WO2011093427A1 - Method for manufacturing a laminate with one metal-plated side - Google Patents

Method for manufacturing a laminate with one metal-plated side Download PDF

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Publication number
WO2011093427A1
WO2011093427A1 PCT/JP2011/051706 JP2011051706W WO2011093427A1 WO 2011093427 A1 WO2011093427 A1 WO 2011093427A1 JP 2011051706 W JP2011051706 W JP 2011051706W WO 2011093427 A1 WO2011093427 A1 WO 2011093427A1
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Prior art keywords
film
metal
clad laminate
insulating film
foil
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PCT/JP2011/051706
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French (fr)
Japanese (ja)
Inventor
昭平 荒井
有起 岡▲崎▼
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新日鐵化学株式会社
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Application filed by 新日鐵化学株式会社 filed Critical 新日鐵化学株式会社
Priority to KR1020127021695A priority Critical patent/KR20120124449A/en
Priority to JP2011551922A priority patent/JP5661051B2/en
Priority to CN201180007325.7A priority patent/CN102781661B/en
Publication of WO2011093427A1 publication Critical patent/WO2011093427A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/22Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
    • B32B37/223One or more of the layers being plastic
    • B32B37/226Laminating sheets, panels or inserts between two continuous plastic layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/16Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/28Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B32B37/025Transfer laminating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/50Properties of the layers or laminate having particular mechanical properties
    • B32B2307/538Roughness
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/50Properties of the layers or laminate having particular mechanical properties
    • B32B2307/546Flexural strength; Flexion stiffness
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/70Other properties
    • B32B2307/732Dimensional properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02Temperature
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/04Time
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/08Dimensions, e.g. volume
    • B32B2309/10Dimensions, e.g. volume linear, e.g. length, distance, width
    • B32B2309/105Thickness
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00Metals, their alloys or their compounds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/08PCBs, i.e. printed circuit boards
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • B32B37/0015Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid warp or curl
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
    • H05K2201/0141Liquid crystal polymer [LCP]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1536Temporarily stacked PCBs

Definitions

  • the present invention relates to a method for producing a single-sided metal-clad laminate in which a metal foil is bonded to an insulating film having an adhesive surface made of a thermoplastic resin.
  • metal foil is applied to insulating films such as polyimide films and liquid crystal polymer films whose surfaces are thermoplastic.
  • a crimped metal-clad laminate is preferably used.
  • a method for producing a laminate having such a structure a method in which an insulating film and a metal foil are transported by a roll-to-roll method and is continuously thermocompressed through a pair of pressure rolls while being heated is generally employed. Yes.
  • Patent Document 1 when a metal foil is thermocompression bonded to one side of an adhesive sheet having a thermoplastic resin layer on both sides of a heat resistant film, a protective material is provided between the pressure surface of the thermocompression bonding apparatus and the adhesive sheet.
  • a method for preventing the thermoplastic resin layer on the side where the metal foil is not laminated from being fused to a metal roll or a protective film has been proposed.
  • the pressure buffering effect for uniformly applying pressure is poor, and particularly when a thin adhesive sheet or a thin metal foil is used, an unadhered portion or a portion with low adhesive strength is generated due to pressure variation.
  • Patent Document 2 when a liquid crystal polymer film and a metal foil are overlapped and thermocompression bonded with a metal pressure roll, a heat resistant resin film is further overlapped and laminated on the side in contact with the metal pressure roll.
  • a method of manufacturing a body has been proposed. According to this method, since a heat-resistant resin film is interposed between the laminate for production and the roll, a certain buffering effect can be expected, but conversely, the heat of the pressure roll is transmitted to the laminate. The thermal effect is hindered, and there is a possibility that the adhesive force between the metal foil and the liquid crystal polymer film is lowered or the adhesive force varies.
  • Patent Document 3 in a method for producing a laminate in which a thermoplastic polymer film and an adherend are pressure-bonded while being heat-treated between rolls, the thermoplastic polymer film and the adherend are overlapped, and from both sides thereof.
  • a method in which a film and an adherend are firmly bonded in a short time by pressing in a state of being sandwiched between covering materials has drawbacks such that the protective material is in direct contact with the heating and pressing surface, so that the protective material is rapidly deteriorated, and the number of reuses of the protective material is reduced, resulting in an increase in manufacturing cost.
  • Patent Document 1 when a thin thermoplastic polymer film or a thin adherend is used, there is a risk of formation of an unbonded portion or a weakly bonded portion, and interlayer voids or wrinkles are generated. There is also a fear.
  • the present invention is excellent in interlaminar adhesion between an insulating film and a metal foil, has no variation in adhesive strength, and suppresses the occurrence of appearance defects such as wrinkles, while producing a single-sided metal-clad laminate with good industrial productivity. It is an object to provide a method that can be manufactured.
  • the present inventors have determined that the combination of the insulating film and the metal foil is symmetric about the distance film so as to be symmetrical up and down.
  • the pressure rolls By stacking and thermocompression bonding with pressure rolls, there is no risk of film fusing to the pressure rolls, and the pressure between the pressure rolls is more evenly transmitted.
  • the gist of the present invention is as follows. (1) A method for producing a single-sided metal-clad laminate in which a metal foil (B) is bonded to an insulating film (A) having an adhesive surface made of a thermoplastic resin, Using a separation film (C) whose surface roughness (Rz) is 2.0 ⁇ m or less on both front and back surfaces, between the pair of pressure rolls (r 1 , r 2 ), (r 1 ) / (B) / ( The insulating film (A), the metal foil (B), and the separation film (C) are stacked and thermocompression bonded so that they are in the order of A) / (C) / (A) / (B) / (r 2 ).
  • a high-quality single-sided metal-clad laminate excellent in interlayer adhesion between an insulating film and a metal foil is produced industrially with high productivity, eliminating wrinkles and variations in adhesive strength. Will be able to. That is, the production method of the present invention can significantly increase the industrial production efficiency and can produce a high-quality single-sided metal-clad laminate at a lower cost than the conventional method. And since the single-sided metal-clad laminate obtained by the present invention is high quality and excellent in reliability, it is suitably used, for example, as a substrate material for circuit boards that require fine pattern formation and multilayer circuit boards. be able to.
  • FIG. 1 is a schematic side view for explaining an apparatus for producing a single-sided metal-clad laminate according to an embodiment of the present invention.
  • FIG. 2 is an enlarged schematic view of the vicinity of the pressure roll.
  • FIG. 3 is a schematic plan view illustrating the test piece used for evaluating the adhesion between the insulating film and the metal foil.
  • metal foil (B) / insulating film (A) / separating film (C) / insulating film (A) / metal foil (B) The two single-sided metal-clad laminates in which the metal foil (B) is bonded to the insulating film (A) are manufactured at the same time.
  • the insulating film (A) used in the present invention has an adhesive surface made of a thermoplastic resin and is particularly capable of bonding the metal foil (B) to the adhesive surface by thermocompression bonding.
  • thermoplastic resin film ii) A thermoplastic resin layer provided on one side of the heat-resistant resin film to form an adhesive surface, iii) Thermoplastic on both sides of the heat-resistant resin film A resin layer is provided, and any of them is used as an adhesive surface of a metal foil.
  • stacked these 1 type (s) or 2 or more types into multiple layers can also be used.
  • insulating film (A) made of a thermoplastic resin film, for example, polyethylene terephthalate resin, polyethylene naphthalate resin, polycarbonate resin, acrylonitrile / styrene copolymer resin, thermoplastic polyimide resin, liquid crystal polymer, etc.
  • a liquid crystal polymer or a thermoplastic polyimide resin is preferably used.
  • liquid crystal polymer examples include known thermotropic liquid crystal polyesters and thermotropic liquid crystal polyester amides derived from the compounds classified into the following (1) to (4) and derivatives thereof.
  • Aromatic or aliphatic dihydroxy compounds (2) Aromatic or aliphatic dicarboxylic acids (3) Aromatic hydroxycarboxylic acids (4) Aromatic diamines, aromatic hydroxyamines or aromatic aminocarboxylic acids
  • liquid crystal polymers obtained from these raw material compounds aromatic liquid crystal polymers that do not contain an aliphatic chain in the molecule are preferred.
  • a copolymer having a structural unit represented by the following formula obtained using 6-hydroxy-2-naphthoic acid and p-hydroxybenzoic acid as raw materials can be given.
  • m 2 and n 2 in the formula is a positive number indicating the presence molar ratio of the respective structural units.
  • the liquid crystal polymer is preferably in the range of 200 to 400 ° C., more preferably in the range of 250 to 350 ° C., and the transition temperature to the optically anisotropic melt phase. It is good to have.
  • the liquid crystal polymer may be blended with, for example, a lubricant, an antioxidant, a filler, and the like, as long as the characteristics are not impaired.
  • Examples of the method for forming a liquid crystal polymer into a film include a T-die method, a laminate stretching method, and an inflation method.
  • the inflation method and the laminate stretching method stress is applied not only in the mechanical axis direction of the film (MD direction) but also in the direction perpendicular to this (TD direction), so the balance of mechanical properties in the MD and TD directions.
  • An excellent film can be obtained.
  • a commercial item can also be used for a liquid crystal polymer film, for example, Kuraray Co., Ltd. Vecstar (registered trademark), Japan Gore-Tex Co., Ltd. BIAC, STABIAX (both are registered trademarks), etc. can be used. .
  • thermoplastic polyimide resin can be formed by imidizing (curing) the precursor polyamic acid, and the polyamic acid reacts with a known diamine and acid anhydride in the presence of a solvent. Can be manufactured.
  • a precursor having a structural unit represented by the following general formula (1) is preferable.
  • Ar 3 represents a divalent aromatic group represented by Formula (2), Formula (3), or Formula (4)
  • Ar 4 represents Formula (5) or Formula (6).
  • R 2 represents independently a monovalent hydrocarbon group or alkoxy group having 1 to 6 carbon atoms
  • V and W independently represent a single bond or 1 to 15 carbon atoms.
  • m 1 independently represents an integer of 0 to 4
  • p is a molar ratio of the constituent units. And a value of 0.1 to 1.0.
  • diamine used examples include 4,4′-diaminodiphenyl ether, 2′-methoxy-4,4′-diaminobenzanilide, 1,4-bis (4-aminophenoxy) benzene, 1,3-bis (4 -Aminophenoxy) benzene, 2,2'-bis [4- (4-aminophenoxy) phenyl] propane, 2,2'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dihydroxy-4,4 Examples include '-diaminobiphenyl and 4,4'-diaminobenzanilide.
  • Examples of the acid anhydride include pyromellitic anhydride, 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride, and 3,3 ′, 4,4′-diphenylsulfonetetracarboxylic dianhydride. Products, 4,4′-oxydiphthalic anhydride and the like.
  • Each of the diamine and the acid anhydride may be used alone or in combination of two or more.
  • a polyimide resin is not limited to what is obtained from the said diamine and an acid anhydride.
  • the film can be formed into a film from a polyamic acid which is a precursor of a polyimide resin by a known method such as a tenter method or a casting method.
  • a tenter method which is one of the typical methods, a polyamic acid solution is cast on a rotating drum, peeled off from the rotating drum in the form of a polyamic acid gel film, and heated and cured (imidized) in a tenter furnace. This is a method of forming a polyimide film.
  • the casting method is a method in which a polyamide acid solution is applied to an arbitrary supporting substrate, dried, and then heat-treated and cured (imidized) to form a polyimide film.
  • the imidization can be performed, for example, by heating at a temperature condition in the range of 80 to 400 ° C. for a time in the range of 1 to 60 minutes.
  • a lubricant, an antioxidant, a filler, etc. can be mix
  • the heat-resistant resin film is not particularly limited as long as its heat deformation temperature is higher than that of the thermoplastic resin layer, but among them, a non-thermoplastic polyimide resin film is preferable.
  • the non-thermoplastic polyimide resin can be produced by reacting a known diamine and an acid anhydride in the presence of a solvent in the same manner as the thermoplastic polyimide. It can be a polyimide resin.
  • non-thermoplastic polyimide resin film for example, Kapton EN, Kapton H, Kapton V (all trade names) manufactured by Toray DuPont Co., Ltd. ), Upilex S (trade name) manufactured by Ube Industries, Ltd., and the like.
  • the non-thermoplastic polyimide resin film preferably has a glass transition temperature of 300 ° C. or higher, and more preferably does not deform at the thermocompression bonding temperature by a roll.
  • thermoplastic resin layer provided on one side or both sides of the heat-resistant resin film may be formed from a resin having a glass transition temperature at least below the heating temperature in thermocompression bonding.
  • a thermoplastic polyimide resin, a thermoplastic liquid crystal polymer, polyetheretherketone, polyethylene naphthalate etc. can be illustrated.
  • this thermoplastic resin layer may be formed by bonding a thermoplastic resin film to a heat resistant resin film, or may be formed by applying a precursor by a cast method or the like.
  • the thickness of the insulating film (A) is preferably 5 to 200 ⁇ m, more preferably 10 to 100 ⁇ m. If the insulating film (A) is too thin, the rigidity is lowered, and problems such as wrinkles and tearing may occur in the manufacturing process of the metal-clad laminate and the processing process of the wiring board using the obtained laminate. On the other hand, if it is too thick, the insulating film lacks flexibility, and roll-to-roll conveyance in the manufacturing process of the metal-clad laminate becomes difficult, and problems such as difficulty in fitting a circuit-processed wiring board into a narrow housing. There is a fear.
  • the material of the metal foil (B) used in the present invention is not particularly limited, and examples thereof include gold, silver, copper, stainless steel, nickel, and aluminum. Of these, copper foil and stainless steel foil are preferred from the viewpoints of conductivity, ease of handling, price, and the like. Of these, any copper foil produced by a rolling method or an electrolytic method can be used.
  • the metal foil is subjected to chemical surface treatment such as acid cleaning, UV treatment and plasma treatment in addition to physical surface treatment such as roughening treatment in advance. Also good.
  • the thickness of the metal foil (B) is preferably 1 to 100 ⁇ m, more preferably 5 to 70 ⁇ m, still more preferably 8 to 20 ⁇ m. It is desirable to reduce the thickness of the metal foil because it is easy to form a fine pattern in circuit processing. However, if it is too thin, the metal foil tends to wrinkle in the manufacturing process of the metal-clad laminate, and the circuit processing is performed. In the wiring board, the wiring is easily broken, and the reliability as the wiring board may be reduced. On the other hand, when the thickness is too thick, when the circuit is formed by etching the metal foil, the side surface of the circuit is likely to be tapered, which is disadvantageous for fine pattern formation.
  • the separation film (C) used in the present invention needs to have heat resistance that can withstand the thermocompression bonding temperature, and needs to be easily peelable from the insulating film (A) after thermocompression bonding.
  • the front and back surfaces of the spacing film (C) are both those having a surface roughness (Rz) of 2.0 ⁇ m or less, preferably 0.5 to 1.5 ⁇ m. Since it is easy to ensure surface smoothness as well as heat resistance, a heat resistant resin film such as a non-thermoplastic polyimide film or polyamide film, or a metal foil such as aluminum foil or stainless steel foil is suitable as the separation film (C). Used.
  • the composite film which has metal foil on the front and back of the resin film can also be used.
  • the surface roughness (Rz) of the front and back surfaces of the separating film (C) exceeds 2.0 ⁇ m, the interlayer adhesion between the insulating film (A) and the separating film (C) is improved by the anchor effect, and the insulating film Defects in appearance such as folds and wrinkles in the single-sided metal-clad laminate due to an increase in peeling resistance when the single-sided metal-clad laminate consisting of (A) and the metal foil (B) is released from the separation film (C) May occur.
  • the separation film (C) may be subjected to a release treatment on one side or both sides of the separation film (C) for the purpose of improving the peelability from the insulating film (A) after thermocompression bonding.
  • a release treatment for example, a method of providing a heat-resistant release resin film such as a silicone resin or a fluorine resin on the separation film (C) can be mentioned.
  • the thickness of the separating film (C) is preferably 10 to 300 ⁇ m, more preferably 20 to 150 ⁇ m, still more preferably 30 to 100 ⁇ m. If the separation film (C) is too thin, the pressure buffering effect that uniformly disperses the pressure during thermocompression bonding is reduced, and the interlayer adhesion between the insulating film (A) and the metal foil (B) of the finished metal-clad laminate is reduced. Variation may occur. On the other hand, when it is too thick, there is a possibility that the roll-to-roll type conveyance may be hindered or the workability when peeling from the metal-clad laminate after thermocompression bonding may be deteriorated.
  • the insulating film (A) is a liquid crystal polymer film having a thickness of 10 to 100 ⁇ m or thermoplastic on at least one surface.
  • a polyimide film having a resin layer is used, a copper foil having a thickness of 5 to 70 ⁇ m is used for the metal foil (B), and the surface roughness (Rz) is 2.0 ⁇ m or less for both the front and back surfaces of the separation film (C). It is preferable to use an aluminum foil having a thickness of 5 to 70 ⁇ m.
  • a pair of pressure rolls (r 1 , r 2 ) was stacked in the order of (r 1 ) / (B) / (A) / (C) / (A) / (B) / (r 2 ).
  • a known heating and pressing apparatus having a pair of pressing rolls equipped with a heating mechanism can be used.
  • a single-sided metal is used for the insulating film (A), the metal foil (B), and the separation film (C).
  • thermoplastic resin of the insulating film (A) be well bonded to the metal layer (B) by deformation or the like. For this reason, it is preferable to carry out at a temperature slightly lower than the Tg or melting point of the thermoplastic resin.
  • a temperature range 5 to 100 ° C. lower than the melting point is preferable, and a temperature range 20 to 80 ° C. lower than the melting point is more preferable.
  • the pressurizing pressure is preferably in the range of 20 to 200 kN / m.
  • the insulating film (A) and the metal foil (B) disposed on both sides of the spacing film (C) are symmetrical with respect to the spacing film (C). Therefore, thermocompression bonding can be performed with the temperature of the pair of pressure rolls (r 1 , r 2 ) being the same, and unnecessary heat loss between the rolls can be prevented. Moreover, since all of the pressure rolls are in contact with the metal foil (B), the heat conduction from the pressure roll is not easily inhibited. And after thermocompression bonding, as will be described in the following examples, the delamination strength between the insulating film (A) and the separation film (C) is 0.1 kN / m or less and can be peeled off very easily.
  • a single-sided metal-clad laminate is obtained from two sets of insulating films (A) and metal foil (B) via a spacing film (C).
  • A insulating films
  • B metal foil
  • C spacing film
  • processing conditions and measurement (evaluation) conditions are as follows.
  • a laminate (B / A / C / A / B) containing a separation film (C) after thermocompression bonding is cut into a length of 10 mm in the length direction of the pressure roll and a length of 150 mm in the laminating direction (MD direction).
  • a strip-shaped peelable test piece was prepared, and the interlayer peelability between the insulating film (A) and the separating film (C) was measured according to JIS K 6854-3 (T-type peeling). The peeling speed at this time was 100 mm / min.
  • An adhesion test piece was obtained. About the three linear conductor patterns of this adhesion test piece, the intensity
  • Example 1 As the insulating film (A), a long film in which a liquid crystal polymer film 1 (melting point: 320 ° C.) having a thickness of 50 ⁇ m and a width of 70 mm is wound is prepared, and a metal foil (B) having a thickness of 12 ⁇ m and a width is prepared.
  • a liquid crystal polymer film 1 melting point: 320 ° C.
  • a long copper foil in which 70 mm of commercially available electrolytic copper foil 2 (surface roughness Rz: insulating film laminated surface 1.6 ⁇ m, exposed surface 1.4 ⁇ m) is wound in a roll shape is prepared as a separation film (C)
  • Electrolytic copper foil 2 / Liquid crystal polymer film 1 / Aluminum foil 3 / Liquid crystal polymer film 1 / Electrolytic copper foil 2 are supplied so as to overlap in this order (FIG. 2), and naturally cooled after thermocompression bonding.
  • the foil 3 and the liquid crystal polymer film 1 are delaminated, the aluminum foil 3 is recovered by a separation film winding roll C ′, and the single-sided copper clad laminate 5 in which the liquid crystal polymer film 1 and the electrolytic copper foil 2 are bonded together is: It was made to collect with the product winding roll x installed in two places, respectively.
  • the electrolytic copper foil 2, the liquid crystal polymer film 1, and the aluminum foil 3 are all moved at a speed of 0.7 m / min, and the pressure between the two rolls is between the pressure rolls 4 having a surface temperature of 240 ° C.
  • the laminate is cooled by natural cooling after thermocompression bonding, and the aluminum foil 3 is collected by the separation film winding roll C ′.
  • the single-sided copper clad laminate 5 according to the above was recovered.
  • the pressure roll 4 of the apparatus used in Example 1 is a carbon steel metal roll having a length of 130 mm and a roll diameter of 150 mm.
  • Example 1 delamination between the liquid crystal polymer film 1 and the aluminum foil 3 after thermocompression bonding was carried out very smoothly without problems, and the recovered liquid crystal polymer film surface and the electrolytic copper foil surface of the single-sided copper clad laminate 5 were When visually confirmed, no tears, wrinkles, or surface roughness were observed.
  • the peelable test piece described above was cut out before entering the peeling roll 6 after being thermocompression bonded with the pressure roll 4, and the liquid crystal polymer film 1 and the aluminum foil 3.
  • Example 2 As the spacing film (C), a commercially available heat-resistant polyimide film 3 (Tg: 340 ° C., surface roughness Rz: 0.9 ⁇ m on both front and back surfaces) that is non-thermoplastic with a thickness of 50 ⁇ m was used. Thus, a single-sided copper-clad laminate according to Example 2 was obtained.
  • Example 2 delamination between the liquid crystal polymer film 1 and the heat-resistant polyimide film 3 after thermocompression bonding was performed very smoothly without any defects, and the front and back surfaces of the collected single-sided copper-clad laminate 5 were visually confirmed. However, no tears, wrinkles, or rough surfaces were observed. In the measurement using the peelable test piece, 0.07 kN / m interfacial peeling was confirmed. Furthermore, evaluation by the adhesion test piece shows that “adhesion” is good, “adhesion variation” is 0.02 kN / m, and the liquid crystal polymer film 1 and the electrolytic copper foil 2 are in-plane. It was confirmed that it was adhered evenly. The results are shown in Table 1.
  • Example 3 One side according to Example 3 except that a double-sided copper-clad laminate (Espanex M series (MB12-25-12CEG) manufactured by Nippon Steel Chemical Co., Ltd.) was used as the spacing film (C) A copper clad laminate was obtained.
  • This double-sided copper-clad laminate has a polyimide resin with a thickness of 25 ⁇ m as an insulating layer at the center, and a copper foil with a thickness of 12 ⁇ m is provided on both sides, and the surface roughness (Rz of the exposed surface of the copper foil) ) Is 1.0 ⁇ m.
  • Example 3 In the manufacture of Example 3, delamination between the liquid crystal polymer film 1 and the heat-resistant polyimide film 3 after thermocompression bonding was performed very smoothly without any defects, and the front and back surfaces of the collected single-sided copper clad laminate 5 were visually observed. As a result of confirmation, no tears, wrinkles, or rough surfaces were observed. Further, in the measurement using the peelability test piece, 0.04 kN / m interface peeling was confirmed, and in the evaluation using the adhesion test piece, “adhesion” was good and “adhesion variation” was 0. It was 03 kN / m, and it was confirmed that the obtained single-sided copper-clad laminate 5 was uniformly bonded in the plane. The results are shown in Table 1.
  • Comparative Example 1 The single-sided copper-clad wire according to Comparative Example 1 is the same as Example 1, except that a composite polyimide film having a thickness of 25 ⁇ m and having thermoplastic polyimide on the front and back surfaces is used as the spacing film (C). A laminate was obtained.
  • This composite polyimide film is obtained by providing a thermoplastic polyimide of about 2 ⁇ m on both sides of a non-thermoplastic polyimide of about 21 ⁇ m, and the surface roughness (Rz) of the front and back surfaces made of thermoplastic polyimide was 2.3 ⁇ m. It was.
  • Comparative Example 1 the composite polyimide film used as the separation film did not peel off well from the liquid crystal polymer film 1 after thermocompression bonding, and it was 0.50 kN / m in the measurement using the peelable test piece, confirming the cohesive failure. It was. Moreover, when the front and back of the collect
  • Comparative Example 2 A single-sided copper-clad laminate according to Comparative Example 2 was produced in the same manner as in Example 1 except that the separation film (C) was not used. Although it tried to separate, the liquid crystal polymer film 1 used as the insulating film (A) was heat-sealed, and in the measurement of taking a peelable test piece, it was 0.70 kN / m and cohesive failure was confirmed. It was. The obtained single-sided copper-clad laminate was visually observed to be rough due to cohesive failure on the entire surface of the liquid crystal polymer film, and a single-sided copper-clad laminate with a good appearance could not be obtained.
  • Comparative Example 3 One side according to Comparative Example 3 except that the layers were stacked in the order of “electrolytic copper foil 2 / liquid crystal polymer film 1 / aluminum foil 3” between the pair of pressure rolls 4 except for the above. A copper clad laminate was produced.
  • Comparative Example 3 only one single-sided copper-clad laminate can be obtained, but delamination between the liquid crystal polymer film 1 and the aluminum foil 3 after thermocompression bonding is performed smoothly, and the recovered single-sided copper-clad laminate 5 No tears, wrinkles, or rough surfaces were observed on the front and back surfaces. Moreover, the interface peeling of 0.01 kN / m was confirmed by the measurement by a peelability test piece, and “adhesion” was acceptable by the evaluation by the adhesion test piece. However, the “variation in adhesion” was 0.17 kN / m, which was found to be inferior to the in-plane adhesion uniformity as compared with the results of the examples.
  • Comparative Example 4 Comparative example, except that the aluminum foil 3 / electrolytic copper foil 2 / liquid crystal polymer film 1 / aluminum foil 3 are stacked in this order between the pair of pressure rolls 4 except for the above. A single-sided copper clad laminate according to No. 4 was produced.
  • Comparative Example 4 only one single-sided copper-clad laminate can be obtained as in Comparative Example 3, but delamination between the liquid crystal polymer film 1 and the aluminum foil 3 after thermocompression bonding was smoothly performed and the recovered single-sided No tears, wrinkles or surface roughness was observed on the front and back surfaces of the copper clad laminate 5. Moreover, the interface peeling of 0.01 kN / m was confirmed by the measurement by a peelability test piece, and "adhesion” was favorable by the evaluation by an adhesion test piece. However, “adhesion variation” was 0.07 kN / m, which was found to be inferior to the in-plane adhesion uniformity as compared with the results of the examples.

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Abstract

Provided is a high-productivity method for industrial manufacture of a laminate with one metal-plated side. Said method results in excellent interlayer adhesion between an insulating film and a metal foil, with no variations in adhesive strength. The provided method also inhibits the formation of aesthetic defects such as wrinkles. The provided method, which manufactures a laminate in which a metal foil (B) is bonded to an insulating film (A) that has an adhesive surface comprising a thermoplastic resin, uses a divider film (C), both sides of which have a surface roughness (Rz) of at most 2.0 μm. Insulating films (A), metal foils (B), and the divider film (C) are layered between a pair of pressure rollers (r1 and r2) in the order r1, B, A, C, A, B, r2 and bonded via thermocompression bonding. Two laminates, each with one metal-plated side, can then be separated from the divider film (C).

Description

片面金属張積層体の製造方法Method for producing single-sided metal-clad laminate
 本発明は、熱可塑性樹脂からなる接着面を有した絶縁性フィルムに金属箔が接着された片面金属張積層体の製造方法に関する。 The present invention relates to a method for producing a single-sided metal-clad laminate in which a metal foil is bonded to an insulating film having an adhesive surface made of a thermoplastic resin.
 近年の電気機器の小型化・軽量化・高機能化に伴い、フレキシブル回路基板の採用が増大しており、例えば表面が熱可塑性を有するポリイミドフィルムや液晶ポリマーフィルム等の絶縁フィルムに金属箔を熱圧着した金属張積層体が好適に用いられている。このような構造を有する積層体の製法としては、絶縁フィルムと金属箔とをロールトゥロール方式で搬送し、加熱しながら一対の加圧ロール間を通して連続的に熱圧着する方法が一般に採用されている。 With the recent reduction in size, weight and functionality of electrical devices, the use of flexible circuit boards has increased. For example, metal foil is applied to insulating films such as polyimide films and liquid crystal polymer films whose surfaces are thermoplastic. A crimped metal-clad laminate is preferably used. As a method for producing a laminate having such a structure, a method in which an insulating film and a metal foil are transported by a roll-to-roll method and is continuously thermocompressed through a pair of pressure rolls while being heated is generally employed. Yes.
 例えば、特許文献1には、耐熱性フィルムの両面に熱可塑性樹脂層を有した接着シートの片面に金属箔を熱圧着する際、熱圧着装置の加圧面と接着シートとの間に保護材料を配置することで、金属箔を積層しない側の熱可塑性樹脂層が金属ロールや保護フィルムに融着するのを防ぐ方法が提案されている。しかしながら、この方法では、加圧を均一に行う為の圧力緩衝効果に乏しく、特に薄い接着シートや薄い金属箔を用いる場合には加圧のバラツキにより、未接着部分や接着強度が弱い部分が生じるおそれのあるほか、接着シートと金属箔との層間に空隙が形成されたりして、しわ等の外観不良が発生するといった不具合がある。 For example, in Patent Document 1, when a metal foil is thermocompression bonded to one side of an adhesive sheet having a thermoplastic resin layer on both sides of a heat resistant film, a protective material is provided between the pressure surface of the thermocompression bonding apparatus and the adhesive sheet. There has been proposed a method for preventing the thermoplastic resin layer on the side where the metal foil is not laminated from being fused to a metal roll or a protective film. However, in this method, the pressure buffering effect for uniformly applying pressure is poor, and particularly when a thin adhesive sheet or a thin metal foil is used, an unadhered portion or a portion with low adhesive strength is generated due to pressure variation. In addition to this, there is a problem that voids are formed between the adhesive sheet and the metal foil, resulting in appearance defects such as wrinkles.
 また、特許文献2には、液晶ポリマーフィルムと金属箔とを重ね合わせて金属加圧ロールで熱圧着させる際に、金属加圧ロールと接触する面側に耐熱性樹脂フィルムを更に重ね合わせて積層体を製造する方法が提案されている。この方法によれば、製造目的の積層体とロールとの間に耐熱性樹脂フィルムを介在させることから一定の緩衝効果は期待できるものの、逆に、加圧ロールの熱を被積層体に伝える伝熱効果が阻害されて、金属箔と液晶ポリマーフィルムとの接着力の低下や、接着力にばらつきが生じるおそれがある。 Further, in Patent Document 2, when a liquid crystal polymer film and a metal foil are overlapped and thermocompression bonded with a metal pressure roll, a heat resistant resin film is further overlapped and laminated on the side in contact with the metal pressure roll. A method of manufacturing a body has been proposed. According to this method, since a heat-resistant resin film is interposed between the laminate for production and the roll, a certain buffering effect can be expected, but conversely, the heat of the pressure roll is transmitted to the laminate. The thermal effect is hindered, and there is a possibility that the adhesive force between the metal foil and the liquid crystal polymer film is lowered or the adhesive force varies.
 また、特許文献3には、熱可塑性ポリマーフィルムと被着体とをロール間で熱処理しながら圧着する積層体の製造方法において、熱可塑性ポリマーフィルムと被着体とを重ね合わせて、その両側から被覆材で挟んだ状態で圧着することにより、フィルムと被着体とを短時間で強固に圧着する方法が提案されている。しかしながら、この方法では、保護材料が加熱加圧面に直接接触するために保護材料の劣化がはやく、保護材料の再利用回数が少なくなるために製造コストが高くなるなどの欠点を有していた。また、特許文献1の場合と同様に、薄い熱可塑性ポリマーフィルムや薄い被着体を用いる場合には、未接着部分や弱接着部分の形成のおそれのほか、層間空隙やしわ等が発生するといったおそれもある。 Further, in Patent Document 3, in a method for producing a laminate in which a thermoplastic polymer film and an adherend are pressure-bonded while being heat-treated between rolls, the thermoplastic polymer film and the adherend are overlapped, and from both sides thereof. There has been proposed a method in which a film and an adherend are firmly bonded in a short time by pressing in a state of being sandwiched between covering materials. However, this method has drawbacks such that the protective material is in direct contact with the heating and pressing surface, so that the protective material is rapidly deteriorated, and the number of reuses of the protective material is reduced, resulting in an increase in manufacturing cost. Similarly to the case of Patent Document 1, when a thin thermoplastic polymer film or a thin adherend is used, there is a risk of formation of an unbonded portion or a weakly bonded portion, and interlayer voids or wrinkles are generated. There is also a fear.
特開2008-272958号公報JP 2008-272958 A WO2004/108397号公報WO 2004/108397 特開2001-88219号公報JP 2001-88219 A
 本発明は、絶縁性フィルムと金属箔との層間密着性に優れて、接着強度にばらつきがなく、しわ等の外観不具合の発生を抑制しながら、工業的に生産性良く片面金属張積層体を製造することができる方法を提供することを目的とする。 The present invention is excellent in interlaminar adhesion between an insulating film and a metal foil, has no variation in adhesive strength, and suppresses the occurrence of appearance defects such as wrinkles, while producing a single-sided metal-clad laminate with good industrial productivity. It is an object to provide a method that can be manufactured.
 本発明者らは、上述した従来技術の問題点を解消するために鋭意研究を行った結果、絶縁性フィルムと金属箔との組み合わせを、離間フィルムを中心にその上下に対称となるように2組重ねて、加圧ロールで熱圧着することで、加圧ロールにフィルムが融着するおそれがなく、しかも、加圧ロール間の圧力がより均一に伝わるようになることから、接着強度のばらつきや、しわの発生等を防ぐことができ、更には、離間フィルムから剥離すれば、このように品質が安定した片面金属張積層体を一度に2組得ることができることを見出し、本発明を完成した。 As a result of intensive studies to solve the above-described problems of the prior art, the present inventors have determined that the combination of the insulating film and the metal foil is symmetric about the distance film so as to be symmetrical up and down. By stacking and thermocompression bonding with pressure rolls, there is no risk of film fusing to the pressure rolls, and the pressure between the pressure rolls is more evenly transmitted. In addition, it is possible to prevent the occurrence of wrinkles and the like, and further, it is found that two sets of single-sided metal-clad laminates with stable quality can be obtained at a time by peeling off from the separation film, and the present invention is completed. did.
 すなわち、本発明の要旨は次のとおりである。
(1)熱可塑性樹脂からなる接着面を有した絶縁性フィルム(A)に金属箔(B)が接着された片面金属張積層体を製造する方法であって、
 表裏両面がいずれも表面粗さ(Rz)2.0μm以下である離間フィルム(C)を用いて、一対の加圧ロール(r1、r2)間で(r1)/(B)/(A)/(C)/(A)/(B)/(r2)の順となるように、絶縁性フィルム(A)、金属箔(B)、及び離間フィルム(C)を重ねて熱圧着し、離間フィルム(C)から剥離して2つの片面金属張積層体を得ることを特徴とする片面金属張積層体の製造方法。
(2)絶縁性フィルム(A)が、熱可塑性液晶ポリマーフィルム、又は、少なくとも一方の面に熱可塑性樹脂層を備えた耐熱性樹脂フィルムからなる(1)に記載の片面金属張積層体の製造方法。
(3)離間フィルム(C)が、アルミニウム箔、耐熱性樹脂フィルム、又は樹脂フィルムの表裏面に金属箔を有した複合フィルムからなる(1)又は(2)に記載の片面金属張積層体の製造方法。
(4)離間フィルム(C)の片面もしくは両面が離型処理されている(1)~(3)のいずれかに記載の片面金属張積層体の製造方法。
(5)金属箔(B)が、厚さ1~100μmの銅箔である(1)~(4)のいずれかに記載の片面金属張積層体の製造方法。
(6)熱圧着後の絶縁性フィルム(A)と離間フィルム(C)との層間剥離強度が、0.1kN/m以下である(1)~(5)のいずれかに記載の片面金属張積層体の製造方法。
That is, the gist of the present invention is as follows.
(1) A method for producing a single-sided metal-clad laminate in which a metal foil (B) is bonded to an insulating film (A) having an adhesive surface made of a thermoplastic resin,
Using a separation film (C) whose surface roughness (Rz) is 2.0 μm or less on both front and back surfaces, between the pair of pressure rolls (r 1 , r 2 ), (r 1 ) / (B) / ( The insulating film (A), the metal foil (B), and the separation film (C) are stacked and thermocompression bonded so that they are in the order of A) / (C) / (A) / (B) / (r 2 ). And separating from the separating film (C) to obtain two single-sided metal-clad laminates.
(2) Production of single-sided metal-clad laminate according to (1), wherein the insulating film (A) comprises a thermoplastic liquid crystal polymer film or a heat-resistant resin film having a thermoplastic resin layer on at least one surface. Method.
(3) The single-sided metal-clad laminate according to (1) or (2), wherein the separation film (C) is made of an aluminum foil, a heat-resistant resin film, or a composite film having a metal foil on the front and back surfaces of the resin film. Production method.
(4) The method for producing a single-sided metal-clad laminate according to any one of (1) to (3), wherein one side or both sides of the separation film (C) is subjected to a release treatment.
(5) The method for producing a single-sided metal-clad laminate according to any one of (1) to (4), wherein the metal foil (B) is a copper foil having a thickness of 1 to 100 μm.
(6) The single-sided metal tension according to any one of (1) to (5), wherein the delamination strength between the insulating film (A) and the separating film (C) after thermocompression bonding is 0.1 kN / m or less A manufacturing method of a layered product.
 本発明によれば、しわの発生や接着強度のばらつきをなくして、絶縁性フィルムと金属箔との層間密着性に優れた高品質の片面金属張積層体を、工業的に生産性良く製造することができるようになる。すなわち、本発明の製造方法は、従来の方法と比べて、工業生産効率を格段に高めることができ、高品質の片面金属張積層体をより低コストで製造することができる。そして、本発明によって得られた片面金属張積層体は、高品質であって信頼性にも優れることから、例えばファインパターン形成が必要な回路基板や、多層回路基板用の基板材料として好適に用いることができる。 According to the present invention, a high-quality single-sided metal-clad laminate excellent in interlayer adhesion between an insulating film and a metal foil is produced industrially with high productivity, eliminating wrinkles and variations in adhesive strength. Will be able to. That is, the production method of the present invention can significantly increase the industrial production efficiency and can produce a high-quality single-sided metal-clad laminate at a lower cost than the conventional method. And since the single-sided metal-clad laminate obtained by the present invention is high quality and excellent in reliability, it is suitably used, for example, as a substrate material for circuit boards that require fine pattern formation and multilayer circuit boards. be able to.
図1は、本発明の実施の形態に係る片面金属張積層体の製造装置を説明する側面模式図である。FIG. 1 is a schematic side view for explaining an apparatus for producing a single-sided metal-clad laminate according to an embodiment of the present invention. 図2は、加圧ロール付近を拡大した模式図である。FIG. 2 is an enlarged schematic view of the vicinity of the pressure roll. 図3は、絶縁性フィルムと金属箔との密着性評価に使用した試験片を説明する平面模式図である。FIG. 3 is a schematic plan view illustrating the test piece used for evaluating the adhesion between the insulating film and the metal foil.
 以下、本発明について詳細に説明する。
 本発明では、一対の加圧ロール(r1、r2)間で、金属箔(B)/絶縁性フィルム(A)/離間フィルム(C)/絶縁性フィルム(A)/金属箔(B)の順となるように重ねて熱圧着し、離間フィルム(C)から剥離して、絶縁性フィルム(A)に金属箔(B)が接着された2つの片面金属張積層体を同時に製造する。
Hereinafter, the present invention will be described in detail.
In the present invention, between the pair of pressure rolls (r 1 , r 2 ), metal foil (B) / insulating film (A) / separating film (C) / insulating film (A) / metal foil (B) The two single-sided metal-clad laminates in which the metal foil (B) is bonded to the insulating film (A) are manufactured at the same time.
 ここで、本発明に用いられる絶縁性フィルム(A)は、熱可塑性樹脂からなる接着面を有して、熱圧着により接着面に金属箔(B)を貼り合わせることができるものであれば特に制限はなく、i)熱可塑性樹脂フィルムからなるもののほか、ii)耐熱性樹脂フィルムの片面側に熱可塑性樹脂層を設けて接着面を形成したもの、iii)耐熱性樹脂フィルムの両面に熱可塑性樹脂層を設けて、いずれかを金属箔の接着面とするもの等が挙げられる。また、これらの1種又は2種以上を重ね合わせて複数層にしたものを使用することもできる。 Here, the insulating film (A) used in the present invention has an adhesive surface made of a thermoplastic resin and is particularly capable of bonding the metal foil (B) to the adhesive surface by thermocompression bonding. There are no restrictions: i) In addition to those made of thermoplastic resin film, ii) A thermoplastic resin layer provided on one side of the heat-resistant resin film to form an adhesive surface, iii) Thermoplastic on both sides of the heat-resistant resin film A resin layer is provided, and any of them is used as an adhesive surface of a metal foil. Moreover, what laminated | stacked these 1 type (s) or 2 or more types into multiple layers can also be used.
 このうち、i)熱可塑性樹脂フィルムからなる絶縁性フィルム(A)としては、例えば、ポリエチレンテレフタラート樹脂、ポリエチレンナフタレート樹脂、ポリカーボネート樹脂、アクリロニトリル・スチレン共重合樹脂、熱可塑性ポリイミド樹脂、液晶ポリマーなどを例示することができ、なかでも、加工性、電気特性、耐熱性等の観点から、液晶ポリマー、又は熱可塑性ポリイミド樹脂が好適に用いられる。 Among these, as i) insulating film (A) made of a thermoplastic resin film, for example, polyethylene terephthalate resin, polyethylene naphthalate resin, polycarbonate resin, acrylonitrile / styrene copolymer resin, thermoplastic polyimide resin, liquid crystal polymer, etc. Among these, from the viewpoint of processability, electrical characteristics, heat resistance, and the like, a liquid crystal polymer or a thermoplastic polyimide resin is preferably used.
 液晶ポリマーについては、次の(1)~(4)に分類される化合物及びその誘導体から導かれる公知のサーモトロピック液晶ポリエステル、サーモトロピック液晶ポリエステルアミド等を挙げることができる。
(1)芳香族又は脂肪族ジヒドロキシ化合物
(2)芳香族又は脂肪族ジカルボン酸
(3)芳香族ヒドロキシカルボン酸
(4)芳香族ジアミン、芳香族ヒドロキシアミン又は芳香族アミノカルボン酸
Examples of the liquid crystal polymer include known thermotropic liquid crystal polyesters and thermotropic liquid crystal polyester amides derived from the compounds classified into the following (1) to (4) and derivatives thereof.
(1) Aromatic or aliphatic dihydroxy compounds (2) Aromatic or aliphatic dicarboxylic acids (3) Aromatic hydroxycarboxylic acids (4) Aromatic diamines, aromatic hydroxyamines or aromatic aminocarboxylic acids
 これらの原料化合物から得られる液晶ポリマーの中でも、分子中に脂肪族鎖を含まない芳香族液晶ポリマーが好ましい。そのような液晶ポリマーの代表例として、6-ヒドロキシ-2-ナフトエ酸と、p-ヒドロキシ安息香酸とを原料として得られる下記式に示す構成単位を有した共重合体を挙げることができる。なお、下記式中のmおよびnは、各構成単位の存在モル比を示す正の数である。
Figure JPOXMLDOC01-appb-I000001
 
Among the liquid crystal polymers obtained from these raw material compounds, aromatic liquid crystal polymers that do not contain an aliphatic chain in the molecule are preferred. As a typical example of such a liquid crystal polymer, a copolymer having a structural unit represented by the following formula obtained using 6-hydroxy-2-naphthoic acid and p-hydroxybenzoic acid as raw materials can be given. Incidentally, m 2 and n 2 in the formula is a positive number indicating the presence molar ratio of the respective structural units.
Figure JPOXMLDOC01-appb-I000001
 液晶ポリマーは、耐熱性と共に、熱圧着における加工性を考慮すると、好ましくは200~400℃の範囲、より好ましくは250~350℃の範囲内に光学的に異方性の溶融相への転移温度を有するものであるのが良い。また、液晶ポリマーには、その特性を損なわない範囲で、例えば滑剤、酸化防止剤、充填剤などを配合することもできる。 In consideration of heat resistance and workability in thermocompression bonding, the liquid crystal polymer is preferably in the range of 200 to 400 ° C., more preferably in the range of 250 to 350 ° C., and the transition temperature to the optically anisotropic melt phase. It is good to have. The liquid crystal polymer may be blended with, for example, a lubricant, an antioxidant, a filler, and the like, as long as the characteristics are not impaired.
 液晶ポリマーをフィルム化する方法としては、例えばTダイ法、ラミネート体延伸法、インフレーション法などが挙げられる。インフレーション法やラミネート体延伸法では、フィルムの機械軸方向(MD方向)だけでなく、これと直行する方向(TD方向)にも応力が加えられるため、MD方向とTD方向における機械的性質のバランスのとれたフィルムを得ることができる。なお、液晶ポリマーフィルムは、市販品を使用することも可能であり、例えば株式会社クラレ製Vecstar(登録商標)や、ジャパンゴアテックス株式会社製BIAC、STABIAX(共に登録商標)などを用いることができる。 Examples of the method for forming a liquid crystal polymer into a film include a T-die method, a laminate stretching method, and an inflation method. In the inflation method and the laminate stretching method, stress is applied not only in the mechanical axis direction of the film (MD direction) but also in the direction perpendicular to this (TD direction), so the balance of mechanical properties in the MD and TD directions. An excellent film can be obtained. In addition, a commercial item can also be used for a liquid crystal polymer film, for example, Kuraray Co., Ltd. Vecstar (registered trademark), Japan Gore-Tex Co., Ltd. BIAC, STABIAX (both are registered trademarks), etc. can be used. .
 また、熱可塑性ポリイミド樹脂については、その前駆体であるポリアミド酸をイミド化(硬化)することによって形成することができ、ポリアミド酸は、公知のジアミンと酸無水物とを溶媒の存在下で反応させて製造することができる。 The thermoplastic polyimide resin can be formed by imidizing (curing) the precursor polyamic acid, and the polyamic acid reacts with a known diamine and acid anhydride in the presence of a solvent. Can be manufactured.
 熱可塑性のポリイミド樹脂に使用される前駆体としては、下記一般式(1)で表される構造単位を有する前駆体が好ましい。一般式(1)において、Arは式(2)、式(3)又は式(4)で表される2価の芳香族基を示し、Arは式(5)又は式(6)で表される4価の芳香族基を示し、Rは独立に炭素数1~6の1価の炭化水素基又はアルコキシ基を示し、V及びWは、独立に単結合又は炭素数1~15の2価の炭化水素基、O、S、CO、SO、又はCONHから選ばれる2価の基を示し、mは独立に0~4の整数を示し、pは構成単位の存在モル比を示し、0.1~1.0の値である。
Figure JPOXMLDOC01-appb-I000002
 
As a precursor used for a thermoplastic polyimide resin, a precursor having a structural unit represented by the following general formula (1) is preferable. In General Formula (1), Ar 3 represents a divalent aromatic group represented by Formula (2), Formula (3), or Formula (4), and Ar 4 represents Formula (5) or Formula (6). R 2 represents independently a monovalent hydrocarbon group or alkoxy group having 1 to 6 carbon atoms, and V and W independently represent a single bond or 1 to 15 carbon atoms. A divalent hydrocarbon group, a divalent group selected from O, S, CO, SO 2 , or CONH, m 1 independently represents an integer of 0 to 4, and p is a molar ratio of the constituent units. And a value of 0.1 to 1.0.
Figure JPOXMLDOC01-appb-I000002
 用いられるジアミンとしては、例えば、4,4’-ジアミノジフェニルエーテル、2’-メトキシ-4,4’-ジアミノベンズアニリド、1,4-ビス(4-アミノフェノキシ)ベンゼン、1,3-ビス(4-アミノフェノキシ)ベンゼン、2,2’-ビス[4-(4-アミノフェノキシ)フェニル]プロパン、2,2’-ジメチル-4,4’-ジアミノビフェニル、3,3’-ジヒドロキシ-4,4’-ジアミノビフェニル、4,4’-ジアミノベンズアニリド等が挙げられる。また、酸無水物としては、例えば、無水ピロメリット酸、3,3’,4,4’-ビフェニルテトラカルボン酸二無水物、3,3’,4,4’-ジフェニルスルフォンテトラカルボン酸二無水物、4,4’-オキシジフタル酸無水物等が挙げられる。ジアミン、及び酸無水物は、それぞれ1種のみを使用してもよく、2種以上を併用することもできる。なお、ポリイミド樹脂は、上記ジアミンと酸無水物から得られるものに限定されることはない。 Examples of the diamine used include 4,4′-diaminodiphenyl ether, 2′-methoxy-4,4′-diaminobenzanilide, 1,4-bis (4-aminophenoxy) benzene, 1,3-bis (4 -Aminophenoxy) benzene, 2,2'-bis [4- (4-aminophenoxy) phenyl] propane, 2,2'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dihydroxy-4,4 Examples include '-diaminobiphenyl and 4,4'-diaminobenzanilide. Examples of the acid anhydride include pyromellitic anhydride, 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride, and 3,3 ′, 4,4′-diphenylsulfonetetracarboxylic dianhydride. Products, 4,4′-oxydiphthalic anhydride and the like. Each of the diamine and the acid anhydride may be used alone or in combination of two or more. In addition, a polyimide resin is not limited to what is obtained from the said diamine and an acid anhydride.
 絶縁性フィルム(A)として熱可塑性ポリイミド樹脂フィルムを用いる場合、そのフィルムは、ポリイミド樹脂の前駆体であるポリアミド酸からテンター法やキャスト法などの公知の手法によってフィルム化することができる。代表的な方法の一つであるテンター法は、回転ドラムにポリアミド酸溶液を流延し、ポリアミド酸のゲルフィルムの状態で回転ドラムから剥離し、テンター炉で加熱・硬化(イミド化)させてポリイミドフィルムとする方法である。キャスト法は、任意の支持基材にポリアミド酸溶液を塗布、乾燥した後、熱処理して硬化(イミド化)させ、ポリイミドフィルムとする方法である。イミド化は、例えば、80~400℃の範囲内の温度条件で1~60分間の範囲内の時間加熱することにより行うことができる。なお、ポリイミド樹脂には、その特性を損なわない範囲で、例えば滑剤、酸化防止剤、充填剤などを配合することもできる。 When a thermoplastic polyimide resin film is used as the insulating film (A), the film can be formed into a film from a polyamic acid which is a precursor of a polyimide resin by a known method such as a tenter method or a casting method. In the tenter method, which is one of the typical methods, a polyamic acid solution is cast on a rotating drum, peeled off from the rotating drum in the form of a polyamic acid gel film, and heated and cured (imidized) in a tenter furnace. This is a method of forming a polyimide film. The casting method is a method in which a polyamide acid solution is applied to an arbitrary supporting substrate, dried, and then heat-treated and cured (imidized) to form a polyimide film. The imidization can be performed, for example, by heating at a temperature condition in the range of 80 to 400 ° C. for a time in the range of 1 to 60 minutes. In addition, a lubricant, an antioxidant, a filler, etc. can be mix | blended with a polyimide resin in the range which does not impair the characteristic, for example.
 絶縁性フィルム(A)として、ii)耐熱性樹脂フィルムの片面側に熱可塑性樹脂層を設けたもの、又は、iii)耐熱性樹脂フィルムの両面に熱可塑性樹脂層を設けたものを用いる場合、この耐熱性樹脂フィルムについては、その熱変形温度が熱可塑性樹脂層よりも高いものであれば特に制限はないが、なかでも好適には、非熱可塑性のポリイミド樹脂フィルムが好ましい。非熱可塑性ポリイミド樹脂は、熱可塑性ポリイミドと同様、公知のジアミンと酸無水物とを溶媒の存在下で反応させて製造することができ、そこで用いる原料の組合せを変更することで、耐熱性のポリイミド樹脂とすることができる。この非熱可塑性ポリイミド樹脂フィルムとして市販品を挙げるとすると、例えば東レ・デュポン株式会社製のカプトンEN、カプトンH、カプトンV(いずれも商品名)、鐘淵化学株式会社製のアピカルNPI(商品名)、宇部興産株式会社製のユーピレックスS(商品名)等を例示することができる。非熱可塑性ポリイミド樹脂フィルムは、ガラス転移温度が300℃以上であることが好ましく、更には、ロールによる熱圧着温度で変形しないものが好ましい。 When using as the insulating film (A), ii) one provided with a thermoplastic resin layer on one side of the heat resistant resin film, or iii) one provided with a thermoplastic resin layer on both sides of the heat resistant resin film, The heat-resistant resin film is not particularly limited as long as its heat deformation temperature is higher than that of the thermoplastic resin layer, but among them, a non-thermoplastic polyimide resin film is preferable. The non-thermoplastic polyimide resin can be produced by reacting a known diamine and an acid anhydride in the presence of a solvent in the same manner as the thermoplastic polyimide. It can be a polyimide resin. As this non-thermoplastic polyimide resin film, for example, Kapton EN, Kapton H, Kapton V (all trade names) manufactured by Toray DuPont Co., Ltd. ), Upilex S (trade name) manufactured by Ube Industries, Ltd., and the like. The non-thermoplastic polyimide resin film preferably has a glass transition temperature of 300 ° C. or higher, and more preferably does not deform at the thermocompression bonding temperature by a roll.
 また、耐熱性樹脂フィルムの片面、又は両面に設けられる熱可塑性樹脂層については、少なくとも熱圧着における加熱温度以下でガラス転位温度を有するような樹脂から形成されたものであればよく、樹脂の種類に特に制限はないが、例えば熱可塑性ポリイミド樹脂、熱可塑性液晶ポリマー、ポリエーテルエーテルケトン、ポリエチレンナフタレート等を例示することができる。なお、この熱可塑性樹脂層は、耐熱性樹脂フィルムに熱可塑性樹脂フィルムを接合させて形成してもよく、前駆体をキャスト法等により塗布して形成するようにしてもよい。 Further, the thermoplastic resin layer provided on one side or both sides of the heat-resistant resin film may be formed from a resin having a glass transition temperature at least below the heating temperature in thermocompression bonding. Although there is no restriction | limiting in particular, For example, a thermoplastic polyimide resin, a thermoplastic liquid crystal polymer, polyetheretherketone, polyethylene naphthalate etc. can be illustrated. In addition, this thermoplastic resin layer may be formed by bonding a thermoplastic resin film to a heat resistant resin film, or may be formed by applying a precursor by a cast method or the like.
 絶縁性フィルム(A)の厚さは、好ましくは5~200μmであるのが良く、より好ましくは10~100μmであるのが良い。絶縁性フィルム(A)が薄過ぎると剛性が低下し、金属張積層体の製造工程や得られた積層体を用いた配線基板の加工工程において、しわや破れ等の不具合が生じるおそれがある。一方、厚過ぎると絶縁性フィルムの柔軟性に欠け、金属張積層体の製造工程におけるロールトゥロール搬送が困難となり、また、回路加工された配線基板も狭小筐体に収まりにくい等の不具合が生じるおそれがある。 The thickness of the insulating film (A) is preferably 5 to 200 μm, more preferably 10 to 100 μm. If the insulating film (A) is too thin, the rigidity is lowered, and problems such as wrinkles and tearing may occur in the manufacturing process of the metal-clad laminate and the processing process of the wiring board using the obtained laminate. On the other hand, if it is too thick, the insulating film lacks flexibility, and roll-to-roll conveyance in the manufacturing process of the metal-clad laminate becomes difficult, and problems such as difficulty in fitting a circuit-processed wiring board into a narrow housing. There is a fear.
 また、本発明に用いられる金属箔(B)の材質は特に制限はなく、例えば金、銀、銅、ステンレス、ニッケル、アルミニウムなどが例示される。なかでも、導電性、取扱いの容易性、価格等の観点から、銅箔やステンレス箔が好適である。このうち銅箔としては、圧延法や電解法によって製造されるいずれのものでも使用することができる。また、金属箔には絶縁フィルムとの接着力向上などを目的として、予め粗化処理等の物理的表面処理のほか、酸洗浄、UV処理、プラズマ処理等の化学的表面処理を施すようにしても良い。 The material of the metal foil (B) used in the present invention is not particularly limited, and examples thereof include gold, silver, copper, stainless steel, nickel, and aluminum. Of these, copper foil and stainless steel foil are preferred from the viewpoints of conductivity, ease of handling, price, and the like. Of these, any copper foil produced by a rolling method or an electrolytic method can be used. In addition, for the purpose of improving the adhesive strength with the insulating film, the metal foil is subjected to chemical surface treatment such as acid cleaning, UV treatment and plasma treatment in addition to physical surface treatment such as roughening treatment in advance. Also good.
 金属箔(B)の厚さについては、1~100μmが好ましく、より好ましくは5~70μm、更に好ましくは8~20μmの範囲であるのが良い。金属箔の厚さを薄くすることは、回路加工においてファインパターンを形成し易いという点で望ましいが、薄過ぎると金属張積層体の製造工程で金属箔にしわが生じ易くなるほか、回路加工された配線基板においても配線の破断が生じ易く、配線基板としての信頼性が低下するおそれがある。反対に厚過ぎると、金属箔をエッチング加工して回路を形成する際に、回路側面にテーパーが生じ易く、ファインパターン形成に不利である。 The thickness of the metal foil (B) is preferably 1 to 100 μm, more preferably 5 to 70 μm, still more preferably 8 to 20 μm. It is desirable to reduce the thickness of the metal foil because it is easy to form a fine pattern in circuit processing. However, if it is too thin, the metal foil tends to wrinkle in the manufacturing process of the metal-clad laminate, and the circuit processing is performed. In the wiring board, the wiring is easily broken, and the reliability as the wiring board may be reduced. On the other hand, when the thickness is too thick, when the circuit is formed by etching the metal foil, the side surface of the circuit is likely to be tapered, which is disadvantageous for fine pattern formation.
 また、本発明に用いる離間フィルム(C)は、熱圧着温度に耐える耐熱性を有する必要があるほか、熱圧着後に絶縁性フィルム(A)と容易に剥離可能である必要がある。後者の観点から、離間フィルム(C)の表裏面は、いずれも表面粗さ(Rz)が2.0μm以下、好ましくは0.5~1.5μmであるものを用いるようにする。耐熱性と共に表面平滑性を確保し易いことから、離間フィルム(C)として、非熱可塑性のポリイミドフィルムやポリアミドフィルム等の耐熱性樹脂フィルム、又は、アルミニウム箔やステンレス箔等の金属箔が好適に用いられる。また、樹脂フィルムの表裏面に金属箔を有した複合フィルムを用いることもできる。離間フィルム(C)の表裏面の表面粗さ(Rz)が2.0μmを超えると、アンカー効果により絶縁性フィルム(A)と離間フィルム(C)との層間密着力が向上し、絶縁性フィルム(A)および金属箔(B)から成る片面金属張積層体を離間フィルム(C)から剥離する際の剥離抵抗が大きくなることで、片面金属張積層体に折れやシワ等の外観上の不具合が生じる恐れがある。 Further, the separation film (C) used in the present invention needs to have heat resistance that can withstand the thermocompression bonding temperature, and needs to be easily peelable from the insulating film (A) after thermocompression bonding. From the latter point of view, the front and back surfaces of the spacing film (C) are both those having a surface roughness (Rz) of 2.0 μm or less, preferably 0.5 to 1.5 μm. Since it is easy to ensure surface smoothness as well as heat resistance, a heat resistant resin film such as a non-thermoplastic polyimide film or polyamide film, or a metal foil such as aluminum foil or stainless steel foil is suitable as the separation film (C). Used. Moreover, the composite film which has metal foil on the front and back of the resin film can also be used. When the surface roughness (Rz) of the front and back surfaces of the separating film (C) exceeds 2.0 μm, the interlayer adhesion between the insulating film (A) and the separating film (C) is improved by the anchor effect, and the insulating film Defects in appearance such as folds and wrinkles in the single-sided metal-clad laminate due to an increase in peeling resistance when the single-sided metal-clad laminate consisting of (A) and the metal foil (B) is released from the separation film (C) May occur.
 離間フィルム(C)については、熱圧着後の絶縁性フィルム(A)との剥離性を向上させる目的で、離間フィルム(C)の片面もしくは両面を離型処理するようにしても良い。離型処理の具体的方法については、例えば離間フィルム(C)にシリコーン樹脂、フッ素系樹脂等の耐熱離型樹脂皮膜を設ける方法等が挙げられる。 The separation film (C) may be subjected to a release treatment on one side or both sides of the separation film (C) for the purpose of improving the peelability from the insulating film (A) after thermocompression bonding. As a specific method of the release treatment, for example, a method of providing a heat-resistant release resin film such as a silicone resin or a fluorine resin on the separation film (C) can be mentioned.
 離間フィルム(C)の厚さについては、10~300μmが好ましく、より好ましくは20~150μm、更に好ましくは30~100μmの範囲であるのが良い。離間フィルム(C)が薄過ぎると、熱圧着時の圧力を均一に分散させる圧力緩衝効果が低下し、出来上がった金属張積層体の絶縁フィルム(A)と金属箔(B)の層間密着性にばらつきが生じるおそれがある。一方、厚過ぎるとロールトゥロール方式の搬送で支障をきたしたり、熱圧着後に金属張積層体から剥離する際の作業性が悪化するおそれがある。 The thickness of the separating film (C) is preferably 10 to 300 μm, more preferably 20 to 150 μm, still more preferably 30 to 100 μm. If the separation film (C) is too thin, the pressure buffering effect that uniformly disperses the pressure during thermocompression bonding is reduced, and the interlayer adhesion between the insulating film (A) and the metal foil (B) of the finished metal-clad laminate is reduced. Variation may occur. On the other hand, when it is too thick, there is a possibility that the roll-to-roll type conveyance may be hindered or the workability when peeling from the metal-clad laminate after thermocompression bonding may be deteriorated.
 絶縁性フィルム(A)、金属箔(B)、及び離間フィルム(C)の組合せとしては、熱圧着工程における取り扱い易さや経済性(材料コスト、離間フィルムのリユース性、等)、および得られる片面金属張積層体の特性(機械特性、電気特性、熱特性、加工性、等)の観点から、絶縁性フィルム(A)には厚さ10~100μmの液晶ポリマーフィルムもしくは少なくとも一方の表面に熱可塑性樹脂層を有するポリイミドフィルムを用い、金属箔(B)には厚さ5~70μmの銅箔を用い、離間フィルム(C)には表裏両面がいずれも表面粗さ(Rz)2.0μm以下であって、且つ厚さ5~70μmのアルミニウム箔を用いることが好ましい。 As a combination of the insulating film (A), the metal foil (B), and the separation film (C), it is easy to handle and economical in the thermocompression bonding process (material cost, reusability of the separation film, etc.), and one side obtained From the viewpoint of the characteristics (mechanical characteristics, electrical characteristics, thermal characteristics, workability, etc.) of the metal-clad laminate, the insulating film (A) is a liquid crystal polymer film having a thickness of 10 to 100 μm or thermoplastic on at least one surface. A polyimide film having a resin layer is used, a copper foil having a thickness of 5 to 70 μm is used for the metal foil (B), and the surface roughness (Rz) is 2.0 μm or less for both the front and back surfaces of the separation film (C). It is preferable to use an aluminum foil having a thickness of 5 to 70 μm.
 一対の加圧ロール(r1、r2)間に、(r1)/(B)/(A)/(C)/(A)/(B)/(r2)の順で重ねられた絶縁性フィルム(A)、金属箔(B)、及び離間フィルム(C)を熱圧着するには、加熱機構を備えた一対の加圧ロールを有する公知の加熱加圧装置を使用することができる。その際、絶縁性フィルム(A)、金属箔(B)、及び離間フィルム(C)について、それぞれロール状に巻かれた長尺材料を加熱加圧装置と組み合わせて用いるようにすれば、片面金属張積層体の連続製造が可能になる。また、加圧ロール温度や加圧ロールの圧力条件については特に制限はないが、絶縁性フィルム(A)の熱可塑性樹脂が変形等により金属層(B)に良好に接着されることが必要であることから、熱可塑性樹脂のTg又は融点よりやや低い温度で行うことがよい。例えば、絶縁性フィルム(A)に液晶ポリマーフィルムを用いる場合、その融点より5~100℃低い温度範囲が好ましく、融点より20~80℃低い温度範囲がより好ましい。その上で、加圧圧力は20~200kN/mの範囲とすることが好ましい。 A pair of pressure rolls (r 1 , r 2 ) was stacked in the order of (r 1 ) / (B) / (A) / (C) / (A) / (B) / (r 2 ). In order to thermocompression-bond the insulating film (A), the metal foil (B), and the separation film (C), a known heating and pressing apparatus having a pair of pressing rolls equipped with a heating mechanism can be used. . At that time, for the insulating film (A), the metal foil (B), and the separation film (C), if a long material wound in a roll shape is used in combination with a heating and pressing apparatus, a single-sided metal is used. Continuous production of a stretched laminate is possible. Moreover, there are no particular limitations on the pressure roll temperature and pressure conditions of the pressure roll, but it is necessary that the thermoplastic resin of the insulating film (A) be well bonded to the metal layer (B) by deformation or the like. For this reason, it is preferable to carry out at a temperature slightly lower than the Tg or melting point of the thermoplastic resin. For example, when a liquid crystal polymer film is used for the insulating film (A), a temperature range 5 to 100 ° C. lower than the melting point is preferable, and a temperature range 20 to 80 ° C. lower than the melting point is more preferable. In addition, the pressurizing pressure is preferably in the range of 20 to 200 kN / m.
 本発明では、離間フィルム(C)を介してその両面側に配置される絶縁性フィルム(A)と金属箔(B)とは、離間フィルム(C)を中心にしてそれぞれ対称の位置関係になるため、一対の加圧ロール(r1、r2)の温度を同じにして熱圧着することができ、ロール間での不要な熱損失を防ぐことができる。また、加圧ロールはいずれも金属箔(B)に接するため、加圧ロールからの熱伝導が阻害されにくい。そして、熱圧着後には、下記実施例で説明するように、絶縁性フィルム(A)と離間フィルム(C)との層間剥離強度が0.1kN/m以下であって極めて容易に剥離することができ、接着強度のばらつきをなくして、しわの発生も防ぐことができ、高品質の片面金属張積層体を生産性良く得ることができる。なお、本発明は、離間フィルム(C)を介して、2組の絶縁性フィルム(A)及び金属箔(B)から片面金属張積層体を得るものであるが、離間フィルム(C)を介して(B)/(A)/(B)の組み合わせを2組用いて、両面に金属箔を有した両面金属張積層体を一度に2つ得るような変形例を検討することもできる。 In the present invention, the insulating film (A) and the metal foil (B) disposed on both sides of the spacing film (C) are symmetrical with respect to the spacing film (C). Therefore, thermocompression bonding can be performed with the temperature of the pair of pressure rolls (r 1 , r 2 ) being the same, and unnecessary heat loss between the rolls can be prevented. Moreover, since all of the pressure rolls are in contact with the metal foil (B), the heat conduction from the pressure roll is not easily inhibited. And after thermocompression bonding, as will be described in the following examples, the delamination strength between the insulating film (A) and the separation film (C) is 0.1 kN / m or less and can be peeled off very easily. It is possible to eliminate variations in adhesive strength, prevent wrinkling, and obtain a high-quality single-sided metal-clad laminate with high productivity. In the present invention, a single-sided metal-clad laminate is obtained from two sets of insulating films (A) and metal foil (B) via a spacing film (C). Thus, it is possible to consider a modification in which two sets of (B) / (A) / (B) are used to obtain two double-sided metal-clad laminates having metal foils on both sides at once.
 次に、実施例により本発明をより具体的に説明するが、本発明はこれらの内容に制限されるものではない。なお、後述する本発明の実施例において、特にことわりのない限り、加工条件、測定(評価)条件は下記によるものである。 Next, the present invention will be described more specifically with reference to examples, but the present invention is not limited to these contents. In the examples of the present invention to be described later, unless otherwise specified, processing conditions and measurement (evaluation) conditions are as follows.
[表面粗さの測定]
 JIS B 0601に準じて、触針式表面粗さ測定器(TENCOR社製、TENCOR P-10)を使用して、荷重100μN、走査速度20μm/秒、測定距離800μmの条件でRz(十点平均粗さ)を測定した。
[Measurement of surface roughness]
In accordance with JIS B 0601, using a stylus type surface roughness measuring instrument (manufactured by TENCOR, TENCOR P-10) under conditions of a load of 100 μN, a scanning speed of 20 μm / second, and a measurement distance of 800 μm (10-point average) (Roughness) was measured.
[離間フィルム(C)の剥離性評価]
 熱圧着後に離間フィルム(C)を含んだ積層物(B/A/C/A/B)を、加圧ロールの長さ方向に幅10mm、ラミネート進行方向(MD方向)に長さ150mmに切り出した短冊状の剥離性試験片を用意し、絶縁フィルム(A)と離間フィルム(C)との層間剥離性をJIS K 6854-3(T型はく離)に準じて測定した。この際の剥離速度は100mm/分とした。
[Evaluation of peelability of separation film (C)]
A laminate (B / A / C / A / B) containing a separation film (C) after thermocompression bonding is cut into a length of 10 mm in the length direction of the pressure roll and a length of 150 mm in the laminating direction (MD direction). A strip-shaped peelable test piece was prepared, and the interlayer peelability between the insulating film (A) and the separating film (C) was measured according to JIS K 6854-3 (T-type peeling). The peeling speed at this time was 100 mm / min.
[金属張積層体の密着性評価]
 得られた片面銅張積層体をラミネート進行方向(MD方向)に長さ150mmに切り出し、市販のエッチング液(アデカケルミカFE-210、株式会社ADEKA製)を用いたサブトラクティブ法により、銅箔をエッチングして、ラミネート進行方向に沿って、幅1mm、長さ100mmの直線導体パターン7を形成した(図3)。この際、直線導体パターン7は、片面金属張積層体の幅方向(加圧ロールの長さ方向)の中央の位置、中央から幅方向左右にそれぞれ30mm離れた位置の3箇所に形成して、密着性試験片とした。この密着性試験片の3本の直線導体パターンについて、絶縁フィルム(A)から剥離する強度をJIS C 6471 8.1 方法B(180°方向引き剥がし)に準じて測定した。そして、3本の剥離強度の平均値が1.0kN/m以上の場合を良好とし、0.5kN/m以上1.0kN/m未満の場合を可とし、0.5kN/m未満の場合を不良とする3段階で「密着性」を評価した。また、3本の剥離強度のうちの最大値と最小値との差を「密着性のばらつき」として評価した。
[Adhesion evaluation of metal-clad laminates]
The obtained single-sided copper clad laminate was cut into a length of 150 mm in the laminating direction (MD direction), and the copper foil was etched by a subtractive method using a commercially available etchant (Adeka Kermica FE-210, manufactured by ADEKA Corporation). Then, a linear conductor pattern 7 having a width of 1 mm and a length of 100 mm was formed along the laminating direction (FIG. 3). At this time, the linear conductor pattern 7 is formed at three positions in the center position in the width direction (length direction of the pressure roll) of the single-sided metal-clad laminate, and 30 mm away from the center in the width direction left and right respectively. An adhesion test piece was obtained. About the three linear conductor patterns of this adhesion test piece, the intensity | strength which peels from an insulating film (A) was measured according to JISC6471 8.1 method B (180 degree direction peeling). And the case where the average value of the three peel strengths is 1.0 kN / m or more is good, the case where it is 0.5 kN / m or more and less than 1.0 kN / m is acceptable, and the case where it is less than 0.5 kN / m “Adhesion” was evaluated in three stages to be defective. Further, the difference between the maximum value and the minimum value among the three peel strengths was evaluated as “adhesion variation”.
(実施例1)
 絶縁性フィルム(A)として、厚さ50μm、幅70mmの液晶ポリマーフィルム1(融点320℃)がロール状に巻かれた長尺フィルムを準備し、金属箔(B)として、厚さ12μm、幅70mmの市販の電解銅箔2(表面粗さRz:絶縁性フィルム積層面1.6μm、露出面1.4μm)がロール状に巻かれた長尺銅箔を準備し、離間フィルム(C)として、厚さ50μm、幅70mmのアルミニウム箔3(表裏ともに表面粗さRz:1.2μm)がロール状に巻かれた長尺アルミ箔を準備した。これらを図1に示すように、絶縁性フィルム繰出しロールA、金属箔繰出しロールB、離間フィルム繰出しロールCにそれぞれセットし、一対の加圧ロール4(r1、r2)の間に、“電解銅箔2/液晶ポリマーフィルム1/アルミニウム箔3/液晶ポリマーフィルム1/電解銅箔2”の順で重なるように供給し(図2)、熱圧着後に自然冷却して、剥離ロール6によりアルミニウム箔3と液晶ポリマーフィルム1とを層間剥離し、アルミニウム箔3は離間フィルム巻取りロールC’で回収し、液晶ポリマーフィルム1と電解銅箔2とが貼り合わされた片面銅張積層体5は、2箇所に設置した製品巻取りロールxでそれぞれ回収するようにした。
Example 1
As the insulating film (A), a long film in which a liquid crystal polymer film 1 (melting point: 320 ° C.) having a thickness of 50 μm and a width of 70 mm is wound is prepared, and a metal foil (B) having a thickness of 12 μm and a width is prepared. A long copper foil in which 70 mm of commercially available electrolytic copper foil 2 (surface roughness Rz: insulating film laminated surface 1.6 μm, exposed surface 1.4 μm) is wound in a roll shape is prepared as a separation film (C) A long aluminum foil in which an aluminum foil 3 having a thickness of 50 μm and a width of 70 mm (surface roughness Rz: 1.2 μm on both sides) was wound in a roll shape was prepared. As shown in FIG. 1, these are set on an insulating film feeding roll A, a metal foil feeding roll B, and a separation film feeding roll C, respectively, and between the pair of pressure rolls 4 (r 1 , r 2 ), “ Electrolytic copper foil 2 / Liquid crystal polymer film 1 / Aluminum foil 3 / Liquid crystal polymer film 1 / Electrolytic copper foil 2 ”are supplied so as to overlap in this order (FIG. 2), and naturally cooled after thermocompression bonding. The foil 3 and the liquid crystal polymer film 1 are delaminated, the aluminum foil 3 is recovered by a separation film winding roll C ′, and the single-sided copper clad laminate 5 in which the liquid crystal polymer film 1 and the electrolytic copper foil 2 are bonded together is: It was made to collect with the product winding roll x installed in two places, respectively.
 そして、電解銅箔2、液晶ポリマーフィルム1、及びアルミニウム箔3をいずれも0.7m/分の速度で移動させて、2つとも表面温度が240℃の加圧ロール4間により、ロール間圧力40kN/mで熱圧着し、熱圧着後は自然冷却により積層物を冷却して、離間フィルム巻取りロールC’でアルミニウム箔3を回収し、2箇所の製品巻取りロールxでは、実施例1に係る片面銅張積層体5をそれぞれ回収した。なお、実施例1で使用した装置の加圧ロール4は、いずれも長さ130mm、ロール径150mmの炭素鋼製金属ロールからなる。 Then, the electrolytic copper foil 2, the liquid crystal polymer film 1, and the aluminum foil 3 are all moved at a speed of 0.7 m / min, and the pressure between the two rolls is between the pressure rolls 4 having a surface temperature of 240 ° C. After thermocompression bonding, the laminate is cooled by natural cooling after thermocompression bonding, and the aluminum foil 3 is collected by the separation film winding roll C ′. The single-sided copper clad laminate 5 according to the above was recovered. Note that the pressure roll 4 of the apparatus used in Example 1 is a carbon steel metal roll having a length of 130 mm and a roll diameter of 150 mm.
 上記実施例1において、熱圧着後の液晶ポリマーフィルム1とアルミニウム箔3の層間剥離は不具合なく極めて順調に行われ、回収された片面銅張積層体5の液晶ポリマーフィルム面及び電解銅箔面をそれぞれ目視にて確認したところ、破れや皺、表面荒れの発生は全く確認されなかった。実施例1に係る片面銅張積層体5の製造途中、加圧ロール4で熱圧着されてから剥離ロール6に入る手前で上述した剥離性試験片を切り出し、液晶ポリマーフィルム1とアルミニウム箔3の層間剥離性を調べたところ、数値が測定されないレベルの界面剥離であって極めて良好に剥離できることが確認された。また、2箇所で回収された片面銅張積層体5の一方から、上述したようにして密着性試験片を作製し、液晶ポリマーフィルム1と電解銅箔2との密着性評価を行ったところ、3本の直線導体パターンで得られた剥離強度の平均値で評価した「密着性」は良好であった。更には、3本の剥離強度のうちの最大値と最小値との差から求めた「密着性のばらつき」は0.03kN/mであり、液晶ポリマーフィルム1と電解銅箔2とが、面内で均一に接着されていることが確認された。結果を表1に示す。 In Example 1 above, delamination between the liquid crystal polymer film 1 and the aluminum foil 3 after thermocompression bonding was carried out very smoothly without problems, and the recovered liquid crystal polymer film surface and the electrolytic copper foil surface of the single-sided copper clad laminate 5 were When visually confirmed, no tears, wrinkles, or surface roughness were observed. During the production of the single-sided copper clad laminate 5 according to Example 1, the peelable test piece described above was cut out before entering the peeling roll 6 after being thermocompression bonded with the pressure roll 4, and the liquid crystal polymer film 1 and the aluminum foil 3. As a result of examining the delamination property, it was confirmed that it was an interfacial delamination level at which the numerical value was not measured and it was possible to exfoliate very well. Moreover, from one side of the single-sided copper clad laminate 5 collected at two locations, an adhesion test piece was prepared as described above, and the adhesion evaluation between the liquid crystal polymer film 1 and the electrolytic copper foil 2 was performed. The “adhesion” evaluated by the average value of the peel strengths obtained with the three linear conductor patterns was good. Furthermore, the “variation in adhesion” obtained from the difference between the maximum value and the minimum value among the three peel strengths is 0.03 kN / m, and the liquid crystal polymer film 1 and the electrolytic copper foil 2 are surfaces. It was confirmed that they were evenly bonded inside. The results are shown in Table 1.
(実施例2)
 離間フィルム(C)として、厚さ50μmの非熱可塑性である市販の耐熱性ポリイミドフィルム3(Tg:340℃、表裏ともに表面粗さRz:0.9μm)を用いた以外は実施例1と同様にして、実施例2に係る片面銅張積層体を得た。
(Example 2)
As the spacing film (C), a commercially available heat-resistant polyimide film 3 (Tg: 340 ° C., surface roughness Rz: 0.9 μm on both front and back surfaces) that is non-thermoplastic with a thickness of 50 μm was used. Thus, a single-sided copper-clad laminate according to Example 2 was obtained.
 この実施例2において、熱圧着後の液晶ポリマーフィルム1と耐熱性ポリイミドフィルム3の層間剥離は不具合なく極めて順調に行われ、回収された片面銅張積層体5の表裏面を目視にて確認したところ、破れや皺、表面荒れの発生は全く確認されなかった。また、剥離性試験片を用いた測定では、0.07kN/mの界面剥離が確認された。更には、密着性試験片による評価は、「密着性」が良好であり、「密着性のばらつき」は0.02kN/mであって、液晶ポリマーフィルム1と電解銅箔2とが、面内で均一に接着されていることが確認された。結果を表1に示す。 In Example 2, delamination between the liquid crystal polymer film 1 and the heat-resistant polyimide film 3 after thermocompression bonding was performed very smoothly without any defects, and the front and back surfaces of the collected single-sided copper-clad laminate 5 were visually confirmed. However, no tears, wrinkles, or rough surfaces were observed. In the measurement using the peelable test piece, 0.07 kN / m interfacial peeling was confirmed. Furthermore, evaluation by the adhesion test piece shows that “adhesion” is good, “adhesion variation” is 0.02 kN / m, and the liquid crystal polymer film 1 and the electrolytic copper foil 2 are in-plane. It was confirmed that it was adhered evenly. The results are shown in Table 1.
(実施例3)
 離間フィルム(C)として、両面銅張積層体(新日鐵化学社製 エスパネックスMシリーズ(MB12-25-12CEG))を用いた以外は実施例1と同様にして、実施例3に係る片面銅張積層体を得た。この両面銅張積層体は、中心に絶縁層として厚さ25μmのポリイミド樹脂を有し、その両面に厚さ12μmの銅箔がそれぞれ設けられており、銅箔の露出面の表面粗さ(Rz)はいずれも1.0μmである。
(Example 3)
One side according to Example 3 except that a double-sided copper-clad laminate (Espanex M series (MB12-25-12CEG) manufactured by Nippon Steel Chemical Co., Ltd.) was used as the spacing film (C) A copper clad laminate was obtained. This double-sided copper-clad laminate has a polyimide resin with a thickness of 25 μm as an insulating layer at the center, and a copper foil with a thickness of 12 μm is provided on both sides, and the surface roughness (Rz of the exposed surface of the copper foil) ) Is 1.0 μm.
 この実施例3の製造において、熱圧着後の液晶ポリマーフィルム1と耐熱性ポリイミドフィルム3の層間剥離は不具合なく極めて順調に行われ、回収された片面銅張積層体5の表裏面を目視にて確認したところ、破れや皺、表面荒れの発生は全く確認されなかった。また、剥離性試験片を用いた測定では、0.04kN/mの界面剥離が確認され、密着性試験片による評価では、「密着性」が良好であり、「密着性のばらつき」は0.03kN/mであって、得られた片面銅張積層体5は、面内で均一に接着されていることが確認された。結果を表1に示す。 In the manufacture of Example 3, delamination between the liquid crystal polymer film 1 and the heat-resistant polyimide film 3 after thermocompression bonding was performed very smoothly without any defects, and the front and back surfaces of the collected single-sided copper clad laminate 5 were visually observed. As a result of confirmation, no tears, wrinkles, or rough surfaces were observed. Further, in the measurement using the peelability test piece, 0.04 kN / m interface peeling was confirmed, and in the evaluation using the adhesion test piece, “adhesion” was good and “adhesion variation” was 0. It was 03 kN / m, and it was confirmed that the obtained single-sided copper-clad laminate 5 was uniformly bonded in the plane. The results are shown in Table 1.
(比較例1)
 離間フィルム(C)として、厚さ25μmであって、表裏面に熱可塑性ポリイミドを有した複合ポリイミドフィルムを用いるようにした以外は、実施例1と同様にして、比較例1に係る片面銅張積層体を得た。この複合ポリイミドフィルムは、約21μmの非熱可塑性ポリイミドの両側に約2μmの熱可塑性ポリイミドが設けられたものであり、熱可塑性ポリイミドからなる表裏面の表面粗さ(Rz)は2.3μmであった。
(Comparative Example 1)
The single-sided copper-clad wire according to Comparative Example 1 is the same as Example 1, except that a composite polyimide film having a thickness of 25 μm and having thermoplastic polyimide on the front and back surfaces is used as the spacing film (C). A laminate was obtained. This composite polyimide film is obtained by providing a thermoplastic polyimide of about 2 μm on both sides of a non-thermoplastic polyimide of about 21 μm, and the surface roughness (Rz) of the front and back surfaces made of thermoplastic polyimide was 2.3 μm. It was.
 この比較例1では、熱圧着後の液晶ポリマーフィルム1から離間フィルムとして用いた複合ポリイミドフィルムがうまく剥がれず、剥離性試験片を用いた測定では0.50kN/mであり、凝集破壊が確認された。また、回収された片面銅張積層体5の表裏面を目視にて確認したところ、液晶ポリマーフィルムの表面全体に凝集破壊による荒れが確認された。一方、密着性試験片による評価では、「密着性」は可であったが、「密着性のばらつき」は0.15kN/mであって、実施例の結果に比べて、片面銅張積層体5の面内での接着性は不均一であることが分った。結果を表1に示す。 In Comparative Example 1, the composite polyimide film used as the separation film did not peel off well from the liquid crystal polymer film 1 after thermocompression bonding, and it was 0.50 kN / m in the measurement using the peelable test piece, confirming the cohesive failure. It was. Moreover, when the front and back of the collect | recovered single-sided copper clad laminated body 5 was confirmed visually, the roughness by the cohesive failure was confirmed on the whole surface of the liquid crystal polymer film. On the other hand, in the evaluation with the adhesion test piece, “adhesion” was acceptable, but “adhesion variation” was 0.15 kN / m, which is a single-sided copper clad laminate compared with the results of the examples. The in-plane adhesion was found to be non-uniform. The results are shown in Table 1.
(比較例2)
 離間フィルム(C)を使わずに、それ以外は実施例1と同様にして、比較例2に係る片面銅張積層体を製造したところ、熱圧着して冷却した後に、片面銅張積層体を分離しようとしたが、絶縁性フィルム(A)として用いた液晶ポリマーフィルム1同士が熱融着してしまい、剥離性試験片を採取した測定では0.70kN/mであって凝集破壊が確認された。そして、得られた片面銅張積層体は、目視にて液晶ポリマーフィルムの表面全体に凝集破壊による荒れが確認され、外観が良好な片面銅張積層体を得ることは出来なかった。
(Comparative Example 2)
A single-sided copper-clad laminate according to Comparative Example 2 was produced in the same manner as in Example 1 except that the separation film (C) was not used. Although it tried to separate, the liquid crystal polymer film 1 used as the insulating film (A) was heat-sealed, and in the measurement of taking a peelable test piece, it was 0.70 kN / m and cohesive failure was confirmed. It was. The obtained single-sided copper-clad laminate was visually observed to be rough due to cohesive failure on the entire surface of the liquid crystal polymer film, and a single-sided copper-clad laminate with a good appearance could not be obtained.
(比較例3)
 一対の加圧ロール4の間で“電解銅箔2/液晶ポリマーフィルム1/アルミニウム箔3”の順となるように重ねて、これ以外は実施例1と同様にして、比較例3に係る片面銅張積層体を製造した。
(Comparative Example 3)
One side according to Comparative Example 3 except that the layers were stacked in the order of “electrolytic copper foil 2 / liquid crystal polymer film 1 / aluminum foil 3” between the pair of pressure rolls 4 except for the above. A copper clad laminate was produced.
 この比較例3では、1つの片面銅張積層体しか得られないが、熱圧着後の液晶ポリマーフィルム1とアルミニウム箔3の層間剥離は順調に行われ、回収された片面銅張積層体5の表裏面に破れや皺、表面荒れは全く確認されなかった。また、剥離性試験片による測定では0.01kN/mの界面剥離が確認され、密着性試験片による評価で「密着性」は可であった。ところが、「密着性のばらつき」は0.17kN/mであって、実施例の結果と比べて、面内での接着均一性に劣ることが分った。 In Comparative Example 3, only one single-sided copper-clad laminate can be obtained, but delamination between the liquid crystal polymer film 1 and the aluminum foil 3 after thermocompression bonding is performed smoothly, and the recovered single-sided copper-clad laminate 5 No tears, wrinkles, or rough surfaces were observed on the front and back surfaces. Moreover, the interface peeling of 0.01 kN / m was confirmed by the measurement by a peelability test piece, and “adhesion” was acceptable by the evaluation by the adhesion test piece. However, the “variation in adhesion” was 0.17 kN / m, which was found to be inferior to the in-plane adhesion uniformity as compared with the results of the examples.
(比較例4)
 一対の加圧ロール4の間で“アルミニウム箔3/電解銅箔2/液晶ポリマーフィルム1/アルミニウム箔3”の順となるように重ねて、これ以外は実施例1と同様にして、比較例4に係る片面銅張積層体を製造した。
(Comparative Example 4)
Comparative example, except that the aluminum foil 3 / electrolytic copper foil 2 / liquid crystal polymer film 1 / aluminum foil 3 are stacked in this order between the pair of pressure rolls 4 except for the above. A single-sided copper clad laminate according to No. 4 was produced.
 この比較例4では、比較例3と同様、1つの片面銅張積層体しか得られないが、熱圧着後の液晶ポリマーフィルム1とアルミニウム箔3の層間剥離は順調に行われ、回収された片面銅張積層体5の表裏面に破れや皺、表面荒れは全く確認されなかった。また、剥離性試験片による測定では0.01kN/mの界面剥離が確認され、密着性試験片による評価で「密着性」は良好であった。ところが、「密着性のばらつき」は0.07kN/mであって、実施例の結果と比べて、面内での接着均一性に劣ることが分った。 In Comparative Example 4, only one single-sided copper-clad laminate can be obtained as in Comparative Example 3, but delamination between the liquid crystal polymer film 1 and the aluminum foil 3 after thermocompression bonding was smoothly performed and the recovered single-sided No tears, wrinkles or surface roughness was observed on the front and back surfaces of the copper clad laminate 5. Moreover, the interface peeling of 0.01 kN / m was confirmed by the measurement by a peelability test piece, and "adhesion" was favorable by the evaluation by an adhesion test piece. However, “adhesion variation” was 0.07 kN / m, which was found to be inferior to the in-plane adhesion uniformity as compared with the results of the examples.
Figure JPOXMLDOC01-appb-T000003
 
Figure JPOXMLDOC01-appb-T000003
 
 以上の結果から、本発明に係る製造方法によれば、しわの発生や接着強度のばらつきをなくして、絶縁性フィルムと金属箔との層間密着性に優れた高品質の片面金属張積層体を、工業的に生産性良く製造できることが分かった。なお、本発明は上記実施の形態に制約されるものではなく、種々の変形が可能である。 From the above results, according to the manufacturing method according to the present invention, a high-quality single-sided metal-clad laminate excellent in interlayer adhesion between the insulating film and the metal foil without wrinkles and variations in adhesive strength is obtained. It was found that it can be produced industrially with high productivity. In addition, this invention is not restrict | limited to the said embodiment, A various deformation | transformation is possible.
1:液晶ポリマーフィルム(絶縁性フィルム(A))
2:電解銅箔(金属箔(B))
3:アルミニウム箔(離間フィルム(C))
4:加圧ロール
5:片面銅張積層体
6:剥離ロール
7:直線導体パターン
1: Liquid crystal polymer film (insulating film (A))
2: Electrolytic copper foil (metal foil (B))
3: Aluminum foil (spaced film (C))
4: Pressure roll 5: Single-sided copper-clad laminate 6: Peeling roll 7: Linear conductor pattern

Claims (6)

  1.  熱可塑性樹脂からなる接着面を有した絶縁性フィルム(A)に金属箔(B)が接着された片面金属張積層体を製造する方法であって、
     表裏両面がいずれも表面粗さ(Rz)2.0μm以下である離間フィルム(C)を用いて、一対の加圧ロール(r1、r2)間で(r1)/(B)/(A)/(C)/(A)/(B)/(r2)の順となるように、絶縁性フィルム(A)、金属箔(B)、及び離間フィルム(C)を重ねて熱圧着し、離間フィルム(C)から剥離して2つの片面金属張積層体を得ることを特徴とする片面金属張積層体の製造方法。
    A method for producing a single-sided metal-clad laminate in which a metal foil (B) is bonded to an insulating film (A) having an adhesive surface made of a thermoplastic resin,
    Using a separation film (C) whose surface roughness (Rz) is 2.0 μm or less on both front and back surfaces, between the pair of pressure rolls (r 1 , r 2 ), (r 1 ) / (B) / ( The insulating film (A), the metal foil (B), and the separation film (C) are stacked and thermocompression bonded so that they are in the order of A) / (C) / (A) / (B) / (r 2 ). And separating from the separating film (C) to obtain two single-sided metal-clad laminates.
  2.  絶縁性フィルム(A)が、熱可塑性液晶ポリマーフィルム、又は、少なくとも一方の面に熱可塑性樹脂層を備えた耐熱性樹脂フィルムからなる請求項1に記載の片面金属張積層体の製造方法。 The method for producing a single-sided metal-clad laminate according to claim 1, wherein the insulating film (A) comprises a thermoplastic liquid crystal polymer film or a heat-resistant resin film provided with a thermoplastic resin layer on at least one surface.
  3.  離間フィルム(C)が、アルミニウム箔、耐熱性樹脂フィルム、又は樹脂フィルムの表裏面に金属箔を有した複合フィルムからなる請求項1又は2に記載の片面金属張積層体の製造方法。 The method for producing a single-sided metal-clad laminate according to claim 1 or 2, wherein the separation film (C) is made of an aluminum foil, a heat-resistant resin film, or a composite film having a metal foil on the front and back surfaces of the resin film.
  4.  離間フィルム(C)の片面もしくは両面が離型処理されている請求項1~3のいずれかに記載の片面金属張積層体の製造方法。 The method for producing a single-sided metal-clad laminate according to any one of claims 1 to 3, wherein one or both sides of the separation film (C) are subjected to a release treatment.
  5.  金属箔(B)が、厚さ1~100μmの銅箔である請求項1~4のいずれかに記載の片面金属張積層体の製造方法。 The method for producing a single-sided metal-clad laminate according to any one of claims 1 to 4, wherein the metal foil (B) is a copper foil having a thickness of 1 to 100 µm.
  6.  熱圧着後の絶縁性フィルム(A)と離間フィルム(C)との層間剥離強度が、0.1kN/m以下である請求項1~5のいずれかに記載の片面金属張積層体の製造方法。 The method for producing a single-sided metal-clad laminate according to any one of claims 1 to 5, wherein the delamination strength between the insulating film (A) and the separation film (C) after thermocompression bonding is 0.1 kN / m or less. .
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