WO2011105873A3 - 펄스 플라즈마의 dc 파워 인가에 따른 동기화 제어 방법 - Google Patents
펄스 플라즈마의 dc 파워 인가에 따른 동기화 제어 방법 Download PDFInfo
- Publication number
- WO2011105873A3 WO2011105873A3 PCT/KR2011/001400 KR2011001400W WO2011105873A3 WO 2011105873 A3 WO2011105873 A3 WO 2011105873A3 KR 2011001400 W KR2011001400 W KR 2011001400W WO 2011105873 A3 WO2011105873 A3 WO 2011105873A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- power
- applying
- controlling synchronization
- pulse plasma
- pulse
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32137—Radio frequency generated discharge controlling of the discharge by modulation of energy
- H01J37/32146—Amplitude modulation, includes pulsing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32697—Electrostatic control
- H01J37/32706—Polarising the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/01—Manufacture or treatment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
- Mram Or Spin Memory Techniques (AREA)
- Hall/Mr Elements (AREA)
- Plasma Technology (AREA)
Abstract
펄스 플라즈마의 DC 파워 인가에 따른 동기화 제어 방법이 개시된다. 본 발명에 의한 펄스 플라즈마의 DC 파워 인가에 따른 동기화 제어 방법은 RF 펄스 파워의 온/오프 주기에 맞추어 DC 파워를 마이너스(-) 파워 주기 및 플러스(+) 파워 주기가 조절되도록 인가함으로써 각 공정에 적합한 플라즈마를 형성하여 공정 효율을 극대화할 수 있다.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/594,452 US20130049592A1 (en) | 2010-02-26 | 2012-08-24 | Method for controlling synchronization of pulsed plasma by applying dc power |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100017680A KR101214758B1 (ko) | 2010-02-26 | 2010-02-26 | 식각 방법 |
KR10-2010-0017680 | 2010-02-26 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/594,452 Continuation US20130049592A1 (en) | 2010-02-26 | 2012-08-24 | Method for controlling synchronization of pulsed plasma by applying dc power |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2011105873A2 WO2011105873A2 (ko) | 2011-09-01 |
WO2011105873A3 true WO2011105873A3 (ko) | 2012-01-12 |
Family
ID=44507477
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2011/001400 WO2011105873A2 (ko) | 2010-02-26 | 2011-02-28 | 펄스 플라즈마의 dc 파워 인가에 따른 동기화 제어 방법 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20130049592A1 (ko) |
KR (1) | KR101214758B1 (ko) |
WO (1) | WO2011105873A2 (ko) |
Families Citing this family (73)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9132436B2 (en) | 2012-09-21 | 2015-09-15 | Applied Materials, Inc. | Chemical control features in wafer process equipment |
US8916056B2 (en) * | 2012-10-11 | 2014-12-23 | Varian Semiconductor Equipment Associates, Inc. | Biasing system for a plasma processing apparatus |
US10256079B2 (en) | 2013-02-08 | 2019-04-09 | Applied Materials, Inc. | Semiconductor processing systems having multiple plasma configurations |
US9362130B2 (en) | 2013-03-01 | 2016-06-07 | Applied Materials, Inc. | Enhanced etching processes using remote plasma sources |
US9309598B2 (en) | 2014-05-28 | 2016-04-12 | Applied Materials, Inc. | Oxide and metal removal |
US9355922B2 (en) | 2014-10-14 | 2016-05-31 | Applied Materials, Inc. | Systems and methods for internal surface conditioning in plasma processing equipment |
US9966240B2 (en) | 2014-10-14 | 2018-05-08 | Applied Materials, Inc. | Systems and methods for internal surface conditioning assessment in plasma processing equipment |
US11637002B2 (en) | 2014-11-26 | 2023-04-25 | Applied Materials, Inc. | Methods and systems to enhance process uniformity |
US10573496B2 (en) | 2014-12-09 | 2020-02-25 | Applied Materials, Inc. | Direct outlet toroidal plasma source |
US9728437B2 (en) | 2015-02-03 | 2017-08-08 | Applied Materials, Inc. | High temperature chuck for plasma processing systems |
US20160225652A1 (en) | 2015-02-03 | 2016-08-04 | Applied Materials, Inc. | Low temperature chuck for plasma processing systems |
KR102354460B1 (ko) * | 2015-02-12 | 2022-01-24 | 삼성전자주식회사 | 반도체 소자 및 그 제조 방법 |
US9691645B2 (en) | 2015-08-06 | 2017-06-27 | Applied Materials, Inc. | Bolted wafer chuck thermal management systems and methods for wafer processing systems |
US9741593B2 (en) | 2015-08-06 | 2017-08-22 | Applied Materials, Inc. | Thermal management systems and methods for wafer processing systems |
US9349605B1 (en) | 2015-08-07 | 2016-05-24 | Applied Materials, Inc. | Oxide etch selectivity systems and methods |
US10504700B2 (en) | 2015-08-27 | 2019-12-10 | Applied Materials, Inc. | Plasma etching systems and methods with secondary plasma injection |
JP2017098323A (ja) * | 2015-11-19 | 2017-06-01 | 東京エレクトロン株式会社 | プラズマエッチング方法 |
KR101800321B1 (ko) * | 2016-04-18 | 2017-11-22 | 최상준 | 건식 에칭장치 |
US10522371B2 (en) | 2016-05-19 | 2019-12-31 | Applied Materials, Inc. | Systems and methods for improved semiconductor etching and component protection |
US10504754B2 (en) | 2016-05-19 | 2019-12-10 | Applied Materials, Inc. | Systems and methods for improved semiconductor etching and component protection |
US9865484B1 (en) * | 2016-06-29 | 2018-01-09 | Applied Materials, Inc. | Selective etch using material modification and RF pulsing |
US10629473B2 (en) | 2016-09-09 | 2020-04-21 | Applied Materials, Inc. | Footing removal for nitride spacer |
US10546729B2 (en) | 2016-10-04 | 2020-01-28 | Applied Materials, Inc. | Dual-channel showerhead with improved profile |
US9934942B1 (en) | 2016-10-04 | 2018-04-03 | Applied Materials, Inc. | Chamber with flow-through source |
KR102553253B1 (ko) * | 2016-11-10 | 2023-07-06 | 삼성전자주식회사 | 펄스 플라즈마 분석 장치 및 그 분석 방법 |
US10163696B2 (en) | 2016-11-11 | 2018-12-25 | Applied Materials, Inc. | Selective cobalt removal for bottom up gapfill |
US10026621B2 (en) | 2016-11-14 | 2018-07-17 | Applied Materials, Inc. | SiN spacer profile patterning |
US10566206B2 (en) | 2016-12-27 | 2020-02-18 | Applied Materials, Inc. | Systems and methods for anisotropic material breakthrough |
US10431429B2 (en) | 2017-02-03 | 2019-10-01 | Applied Materials, Inc. | Systems and methods for radial and azimuthal control of plasma uniformity |
US10319739B2 (en) | 2017-02-08 | 2019-06-11 | Applied Materials, Inc. | Accommodating imperfectly aligned memory holes |
US10943834B2 (en) | 2017-03-13 | 2021-03-09 | Applied Materials, Inc. | Replacement contact process |
US11276590B2 (en) | 2017-05-17 | 2022-03-15 | Applied Materials, Inc. | Multi-zone semiconductor substrate supports |
US11276559B2 (en) | 2017-05-17 | 2022-03-15 | Applied Materials, Inc. | Semiconductor processing chamber for multiple precursor flow |
US10497579B2 (en) | 2017-05-31 | 2019-12-03 | Applied Materials, Inc. | Water-free etching methods |
US10920320B2 (en) | 2017-06-16 | 2021-02-16 | Applied Materials, Inc. | Plasma health determination in semiconductor substrate processing reactors |
US10541246B2 (en) | 2017-06-26 | 2020-01-21 | Applied Materials, Inc. | 3D flash memory cells which discourage cross-cell electrical tunneling |
KR102475069B1 (ko) | 2017-06-30 | 2022-12-06 | 삼성전자주식회사 | 반도체 제조 장치, 이의 동작 방법 |
US10727080B2 (en) | 2017-07-07 | 2020-07-28 | Applied Materials, Inc. | Tantalum-containing material removal |
US10541184B2 (en) | 2017-07-11 | 2020-01-21 | Applied Materials, Inc. | Optical emission spectroscopic techniques for monitoring etching |
US10043674B1 (en) | 2017-08-04 | 2018-08-07 | Applied Materials, Inc. | Germanium etching systems and methods |
US10297458B2 (en) | 2017-08-07 | 2019-05-21 | Applied Materials, Inc. | Process window widening using coated parts in plasma etch processes |
JP7302060B2 (ja) * | 2017-08-18 | 2023-07-03 | 東京エレクトロン株式会社 | クリーニング方法及びプラズマ処理装置 |
US10903054B2 (en) | 2017-12-19 | 2021-01-26 | Applied Materials, Inc. | Multi-zone gas distribution systems and methods |
US11328909B2 (en) | 2017-12-22 | 2022-05-10 | Applied Materials, Inc. | Chamber conditioning and removal processes |
US10854426B2 (en) | 2018-01-08 | 2020-12-01 | Applied Materials, Inc. | Metal recess for semiconductor structures |
US10964512B2 (en) | 2018-02-15 | 2021-03-30 | Applied Materials, Inc. | Semiconductor processing chamber multistage mixing apparatus and methods |
US10679870B2 (en) | 2018-02-15 | 2020-06-09 | Applied Materials, Inc. | Semiconductor processing chamber multistage mixing apparatus |
TWI716818B (zh) | 2018-02-28 | 2021-01-21 | 美商應用材料股份有限公司 | 形成氣隙的系統及方法 |
US10593560B2 (en) | 2018-03-01 | 2020-03-17 | Applied Materials, Inc. | Magnetic induction plasma source for semiconductor processes and equipment |
US10319600B1 (en) | 2018-03-12 | 2019-06-11 | Applied Materials, Inc. | Thermal silicon etch |
US10497573B2 (en) | 2018-03-13 | 2019-12-03 | Applied Materials, Inc. | Selective atomic layer etching of semiconductor materials |
US10573527B2 (en) | 2018-04-06 | 2020-02-25 | Applied Materials, Inc. | Gas-phase selective etching systems and methods |
US10490406B2 (en) | 2018-04-10 | 2019-11-26 | Appled Materials, Inc. | Systems and methods for material breakthrough |
US10699879B2 (en) | 2018-04-17 | 2020-06-30 | Applied Materials, Inc. | Two piece electrode assembly with gap for plasma control |
US10886137B2 (en) | 2018-04-30 | 2021-01-05 | Applied Materials, Inc. | Selective nitride removal |
US10872778B2 (en) | 2018-07-06 | 2020-12-22 | Applied Materials, Inc. | Systems and methods utilizing solid-phase etchants |
US10755941B2 (en) | 2018-07-06 | 2020-08-25 | Applied Materials, Inc. | Self-limiting selective etching systems and methods |
US10672642B2 (en) | 2018-07-24 | 2020-06-02 | Applied Materials, Inc. | Systems and methods for pedestal configuration |
US10892198B2 (en) | 2018-09-14 | 2021-01-12 | Applied Materials, Inc. | Systems and methods for improved performance in semiconductor processing |
US11049755B2 (en) | 2018-09-14 | 2021-06-29 | Applied Materials, Inc. | Semiconductor substrate supports with embedded RF shield |
US11062887B2 (en) | 2018-09-17 | 2021-07-13 | Applied Materials, Inc. | High temperature RF heater pedestals |
US11417534B2 (en) | 2018-09-21 | 2022-08-16 | Applied Materials, Inc. | Selective material removal |
US11682560B2 (en) | 2018-10-11 | 2023-06-20 | Applied Materials, Inc. | Systems and methods for hafnium-containing film removal |
US11121002B2 (en) | 2018-10-24 | 2021-09-14 | Applied Materials, Inc. | Systems and methods for etching metals and metal derivatives |
JP7481823B2 (ja) * | 2018-11-05 | 2024-05-13 | 東京エレクトロン株式会社 | エッチング方法及びプラズマ処理装置 |
CN111146086B (zh) * | 2018-11-05 | 2024-05-03 | 东京毅力科创株式会社 | 蚀刻方法和等离子体处理装置 |
US11437242B2 (en) | 2018-11-27 | 2022-09-06 | Applied Materials, Inc. | Selective removal of silicon-containing materials |
US11721527B2 (en) | 2019-01-07 | 2023-08-08 | Applied Materials, Inc. | Processing chamber mixing systems |
US10920319B2 (en) | 2019-01-11 | 2021-02-16 | Applied Materials, Inc. | Ceramic showerheads with conductive electrodes |
JP7313929B2 (ja) * | 2019-06-26 | 2023-07-25 | 住友重機械工業株式会社 | 負イオン照射装置 |
JP7450455B2 (ja) * | 2020-05-13 | 2024-03-15 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
JP7433165B2 (ja) | 2020-08-11 | 2024-02-19 | 東京エレクトロン株式会社 | プラズマ処理装置及び給電方法 |
US20220399186A1 (en) * | 2021-06-09 | 2022-12-15 | Applied Materials, Inc. | Method and apparatus to reduce feature charging in plasma processing chamber |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20070022781A (ko) * | 2004-06-21 | 2007-02-27 | 동경 엘렉트론 주식회사 | 플라즈마 처리 장치 및 방법 |
KR100750420B1 (ko) * | 1999-08-17 | 2007-08-21 | 동경 엘렉트론 주식회사 | 플라즈마 보조 처리 실행 방법 및 플라즈마 보조 처리실행 리액터 |
KR20090084694A (ko) * | 2008-02-01 | 2009-08-05 | 가부시끼가이샤 도시바 | 기판의 플라즈마 처리장치 및 플라즈마 처리방법 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6794301B2 (en) * | 1995-10-13 | 2004-09-21 | Mattson Technology, Inc. | Pulsed plasma processing of semiconductor substrates |
JPH1079372A (ja) * | 1996-09-03 | 1998-03-24 | Matsushita Electric Ind Co Ltd | プラズマ処理方法及びプラズマ処理装置 |
US6472822B1 (en) * | 2000-04-28 | 2002-10-29 | Applied Materials, Inc. | Pulsed RF power delivery for plasma processing |
US7498586B2 (en) * | 2003-10-31 | 2009-03-03 | Saintech Pty, Ltd. | Ion source control system |
US7071009B2 (en) * | 2004-04-01 | 2006-07-04 | Headway Technologies, Inc. | MRAM arrays with reduced bit line resistance and method to make the same |
US7988816B2 (en) * | 2004-06-21 | 2011-08-02 | Tokyo Electron Limited | Plasma processing apparatus and method |
US7740737B2 (en) * | 2004-06-21 | 2010-06-22 | Tokyo Electron Limited | Plasma processing apparatus and method |
US8337661B2 (en) * | 2008-05-29 | 2012-12-25 | Applied Materials, Inc. | Plasma reactor with plasma load impedance tuning for engineered transients by synchronized modulation of an unmatched low power RF generator |
US8692467B2 (en) * | 2011-07-06 | 2014-04-08 | Lam Research Corporation | Synchronized and shortened master-slave RF pulsing in a plasma processing chamber |
-
2010
- 2010-02-26 KR KR1020100017680A patent/KR101214758B1/ko active IP Right Grant
-
2011
- 2011-02-28 WO PCT/KR2011/001400 patent/WO2011105873A2/ko active Application Filing
-
2012
- 2012-08-24 US US13/594,452 patent/US20130049592A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100750420B1 (ko) * | 1999-08-17 | 2007-08-21 | 동경 엘렉트론 주식회사 | 플라즈마 보조 처리 실행 방법 및 플라즈마 보조 처리실행 리액터 |
KR20070022781A (ko) * | 2004-06-21 | 2007-02-27 | 동경 엘렉트론 주식회사 | 플라즈마 처리 장치 및 방법 |
KR20090084694A (ko) * | 2008-02-01 | 2009-08-05 | 가부시끼가이샤 도시바 | 기판의 플라즈마 처리장치 및 플라즈마 처리방법 |
Also Published As
Publication number | Publication date |
---|---|
KR101214758B1 (ko) | 2012-12-21 |
KR20110098199A (ko) | 2011-09-01 |
US20130049592A1 (en) | 2013-02-28 |
WO2011105873A2 (ko) | 2011-09-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2011105873A3 (ko) | 펄스 플라즈마의 dc 파워 인가에 따른 동기화 제어 방법 | |
EP4014245A4 (en) | METHOD AND APPARATUS FOR IMPROVING SHEATH FORMATION, PULSE EVOLUTION AND STABILITY IN RF POWERED PLASMA APPLICATIONS | |
EP2678930A4 (en) | Ac/dc power conversion system and method of manufacture of same | |
WO2012156329A3 (en) | A switched mode power supply | |
NZ596549A (en) | Apparatus and method for processing biomass | |
MX2012013183A (es) | Metodos y sistemas para controlar la energia electrica suministrada a una carga de corriente continua. | |
EP3568961A4 (en) | SYSTEM AND METHOD FOR PROVIDING COMMUNICATIONS HAVING A REDUCED MAXIMUM POWER / AVERAGE POWER RATIO | |
WO2010109373A3 (en) | Method and apparatus for reduction of voltage potential spike during dechucking | |
WO2012110996A3 (en) | A method and apparatus for cosmetic skin treatment | |
EP2622704A4 (en) | POWER CONVERSION SYSTEM FOR ENERGY STORAGE SYSTEM AND CONTROL METHOD THEREOF | |
EP3629439A4 (en) | METHOD FOR CONTROLLING THE PHOTOVOLTAIC POWER GENERATION AND PHOTOVOLTAIC POWER GENERATION SYSTEM | |
WO2014018878A3 (en) | Solar thermochemical processing system and method | |
EP2585710A4 (en) | SYSTEM AND METHOD FOR GENERATING RENEWABLE ELECTRIC CURRENT BY WAVING ENERGY | |
WO2011159420A3 (en) | Power supply system and method with remote variable frequency drive (vfd) | |
EP2670553A1 (en) | Fume extractor for welding applications | |
EP3528379A4 (en) | METHOD FOR REDUCING POWER CONSUMPTION OF A POWER SUPPLY, POWER SUPPLY AUTOMATICALLY REDUCING POWER CONSUMPTION AND TELEVISION | |
EP2661805A4 (en) | Method and apparatus for resonant power conversion | |
EP2432117A4 (en) | ELECTRICITY CONTROL DEVICE AND METHOD FOR CONTROLLING THE CAPACITOR VOLTAGE OF THE CIRCUIT ARRANGEMENT | |
EP3498886A4 (en) | ELECTROLYSIS SYSTEM AND METHOD FOR A HIGH RATE OF ELECTRICAL POWER TRANSFORMATION | |
MY175563A (en) | Method for providing sequential power pulses | |
EP2577046A4 (en) | A wave power unit, a use of a such and a method of producing electric energy | |
EP4024641A4 (en) | SYSTEM AND METHOD FOR GENERATION OF PHOTOVOLTAIC ENERGY | |
EP3905465A4 (en) | CONVERTER, METHOD AND SYSTEM APPLIED TO A PHOTOVOLTAIC ENERGY PRODUCTION SYSTEM | |
PL2605103T3 (pl) | Regulator do impulsowej przetwornicy mocy, impulsowa przetwornica mocy oraz sposób jej regulacji | |
WO2010144528A3 (en) | High efficiency and low cost high voltage power converter |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 11747763 Country of ref document: EP Kind code of ref document: A2 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 11747763 Country of ref document: EP Kind code of ref document: A2 |