WO2011105674A1 - 엘이디 조명장치 - Google Patents
엘이디 조명장치 Download PDFInfo
- Publication number
- WO2011105674A1 WO2011105674A1 PCT/KR2010/006768 KR2010006768W WO2011105674A1 WO 2011105674 A1 WO2011105674 A1 WO 2011105674A1 KR 2010006768 W KR2010006768 W KR 2010006768W WO 2011105674 A1 WO2011105674 A1 WO 2011105674A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat
- thermal base
- heat dissipation
- led lighting
- light source
- Prior art date
Links
- 238000009423 ventilation Methods 0.000 claims abstract description 6
- 230000017525 heat dissipation Effects 0.000 claims description 62
- 230000005855 radiation Effects 0.000 claims description 20
- 239000012530 fluid Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims 8
- 230000035699 permeability Effects 0.000 description 3
- 210000005239 tubule Anatomy 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2101/00—Point-like light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/30—Elongate light sources, e.g. fluorescent tubes curved
- F21Y2103/33—Elongate light sources, e.g. fluorescent tubes curved annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the present invention relates to an LED lighting device.
- the LED lighting device In the LED lighting device, a large amount of heat is generated due to the heat of the LED. In general, when the LED lighting device is overheated, an operation error may occur or be damaged, and a heat dissipation structure is necessary to prevent overheating.
- an LED lighting device having a heat radiating fin has been disclosed.
- the LED lighting device having a heat dissipation fin has a structure in which a heat dissipation fin is attached to a cylindrical body surrounding the light source to enlarge the surface area.
- the heat dissipation fin structure has a limitation in enlarging the surface area, and the air staying in the gap space between the heat dissipation fins is stagnated with heat, and thus there is a problem in that the heat dissipation efficiency is lower than the surface area.
- Korean Patent Publication No. 2009-0095903 discloses a structure for disposing a linear heat dissipation member on an outer circumferential surface of a body surrounding a light source.
- a structure also does not solve the problem that the air containing the stagnation is stagnated on the outer periphery of the body to lower the efficiency of heat radiation.
- the bottleneck of heat transfer that the heat generated from the light source is trapped in the cylindrical body and is not quickly transmitted to the heat radiation member.
- Korean Patent Laid-Open Publication No. 2009-0076545 discloses an LED lighting device that forms an open heat dissipation passage in the heat sink in order to smooth the air flow.
- such a structure also has a limited improvement in the flow of air only at the end of the heat sink, which does not solve the problem due to the stagnation of air containing heat, and the problem that the effective heat dissipation area used for heat dissipation is still large. .
- the present invention is to provide an LED lighting device to increase the heat radiation efficiency by activating the air flow around the heat radiation member.
- a light source module having an LED light source, coupled to the light source module, the thermal base receiving heat generated from the light source module, coupled to the edge region of the thermal base in the thermal base
- An LED lighting device includes a heat radiating member that emits transferred heat and has a vent formed therein to open a central area of the thermal base to facilitate ventilation with the outside.
- the LED light source may be plural in number, and the plurality of LED light sources may be disposed corresponding to an edge region of the thermal base.
- the heat dissipation member is formed of a linear member, the heat dissipation having a spiral structure that is coupled to the edge region of the thermal base to receive heat and repeatedly forming a heat dissipation portion for dissipating heat absorbed from the heat absorbing portion It may include a loop.
- the heat dissipation loop may include a tubular heat pipe loop into which a working fluid is injected.
- Trench-shaped heat transfer grooves are formed in the thermal base, and the heat dissipation loop may be inserted into the heat transfer grooves.
- the heat dissipation member may be coupled to an edge region of the thermal base, and may include a hollow heat dissipation fence having a plurality of through holes formed therein to allow air flow inward.
- the heat dissipation fence is a plurality, it may be coupled to the thermal base in a double row structure.
- the heat dissipation member may include a plurality of linear members having a heat absorbing portion coupled to an edge region of the thermal base to receive heat and a heat dissipating portion dissipating heat absorbed from the heat absorbing portion.
- Through-holes may be formed in the thermal base to allow air flow.
- the air permeability of the LED lighting device is maximized so that the air around the heat dissipation member flows smoothly without stagnation, thereby increasing heat dissipation efficiency.
- FIG. 1 is an exploded perspective view showing an LED lighting apparatus according to an embodiment of the present invention.
- Figure 2 is a perspective view of the LED lighting apparatus according to an embodiment of the present invention.
- Figure 3 is a perspective view showing a thermal base of the LED lighting apparatus according to an embodiment of the present invention.
- FIG. 4 is a view for explaining a heat transfer path in the thermal base of the LED lighting apparatus according to an embodiment of the present invention.
- FIG. 5 is a view for explaining the flow of air in the LED lighting apparatus according to an embodiment of the present invention.
- Figure 6 is a perspective view showing a heat pipe loop of the LED lighting apparatus according to an embodiment of the present invention.
- Figure 7 is an exploded perspective view showing the LED lighting apparatus according to another embodiment of the present invention.
- FIG. 8 is a view for explaining a heat radiation fence structure of the LED lighting apparatus according to another embodiment of the present invention.
- FIG. 1 is an exploded perspective view showing an LED lighting apparatus according to an embodiment of the present invention
- Figure 2 is a perspective view showing the LED lighting apparatus according to an embodiment of the present invention.
- LED lighting apparatus includes a light source module 5, the thermal base 10 and the heat radiation member (20, 30).
- the light source module 5 is an LED light source 6 capable of emitting light using electrical energy, thereby generating light necessary for illumination. As shown in FIG. 1, the light source module 5 of the present embodiment includes an LED light source 6 and a module substrate 7 on which the LED light source 6 is mounted.
- the thermal base 10 is a portion which receives heat generated by the LED light source 6 and transmits it to a heat radiation member to be described later.
- the LED light source 6 is coupled to one side of the thermal base 10 to enable heat transfer
- the heat dissipation member is coupled to the edge region of the thermal base 10 to enable heat transfer. Accordingly, heat absorbed from the thermal base 10 may be smoothly transferred to the heat radiating member.
- FIG 3 is a perspective view showing a thermal base of the LED lighting apparatus according to an embodiment of the present invention
- Figure 4 is a view illustrating a heat transfer path in the thermal base of the LED lighting apparatus according to an embodiment of the present invention.
- a light source module 5 having a plurality of LED light sources 6 arranged in a circle on one surface of a circular thermal base 10 is mounted, and a cylindrical shape is formed at the edge of the other surface.
- the heat radiating member is coupled.
- a through hole 14 into which a power cable 8 for supplying electricity to the light source module 5 is inserted is formed at the center of the thermal base 10.
- the heat dissipation members 20 and 30 are coupled to edge regions of the thermal base 10 to emit heat transferred from the thermal base 10.
- the heat dissipation members 20 and 30 of the present embodiment are provided with vents 22 and 32 to allow air to flow freely while opening the central region of the thermal base 10 so as to smoothly ventilate with the outside.
- FIG. 5 is a view for explaining the flow of air in the LED lighting apparatus according to an embodiment of the present invention.
- the LED lighting apparatus of the present embodiment is formed in the form of the inside as empty as possible to open the central area of the thermal base 10, the interior empty space is free to ventilate with the outside through the vents . Accordingly, the air permeability of the LED lighting device is maximized so that the air around the heat dissipation member flows smoothly without stagnation, thereby improving heat dissipation efficiency. In other words, by increasing the air permeability to form a continuous air flow around the heat radiating member, it is possible to prevent the air holding the heat stagnated to lower the heat radiating performance.
- the air vented to the inside can directly heat the heat absorbed by the thermal base 10 as well as the heat radiation of the heat dissipation member can further increase the heat radiation efficiency. That is, the surface of the thermal base 10 may also be used as a heat dissipation area effective for heat dissipation. On the other hand, the thermal base 10 may be formed through holes for ventilation to further increase the breathability of the LED lighting device.
- the heat dissipation member of the present embodiment is absorbed spaced apart from the heat absorbing portion (20a) and the heat absorbing portion (20a) is coupled to the edge region of the thermal base 10 to receive heat It may include a heat radiation loop 20 of the helical structure made of a linear member repeatedly forming the heat radiation portion 20b for dissipating heat. That is, the heat dissipation loop 20 has a spiral structure that repeatedly reciprocates a portion coupled to the thermal base 10 and a portion falling from the thermal base 10. As a result, the space between the heat dissipation loops 20 spirals becomes the vent 22, and is freely ventilated with the outside through the vent 22. And, since the heat dissipation member has a spiral structure, the surface area required for heat dissipation in a limited space can be secured as much as possible.
- the thermal base 10 is provided with a trench, that is, a groove-shaped heat-transfer groove 12, and as shown in FIG. 2, the heat-dissipation loop 20 is formed in the heat-transfer groove. It can be inserted continuously and joined. Accordingly, after the heat radiation loop 20 is inserted, solder or the like is filled in the heat transfer grooves 12, so that the heat radiation loop 20 may be easily coupled to the thermal base 10.
- the elastic force is applied to each of the loops of the heat dissipation loop 20 formed in a spiral shape, so that each loop of the heat dissipation loop 20 inserted into the heat transfer grooves 12 is spaced apart from the adjacent loop and inserted by the elastic force. Can be maintained.
- each loop of the heat dissipation loop 20 inserted into the heat transfer grooves 12 are inclined in the heat transfer grooves 12, to increase the density of the heat dissipation roof 20, the thermal base ( 10) can increase the contact area with
- the heat dissipation loop 20 may include a tubular heat pipe loop 25 into which the working fluid 26 is injected.
- Figure 6 is a perspective view showing a heat pipe loop of the LED lighting apparatus according to an embodiment of the present invention.
- the heat pipe loop 25 of the present embodiment has a vibrating tubular heat pipe having a spiral structure, and the vibrating tubular heat pipe has a working fluid 26 and a bubble 27 inside the tubule. After being injected at a rate, the inside of the tubule is sealed from the outside. Accordingly, the vibrating tubular heat pipe has a heat transfer cycle for transporting a large amount of heat in latent form by volume expansion and condensation of the bubbles 27 and the working fluid 26. Accordingly, the heat radiation performance of the heat radiation member can be maximized.
- the heat pipe loop 25 may be formed in a plate shape as a whole.
- the heat pipe loop 25 formed in a plate shape may be rolled in an annular shape and both ends of the heat pipe loop 25 may be coupled to the joint 28 to form a cylindrical shape.
- the cylindrical heat pipe loop 25 is easily inserted into the annular heat-transfer groove 12 and has a high heat dissipation efficiency because the flow of air required for heat dissipation is more free.
- the heat dissipation member made of a linear member is not limited to the spiral loop shape, and is provided with a heat absorbing portion coupled to the edge region of the thermal base 10 and a heat dissipating portion for dissipating heat absorbed from the heat absorbing portion.
- the plurality of linear members may be variously modified and implemented in a form in which they are arranged side by side.
- heat radiating member may be implemented in various forms other than the linear member.
- FIG. 7 is an exploded perspective view showing the LED lighting apparatus according to another embodiment of the present invention
- Figure 8 is a view illustrating a heat radiation fence structure of the LED lighting apparatus according to another embodiment of the present invention.
- the heat dissipation member of the present embodiment is coupled to the edge region of the thermal base 10 and includes a hollow heat dissipation fence 30 having a plurality of through holes formed therein to allow air to flow therein. do. Accordingly, the plurality of through holes formed in the heat radiation fence 30 become the vent 32, and the inside of the LED lighting apparatus of the present embodiment may be freely ventilated with the outside through the through holes.
- the heat dissipation fence 30 of the present embodiment has the advantage that the manufacturing and the coupling of the thermal base 10 is very easy.
- a plurality of heat dissipation fences 30 are coupled to the thermal base 10 in a double row structure in which multiple layers are arranged, thereby further improving heat dissipation capability.
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
Description
Claims (9)
- 엘이디 광원을 구비한 광원모듈;상기 광원모듈과 결합되어 있으며, 상기 광원모듈에서 발생된 열을 전달받는 써멀 베이스; 및상기 써멀 베이스의 가장자리 영역에 결합되어 상기 써멀 베이스에서 전달된 열을 방출하며, 외부와 통기가 원활하도록 상기 써멀 베이스의 중앙 영역을 개방시키는 통기부가 형성된 방열부재를 포함하는 엘이디 조명장치.
- 제1항에 있어서,상기 엘이디 광원은 복수 개이며,상기 복수의 엘이디 광원은 상기 써멀 베이스의 가장자리 영역에 상응하여 배치된 것을 특징으로 하는 엘이디 조명장치.
- 제1항 또는 제2항에 있어서,상기 방열부재는,선형부재로 이루어지며, 상기 써멀 베이스의 가장자리 영역에 결합되어 열을 전달받는 흡열부 및 상기 흡열부에서 이격되어 흡수된 열을 방출하는 방열부를 반복적으로 형성하는 나선형 구조를 가지는 방열루프를 포함하는 것을 특징으로 하는 엘이디 조명장치.
- 제3항에 있어서,상기 방열루프는,작동유체가 주입되는 세관형의 히트파이프 루프를 포함하는 것을 특징으로 하는 엘이디 조명장치.
- 제3항에 있어서,상기 써멀 베이스에는 트렌치(trench) 형상의 전열홈이 형성되어 있으며,상기 방열루프는 상기 전열홈에 삽입되어 배치된 것을 특징으로 하는 엘이디 조명장치.
- 제1항 또는 제2항에 있어서,상기 방열부재는,상기 써멀 베이스의 가장자리 영역에 결합되어 있으며, 내측으로의 공기 유동이 가능하도록 복수의 관통홀이 형성된 중공형의 방열펜스를 포함하는 것을 특징으로 하는 엘이디 조명장치.
- 제6항에 있어서,상기 방열펜스은 복수 개이며,상기 써멀 베이스에 복열 구조로 결합된 것을 특징으로 하는 엘이디 조명장치.
- 제1항 또는 제2항에 있어서,상기 방열부재는,상기 써멀 베이스의 가장자리 영역에 결합되어 열을 전달받는 흡열부 및 상기 흡열부에서 이격되어 흡수된 열을 방출하는 방열부를 구비한 복수의 선형부재를 포함하는 것을 특징으로 하는 엘이디 조명장치.
- 제1항 또는 제2항에 있어서,상기 써멀 베이스에는 공기 유동이 가능하도록 관통홀이 형성된 것을 특징으로 하는 엘이디 조명장치.
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201080065106XA CN102869922A (zh) | 2010-02-25 | 2010-10-05 | Led照明设备 |
CA2790112A CA2790112C (en) | 2010-02-25 | 2010-10-05 | Led lighting apparatus |
ES10846701.0T ES2539961T3 (es) | 2010-02-25 | 2010-10-05 | Aparato de iluminación de ledes |
NZ602276A NZ602276A (en) | 2010-02-25 | 2010-10-05 | Led lighting apparatus |
AU2010347154A AU2010347154B2 (en) | 2010-02-25 | 2010-10-05 | LED lighting apparatus |
BR112012021500A BR112012021500A2 (pt) | 2010-02-25 | 2010-10-05 | aparelho de iluminação por led |
EP10846701.0A EP2541138B1 (en) | 2010-02-25 | 2010-10-05 | Led lighting apparatus |
EA201290650A EA024632B1 (ru) | 2010-02-25 | 2010-10-05 | Светодиодное осветительное устройство |
JP2012551899A JP5496368B2 (ja) | 2010-02-25 | 2010-10-05 | Led照明装置 |
US13/594,183 US8733975B2 (en) | 2010-02-25 | 2012-08-24 | LED lighting apparatus |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2010-0017149 | 2010-02-25 | ||
KR1020100017149A KR101081550B1 (ko) | 2010-02-25 | 2010-02-25 | 엘이디 조명장치 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/594,183 Continuation US8733975B2 (en) | 2010-02-25 | 2012-08-24 | LED lighting apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2011105674A1 true WO2011105674A1 (ko) | 2011-09-01 |
Family
ID=44507056
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2010/006768 WO2011105674A1 (ko) | 2010-02-25 | 2010-10-05 | 엘이디 조명장치 |
Country Status (13)
Country | Link |
---|---|
US (1) | US8733975B2 (ko) |
EP (1) | EP2541138B1 (ko) |
JP (1) | JP5496368B2 (ko) |
KR (1) | KR101081550B1 (ko) |
CN (1) | CN102869922A (ko) |
AU (1) | AU2010347154B2 (ko) |
BR (1) | BR112012021500A2 (ko) |
CA (1) | CA2790112C (ko) |
EA (1) | EA024632B1 (ko) |
ES (1) | ES2539961T3 (ko) |
HU (1) | HUE025339T2 (ko) |
NZ (1) | NZ602276A (ko) |
WO (1) | WO2011105674A1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013156521A1 (de) * | 2012-04-19 | 2013-10-24 | Osram Gmbh | Led-modul |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101070842B1 (ko) * | 2009-06-11 | 2011-10-06 | 주식회사 자온지 | 방열장치 및 이를 구비한 전자장치 |
KR101364002B1 (ko) | 2011-12-02 | 2014-02-18 | 쎄딕(주) | 엘이디 조명 장치와 그 방열 장치 |
KR101255221B1 (ko) * | 2011-12-09 | 2013-04-23 | 한국해양대학교 산학협력단 | Led 방폭등 방열 장치 |
US8974077B2 (en) | 2012-07-30 | 2015-03-10 | Ultravision Technologies, Llc | Heat sink for LED light source |
WO2014208797A1 (ko) * | 2013-06-28 | 2014-12-31 | (주)우미앤씨 | 엘이디 조명장치 및 이를 구비한 가로등 장치 |
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Also Published As
Publication number | Publication date |
---|---|
EP2541138A4 (en) | 2013-12-18 |
AU2010347154B2 (en) | 2014-02-20 |
KR101081550B1 (ko) | 2011-11-08 |
HUE025339T2 (en) | 2016-02-29 |
CA2790112C (en) | 2016-11-08 |
EA024632B1 (ru) | 2016-10-31 |
EP2541138A1 (en) | 2013-01-02 |
AU2010347154A1 (en) | 2012-09-27 |
BR112012021500A2 (pt) | 2016-06-28 |
EP2541138B1 (en) | 2015-06-17 |
JP5496368B2 (ja) | 2014-05-21 |
US20120314415A1 (en) | 2012-12-13 |
KR20110097346A (ko) | 2011-08-31 |
US8733975B2 (en) | 2014-05-27 |
CA2790112A1 (en) | 2011-09-01 |
EA201290650A1 (ru) | 2013-03-29 |
CN102869922A (zh) | 2013-01-09 |
NZ602276A (en) | 2014-03-28 |
ES2539961T3 (es) | 2015-07-07 |
JP2013519202A (ja) | 2013-05-23 |
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