WO2011096695A3 - 검사 프로그램의 생성 방법 - Google Patents

검사 프로그램의 생성 방법 Download PDF

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Publication number
WO2011096695A3
WO2011096695A3 PCT/KR2011/000683 KR2011000683W WO2011096695A3 WO 2011096695 A3 WO2011096695 A3 WO 2011096695A3 KR 2011000683 W KR2011000683 W KR 2011000683W WO 2011096695 A3 WO2011096695 A3 WO 2011096695A3
Authority
WO
WIPO (PCT)
Prior art keywords
image information
inspection program
creating
inspection
solder
Prior art date
Application number
PCT/KR2011/000683
Other languages
English (en)
French (fr)
Other versions
WO2011096695A2 (ko
Inventor
한승범
김희태
Original Assignee
주식회사 고영테크놀러지
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 고영테크놀러지 filed Critical 주식회사 고영테크놀러지
Priority to US13/576,829 priority Critical patent/US20130039563A1/en
Priority to CN2011800081376A priority patent/CN102742380A/zh
Publication of WO2011096695A2 publication Critical patent/WO2011096695A2/ko
Publication of WO2011096695A3 publication Critical patent/WO2011096695A3/ko

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Abstract

거버 파일이 없는 검사 기판에 대한 검사 프로그램을 생성하는 방법이 개시되어 있다. 검사 프로그램의 생성을 위해서, 베어 기판을 스캔하여 제1 영상정보를 획득하고, 베어 기판의 패드 영역에 납이 도포된 납도포 기판을 스캔하여 제2 영상정보를 획득한 후, 제1 영상정보와 제2 영상정보를 분석하여 검사 프로그램을 생성한다. 제1 영상정보 및 제2 영상정보는 각각 2차원 영상정보 및 3차원 영상정보 중 적어도 하나를 포함할 수 있다. 검사 프로그램을 생성하는 과정은 제1 영상정보와 제2 영상정보의 차이를 계산하고, 차이가 생긴 영역에 대한 위치 및 크기를 추출한 후, 추출된 정보를 통해 검사 프로그램을 생성할 수 있다. 이와 같이, 베어 기판과 납도포 기판을 각각 검사하고 이를 통해 획득된 2차원 영상정보 또는 3차원 영상정보의 차이를 분석함으로써 납이 도포된 영역에 대한 정확한 위치 및 크기를 추출할 수 있다.
PCT/KR2011/000683 2010-02-02 2011-02-01 검사 프로그램의 생성 방법 WO2011096695A2 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US13/576,829 US20130039563A1 (en) 2010-02-02 2011-02-01 Method of generating inspection program
CN2011800081376A CN102742380A (zh) 2010-02-02 2011-02-01 检测程序的生成方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0009365 2010-02-02
KR1020100009365A KR101121994B1 (ko) 2010-02-02 2010-02-02 검사 프로그램의 생성 방법

Publications (2)

Publication Number Publication Date
WO2011096695A2 WO2011096695A2 (ko) 2011-08-11
WO2011096695A3 true WO2011096695A3 (ko) 2011-12-01

Family

ID=44355940

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/000683 WO2011096695A2 (ko) 2010-02-02 2011-02-01 검사 프로그램의 생성 방법

Country Status (4)

Country Link
US (1) US20130039563A1 (ko)
KR (1) KR101121994B1 (ko)
CN (1) CN102742380A (ko)
WO (1) WO2011096695A2 (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9516762B2 (en) * 2014-08-04 2016-12-06 Ok International Inc. Soldering iron with automatic soldering connection validation
US10716220B2 (en) 2014-08-04 2020-07-14 Ok International, Inc. Variable temperature controlled soldering iron
US10688578B2 (en) 2014-08-04 2020-06-23 OK International, Inc Variable temperature controlled soldering iron
KR20160019564A (ko) * 2014-08-11 2016-02-22 주식회사 고영테크놀러지 검사 장치 및 방법과, 이를 포함하는 부품 실장 시스템 및 방법
CA2915654C (en) * 2015-07-08 2018-05-01 Delaware Capital Formation, Inc. An intelligent soldering cartridge for automatic soldering connection validation
CN106546597A (zh) * 2015-09-22 2017-03-29 泰科电子(上海)有限公司 焊接质量检测系统和方法
JP6225222B1 (ja) * 2016-06-14 2017-11-01 Ckd株式会社 半田印刷検査装置
CN113866171B (zh) * 2021-12-02 2022-03-18 武汉飞恩微电子有限公司 电路板点胶检测方法、设备及计算机可读存储介质

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6317972B1 (en) * 1998-05-19 2001-11-20 Fuji Machine Mfg. Co., Ltd. Method for mounting and inspecting the mounting of electric components
KR20050055883A (ko) * 2003-12-09 2005-06-14 삼성코닝정밀유리 주식회사 유리기판의 검사장치 및 검사방법
KR20070115274A (ko) * 2006-06-01 2007-12-06 삼성전자주식회사 어셈블리 기판의 검사장치 및 표시패널의 제조방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62229017A (ja) * 1986-03-31 1987-10-07 Toshiba Corp 検査装置
US6298149B1 (en) * 1996-03-21 2001-10-02 Cognex Corporation Semiconductor device image inspection with contrast enhancement
US5912984A (en) * 1996-12-19 1999-06-15 Cognex Corporation Method and apparatus for in-line solder paste inspection
US6721461B1 (en) * 1997-11-24 2004-04-13 Cognex Technology And Investment Corporation Method and apparatus using image subtraction and dynamic thresholding
SG121898A1 (en) * 2004-10-06 2006-05-26 Generic Power Pte Ltd System for 2-D and 3-D vision inspection
JP4563205B2 (ja) * 2005-02-08 2010-10-13 富士機械製造株式会社 実装された電子部品の検査方法及び装置
WO2008124397A1 (en) * 2007-04-03 2008-10-16 David Fishbaine Inspection system and method
KR101525251B1 (ko) * 2008-12-29 2015-06-03 주식회사 동부하이텍 노이즈 필터

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6317972B1 (en) * 1998-05-19 2001-11-20 Fuji Machine Mfg. Co., Ltd. Method for mounting and inspecting the mounting of electric components
KR20050055883A (ko) * 2003-12-09 2005-06-14 삼성코닝정밀유리 주식회사 유리기판의 검사장치 및 검사방법
KR20070115274A (ko) * 2006-06-01 2007-12-06 삼성전자주식회사 어셈블리 기판의 검사장치 및 표시패널의 제조방법

Also Published As

Publication number Publication date
CN102742380A (zh) 2012-10-17
WO2011096695A2 (ko) 2011-08-11
KR20110089897A (ko) 2011-08-10
KR101121994B1 (ko) 2012-03-09
US20130039563A1 (en) 2013-02-14

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