WO2011093427A1 - Method for manufacturing a laminate with one metal-plated side - Google Patents
Method for manufacturing a laminate with one metal-plated side Download PDFInfo
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- WO2011093427A1 WO2011093427A1 PCT/JP2011/051706 JP2011051706W WO2011093427A1 WO 2011093427 A1 WO2011093427 A1 WO 2011093427A1 JP 2011051706 W JP2011051706 W JP 2011051706W WO 2011093427 A1 WO2011093427 A1 WO 2011093427A1
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- film
- metal
- clad laminate
- insulating film
- foil
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/22—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
- B32B37/223—One or more of the layers being plastic
- B32B37/226—Laminating sheets, panels or inserts between two continuous plastic layers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
- B32B37/025—Transfer laminating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/538—Roughness
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/546—Flexural strength; Flexion stiffness
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/02—Temperature
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/04—Time
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/08—Dimensions, e.g. volume
- B32B2309/10—Dimensions, e.g. volume linear, e.g. length, distance, width
- B32B2309/105—Thickness
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
- B32B37/0015—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid warp or curl
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1536—Temporarily stacked PCBs
Definitions
- the present invention relates to a method for producing a single-sided metal-clad laminate in which a metal foil is bonded to an insulating film having an adhesive surface made of a thermoplastic resin.
- metal foil is applied to insulating films such as polyimide films and liquid crystal polymer films whose surfaces are thermoplastic.
- a crimped metal-clad laminate is preferably used.
- a method for producing a laminate having such a structure a method in which an insulating film and a metal foil are transported by a roll-to-roll method and is continuously thermocompressed through a pair of pressure rolls while being heated is generally employed. Yes.
- Patent Document 1 when a metal foil is thermocompression bonded to one side of an adhesive sheet having a thermoplastic resin layer on both sides of a heat resistant film, a protective material is provided between the pressure surface of the thermocompression bonding apparatus and the adhesive sheet.
- a method for preventing the thermoplastic resin layer on the side where the metal foil is not laminated from being fused to a metal roll or a protective film has been proposed.
- the pressure buffering effect for uniformly applying pressure is poor, and particularly when a thin adhesive sheet or a thin metal foil is used, an unadhered portion or a portion with low adhesive strength is generated due to pressure variation.
- Patent Document 2 when a liquid crystal polymer film and a metal foil are overlapped and thermocompression bonded with a metal pressure roll, a heat resistant resin film is further overlapped and laminated on the side in contact with the metal pressure roll.
- a method of manufacturing a body has been proposed. According to this method, since a heat-resistant resin film is interposed between the laminate for production and the roll, a certain buffering effect can be expected, but conversely, the heat of the pressure roll is transmitted to the laminate. The thermal effect is hindered, and there is a possibility that the adhesive force between the metal foil and the liquid crystal polymer film is lowered or the adhesive force varies.
- Patent Document 3 in a method for producing a laminate in which a thermoplastic polymer film and an adherend are pressure-bonded while being heat-treated between rolls, the thermoplastic polymer film and the adherend are overlapped, and from both sides thereof.
- a method in which a film and an adherend are firmly bonded in a short time by pressing in a state of being sandwiched between covering materials has drawbacks such that the protective material is in direct contact with the heating and pressing surface, so that the protective material is rapidly deteriorated, and the number of reuses of the protective material is reduced, resulting in an increase in manufacturing cost.
- Patent Document 1 when a thin thermoplastic polymer film or a thin adherend is used, there is a risk of formation of an unbonded portion or a weakly bonded portion, and interlayer voids or wrinkles are generated. There is also a fear.
- the present invention is excellent in interlaminar adhesion between an insulating film and a metal foil, has no variation in adhesive strength, and suppresses the occurrence of appearance defects such as wrinkles, while producing a single-sided metal-clad laminate with good industrial productivity. It is an object to provide a method that can be manufactured.
- the present inventors have determined that the combination of the insulating film and the metal foil is symmetric about the distance film so as to be symmetrical up and down.
- the pressure rolls By stacking and thermocompression bonding with pressure rolls, there is no risk of film fusing to the pressure rolls, and the pressure between the pressure rolls is more evenly transmitted.
- the gist of the present invention is as follows. (1) A method for producing a single-sided metal-clad laminate in which a metal foil (B) is bonded to an insulating film (A) having an adhesive surface made of a thermoplastic resin, Using a separation film (C) whose surface roughness (Rz) is 2.0 ⁇ m or less on both front and back surfaces, between the pair of pressure rolls (r 1 , r 2 ), (r 1 ) / (B) / ( The insulating film (A), the metal foil (B), and the separation film (C) are stacked and thermocompression bonded so that they are in the order of A) / (C) / (A) / (B) / (r 2 ).
- a high-quality single-sided metal-clad laminate excellent in interlayer adhesion between an insulating film and a metal foil is produced industrially with high productivity, eliminating wrinkles and variations in adhesive strength. Will be able to. That is, the production method of the present invention can significantly increase the industrial production efficiency and can produce a high-quality single-sided metal-clad laminate at a lower cost than the conventional method. And since the single-sided metal-clad laminate obtained by the present invention is high quality and excellent in reliability, it is suitably used, for example, as a substrate material for circuit boards that require fine pattern formation and multilayer circuit boards. be able to.
- FIG. 1 is a schematic side view for explaining an apparatus for producing a single-sided metal-clad laminate according to an embodiment of the present invention.
- FIG. 2 is an enlarged schematic view of the vicinity of the pressure roll.
- FIG. 3 is a schematic plan view illustrating the test piece used for evaluating the adhesion between the insulating film and the metal foil.
- metal foil (B) / insulating film (A) / separating film (C) / insulating film (A) / metal foil (B) The two single-sided metal-clad laminates in which the metal foil (B) is bonded to the insulating film (A) are manufactured at the same time.
- the insulating film (A) used in the present invention has an adhesive surface made of a thermoplastic resin and is particularly capable of bonding the metal foil (B) to the adhesive surface by thermocompression bonding.
- thermoplastic resin film ii) A thermoplastic resin layer provided on one side of the heat-resistant resin film to form an adhesive surface, iii) Thermoplastic on both sides of the heat-resistant resin film A resin layer is provided, and any of them is used as an adhesive surface of a metal foil.
- stacked these 1 type (s) or 2 or more types into multiple layers can also be used.
- insulating film (A) made of a thermoplastic resin film, for example, polyethylene terephthalate resin, polyethylene naphthalate resin, polycarbonate resin, acrylonitrile / styrene copolymer resin, thermoplastic polyimide resin, liquid crystal polymer, etc.
- a liquid crystal polymer or a thermoplastic polyimide resin is preferably used.
- liquid crystal polymer examples include known thermotropic liquid crystal polyesters and thermotropic liquid crystal polyester amides derived from the compounds classified into the following (1) to (4) and derivatives thereof.
- Aromatic or aliphatic dihydroxy compounds (2) Aromatic or aliphatic dicarboxylic acids (3) Aromatic hydroxycarboxylic acids (4) Aromatic diamines, aromatic hydroxyamines or aromatic aminocarboxylic acids
- liquid crystal polymers obtained from these raw material compounds aromatic liquid crystal polymers that do not contain an aliphatic chain in the molecule are preferred.
- a copolymer having a structural unit represented by the following formula obtained using 6-hydroxy-2-naphthoic acid and p-hydroxybenzoic acid as raw materials can be given.
- m 2 and n 2 in the formula is a positive number indicating the presence molar ratio of the respective structural units.
- the liquid crystal polymer is preferably in the range of 200 to 400 ° C., more preferably in the range of 250 to 350 ° C., and the transition temperature to the optically anisotropic melt phase. It is good to have.
- the liquid crystal polymer may be blended with, for example, a lubricant, an antioxidant, a filler, and the like, as long as the characteristics are not impaired.
- Examples of the method for forming a liquid crystal polymer into a film include a T-die method, a laminate stretching method, and an inflation method.
- the inflation method and the laminate stretching method stress is applied not only in the mechanical axis direction of the film (MD direction) but also in the direction perpendicular to this (TD direction), so the balance of mechanical properties in the MD and TD directions.
- An excellent film can be obtained.
- a commercial item can also be used for a liquid crystal polymer film, for example, Kuraray Co., Ltd. Vecstar (registered trademark), Japan Gore-Tex Co., Ltd. BIAC, STABIAX (both are registered trademarks), etc. can be used. .
- thermoplastic polyimide resin can be formed by imidizing (curing) the precursor polyamic acid, and the polyamic acid reacts with a known diamine and acid anhydride in the presence of a solvent. Can be manufactured.
- a precursor having a structural unit represented by the following general formula (1) is preferable.
- Ar 3 represents a divalent aromatic group represented by Formula (2), Formula (3), or Formula (4)
- Ar 4 represents Formula (5) or Formula (6).
- R 2 represents independently a monovalent hydrocarbon group or alkoxy group having 1 to 6 carbon atoms
- V and W independently represent a single bond or 1 to 15 carbon atoms.
- m 1 independently represents an integer of 0 to 4
- p is a molar ratio of the constituent units. And a value of 0.1 to 1.0.
- diamine used examples include 4,4′-diaminodiphenyl ether, 2′-methoxy-4,4′-diaminobenzanilide, 1,4-bis (4-aminophenoxy) benzene, 1,3-bis (4 -Aminophenoxy) benzene, 2,2'-bis [4- (4-aminophenoxy) phenyl] propane, 2,2'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dihydroxy-4,4 Examples include '-diaminobiphenyl and 4,4'-diaminobenzanilide.
- Examples of the acid anhydride include pyromellitic anhydride, 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride, and 3,3 ′, 4,4′-diphenylsulfonetetracarboxylic dianhydride. Products, 4,4′-oxydiphthalic anhydride and the like.
- Each of the diamine and the acid anhydride may be used alone or in combination of two or more.
- a polyimide resin is not limited to what is obtained from the said diamine and an acid anhydride.
- the film can be formed into a film from a polyamic acid which is a precursor of a polyimide resin by a known method such as a tenter method or a casting method.
- a tenter method which is one of the typical methods, a polyamic acid solution is cast on a rotating drum, peeled off from the rotating drum in the form of a polyamic acid gel film, and heated and cured (imidized) in a tenter furnace. This is a method of forming a polyimide film.
- the casting method is a method in which a polyamide acid solution is applied to an arbitrary supporting substrate, dried, and then heat-treated and cured (imidized) to form a polyimide film.
- the imidization can be performed, for example, by heating at a temperature condition in the range of 80 to 400 ° C. for a time in the range of 1 to 60 minutes.
- a lubricant, an antioxidant, a filler, etc. can be mix
- the heat-resistant resin film is not particularly limited as long as its heat deformation temperature is higher than that of the thermoplastic resin layer, but among them, a non-thermoplastic polyimide resin film is preferable.
- the non-thermoplastic polyimide resin can be produced by reacting a known diamine and an acid anhydride in the presence of a solvent in the same manner as the thermoplastic polyimide. It can be a polyimide resin.
- non-thermoplastic polyimide resin film for example, Kapton EN, Kapton H, Kapton V (all trade names) manufactured by Toray DuPont Co., Ltd. ), Upilex S (trade name) manufactured by Ube Industries, Ltd., and the like.
- the non-thermoplastic polyimide resin film preferably has a glass transition temperature of 300 ° C. or higher, and more preferably does not deform at the thermocompression bonding temperature by a roll.
- thermoplastic resin layer provided on one side or both sides of the heat-resistant resin film may be formed from a resin having a glass transition temperature at least below the heating temperature in thermocompression bonding.
- a thermoplastic polyimide resin, a thermoplastic liquid crystal polymer, polyetheretherketone, polyethylene naphthalate etc. can be illustrated.
- this thermoplastic resin layer may be formed by bonding a thermoplastic resin film to a heat resistant resin film, or may be formed by applying a precursor by a cast method or the like.
- the thickness of the insulating film (A) is preferably 5 to 200 ⁇ m, more preferably 10 to 100 ⁇ m. If the insulating film (A) is too thin, the rigidity is lowered, and problems such as wrinkles and tearing may occur in the manufacturing process of the metal-clad laminate and the processing process of the wiring board using the obtained laminate. On the other hand, if it is too thick, the insulating film lacks flexibility, and roll-to-roll conveyance in the manufacturing process of the metal-clad laminate becomes difficult, and problems such as difficulty in fitting a circuit-processed wiring board into a narrow housing. There is a fear.
- the material of the metal foil (B) used in the present invention is not particularly limited, and examples thereof include gold, silver, copper, stainless steel, nickel, and aluminum. Of these, copper foil and stainless steel foil are preferred from the viewpoints of conductivity, ease of handling, price, and the like. Of these, any copper foil produced by a rolling method or an electrolytic method can be used.
- the metal foil is subjected to chemical surface treatment such as acid cleaning, UV treatment and plasma treatment in addition to physical surface treatment such as roughening treatment in advance. Also good.
- the thickness of the metal foil (B) is preferably 1 to 100 ⁇ m, more preferably 5 to 70 ⁇ m, still more preferably 8 to 20 ⁇ m. It is desirable to reduce the thickness of the metal foil because it is easy to form a fine pattern in circuit processing. However, if it is too thin, the metal foil tends to wrinkle in the manufacturing process of the metal-clad laminate, and the circuit processing is performed. In the wiring board, the wiring is easily broken, and the reliability as the wiring board may be reduced. On the other hand, when the thickness is too thick, when the circuit is formed by etching the metal foil, the side surface of the circuit is likely to be tapered, which is disadvantageous for fine pattern formation.
- the separation film (C) used in the present invention needs to have heat resistance that can withstand the thermocompression bonding temperature, and needs to be easily peelable from the insulating film (A) after thermocompression bonding.
- the front and back surfaces of the spacing film (C) are both those having a surface roughness (Rz) of 2.0 ⁇ m or less, preferably 0.5 to 1.5 ⁇ m. Since it is easy to ensure surface smoothness as well as heat resistance, a heat resistant resin film such as a non-thermoplastic polyimide film or polyamide film, or a metal foil such as aluminum foil or stainless steel foil is suitable as the separation film (C). Used.
- the composite film which has metal foil on the front and back of the resin film can also be used.
- the surface roughness (Rz) of the front and back surfaces of the separating film (C) exceeds 2.0 ⁇ m, the interlayer adhesion between the insulating film (A) and the separating film (C) is improved by the anchor effect, and the insulating film Defects in appearance such as folds and wrinkles in the single-sided metal-clad laminate due to an increase in peeling resistance when the single-sided metal-clad laminate consisting of (A) and the metal foil (B) is released from the separation film (C) May occur.
- the separation film (C) may be subjected to a release treatment on one side or both sides of the separation film (C) for the purpose of improving the peelability from the insulating film (A) after thermocompression bonding.
- a release treatment for example, a method of providing a heat-resistant release resin film such as a silicone resin or a fluorine resin on the separation film (C) can be mentioned.
- the thickness of the separating film (C) is preferably 10 to 300 ⁇ m, more preferably 20 to 150 ⁇ m, still more preferably 30 to 100 ⁇ m. If the separation film (C) is too thin, the pressure buffering effect that uniformly disperses the pressure during thermocompression bonding is reduced, and the interlayer adhesion between the insulating film (A) and the metal foil (B) of the finished metal-clad laminate is reduced. Variation may occur. On the other hand, when it is too thick, there is a possibility that the roll-to-roll type conveyance may be hindered or the workability when peeling from the metal-clad laminate after thermocompression bonding may be deteriorated.
- the insulating film (A) is a liquid crystal polymer film having a thickness of 10 to 100 ⁇ m or thermoplastic on at least one surface.
- a polyimide film having a resin layer is used, a copper foil having a thickness of 5 to 70 ⁇ m is used for the metal foil (B), and the surface roughness (Rz) is 2.0 ⁇ m or less for both the front and back surfaces of the separation film (C). It is preferable to use an aluminum foil having a thickness of 5 to 70 ⁇ m.
- a pair of pressure rolls (r 1 , r 2 ) was stacked in the order of (r 1 ) / (B) / (A) / (C) / (A) / (B) / (r 2 ).
- a known heating and pressing apparatus having a pair of pressing rolls equipped with a heating mechanism can be used.
- a single-sided metal is used for the insulating film (A), the metal foil (B), and the separation film (C).
- thermoplastic resin of the insulating film (A) be well bonded to the metal layer (B) by deformation or the like. For this reason, it is preferable to carry out at a temperature slightly lower than the Tg or melting point of the thermoplastic resin.
- a temperature range 5 to 100 ° C. lower than the melting point is preferable, and a temperature range 20 to 80 ° C. lower than the melting point is more preferable.
- the pressurizing pressure is preferably in the range of 20 to 200 kN / m.
- the insulating film (A) and the metal foil (B) disposed on both sides of the spacing film (C) are symmetrical with respect to the spacing film (C). Therefore, thermocompression bonding can be performed with the temperature of the pair of pressure rolls (r 1 , r 2 ) being the same, and unnecessary heat loss between the rolls can be prevented. Moreover, since all of the pressure rolls are in contact with the metal foil (B), the heat conduction from the pressure roll is not easily inhibited. And after thermocompression bonding, as will be described in the following examples, the delamination strength between the insulating film (A) and the separation film (C) is 0.1 kN / m or less and can be peeled off very easily.
- a single-sided metal-clad laminate is obtained from two sets of insulating films (A) and metal foil (B) via a spacing film (C).
- A insulating films
- B metal foil
- C spacing film
- processing conditions and measurement (evaluation) conditions are as follows.
- a laminate (B / A / C / A / B) containing a separation film (C) after thermocompression bonding is cut into a length of 10 mm in the length direction of the pressure roll and a length of 150 mm in the laminating direction (MD direction).
- a strip-shaped peelable test piece was prepared, and the interlayer peelability between the insulating film (A) and the separating film (C) was measured according to JIS K 6854-3 (T-type peeling). The peeling speed at this time was 100 mm / min.
- An adhesion test piece was obtained. About the three linear conductor patterns of this adhesion test piece, the intensity
- Example 1 As the insulating film (A), a long film in which a liquid crystal polymer film 1 (melting point: 320 ° C.) having a thickness of 50 ⁇ m and a width of 70 mm is wound is prepared, and a metal foil (B) having a thickness of 12 ⁇ m and a width is prepared.
- a liquid crystal polymer film 1 melting point: 320 ° C.
- a long copper foil in which 70 mm of commercially available electrolytic copper foil 2 (surface roughness Rz: insulating film laminated surface 1.6 ⁇ m, exposed surface 1.4 ⁇ m) is wound in a roll shape is prepared as a separation film (C)
- Electrolytic copper foil 2 / Liquid crystal polymer film 1 / Aluminum foil 3 / Liquid crystal polymer film 1 / Electrolytic copper foil 2 are supplied so as to overlap in this order (FIG. 2), and naturally cooled after thermocompression bonding.
- the foil 3 and the liquid crystal polymer film 1 are delaminated, the aluminum foil 3 is recovered by a separation film winding roll C ′, and the single-sided copper clad laminate 5 in which the liquid crystal polymer film 1 and the electrolytic copper foil 2 are bonded together is: It was made to collect with the product winding roll x installed in two places, respectively.
- the electrolytic copper foil 2, the liquid crystal polymer film 1, and the aluminum foil 3 are all moved at a speed of 0.7 m / min, and the pressure between the two rolls is between the pressure rolls 4 having a surface temperature of 240 ° C.
- the laminate is cooled by natural cooling after thermocompression bonding, and the aluminum foil 3 is collected by the separation film winding roll C ′.
- the single-sided copper clad laminate 5 according to the above was recovered.
- the pressure roll 4 of the apparatus used in Example 1 is a carbon steel metal roll having a length of 130 mm and a roll diameter of 150 mm.
- Example 1 delamination between the liquid crystal polymer film 1 and the aluminum foil 3 after thermocompression bonding was carried out very smoothly without problems, and the recovered liquid crystal polymer film surface and the electrolytic copper foil surface of the single-sided copper clad laminate 5 were When visually confirmed, no tears, wrinkles, or surface roughness were observed.
- the peelable test piece described above was cut out before entering the peeling roll 6 after being thermocompression bonded with the pressure roll 4, and the liquid crystal polymer film 1 and the aluminum foil 3.
- Example 2 As the spacing film (C), a commercially available heat-resistant polyimide film 3 (Tg: 340 ° C., surface roughness Rz: 0.9 ⁇ m on both front and back surfaces) that is non-thermoplastic with a thickness of 50 ⁇ m was used. Thus, a single-sided copper-clad laminate according to Example 2 was obtained.
- Example 2 delamination between the liquid crystal polymer film 1 and the heat-resistant polyimide film 3 after thermocompression bonding was performed very smoothly without any defects, and the front and back surfaces of the collected single-sided copper-clad laminate 5 were visually confirmed. However, no tears, wrinkles, or rough surfaces were observed. In the measurement using the peelable test piece, 0.07 kN / m interfacial peeling was confirmed. Furthermore, evaluation by the adhesion test piece shows that “adhesion” is good, “adhesion variation” is 0.02 kN / m, and the liquid crystal polymer film 1 and the electrolytic copper foil 2 are in-plane. It was confirmed that it was adhered evenly. The results are shown in Table 1.
- Example 3 One side according to Example 3 except that a double-sided copper-clad laminate (Espanex M series (MB12-25-12CEG) manufactured by Nippon Steel Chemical Co., Ltd.) was used as the spacing film (C) A copper clad laminate was obtained.
- This double-sided copper-clad laminate has a polyimide resin with a thickness of 25 ⁇ m as an insulating layer at the center, and a copper foil with a thickness of 12 ⁇ m is provided on both sides, and the surface roughness (Rz of the exposed surface of the copper foil) ) Is 1.0 ⁇ m.
- Example 3 In the manufacture of Example 3, delamination between the liquid crystal polymer film 1 and the heat-resistant polyimide film 3 after thermocompression bonding was performed very smoothly without any defects, and the front and back surfaces of the collected single-sided copper clad laminate 5 were visually observed. As a result of confirmation, no tears, wrinkles, or rough surfaces were observed. Further, in the measurement using the peelability test piece, 0.04 kN / m interface peeling was confirmed, and in the evaluation using the adhesion test piece, “adhesion” was good and “adhesion variation” was 0. It was 03 kN / m, and it was confirmed that the obtained single-sided copper-clad laminate 5 was uniformly bonded in the plane. The results are shown in Table 1.
- Comparative Example 1 The single-sided copper-clad wire according to Comparative Example 1 is the same as Example 1, except that a composite polyimide film having a thickness of 25 ⁇ m and having thermoplastic polyimide on the front and back surfaces is used as the spacing film (C). A laminate was obtained.
- This composite polyimide film is obtained by providing a thermoplastic polyimide of about 2 ⁇ m on both sides of a non-thermoplastic polyimide of about 21 ⁇ m, and the surface roughness (Rz) of the front and back surfaces made of thermoplastic polyimide was 2.3 ⁇ m. It was.
- Comparative Example 1 the composite polyimide film used as the separation film did not peel off well from the liquid crystal polymer film 1 after thermocompression bonding, and it was 0.50 kN / m in the measurement using the peelable test piece, confirming the cohesive failure. It was. Moreover, when the front and back of the collect
- Comparative Example 2 A single-sided copper-clad laminate according to Comparative Example 2 was produced in the same manner as in Example 1 except that the separation film (C) was not used. Although it tried to separate, the liquid crystal polymer film 1 used as the insulating film (A) was heat-sealed, and in the measurement of taking a peelable test piece, it was 0.70 kN / m and cohesive failure was confirmed. It was. The obtained single-sided copper-clad laminate was visually observed to be rough due to cohesive failure on the entire surface of the liquid crystal polymer film, and a single-sided copper-clad laminate with a good appearance could not be obtained.
- Comparative Example 3 One side according to Comparative Example 3 except that the layers were stacked in the order of “electrolytic copper foil 2 / liquid crystal polymer film 1 / aluminum foil 3” between the pair of pressure rolls 4 except for the above. A copper clad laminate was produced.
- Comparative Example 3 only one single-sided copper-clad laminate can be obtained, but delamination between the liquid crystal polymer film 1 and the aluminum foil 3 after thermocompression bonding is performed smoothly, and the recovered single-sided copper-clad laminate 5 No tears, wrinkles, or rough surfaces were observed on the front and back surfaces. Moreover, the interface peeling of 0.01 kN / m was confirmed by the measurement by a peelability test piece, and “adhesion” was acceptable by the evaluation by the adhesion test piece. However, the “variation in adhesion” was 0.17 kN / m, which was found to be inferior to the in-plane adhesion uniformity as compared with the results of the examples.
- Comparative Example 4 Comparative example, except that the aluminum foil 3 / electrolytic copper foil 2 / liquid crystal polymer film 1 / aluminum foil 3 are stacked in this order between the pair of pressure rolls 4 except for the above. A single-sided copper clad laminate according to No. 4 was produced.
- Comparative Example 4 only one single-sided copper-clad laminate can be obtained as in Comparative Example 3, but delamination between the liquid crystal polymer film 1 and the aluminum foil 3 after thermocompression bonding was smoothly performed and the recovered single-sided No tears, wrinkles or surface roughness was observed on the front and back surfaces of the copper clad laminate 5. Moreover, the interface peeling of 0.01 kN / m was confirmed by the measurement by a peelability test piece, and "adhesion” was favorable by the evaluation by an adhesion test piece. However, “adhesion variation” was 0.07 kN / m, which was found to be inferior to the in-plane adhesion uniformity as compared with the results of the examples.
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Abstract
Description
(1)熱可塑性樹脂からなる接着面を有した絶縁性フィルム(A)に金属箔(B)が接着された片面金属張積層体を製造する方法であって、
表裏両面がいずれも表面粗さ(Rz)2.0μm以下である離間フィルム(C)を用いて、一対の加圧ロール(r1、r2)間で(r1)/(B)/(A)/(C)/(A)/(B)/(r2)の順となるように、絶縁性フィルム(A)、金属箔(B)、及び離間フィルム(C)を重ねて熱圧着し、離間フィルム(C)から剥離して2つの片面金属張積層体を得ることを特徴とする片面金属張積層体の製造方法。
(2)絶縁性フィルム(A)が、熱可塑性液晶ポリマーフィルム、又は、少なくとも一方の面に熱可塑性樹脂層を備えた耐熱性樹脂フィルムからなる(1)に記載の片面金属張積層体の製造方法。
(3)離間フィルム(C)が、アルミニウム箔、耐熱性樹脂フィルム、又は樹脂フィルムの表裏面に金属箔を有した複合フィルムからなる(1)又は(2)に記載の片面金属張積層体の製造方法。
(4)離間フィルム(C)の片面もしくは両面が離型処理されている(1)~(3)のいずれかに記載の片面金属張積層体の製造方法。
(5)金属箔(B)が、厚さ1~100μmの銅箔である(1)~(4)のいずれかに記載の片面金属張積層体の製造方法。
(6)熱圧着後の絶縁性フィルム(A)と離間フィルム(C)との層間剥離強度が、0.1kN/m以下である(1)~(5)のいずれかに記載の片面金属張積層体の製造方法。 That is, the gist of the present invention is as follows.
(1) A method for producing a single-sided metal-clad laminate in which a metal foil (B) is bonded to an insulating film (A) having an adhesive surface made of a thermoplastic resin,
Using a separation film (C) whose surface roughness (Rz) is 2.0 μm or less on both front and back surfaces, between the pair of pressure rolls (r 1 , r 2 ), (r 1 ) / (B) / ( The insulating film (A), the metal foil (B), and the separation film (C) are stacked and thermocompression bonded so that they are in the order of A) / (C) / (A) / (B) / (r 2 ). And separating from the separating film (C) to obtain two single-sided metal-clad laminates.
(2) Production of single-sided metal-clad laminate according to (1), wherein the insulating film (A) comprises a thermoplastic liquid crystal polymer film or a heat-resistant resin film having a thermoplastic resin layer on at least one surface. Method.
(3) The single-sided metal-clad laminate according to (1) or (2), wherein the separation film (C) is made of an aluminum foil, a heat-resistant resin film, or a composite film having a metal foil on the front and back surfaces of the resin film. Production method.
(4) The method for producing a single-sided metal-clad laminate according to any one of (1) to (3), wherein one side or both sides of the separation film (C) is subjected to a release treatment.
(5) The method for producing a single-sided metal-clad laminate according to any one of (1) to (4), wherein the metal foil (B) is a copper foil having a thickness of 1 to 100 μm.
(6) The single-sided metal tension according to any one of (1) to (5), wherein the delamination strength between the insulating film (A) and the separating film (C) after thermocompression bonding is 0.1 kN / m or less A manufacturing method of a layered product.
本発明では、一対の加圧ロール(r1、r2)間で、金属箔(B)/絶縁性フィルム(A)/離間フィルム(C)/絶縁性フィルム(A)/金属箔(B)の順となるように重ねて熱圧着し、離間フィルム(C)から剥離して、絶縁性フィルム(A)に金属箔(B)が接着された2つの片面金属張積層体を同時に製造する。 Hereinafter, the present invention will be described in detail.
In the present invention, between the pair of pressure rolls (r 1 , r 2 ), metal foil (B) / insulating film (A) / separating film (C) / insulating film (A) / metal foil (B) The two single-sided metal-clad laminates in which the metal foil (B) is bonded to the insulating film (A) are manufactured at the same time.
(1)芳香族又は脂肪族ジヒドロキシ化合物
(2)芳香族又は脂肪族ジカルボン酸
(3)芳香族ヒドロキシカルボン酸
(4)芳香族ジアミン、芳香族ヒドロキシアミン又は芳香族アミノカルボン酸 Examples of the liquid crystal polymer include known thermotropic liquid crystal polyesters and thermotropic liquid crystal polyester amides derived from the compounds classified into the following (1) to (4) and derivatives thereof.
(1) Aromatic or aliphatic dihydroxy compounds (2) Aromatic or aliphatic dicarboxylic acids (3) Aromatic hydroxycarboxylic acids (4) Aromatic diamines, aromatic hydroxyamines or aromatic aminocarboxylic acids
Among the liquid crystal polymers obtained from these raw material compounds, aromatic liquid crystal polymers that do not contain an aliphatic chain in the molecule are preferred. As a typical example of such a liquid crystal polymer, a copolymer having a structural unit represented by the following formula obtained using 6-hydroxy-2-naphthoic acid and p-hydroxybenzoic acid as raw materials can be given. Incidentally, m 2 and n 2 in the formula is a positive number indicating the presence molar ratio of the respective structural units.
As a precursor used for a thermoplastic polyimide resin, a precursor having a structural unit represented by the following general formula (1) is preferable. In General Formula (1), Ar 3 represents a divalent aromatic group represented by Formula (2), Formula (3), or Formula (4), and Ar 4 represents Formula (5) or Formula (6). R 2 represents independently a monovalent hydrocarbon group or alkoxy group having 1 to 6 carbon atoms, and V and W independently represent a single bond or 1 to 15 carbon atoms. A divalent hydrocarbon group, a divalent group selected from O, S, CO, SO 2 , or CONH, m 1 independently represents an integer of 0 to 4, and p is a molar ratio of the constituent units. And a value of 0.1 to 1.0.
JIS B 0601に準じて、触針式表面粗さ測定器(TENCOR社製、TENCOR P-10)を使用して、荷重100μN、走査速度20μm/秒、測定距離800μmの条件でRz(十点平均粗さ)を測定した。 [Measurement of surface roughness]
In accordance with JIS B 0601, using a stylus type surface roughness measuring instrument (manufactured by TENCOR, TENCOR P-10) under conditions of a load of 100 μN, a scanning speed of 20 μm / second, and a measurement distance of 800 μm (10-point average) (Roughness) was measured.
熱圧着後に離間フィルム(C)を含んだ積層物(B/A/C/A/B)を、加圧ロールの長さ方向に幅10mm、ラミネート進行方向(MD方向)に長さ150mmに切り出した短冊状の剥離性試験片を用意し、絶縁フィルム(A)と離間フィルム(C)との層間剥離性をJIS K 6854-3(T型はく離)に準じて測定した。この際の剥離速度は100mm/分とした。 [Evaluation of peelability of separation film (C)]
A laminate (B / A / C / A / B) containing a separation film (C) after thermocompression bonding is cut into a length of 10 mm in the length direction of the pressure roll and a length of 150 mm in the laminating direction (MD direction). A strip-shaped peelable test piece was prepared, and the interlayer peelability between the insulating film (A) and the separating film (C) was measured according to JIS K 6854-3 (T-type peeling). The peeling speed at this time was 100 mm / min.
得られた片面銅張積層体をラミネート進行方向(MD方向)に長さ150mmに切り出し、市販のエッチング液(アデカケルミカFE-210、株式会社ADEKA製)を用いたサブトラクティブ法により、銅箔をエッチングして、ラミネート進行方向に沿って、幅1mm、長さ100mmの直線導体パターン7を形成した(図3)。この際、直線導体パターン7は、片面金属張積層体の幅方向(加圧ロールの長さ方向)の中央の位置、中央から幅方向左右にそれぞれ30mm離れた位置の3箇所に形成して、密着性試験片とした。この密着性試験片の3本の直線導体パターンについて、絶縁フィルム(A)から剥離する強度をJIS C 6471 8.1 方法B(180°方向引き剥がし)に準じて測定した。そして、3本の剥離強度の平均値が1.0kN/m以上の場合を良好とし、0.5kN/m以上1.0kN/m未満の場合を可とし、0.5kN/m未満の場合を不良とする3段階で「密着性」を評価した。また、3本の剥離強度のうちの最大値と最小値との差を「密着性のばらつき」として評価した。 [Adhesion evaluation of metal-clad laminates]
The obtained single-sided copper clad laminate was cut into a length of 150 mm in the laminating direction (MD direction), and the copper foil was etched by a subtractive method using a commercially available etchant (Adeka Kermica FE-210, manufactured by ADEKA Corporation). Then, a
絶縁性フィルム(A)として、厚さ50μm、幅70mmの液晶ポリマーフィルム1(融点320℃)がロール状に巻かれた長尺フィルムを準備し、金属箔(B)として、厚さ12μm、幅70mmの市販の電解銅箔2(表面粗さRz:絶縁性フィルム積層面1.6μm、露出面1.4μm)がロール状に巻かれた長尺銅箔を準備し、離間フィルム(C)として、厚さ50μm、幅70mmのアルミニウム箔3(表裏ともに表面粗さRz:1.2μm)がロール状に巻かれた長尺アルミ箔を準備した。これらを図1に示すように、絶縁性フィルム繰出しロールA、金属箔繰出しロールB、離間フィルム繰出しロールCにそれぞれセットし、一対の加圧ロール4(r1、r2)の間に、“電解銅箔2/液晶ポリマーフィルム1/アルミニウム箔3/液晶ポリマーフィルム1/電解銅箔2”の順で重なるように供給し(図2)、熱圧着後に自然冷却して、剥離ロール6によりアルミニウム箔3と液晶ポリマーフィルム1とを層間剥離し、アルミニウム箔3は離間フィルム巻取りロールC’で回収し、液晶ポリマーフィルム1と電解銅箔2とが貼り合わされた片面銅張積層体5は、2箇所に設置した製品巻取りロールxでそれぞれ回収するようにした。 Example 1
As the insulating film (A), a long film in which a liquid crystal polymer film 1 (melting point: 320 ° C.) having a thickness of 50 μm and a width of 70 mm is wound is prepared, and a metal foil (B) having a thickness of 12 μm and a width is prepared. A long copper foil in which 70 mm of commercially available electrolytic copper foil 2 (surface roughness Rz: insulating film laminated surface 1.6 μm, exposed surface 1.4 μm) is wound in a roll shape is prepared as a separation film (C) A long aluminum foil in which an
離間フィルム(C)として、厚さ50μmの非熱可塑性である市販の耐熱性ポリイミドフィルム3(Tg:340℃、表裏ともに表面粗さRz:0.9μm)を用いた以外は実施例1と同様にして、実施例2に係る片面銅張積層体を得た。 (Example 2)
As the spacing film (C), a commercially available heat-resistant polyimide film 3 (Tg: 340 ° C., surface roughness Rz: 0.9 μm on both front and back surfaces) that is non-thermoplastic with a thickness of 50 μm was used. Thus, a single-sided copper-clad laminate according to Example 2 was obtained.
離間フィルム(C)として、両面銅張積層体(新日鐵化学社製 エスパネックスMシリーズ(MB12-25-12CEG))を用いた以外は実施例1と同様にして、実施例3に係る片面銅張積層体を得た。この両面銅張積層体は、中心に絶縁層として厚さ25μmのポリイミド樹脂を有し、その両面に厚さ12μmの銅箔がそれぞれ設けられており、銅箔の露出面の表面粗さ(Rz)はいずれも1.0μmである。 (Example 3)
One side according to Example 3 except that a double-sided copper-clad laminate (Espanex M series (MB12-25-12CEG) manufactured by Nippon Steel Chemical Co., Ltd.) was used as the spacing film (C) A copper clad laminate was obtained. This double-sided copper-clad laminate has a polyimide resin with a thickness of 25 μm as an insulating layer at the center, and a copper foil with a thickness of 12 μm is provided on both sides, and the surface roughness (Rz of the exposed surface of the copper foil) ) Is 1.0 μm.
離間フィルム(C)として、厚さ25μmであって、表裏面に熱可塑性ポリイミドを有した複合ポリイミドフィルムを用いるようにした以外は、実施例1と同様にして、比較例1に係る片面銅張積層体を得た。この複合ポリイミドフィルムは、約21μmの非熱可塑性ポリイミドの両側に約2μmの熱可塑性ポリイミドが設けられたものであり、熱可塑性ポリイミドからなる表裏面の表面粗さ(Rz)は2.3μmであった。 (Comparative Example 1)
The single-sided copper-clad wire according to Comparative Example 1 is the same as Example 1, except that a composite polyimide film having a thickness of 25 μm and having thermoplastic polyimide on the front and back surfaces is used as the spacing film (C). A laminate was obtained. This composite polyimide film is obtained by providing a thermoplastic polyimide of about 2 μm on both sides of a non-thermoplastic polyimide of about 21 μm, and the surface roughness (Rz) of the front and back surfaces made of thermoplastic polyimide was 2.3 μm. It was.
離間フィルム(C)を使わずに、それ以外は実施例1と同様にして、比較例2に係る片面銅張積層体を製造したところ、熱圧着して冷却した後に、片面銅張積層体を分離しようとしたが、絶縁性フィルム(A)として用いた液晶ポリマーフィルム1同士が熱融着してしまい、剥離性試験片を採取した測定では0.70kN/mであって凝集破壊が確認された。そして、得られた片面銅張積層体は、目視にて液晶ポリマーフィルムの表面全体に凝集破壊による荒れが確認され、外観が良好な片面銅張積層体を得ることは出来なかった。 (Comparative Example 2)
A single-sided copper-clad laminate according to Comparative Example 2 was produced in the same manner as in Example 1 except that the separation film (C) was not used. Although it tried to separate, the liquid
一対の加圧ロール4の間で“電解銅箔2/液晶ポリマーフィルム1/アルミニウム箔3”の順となるように重ねて、これ以外は実施例1と同様にして、比較例3に係る片面銅張積層体を製造した。 (Comparative Example 3)
One side according to Comparative Example 3 except that the layers were stacked in the order of “
一対の加圧ロール4の間で“アルミニウム箔3/電解銅箔2/液晶ポリマーフィルム1/アルミニウム箔3”の順となるように重ねて、これ以外は実施例1と同様にして、比較例4に係る片面銅張積層体を製造した。 (Comparative Example 4)
Comparative example, except that the
2:電解銅箔(金属箔(B))
3:アルミニウム箔(離間フィルム(C))
4:加圧ロール
5:片面銅張積層体
6:剥離ロール
7:直線導体パターン 1: Liquid crystal polymer film (insulating film (A))
2: Electrolytic copper foil (metal foil (B))
3: Aluminum foil (spaced film (C))
4: Pressure roll 5: Single-sided copper-clad laminate 6: Peeling roll 7: Linear conductor pattern
Claims (6)
- 熱可塑性樹脂からなる接着面を有した絶縁性フィルム(A)に金属箔(B)が接着された片面金属張積層体を製造する方法であって、
表裏両面がいずれも表面粗さ(Rz)2.0μm以下である離間フィルム(C)を用いて、一対の加圧ロール(r1、r2)間で(r1)/(B)/(A)/(C)/(A)/(B)/(r2)の順となるように、絶縁性フィルム(A)、金属箔(B)、及び離間フィルム(C)を重ねて熱圧着し、離間フィルム(C)から剥離して2つの片面金属張積層体を得ることを特徴とする片面金属張積層体の製造方法。 A method for producing a single-sided metal-clad laminate in which a metal foil (B) is bonded to an insulating film (A) having an adhesive surface made of a thermoplastic resin,
Using a separation film (C) whose surface roughness (Rz) is 2.0 μm or less on both front and back surfaces, between the pair of pressure rolls (r 1 , r 2 ), (r 1 ) / (B) / ( The insulating film (A), the metal foil (B), and the separation film (C) are stacked and thermocompression bonded so that they are in the order of A) / (C) / (A) / (B) / (r 2 ). And separating from the separating film (C) to obtain two single-sided metal-clad laminates. - 絶縁性フィルム(A)が、熱可塑性液晶ポリマーフィルム、又は、少なくとも一方の面に熱可塑性樹脂層を備えた耐熱性樹脂フィルムからなる請求項1に記載の片面金属張積層体の製造方法。 The method for producing a single-sided metal-clad laminate according to claim 1, wherein the insulating film (A) comprises a thermoplastic liquid crystal polymer film or a heat-resistant resin film provided with a thermoplastic resin layer on at least one surface.
- 離間フィルム(C)が、アルミニウム箔、耐熱性樹脂フィルム、又は樹脂フィルムの表裏面に金属箔を有した複合フィルムからなる請求項1又は2に記載の片面金属張積層体の製造方法。 The method for producing a single-sided metal-clad laminate according to claim 1 or 2, wherein the separation film (C) is made of an aluminum foil, a heat-resistant resin film, or a composite film having a metal foil on the front and back surfaces of the resin film.
- 離間フィルム(C)の片面もしくは両面が離型処理されている請求項1~3のいずれかに記載の片面金属張積層体の製造方法。 The method for producing a single-sided metal-clad laminate according to any one of claims 1 to 3, wherein one or both sides of the separation film (C) are subjected to a release treatment.
- 金属箔(B)が、厚さ1~100μmの銅箔である請求項1~4のいずれかに記載の片面金属張積層体の製造方法。 The method for producing a single-sided metal-clad laminate according to any one of claims 1 to 4, wherein the metal foil (B) is a copper foil having a thickness of 1 to 100 µm.
- 熱圧着後の絶縁性フィルム(A)と離間フィルム(C)との層間剥離強度が、0.1kN/m以下である請求項1~5のいずれかに記載の片面金属張積層体の製造方法。 The method for producing a single-sided metal-clad laminate according to any one of claims 1 to 5, wherein the delamination strength between the insulating film (A) and the separation film (C) after thermocompression bonding is 0.1 kN / m or less. .
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CN201180007325.7A CN102781661B (en) | 2010-01-29 | 2011-01-28 | Method for manufacturing a laminate with one metal-plated side |
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CN102781661A (en) | 2012-11-14 |
JPWO2011093427A1 (en) | 2013-06-06 |
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JP5661051B2 (en) | 2015-01-28 |
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