about 70 to 150 ° C.), the wafer having the low dielectric constant film formed thereon is transported into a vacuum processing apparatus and used as a lamp heating means. In a state where the wafer is heated to a predetermined temperature (for example, 350 ° C.) by an appropriate heating means, the low dielectric constant film is cured by irradiating the wafer with ultraviolet rays from an ultraviolet irradiation device, and having a predetermined mechanical strength. Can be formed.

After obtaining the low dielectric constant film as described above, the process proceeds to a process of further laminating another film on the low dielectric constant film or processing the low dielectric constant film as desired.

According to FIG. 5 showing an embodiment of a film forming apparatus according to the present invention, this film forming apparatus includes a coating apparatus 51 for use in forming a thin film such as a low dielectric constant film on a wafer, and the like. 4A and 4B, a vacuum processing apparatus 52, which is a vacuum processing apparatus, and a wafer having a thin film formed by coating using the coating apparatus 51 are carried into and out of the vacuum processing chamber. Load / unload chamber (L / UL chamber) 53 for the wafer, and the wafer stored in the load / unload chamber 53 passes through the transfer chamber 54 in which the transfer robot is installed. Then, the thin film is processed there, and then transferred to a load / unload chamber (L / UL chamber) 53.

After processing a thin film as described above, if another thin film is further formed on this film or other processing is performed as desired, such a thin film forming process or other processing process is performed. One or a plurality of apparatuses 55 to be performed can be arranged around the transfer chamber 54, and can be configured to be carried in / out by a transfer robot in the transfer chamber 54 to perform each processing.

The vacuum processing apparatus shown in FIG. 4 has been described by taking an ultraviolet irradiation apparatus as a light energy source and a quartz window, which is an ultraviolet transmission window as a light transmissive partition, as an example for convenience of description. Even if an optical energy source such as an infrared irradiation device, an X-ray generation device, a laser generation device, a visible light generation device, a glass material other than a quartz window, or a light-transmitting barrier such as sapphire, CaF ₂ , or MgF ₂ is applied. A vacuum processing apparatus capable of performing the above process can be configured. In addition, the vacuum processing apparatus has been specifically described as an example of an apparatus for processing a processing object in which a low dielectric constant material is formed on a surface by applying a low dielectric constant material using a spin coater. The present invention can also be applied to processing of a processing object on which a low dielectric constant film or other film is formed by a film forming apparatus such as the above. In addition, the present invention can be applied to the treatment of the substrate surface itself on which no film is formed.

As a processing method that can be carried out using the vacuum processing apparatus of the present invention, in addition to the above, the following application is possible as processing by ultraviolet irradiation in vacuum. For example, (1) when the above-described low dielectric constant material is used, holes can be introduced to produce a film having a low dielectric constant and a low refractive index. (2) Nano-sized quartz or the like is resisted. It can be hardened by ultraviolet irradiation (+ heat) in a state of being pressed against the surface, peeled off, and transferred to a pattern to create a pattern in which bubbles do not enter or difficult to enter. (3) Organic matter on the substrate surface by ultraviolet irradiation The surface of the substrate can be modified by removing the substrate and improving the adhesion of the surface of the substrate. (4) For those that do not want to be exposed to the atmosphere, the substrate should be exposed to ultraviolet rays in a consistent vacuum. The film can be formed with good adhesion after cleaning.

Hereinafter, the related invention of the present invention described above and the synergistic effect with the effect of the above-described seal structure according to the related invention will be described. For convenience of explanation, the thin film to be processed will be described by taking a low dielectric constant film as an example. However, like the present invention, the thin film is not limited to this film.

In addition to the above-described seal structure of the present invention, the vacuum processing apparatus according to the related invention is further provided inside the vacuum processing chamber, and heats the inside of the vacuum processing chamber and the processing object to obtain a predetermined temperature distribution. And a light transmissive partition wall (for example, an ultraviolet light such as a quartz window) that is a window member that transmits light (for example, a light energy source such as ultraviolet light) from a light irradiation device (for example, an ultraviolet irradiation device). And a blocking member A provided inside the vacuum processing chamber to block heat from the heat source. Since the configuration other than the blocking member is the same as that of the vacuum processing apparatus of the present invention, detailed description thereof is omitted.

Thereby, in addition to the effects of the above-described seal structure, the following effects can be achieved. The same applies to another vacuum processing apparatus described below.

That is, when a processing object such as a wafer is not present, that is, when heating is performed by a heat source as preheating before processing of the processing object, a light transmitting partition or an optical energy source such as ultraviolet rays through the partition is used. Can be blocked by the blocking member A, and when the object to be processed is heated and the energy from the optical energy source is applied, the influence of the heat on the partition walls and the optical energy source in the vacuum processing chamber is eliminated. Only necessary preheating can be performed. Further, since the blocking member A is provided so as to face the partition wall, at least heat from the heat source for the partition wall can be blocked. Further, by blocking the heat to the light transmissive partition wall by the blocking member A, it is possible to prevent the occurrence of cracks due to deformation due to the difference in thermal expansion between the fixed portion of the partition wall and the vacuum processing chamber.

Further, in the vacuum processing apparatus, the vacuum processing chamber is cylindrical, and the partition is fixed and arranged as a ceiling member in the upper opening of the vacuum processing chamber, and a light irradiation device is provided on the atmosphere side of the partition, A stage for supporting the object to be processed may be provided inside the vacuum processing chamber, the heat source may be provided below the stage, and the blocking member A may be formed in a disk shape and provided at the top of the stage.

By comprising in this way, the influence of the heat | fever from the heat source to the light irradiation apparatus through the said partition and a partition can be interrupted | blocked by the shielding member A, and when a process target is heated and irradiated with light, a partition It is possible to eliminate the influence of heat on the light irradiation device and to perform only the necessary preheating. As this partition, a square shape and a disk shape can be mentioned, for example.

The heat source may be a lamp heating means, and is provided at the lower part of the stage. Thus, since the substrate is heated by raising the temperature inside the vacuum processing chamber using the lamp heating means, the substrate can be heated without bringing the heating means into contact with the substrate.

Further, the blocking member A may be configured such that a circular opening is formed in the center portion, and heat to the peripheral edge portion of the partition wall is mainly blocked. Thus, by using the blocking member A having a circular opening at the center, the influence of heat on the fixed portion at the periphery of the partition wall in the metal vacuum processing chamber can be reduced, and the thermal expansion coefficient It is possible to prevent cracks from being generated at the periphery of the partition wall due to the deformation due to the difference between them, and to eliminate the influence of heat on the partition wall and the light irradiation means in the vacuum processing chamber.

Furthermore, a plurality of small holes may be formed in the blocking member A so that the temperature inside the processing chamber is maintained and heat is blocked. As described above, by using the blocking member A in which a plurality of small holes are formed, the temperature in the vacuum processing chamber can be controlled, and the influence of heat on the partition wall and the light irradiation device above the vacuum processing chamber can be eliminated. .

Furthermore, for example, when a low dielectric constant film is formed by applying a composition for a low dielectric constant film to the object to be treated, the film is irradiated with light from a light irradiation device, and the heat source is used. The low dielectric constant film can be cured by heating. During this curing process, it is possible to eliminate the influence of heat on the partition walls and the light energy source in the vacuum processing chamber, and to perform only the necessary preheating.

According to the processing method of the processing object performed using the vacuum processing apparatus provided with the blocking member A described above, the processing object coated with the low dielectric constant film composition is heated and the low dielectric constant film is used. In the processing method of forming a modified thin film on the surface of the processing object by irradiating the thin film obtained from the composition with ultraviolet light or the like from the outside of the vacuum processing chamber, the processing object is processed. Except when performing, the heat at the time of heating the inside of the vacuum processing chamber is cut off from the irradiation source of the light irradiation apparatus and the light transmission portion of the vacuum processing chamber. In this case, for example, when forming a modified thin film by curing a low dielectric constant film, it is possible to eliminate the influence of heat on the light transmission site and the light irradiation treatment, and to perform only necessary preheating.

A film forming apparatus according to a related invention of the present invention is a coating apparatus that applies a composition for a low dielectric constant film to a processing object, and a coating apparatus that uses the coating apparatus to form a low dielectric constant film. The above-described vacuum processing apparatus (that is, the vacuum processing apparatus shown in FIGS. 6 to 8 which will be described in detail below) that can be carried in and cured, for example, and a processing target having a thin film formed by coating with a coating apparatus And a load / unload chamber for loading and unloading objects into and from the vacuum processing chamber. This vacuum processing apparatus eliminates the influence of heat on the vacuum processing chamber and the light energy source in the processing step, and can perform only necessary preheating.

The above-described vacuum processing apparatus eliminates the influence of heat on the light-transmitting partition walls and the energy source in the vacuum processing chamber during the process of heating the object to be processed and applying energy from the light energy source, and performs only necessary preheating. It becomes possible to do. In addition, according to the above processing method, when the low dielectric constant film is cured, it is possible to eliminate the influence of heat on the light transmission region and the light irradiation device and perform only the necessary preheating. Furthermore, when the low dielectric constant film is cured, the film forming apparatus eliminates the influence of heat on the vacuum processing chamber and the light energy source, and can perform only necessary preheating.

Next, embodiments of the related invention described above will be described with reference to the drawings.

Referring to FIG. 6, a vacuum processing apparatus for producing a modified low dielectric constant film on a processing target will be specifically described. In FIG. 6, about the example of the vacuum processing apparatus which has the above-mentioned interruption | blocking member A, the typical cross-sectional state from the side surface of the whole is shown. Although FIG. 6 and FIG. 4 are different in drawing, they are basically different only in terms of the presence or absence of a blocking member, and the other components are substantially the same.

As shown in FIG. 6, the vacuum processing apparatus includes a cylindrical metal vacuum processing chamber 61 having an open top, as in FIG. 4, and an opening 62 is formed above the vacuum processing chamber 61. Is formed. A disc-shaped quartz window 63 is disposed in the opening 62 of the vacuum processing chamber 61, and the lower surface edge of the quartz window 63 is a part of the upper surface of the side wall of the vacuum processing chamber 61 (in FIG. 6, the edge 62a of the upper surface of the side wall). It is fixed on the top. A resin-made first seal member (for example, O-ring or the like) 64a provided on the upper surface edge of the quartz window 63 and a resin-made second seal member (for example, the upper surface of the side wall of the vacuum processing chamber 61). , O-ring, etc.) 64b, and a pressing member 64 for pressing the first sealing member 64a and the second sealing member 64b, and a pressing member 64 provided with a flange member 64c as a protrusion at the edge thereof Thus, the vacuum processing chamber 61 can be vacuum-sealed.

In the above case, in order to partition the two

seal members

64a and 64b, a collar member which is a protrusion may be provided between them.

A transfer port 65 is provided in the side wall of the vacuum processing chamber 61, and the processing object 66 is carried in and out through the transfer port 65. The vacuum processing chamber 61 includes a stage 67 on which a processing target is placed and supported, and the stage 67 is configured to be movable up and down. A holding member 68 is provided on the stage 67, and the processing object 66 is regulated and held at a predetermined position by the holding member.

Below the stage 67, a lamp heater 69 is provided as a lamp heating means serving as a heat source, and the inside of the vacuum processing chamber 61 and the processing object 66 are heated by this lamp heater and kept at a predetermined temperature distribution.

A reflector 70 may be provided inside the vacuum processing chamber 61. In this case, the stage 67 and the lamp heater 69 are arranged laterally while avoiding the route for carrying in / out the processing object 66 from the carrying port 65. And it is covered with the reflector 70 from below.

Further, an ultraviolet irradiation device 71 is provided above the quartz window 63, and the processing object 66 having a low dielectric constant film on the surface is irradiated with ultraviolet rays from the ultraviolet irradiation device 71 through the quartz window 63 and processed.

Support members 72 are fixedly provided at a plurality of positions on the inner wall of the vacuum processing chamber 61 above the stage 67, and a disc-shaped block disc 73 as a block member A is placed on the support member 72. Yes. When the vacuum processing chamber 61 is preheated, the blocking board 73 is carried into the vacuum processing chamber 61 through the transfer port 65. When the temperature of the vacuum processing chamber 61 is increased by the lamp heater 69, the heat transfer to the quartz window 63 and the ultraviolet irradiation device 71 is blocked by this blocker.

The breaker 73 is made of an inexpensive material having a high heat resistance, low thermal expansion, low specific gravity, and low cost. For example, the breaker 73 is made of ceramics such as alumina, SiC, SiN, or a metal such as Ti.

In the vacuum processing apparatus, the processing object 66 having a low dielectric constant film on the surface is heated to a predetermined temperature (for example, 350 ° C.) by the lamp heater 69, and ultraviolet light is processed from the ultraviolet irradiation device 71 through the quartz window 63. 66 is irradiated. By irradiating ultraviolet rays, the low dielectric constant film is cured, and a low dielectric constant film having sufficient mechanical strength is produced on the object to be processed.

Prior to irradiating the object to be processed with ultraviolet rays, the temperature of the vacuum processing chamber 61 is raised by the lamp heater 69 to preheat the jig and the processing chamber installed in the processing chamber to a predetermined temperature. At this time, the blocking board 73 placed on the support member 72 blocks the heat transfer to the quartz window 63 and the ultraviolet irradiation device 71. As a result, the quartz window 63 and the ultraviolet irradiation device 71 are not affected by the heat for heating the vacuum processing chamber 61, and the temperature of the atmosphere below the blocking plate 73 can be kept uniform in a required state. it can.

When the preheating is performed, the quartz window 63 and the ultraviolet irradiation device 71 are not affected by heat, so there is no possibility of overheating, and the edge of the quartz window 63 in the metal vacuum processing chamber 61 is not affected. The influence of heat on the fixing portion (that is, the fixing portion on the edge portion 62a of the upper surface of the side wall in the opening 62) can be reduced, and cracks are generated at the periphery of the quartz window 63 due to deformation based on the difference in thermal expansion coefficient. It is prevented. Further, the ultraviolet irradiation device 71 is not exposed to heat, and thermal damage does not occur.

For this reason, it becomes possible to sufficiently perform the preliminary heating of the vacuum processing chamber 61, and the curing treatment of the low dielectric constant film can be performed efficiently. Moreover, since the ultraviolet irradiation device 71 is not exposed to heat, it is possible to simplify the heat countermeasures on the ultraviolet irradiation device 71 side. Since the lamp heater 69 is used as the heat source, the heat source does not come into contact with the object to be processed 66, and there is no risk of contamination.

Therefore, when the low dielectric constant film is formed by curing, it becomes possible to perform necessary preheating without the influence of heat on the quartz window 63 and the ultraviolet irradiation device 71.

Next, another example of the vacuum processing apparatus according to the related invention of the present invention will be described with reference to FIG.

FIG. 7 shows a schematic cross-sectional state from the side of the entire vacuum processing apparatus. Since this vacuum processing apparatus is different from the above-described vacuum processing apparatus shown in FIG. 6 only in the shape of the barrier, the same members are denoted by the same reference numerals, and redundant description is omitted.

Support members 72 are fixedly provided at a plurality of positions on the inner wall of the vacuum processing chamber 61 above the stage 67, and a blocking plate 74 serving as a blocking member A is placed on the support member 72. The shut-off disc 74 has a disc shape, and a circular opening 75 is formed at the center. When the vacuum processing chamber 61 is preheated, the shut-off plate 74 is carried into the vacuum processing chamber 61 through the transfer port 65. When the temperature of the vacuum processing chamber 61 is raised by the lamp heater 69 by this blocker, the quartz window 63, in particular, a fixing portion to the upper opening of the vacuum processing chamber 61 which is the peripheral portion of the quartz window 63, and an ultraviolet irradiation device The heat transfer to 71 is cut off.

By providing such a blocking board 74, the peripheral portion of the quartz window 63 is not affected by heat when preheating is performed, so there is no possibility of overheating, and a metal vacuum processing chamber is provided. The influence of heat on the fixed portion at the periphery of the quartz window 63 installed in the upper opening of 61 can be greatly reduced, and cracks are generated at the periphery of the quartz window 63 due to deformation based on the difference in thermal expansion coefficient. Is reliably prevented. Moreover, since the opening 75 is formed in the shut-off disc 74, the entire atmosphere of the vacuum processing chamber 61 can be raised in temperature uniformly.

For this reason, it is possible to prevent the generation of cracks at the periphery of the quartz window 63 and at the same time uniformly heat the entire interior of the vacuum processing chamber 61. When an ultraviolet ray irradiation device 71 with a countermeasure against heat is used, a lightweight barrier board 74 can be provided to prevent the occurrence of cracks in the quartz window 63, and cracks in the periphery of the quartz window 63 can be provided. Preheating can be performed in a state in which generation is reliably prevented.

In the vacuum processing apparatus shown in FIGS. 6 and 7 described above, an example in which the blocking plate 73 and the blocking plate 74 are mounted on the support member 72 has been described. However, these blocking plates are processed without using the support member. It is also possible to hold the object 66 on the holding member 68. Further, it can be placed on the upper edge portion of the reflector 70.

In addition, the breaker may be a breaker whose shape is a disk and the outer peripheral part is thicker than the thickness of the central part, and the outer peripheral part is thicker. Thus, it is possible to reliably reduce the influence of heat on the fixed portion at the periphery of the quartz window 63 in the metal vacuum processing chamber 61, and to perform preliminary heating by uniformly raising the temperature of the lower side of the barrier plate. it can.

Further, the blocker may be a blocker having a disk shape and formed with a plurality of small holes, and by providing the blocker with the small holes formed in this way, the entire atmosphere of the vacuum processing chamber 61 is provided. Can be controlled more easily.

Next, still another example of the vacuum processing apparatus according to the related invention of the present invention will be described with reference to FIG.

FIG. 8 shows a cross-sectional state from the side of the entire vacuum processing apparatus. Since this vacuum processing apparatus is different from the above-described vacuum processing apparatus shown in FIGS. 6 and 7 only in the configuration of the stage, the same members are denoted by the same reference numerals, and redundant description is omitted.

As shown in FIG. 8, a stage 67 is provided inside the vacuum processing chamber 61, and the stage 67 is configured to be movable up and down. A hot plate 76 as a heat source is provided on the upper surface of the stage 67. A processing object 66 is directly placed on the hot plate 76, and the back surface of the processing object is heated to a predetermined temperature. The lamp heater 69 in FIGS. 6 and 7 is not provided.

Even in the vacuum processing apparatus provided with the hot plate 76 as shown in FIG. 8, the quartz window 63 and the ultraviolet irradiation apparatus 71 are not affected by heat, as in the case of FIGS.

The vacuum processing apparatus shown in FIGS. 6 to 8 is described by taking an ultraviolet irradiation apparatus as a light energy source, a quartz window as an ultraviolet transmission window as a light transmissive partition, and an ultraviolet blocking member as an optical energy blocking member for convenience of explanation. However, in addition to this, light energy sources such as microwave generators, infrared irradiation apparatuses, X-ray generators, laser generators, visible light generators, glass materials other than quartz windows, sapphire, CaF ₂ , MgF _2, etc. A vacuum processing apparatus capable of the same processing can be configured even by applying a light energy blocking member made of the above-described metals, alloys, oxides, nitrides, fluorides or the like other than the light transmitting partition walls and the ultraviolet blocking member.

In addition, these vacuum processing apparatuses have been described as apparatuses for processing an object to be processed on which a low dielectric constant film is formed by applying a low dielectric constant material to the surface with a spin coater. However, these apparatuses are components such as a CVD apparatus. The present invention can also be applied to processing of a processing object in which a low dielectric constant film or other film is formed by a film device. In addition, the present invention can be applied to the processing of the substrate surface itself on which no film is formed.

As a processing method that can be carried out using the vacuum processing apparatus according to the related invention, various processings by ultraviolet irradiation in the vacuum according to the present invention described above can be applied.

According to the present invention, by adopting a specific sealing structure, the resin sealing member is prevented from being irradiated with light such as ultraviolet rays, so that there is no problem of resin deterioration, and organic matter generated by decomposition of the resin. Impurities are not generated in the vacuum processing apparatus and contaminate the inside of the apparatus and the object to be processed. Therefore, it can be used in various industrial fields using a vacuum processing apparatus that performs processing by light irradiation in a vacuum processing chamber. For example, it can be used in an industrial field for producing a low dielectric constant film.

DESCRIPTION OF SYMBOLS 11 Case 12 Light transmissive partition 13 Seal member 14 Stage 15 Wafer 21 Case 22 Quartz window 23 Seal member 24 Ultraviolet irradiation device 25 Stage 26 Wafer 31 Housing 32 Quartz window 33 Seal member 34 Ultraviolet irradiation device 35 Wafer support stage 36 Wafer 37 Blocking member 41 Vacuum processing chamber 42 Wafer 43 Stage 44 Light transmissive partition wall (quartz window)
45 Light irradiation device (ultraviolet irradiation device) 46a First seal member 46b Second seal member 47 Holding member 47a Saddle member 51 Coating device 52 Vacuum processing device 53 Load / unload chamber 54 Transfer chamber 55 Device 61 Vacuum processing chamber 62 Opening 62a edge 63 quartz window 64 holding member 64a first seal member 64b second seal member 64c collar member 65 transport port 66 object to be processed 67 stage 68 holding member 69 lamp heater 70 reflector 71 ultraviolet irradiation device 72 support material 73 blocker 74 Barrier board 75 Opening 76 Hot plate

Claims

A vacuum processing chamber, a stage for placing an object to be processed, a light-transmitting partition wall fixed to the upper surface of the side wall forming the upper opening of the vacuum processing chamber, A vacuum processing apparatus having a light irradiation device on the outside, the first resin-made sealing member provided on the upper surface edge of the light transmissive partition, and the light transmission of the upper surface of the side wall of the vacuum processing chamber A resin-made second seal member provided in a portion where the conductive partition is not installed, and the first seal member and the pressing member for the second seal member, the first seal member and the second seal member; And a pressing member for sealing the vacuum processing chamber.
The vacuum processing apparatus according to claim 1, wherein the light irradiation apparatus is an ultraviolet irradiation apparatus.
The vacuum processing apparatus according to claim 1, wherein the pressing member is further provided with a flange member for partitioning the first seal member and the second seal member.
A vacuum processing chamber, a stage for placing an object to be processed, a light-transmitting partition fixedly installed on an upper surface of a side wall forming an upper opening of the vacuum processing chamber, and a vacuum processing chamber A vacuum processing apparatus having a light irradiation device on the outside, provided to seal a clearance portion between a side surface of the light-transmitting partition and a side wall of the vacuum processing chamber facing the side surface A vacuum processing apparatus comprising a resin seal member and a pressing member for the seal member.
Light transmissivity that is fixedly installed on the upper surface of the side wall that forms the upper opening of the vacuum processing chamber from the light irradiation device with respect to the processing target having a film formed on the surface placed in the vacuum processing chamber When processing the object to be processed by irradiating light through the partition wall, a resin-made first seal member provided on the upper surface edge of the light transmissive partition wall and the upper surface portion of the side wall of the vacuum processing chamber A resin-made second seal member provided in a portion where the light transmissive partition wall is not installed, and the first seal member and the pressing member for the second seal member, the first seal member and the second seal An object to be processed by irradiating light through the light-transmitting partition configured to include a pressing member that seals the vacuum processing chamber with a member. How to handle things.
6. The processing method of a processing object according to claim 5, wherein the light irradiation device is an ultraviolet irradiation device.
The method for processing a processing object according to claim 5 or 6, wherein the film is a low dielectric constant film.
A coating apparatus for use in forming a film on the object to be processed, a vacuum processing apparatus according to any one of claims 1 to 4, and a film formed by coating using the coating apparatus A film forming apparatus comprising: a load / unload chamber for loading and unloading a processing object having the above into and from a vacuum processing chamber.
The film forming apparatus according to claim 8, wherein the film is a low dielectric constant film.