WO2011138670A3 - Dispositif de transfert thermique fractal - Google Patents

Dispositif de transfert thermique fractal Download PDF

Info

Publication number
WO2011138670A3
WO2011138670A3 PCT/IB2011/001026 IB2011001026W WO2011138670A3 WO 2011138670 A3 WO2011138670 A3 WO 2011138670A3 IB 2011001026 W IB2011001026 W IB 2011001026W WO 2011138670 A3 WO2011138670 A3 WO 2011138670A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat exchange
heat transfer
exchange elements
transfer device
flow
Prior art date
Application number
PCT/IB2011/001026
Other languages
English (en)
Other versions
WO2011138670A2 (fr
Inventor
Alexander Poltorak
Original Assignee
Alexander Poltorak
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alexander Poltorak filed Critical Alexander Poltorak
Priority to KR1020197035325A priority Critical patent/KR102166190B1/ko
Priority to KR1020127031809A priority patent/KR101926035B1/ko
Priority to KR1020187034463A priority patent/KR20180132941A/ko
Priority to EP11777334.1A priority patent/EP2567174B1/fr
Publication of WO2011138670A2 publication Critical patent/WO2011138670A2/fr
Publication of WO2011138670A3 publication Critical patent/WO2011138670A3/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3732—Diamonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/10—Secondary fins, e.g. projections or recesses on main fins
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/20—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes with nanostructures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
    • F28F2265/28—Safety or protection arrangements; Arrangements for preventing malfunction for preventing noise

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

L'invention concerne un puits thermique comprenant un dispositif d'échange thermique ayant plusieurs éléments d'échange thermique, chacun présentant une limite de surface par rapport à un liquide de transfert thermique, ayant une variation fractale entre eux, le liquide de transfert thermique est induit à s'écouler par rapport à la pluralité d'éléments d'échange thermique variant de manière fractale de façon que des tourbillons induits par écoulement sont générés à des emplacements non correspondants de la pluralité d'éléments d'échange thermique variant de manière fractale, le résultat étant une résonance réduite en comparaison à un dispositif d'échange thermique correspondant présentant une pluralité d'éléments d'échange thermique qui produisent des tourbillons induits par écoulement à des emplacements correspondants sur la pluralité d'éléments d'échange thermique.
PCT/IB2011/001026 2010-05-04 2011-05-13 Dispositif de transfert thermique fractal WO2011138670A2 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020197035325A KR102166190B1 (ko) 2010-05-04 2011-05-13 프랙탈 열전달 장치
KR1020127031809A KR101926035B1 (ko) 2010-05-04 2011-05-13 프랙탈 열전달 장치
KR1020187034463A KR20180132941A (ko) 2010-05-04 2011-05-13 프랙탈 열전달 장치
EP11777334.1A EP2567174B1 (fr) 2010-05-04 2011-05-13 Dispositif de transfert thermique fractal

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US33110310P 2010-05-04 2010-05-04
US61/331,103 2010-05-04

Publications (2)

Publication Number Publication Date
WO2011138670A2 WO2011138670A2 (fr) 2011-11-10
WO2011138670A3 true WO2011138670A3 (fr) 2016-03-24

Family

ID=44904168

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2011/001026 WO2011138670A2 (fr) 2010-05-04 2011-05-13 Dispositif de transfert thermique fractal

Country Status (3)

Country Link
EP (1) EP2567174B1 (fr)
KR (3) KR101926035B1 (fr)
WO (1) WO2011138670A2 (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11322850B1 (en) 2012-10-01 2022-05-03 Fractal Antenna Systems, Inc. Deflective electromagnetic shielding
WO2014055573A1 (fr) 2012-10-01 2014-04-10 Fractal Antenna Systems, Inc. Transfert radiatif et commande de puissance à l'aide de méta-matériau fractal et de plasmonique
US11268771B2 (en) 2012-10-01 2022-03-08 Fractal Antenna Systems, Inc. Enhanced gain antenna systems employing fractal metamaterials
US9134465B1 (en) 2012-11-03 2015-09-15 Fractal Antenna Systems, Inc. Deflective electromagnetic shielding
US10914534B2 (en) 2012-10-01 2021-02-09 Fractal Antenna Systems, Inc. Directional antennas from fractal plasmonic surfaces
US10866034B2 (en) 2012-10-01 2020-12-15 Fractal Antenna Systems, Inc. Superconducting wire and waveguides with enhanced critical temperature, incorporating fractal plasmonic surfaces
WO2017117088A1 (fr) * 2015-12-30 2017-07-06 Alexander Poltorak Dispositif de transfert de chaleur fractal
WO2018013668A1 (fr) * 2016-07-12 2018-01-18 Alexander Poltorak Système et procédé destinés à maintenir l'efficacité d'un puits thermique
CN107152796A (zh) * 2017-07-11 2017-09-12 石同生 模块化高温抗冻高效率自然循环太阳能锅炉
CN107152797A (zh) * 2017-07-11 2017-09-12 石同生 单管口多分支自然循环管式集热器
CN108120335A (zh) * 2017-12-20 2018-06-05 河南百年融熥实业有限公司 一种内螺旋翅片管
WO2019126821A1 (fr) * 2017-12-22 2019-06-27 Fractal Antenna Systems, Inc. Fil supraconducteur et guides d'ondes à température critique améliorée, incorporant des surfaces plasmoniques fractales
WO2020263731A1 (fr) 2019-06-24 2020-12-30 Milwaukee Electric Tool Corporation Outils électriques dotés de dissipateurs thermiques à haute émissivité

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5870284A (en) * 1997-03-17 1999-02-09 Astec International Limited Integrated power supply frame including integrated circuit (IC) mounting and cooling
US7351360B2 (en) * 2004-11-12 2008-04-01 International Business Machines Corporation Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive
US20090321045A1 (en) * 2008-06-30 2009-12-31 Alcatel-Lucent Technologies Inc. Monolithic structurally complex heat sink designs

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5874775A (en) * 1994-08-03 1999-02-23 Sumitomo Electric Industries, Ltd. Diamond heat sink including microchannel therein and methods for manufacturing diamond heat sinks
US6452553B1 (en) 1995-08-09 2002-09-17 Fractal Antenna Systems, Inc. Fractal antennas and fractal resonators
JP3968887B2 (ja) * 1998-08-25 2007-08-29 ソニー株式会社 ヒートシンク
JP3008942B1 (ja) * 1998-11-20 2000-02-14 日本電気株式会社 電子装置の放熱構造
US6807059B1 (en) * 1998-12-28 2004-10-19 James L. Dale Stud welded pin fin heat sink
US6323432B1 (en) * 1999-08-10 2001-11-27 International Business Machines Corporation Manufacture of dendrites and their use
JP3303870B2 (ja) * 2000-01-26 2002-07-22 松下電器産業株式会社 ヒートシンクとその製造方法およびそれを用いた冷却装置
WO2001095688A1 (fr) * 2000-06-05 2001-12-13 The State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of The University Of Oregon Appareil de transport a echelle variable et procedes correspondants
DE60036097T2 (de) * 2000-06-15 2008-05-21 Borgwarner Inc., Auburn Hills Kühlrippe
US6437438B1 (en) * 2000-06-30 2002-08-20 Intel Corporation Eddy current limiting thermal plate
US6390181B1 (en) * 2000-10-04 2002-05-21 David R. Hall Densely finned tungsten carbide and polycrystalline diamond cooling module
US7972390B2 (en) 2002-03-21 2011-07-05 Gr Intellectual Reserve, Llc Methods for controlling crystal growth, crystallization, structures and phases in materials and systems
US20030183368A1 (en) * 2002-04-02 2003-10-02 Paradis Leo Richard Diamond heat sink
US20050116336A1 (en) * 2003-09-16 2005-06-02 Koila, Inc. Nano-composite materials for thermal management applications
JP2006322698A (ja) * 2005-04-22 2006-11-30 Denso Corp 熱交換器
US8178153B2 (en) * 2006-03-31 2012-05-15 International Business Machines Corporation Heat transfer control structures using thermal phonon spectral overlap
JP2008091644A (ja) * 2006-10-02 2008-04-17 Nippon Densan Corp ヒートシンク及びヒートシンク冷却装置
TWI308954B (en) * 2006-10-20 2009-04-21 Foxconn Tech Co Ltd Heat dissipation device
US8037927B2 (en) * 2006-11-16 2011-10-18 CUI Global, Inc. Cooling device for an electronic component
CN101394730A (zh) * 2008-04-01 2009-03-25 北京航空航天大学 分形散热器
US20100085713A1 (en) * 2008-10-03 2010-04-08 Balandin Alexander A Lateral graphene heat spreaders for electronic and optoelectronic devices and circuits

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5870284A (en) * 1997-03-17 1999-02-09 Astec International Limited Integrated power supply frame including integrated circuit (IC) mounting and cooling
US7351360B2 (en) * 2004-11-12 2008-04-01 International Business Machines Corporation Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive
US20090321045A1 (en) * 2008-06-30 2009-12-31 Alcatel-Lucent Technologies Inc. Monolithic structurally complex heat sink designs

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
LIU ET AL.: "Heat Transfer and Pressure Drop in Fractal Microchannel Heat Sink for Cooling of Electronic Chips", HEAT MASS TRANSFER, vol. 44, 2007, pages 221, XP019560208, DOI: doi:10.1007/s00231-007-0240-0 *

Also Published As

Publication number Publication date
EP2567174A4 (fr) 2017-09-27
EP2567174A2 (fr) 2013-03-13
KR101926035B1 (ko) 2018-12-06
KR102166190B1 (ko) 2020-10-15
WO2011138670A2 (fr) 2011-11-10
KR20180132941A (ko) 2018-12-12
EP2567174B1 (fr) 2020-02-26
KR20190134856A (ko) 2019-12-04
KR20140019210A (ko) 2014-02-14

Similar Documents

Publication Publication Date Title
WO2011138670A3 (fr) Dispositif de transfert thermique fractal
EA201792002A3 (ru) Косвенный теплообменник
IT1400737B1 (it) Unita' esterna per lo scambio di calore, particolarmente in scambiatori di calore e simili.
WO2014152527A8 (fr) Amplificateur de turbulences pour refroidisseur de quille
WO2014022428A3 (fr) Génération thermoélectrique à haute efficacité
JP2013139772A5 (fr)
EP2700894A4 (fr) Echangeur de chaleur du type à plaques, et dispositif de pompe à chaleur
WO2016012161A3 (fr) Echangeur thermique a plaques avec renforts structurels pour turbomoteur
MX2016009930A (es) Placa de intercambio de calor e intercambiador de calor tipo placa provisto con placa de intercambio de calor.
WO2012125586A3 (fr) Échange de chaleur à surfaces multiples doté d'une capacité de mise sous vide et de racloirs magnétiques
EP2589884A3 (fr) Appareil d'eau chaude à pompe à chaleur
EP2626899A3 (fr) Module de dissipation de chaleur
EP2778593A4 (fr) Ailette de transfert de chaleur, échangeur de chaleur à tube à ailettes et dispositif de pompe à chaleur
EP2784427A4 (fr) Ailette de transfert de chaleur, échangeur de chaleur à ailette et tube, et dispositif pompe à chaleur
CN201700117U (zh) 具有多丛集式鳍片的散热器
GB201201672D0 (en) Steam generation
MX369021B (es) Elemento de tubo para un medio de intercambio de calor.
EP2677254A3 (fr) Échangeur de chaleur
CN202648500U (zh) 板式换热器换热板片
WO2013004211A3 (fr) Système échangeur de chaleur
CN201935363U (zh) 一种电热水器
GB201215174D0 (en) Heat exchange
FR2993967B1 (fr) Ailette destinee a perturber l'ecoulement d'un fluide, echangeur de chaleur comprenant une telle ailette et procede de fabrication d'une telle ailette
CN105890419A (zh) 一种多级鳍片散热器
CN204069602U (zh) 一种热管散热器

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11777334

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20127031809

Country of ref document: KR

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 2011777334

Country of ref document: EP