WO2011135050A1

WO2011135050A1 - Wafer pocket with tear-open wafer accommodating compartment

Info

Publication number: WO2011135050A1
Application number: PCT/EP2011/056788
Authority: WO
Inventors: Kathrin Reichardt; Sven Filler; Kirsten Gollin
Original assignee: Bayer Pharma Aktiengesellschaft
Priority date: 2010-04-29
Filing date: 2011-04-28
Publication date: 2011-11-03
Also published as: EP2563681A1; CA2797610A1; JP2013529159A; US20130199958A1; DE102010028361A1; CN102947195A

Abstract

In order to be able to conveniently remove a wafer (4) from a wafer pocket (1), it is proposed that the wafer pocket (1) is formed by a first enveloping film (9) and a second enveloping film (11), which are connected to one another via at least one connecting region (2), such that a wafer accommodating compartment (3) which is suitable for accommodating the wafer (4) and which is closed off towards the outside is formed between the first enveloping film (9) and the second enveloping film (11), wherein at least one of the enveloping films (9, 11) is weakened within a weakening region (5) situated in the region of the wafer accommodating compartment (3), such that the wafer accommodating compartment (3) can be opened by tearing open the wafer pocket (1) along a tearing line that passes the weakening region (5). In order furthermore to ensure that the outer sides of the wafer pocket (1) are aesthetically attractive and can meet the requirements made of necessary identification obligations, the weakening region (5) is spaced apart from each edge of the wafer packet (1). Moreover, the tearing line additionally runs partly outside the weakening region.

Description

Wafer bag with tear-open wafer storage compartment

Description:

The present invention relates to a wafer pocket for holding a wafer, that is to say for receiving a film wafer with at least one active substance contained therein, for example for receiving a drug wafer, in particular a wafer containing contraceptive or hormone replacement therapy, or even a wafer. the other, for example, non-medical, contains active ingredients, eg Nicotine. In addition, the wafer may also contain flavorings or fragrances.

Such primary packaging of the type according to the invention typically contains a first and a second covering film interconnected via at least one connecting region, so that a wafer receiving compartment suitable for receiving a wafer and closed outwards is formed between the first and the second covering film.

Such a wafer bag is disclosed, for example, in DE 10 2004 047 447 A1. The packaging described there, for example for wafer-shaped or film-shaped dosage forms, has a carrier layer and a cover layer releasably connected thereto. In this packaging, the carrier layer in a delimited surface area is not connected to the cover layer, thereby creating a compartment enclosed on all sides and the surface area is completely surrounded by an edge region in which the carrier layer is detachably connected to the cover layer. The compartment is used to hold the oblate or film-shaped dosage form. In order to be able to remove the pharmaceutical form, the cover layer for opening the compartment is detached or pulled off manually from the carrier layer.

However, it has been found that in this case the manual detachment of a cover film from the lower film is not readily possible if the cover film and the lower film at the compartment each enclosing side of the two layers are made of a material that a dissolution of the sealed seam by peeling the cover sheet of the lower film is not allowed because the two layers enter through the seal a not easily separable connection.

Another embodiment of a package, in this case for food, is described in WO 03/103950 A1. The packaging specified there consists of two interconnected foils which form a receptacle which is enclosed on all sides, so that, for example, a foodstuff can be kept securely closed therein. Around

l To get to the food, the packaging can be torn open. For this purpose, a scribe structure produced by means of a focused laser beam, along which the films can be torn open, is introduced into one of the films at least on the outside.

Another embodiment, also for receiving a food, is given in US 6,719,678 B1. The bag disclosed therein consists of two film laminates, which are joined together by heat sealing at the edges. Furthermore, in addition to a scribe structure produced by means of a focused laser beam, a mechanical closure is provided in a rupture-resistant layer on the respective inner side of the film laminates, with which the pouch can be closed again after tearing over the scribe structure.

The known bags are not suitable to receive a drug wafer and to ensure that the film inner layer is inert to an exchange of substances between the product and the film and at the same time to allow easy, trouble-free removal of the drug wafer. The bags for food intake specified in WO 03/103950 A1 and US Pat. No. 6,719,678 B1 are not suitable for the storage of drug wafers. Even if the wafer bag were to be rupturable for removal of a drug wafer according to the construction set forth in these documents, the wafer would be difficult to remove from the tray due to its small thickness and dimensioned with a small receptacle for the wafer could be taken.

It is therefore an object of the present invention to provide a primary package for the safe storage of film-like objects, such as wafers, which contain one or more active ingredients for use as a pharmaceutical or one or more active ingredients not for use serve as a drug, are located and additionally optionally contain flavors or fragrances, and from which the wafer or the other film-shaped object can be conveniently removed. In addition, the primary packaging should also have an attractive appearance, that is, in particular appeal to the user by an attractive and informative printing.

This object is achieved by the wafer bag according to claim 1. Preferred embodiments of the invention are specified in the subclaims.

As far as the term 'wafer' is used in this description and in the claims, this is to be understood as meaning a flat, flexible object or film platelets which at least contains an active substance. Typically, such wafers are used to deliver the active agent or agents to a human or animal body by containing a wafer containing such agent (s) and contacting it with a site of the body of the human for administration to which the active substance (s) are / are being administered. For example, a wafer may be a drug, in particular a contraceptive or a hormone replacement therapy or other drug, or the wafer may also contain another drug, for example, one or more drugs of a nicotine patch. In addition, the wafer may also contain another substance, such as a flavor or fragrance. In another embodiment of the invention, the wafer may also contain only one flavor, for example a sweetener and a flavoring. Typically, the wafer consists of a wafer matrix which dissolves upon administration or releases the drug (s).

The wafer pocket according to the invention is formed by a first and a second covering films interconnected via at least one connecting region, so that a wafer receiving compartment suitable for receiving a wafer and closed outwards is formed between the first and the second covering film. In the connection region, the first and the second wrapping film can be connected to one another in a positive, positive or material fit, for example by welding, cold or heat sealing or else by gluing. The connecting portion closes the wafer receiving tray from the outside, so that the quality of the wafer in the wafer receiving tray is not affected by external influences. Thus, a secure, longer storage is guaranteed. The cover sheets are typically laminates of several layers, each having different properties and fulfilling different tasks. In principle, both or even only one of the two enveloping films can also consist exclusively of a single layer. The connection region preferably encloses the wafer on all sides.

Furthermore, at least one of the enveloping films, if appropriate also both enveloping films, is weakened within a weakening region located in the region of the wafer receiving compartment, so that the wafer receiving compartment can be opened by tearing the wafer pocket along a tear line passing the weakened region. This allows the wafer pocket to be easily ripped open in one direction to remove the wafer.

In accordance with the invention, the weakened area is spaced apart from each edge of the wafer pocket. In addition, the tear line also partially extends outside the weakened area. These measures will ensure that the area does not affect the outside of the wafer bag. For example, a scribe structure would not be readily printable, so that it would always be visible even after printing. If the weakened area between two edges of the wafer pocket extended over its entire width, the outer configuration of the wafer pocket would be considerably impaired. Only by restricting the expansion of the weakened area to a smaller area, which is therefore at a distance to the edges of the wafer pocket, a largely free configurability of the outer sides of the wafer pocket can be achieved, so that on the one hand the aesthetic impression is not affected and on the other hand the attachment of the required Information is not restricted by the attenuation range.

It is preferred that at least one wrapping film of the wafer bag, possibly also both wrapping films, is weakened along a deflection line extending in the area of the wafer receiving compartment or in the region of a deflection surface, so that the wafer receiving compartment can be opened by tearing the wafer pocket along at least two edges of the wafer receiving compartment , This includes not only the variant that the wafer pocket is torn parallel to, for example, at least two edges of the receiving compartment, but also the variant that the tear line is not parallel to the edges. Preferably, the Umlenklinie or the deflection causes a deflection of an otherwise arbitrary tear line when tearing the wafer pocket.

In a particularly preferred embodiment of the invention, the wafer pocket according to the invention contains a wafer.

In a preferred embodiment of the invention, the weakened region is formed in the form of a weakening line or in the form of a weakening surface. For example, the weakening line may be formed as a trench-shaped structure, which is introduced into the uppermost layer of an enveloping film. This trench-like structure is elongated and can have a width of several 100 μm. Preferably, this structure is at least 500 μm, and more preferably at least 1 mm wide. Most preferably, the structure is at least 1.5mm wide. The structure may in particular be up to, for example, 10 mm wide. It is preferred if it is at most 5 mm wide, and very particularly preferred if it is at most 2.5 mm wide. The indicated values for the width are related to the surface of the enveloping foil. If the structure does not have a rectangular cross-section but, for example, a trapezoidal or triangular cross-section, the width of the structures at their bottom is less than the specified values. Alternatively, the weakened area may be a weakened area, for example a cut formed by abrasion area-like depression in at least one of the enveloping films. The surface may be formed for example in the form of a circle. Other surface shapes are also conceivable, for example an elliptical or triangular surface or another surface shape. It is preferred if the surface has at least on one side a circular boundary, at which the tear line is deflected in another direction. The line of weakness differs from the area of weakness by its elongated shape, which has an aspect ratio (length to width) of at least 5, in particular at least 10.

In a further preferred embodiment of the invention, the first wrapping film and / or the second wrapping film is / are biaxially stretched. This ensures that the enveloping films form a straight tear line when tearing from the tear point. Such formed films form preferred tear lines in two orthogonal directions so that substantially straight tear lines can be produced.

In a further preferred embodiment of the invention, the first and / or the second wrapping film is / are stretched in a direction perpendicular to at least one edge of the wafer bag. Thereby, the wafer pocket can be torn in a straight line in a direction perpendicular to the edge or to the edges of the wafer pocket.

In a further preferred embodiment of the invention, in each case there is an edge weakening on at least one edge of the wafer pocket, from which the first wrapping film and the second wrapping film can be torn open. Thus, the wafer bag can be targeted torn at one point of the bag at the edge.

In a further preferred embodiment of the invention, the edge weakening is formed by in each case a notch or an incision on at least one edge of the wafer pocket. About this notch or this incision, the enveloping films can be easily torn. This results in the starting point for the tear line. The direction of the tear line is typically given as the preferred direction by the manufacturing conditions, starting from the notch or notch. Basically, a single such indentation or cut at one edge of the wafer pocket is sufficient to open the wafer pocket. However, to allow the user to choose from which edge he / she wishes to rip the wafer pocket, such indentations or cuts may be provided on both (adjacent) edges of the wafer pocket. In a further preferred embodiment of the invention, the edge weakening is located within the connection region, so that the receptacle for the wafer has no connection to the exterior and thus the wafer is hermetically sealed in the receptacle.

The wafer pocket ruptures when opened along a tear line. The Umlenklinie or the deflection affects the direction of the tear line, along the Umlenklinie or within the deflection, in particular along a boundary line of the deflection, the direction changes. Because in this area, the material of the enveloping films, which have the Umlenklinie or deflection, weakened or almost completely removed. The Umlenklinie forms a track that changes direction when tearing. In a corresponding manner also generates the deflection at one of its boundaries a track along which the tear line changes direction. This allows the tray to be opened on at least two (adjacent) pages. This allows the user to open the wafer bag wide to access the wafer and easily remove it.

On the other hand, if the wafer pocket were opened only on one side, as provided, for example, in US Pat. No. 6,719,678 B1, the opening of the receiving compartment would only be very narrow, so that the wafer could hardly be grasped with the fingers. The removal of the wafer would be extremely difficult in this case. Only by at least two-sided opening of the receiving compartment, the wafer can be easily grasped, because at least the wrapping film, which has been torn along the Umlenklinie therein or within the deflecting surface, now against the wafer contained in the wafer pocket and at least one edge of the wafer can be exposed or at least slightly bent back, so that the wafer can be easily grasped.

According to one embodiment of the invention, it is possible that this Umlenklinie or deflection is located in only one of the two envelopes, so that only this wrapping film tears under change of direction of the tear line. The other wrapping film can tear in this case without change of direction, because there is no such Umlenklinie in which the material is weakened in this wrapping film. The wafer receiving compartment is thus opened only on the side at which the wrapping film has been weakened along the Umlenklinie or within the deflection and thus "demolished" corner, the wafer can still be very easily removed in this case, because it is on the side is partially exposed, at which the wrapping film weakened along the deflection line or within the deflection surface is torn from the wafer pocket, or because the wafer receiving tray can be easily peeled open, so that the wafer can be comfortably gripped. Of course, the wafer is also conveniently removed from the wafer bag when Umlenklinien, in the course of which the envelopes are weakened, or deflection, along the boundaries of the enveloping films easily tear, according to another embodiment of the invention in both envelopes. In this case, it is advantageous if the Umlenklinien or deflection of the two envelopes in the wafer pocket are congruent one above the other, so that the enveloping films tear at congruent to each other extending tear lines. However, a clinging together of the two cladding films is to avoid eg by excessive heat input. For an easy removability of the wafer, it would also be sufficient in this case if the Umlenklinien or deflection of the two envelopes are not exactly congruent to each other, but only substantially congruent to each other, for example, at a distance of a few mm, for example 2-5 mm, where the two Umlenklinien not necessarily have to run parallel to each other or the deflection surfaces do not necessarily have to lie directly above each other, so that the respective directional change of the tear lines causing boundary lines of the deflection surfaces are not parallel to each other. It would in any case be advantageous if the Umlenklinien or deflection surfaces are mounted so that after tearing at least one film is tangible with the fingers or protruding or the wafer is at least by simply flipping the enveloping films tangible.

In a preferred embodiment of the invention, the deflection line or the deflection surface connects a first preferably straight tear line section and a second preferably straight tear line section with one another, wherein this connection may preferably be arc-shaped. The Umlenklinie or the deflection surface can cause according to this embodiment, a change of direction of the first tear line section for example, about 90 °, or even a change of direction by less than 90 ° or more than 90 °. It is preferred if the tear line is rotated by 90 ° when torn off with respect to the original tear direction, resulting in the first tear line section and the second tear line section. According to this embodiment, these two tear line sections run essentially or exactly at right angles to each other when they each form a straight track, and go along the preferably arcuate deflection line or along a preferably arcuate boundary line of the deflection surface along which the cover film or the two cover films tear. into each other. In the case of deflection of the tear line by the deflection surface, this preferably has an outer boundary line, at which the tear line is deflected from the first tear line section to the second tear line section. Because within the deflection surface provided with this deflection wrapping film is weakened, so that the tear line when tearing the film in one direction continues until it encounters the outer boundary. Then, the tear line is deflected in the direction in which this boundary line runs. Of course, the tear line runs when it hits the deflecting surface already tangential to the outer boundary line, even further along this boundary line.

In a particularly preferred embodiment, the diverting line has ends located in the region of the cavity, wherein first and second tangents adjacent the respective ends of the diverting lines are perpendicular to each other, and wherein the first tear line section is along the first tangent and the second tear line section is along the second tangent. As a result, the first preferably straight tear line formed during tearing pivots into the preferably arcuate course of the deflection line without further change of direction and from there, without further change of direction, passes into the second and again preferably straight tear line extending perpendicularly to the first tear line.

In a further preferred embodiment of the invention, at least one of the two tear lines is defined by an edge weakening, for example a notch or an incision on an edge of the wafer pocket.

The weakening of the material of the cladding film or of the cladding foils formed in the course of the deflection line or in the region of the deflection surface is formed in the shell material or in the shell materials in the form of one or more scribe structures by directing a preferably focused laser beam onto the first and / or second cladding foil (Notching by means of a laser beam). As a result of this action of the laser beam on the enveloping foil, the material of the uppermost layer or of the uppermost layers of the enveloping foil is vaporized or otherwise removed, for example by decomposition, so that a thinning of the uppermost material layer occurs along the Umlenklinie or in the region of the deflection surface. For this purpose, a sufficient interaction of the laser beam with the upper material of the enveloping film is required. Such a method is explained in more detail, for example, in WO 03/103950 A1. It is advantageous if only a foil component of the wrapping film is at least partially removed, for example an outer layer of the wrapping film. It is also possible that the weakening of only a single wrapping film along a Umlenklinie or in a region of a deflection surface or that the weakening of both envelopes along Umlenklinien or in areas of deflection is generated.

In a further preferred embodiment of the invention, the wafer pocket is detachably connected on one side with one or more tear-off sections. The tear-off or the tear-off sections are separable from the wafer bag. About the tear-off sections For example, the wafer bags can be stacked in a secondary package by holding the tear-off section (s) in the secondary package. As a result of the tear-off section or sections being separable from the respective wafer pocket, for example by tearing off, the wafer pockets can be detached individually from the secondary packaging. The detachability of the respective wafer bag from the corresponding tear-off section can be realized, for example, via at least one perforation in each case.

In a further preferred embodiment of the invention, the tear-off sections can be shaped so that they can be received in a holding module in a secondary packaging. For example, the holding module can partially enclose the tear-off sections, so that the tear-off sections are connected to the wafer pockets only via respective connecting regions having the perforation, for example. Alternatively, mutually aligned recesses for receiving a recesses passing through the retaining element can be located within the tear-off. With each of these embodiments, the wafer bags are held in the secondary package.

It is particularly preferred if the first and the second cover film are each formed from a layer composite of interconnected layers, in order to optimize the structure of the layer composite with regard to the compatibility of the respective film with the wafer, the handling of the wafer bag, for example when opening, the outer design, for example, for an external printing, and to achieve other drug-specific requirements.

In a particularly preferred embodiment of the invention, the first and second cladding films on the sides in contact with the wafer are coated with a material which is inert to the active substance (s) of the wafer, that is to say that the active substance (s) does not comprise this material penetrate or migrate. Preferably, this material is Barex®, an acrylonitrile-methyl acrylate copolymer, which is located for example in the form of a layer on the insides. The inert layers of the cladding films thus point towards the cavity for the wafer. Thus, almost a chemical inertness of the first and the second cladding film is achieved compared to the active ingredient of the wafer.

Furthermore, the first and the second wrapping film can each have a printable polymer layer on the outwardly facing sides in order to be able to provide the wafer bag with an imprint. The printable polymer layers of the first and second cover films may in particular consist of polyethylene terephthalate. The inert inner layers and the printable polymer layers of the first and second cover films may advantageously be connected to each other via an aluminum foil in each case. These aluminum foils act as a moisture barrier.

For a more detailed illustration of the invention serve below explained figures.

1 shows a wafer pocket according to the invention with a wafer contained therein in a schematic plan view in a first embodiment;

Fig. 2 shows a wafer pocket according to the invention with a wafer contained therein schematically in section;

3 shows a wafer pocket according to the invention with a wafer contained therein in a schematic plan view in a second embodiment;

4 shows a wafer pocket according to the invention with a wafer contained therein in a schematic plan view in a third embodiment.

Like reference numerals designate like elements throughout the figures.

The wafer pocket 1 shown in FIG. 1 is rectangular and detachably connected on one side to a tear-off portion 20. For this purpose, two perforation sections 21 are provided in the present case and four cuts 22nd

The wafer pocket 1 consists of two enveloping foils 9, 11 (FIG. 2), of which only the upper enveloping foil 9 can be seen in FIG. The two envelopes are connected to each other via a connection region 2, for example by heat sealing. The connecting region 2 extends on all sides along the edges of the wafer pocket 1 and encloses a wafer receiving space 3, which is thus hermetically sealed from the outside space. There is a wafer 4 in the wafer receiving space 3.

In the upper enveloping foil 9 and in the lower enveloping foil 1 1, notches 10 are formed along a deflection line 5 by laser ablation (FIG. 2). This means that the notch 10 is generated, for example, on the outside of the upper wrapping film 9 and on the outside of the lower wrapping film 1 1 along the Umlenklinie 5. The indentations have a width of at least 0.1 mm, at least on the surfaces of the enveloping films. The indentations are quite short and spaced at the edges of the wafer pocket. As a result, they practically do not affect the outer sides of the enveloping films. For printing the outer sides of the enveloping films are sufficiently large areas available. Along the indentations 10, the material of the upper wrapping film 9 and the lower wrapping film 1 1 is weakened, so that the enveloping films tear when opening the wafer bag 1 along the notches 10. To open the wafer pocket 1, the enveloping films 9, 11 are first torn, starting from an incision 6, so that a straight first tear-line section 7 results. This first tear line section 7 then hits the deflection line 5, so that the direction of the tear line pivots by 90 ° (to the left). In the further course of the opening of the wafer pocket 1, the tear line also follows the further course indicated under 8 (second tear line section). Thereby, the wafer accommodating space 3 is opened at two edges, so that the wafer 4 can be comfortably gripped and taken out with the fingers.

The wafer bag 1 is torn off from the tear-off portion 20 as needed. The tear-off section 20 then remains in the secondary packaging, while the wafer bag 1 can be torn open to remove the wafer 4.

In a second embodiment of the invention, the Umlenklinie 5 extends arcuately, starting almost from the edges of the wafer pocket 1 (Fig. 3).

In a third embodiment of the invention, a deflection surface 12 is located on both envelopes 9, 11 (the latter not shown in FIG. 4). This deflection is circular. The material of the enveloping films 9, 1 1 is surface-thinned by laser ablation within the deflection. The deflection surface has a boundary line 13, which open tangentially into the tear line sections 7, 8 on one side. When tearing the wafer pocket 1, starting from the incision 6, the tear line hits tangentially on the deflection surface at its outer boundary line. As a result of the fact that the non-thinned material of the enveloping foil offers increased resistance to further tearing, the enveloping foils tear along the boundary line, so that the direction of the tearing line is pivoted by 90 °. The material of the enveloping films consists at least partially of a biaxially stretched sealing film, so that two orthogonally aligned tear directions result, which are also perpendicular to the edges. As a result, the tear line leaves the deflection surface on the first tear line section aligned by 90 ° second tear line section and follows this. Therefore, even in this case, the wafer bag can be torn open parallel to two edges, so that the wafer 4 can be easily removed from the wafer accommodating space 3.

Claims

claims:

1 . Wafer pocket (1) formed by a first and a second at least one connection region (2) interconnected enveloping films (9, 1 1), so that between the first cladding film (9) and the second cladding film (1 1) for receiving a wafer (4) is formed, wherein at least one of the enveloping foils (9, 11) is weakened within a weakening region (5) located in the region of the wafer receiving compartment (3), so that the wafer receiving compartment ( 3) can be opened by tearing the wafer pocket (1) along a tear line passing the weakened area (5),

characterized in that the weakened area (5) is spaced apart from each edge of the wafer pocket (1) and the tear line additionally extends partially outside the weakened area.

2. wafer bag (1) according to claim 1, characterized in that the weakened area in the form of a weakening line (5) or in the form of a weakening surface (12) is formed.

3. Wafer bag according to one of the preceding claims, characterized in that the first wrapping film (9) and / or the second wrapping film (1 1) is biaxially stretched / are.

4. wafer bag (1) according to claim 2, characterized in that the first and / or the second wrapping film (9, 1 1) in a direction perpendicular to at least one edge of the wafer pocket (1) is stretched / are.

5. wafer bag (1) according to claim 3, characterized in that at least one edge of the wafer pocket (1) is a Randschwächung (6) from which the first wrapping film (9) and the second wrapping film (1 1) are tearable ,

6. Wafer pocket (1) according to claim 5, characterized in that the edge weakening is formed by a notch or an incision (6) on at least one edge of the wafer pocket (1).

7. wafer bag (1) according to any one of claims 5 and 6, characterized in that the edge weakening is located within the connecting region (2).

8. wafer pocket (1) according to any one of the preceding claims, characterized in that the weakening region (5) causes a deflection of the tear line when tearing the wafer pocket (1).

9. wafer pocket (1) according to claim 8, characterized in that the weakened area by a Umlenklinie (5) or a deflection surface (12) is formed and that the Umlenklinie (5) or the deflection surface (12) has a first tear line section (7) and a second tear line portion (8), which extend substantially perpendicular to each other, connects to each other.

10. wafer bag (1) according to claim 8, characterized in that the deflection surface (12) has an outer boundary line (13), at which the tear line from the first tear line section (7) to the second tear line section (8) is deflected.

1 1. Wafer bag (1) according to any one of claims 1-9, characterized in that the weakened region is formed by a Umlenklinie (5) and that the Umlenklinie (5) in the region of the wafer receiving compartment (3) has ends, wherein at the respective ends the deflection line (5) adjacent first and second tangents are perpendicular to each other and wherein the first tangent a first tear line section (7) and the second tangent form a second tear line section (8).

12. wafer pocket (1) according to any one of the preceding claims, characterized in that the weakened area by a Umlenklinie (5) or a deflection surface (12) is formed and that the Umlenklinie (5) or the deflection surface (12) has a scribe structure (10) is, which is formed by the action of a laser beam on the first cladding film (9) and / or the second cladding film (1 1).

13. wafer bag (1) according to any one of the preceding claims, characterized in that the Umlenklinie (5) or the deflection surface (12) in exclusively one of the enveloping films (9, 1 1) is formed.

14. wafer bag (1) according to any one of the preceding claims, characterized in that the wafer pocket (1) on one side with a tear-off portion (20) is detachably connected.

15. Wafer pocket (1) according to claim 14, characterized in that the wafer pocket (1) via at least one perforation (21) with the tear-off portion (20) is connected.

16. wafer bag (1) according to any one of the preceding claims, characterized in that the first cladding film (9) and the second cladding film (1 1) each have a printable polymer layer on the outwardly facing sides.

17 wafer pocket (1) according to any one of the preceding claims, characterized in that in the Waferaufnahmefach (3) is a wafer (4).