WO2011118195A1 - 太陽電池の電極形成システムおよび太陽電池の電極形成方法 - Google Patents
太陽電池の電極形成システムおよび太陽電池の電極形成方法 Download PDFInfo
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- WO2011118195A1 WO2011118195A1 PCT/JP2011/001654 JP2011001654W WO2011118195A1 WO 2011118195 A1 WO2011118195 A1 WO 2011118195A1 JP 2011001654 W JP2011001654 W JP 2011001654W WO 2011118195 A1 WO2011118195 A1 WO 2011118195A1
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- Prior art keywords
- metal mask
- solar cell
- squeegee
- electrode
- paste
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 67
- 230000015572 biosynthetic process Effects 0.000 title claims abstract description 28
- 239000002184 metal Substances 0.000 claims abstract description 106
- 238000007650 screen-printing Methods 0.000 claims abstract description 60
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims description 31
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 description 64
- 238000004140 cleaning Methods 0.000 description 25
- 230000004048 modification Effects 0.000 description 13
- 238000012986 modification Methods 0.000 description 13
- 238000007639 printing Methods 0.000 description 12
- 238000010304 firing Methods 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 4
- 238000002508 contact lithography Methods 0.000 description 3
- 230000001154 acute effect Effects 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
- B41F15/0881—Machines for printing on polyhedral articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to a solar cell electrode forming system and a solar cell electrode forming method for printing paste such as cream solder or conductive paste on a base material.
- the first conductive paste is applied on the substrate, the first layer electrode is baked, the second conductive paste is applied on the first layer electrode, and the second A solar cell electrode forming system and a solar cell electrode forming method in which a layered electrode is fired are known (see, for example, Patent Document 1).
- the solar cell electrode forming system and the solar cell electrode forming method disclosed in Patent Document 1 attempt to form a thick electrode by performing each step of printing and baking twice. Therefore, in the solar cell electrode forming system and the solar cell electrode forming method disclosed in Patent Document 1, it is difficult to improve productivity because each step of printing and baking is performed twice.
- the present invention has been made to solve the above-described problems, and an object of the present invention is to provide a solar cell electrode forming system and a solar cell electrode forming method capable of improving productivity. .
- the electrode forming system for a solar cell exposes a covering portion that covers a part of the surface of the base material and a part of the base material in order to form an electrode of the base material used for the solar cell.
- a baking step in which the paste is used as the electrode by baking in a state where the paste is placed in a predetermined shape on the surface of the substrate, and the screen printing.
- the squeegee is relatively moved with respect to the metal mask along the arrangement direction of each opening and the bridge portion.
- the squeegee moves relative to the metal mask in the screen printing process.
- the paste on the surface of the substrate is fired. Therefore, in the present invention, productivity can be improved by forming a thick electrode by a single screen printing process and a single baking process.
- the electrode formation system for a solar cell according to the present invention is the above-described electrode formation system for a solar cell, wherein the squeegee head has a longitudinal direction of the squeegee in a direction orthogonal to the arrangement direction of the openings and the bridging portions. It is arranged relative to the metal mask so as to be along, and moves relatively along the arrangement direction of the openings and the bridging portions.
- the electrode of the solar cell can be reliably formed in a desired shape.
- the electrode formation system for a solar cell according to the present invention is formed by performing the screen printing step and the firing step once in the electrode formation system for the solar cell.
- the electrode formation system for a solar cell according to the present invention is the above-described electrode formation system for a solar cell, wherein the aspect ratio of the cross-sectional shape of the electrode is 1.0 or more.
- the aspect ratio of the mesh mask used conventionally is 0.7 or less, the aspect ratio can be dramatically improved.
- a covering portion that covers a part of the surface of the base material and a part of the base material are exposed.
- productivity can be improved by forming a thick electrode by a single screen printing process and a single baking process.
- the electrode forming method for a solar cell according to the present invention is the above-described electrode forming method for a solar cell, wherein the metal has a lengthwise direction of the squeegee along a direction orthogonal to an arrangement direction of the openings and the bridging portions. After disposing relative to the mask, the squeegee is moved relatively along the arrangement direction of the openings and the bridging portions.
- the electrode formation method for a solar cell according to the present invention is formed by performing the screen printing step and the firing step once in the electrode formation method for a solar cell.
- the longitudinal direction is along the direction perpendicular to the arrangement direction of the openings and the bridging portions of the metal mask.
- the squeegee arranged relative to the metal mask moves relative to the metal mask along the arrangement direction of the openings and the bridging portions of the metal mask.
- the firing step the paste on the surface of the substrate is fired.
- FIG. 1 is a front view of a screen printing apparatus having an open squeegee to which a screen printing method according to an embodiment of the present invention is applied.
- 1 is a front view of a screen printing apparatus having a cartridge type squeegee to which the screen printing method of FIG. 1 is applied.
- Enlarged view of the metal mask in FIG. Enlarged view of the main part of the metal mask of FIG. AA line sectional view of FIG. BB sectional view of FIG.
- FIG. 5 is an external perspective view around the bridge portion in the metal mask of FIG. FIG.
- FIG. 5 is an external perspective view around a bridge portion of a modification of the metal mask of FIG.
- the principal part top view of the modification of the screen printing apparatus of FIG. Plan view of a modification of the metal mask of FIG.
- the top view of the other modification of the metal mask of FIG. The top view of the other modification of the metal mask of FIG.
- a screen printing apparatus 10 to which a screen printing method according to an embodiment of the present invention is applied has a base 11, a support 12 that supports the base 11, a metal mask 1, and a predetermined upper surface of the metal mask 1.
- a squeegee head 13 for supplying a paste P as a circuit pattern to the surface of the metal mask 1 while relatively sliding the length squeegee 14 in sliding contact, and a cleaning mechanism 15 for cleaning the lower surface of the metal mask 1 are provided.
- the screen printing apparatus 10 includes a support base 12 that is a positioning unit for the base material 11, a Y-axis table 16, an X-axis table 17, and a ⁇ -axis table. 18, and a first Z-axis table 19 and a second Z-axis table 20 are combined thereon.
- the first Z-axis table 19 has a horizontal base plate 21 and is subjected to printing by two transport rails 23 arranged in parallel with the base material transport direction (X direction) in the base material transport section 22 on the base plate 21. It is conveyed while both ends of the substrate 11 are supported.
- the base material transport unit 22 extends to the upstream side and the downstream side, and the base material 11 carried from the upstream side is transported by the base material transport unit 22 and further positioned by the support base 12. The base material 11 after printing is carried out to the downstream side by the transport rail 23.
- the metal mask 1 is extended in the mask frame 2.
- a squeegee head 13 is disposed on the metal mask 1.
- the squeegee head 13 is an open type, and a squeegee raising / lowering mechanism 25 for raising and lowering the squeegee 14 having a predetermined length is disposed on a horizontal plate 24.
- the squeegee head 13 supplies paste (see FIG. 10) P, which becomes a circuit pattern, to the surface of the metal mask 1 with a predetermined pressure, and when the squeegee lifting mechanism 25 is driven, the squeegee 14 is lifted and lowered. Abuts the top surface.
- FIG. 2 shows a screen printing apparatus 10 equipped with a cartridge type squeegee head 13 instead of the open type squeegee head 13.
- the screen printing apparatus 10 supplies paste (see FIG. 10) P to be a circuit pattern to the surface of the metal mask 1 with a predetermined pressure, and the squeegee elevating mechanism 25 is driven to raise and lower the squeegee 14. In contact with the upper surface of the metal mask 1.
- the cartridge-type squeegee head 13 is excellent in filling performance as compared with the open type.
- a bracket 27 is disposed on the vertical frame 26, and a guide rail 28 is disposed on the bracket 27 in the Y direction.
- a slider 29 slidably fitted to the guide rail 28 is coupled to both ends of the plate 24. Thereby, the squeegee head 13 is slidable in the Y direction.
- the cleaning mechanism 15 moves integrally with the camera head unit 31 in which the cleaning head unit 30 images the base material 11 and the metal mask 1.
- the camera head unit 31 includes a base material recognition camera 32 for capturing an image of the base material 11 from above and a mask recognition camera 33 for capturing an image of the metal mask 1 from the lower surface side, and the camera head unit 30 moves. By doing so, recognition of the base material 11 and recognition of the metal mask 1 can be performed simultaneously.
- a paper roll 34 around which unused cleaning paper is wound, a paper roll 35 around which used cleaning paper is wound, and a cleaning region having a predetermined length are set on the lower surface of the metal mask 1.
- a cleaning nozzle 36 is provided.
- the cleaning head unit 30 is supported by a head X-axis table 38 that is slidably mounted on a guide rail 37 on the vertical frame 26, and is moved in the Y direction by a head Y-axis moving mechanism 39 on the head X-axis table 38. Move horizontally.
- the cleaning head unit 30 is retracted to the side of the support base 12 during standby.
- the cleaning head unit 30 is advanced below the metal mask 1 together with the camera head unit 31, and then the cleaning head unit 30 is raised. Then, with the cleaning paper pressed against the lower surface of the metal mask 1 by the cleaning nozzle 36, the cleaning head unit 30 is moved horizontally to perform cleaning.
- the metal mask 1 has a thickness dimension T ⁇ b> 1 of 0.1 mm, a width dimension L ⁇ b> 1 of 550 mm, and a length dimension L ⁇ b> 2 of 650 mm, for example. And a plurality of rectangular openings 4 from which a part of the base material 11 is exposed, each opening part 4 having a covering part 3 that covers a part of the surface of the base material 11 inside the mask frame 2.
- a bridging portion 5 is provided along the direction intersecting the longitudinal direction of the circuit pattern formed between the two.
- the metal mask 1 has a plurality of grit parts 6 provided with the openings 4 and the bridging parts 5 and arranged in parallel, and is continuous with the terminal opening at the longitudinal end of each grit part 6.
- the grid portion 6 has 67 lines having a line width dimension of 0.08 mm, for example.
- the grid portion 6 has a width dimension L6 of 2 mm at a position of a length dimension L5 of 39 mm from the left and right in FIG. 6 with a width dimension L4 of 75 mm in the center portion sandwiched within a width dimension L3 of 153 mm in the longitudinal direction.
- Each bus bar portion 7 is arranged.
- the opening 4 has a width dimension L7 of, for example, 0.08 mm.
- the bridging portion 5 has a width dimension L8 of 0.05 mm, for example, and a height dimension L9 of 0.02 mm, for example.
- crosslinking part 5 has the height dimension L9 of 0.02 mm, for example in the upper end part of the opening part 4 which has thickness dimension T1 of 0.1 mm, for example, a lower surface is with respect to the lower surface of the coating
- the bridging portion 5 may be arranged at the central portion in the thickness direction of the opening 4 as in the modification of the metal mask 1 shown in FIG. Also in this case, the bridging portion 5 is formed in a stepped shape in which the lower surface is concave with respect to the lower surface of the covering portion 3.
- a solar cell electrode forming system to which the screen printing apparatus 10 is applied and a solar cell electrode forming method to which the screen printing method is applied will be described.
- a screen printing process using a cartridge type squeegee head and a firing process are performed.
- the second Z-axis table 20 is driven and the lower surface of the base material 11 is received.
- the base 11 is aligned with the metal mask 1 by the support 12 and the metal mask 1 is brought into surface contact with the base 11.
- the squeegee head 13 moves the squeegee 14 relative to the metal mask 1 so that the longitudinal direction of the squeegee 14 is along a direction orthogonal to the arrangement direction of the openings 4 and the bridging portions 5 of the metal mask 1. To place.
- the squeegee 14 moves relative to the metal mask 1 in the Y direction along the arrangement direction of the openings 4 and the bridging portions 5.
- contact printing is performed with the base material 11 in contact with the metal mask 1.
- the paste P is pressed and progressed downward from each opening 4 to the lower part of the bridging part 5 along with the movement of the squeegee 14 in the Y direction. 4 is fully filled.
- the base material 11 after printing is carried out to the downstream baking process by the conveyance rail 23.
- the squeegee head 13 moves the squeegee 14 to the metal mask so that the longitudinal direction of the squeegee 14 is along the direction orthogonal to the arrangement direction of the openings 4 and the bridging portions 5 of the metal mask 1. 1 is relatively arranged. While the paste P is supplied onto the metal mask 1 with a predetermined pressure by the squeegee 14, the squeegee 14 moves relative to the metal mask 1 in the Y direction along the arrangement direction of the openings 4 and the bridging portions 5. By sliding movement, contact printing is performed with the base material 11 in contact with the metal mask 1.
- the firing step firing is performed in a state where the paste P is placed on the surface of the substrate 11 in a predetermined shape. Thereby, the paste P is formed in the electrode of a solar cell.
- the screen printing process and the baking process are performed once by using the cartridge type squeegee head 13 in the screen printing process. Then, by using the cartridge-type squeegee head 13 in the screen printing process, an electrode having a cross-sectional aspect ratio set to 1.0 or more is formed.
- the longitudinal direction of the cleaning nozzle 36 of the cleaning head unit 30 is arranged parallel to the longitudinal direction of the bus bar portion 7 of the metal mask 1, and the lower surface of the metal mask 1. Is cleaned.
- the longitudinal direction of the cleaning nozzle 36 is arranged parallel to the longitudinal direction of the bus bar portion 7 of the metal mask 1, that is, the bus bar portion 7 is wider than the grid portion 6, so The residual paste in part 7 increases. For this reason, the cleaning quality of the metal mask 1 as a whole can be improved by adopting a nozzle arrangement that prioritizes cleaning of the bus bar portion 7 over the grid portion 6.
- the longitudinal direction of the squeegee 14 is along a direction intersecting at a predetermined angle ⁇ 1 with respect to a direction orthogonal to the arrangement direction of the openings 4 and the bridging portions 5 of the metal mask 1.
- the squeegee 14 is relatively moved along the X direction orthogonal to the arrangement direction of the openings 4 and the bridging portions 5 of the metal mask 1.
- the squeegee 14 is moved from a direction intersecting at a predetermined angle ⁇ 1 with respect to a direction orthogonal to the arrangement direction of the openings 4 and the bridging portions 5 of the metal mask 1, whereby the paste P
- the opening 4 including the lower part of the bridging part 5 is sufficiently filled by being pushed and pushed obliquely from 4 toward the lower part of the bridging part 5.
- each of the parallelogram openings 4 is provided along the longitudinal direction of the circuit pattern to be formed. Therefore, the bridging portion 5 is disposed so as to be inclined with respect to the direction orthogonal to the longitudinal direction of the circuit pattern to be formed.
- the squeegee 14 is disposed relatively in the longitudinal direction in a direction perpendicular to the arrangement direction of the openings 4 and the bridging portions 5 of the metal mask 1. It moves relative to the metal mask 1 along the X direction orthogonal to the arrangement direction.
- the paste P is pushed downward from the acute angle portion of the bridging portion 5 arranged so as to be inclined with respect to the traveling direction of the squeegee 14, thereby lowering the bridging portion 5.
- the squeegee 14 may be moved relative to the metal mask 1 in the Y direction along the arrangement direction of the openings 4 and the bridging portions 5.
- the bridging portion 5 is disposed so as to be inclined with respect to the direction orthogonal to the longitudinal direction of the circuit pattern to be formed.
- the squeegee 14 is disposed relatively in the longitudinal direction in a direction perpendicular to the arrangement direction of the openings 4 and the bridging portions 5 of the metal mask 1. It moves relative to the metal mask 1 along the arrangement direction.
- the paste P is pushed downward from the acute angle portion of the bridging portion 5 arranged so as to be inclined with respect to the traveling direction of the squeegee 14, thereby lowering the bridging portion 5.
- the squeegee 14 may be moved relative to the metal mask 1 in the Y direction along the arrangement direction of the openings 4 and the bridging portions 5.
- each square opening 4 is provided along the longitudinal direction of the circuit pattern to be formed.
- the longitudinal direction of the squeegee 14 is relative to the direction intersecting at a predetermined angle with respect to the direction orthogonal to the arrangement direction of the openings 4 and the bridging portions 5 of the metal mask 1.
- the squeegee 14 moves relatively along the X direction orthogonal to the arrangement direction of the openings 4 and the bridging portions 5 of the metal mask 1. Accordingly, the paste P is pressed and progressed downward from the respective opening portions 4 to the lower portions of the bridging portions 5 as the squeegee 14 is moved in the X direction. 4 is fully filled.
- the openings 4 and the bridging portions 5 of the metal mask 1 are arranged in the arrangement direction.
- the firing step the paste on the surface of the substrate 11 is fired.
- the cartridge-type squeegee head 13 is used in the screen printing process, so that a thick electrode is formed once.
- the productivity can be improved by forming by the screen printing step and the single baking step.
- the printing and baking processes are performed only once by using the cartridge type squeegee head 13 in the screen printing process. As a result, man-hours can be significantly reduced.
- the conventional mesh mask has an aspect ratio of 0.7 or less, while the screen printing process uses a cartridge.
- the squeegee head 13 the aspect ratio can be dramatically improved.
- the paste is efficiently supplied to the openings 4 and the bridging portions 5 of the metal mask 1.
- the battery electrode can be reliably formed in a desired shape.
- the longitudinal direction is along the direction orthogonal to the arrangement direction of the openings 4 and the bridging portions 5 of the metal mask 1.
- a screen printing step in which the squeegee 14 disposed relative to the metal mask 1 is moved relative to the metal mask 1 along the arrangement direction of the openings 4 and the bridging portions 5 of the metal mask 1.
- the paste on the surface of the substrate 11 is fired. Therefore, according to the screen printing method to which the solar cell electrode forming method of one embodiment of the present invention is applied, the cartridge-type squeegee head 13 is used in the screen printing process, so that a thick electrode is formed once. Productivity can be improved by forming through a screen printing process and a single baking process.
- Example 2 Next, the Example performed in order to confirm the effect of the screen printing apparatus 10 which applied the solar cell electrode formation system which concerns on this invention, and the screen printing method which applied the solar cell electrode formation method is demonstrated.
- a mesh mask having an aperture ratio of 50% or less was used, and Comparative Example 1 in which gap printing was performed by an open squeegee head, and a cartridge type squeegee head having an aperture ratio of 50% or less were used.
- Comparative Example 2 using contact printing was prepared to form an electrode of a solar cell, and the aspect ratio according to the cross-sectional area between the height dimension of the formed electrode and the width dimension of the electrode was measured.
- Comparative Example 1 had an aspect ratio of 0.3 or less
- Comparative Example 2 had an aspect ratio of 0.7 or less
- the aspect ratio of the present invention was 1.0 or more. That is, the squeegee of the cartridge type squeegee head 13 disposed relative to the metal mask 1 so that the longitudinal direction is along the direction orthogonal to the arrangement direction of the openings 4 and the bridging portions 5 of the metal mask 1. 14 is moved relative to the metal mask 1 along the arrangement direction of the openings 4 and the bridging portions 5 of the metal mask 1. Thereby, it is also possible to apply the metal mask 1 having an aperture ratio of 90% or more.
- the support stand 12, the squeegee 14, the cleaning mechanism 15 and the like used in the above embodiment are not limited to those illustrated, and can be appropriately changed.
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Abstract
Description
このような要望に対し、上記特許文献1の太陽電池の電極形成システムおよび太陽電池の電極形成方法では、印刷および焼成の各工程を2回行うことにより膜厚の厚い電極を形成しようとしている。
従って、上記特許文献1の太陽電池の電極形成システムおよび太陽電池の電極形成方法では、印刷および焼成の各工程を2回行っているために生産性の向上を図ることが難しい。
従って、本発明においては、膜厚の厚い電極を、1回のスクリーン印刷工程と1回の焼成工程とにより形成することにより生産性の向上を図ることができる。
これにより、本発明の太陽電池の電極形成システムおよび太陽電池の電極形成方法によれば、膜厚の厚い電極を、1回のスクリーン印刷工程と1回の焼成工程とにより形成することにより生産性の向上を図ることができるという効果を奏する。
カートリッジ式のスキージヘッド13でペーストPをメタルマスク1の表面に対して所定の圧力で供給することにより、ペーストPは各開口部4から架橋部5の下方に向けて押圧進行され、架橋部5の下方を含めた各開口部4内に十分に充填される。
従って、本発明の一実施形態の太陽電池の電極形成システムを適用したスクリーン印刷装置10によれば、スクリーン印刷工程にカートリッジ式のスキージヘッド13を用いることにより、膜厚の厚い電極を、1回のスクリーン印刷工程と1回の焼成工程とにより形成することにより生産性の向上を図ることができる。
従って、本発明の一実施形態の太陽電池の電極形成方法を適用したスクリーン印刷方法によれば、スクリーン印刷工程にカートリッジ式のスキージヘッド13を用いることにより、膜厚の厚い電極を、1回のスクリーン印刷工程と1回の焼成工程とにより形成することにより生産性の向上を図ることができる。
次に、本発明に係る太陽電池の電極形成システムを適用したスクリーン印刷装置10および太陽電池の電極形成方法を適用したスクリーン印刷方法の作用効果を確認するために行った実施例について説明する。実施例では、開口率が50%以下のメッシュマスクを用い、開放式のスキージヘッドによりギャップ印刷を行った比較例1と、開口率が50%以下のメッシュマスクを用い、カートリッジ式のスキージヘッドを用いてコンタクト印刷を行った比較例2と、を用意して太陽電池の電極を形成し、形成された電極の高さ寸法と電極の幅寸法との断面積によるアスペクト比を測定した。
3 被覆部
4 開口部
5 架橋部
10 スクリーン印刷装置(太陽電池の電極形成システム)
11 基材
13 スキージヘッド
14 スキージ
P ペースト
Claims (7)
- 太陽電池に用いられる基材の電極を形成するために、
前記基材の表面の一部を覆う被覆部と、前記基材の一部が露出する複数の開口部と、前記各開口部の間において回路パターンの長手方向に対して交差する方向に沿って設けられた架橋部とを有するメタルマスクを前記基材の表面に載置させてから、前記メタルマスクにおける上面に対して所定長さのスキージを相対的に摺接させながら前記電極となるペーストをカートリッジ式のスキージヘッドにより前記メタルマスクの表面に対して所定の圧力で供給するスクリーン印刷工程と、
前記基材の表面に前記ペーストが所定の形状に載せられた状態で焼成することにより前記ペーストを前記電極とする焼成工程と、
を有し、
前記スクリーン印刷工程において、
前記スキージが、前記メタルマスクに対して相対的に移動する太陽電池の電極形成システム。 - 請求項1に記載の太陽電池の電極形成システムにおいて、
前記スキージヘッドが、
前記各開口部および前記架橋部の配列方向に対して直交する方向に前記スキージの長手方向が沿うように前記メタルマスクに対して相対的に配置され、前記各開口部および前記架橋部の配列方向に沿って相対的に移動する太陽電池の電極形成システム。 - 請求項1または請求項2に記載の太陽電池の電極形成システムにおいて、
前記電極が、前記スクリーン印刷工程と、前記焼成工程とを1回行うことにより形成される太陽電池の電極形成システム。 - 請求項3に記載の太陽電池の電極形成システムにおいて、
前記電極の断面形状のアスペクト比が1.0以上である太陽電池の電極形成システム。 - 太陽電池に用いられる基材の電極を形成するために、
前記基材の表面の一部を覆う被覆部と、前記基材の一部が露出する複数の開口部と、前記各開口部の間において回路パターンの長手方向に対して交差する方向に沿って設けられた架橋部とを有するメタルマスクを前記基材の表面に載置させてから、前記メタルマスクにおける上面に対して所定長さのスキージを相対的に摺接させながら前記電極となるペーストをカートリッジ式のスキージヘッドにより前記メタルマスクの表面に対して所定の圧力で供給するにあたって、
前記メタルマスクに対して前記スキージを相対的に移動させるスクリーン印刷工程の後、
前記基材の表面に前記ペーストが所定の形状に載せられた状態で焼成することにより前記ペーストを前記電極とする焼成工程を行う太陽電池の電極形成方法。 - 請求項5に記載の太陽電池の電極形成方法において、
前記各開口部および前記架橋部の配列方向に対して直交する方向に前記スキージの長手方向が沿うように前記メタルマスクに対して相対的に配置した後、前記スキージを前記各開口部および前記架橋部の配列方向に沿って相対的に移動させる太陽電池の電極形成方法。 - 請求項5または請求項6に記載の太陽電池の電極形成方法において、
前記電極が、前記スクリーン印刷工程と、前記焼成工程とを1回行うことにより形成される太陽電池の電極形成方法。
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GB1214225.3A GB2491992A (en) | 2010-03-24 | 2011-03-18 | Electrode formation system for solar cell and electrode formation method for solar cell |
US13/582,881 US8997646B2 (en) | 2010-03-24 | 2011-03-18 | Electrode formation system for solar cell and electrode formation method for solar cell |
KR1020127023025A KR20130059316A (ko) | 2010-03-24 | 2011-03-18 | 태양 전지의 전극 형성 시스템 및 태양 전지의 전극 형성 방법 |
CN201180012710.0A CN102792458B (zh) | 2010-03-24 | 2011-03-18 | 太阳能电池的电极形成系统及太阳能电池的电极形成方法 |
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JP2010068256A JP5288633B2 (ja) | 2010-03-24 | 2010-03-24 | 太陽電池の電極形成システムおよび太陽電池の電極形成方法 |
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CN105449031A (zh) * | 2014-09-24 | 2016-03-30 | 英属开曼群岛商精曜有限公司 | 电极表面处理与制作方法 |
JP2018536559A (ja) * | 2015-11-12 | 2018-12-13 | ハンファ キュー セルズ マレーシア エスディーエヌ.ビーエイチディー. | 少なくとも1つのグリッド線を対象基板の上面に順方向および逆方向に形成する2つの印刷ブレード付きプリントヘッド |
CN107662401A (zh) * | 2016-07-31 | 2018-02-06 | 青岛瑞元鼎泰新能源科技有限公司 | 一种印刷无主栅电池片正面电极的设备及工艺 |
WO2019078598A1 (ko) * | 2017-10-20 | 2019-04-25 | (주)이노페이스 | 태양전지용 스텐실 마스크 |
US11575064B2 (en) | 2018-03-22 | 2023-02-07 | Applied Materials Italia S.R.L. | Device and method for cleaning a printing device |
JP6846609B2 (ja) * | 2019-03-20 | 2021-03-24 | パナソニックIpマネジメント株式会社 | スクリーン印刷装置およびスクリーン印刷方法 |
CN111114108A (zh) * | 2020-01-06 | 2020-05-08 | 江西展宇新能源股份有限公司 | 一种太阳能电池正面电极网版 |
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KR20130059316A (ko) | 2013-06-05 |
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US8997646B2 (en) | 2015-04-07 |
GB201214225D0 (en) | 2012-09-19 |
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