WO2011077416A2 - Mosaïque de del préalablement enduite de pâte thermique - Google Patents

Mosaïque de del préalablement enduite de pâte thermique Download PDF

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Publication number
WO2011077416A2
WO2011077416A2 PCT/IB2011/000321 IB2011000321W WO2011077416A2 WO 2011077416 A2 WO2011077416 A2 WO 2011077416A2 IB 2011000321 W IB2011000321 W IB 2011000321W WO 2011077416 A2 WO2011077416 A2 WO 2011077416A2
Authority
WO
WIPO (PCT)
Prior art keywords
backing material
light source
solid state
state component
thermally conductive
Prior art date
Application number
PCT/IB2011/000321
Other languages
English (en)
Other versions
WO2011077416A3 (fr
Inventor
Robert Tudhope
Alexander Rizkin
Original Assignee
Bridgelux, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bridgelux, Inc. filed Critical Bridgelux, Inc.
Publication of WO2011077416A2 publication Critical patent/WO2011077416A2/fr
Publication of WO2011077416A3 publication Critical patent/WO2011077416A3/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements

Definitions

  • the present disclosure relates to a light emitting diode (LED) array module, and more particularly, to a pre-thermal greased LED array.
  • LED light emitting diode
  • LEDs have been developed for many years and have been widely used in various light applications. As LEDs are light weight, consume less energy, and have a good electrical power to light conversion efficacy, they have been used to replace conventional light sources, such as incandescent lamps and fluorescent light sources. LEDs may be utilized in an array module. Heat is conducted from the LED array to a heat sink. The interface between the LED array and the heat sink may have gaps or voids. As such, a thermal interface material, such as thermal grease, may be used to fill the gaps and voids to aid in conducting heat from the LED array to the heat sink. Whether the thermal grease is applied by hand or by machine, the thermal grease may be misapplied, thus causing variation in thermal grease thickness and/or exposed areas where the thermal grease was not applied. Misapplication of the thermal grease to the LED array may shorten the lifespan of the LED array. As such, there is a need for a method for improving and an apparatus with improved thermal grease application.
  • thermal grease such as thermal grease
  • an apparatus includes a backing material carrying a thermally conductive non-solid substance, and a solid state component set into the thermally conductive non-solid substance.
  • the backing material is arranged with the solid state component so that the backing material may be removed from the apparatus leaving at least a portion of the thermally conductive non-solid substance on the solid state component for mounting to a heat sink.
  • an apparatus includes a backing material, a solid state component, and a thermally conductive non-solid substance between the backing material and the solid state component.
  • the backing material is arranged with the solid state component so that the backing material may be removed from the apparatus leaving at least a portion of the thermally conductive non-solid substance on the solid state component for mounting to a heat sink.
  • an apparatus in one aspect of the disclosure, includes a solid state component and a backing material carrying a thermally conductive non-solid substance.
  • the backing material is attached to the solid state component such that the thermally conductive non-solid substance is between the backing material and the solid state component.
  • the backing material is arranged with the solid state component so that the backing material may be removed from the apparatus leaving at least a portion of the thermally conductive non-solid substance on the solid state component for mounting to a heat sink.
  • a method of producing a module from an apparatus having a backing material, a solid state component, and a thermally conductive non-solid substance between the backing material and the solid state component includes removing the backing material from the apparatus leaving at least a portion of the thermally conductive non-solid substance on the solid state component, and mounting the solid state component to a heat sink with the thermally conductive non-solid substance being between the solid state component and the heat sink.
  • a method of producing a plurality of apparatus includes applying a thermally conductive non-solid substance to a backing material, setting a solid state component into the thermally conductive non-solid substance in each of a plurality of backing material sections, and splitting the backing material into the sections to separate each of the backing sections.
  • an apparatus in one aspect of the disclosure, includes a frame, a solid state component secured to the frame, and a phase change thermal interface material coupled to the solid state component.
  • the phase change thermal interface material is configured to be liquefied to fill voids adjacent the solid state component.
  • FIG. 1 is a conceptual cross-sectional side view illustrating an example of an LED.
  • FIG. 2 is a conceptual top view illustrating an example of a light emitting element.
  • FIG. 3A is a conceptual top view illustrating an example of a white light emitting0 element.
  • FIG. 3B is a conceptual cross-sectional side view of the white light emitting element in FIG. 3A.
  • FIG. 4 is a perspective view of a first LED array module.
  • FIG. 5 is an exploded view of the first LED array module.
  • FIG. 6 is a first perspective view of a second LED array module.
  • FIG. 7 is a second perspective view of the second LED array module.
  • FIG. 8 is an exploded view of the second LED array module.
  • FIG. 9 is a view of a thermal grease sheet.
  • FIG. 10 shows a master slip sheet of a plurality of thermal grease sheets.
  • FIG. 1 1 is an illustration of a thermal grease sheet covering a layer of grease on a surface of an LED array.
  • relative terms such as “lower” or “bottom” and “upper” or “top,” may be used herein to describe one element's relationship to another element as illustrated in the drawings. It will be understood that relative terms are intended to encompass different orientations of an apparatus in addition to the orientation depicted in the drawings. By way of example, if an apparatus in the drawings is turned over, elements described as being on the “lower” side of other elements would then be oriented on the “upper” side of the other elements. The term “lower” can therefore encompass both an orientation of “lower” and “upper,” depending of the particular orientation of the apparatus.
  • LED array module may be illustrated with reference to one or more exemplary configurations.
  • exemplary means "serving as an example, instance, or illustration,” and should not necessarily be construed as preferred or advantageous over other configurations of an LED array module disclosed herein.
  • FIG. 1 is a conceptual cross-sectional side view illustrating an example of an LED.
  • An LED is a semiconductor material impregnated, or doped, with impurities. These impurities add “electrons” and "holes” to the semiconductor, which can move in the material relatively freely.
  • a doped region of the semiconductor can have predominantly electrons or holes, which is referred to as n-type or a p-type semiconductor region, respectively.
  • the semiconductor includes an n-type semiconductor region, a p-type semiconductor region, and an intervening active region between the n-type and p-type semiconductor regions.
  • a forward voltage sufficient to overcome the reverse electric field is applied across the p-n junction, electrons and holes are forced into the active region and combine. When electrons combine with holes, they fall to lower energy levels and release energy in the form of light.
  • the LED 101 includes a substrate 102, an epitaxial-layer structure 104 on the substrate 102, and a pair of electrodes 106 and 108 on the epitaxial-layer structure 104.
  • the epitaxial-layer structure 104 comprises an active region 1 16 sandwiched between two oppositely doped epitaxial regions.
  • an n-type semiconductor region 1 14 is formed on the substrate 102 and a p-type semiconductor region 1 18 is formed on the active region 1 16, however, the regions may be reversed. That is, the p-type semiconductor region 1 18 may be formed on the substrate 102 and the n-type semiconductor region 1 14 may formed on the active region 1 16.
  • epitaxial-layer structure 104 may be extended to any suitable epitaxial -layer structure. Additional layers (not shown) may also be included in the epitaxial-layer structure 104, including but not limited to buffer, nucleation, contact and current spreading layers as well as light extraction layers.
  • the electrodes 106 and 108 may be formed on the surface of the epitaxial-layer structure 104.
  • the p-type semiconductor region 118 is exposed at the top surface, and therefore, the p-type electrode 106 may be readily formed thereon.
  • the n-type semiconductor region 114 is buried beneath the p-type semiconductor region 1 18 and the active region 1 16. Accordingly, to form the n-type electrode 108 on the n-type semiconductor region 1 14, a portion of the active region 1 16 and the p-type semiconductor region 1 18 is removed to expose the n-type semiconductor region 1 14 therebeneath. After this portion of the epitaxial- layer structure 104 is removed, the n-type electrode 108 may be formed.
  • FIG. 2 is a conceptual top view illustrating an example of a light emitting element.
  • a light emitting element 200 is configured with multiple LEDs 201 arranged on a substrate 202.
  • the substrate 202 may be made from any suitable material that provides mechanical support to the LEDs 201.
  • the material is thermally conductive to dissipate heat away from the LEDs 201.
  • the substrate 202 may include a dielectric layer (not shown) to provide electrical insulation between the LEDs 201.
  • the LEDs 201 may be electrically coupled in parallel and/or series by a conductive circuit layer, wire bonding, or a combination of these or other methods on the dielectric layer.
  • the light emitting element may be configured to produce white light.
  • White light may enable the light emitting element to act as a direct replacement for conventional light sources used today in incandescent, halogen and fluorescent lamps.
  • One way is to use individual LEDs that emit wavelengths (such as red, green, blue, amber, or other colors) and then mix all the colors to produce white light.
  • the other way is to use a phosphor material or materials to convert monochromatic light emitted from a blue or ultra-violet (UV) LED to broad-spectrum white light.
  • the present invention may be practiced with other LED and phosphor combinations to produce different color lights.
  • FIG. 3A is a conceptual top view illustrating an example of a white light emitting element
  • FIG. 3B is a conceptual cross-sectional side view of the white light emitting element in FIG. 3A.
  • the white light emitting element 300 is shown with a substrate 302 which may be used to support multiple LEDs 301.
  • the substrate 302 may be configured in a manner similar to that described in connection with FIG. 2 or in some other suitable way.
  • a phosphor material 308 may be deposited within a cavity defined by an annular, or other shaped, or other boundary 310 that extends circumferentially, or in any shape, around the upper surface of the substrate 302.
  • the annular boundary 310 may be formed with a suitable mold, or alternatively, formed separately from the substrate 302 and attached to the substrate 302 using an adhesive or other suitable means.
  • the phosphor material 308 may include, by way of example, phosphor particles suspended in an epoxy, silicone, or other carrier or may be constructed from a soluble phosphor that is dissolved in the carrier.
  • each LED may have its own phosphor layer.
  • various configurations of LEDs and other light emitting cells may be used to create a white light emitting element.
  • the present invention is not limited to solid state lighting devices that produce white light, but may be extended to solid state lighting devices that produce other colors of light.
  • FIG. 4 is a perspective view of a first LED array module 400.
  • FIG. 5 is an exploded view of the first LED array module 400.
  • the LED array module 400 includes a heat sink 402.
  • a printed circuit board 404 may attach to frame 414.
  • the frame 414 may attach to the heat sink 402.
  • the LED array 408 may have a metalized bottom surface for conducting heat away from the substrate of the LED array 408.
  • the LED array 408 may have a thermal grease sheet 406 that can be removed prior to positioning the LED array 408 against the heat sink 402.
  • the primary optical element, the reflector 416 inserts within the frame 414 and attaches to the LED array 408.
  • the secondary optical element, the lens/diffuser 422 may cover the reflector 416.
  • the cover 418 attaches to the frame 414 in order to provide a supporting structure for securing the LED components 402-422 to the reflector 424.
  • FIG. 6 is a first perspective view of a second LED array module 500.
  • FIG. 7 is a second perspective view of the second LED array module 500.
  • FIG. 8 is an exploded view of the second LED array module 500.
  • the LED array module 500 includes a printed circuit board 502 attachable to the frame 504, a frame 504 attachable to the heat sink, an LED array 506 attachable to the frame 504, a removable thermal grease sheet 406 that is attached to a bottom surface of the LED array 506 and is removed prior to attaching the module 500 to a heat sink, a reflector 510 for transforming light from the LED array 506, a cover 512 for covering the LED array 506 and the reflector 510, and a secondary optic 514 for further transforming the light emitted from the LED array 506.
  • the LED array 506 may be the light emitting element 200 or the light emitting element 300.
  • the LED array 506 is sealed within the cover 512 with the silicone o-ring 522 and the rubber grommet 524 that is insertable into a hole in the side of the cover 512.
  • the frame 504 has torsion pins 504' for attaching to the corresponding holes 506' in the LED array 506.
  • the torsion pins 504' extend slightly below the legs 505 of the frame 504.
  • Such a configuration of the legs 505 and torsion pins 504' allow for a constant pressure to be applied against the LED array 506 when the frame 504 is attached to a heat sink.
  • the thermal grease sheet 406 is a phase change thermal interface material. Phase change thermal interface pads melt and liquefy when heated. The liquefied thermal interface material fills micro voids, thus providing better contact between the heat sink and the metalized bottom surface of the LED array 506.
  • the pressure applied by the frame 504 on the LED array 506 takes up any voids left by the displaced liquefied thermal interface material. As such, after the phase change thermal interface pads are melted, the metalized bottom surface of the LED array 506 maintains a good thermal metal-to-metal contact with the heat sink through the liquefied thermal interface material.
  • the thermal grease sheet 406 may be plastic, wax paper, or another suitable material for covering a layer of thermal grease on the bottom surface of the LED array 408, 506.
  • the thermal grease sheet 406 is removed, revealing the layer of grease. The layer of grease conducts heat from the LED array 408, 506 to the heat sink.
  • FIG. 9 is a view of the thermal grease sheet 406.
  • the thermal grease sheet 406 may be plastic, wax paper, silicone, or another suitable material for protecting a layer of grease on the substrate (bottom surface) of the LED array 408, 506 before the LED array 408, 506 is mounted to a heat sink.
  • the thermal grease sheet 406 may include a tab 406' for allowing the grease sheet 406 to be gripped and removed from the layer of grease once the layer of grease is attached to the substrate of the LED array 408, 506.
  • the thermal grease sheet 406 may be referred to as a backing material and the thermal grease may be referred to as a thermally conductive non-solid substance.
  • the thermal grease may also be referred to as a thermal compound, a thermal paste, a thermal lubricant, heat paste, heat sink paste, heat transfer compound, phase change thermal interface material, or heat sink compound.
  • the thermal grease may be silicone grease medium with small, thermally conductive particles.
  • the particles may be ceramic, metal, carbon, or a liquid metal alloy such as gallium.
  • FIG. 10 shows a master slip sheet 1000 of a plurality of thermal grease sheets 406.
  • the master slip sheet 1000 may be prescored along prescore lines 1002. Subsequently, a layer of grease is applied evenly on top of the master slip sheet 1000.
  • the layer of grease may be applied to the master slip sheet 1000 through a silk screening process using a squeegee or a roller to control the even application of the grease to the master slip sheet 1000.
  • the individual thermal grease sheets 406 may be separated individually along the prescore lines 1002 and applied to an LED array.
  • an LED array may be placed onto the grease layer of each individual thermal grease sheet 406, providing pre-thermal greased LED array components that can later be attached to the corresponding frame 414, 504.
  • the thermal grease sheet 406 protects the intervening layer of thermal grease, maintains the even distribution of the layer of grease on the surface of the LED array, and prevents dust or other particles from sticking to the grease layer.
  • the thermal grease sheet 406 is removed from the grease layer to expose the grease layer, and the greasy surface of the LED array is attached to an associated heat sink.
  • FIG. 11 is an illustration 1 100 of a thermal grease sheet 406 covering a layer of grease 1 102 on a bottom surface of an LED array 1104, which may be the LED array 408 or the LED array 506.
  • a grease layer 1102 may be applied to a master slip sheet. Subsequently, sectioned LED arrays may be attached to the grease layer 1102 and the thermal grease sheets 406 may be separated, thus providing a pre-thermal greased LED array 1100.
  • the thermal grease sheet 406 protects the layer of grease 1102 by maintaining the even distribution of the layer of grease 1102 on the LED array 1 104 and by preventing dust or other particles from sticking to the grease.
  • the thermal grease sheet 406 is removed from the grease layer 1 102, as discussed supra.
  • the LED array modules 400, 500 include an LED array.
  • the modules 400, 500 may alternatively include a solid state component, the solid state component being a device built entirely from solid materials in which the electrons are entirely confined within the solid material.
  • the solid state component may be a light source.
  • the light source may be constructed from an array of light emitting semiconductor cells.
  • One example of a light emitting semiconductor cell is an LED.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

La présente invention concerne un matériau de support et un composant à semi-conducteurs. Le matériau de support porte une substance non solide thermoconductrice. Le composant à semi-conducteurs est disposé dans la substance non solide thermoconductrice. Le matériau de support est disposé avec le composant à semi-conducteurs de sorte que le matériau de support puisse être enlevé de l'appareil en laissant au moins une partie de la substance non solide thermoconductrice sur le composant à semi-conducteurs dans le but de permettre le montage d'un drain thermique.
PCT/IB2011/000321 2009-12-23 2011-02-18 Mosaïque de del préalablement enduite de pâte thermique WO2011077416A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/646,596 2009-12-23
US12/646,596 US20110065218A1 (en) 2009-09-14 2009-12-23 Pre-thermal greased led array

Publications (2)

Publication Number Publication Date
WO2011077416A2 true WO2011077416A2 (fr) 2011-06-30
WO2011077416A3 WO2011077416A3 (fr) 2011-08-25

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PCT/IB2011/000321 WO2011077416A2 (fr) 2009-12-23 2011-02-18 Mosaïque de del préalablement enduite de pâte thermique

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US (1) US20110065218A1 (fr)
WO (1) WO2011077416A2 (fr)

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US8585243B2 (en) 2011-06-28 2013-11-19 Osram Sylvania Inc. LED lighting apparatus, systems and methods of manufacture
US8480267B2 (en) * 2011-06-28 2013-07-09 Osram Sylvania Inc. LED lighting apparatus, systems and methods of manufacture

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US20090170226A1 (en) * 2003-08-29 2009-07-02 Philips Lumileds Lighting Company, Llc Package for a Semiconductor Light Emitting Device
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US20080296589A1 (en) * 2005-03-24 2008-12-04 Ingo Speier Solid-State Lighting Device Package

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US20110065218A1 (en) 2011-03-17
WO2011077416A3 (fr) 2011-08-25

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