WO2011105800A3 - Heat sink including a heat-dissipation fin capable of vibrating - Google Patents

Heat sink including a heat-dissipation fin capable of vibrating Download PDF

Info

Publication number
WO2011105800A3
WO2011105800A3 PCT/KR2011/001252 KR2011001252W WO2011105800A3 WO 2011105800 A3 WO2011105800 A3 WO 2011105800A3 KR 2011001252 W KR2011001252 W KR 2011001252W WO 2011105800 A3 WO2011105800 A3 WO 2011105800A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat
dissipation fin
heat sink
vibrating
piezoelectric device
Prior art date
Application number
PCT/KR2011/001252
Other languages
French (fr)
Korean (ko)
Other versions
WO2011105800A2 (en
Inventor
김성진
박희승
Original Assignee
한국과학기술원
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020100030077A external-priority patent/KR20110097552A/en
Application filed by 한국과학기술원 filed Critical 한국과학기술원
Publication of WO2011105800A2 publication Critical patent/WO2011105800A2/en
Publication of WO2011105800A3 publication Critical patent/WO2011105800A3/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D33/00—Non-positive-displacement pumps with other than pure rotation, e.g. of oscillating type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The present invention relates to a heat sink including a heat-dissipation fin capable of vibrating. The heat sink of the present invention comprises a piezoelectric device that is attached to a surface of a heat-dissipation fin for dissipating heat, wherein the piezoelectric device compresses or expands so as to vibrate the heat-dissipation fin. The same frequency as the natural frequency of the heat-dissipation fin can be inputted to the piezoelectric device. According to the present invention, since airflow is generated by the vibration of the heat-dissipation fin, the heat sink has good cooling performance without using a separate fan. Thus, a space for accommodating a fan in the heat sink is unnecessary.
PCT/KR2011/001252 2010-02-23 2011-02-23 Heat sink including a heat-dissipation fin capable of vibrating WO2011105800A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2010-0016233 2010-02-23
KR20100016233 2010-02-23
KR10-2010-0030077 2010-04-01
KR1020100030077A KR20110097552A (en) 2010-02-23 2010-04-01 Heat sink having cooling fin capable of vibrating

Publications (2)

Publication Number Publication Date
WO2011105800A2 WO2011105800A2 (en) 2011-09-01
WO2011105800A3 true WO2011105800A3 (en) 2012-01-12

Family

ID=44507420

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/001252 WO2011105800A2 (en) 2010-02-23 2011-02-23 Heat sink including a heat-dissipation fin capable of vibrating

Country Status (1)

Country Link
WO (1) WO2011105800A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2731131A1 (en) * 2012-11-08 2014-05-14 Alcatel-Lucent Cooling assembly
US9409264B2 (en) 2013-03-25 2016-08-09 International Business Machines Corporation Interleaved heat sink and fan assembly
CN112351634B (en) * 2019-08-07 2022-08-23 杭州海康威视数字技术股份有限公司 Heat dissipation device and electronic equipment
CN113692182B (en) * 2021-08-05 2024-07-26 Oppo广东移动通信有限公司 Heat abstractor and electronic equipment

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0697336A (en) * 1992-09-17 1994-04-08 Toshiba Corp Radiating device and semiconductor device using same
JP2001028418A (en) * 1999-07-14 2001-01-30 Hokuriku Electric Ind Co Ltd Heat sink
JP2008210876A (en) * 2007-02-23 2008-09-11 Furukawa Electric Co Ltd:The Heat sink
JP2008210875A (en) * 2007-02-23 2008-09-11 Furukawa Electric Co Ltd:The Heat sink

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0697336A (en) * 1992-09-17 1994-04-08 Toshiba Corp Radiating device and semiconductor device using same
JP2001028418A (en) * 1999-07-14 2001-01-30 Hokuriku Electric Ind Co Ltd Heat sink
JP2008210876A (en) * 2007-02-23 2008-09-11 Furukawa Electric Co Ltd:The Heat sink
JP2008210875A (en) * 2007-02-23 2008-09-11 Furukawa Electric Co Ltd:The Heat sink

Also Published As

Publication number Publication date
WO2011105800A2 (en) 2011-09-01

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