WO2011108260A1 - Procédé de production d'un écran plasma - Google Patents

Procédé de production d'un écran plasma Download PDF

Info

Publication number
WO2011108260A1
WO2011108260A1 PCT/JP2011/001200 JP2011001200W WO2011108260A1 WO 2011108260 A1 WO2011108260 A1 WO 2011108260A1 JP 2011001200 W JP2011001200 W JP 2011001200W WO 2011108260 A1 WO2011108260 A1 WO 2011108260A1
Authority
WO
WIPO (PCT)
Prior art keywords
oxide
substrate
discharge
conductance
base film
Prior art date
Application number
PCT/JP2011/001200
Other languages
English (en)
Japanese (ja)
Inventor
後藤　真志
奥村　智洋
関口　大好
Original Assignee
パナソニック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニック株式会社 filed Critical パナソニック株式会社
Publication of WO2011108260A1 publication Critical patent/WO2011108260A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/10—AC-PDPs with at least one main electrode being out of contact with the plasma
    • H01J11/12—AC-PDPs with at least one main electrode being out of contact with the plasma with main electrodes provided on both sides of the discharge space
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H01J11/34—Vessels, containers or parts thereof, e.g. substrates
    • H01J11/40—Layers for protecting or enhancing the electron emission, e.g. MgO layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems

Definitions

  • the present invention relates to a method for manufacturing a plasma display panel used for a display device or the like.
  • PDPs Plasma display panels
  • 100-inch class televisions have been commercialized.
  • PDP has been applied to high-definition televisions that have more than twice the number of scanning lines compared to the conventional NTSC system.
  • efforts to further reduce power consumption and environmental issues There is also a growing demand for PDPs that do not contain lead components in consideration of the above.
  • the PDP is basically composed of a front plate and a back plate.
  • the front plate is a glass substrate of sodium borosilicate glass produced by the float process, a display electrode composed of a striped transparent electrode and a bus electrode formed on one main surface of the glass substrate, A dielectric layer that covers the display electrode and functions as a capacitor, and a protective layer made of magnesium oxide (MgO) formed on the dielectric layer.
  • MgO magnesium oxide
  • the back plate is a glass substrate, stripe-shaped address electrodes formed on one main surface thereof, a base dielectric layer covering the address electrodes, a partition formed on the base dielectric layer, The phosphor layer is formed between the barrier ribs and emits red, green and blue light.
  • the front plate and the back plate are hermetically sealed with their electrode forming surfaces facing each other, and a discharge gas of neon (Ne) -xenon (Xe) is 400 Torr to 600 Torr (5.3 ⁇ ) in a discharge space partitioned by a partition wall. 10 4 Pa to 8.0 ⁇ 10 4 Pa).
  • PDP discharges by selectively applying a video signal voltage to the display electrodes, and the ultraviolet rays generated by the discharge excite each color phosphor layer to emit red, green, and blue light, thereby realizing color image display is doing.
  • such a PDP driving method includes an initialization period in which wall charges are adjusted so that writing is easy, a writing period in which writing discharge is performed according to an input image signal, and a discharge space in which writing is performed.
  • a driving method having a sustain period in which display is performed by generating a sustain discharge is generally used.
  • a period (subfield) obtained by combining these periods is repeated a plurality of times within a period (one field) corresponding to one frame of an image, thereby performing PDP gradation display.
  • the role of the protective layer formed on the dielectric layer of the front plate is to protect the dielectric layer from ion bombardment due to discharge and to emit initial electrons for generating address discharge.
  • Etc. Protecting the dielectric layer from ion bombardment plays an important role in preventing an increase in discharge voltage, and emitting initial electrons for generating an address discharge is an address discharge error that causes image flickering. It is an important role to prevent.
  • JP 2002-260535 A Japanese Patent Laid-Open No. 11-339665 JP 2006-59779 A JP-A-8-236028 JP-A-10-334809
  • the present invention provides a first substrate in which a dielectric layer is formed so as to cover a display electrode formed on the substrate and a protective layer is formed on the dielectric layer, and a discharge space in which the first substrate is filled with a discharge gas.
  • a second substrate that is arranged so as to be opposed to each other and that forms an address electrode in a direction intersecting with the display electrode of the first substrate and has a partition wall that partitions a discharge space, and the first substrate and the second substrate, Is a method of manufacturing a plasma display panel having a sealing process in which a peripheral portion is sealed with a sealing member, and the sealing process includes an inspection process for inspecting conductance for each panel, and a second substrate.
  • the present invention it is possible to reduce the discharge start voltage even when the Xe gas partial pressure of the discharge gas is increased in order to improve the secondary electron emission characteristics in the protective layer and increase the luminance.
  • a PDP excellent in display performance capable of being driven with high brightness and low voltage can be realized.
  • the reaction between the protective film and the impurity gas during the panel manufacturing process can be suppressed, and a PDP in which variation in discharge characteristics for each discharge cell is suppressed can be realized.
  • FIG. 1 is a perspective view showing a structure of a PDP according to an embodiment.
  • FIG. 2 is a cross-sectional view showing the configuration of the front plate of the PDP.
  • FIG. 3 is a flowchart showing a method for manufacturing the panel.
  • FIG. 4 is a diagram showing an X-ray diffraction result in the base film of the PDP.
  • FIG. 5 is a diagram showing an X-ray diffraction result in the base film having another configuration of the PDP.
  • FIG. 6 is an enlarged view for explaining the aggregated particles of the PDP.
  • FIG. 7 is a diagram showing the relationship between the discharge delay of the PDP and the calcium (Ca) concentration in the protective layer.
  • FIG. 1 is a perspective view showing a structure of a PDP according to an embodiment.
  • FIG. 2 is a cross-sectional view showing the configuration of the front plate of the PDP.
  • FIG. 3 is a flowchart showing a method for manufacturing the panel.
  • FIG. 8 is a diagram showing the results of examining the electron emission performance and the lighting voltage of the PDP.
  • FIG. 9 is a characteristic diagram showing the relationship between the particle size of the crystal particles used in the PDP and the electron emission performance.
  • FIG. 10 is a diagram illustrating an example of the sealing device.
  • FIG. 11 is a diagram illustrating a result of the inspection process in the sealing process.
  • FIG. 12 is a diagram showing a result of the gas flow process in the sealing process.
  • FIG. 13 is a view showing an installation state of the panel and the glass tube.
  • FIG. 1 is a perspective view showing a structure of a PDP in one embodiment.
  • the basic structure of the PDP is the same as that of a general AC surface discharge type PDP.
  • a front plate 2 as a first substrate made of a front glass substrate 3 and the like and a back plate 10 as a second substrate made of a back glass substrate 11 and the like are arranged to face each other.
  • the peripheral part of the front plate 2 and the back plate 10 is hermetically sealed by a sealing member made of glass frit or the like.
  • the discharge space 16 in the sealed PDP 1 contains a discharge gas in which Ne or the like is mixed with Xe at a pressure of 30 Torr to 300 Torr (5.3 ⁇ 10 4 Pa to 8.0 ⁇ 10 4 Pa). It is enclosed.
  • a pair of strip-shaped display electrodes 6 each composed of a scanning electrode 4 and a sustain electrode 5 and a plurality of black stripes (light shielding layers) 7 are arranged in parallel to each other.
  • a dielectric layer 8 is formed on the front glass substrate 3 so as to cover the display electrodes 6 and the light-shielding layer 7 so as to hold charges and function as a capacitor.
  • a protective layer 9 is further formed thereon. .
  • a plurality of strip-like address electrodes 12 are arranged in parallel to each other in a direction orthogonal to the scanning electrodes 4 and the sustain electrodes 5 of the front plate 2.
  • Layer 13 is covering.
  • a partition wall 14 having a predetermined height is formed on the base dielectric layer 13 between the address electrodes 12 to divide the discharge space 16.
  • a phosphor layer 15 that emits red, green, and blue light by ultraviolet rays is sequentially applied.
  • a discharge space 16 is formed at a position where the scan electrode 4 and the sustain electrode 5 and the address electrode 12 intersect, and the discharge space 16 having the red, green, and blue phosphor layers 15 arranged in the direction of the display electrode 6 is used for color display. It becomes a pixel for.
  • FIG. 2 is a cross-sectional view showing a detailed configuration of the front plate of the PDP according to one embodiment. 2 is shown upside down from FIG.
  • a display electrode 6 and a light shielding layer 7 including scanning electrodes 4 and sustain electrodes 5 are formed in a pattern on a front glass substrate 3 manufactured by a float method or the like.
  • Scan electrode 4 and sustain electrode 5 are made of transparent electrodes 4a and 5a made of indium tin oxide (ITO), tin oxide (SnO 2 ), etc., and metal bus electrodes 4b and 5b formed on transparent electrodes 4a and 5a, respectively. It is comprised by.
  • the metal bus electrodes 4b and 5b are used for the purpose of imparting conductivity in the longitudinal direction of the transparent electrodes 4a and 5a, and are formed of a conductive material whose main component is a silver (Ag) material.
  • the dielectric layer 8 includes a first dielectric layer 81 provided on the front glass substrate 3 so as to cover the transparent electrodes 4a and 5a, the metal bus electrodes 4b and 5b, and the light shielding layer 7, and a first dielectric.
  • the second dielectric layer 82 formed on the layer 81 has at least two layers, and the protective layer 9 is formed on the second dielectric layer 82.
  • the protective layer 9 includes a base film 91 formed on the dielectric layer 8 and aggregated particles 92 in which a plurality of magnesium oxide (MgO) crystal particles 92 a are aggregated on the base film 91.
  • the base film 91 is formed of a metal oxide selected from magnesium oxide (MgO), calcium oxide (CaO), strontium oxide (SrO), and barium oxide (BaO).
  • the base film 91 of the protective layer 9 is made of a metal oxide composed of at least two oxides selected from magnesium oxide (MgO), calcium oxide (CaO), strontium oxide (SrO), and barium oxide (BaO). It is desirable to form.
  • FIG. 3 is a flowchart showing the manufacturing process of the PDP.
  • the PDP 1 applies a glass frit as a sealing member to the outside of the image display area of the back plate 10 produced by the front plate production process, the back plate production process, and the back plate production process.
  • the frit coating step of pre-baking at a temperature of about 350 ° C. the front plate 2 produced in the front plate production step, and the back plate 10 after completion of the frit coating step are attached and sealed.
  • a panel is completed through these steps.
  • the sealing member is preferably a frit mainly composed of bismuth oxide or vanadium oxide.
  • the frit mainly composed of bismuth oxide include a Bi 2 O 3 —B 2 O 3 —RO—MO system (where R is any one of Ba, Sr, Ca, and Mg, and M is Any of Cu, Sb, and Fe)) and a filler made of an oxide such as Al 2 O 3 , SiO 2 , and cordierite can be used.
  • a frit containing vanadium oxide as a main component for example, a filler made of an oxide such as Al 2 O 3 , SiO 2 or cordierite is added to a V 2 O 5 —BaO—TeO—WO glass material. Things can be used.
  • the scan electrode 4, the sustain electrode 5, and the light shielding layer 7 are formed on the front glass substrate 3.
  • Transparent electrodes 4a and 5a and metal bus electrodes 4b and 5b constituting scan electrode 4 and sustain electrode 5 are formed by patterning using a photolithography method or the like.
  • the transparent electrodes 4a and 5a are formed using a thin film process or the like, and the metal bus electrodes 4b and 5b are solidified by baking a paste containing a silver (Ag) material at a predetermined temperature.
  • the light shielding layer 7 is also formed by screen printing a paste containing a black pigment or by forming a black pigment on the entire surface of the glass substrate and then patterning and baking using a photolithography method.
  • a dielectric paste (dielectric material) layer is formed by applying a dielectric paste on the front glass substrate 3 by a die coating method or the like so as to cover the scanning electrode 4, the sustain electrode 5 and the light shielding layer 7.
  • the surface of the applied dielectric paste is leveled by leaving it to stand for a predetermined time, so that a flat surface is obtained.
  • the dielectric paste layer is formed by baking and solidifying the dielectric paste layer to cover the scan electrode 4, the sustain electrode 5, and the light shielding layer 7.
  • the dielectric paste is a paint containing a dielectric material such as glass powder, a binder and a solvent.
  • the base film 91 is made of a metal oxide composed of at least two oxides selected from magnesium oxide (MgO), calcium oxide (CaO), strontium oxide (SrO), and barium oxide (BaO). It is formed by things.
  • MgO magnesium oxide
  • CaO calcium oxide
  • SrO strontium oxide
  • BaO barium oxide
  • the base film 91 is formed into a thin film using a pellet made of a single material of magnesium oxide (MgO), calcium oxide (CaO), strontium oxide (SrO), and barium oxide (BaO), or a pellet obtained by mixing these materials. Formed by the method.
  • a known method such as an electron beam evaporation method, a sputtering method, or an ion plating method can be applied.
  • the upper limit of the pressure that can be actually taken is 1 Pa in the sputtering method and 0.2 Pa in the electron beam evaporation method which is an example of the evaporation method.
  • a base film 91 made of a metal oxide having the above can be formed.
  • the agglomerated particles 92 of the magnesium oxide (MgO) crystal particles 92a deposited on the base film 91 will be described.
  • These crystal particles 92a can be manufactured by any one of the following vapor phase synthesis method or precursor baking method.
  • a magnesium metal material having a purity of 99.9% or more is heated in an atmosphere filled with an inert gas, and a small amount of oxygen is introduced into the atmosphere to directly oxidize magnesium, thereby oxidizing the material.
  • Magnesium (MgO) crystal particles 92a can be produced.
  • the crystal particles 92a can be produced by the following method.
  • a magnesium oxide (MgO) precursor is uniformly fired at a high temperature of 700 ° C. or higher, and this is gradually cooled to obtain magnesium oxide (MgO) crystal particles 92a.
  • the precursor include magnesium alkoxide (Mg (OR) 2 ), magnesium acetylacetone (Mg (acac) 2 ), magnesium hydroxide (Mg (OH) 2 ), magnesium carbonate (MgCO 2 ), magnesium chloride (MgCl 2 ).
  • MgSO 4 Magnesium sulfate
  • Mg (NO 3 ) 2 magnesium nitrate
  • MgC 2 O 4 magnesium oxalate
  • it may usually take the form of a hydrate, but such a hydrate may be used.
  • MgO magnesium oxide
  • these compounds are adjusted so that the purity of magnesium oxide (MgO) obtained after firing is 99.95% or more, preferably 99.98% or more. If these compounds contain a certain amount or more of various impurity elements such as alkali metals, B, Si, Fe, and Al, unnecessary interparticle adhesion and sintering occur during heat treatment, and highly crystalline magnesium oxide ( This is because it is difficult to obtain MgO) crystal particles 92a. For this reason, it is necessary to adjust the precursor in advance by removing the impurity element.
  • impurity elements such as alkali metals, B, Si, Fe, and Al
  • the magnesium oxide (MgO) crystal particles 92a obtained by any of the above methods are dispersed in a solvent, and the dispersion is applied to the undercoat film 91 by a spray method, a screen printing method, a slit coating method, an electrostatic coating method, or the like. Disperse the surface. Thereafter, the solvent is removed through a drying / firing process, and the magnesium oxide (MgO) crystal particles 92 a can be fixed on the surface of the base film 91.
  • magnesium oxide (MgO) crystal particles 92 a on the surface of the base film 91 As a method for dispersing and fixing the magnesium oxide (MgO) crystal particles 92 a on the surface of the base film 91, a method that can be performed at a low temperature of 400 ° C. or lower is preferable from the viewpoint of suppressing reaction with impurities in the base film 91. .
  • predetermined components scanning electrode 4, sustaining electrode 5, light shielding layer 7, dielectric layer 8, and protective layer 9) are formed on front glass substrate 3, and front plate 2 is completed.
  • the back plate 10 is formed as follows. First, the structure for the address electrode 12 is formed by a method of screen printing a paste containing silver (Ag) material on the rear glass substrate 11 or a method of patterning using a photolithography method after forming a metal film on the entire surface. A material layer to be a material is formed. Thereafter, the address electrode 12 is formed by firing at a predetermined temperature. Next, a dielectric paste is applied on the rear glass substrate 11 on which the address electrodes 12 are formed by a die coating method or the like so as to cover the address electrodes 12 to form a dielectric paste layer. Thereafter, the base dielectric layer 13 is formed by firing the dielectric paste layer.
  • the dielectric paste is a paint containing a dielectric material such as glass powder, a binder and a solvent.
  • a barrier rib forming paste containing barrier rib material is applied on the underlying dielectric layer 13 and patterned into a predetermined shape to form a barrier rib material layer.
  • the partition 14 is formed by baking at a predetermined temperature.
  • a photolithography method or a sand blast method can be used as a method of patterning the partition wall paste applied on the base dielectric layer 13.
  • the phosphor layer 15 is formed by applying and baking a phosphor paste containing a phosphor material on the base dielectric layer 13 between the adjacent barrier ribs 14 and on the side surfaces of the barrier ribs 14.
  • the dielectric material of the first dielectric layer 81 is composed of the following material composition. That is, 20% by weight to 40% by weight of bismuth oxide (Bi 2 O 3 ), 0.5% by weight to 12% of at least one selected from calcium oxide (CaO), strontium oxide (SrO), and barium oxide (BaO). Contains 0.1% by weight to 7% by weight of at least one selected from molybdenum oxide (MoO 3 ), tungsten oxide (WO 3 ), cerium oxide (CeO 2 ), and manganese dioxide (MnO 2 ). .
  • molybdenum oxide MoO 3
  • tungsten oxide WO 3
  • cerium oxide CeO 2
  • manganese dioxide MnO 2
  • copper oxide CuO
  • chromium oxide Cr 2 O 3
  • cobalt oxide At least one selected from (Co 2 O 3 ), vanadium oxide (V 2 O 7 ), and antimony oxide (Sb 2 O 3 ) may be contained in an amount of 0.1 wt% to 7 wt%.
  • zinc oxide (ZnO) is contained in an amount of 0 to 40% by weight, boron oxide (B 2 O 3 ) in an amount of 0 to 35% by weight, and silicon oxide (SiO 2 ) in an amount of 0 to 4% by weight.
  • a material composition that does not contain a lead component, such as 15 wt% and aluminum oxide (Al 2 O 3 ) 0 wt% to 10 wt% may be included.
  • a dielectric material powder is prepared by pulverizing a dielectric material composed of these composition components with a wet jet mill or a ball mill so that the particle diameter becomes 0.5 ⁇ m to 2.5 ⁇ m. Next, 55 wt% to 70 wt% of the dielectric material powder and 30 wt% to 45 wt% of the binder component are well kneaded with three rolls to paste for the first dielectric layer 81 for die coating or printing. Is made.
  • the binder component is ethyl cellulose, terpineol containing 1% to 20% by weight of acrylic resin, or butyl carbitol acetate.
  • dioctyl phthalate, dibutyl phthalate, triphenyl phosphate and tributyl phosphate are added to the paste as needed, and glycerol monooleate, sorbitan sesquioleate, homogenol (Kao Corporation) as a dispersant.
  • the printing property may be improved as a paste by adding a phosphate ester of an alkyl allyl group, etc.
  • the front glass substrate 3 is printed by a die coat method or a screen printing method so as to cover the display electrode 6 and dried, and then slightly higher than the softening point of the dielectric material.
  • the first dielectric layer 81 is formed by baking at a temperature of 575 ° C. to 590 ° C.
  • the dielectric material of the second dielectric layer 82 is composed of the following material composition. That is, bismuth oxide (Bi 2 O 3 ) is 11 wt% to 20 wt%, and at least one selected from calcium oxide (CaO), strontium oxide (SrO), and barium oxide (BaO) is 1.6 wt%. It contains ⁇ 21 wt%, and contains 0.1 wt% ⁇ 7 wt% of at least one selected from molybdenum oxide (MoO 3 ), tungsten oxide (WO 3 ), and cerium oxide (CeO 2 ).
  • MoO 3 molybdenum oxide
  • WO 3 tungsten oxide
  • CeO 2 cerium oxide
  • MoO 3 molybdenum oxide
  • tungsten oxide WO 3
  • cerium oxide CeO 2
  • copper oxide CuO
  • chromium oxide Cr 2 O 3
  • cobalt oxide Co 2 O 3
  • At least one selected from vanadium oxide (V 2 O 7 ), antimony oxide (Sb 2 O 3 ), and manganese oxide (MnO 2 ) may be contained in an amount of 0.1 wt% to 7 wt%.
  • zinc oxide (ZnO) is contained in an amount of 0 to 40% by weight, boron oxide (B 2 O 3 ) in an amount of 0 to 35% by weight, and silicon oxide (SiO 2 ) in an amount of 0 to 4% by weight.
  • a material composition that does not contain a lead component, such as 15 wt% and aluminum oxide (Al 2 O 3 ) 0 wt% to 10 wt% may be included.
  • a dielectric material powder is prepared by pulverizing a dielectric material composed of these composition components with a wet jet mill or a ball mill so that the particle diameter becomes 0.5 ⁇ m to 2.5 ⁇ m. Next, 55 wt% to 70 wt% of the dielectric material powder and 30 wt% to 45 wt% of the binder component are well kneaded with three rolls to form a second dielectric layer paste for die coating or printing. Make it.
  • the binder component is ethyl cellulose, terpineol containing 1% to 20% by weight of acrylic resin, or butyl carbitol acetate.
  • dioctyl phthalate, dibutyl phthalate, triphenyl phosphate, and tributyl phosphate are added as plasticizers as needed, and glycerol monooleate, sorbitan sesquioleate, and homogenol (Kao Corporation) as dispersants.
  • the printability may be improved by adding a phosphoric ester of an alkyl allyl group or the like.
  • the film thickness of the dielectric layer 8 is preferably set to 41 ⁇ m or less in total of the first dielectric layer 81 and the second dielectric layer 82 in order to ensure visible light transmittance.
  • the first dielectric layer 81 has a bismuth oxide (Bi 2 O 3 ) content of the second dielectric layer 82 in order to suppress the reaction of the metal bus electrodes 4b and 5b with silver (Ag). More than the content of (Bi 2 O 3 ), the content is 20 wt% to 40 wt%. Therefore, since the visible light transmittance of the first dielectric layer 81 is lower than the visible light transmittance of the second dielectric layer 82, the film thickness of the first dielectric layer 81 is set to the film thickness of the second dielectric layer 82. It is thinner.
  • the second dielectric layer 82 is less likely to be colored when the content of bismuth oxide (Bi 2 O 3 ) is 11 wt% or less, but bubbles are likely to be generated in the second dielectric layer 82. Therefore, it is not preferable. On the other hand, if the content exceeds 40% by weight, coloration tends to occur, and the transmittance decreases.
  • the thickness of the dielectric layer 8 is set to 41 ⁇ m or less, the first dielectric layer 81 is set to 5 ⁇ m to 15 ⁇ m, and the second dielectric layer 82 is set to 20 ⁇ m to 36 ⁇ m. Yes.
  • the PDP manufactured in this manner has little coloring phenomenon (yellowing) of the front glass substrate 3 even when a silver (Ag) material is used for the display electrode 6, and bubbles are generated in the dielectric layer 8.
  • the dielectric layer 8 having excellent withstand voltage performance can be realized.
  • the protective layer 9 includes a base film 91 formed on the dielectric layer 8 and magnesium oxide (MgO) crystal particles 92 a deposited on the base film 91. A plurality of aggregated particles 92 are formed.
  • MgO magnesium oxide
  • the base film 91 is formed of a metal oxide made of at least two oxides selected from magnesium oxide (MgO), calcium oxide (CaO), strontium oxide (SrO), and barium oxide (BaO),
  • MgO magnesium oxide
  • CaO calcium oxide
  • SrO strontium oxide
  • BaO barium oxide
  • FIG. 4 is a diagram showing an X-ray diffraction result on the surface of the base film 91 of the PDP in one embodiment.
  • FIG. 4 also shows the results of X-ray diffraction analysis of magnesium oxide (MgO) alone, calcium oxide (CaO) alone, strontium oxide (SrO) alone, and barium oxide (BaO) alone.
  • MgO magnesium oxide
  • CaO calcium oxide
  • SrO strontium oxide
  • BaO barium oxide
  • the horizontal axis represents the Bragg diffraction angle (2 ⁇ ), and the vertical axis represents the intensity of the X-ray diffraction wave.
  • the unit of the diffraction angle is shown in degrees when one round is 360 degrees, and the intensity is shown in an arbitrary unit (arbitrary unit).
  • the crystal orientation plane which is a specific orientation plane is shown in parentheses. As shown in FIG. 4, with respect to the crystal orientation plane (111), the diffraction angle is 32.2 degrees for calcium oxide (CaO) alone, the diffraction angle is 36.9 degrees for magnesium oxide (MgO) alone, and the diffraction angle for strontium oxide alone. It can be seen that 30.0 degrees and barium oxide alone has a peak at a diffraction angle of 27.9 degrees.
  • PDP 1 in the present embodiment at least two or more oxides selected from magnesium oxide (MgO), calcium oxide (CaO), strontium oxide (SrO), and barium oxide (BaO) are used as base film 91 of protective layer 9. It is made of a metal oxide made of a material.
  • MgO magnesium oxide
  • CaO calcium oxide
  • SrO strontium oxide
  • BaO barium oxide
  • FIG. 4 shows the X-ray diffraction results when the single component constituting the base film 91 is two components. That is, the X-ray diffraction result of the base film 91 formed using magnesium oxide (MgO) and calcium oxide (CaO) alone was formed using point A, magnesium oxide (MgO) and strontium oxide (SrO) alone. The X-ray diffraction result of the base film 91 is indicated by B point, and further, the X-ray diffraction result of the base film 91 formed using magnesium oxide (MgO) and barium oxide (BaO) alone is indicated by C point.
  • MgO magnesium oxide
  • CaO calcium oxide
  • SrO strontium oxide
  • the point A is a diffraction angle of 36.9 degrees of the magnesium oxide (MgO) alone, which is the maximum diffraction angle of the single oxide, in the crystal orientation plane (111) as the specific orientation plane, and the oxidation which is the minimum diffraction angle.
  • MgO magnesium oxide
  • a peak exists at a diffraction angle of 36.1 degrees, which is between the diffraction angle of 32.2 degrees of calcium (CaO) alone.
  • peaks at points B and C exist at 35.7 degrees and 35.4 degrees between the maximum diffraction angle and the minimum diffraction angle, respectively.
  • FIG. 5 shows the X-ray diffraction result when the single component constituting the base film 91 is three or more components, as in FIG. That is, FIG. 5 shows the results when magnesium oxide (MgO), calcium oxide (CaO), and strontium oxide (SrO) are used as the single component, point D, magnesium oxide (MgO), calcium oxide (CaO), and barium oxide.
  • the results when (BaO) is used are indicated by point E, and the results when calcium oxide (CaO), strontium oxide (SrO) and barium oxide (BaO) are used are indicated by point F.
  • the point D is a crystal orientation plane (111) as a specific orientation plane, and a diffraction angle of 36.9 degrees of magnesium oxide (MgO) as a maximum diffraction angle of a single oxide and an oxidation level as a minimum diffraction angle.
  • MgO magnesium oxide
  • a peak exists at a diffraction angle of 33.4 degrees, which is between the diffraction angle of 30.0 degrees of strontium (SrO) alone.
  • peaks at points E and F exist at 32.8 degrees and 30.2 degrees between the maximum diffraction angle and the minimum diffraction angle, respectively.
  • the base film 91 of the PDP 1 has a specific orientation in the X-ray diffraction analysis of the surface of the base film 91 of the metal oxide constituting the base film 91, whether it is a single component or two components.
  • a peak exists between the minimum diffraction angle and the maximum diffraction angle of a peak generated from a single oxide constituting the surface metal oxide.
  • (111) has been described as the crystal orientation plane as the specific orientation plane, but the peak position of the metal oxide is the same as described above even when other crystal orientation planes are targeted.
  • the depth from the vacuum level of calcium oxide (CaO), strontium oxide (SrO), and barium oxide (BaO) exists in a shallow region as compared with magnesium oxide (MgO). Therefore, when the PDP 1 is driven, when electrons existing in the energy levels of calcium oxide (CaO), strontium oxide (SrO), and barium oxide (BaO) transition to the ground state of the xenon (Xe) ion, Auger It is considered that the number of electrons emitted due to the effect increases as compared with the case of transition from the energy level of magnesium oxide (MgO).
  • the base film 91 in the present embodiment is configured such that a peak exists between the minimum diffraction angle and the maximum diffraction angle of the peak generated from a single oxide constituting the metal oxide. Yes.
  • the metal oxide having the characteristics shown in FIGS. 4 and 5 has its energy level between the single oxides constituting them. Accordingly, the energy level of the base film 91 is also present between the single oxides, and the amount of energy acquired by other electrons due to the Auger effect can be set to an amount sufficient to be released beyond the vacuum level. .
  • the base film 91 can exhibit better secondary electron emission characteristics compared to magnesium oxide (MgO) alone, and as a result, the discharge sustaining voltage can be reduced. Therefore, particularly when the partial pressure of xenon (Xe) as the discharge gas is increased in order to increase the luminance, it becomes possible to reduce the discharge voltage and realize a low-voltage and high-luminance PDP1.
  • Xe xenon
  • sample A underlying film 91 is a metal oxide of magnesium oxide (MgO) and calcium oxide (CaO)
  • sample B underlying film 91 is magnesium oxide (MgO) and strontium oxide (SrO).
  • Sample C (the base film 91 is a metal oxide of magnesium oxide (MgO) and barium oxide (BaO))
  • sample D (the base film 91 is magnesium oxide (MgO), calcium oxide (CaO)) And metal oxide by strontium oxide (SrO))
  • sample E (underlying film 91 is a metal oxide by magnesium oxide (MgO), calcium oxide (CaO) and barium oxide (BaO)), and as a comparative example, Prepared the base film 91 composed of magnesium oxide (MgO) alone It was.
  • sample A is 90
  • sample B is 87
  • sample C is 85
  • sample D is 81
  • sample E is 82. The value is shown.
  • the discharge sustaining voltage can be reduced by about 10% to 20% in all of the samples A, B, C, D, and E compared to the comparative example. Therefore, the discharge start voltage can be set within the normal operation range, and a high-luminance and low-voltage drive PDP 1 can be realized.
  • Calcium oxide (CaO), strontium oxide (SrO), and barium oxide (BaO) are highly reactive as a single substance, and thus easily react with impurities, and as a result, the electron emission performance tends to decrease.
  • the structure of the material reduces the reactivity, and is formed with a crystal structure with few impurities and oxygen vacancies. Therefore, it is possible to suppress excessive emission of electrons when the PDP 1 is driven.
  • the effect of moderate charge retention characteristics is also exhibited. This charge retention characteristic is particularly effective for retaining wall charges stored during the initialization period and preventing write defects during the write period to perform reliable write discharge.
  • the agglomerated particles 92 formed on the base film 91 in the present embodiment and agglomerated a plurality of magnesium oxide (MgO) crystal particles 92a will be described in detail.
  • Aggregated particles 92 of magnesium oxide (MgO) have been confirmed by the inventor's experiments mainly to suppress the “discharge delay” in the write discharge and to improve the temperature dependence of the “discharge delay”. . Therefore, in the embodiment of the present invention, the aggregated particles 92 are arranged as an initial electron supply unit required at the time of rising of the discharge pulse by utilizing the property that the advanced initial electron emission characteristics are superior to the base film 91.
  • the “discharge delay” is considered to be mainly caused by a shortage of the amount of initial electrons that are triggered from the surface of the base film 91 being discharged into the discharge space 16 at the start of discharge. Therefore, in order to contribute to the stable supply of initial electrons to the discharge space 16, the aggregated particles 92 of magnesium oxide (MgO) are dispersedly arranged on the surface of the base film 91. As a result, abundant electrons are present in the discharge space 16 at the rise of the discharge pulse, and the discharge delay can be eliminated. Therefore, such initial electron emission characteristics enable high-speed driving with good discharge response even when the PDP 1 has a high definition.
  • MgO magnesium oxide
  • the metal oxide aggregated particles 92 are disposed on the surface of the base film 91, in addition to the effect of mainly suppressing the “discharge delay” in the write discharge, the effect of improving the temperature dependency of the “discharge delay” is also achieved. can get.
  • the PDP 1 includes the base film 91 that achieves both the low voltage driving and the charge retention effect, and the magnesium oxide (MgO) aggregated particles 92 that have the effect of preventing discharge delay.
  • MgO magnesium oxide
  • the aggregated particles 92 in which several crystal particles 92a are aggregated are discretely dispersed on the base film 91, and a plurality of particles are adhered so as to be distributed almost uniformly over the entire surface.
  • FIG. 6 is an enlarged view for explaining the agglomerated particles 92.
  • the agglomerated particles 92 are those in which crystal particles 92a having a predetermined primary particle size are aggregated or necked as shown in FIG. In other words, it is not bonded as a solid with a large bonding force, but a plurality of primary particles form an aggregate body due to static electricity, van der Waals force, etc., and due to external stimuli such as ultrasound , Part or all of them are bonded to such a degree that they become primary particles.
  • the particle size of the agglomerated particles 92 is about 1 ⁇ m, and the crystal particles 92a preferably have a polyhedral shape having seven or more surfaces such as a tetrahedron and a dodecahedron.
  • the particle size of the primary particles of the crystal particles 92a can be controlled by the generation conditions of the crystal particles 92a.
  • the particle size can be controlled by controlling the calcining temperature and the calcining atmosphere.
  • the firing temperature can be selected in the range of 700 ° C. to 1500 ° C., but by setting the firing temperature to a relatively high 1000 ° C. or higher, the particle size can be controlled to about 0.3 to 2 ⁇ m. is there.
  • the crystal particles 92a by heating the MgO precursor, a plurality of primary particles are bonded to each other by a phenomenon called agglomeration or necking in the production process, whereby the agglomerated particles 92 can be obtained.
  • FIG. 7 is a diagram showing the relationship between the discharge delay of the PDP and the calcium (Ca) concentration in the protective layer in the present embodiment.
  • the discharge delay and the calcium (Ca) concentration in the protective layer 9 when using the base film 91 composed of a metal oxide of magnesium oxide (MgO) and calcium oxide (CaO) Shows the relationship.
  • the base film 91 is composed of a metal oxide composed of magnesium oxide (MgO) and calcium oxide (CaO), and the metal oxide has a magnesium oxide (MgO) peak in the X-ray diffraction analysis on the surface of the base film 91.
  • FIG. 7 shows the case where only the base film 91 is used as the protective layer 9 and the case where the aggregated particles 92 are arranged on the base film 91, and the discharge delay is caused by calcium (Ca) contained in the base film 91. The case where it is not done is shown as a standard.
  • the electron emission performance is a numerical value indicating that the larger the electron emission performance is, the more electron emission performance is expressed by the initial electron emission amount determined by the surface state, the gas type and its state.
  • the initial electron emission amount can be measured by a method of measuring the amount of electron current emitted from the surface by irradiating the surface with ions or an electron beam.
  • the evaluation of the surface of the front plate 2 of the PDP 1 can be performed nondestructively. With difficulty. Therefore, the method described in JP 2007-48733 A was used.
  • a numerical value called a statistical delay time which is a measure of the likelihood of occurrence of discharge, is measured, and when the reciprocal is integrated, a numerical value corresponding to the initial electron emission amount is obtained.
  • the delay time at the time of discharge means the time of discharge delay when the discharge is delayed from the rising edge of the pulse, and the discharge delay is the time when the initial electrons that trigger when the discharge is started are discharged from the surface of the protective layer 9 to the discharge space. 16 is considered to be a major factor that is difficult to release.
  • the discharge delay increases as the calcium (Ca) concentration increases in the case of the base film 91 alone.
  • the discharge delay can be significantly reduced, and the discharge delay hardly increases even when the calcium (Ca) concentration is increased.
  • Prototype 1 is a PDP 1 in which a protective layer 9 made only of a magnesium oxide (MgO) base film 91 is formed.
  • Prototype 2 is a protective layer 9 made only of a base film 91 in which impurities such as Al and Si are doped in magnesium oxide (MgO).
  • the prototype 3 is a PDP 1 in which a protective layer 9 is formed by spraying and adhering only primary particles of magnesium oxide (MgO) crystal particles 92a on a base film 91 made of magnesium oxide (MgO).
  • the prototype 4 is the PDP 1 in the present embodiment, and the above-described sample A is used as the protective layer 9.
  • the protective layer 9 includes a base film 91 made of a metal oxide of magnesium oxide (MgO) and calcium oxide (CaO), and aggregated particles 92 obtained by aggregating crystal particles 92a on the base film 91 over the entire surface. So that it is distributed almost uniformly.
  • the base film 91 is set so that a peak exists between the minimum diffraction angle and the maximum diffraction angle of a peak generated from a single oxide constituting the base film 91. ing.
  • the minimum diffraction angle in this case is 32.2 degrees for calcium oxide (CaO)
  • the maximum diffraction angle is 36.9 degrees for magnesium oxide (MgO)
  • the peak of the diffraction angle of the base film 91 is 36.1 degrees.
  • an element having a withstand voltage of about 150 V is used as a semiconductor switching element such as a MOSFET for sequentially applying a scanning voltage to the panel, and the Vscn lighting voltage is 120 V or less in consideration of variation due to temperature. It is desirable to keep it at a minimum.
  • FIG. 8 is a diagram showing the results of examining the electron emission performance and lighting voltage of the PDP in the present embodiment.
  • prototype 4 in which aggregated particles 92 obtained by aggregating single crystal particles 92a of magnesium oxide (MgO) are dispersed on base film 91 in the present embodiment and uniformly distributed over the entire surface.
  • the Vscn lighting voltage can be reduced to 120 V or less, and the electron emission performance is much better than that of the prototype 1 in the case of a protective layer made only of magnesium oxide (MgO). Obtainable.
  • the electron emission capability and the charge retention capability of the protective layer of PDP 1 are contradictory.
  • the Vscn lighting voltage also increases.
  • the electron emission capability is more than eight times that of the prototype 1 using the protective layer of only magnesium oxide (MgO).
  • MgO magnesium oxide
  • the particle size of the crystal particles 92a used for the protective layer 9 of the PDP 1 in the present embodiment will be described in detail.
  • the particle diameter means an average particle diameter
  • the average particle diameter means a volume cumulative average diameter (D50).
  • FIG. 9 is a characteristic diagram showing the relationship between the particle size of the crystal particles used in the PDP and the electron emission characteristics in one embodiment. Specifically, the experimental results of examining the electron emission performance by changing the particle size of the crystal particles 92a in the prototype 4 in the present embodiment described with reference to FIG. 8 are shown. In FIG. 9, the particle diameter of the crystal particle 92 a was measured by observing the crystal particle 92 a with an SEM. As shown in FIG. 9, it can be seen that when the particle size is reduced to about 0.3 ⁇ m, the electron emission performance is lowered, and when it is approximately 0.9 ⁇ m or more, high electron emission performance is obtained.
  • the number of crystal particles 92a per unit area on the base film 91 is larger.
  • the protective layer 9 of the front plate 2 is observed.
  • the crystal particles 92a are present in the portion corresponding to the top of the partition wall 14 of the back plate 10 that is in close contact with the substrate, and the top of the partition wall 14 is damaged, and the material is placed on the phosphor layer 15. It has been found that a phenomenon occurs in which a cell that is normally turned on and off does not occur.
  • the phenomenon of the partition wall breakage is unlikely to occur unless the crystal particles 92a are present at the portion corresponding to the top of the partition wall 14, and therefore, the probability of breakage of the partition wall 14 increases as the number of attached crystal particles 92a increases. . From this point of view, when the crystal particle diameter is increased to about 2.5 ⁇ m, the probability of partition wall breakage increases rapidly, and when the crystal particle diameter is smaller than 2.5 ⁇ m, the probability of partition wall breakage is kept relatively small. be able to.
  • the aggregated particles 92 having a particle size in the range of 0.9 ⁇ m to 2 ⁇ m are used as the aggregated particles 92, the above-described effects of the present invention can be stably obtained.
  • grains as a crystal particle
  • the particle type is not limited to magnesium oxide (MgO).
  • the protective layer 9 is formed of a metal oxide selected from magnesium oxide, calcium oxide, strontium oxide, and barium oxide having the above-described characteristics, the discharge start voltage of the panel is lowered. Therefore, the discharge delay can be reduced and the discharge can be stabilized.
  • these materials are highly reactive with impurity gases such as water and carbon dioxide, and in particular, the discharge characteristics are likely to deteriorate due to reaction with water and carbon dioxide, resulting in variations in the discharge characteristics of each discharge cell. Cheap.
  • the inside of the discharge space 16 is in a positive pressure state through the through hole 22 that opens in the discharge space 16 provided in the back plate 10 that is the second substrate. It is decided to carry out while flowing dry gas so that.
  • the flow rate of this dry gas is desirably a sufficient amount to replace the inside of the panel, but due to warping of the substrate, adhesion of foreign matter, etc., the amount of flow into the panel varies even when the same flow rate is applied.
  • the conductance of the gas inflow path for each panel is inspected in advance, and the flow rate of the dry gas is substantially adjusted by adjusting the flow rate of the dry gas based on this result. Is made smaller.
  • the manufacturing method according to the present embodiment will be described in more detail with reference to FIGS.
  • FIG. 10 is a schematic diagram illustrating an example of a sealing device used in one embodiment.
  • ten panels P01 to P10 can be mounted at a time.
  • a glass tube 21 with a glass frit for sealing is installed corresponding to the position of the through-hole 22 so that gas can flow into the panel through the through-hole 22 provided in the back plate 10. (FIG. 13).
  • a constant flow rate for example, 500 ccm
  • dry gas for example, nitrogen gas
  • FIG. 11 shows the results obtained by this inspection process. It can be seen from the variation in conductance between the 10 panels that the flow rate flowing through the panels substantially decreases and varies. Therefore, by controlling the overall flow rate so that a predetermined flow rate flows in the panel based on the result obtained in the inspection step, it is possible to suppress variations in the substantial flow rate flowing in the panel in the gas flow step. It becomes possible.
  • the flow control of the dry gas is not performed all over the panel, but in the inspection process, a permutation is applied from the panel having a small conductance (a gas leak is large).
  • Each of the two panels was divided into five to control the flow rate.
  • FIG. 12 shows results obtained by dividing the test results shown in FIG. 11 into five groups. It can be seen that the gas flow rate in the panel can be controlled almost uniformly.
  • the sealing process includes a dry gas so that the inside of the discharge space 16 is in a positive pressure state through the inspection process for inspecting the conductance of each panel and the through hole 22 provided in the back plate 10.
  • the flow rate of dry gas in the gas flow process is controlled based on the results of the conductance inspection process, so that the discharge characteristics do not deteriorate and variations in the panel discharge characteristics are suppressed.
  • a panel having a protective film with excellent discharge characteristics can be manufactured.
  • the conductance inspection step in the sealing step introduces gas into the internal space between the front plate 2 as the first substrate and the back plate 10 as the second substrate, and the pressure difference before and after the introduction.
  • the conductance was inspected by measuring, it is possible to inspect by another method.
  • the gap dimension can be known and the conductance can be calculated.
  • the panel is divided into a plurality of groups according to the conductance size based on the result of the conductance inspection process in the gas flow process, and the flow rate is controlled for each group.
  • the number of divisions increases, it is possible to suppress variation and increase uniformity.
  • the gas flow process takes a long time. For this reason, the number of divisions may be set according to the degree of variation and the required accuracy.
  • the gas flow timing is shifted by a maximum of 40 minutes in the case of dividing into 5 groups, but the shift is 4 by repeating 10 times every minute. Can be shortened to minutes.
  • the gas introduced into the sealing step is nitrogen gas.
  • a group consisting of rare gas and dry air in addition to nitrogen gas may be used. These may be used by selecting suitable conditions according to the material of the protective film and the sealing exhaust conditions.
  • the protective layer 9 is formed of a metal oxide composed of at least two oxide films selected from magnesium oxide, calcium oxide, strontium oxide, and barium oxide is exemplified, it is disclosed in JP-A-2004-47193. It is also effective to use lanthanoid oxides such as lanthanum oxide and cerium oxide as the protective layer 9.
  • the protective layer 9 obtained by applying and drying a paste containing fine metal oxide particles on the front plate 2 is also effective.
  • the present invention is useful for realizing a PDP having high image quality display performance and low power consumption.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Gas-Filled Discharge Tubes (AREA)

Abstract

La présente invention a trait à un procédé de production d'un écran plasma doté d'une couche de protection (9) d'une plaque avant (2) qui est constituée d'un oxyde métallique contenant au moins deux oxydes sélectionnés dans le groupe comprenant l'oxyde de magnésium, l'oxyde de calcium, l'oxyde de strontium et l'oxyde de baryum, et dont l'oxyde métallique, dans le cadre d'une analyse par diffraction des rayons X, a un pic présent entre l'angle de diffraction minimum et l'angle de diffraction maximum qui sont attribuables aux oxydes individuels qui constituent des plans à orientation spécifique de l'oxyde métallique. Le procédé comprend une étape de scellement qui comprend : une étape de contrôle au cours de laquelle la conductance de chaque panneau est examinée ; et une étape d'écoulement de gaz au cours de laquelle un gaz sec est introduit à travers un trou traversant formé dans une plaque arrière (10), de sorte qu'un espace de décharge (16) se trouve dans un état de pression positive. Au cours de l'étape d'écoulement de gaz, le débit du gaz sec est contrôlé en fonction des résultats obtenus lors de l'étape de contrôle de la conductance.
PCT/JP2011/001200 2010-03-02 2011-03-02 Procédé de production d'un écran plasma WO2011108260A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010045140 2010-03-02
JP2010-045140 2010-03-02

Publications (1)

Publication Number Publication Date
WO2011108260A1 true WO2011108260A1 (fr) 2011-09-09

Family

ID=44541930

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2011/001200 WO2011108260A1 (fr) 2010-03-02 2011-03-02 Procédé de production d'un écran plasma

Country Status (1)

Country Link
WO (1) WO2011108260A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11285628A (ja) * 1998-04-02 1999-10-19 Matsushita Electric Ind Co Ltd ガス混合装置及びガス放電パネルの製造方法
JP2003141996A (ja) * 2001-11-07 2003-05-16 Matsushita Electric Ind Co Ltd プラズマディスプレイパネルの製造方法
JP2005259666A (ja) * 2004-03-15 2005-09-22 Pioneer Electronic Corp 排気処理装置および表示パネルの製造方法
WO2009044456A1 (fr) * 2007-10-02 2009-04-09 Hitachi, Ltd. Panneau d'affichage à plasma, son procédé de fabrication et particules fines à décharge stabilisée
JP2010027389A (ja) * 2008-07-18 2010-02-04 Panasonic Corp プラズマディスプレイパネルの製造方法
JP2010080388A (ja) * 2008-09-29 2010-04-08 Panasonic Corp プラズマディスプレイパネル

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11285628A (ja) * 1998-04-02 1999-10-19 Matsushita Electric Ind Co Ltd ガス混合装置及びガス放電パネルの製造方法
JP2003141996A (ja) * 2001-11-07 2003-05-16 Matsushita Electric Ind Co Ltd プラズマディスプレイパネルの製造方法
JP2005259666A (ja) * 2004-03-15 2005-09-22 Pioneer Electronic Corp 排気処理装置および表示パネルの製造方法
WO2009044456A1 (fr) * 2007-10-02 2009-04-09 Hitachi, Ltd. Panneau d'affichage à plasma, son procédé de fabrication et particules fines à décharge stabilisée
JP2010027389A (ja) * 2008-07-18 2010-02-04 Panasonic Corp プラズマディスプレイパネルの製造方法
JP2010080388A (ja) * 2008-09-29 2010-04-08 Panasonic Corp プラズマディスプレイパネル

Similar Documents

Publication Publication Date Title
WO2010035488A1 (fr) Ecran plasma
WO2009113256A1 (fr) Panneau d'affichage à plasma
WO2010035493A1 (fr) Ecran plasma
WO2010070861A1 (fr) Panneau d'affichage à plasma
WO2010035487A1 (fr) Panneau d’affichage à plasma
JP2010192356A (ja) プラズマディスプレイパネルの製造方法
JP2010192358A (ja) プラズマディスプレイパネルの製造方法
WO2011108260A1 (fr) Procédé de production d'un écran plasma
JP2010192355A (ja) プラズマディスプレイパネルの製造方法
JP5126451B2 (ja) プラズマディスプレイパネル
US8183777B2 (en) Low power consumption plasma display panel
JP2011181317A (ja) プラズマディスプレイ装置
WO2011114662A1 (fr) Panneau d'affichage à plasma
WO2011102145A1 (fr) Procédé de fabrication de panneau d'affichage plasma
WO2010070848A1 (fr) Écran à plasma
JP2011181371A (ja) プラズマディスプレイパネルの製造方法
JP2010192357A (ja) プラズマディスプレイパネルの製造方法
JP2011204537A (ja) プラズマディスプレイパネルの製造方法
JP2011204536A (ja) プラズマディスプレイパネルの製造方法
JP2011192573A (ja) プラズマディスプレイパネル
JP2010182559A (ja) プラズマディスプレイパネルの製造方法
JP2011180333A (ja) プラズマディスプレイ装置
JP2011192571A (ja) プラズマディスプレイパネル
JP2011181318A (ja) プラズマディスプレイパネル
JP2011198481A (ja) プラズマディスプレイパネル

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11750373

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 11750373

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP