WO2011140692A1 - Circuit imprimé nu à conductivité thermique élevée et son procédé de fabrication - Google Patents

Circuit imprimé nu à conductivité thermique élevée et son procédé de fabrication Download PDF

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Publication number
WO2011140692A1
WO2011140692A1 PCT/CN2010/001939 CN2010001939W WO2011140692A1 WO 2011140692 A1 WO2011140692 A1 WO 2011140692A1 CN 2010001939 W CN2010001939 W CN 2010001939W WO 2011140692 A1 WO2011140692 A1 WO 2011140692A1
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WO
WIPO (PCT)
Prior art keywords
layer
metal
insulating substrate
heat conducting
conductive
Prior art date
Application number
PCT/CN2010/001939
Other languages
English (en)
Chinese (zh)
Inventor
孙百荣
Original Assignee
珠海市荣盈电子科技有限公司
佛山市国星光电股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN 201010177422 external-priority patent/CN101841973B/zh
Priority claimed from CN 201010177622 external-priority patent/CN101841976A/zh
Priority claimed from CN 201010177424 external-priority patent/CN101841974A/zh
Priority claimed from CN 201010177431 external-priority patent/CN101841975B/zh
Application filed by 珠海市荣盈电子科技有限公司, 佛山市国星光电股份有限公司 filed Critical 珠海市荣盈电子科技有限公司
Publication of WO2011140692A1 publication Critical patent/WO2011140692A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias

Definitions

  • the present invention relates to a printed circuit board in the field of electrical engineering and a method of manufacturing the same.
  • a power device generates heat during operation, and if it cannot be dissipated in time, it may damage the power device, or even cause the entire electronic product to work abnormally.
  • LED lighting products as an example, it is usually arranged in a large number of LEDs on a circuit board. When the LEDs are operated for a long time, the accumulation of heat causes the life of the LEDs to be shortened, resulting in unstable product characteristics.
  • the invention patent application No. 200810241905.2 discloses a method of assembling a heat sink on a circuit board and a heat dissipation circuit substrate produced by the method.
  • the method for assembling a heat sink includes the following steps: forming at least one through hole on the circuit board; making a heat sink that is in clearance with the through hole; placing the heat sink into the through hole of the circuit board; and applying pressure to the heat sink by using the mold , until the heat sink is deformed by extrusion and fixed on the circuit board.
  • the heat dissipation circuit substrate provided includes a circuit board, a through hole and a heat sink, and the heat sink is assembled in the through hole.
  • the process of installing the heat sink is an independent process after the completion of the circuit board, which increases the workload; secondly, when the heat sink is squeezed by the mold, the electrical circuit on the circuit board may be damaged. It can be said that the above patented technology is more suitable for the installation of individual power devices, and is not suitable for the installation of a large number of power devices with high density and array distribution. In addition, the heat of the heat sink in the above patented technology has no further conduction, and the heat dissipation effect is limited.
  • An object of the present invention is to comprehensively consider an implementation process of a high thermal conductivity circuit board, integrate an assembly process of a heat sink into a manufacturing process of a circuit board, and simplify a method for manufacturing a high thermal conductivity circuit board and obtain corresponding High thermal conductivity board.
  • a method of fabricating a high thermal conductivity circuit board comprising the steps of:
  • (2) or a opening a plurality of through holes in the insulating substrate layer, placing a metal heat conducting column in the through hole, and hot pressing and solidifying, providing a conductive layer on the upper surface of the insulating substrate layer, and providing a heat conducting layer on the lower surface;
  • a metal conductive layer is disposed on the upper surface of the insulating substrate layer, a metal heat conducting layer is disposed on the lower surface, a plurality of through holes are formed in the double-sided metal layer plate, a metal heat conducting column is placed in the through hole, and is hot pressed and solidified;
  • a method for producing a high thermal conductivity circuit board by hot pressing characterized in that it comprises the following steps:
  • a metal conductive layer is attached on the surface of the insulating substrate layer, a metal heat conducting layer is attached to the lower surface, a plurality of through holes are formed in the double-sided metal layer plate, a metal heat conducting column is placed in the through hole, and hot pressed, Curing
  • the high thermal conductivity circuit board obtained by the first set and the second set of technical solutions includes an insulating substrate layer, an electric circuit layer, a metal heat conducting layer and a metal heat conducting column, and the electrical circuit layer is disposed on the upper surface of the insulating substrate layer, and the metal heat conduction
  • the layer is disposed on the lower surface of the insulating substrate layer, and the double-sided metal layer plate is provided with a through hole at the pre-set heating element; the metal heat conducting column is disposed in the through hole, and the upper end is thermally conductively matched with the pre-set heating element, and the lower end is The metal heat conduction layer is thermally conductively matched.
  • a method for producing a high thermal conductivity circuit board by mimeographing characterized in that it comprises the following steps:
  • the high thermal conductivity circuit board obtained by the third technical solution includes an insulating base material layer, an electric circuit layer on the upper surface of the insulating base material layer, a stencil thermal conductive layer on the lower surface of the insulating base material layer, and a metal thermal conductive column;
  • the squeegee conductive layer is formed by etching;
  • the insulating substrate layer is provided with a through hole at the pre-set heating element, the metal heat conducting column is disposed in the through hole, and the upper end is used for heat conduction coordination with the preset heating element, and the lower end and the stencil heat conducting layer Thermal conduction fit.
  • a method for manufacturing a high thermal conductivity circuit board by electroplating characterized in that it comprises the following steps: (1) providing an insulating substrate layer;
  • the fourth set of the high thermal conductivity circuit board comprises an insulating substrate layer, an electric circuit layer on the upper surface of the insulating substrate layer, an electroplated heat conducting layer on the lower surface of the insulating substrate layer, and a metal heat conducting column;
  • the electroplated conductive layer is formed by etching; the insulating substrate layer is provided with a through hole at the pre-set heating element, the metal heat conducting column is disposed in the through hole, and the upper end is configured to be thermally conductively matched with the pre-set heating element, and the lower end is plated with the heat conducting layer Thermal conduction fit.
  • Another high thermal conductivity circuit board obtained in the fourth set includes an insulating base material layer, an electric circuit layer on the upper surface of the insulating base material layer, a heat conductive layer on the lower surface of the insulating base material layer, and a metal heat conducting column;
  • the metal conductive layer and the electroplated conductive layer on the surface thereof are formed by etching, the heat conductive layer comprises a metal heat conductive layer and an electroplated heat conducting layer on the surface thereof;
  • the insulating base material layer has a through hole at a pre-set heating element, and the metal heat conducting column is disposed at In the through hole, the upper end is used for heat conduction with the pre-set heating element, and the lower end is thermally conductively coupled with the metal heat conduction layer and the plated heat conduction layer. 5.
  • a method for fabricating a high thermal conductivity circuit board based on a metal substrate comprising the steps of:
  • the high thermal conductivity circuit board obtained by the fifth technical solution includes a metal substrate, an insulating layer and an electric circuit layer, wherein a surface of the metal substrate is etched with a metal heat conducting column, and the insulating layer is adhered to the metal by a metal heat conducting column.
  • the upper surface of the substrate, the electrical circuit layer is located above the insulating layer and the metal heat conducting column.
  • the method for manufacturing a high thermal conductivity circuit board provided by the present invention by the overall arrangement, before the electrical connection line is formed, the heat conducting column is assembled in a predetermined position in the circuit board, does not affect the subsequent process (etching), and avoids the circuit board after molding again. Processing, the metal heat conduction layer can further dissipate the heat on the heat-conducting column, the heat dissipation effect is better, the operation is simple, the structure is simple, and the cost is low.
  • 1A-1D are a first embodiment of a high thermal conductivity circuit board produced by a hot press method.
  • 2A-2E are a second embodiment of a high thermal conductivity circuit board produced by a hot press method.
  • 3A-3E are a third embodiment of a high thermal conductivity circuit board produced by a hot press method.
  • 4A-4F are a first embodiment of a high thermal conductivity circuit board produced by mimeographing.
  • 5A-5F are a second embodiment of a high thermal conductivity circuit board produced by mimeographing.
  • 6A-6E are a third embodiment of a high thermal conductivity circuit board produced by mimeographing.
  • 7A-7F are a first embodiment of a high thermal conductivity circuit board produced by electroplating.
  • 8A-8F are a second embodiment of a high thermal conductivity circuit board produced by electroplating.
  • 9A-9E are a third embodiment of a highly thermally conductive circuit board produced by electroplating.
  • Fig. 10 is a schematic view showing a laminated riveted insulating substrate in a highly thermally conductive circuit board.
  • 11A-11E are a first embodiment of a high thermal conductivity circuit board based on a metal substrate. ⁇ detailed description ⁇
  • the method for fabricating a high thermal conductivity circuit board includes the following steps:
  • an insulating substrate layer 1 (which may be an FR4 sheet or a BT sheet), a metal conductive layer 2 is attached on the surface of the insulating substrate layer 1, and a metal heat conducting layer 3 is attached to the lower surface to form a double-sided tape
  • drilling a plurality of through holes 11 on the double-sided metal plate (3) manufacturing a plurality of metal heat conducting columns 4 mated with the through holes; (4) placing the metal heat conducting columns 4 into the through holes 1 1 (5) using a hot press to hot-press the metal heat-conducting column 4 to be assembled in the through-hole 11, in this embodiment, after the hot-pressing of the metal heat-conducting column 4, its volume just fills the volume of the through-hole 1 1; (6) etching the excess metal layer on the upper surface of the insulating substrate layer 1 to form an electrical connection line and a plurality of pads 22 (only pads are shown in FIG.
  • the method provided in this embodiment may further include the step (7) : selective plating of electrical connection lines and several pads, gold plating, silver plating, tin spraying or other solderable metal 5 to form a good overall metal homogenous contact; and, step (8): front side silk screen printing Character or tag.
  • the electrical connection line is used for electrically connecting the heat-generating device and also plays a certain mechanical support role; the pad 22 is used for mechanically connecting the heat-generating device and is used for indirect heat conduction, so when etching,
  • the pads 22 are not necessarily reserved, and only the electrical connection lines can be etched, so that the heat generating devices are disposed directly above the metal heat conducting columns to form a thermally conductive connection.
  • etching at the same time to form electrical connections and pads is the best solution.
  • the high thermal conductivity circuit board produced in Embodiment 1 is as shown in FIG. 1D, and includes an insulating base material layer 1, an electric circuit layer (not shown, but well known in the art), a metal heat conduction layer 3, and a metal heat conduction column 4.
  • the electrical circuit layer is disposed on the upper surface of the insulating substrate layer 1
  • the metal heat conducting layer 3 is disposed on the lower surface of the insulating substrate layer 1
  • the double-sided metal layer plate is provided with a through hole 1 at the pre-set heating element
  • the post 4 is disposed in the through hole 11 and has an upper end for heat conduction engagement with a pre-set heating element (not shown) and a lower end thermally conductively coupled to the metal heat conducting layer 3.
  • the method for manufacturing a high thermal conductivity circuit board includes the following steps: (1) opening a plurality of through holes 11 in the insulating substrate layer 1 (which may be an FR4 sheet or a BT sheet); (2) manufacturing a plurality of metal heat conducting columns 4 mated with the through holes; (3) placing the metal heat conducting columns 4 Placed in the through hole 11; (4) the metal substrate 2 is adhered to the upper surface of the insulating substrate layer 1, and the metal heat conducting layer 3 is attached to the lower surface, and is pressed and cured; (5) on the insulating substrate layer 1 The surface etches the excess metal layer to form an electrical connection line and a plurality of pads 22 (only pads are shown in FIG.
  • the method provided in this embodiment may further include the step (6): performing electrical connection lines and several pads Selectively plated, gold plated, silver plated, spray tin or other solderable metal 5 to form a good overall metal homogenous contact; and, step (7): silk screen characters or marks on the front side of the board.
  • the high thermal conductivity circuit board produced in the second embodiment has the same structure as the first embodiment, and will not be described herein.
  • the method for manufacturing a high thermal conductivity circuit board includes the following steps:
  • an insulating substrate layer 1 (which may be an FR4 sheet or a BT sheet), and a metal heat conducting layer 3 is attached on the lower surface of the insulating substrate layer 1 to form a single-sided metal layer sheet; (2) in a single sheet a plurality of through holes 11 are formed in the metal strip plate; (3) a plurality of metal heat conducting columns 4 are formed to cooperate with the through holes; (4) the metal heat conducting columns 4 are placed in the through holes 11; (5) in the insulating substrate layer 1 The upper surface is pasted with a metal conductive layer 2, hot pressed and cured; (6) the upper surface of the insulating substrate layer 1 is etched with an excess metal layer to form an electrical connection line and a plurality of pads 22 (only pads are shown in FIG.
  • the method provided in this embodiment may further include the step (7): selectively plating the electrical connection lines and the plurality of pads, plating gold, silver plating, tin-spraying or other solderable metal 5 to form a good overall metal homogeneity.
  • Contact and, step (8): silkscreen characters or marks on the front of the board.
  • the high thermal conductivity circuit board produced in the third embodiment has the same structure as the first embodiment, and will not be described herein.
  • Embodiment 1 of the high thermal conductivity circuit board produced by the mimeograph method is the same structure as the first embodiment, and will not be described herein.
  • the method for manufacturing a high thermal conductivity circuit board by the mime printing method includes the following steps: (1) a plurality of through holes 1 1 are formed in the insulating substrate layer 1 (which may be an FR4 sheet or a BT sheet); (2) manufacturing a plurality of metal heat conducting columns 4 mated with the through holes; (3) a metal heat conducting column 4 is placed in the through hole 11 and hot pressed and cured; (4) the upper surface of the insulating substrate layer 1 is stenciled with the conductive layer 2, the lower surface is stenciled with the heat conducting layer 3, and the conductive layer 2 and the heat conducting layer 3 are silver oil, copper oil or (5) etching excess conductive material on the surface of the insulating substrate layer 1 to form an electrical connection line and a plurality of pads 22 (only the disk is shown in FIG.
  • the method provided in this embodiment can further Including step (6): selectively plating the electrical connection lines and the plurality of pads, gold plating, silver plating, tin-spraying or other solderable metal 5 to form a good overall metal homogenous contact; and, step (7): Silkscreen characters or marks on the front of the board.
  • the electrical connection line is used for electrically connecting the heat-generating device and also plays a certain mechanical support role; the pad 22 is used for mechanically connecting the heat-generating device and is used for indirect heat conduction, so when etching,
  • the pads 22 are not necessarily reserved, and only the electrical connection lines can be etched, so that the heat generating devices are disposed directly above the metal heat conducting columns to form a thermally conductive connection.
  • etching at the same time to form electrical connections and pads is the best solution.
  • the high thermal conductivity circuit board produced in Embodiment 1 is as shown in FIG. 1F, and includes: an insulating base material layer 1, a stencil conductive layer 2 on the upper surface of the insulating base material layer, and a stencil thermal conductive layer 3 on the lower surface of the insulating base material layer. And a metal heat-conducting column 4; the insulating substrate layer 1 has a through hole 1 1 at a pre-set heating element; the metal heat-conducting column 4 is disposed in the through-hole 11 and the upper end is used for pre-setting the heating element (not shown) Shown by the heat conduction, the lower end is thermally conductively coupled to the oil-printed heat-conducting layer 3.
  • the layer 1 is provided with a through hole 11 at a pre-set heating element, and the metal heat conducting column 4 is disposed in the through hole 11, the upper end of which is used for heat conduction with the pre-set heating element, and the lower end is thermally conductively coupled with the oil-printed heat conducting layer 3.
  • Embodiment 2 of the high thermal conductivity circuit board produced by the mimeograph method is the high thermal conductivity circuit board produced by the mimeograph method
  • the method for manufacturing a high thermal conductivity circuit board includes the following steps:
  • an insulating base material layer 1 (which may be an FR4 sheet or a BT sheet), and attaching a metal heat conductive layer 3 on the lower surface of the insulating base material layer 1 to form a single-sided metal layer sheet; (2) in a single sheet a plurality of through holes 1 1 are formed in the metal strip plate; (3) a plurality of metal heat conducting columns 4 are formed to cooperate with the through holes; (4) The metal thermal conductive column 4 is placed in the through hole 11, and is hot pressed and cured; (5) the conductive layer 2 is stenciled on the upper surface of the insulating base material layer 1, and the conductive layer 2 is silver oil, copper oil or carbon oil; The upper surface of the insulating substrate layer 1 is etched with excess conductive material to form an electrical connection line and a plurality of pads 22 (only pads are shown in FIG.
  • the method provided in this embodiment may further include the step (7): The connection lines and the pads are selectively plated, gold plated, silver plated, tinned or other solderable metal 5 to form a good overall metal homogenous contact; and, step (8): silk screen characters or marks on the front side of the board.
  • the high thermal conductivity circuit board produced in the second embodiment has the same structure as the first embodiment, and will not be described herein.
  • the method for manufacturing a high thermal conductivity circuit board includes the following steps:
  • an insulating base material layer 1 (which may be an FR4 sheet or a BT sheet), a metal conductive layer 51 is attached on the upper surface of the insulating base material layer 1, and a metal heat conductive layer 61 is attached to the lower surface to form a double-sided tape
  • drilling a plurality of through holes 11 on the double-sided metal plate (2) drilling a plurality of through holes 11 on the double-sided metal plate; (3) manufacturing a plurality of metal heat conducting columns 4 mated with the through holes; (4) placing the metal heat conducting columns 4 into the through holes 1 1 Medium, hot pressing, curing;
  • the method provided in this embodiment may further include the step (7): selectively plating the electrical connection lines and the plurality of pads, gold plating, Silver, tin or other solderable metal to form a good overall metal homogenous contact; and, step (8): silk screen characters or marks on the front side of the board.
  • the high thermal conductivity circuit board produced in the third embodiment is as shown in FIG. 3E, and includes: an insulating base material layer 1, a metal conductive layer 51 attached to the upper surface of the insulating base material layer, and a stencil conductive layer on the surface of the metal conductive layer 51. 52, a metal heat-conducting layer 61 attached to the lower surface of the insulating substrate layer, the striated heat-conducting layer 3 on the surface of the metal heat-conducting layer 61 and the metal heat-conducting column 4; the insulating substrate layer 1 is provided with a through-hole 11 at the pre-set heating element; The metal heat conducting column 4 is disposed in the through hole 11 and the upper end thereof is used for pre-set heating elements
  • the insulating substrate layer 1, the electrical circuit layer on the upper surface of the insulating substrate layer, and the lower surface of the insulating substrate layer The heat conducting layer and the metal heat conducting column 4; the electrical circuit layer is formed by etching the metal conductive layer 51 and the surface of the stencil conductive layer 52, the heat conducting layer comprising the metal heat conducting layer 61 and the surface of the oil-printed heat conducting layer 62; 1
  • a through hole 11 is defined in the pre-set heating element.
  • the metal heat conducting column 4 is disposed in the through hole 11.
  • the upper end is used for heat conduction with the pre-set heating element, and the lower end is thermally conductively coupled with the metal heat conducting layer 61 and the mime conducting layer 62.
  • the method for fabricating a high thermal conductivity circuit board by the electroplating method provided in this embodiment includes the following steps:
  • insulating substrate layer 1 which may be an FR4 sheet or a BT sheet
  • manufacturing a plurality of metal heat conducting columns 4 mated with the through holes (3) placing the metal heat conducting columns 4 is placed in the through hole 1 1 and hot pressed and cured
  • Fig. 1C (4)
  • the upper surface of the insulating base material layer 1 is plated with the conductive layer 2, and the lower surface is plated with the heat conductive layer 3 to form a double-sided metal plate material; (5) etching the excess conductive material on the surface of the insulating substrate layer 1 to form an electrical connection line and a plurality of pads 22 (only the pads are shown in FIG.
  • the method provided in this embodiment may further include the step (6) : Selective plating of electrical connection lines and several pads, gold plating, silver plating, tin-spraying or other solderable metal 5 to form a good overall metal homogenous contact; and, step (7): silk screen characters on the front side of the board Or mark.
  • the electrical connection line is used for electrically connecting the heat-generating device and also plays a certain mechanical support role; the pad 22 is used for mechanically connecting the heat-generating device and is used for indirect heat conduction, so when etching,
  • the pads 22 are not necessarily reserved, and only the electrical connection lines can be etched, so that the heat generating devices are disposed directly above the metal heat conducting columns to form a thermally conductive connection.
  • etching at the same time to form electrical connections and pads is the best solution.
  • the high thermal conductivity circuit board produced in Embodiment 1 is as shown in FIG. 1F, and includes: an insulating base material layer 1, an electroplated conductive layer 2 on the upper surface of the insulating base material layer, and an electroplated thermal conductive layer 3 on the lower surface of the insulating base material layer. And a metal heat-conducting column 4; the insulating substrate layer 1 has a through-hole 1 in the pre-set heating element, the metal heat-conducting column 4 is disposed in the through-hole 1 1 , and the upper end is used for pre-setting the heating element (in the figure) The thermal conduction is not shown, and the lower end is thermally conductively coupled to the electroplated thermally conductive layer 3.
  • the insulating substrate layer 1 The electrical circuit layer on the upper surface of the insulating substrate layer, the plated heat conductive layer 3 on the lower surface of the insulating substrate layer 1, and the metal heat conducting column 4;
  • the electrical circuit layer is formed by etching the electroplated conductive layer 2;
  • the insulating base material layer 1 is provided with a through hole 11 at the pre-set heating element, the metal heat conducting column 4 is disposed in the through hole, and the upper end thereof is used for heat conduction with the pre-set heating element.
  • the lower end is thermally conductively coupled to the electroplated thermally conductive layer 3.
  • the method for fabricating a high thermal conductivity circuit board includes the following steps:
  • an insulating substrate layer 1 (which may be an FR4 sheet or a BT sheet), and a metal heat conducting layer 3 is attached on the lower surface of the insulating substrate layer 1 to form a single-sided metal layer sheet; (2) in a single sheet (3) manufacturing a plurality of metal heat conducting columns 4 mated with the through holes; (4) placing the metal heat conducting columns 4 into the through holes 11, hot pressing, curing;
  • the surface of the insulating substrate layer 1 is plated with a conductive layer 2; (6) the upper surface of the insulating substrate layer 1 is etched with excess conductive material to form an electrical connection line and a plurality of pads 22 (only pads are shown in FIG.
  • the method provided by the embodiment may further comprise the step (7): selectively plating the electrical connection lines and the plurality of pads, gold plating, silver plating, spray tin or other solderable metal 5 to form a good overall metal homogeneity.
  • Contact and, step (8): silkscreen characters or marks on the front of the board.
  • the high thermal conductivity circuit board produced in the second embodiment has the same structure as the first embodiment, and will not be described herein.
  • the method for fabricating a high thermal conductivity circuit board includes the following steps:
  • an insulating base material layer 1 (which may be an FR4 sheet or a BT sheet), a metal conductive layer 51 is attached on the upper surface of the insulating base material layer 1, and a metal heat conductive layer 61 is attached to the lower surface to form a double-sided tape
  • drilling a plurality of through holes 11 in the double-sided metal plate (2) drilling a plurality of through holes 11 in the double-sided metal plate; (3) manufacturing a plurality of metal heat conducting columns 4 mated with the through holes; (4) placing the metal heat conducting columns 4 into the through holes 11 (5) further electroplating the conductive layer 52 on the surface of the metal conductive layer 51, and further plating the heat conductive layer 62 on the surface of the metal heat conductive layer 61 to make the metal heat conducting column and the metal layer more closely connected; (6) in the insulating base
  • the upper surface of the material layer 1 is etched with excess conductive material to form electrical connection lines and a plurality of pads 22 (only pads are shown in FIG.
  • the method provided in this embodiment may further include the step (7): A number of pads are selectively plated, gold plated, silver plated, sprayed with tin or other solderable metal to form a good overall metal homogenous contact; and, step (8): silk screen characters or marks on the front side of the board.
  • the high thermal conductivity circuit board produced in the third embodiment is shown in FIG. 3E, and includes an insulating base material layer 1, an electric circuit layer on the upper surface of the insulating base material layer, a heat conduction layer on the lower surface of the insulating base material layer 1, and a metal heat conduction column 4.
  • the electrical circuit layer is formed by etching the metal conductive layer 51 and the plated conductive layer 52 on the surface thereof, and the heat conductive layer comprises the metal heat conduction layer 61 and the plated heat conduction layer 62 on the surface thereof; the insulating substrate layer 1 is opened at the pre-set heating element
  • the through hole 11, the metal heat conducting column 4 is disposed in the through hole 1 1 , the upper end of which is used for heat conduction with the preheating element, and the lower end is thermally conductively coupled to the metal heat conducting layer 61 and the plated heat conducting layer 62.
  • the insulating base material layer may also be laminated by a plurality of epoxy prepregs (PP sheets), a film or other adhesive non-conductive substrate 33. Made up, see Figure 10.
  • the method for fabricating a high thermal conductivity circuit board based on a metal substrate includes the following steps:
  • the method provided in this embodiment may further include the step (5): selectively plating the electrical connection line and the plurality of pads, gold plating, silver plating, tin-spraying or other solderable metal 5, Forming a good overall metal homogenous contact; and, step (6): silk screen characters or marks on the front side of the board.
  • the electrical connection line is used for electrically connecting the heat-generating device and also plays a certain mechanical support role; the pad 32 is used for mechanically connecting the heat-generating device and is used for indirect heat conduction, so when etching, The pads 32 are not necessarily reserved, and only the electrical connection lines can be etched, so that the heat generating devices are disposed directly above the metal heat conducting columns to form a thermally conductive connection. Of course, etching at the same time to form electrical connection lines and pads is the best solution.
  • the high thermal conductivity circuit board produced in the embodiment 1 includes a metal substrate 1, an insulating layer 2 and an electrical circuit layer. The upper surface of the metal substrate 1 is etched with a metal heat conducting column 11 and an insulating layer 2.
  • the metal heat-conducting column 11 is attached to the upper surface of the metal substrate '1, and the electrical circuit layer is formed by etching the metal layer, the plating conductive layer or the squeegee conductive layer, and is located above the insulating layer 2 and the metal heat-conducting column 11.
  • the difference between the second embodiment and the first embodiment is that: after the upper surface of the metal substrate is affixed with the metal thermal conductive column, the insulating layer is applied, and the metal layer is not covered, but the upper surface is electroplated, and then the upper surface is plated. The plating layer is etched.
  • the high thermal conductivity circuit board produced in the second embodiment has a similar structure to that in the first embodiment, and details are not described herein.
  • the third embodiment differs from the second embodiment in that: the electroplating method is replaced by a method of mimicking a conductive material on the upper surface thereof; the stencil conductive material may be 4 eucalyptus oil, copper oil or carbon oil. All the above embodiments are merely for the purpose of fully exposing and not limiting the present invention. It is understood that other heat-generating components other than LEDs also have heat dissipation problems, such as high-power transistors, thyristors, triacs, GTOs, MOSFETs, IGBTs, and the like. Further, the metal mentioned in the embodiment is preferably copper, and may of course be other metal materials.

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  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

L'invention concerne un circuit imprimé nu à conductivité thermique élevée et son procédé de fabrication, dans le but de résoudre le problème de la dissipation thermique d'un élément chauffant placé sur ledit circuit. Le procédé comprend principalement les étapes suivantes : un montant à conductivité thermique est assemblé dans une position prédéterminée du circuit imprimé avant la constitution du circuit de connexions électriques ; une couche conductrice est formée par galvanoplastie, puis gravée afin de constituer un circuit électrique. Au moyen de ce procédé, le traitement par une structure rayonnante est évité après l'assemblage du circuit imprimé. L'effet de rayonnement est meilleur. Le fonctionnement est simple. La structure est simple. Le coût est réduit.
PCT/CN2010/001939 2010-05-12 2010-12-01 Circuit imprimé nu à conductivité thermique élevée et son procédé de fabrication WO2011140692A1 (fr)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
CN 201010177422 CN101841973B (zh) 2010-05-12 2010-05-12 基于金属基制作高导热性电路板的方法及电路板
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JPH1117340A (ja) * 1997-06-27 1999-01-22 Kokusai Electric Co Ltd ブラインドスルーホールの形成方法
JP2005235840A (ja) * 2004-02-17 2005-09-02 Nec Corp プリント基板およびそれに実装される発熱電子部品の放熱装置
CN2879426Y (zh) * 2006-03-03 2007-03-14 广镓光电股份有限公司 一种模块化led及其封装结构
CN101841973A (zh) * 2010-05-12 2010-09-22 珠海市荣盈电子科技有限公司 基于金属基制作高导热性电路板的方法及电路板
CN101841974A (zh) * 2010-05-12 2010-09-22 珠海市荣盈电子科技有限公司 电镀法制作高导热性电路板的方法及高导热性电路板
CN101841975A (zh) * 2010-05-12 2010-09-22 珠海市荣盈电子科技有限公司 热压法制作高导热性电路板的方法及高导热性电路板
CN101841976A (zh) * 2010-05-12 2010-09-22 珠海市荣盈电子科技有限公司 油印法制作高导热性电路板的方法及高导热性电路板

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JPH1117340A (ja) * 1997-06-27 1999-01-22 Kokusai Electric Co Ltd ブラインドスルーホールの形成方法
JP2005235840A (ja) * 2004-02-17 2005-09-02 Nec Corp プリント基板およびそれに実装される発熱電子部品の放熱装置
CN2879426Y (zh) * 2006-03-03 2007-03-14 广镓光电股份有限公司 一种模块化led及其封装结构
CN101841973A (zh) * 2010-05-12 2010-09-22 珠海市荣盈电子科技有限公司 基于金属基制作高导热性电路板的方法及电路板
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