TWD181167S - Cooling device for electronic component heat sink - Google Patents
Cooling device for electronic component heat sinkInfo
- Publication number
- TWD181167S TWD181167S TW105303084D01F TW105303084D01F TWD181167S TW D181167 S TWD181167 S TW D181167S TW 105303084D01 F TW105303084D01 F TW 105303084D01F TW 105303084D01 F TW105303084D01 F TW 105303084D01F TW D181167 S TWD181167 S TW D181167S
- Authority
- TW
- Taiwan
- Prior art keywords
- electronic component
- heat sink
- cooling device
- component heat
- symmetrical
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title 1
Abstract
【物品用途】;;【設計說明】;仰視圖與俯視圖對稱,故省略[Use of item];;[Design description];The bottom view and the top view are symmetrical, so omitted
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2015-27272F JP1548555S (en) | 2015-12-04 | 2015-12-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
TWD181167S true TWD181167S (en) | 2017-02-01 |
Family
ID=55762037
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105303084D01F TWD181167S (en) | 2015-12-04 | 2016-05-31 | Cooling device for electronic component heat sink |
Country Status (3)
Country | Link |
---|---|
US (1) | USD798829S1 (en) |
JP (1) | JP1548555S (en) |
TW (1) | TWD181167S (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP1653094S (en) * | 2018-11-26 | 2020-02-17 | ||
JP1653095S (en) * | 2018-11-26 | 2020-02-17 | ||
JP1653096S (en) * | 2018-11-26 | 2020-02-17 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5014117A (en) * | 1990-03-30 | 1991-05-07 | International Business Machines Corporation | High conduction flexible fin cooling module |
US6478082B1 (en) * | 2000-05-22 | 2002-11-12 | Jia Hao Li | Heat dissipating apparatus with nest wind duct |
CN2594989Y (en) * | 2001-11-29 | 2003-12-24 | 王清风 | Heat exchange fin plate for improving heat exchange efficience |
TWI267337B (en) * | 2003-05-14 | 2006-11-21 | Inventor Prec Co Ltd | Heat sink |
US7306028B2 (en) * | 2005-06-23 | 2007-12-11 | Thermal Corp. | Modular heat sink |
US20080017360A1 (en) * | 2006-07-20 | 2008-01-24 | International Business Machines Corporation | Heat exchanger with angled secondary fins extending from primary fins |
USD567343S1 (en) * | 2006-09-08 | 2008-04-22 | Spx Cooling Technologies, Inc. | Film fill pack |
US8051896B2 (en) * | 2007-07-31 | 2011-11-08 | Adc Telecommunications, Inc. | Apparatus for spreading heat over a finned surface |
USD586763S1 (en) * | 2007-08-23 | 2009-02-17 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation device |
US7715197B2 (en) * | 2008-06-05 | 2010-05-11 | International Business Machines Corporation | Coined-sheet-metal heatsinks for closely packaged heat-producing devices such as dual in-line memory modules (DIMMs) |
US20090321045A1 (en) * | 2008-06-30 | 2009-12-31 | Alcatel-Lucent Technologies Inc. | Monolithic structurally complex heat sink designs |
USD601515S1 (en) * | 2008-12-17 | 2009-10-06 | Celsia Technologies Taiwan, Inc. | Heat sink |
CN101839654B (en) * | 2009-03-19 | 2013-06-05 | 富准精密工业(深圳)有限公司 | Heat sink |
US20130020060A1 (en) * | 2010-09-02 | 2013-01-24 | Cooper-Standard Automotive, Inc. | Heat exchanger |
CN103119387A (en) * | 2010-09-21 | 2013-05-22 | 开利公司 | Micro-channel heat exchanger including independent heat exchange circuits and method |
USD676118S1 (en) * | 2011-06-24 | 2013-02-12 | Hiform As | Heat exchanger panel |
EP2704190A1 (en) * | 2012-09-03 | 2014-03-05 | ABB Technology AG | Modular cooling system |
USD689835S1 (en) * | 2013-01-08 | 2013-09-17 | Eryn Smith | Electrostatic carrier tray |
USD763804S1 (en) * | 2014-02-06 | 2016-08-16 | Kobe Steel, Ltd. | Plate for heat exchanger |
EP2988578B1 (en) * | 2014-08-19 | 2021-05-19 | ABB Schweiz AG | Cooling element |
CN105636407A (en) * | 2014-11-27 | 2016-06-01 | 英业达科技有限公司 | Radiating fin group |
FR3030708B1 (en) * | 2014-12-22 | 2018-02-16 | Airbus Operations Sas | COLD PLATE, IN PARTICULAR A STRUCTURAL PART OF A HEAT-GENERATING COMPONENT EQUIPMENT |
TWI650522B (en) * | 2015-05-21 | 2019-02-11 | 萬在工業股份有限公司 | Refrigerant heat sink |
TWM512730U (en) * | 2015-08-20 | 2015-11-21 | Cooler Master Co Ltd | Water-cooling radiator |
-
2015
- 2015-12-04 JP JPD2015-27272F patent/JP1548555S/ja active Active
-
2016
- 2016-05-26 US US29/566,037 patent/USD798829S1/en active Active
- 2016-05-31 TW TW105303084D01F patent/TWD181167S/en unknown
Also Published As
Publication number | Publication date |
---|---|
USD798829S1 (en) | 2017-10-03 |
JP1548555S (en) | 2016-10-17 |
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