JP2013529159A - Wafer pocket with wafer containment compartment that can be torn open - Google Patents

Abstract

  In order to allow the wafer 4 to be conveniently removed from the wafer pocket 1, it has been proposed that the wafer pocket 1 is formed of a first exterior film 9 and a second exterior film 11. The first exterior film 9 and the second exterior film 11 are connected to each other via at least one connection region 2 and, as a result, are suitable for housing the wafer 4 and are sealed to the outside. A wafer accommodating compartment 3 is formed between the first exterior film 9 and the second exterior film 11, and at least one of the exterior films 9, 11 is arranged in the region of the wafer accommodating compartment 3. The wafer storage compartment 3 can be opened by breaking the wafer pocket 1 along the cut line passing through the fragile region 5 and opening it. Furthermore, the fragile region 5 is spaced from each edge of the wafer pocket 1 so as to help the outside of the wafer pocket 1 be aesthetically appealing and meet the requirements of the required identification obligations. ing. The cut line further passes partially outside the weakened area.

Description

  The present invention relates to a wafer pocket for accommodating a wafer, ie for accommodating a film patch in which at least one active substance is contained, for example for accommodating a drug wafer. In particular, the wafer contains active substances intended for contraception or hormone replacement therapy, or the wafer contains other active substances containing, for example, non-medical substances, in particular nicotine. In addition, the wafer can include flavoring or fragrance therein.

  Typically, a primary package, such as the type according to the present invention, includes first and second exterior films. The first and second exterior films are suitable for housing a wafer and a wafer housing compartment sealed to the outside is formed between the first exterior film and the second exterior film. As shown, the connection is made in at least one connection region.

  A wafer pocket of this kind is disclosed, for example, in DE 10 2004 047 447 A1. For example, the pack for wafer-like or film-like medicine described therein has a carrier layer and a cover layer removably connected to the carrier layer. In this pack, the carrier layer is not connected to the cover layer in a delimited surface area, so that a sealed compartment is formed everywhere, and the surface area is It is completely surrounded by a partial area, in which the carrier layer is detachably connected to the cover layer. The compartment is used to contain the wafer-like or film-like drug. To remove the drug, the cover layer is manually separated or broken from the cover layer and the compartment is opened.

  However, in this case, on the sides of the two layers each sealing the compartment, if the cover film and the lower film are made of a material that cannot be unsealed by peeling the cover film from the lower film It is not easily possible to manually separate the cover film from the lower film. This is because, as a result of sealing, the two layers form a connection that is not easily separated.

  Another embodiment of the pack, in this case a pack for food products, is described in WO 03/103950 A1. The pack described therein comprises two films that are connected to each other, which form a sealed storage compartment everywhere, so that, for example, food is trapped in it and ensured. Can be saved. The pack can be broken open to pick up the food product. For this purpose, a scribing structure formed by a focused laser beam, which can tear the film along, is introduced at least on one side of the film.

  Similarly, another embodiment for containing food products is described in US 6,719,678 B1. The bag disclosed therein comprises two film laminates that are connected to each other by hot sealing at the edges. Furthermore, in addition to the scribing structure formed by the focused laser beam, a mechanical closure is provided inside each of the film laminates in the anti-rupture layer, and after the bag is torn open, With it, it can be closed again via the scribing structure.

  Known bags are not suitable for containing drug wafers and in this respect are suitable for ensuring that the inner film layer is inert with respect to material exchange between the product and film. At the same time, it is not suitable for allowing simple and trouble-free removal of the drug wafer. The bags for storing foodstuffs described in WO 03/103950 A1 and US 6,719,678 B1 are not suitable for the storage of drug wafers. The wafer pocket is dimensioned to fit in a small receiving compartment for the wafer, even though it can be torn open for removal of the drug wafer according to the design described in those documents. In some cases, removal of the wafer will be difficult due to its small thickness, since the wafer cannot be manually removed from the receiving compartment without problems.

  From this point of view, the present invention is suitable for reliable storage of film-like objects, such as wafers, in which one or more active substances used as a drug or one or more not used as a drug. Based on the objective of finding a primary package that has an active substance, optionally also including flavoring or fragrance, and from which the wafer or other film-like object can be conveniently removed. The primary package should also have an attractive appearance that appeals to the user, especially by printing that is intriguing and informative.

  This object is achieved with the wafer pocket as defined in claim 1. Preferred embodiments of the invention are described in the dependent claims.

  It should be understood that the term “wafer”, as used in the specification and claims of this application, means a flat, flexible object or film patch comprising at least one active substance. Typically, such wafers contain an active substance, or an active substance for the human or animal body, and for administration, a point in the individual body to which the active substance is administered. Used to administer the active substances. For example, the wafer can be a drug, particularly a contraceptive or hormone replacement therapy drug or other drug, or the wafer can contain one or more active substances consisting of other active substances, such as nicotine patches. It can also be included. In addition, the wafer may include other materials, such as flavoring or fragrance. In another embodiment of the present invention, the wafer may contain only flavoring, for example, sweeteners and flavors. Typically, the wafer is comprised of a wafer matrix that decomposes during administration or releases the active agent.

  The wafer pocket according to the present invention is formed of first and second exterior films that are connected to each other via at least one connection region, and is suitable for accommodating a wafer, and with respect to the outside. A sealed wafer containing compartment is formed between the first exterior film and the second exterior film. In the connection area, the first and second outer films are pressure-fitted, foam-fitting, or by a method of material connection, such as by welding, cold seal or hot seal, or other adhesive bonding, Can be connected to each other. The connection area blocks the wafer receiving compartment from the outside, so that the quality of the wafer placed in the wafer receiving compartment is not impaired by external influences. Therefore, reliable and relatively long-term storage is guaranteed. The exterior film is typically a laminate comprising a plurality of layers, each having different properties and serving different purposes. In principle, both exterior films or only one of the two exterior films can be composed of only a single layer. Preferably, the connection area seals the wafer everywhere.

  Further, at least one of the exterior films, and in some cases, both exterior films are fragile within a fragile region located within the region of the wafer containing compartment, and along the cut line through the fragile region, the wafer By breaking the pocket and opening it, the wafer containing compartment can be opened. As a result, the wafer pocket can be easily opened in one direction for removal of the wafer.

  In the method according to the present invention, the fragile region is spaced from each edge of the wafer pocket. The cut line also partially passes outside the weakened area. These measures ensure that the fragile region does not damage the outside of the wafer pocket. For example, the scribing structure cannot be printed so that it is always readily visible after printing. If the fragile region extends across the entire width of the wafer pocket between the two edges of the wafer pocket, as a result, the external structure of the wafer pocket will be significantly impaired. Only by limiting the extent of the fragile area to a relatively small area thereby spaced from the edge of the wafer pocket, firstly, the aesthetic impression is not impaired, and secondly, the utilization of the necessary information It is possible to achieve a generally free design outside the wafer pocket such that is not limited by the fragile region.

  Preferably, at least one outer film of the wafer pocket is fragile along a bend line extending in the area of the wafer containing pocket or in the area of the bend area in some cases. is there. As a result, the wafer containing compartment can be opened by breaching and opening the wafer pocket along at least two edges of the wafer containing compartment. This is not only a variant in which the wafer pocket is opened, for example, in parallel to at least two edges of the wafer receiving pocket, but also in a variant in which the cut line does not extend parallel to those edges. Includes examples. The bend line or bend area preferably causes another irregularly extending cut line bend when the wafer pocket is torn open.

  In a preferred embodiment of the present invention, a wafer pocket according to the present invention can accommodate a wafer.

  In a preferred embodiment of the present invention, the vulnerable area is formed in the form of a vulnerable line or in the form of a vulnerable area. For example, the fragile line can be formed as a trench-like structure introduced into the uppermost layer of the exterior film. This trench-like structure is elongated and can have a width of several hundred μm. This structure is preferably at least 500 μm, particularly preferably at least 1 mm wide. Most preferably, the structure is at least 1.5 mm wide. The structure can, for example, in particular have a width within 10 mm. A case where the width is at most 5 mm is preferred, and a case where the width is at most 2.5 mm is very particularly preferred. The values shown for the width are based on the surface of the exterior film. If the structure does not have a rectangular cross section, but has a trapezoidal or triangular cross section, the width at the base of the structure will be less than the value shown. Alternatively, the fragile region can be a fragile area, such as an area formed by removal of at least one of the exterior films. The area can be formed in a circular shape, for example. Other area shapes, such as an ellipse or triangle, or other area shapes are conceivable as well. The area preferably has a boundary extending around at least one of which the cut line is bent in another direction. The fragile line differs from the fragile area only in its elongated shape, and the side length ratio (length to width) is at least 5, in particular at least 10.

  In a further preferred embodiment of the present invention, the first exterior film and / or the second exterior film are biaxially oriented. This realizes a situation in which, when the exterior films are torn, a linear cut line is formed starting from the breaking location. The film thus formed forms suitable cut lines in two mutually orthogonal directions and can form a substantially straight cut line.

  In a further preferred embodiment of the present invention, the first and / or second exterior film is arranged in a direction perpendicular to at least one edge of the wafer pocket. As a result, the wafer pocket can be opened linearly in a direction perpendicular to the edge or edges of the wafer pocket.

  In a further preferred embodiment of the present invention, at least one edge of the wafer pocket has a respective fragile edge, and the first and second exterior films are torn open from the fragile edge. Can do. Thus, the wafer pocket can be clearly broken at the pocket edge.

  In a further preferred embodiment of the invention, the fragile edges are each formed by a notch or cut in at least one edge of the wafer pocket. The exterior film can be conveniently torn through the notch or the cut portion. The result is the starting point for the cut line. The direction of the cut line typically occurs as the preferred direction from manufacturing conditions, starting from the notch or the cut. In principle, such a single notch or such a single cut at the edge of the wafer pocket is sufficient to open the wafer pocket. However, in order to leave the user an option with respect to the edge that he or she wishes to tear open the wafer pocket from, such a notch or cut is placed on the wafer pocket (adjacent). It can be provided on both edges.

  In a further preferred embodiment of the invention, the fragile edge is provided in the connection area, the receiving compartment for the wafer has no connection to the outside, and accordingly the wafer is , And sealed in the containing compartment.

  The wafer pocket is torn open along the cut line when opened. The bend line or bend area influences the direction of the cut line, so that the cut line is along the bend line or within the bend area, in particular along the border of the bend area. Change direction. This is because, in this region, the material of the exterior film having the bend line or the bend area is fragile or substantially completely removed. The bend line forms a track that changes direction when broken and opened. In a similar manner, a track is formed at one of the bend area boundaries, and the tear line changes direction along the track. As a result, the receiving compartment can be opened with at least two (adjacent) edges. This allows the user to wide open the wafer pocket and reach out to the wafer for easy removal.

  On the other hand, if the wafer pocket is designed to open on only one side, for example as described in US 6,719,678 B1, the opening of the storage pocket becomes very narrow, You can barely grab the wafer with your finger. In this case, the removal of the wafer will be extremely difficult. The wafer can be easily grasped only by opening the receiving compartments of at least two sides. Because at least the outer film that is torn along the bending line or along the weakened portion of the film that is applied to the outer film in the bent area is against the wafer accommodated in the wafer pocket. And at least one edge of the wafer can be exposed or at least easily bent so that the wafer can be easily grasped.

  According to an embodiment of the present invention, the bent line or the bent area can be provided in only one of the two exterior films, and only the exterior film is torn when changing the direction of the cut line. In this case, the other exterior film can be broken without changing the direction. This is because the exterior film does not have a bent line in which the material is brittle. Thus, the outer film is opened there only along the bend line or on the weakened side in the bend area, and the wafer containing compartment is broken “diagonally”. Nevertheless, in this case, the wafer can be removed very easily. This is because the wafer is partially exposed to the side that breaks the wafer pocket along the bend line or the brittle film that is brittle in the bend area. Alternatively, the wafer containing compartment can be easily turned over. As a result, the wafer can be grasped conveniently.

  Of course, a bend line in which the exterior film is weakened, or a bend area along the boundary where the exterior film is easily torn, is present in both exterior films according to another embodiment of the present invention. If provided, the wafer can also be conveniently removed from the wafer pocket. In this case, it is advantageous if the bend lines or bend areas of the two exterior films are provided so as to coincide with each other on the wafer pocket. As a result, the two exterior films break on the cut lines that coincide with each other. Open. However, it should be avoided to bond the two exterior films together, for example by exposure to excessive high heat. In this case, for the function of easily removing the wafer, the bend lines or bend areas of the two exterior films do not exactly coincide with each other, but for example at a distance of a few millimeters, for example 2-5 mm It is sufficient that they are substantially coincident with each other and the two bend lines do not necessarily extend parallel to each other, or the bend areas do not necessarily overlap directly with each other. As a result, the boundaries of the bend regions that cause the respective direction changes of the cut lines do not extend parallel to each other. In any case, after breaking, the bend lines or bends so that at least one of the films can be grasped with fingers or protrusions, or at least so that the wafer can be grasped by simply turning the outer film over. It would be advantageous if applied to the area.

  In a preferred embodiment of the present invention, the bend line or bend area connects the first preferably straight cut line portion and the second preferably straight cut line portion to each other. The part can preferably be curved. The bend line or bend area according to this embodiment can cause, for example, a change in direction of the first cut line portion of about 90 °, or a change in direction less than 90 ° or greater than 90 °. . The cut line is preferably rotated by 90 ° with respect to the initial tear direction when the cut line is broken. As a result, the first cut line portion and the second cut line portion are generated. The two cut lines according to this embodiment are each substantially straight, and preferably substantially along a curved bend line, or preferably along a curved boundary line of the bend area. Or exactly extending perpendicular to each other and the outer film or the two outer films tear along it. If the cut line is bent at the bend area, the bend area has an outer boundary line over which the cut line is bent from the first cut line portion to the second cut line portion. Yes. This is because when the exterior film is torn, the exterior film provided with the bent area is provided in the curved area so that the cut line advances in one direction until the outer boundary line is reached. This is because they are vulnerable. As a result, the cut line is bent in the direction in which the boundary line extends. Naturally, when the cut line is already in contact with the outer boundary line in the tangential direction when the cut area is reached, the cut line also extends along the boundary line.

  In a particularly preferred embodiment, the bend line has an end provided in the region of the cavity, and the first and second tangents to the respective end of the bend line extend perpendicular to each other, The first cut line portion extends along a first tangent, and the second cut line portion extends along a second tangent. As a result, the first preferably linear cut line formed during the cut extends into the preferably curved course of the bend line without further change of direction from which further change of direction. Without a line, extending perpendicular to the first cut line and once again merges with a second cut line, preferably extending in a straight line.

  In a further preferred embodiment of the invention, at least one of the two cut lines is defined by a fragile edge, for example a notch or cut at the edge of the wafer pocket.

  The weakening of the exterior film or material of the exterior film formed through the bend line or in the region of the bend area is performed in the form of one or more scribing structures in the exterior material or multiple exterior materials. Among them, the focused laser beam is preferably directed to the first and / or the second outer film (notch by laser beam). As a result of the action of the laser beam on the exterior film, the material of the top layer or layers of the exterior film is evaporated or otherwise removed, for example, as a result of decomposition, so that the bending Thinning of the top layer material occurs along the line or within the bend region. For this purpose, sufficient interaction between the laser beam and the top material of the outer film is necessary. This type of method is described in detail, for example, in WO03 / 103950 A1.

  It is advantageous if only one component of the outer film, for example the outer layer of the outer film, is at least partially removed. Similarly, the weak part of only a single exterior film can be formed along a bend line or in a bend area. Alternatively, the weakened portions of both exterior films can be formed along a bend line or in the area of the bend area.

  In a further preferred embodiment of the invention, the wafer pocket is detachably connected to one or more cutouts on one side. The cutout or cutouts can be separated from the wafer pocket. The wafer pocket is accommodated in the second pack in a stacked manner through the cutout portion or the plurality of cutout portions, with the cutout portion or the plurality of cutout portions being firmly held by the second pack. Can do. The fact that the cut portion or the plurality of cut portions can be separated from the respective wafer pockets by being cut, for example, means that the wafer pocket can be taken out from the second pack alone. The function of separating each wafer pocket from the corresponding cutout can be implemented, for example, with at least one perforation in any case.

  In a further preferred embodiment of the invention, the cutout can be formed so that it can be accommodated in a holding module in the second pack. For example, the holding module can partially surround the cutout. As a result, the cut portion is connected to the wafer pocket only through each connection region having the perforation, for example. Alternatively, the incisions aligned with each other can be provided in the cutout to accommodate the retaining elements through the incision. By using each of these embodiments, the wafer pocket is held in a second pack.

  The first and second exterior films are particularly preferably formed from a layer composite material composed of layers connected to each other. This layer composite material is a layer composite with regard to the compatibility of each film with the wafer, e.g. handling of the wafer pocket when opened, e.g. external structure for external printing, and further requirements specific to the drug. The optimal material structure is achieved.

  In a particularly preferred embodiment of the invention, the first and second outer films on the side in contact with the wafer are coated with the material that is inert to the active substance or substances of the wafer. This means that the active substance does not penetrate or penetrate into the material. This material is preferably Barex®, ie an acrylonitrile / methacrylate copolymer, which is provided on the inside, for example in the form of a layer. As a result, the inert layer of the outer film faces the cavity for the wafer. Therefore, chemical inertness of the first and second exterior films to the active substance of the wafer is substantially realized.

  Furthermore, the first and second exterior films can each have a printable polymer layer on the outward facing side so that they can be printed on the wafer pocket. The printable polymer layers of the first and second exterior films can in particular be composed of polyethylene terephthalate.

  The inert layer and the printable polymer layer of the first and second exterior films can be advantageously connected to each other via respective aluminum films. These aluminum films act as a moisture barrier.

The drawings described below serve to further explain the present invention.
FIG. 1 is a schematic plan view showing a wafer pocket according to the present invention in a state where a wafer is accommodated in the first embodiment. FIG. 2 shows a schematic cross-sectional view of a wafer pocket according to the invention with the wafer contained therein. FIG. 3 is a schematic plan view showing a wafer pocket according to the present invention in a state where a wafer is accommodated in the second embodiment. FIG. 4 is a schematic plan view showing a wafer pocket according to the present invention in a state in which a wafer is accommodated in the third embodiment.

  In the drawings, the same reference numeral indicates the same element.

  The wafer pocket 1 shown in FIG. 1 has a rectangular shape and is detachably connected to the cutout portion 20 on one side. In this case, two perforations 21 and four cutting parts 22 are provided.

  The wafer pocket 1 includes two exterior films 9, 11 (FIG. 2), and only the upper exterior film 9 is visible in FIG. These two exterior films are connected to each other via the connection region 2 by, for example, hot sealing. The connection region 2 extends to all sides along the edge of the wafer pocket 1 and surrounds the wafer receiving chamber 3. Therefore, the wafer storage chamber 3 is sealed from the outside. Within the wafer storage chamber 3 is a wafer 4.

  In the upper exterior film 9 and the lower exterior film 11, a notch 10 is formed along a bending line 5 by laser removal (FIG. 2). This means, for example, that the notch 10 is formed along the bending line 5, for example, outside the upper exterior film 9 and outside the lower exterior film 11. Those notches have a width of at least 0.1 mm at least on the surface of the exterior film. The notch is very short and is spaced from the edge of the wafer pocket. As a result, the cutouts do not substantially damage the outside of the exterior film. On the outside of the exterior film is a sufficiently large area available for printing.

  The material of the upper exterior film 9 and the lower exterior film 11 is fragile along the cutout portion 10, and the exterior film is torn along the cutout portion 10 when the wafer pocket 1 is opened. In order to open the wafer pocket 1, the exterior films 9 and 11 are first cut from the cutting portion 6, and the result is a first cutting line portion 7 that extends linearly. The first cut line section 7 then reaches the bend line 5 so that the direction of the cut line is turned 90 ° (to the left). In the further process of opening the wafer pocket 1, the cut line further follows a further course (second cut line part) designated by 8. As a result, the wafer storage chamber 3 is opened at two edge portions, so that the wafer 4 can be conveniently grasped with a finger and taken out.

  The wafer pocket 1 has a cutout portion 20 cut out as necessary. As a result, the cutout 20 is left in the second pack, while the wafer pocket 1 can be broken open to remove the wafer 4.

  In the second embodiment of the present invention, the bending line 5 extends in a curved shape starting from substantially the edge of the wafer pocket 1 (FIG. 3).

  In the third embodiment of the present invention, both the exterior films 9 and 11 have a bent region 12 (the latter film is not shown in FIG. 4). This bending area is circular. The material of the exterior films 9 and 11 is thinned by laser removal in the bent region. The bend area has a boundary line 13, which ends in the tangential direction at the cut-out line portions 7, 8 on one side. When the wafer pocket 1 is broken and opened from the cutting part 6, the cut line reaches the bent region in a tangential direction at the outer boundary line of the bent region. Since the unthinned material of the outer film is highly resistant to further cuts, the outer film is torn along the boundary, so that the direction of the cut line is turned 90 °. The outer film material is preferably at least partially composed of a biaxially oriented sealing film so as to produce two cut directions that are perpendicular to each other and perpendicular to each other. Yes. As a result, the cut line leaves the bent region in the second cut line portion that is aligned at an angle of 90 ° with respect to the first cut line portion. Accordingly, in this case as well, the wafer pocket can be opened in parallel with the two edges, so that the wafer 4 can be conveniently removed from the wafer receiving chamber 3.

Claims (17)

A wafer pocket (1) formed of first and second exterior films (9, 11), the first and second exterior films (9, 11) comprising at least one connection region (2) The wafer housing compartment (3), which is connected to each other via a wall and is suitable for housing the wafer (4) and sealed to the outside, comprises the first exterior film (9) and the above-mentioned A fragile region (5) formed between the second exterior film (11) and at least one of the exterior films (9, 11) is provided in the region of the wafer housing compartment (3). The wafer containing compartment (3) is opened by breaking the wafer pocket (1) along a cut line passing through the fragile region (5). Kicking it can,
The fragile region (5) is spaced from each edge of the wafer pocket (1), and the cut line extends partially outside the fragile region. (1). In the wafer pocket (1) according to claim 1,
The fragile area is formed in the form of a fragile line (5) or in the form of a fragile area (12). The wafer pocket according to claim 1 or 2,
The wafer pocket (1), wherein the first exterior film (9) and / or the second exterior film (11) are biaxially oriented. In the wafer pocket (1) according to claim 2,
The wafer pocket (1), wherein the first and / or second exterior film (9, 11) is disposed in a direction perpendicular to at least one edge of the wafer pocket (1). In the wafer pocket (1) according to claim 3,
At least one edge of the wafer pocket (1) has a fragile edge (6), from which the first exterior film (9) and the second exterior film (11) Wafer pocket (1) characterized in that it can be torn. In the wafer pocket (1) according to claim 5,
The wafer pocket (1), wherein the fragile edge is formed by a notch or cut (6) of at least one edge of the wafer pocket (1). In the wafer pocket (1) according to claim 5 or 6,
Wafer pocket (1), characterized in that said weak edge is provided in said connection area (2). In the wafer pocket (1) according to any one of claims 1 to 7,
The wafer pocket (1), wherein the fragile region (5) causes bending of the cut line when the wafer pocket (1) is torn open. In the wafer pocket (1) according to claim 8,
The weakened area is formed by a bend line (5) or a bend area (12), and the bend line (5) or bend area (12) extends substantially perpendicular to each other. Wafer pocket (1), characterized in that the line part (7) and the second cut line part (8) are connected together. In the wafer pocket (1) according to claim 8,
The bend area (12) has an outer boundary line (13) on which the cut line is bent from the first cut line part (7) to the second cut line part (8). Wafer pocket (1), characterized in that In the wafer pocket (1) according to any one of claims 1 to 9,
The fragile region is formed by a bend line (5), the bend line (5) having an end in the region of the wafer containing compartment (3), each end of the bend line (5). First and second tangents extend at right angles to each other, the first tangent forms a first cut line portion (7), and the second tangent is a second cut line portion (8 A wafer pocket (1), characterized in that In the wafer pocket (1) according to any one of claims 1 to 11,
The fragile region is formed by a bend line (5) or a bend area (12), and the bend line (5) or the bend area (12) includes the first exterior film (9) and / or the second area. A wafer pocket (1) characterized by a scribing structure (10) formed by the action of a laser beam on the exterior film (11). In the wafer pocket (1) according to any one of claims 1 to 12,
The wafer pocket (1), wherein the bent line (5) or the bent area (12) is formed on only one of the exterior films (9, 11). In the wafer pocket (1) according to any one of claims 1 to 13,
The wafer pocket (1), wherein the wafer pocket (1) is detachably connected to a cutout portion (20) on one side. In the wafer pocket (1) according to claim 14,
The wafer pocket (1), wherein the wafer pocket (1) is connected to the cutout portion (20) via at least one perforation (21). In the wafer pocket (1) according to any one of claims 1 to 15,
Each of the first exterior film (9) and the second exterior film (11) has a printable polymer layer on the side facing the outside. 1). In the wafer pocket (1) according to any one of the preceding claims,
A wafer pocket (1) characterized in that there is a wafer (4) in the wafer containing compartment (3).

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