WO2011068238A1 - 構造体、プリント基板、アンテナ、伝送線路導波管変換器、アレイアンテナ、および電子装置 - Google Patents
構造体、プリント基板、アンテナ、伝送線路導波管変換器、アレイアンテナ、および電子装置 Download PDFInfo
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- WO2011068238A1 WO2011068238A1 PCT/JP2010/071853 JP2010071853W WO2011068238A1 WO 2011068238 A1 WO2011068238 A1 WO 2011068238A1 JP 2010071853 W JP2010071853 W JP 2010071853W WO 2011068238 A1 WO2011068238 A1 WO 2011068238A1
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- conductor element
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/08—Arrays of individually energised antenna units similarly polarised and spaced apart the units being spaced along or adjacent to a rectilinear path
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
Definitions
- the present invention relates to a structure, a printed board, an antenna, a transmission line waveguide converter, an array antenna, and an electronic device.
- a structure including a right-handed left-handed composite medium and having a controlled dispersion relationship with respect to electromagnetic waves, and a printed circuit board, an antenna, a transmission line waveguide converter, an array antenna, an electron including the structure. Relates to the device.
- Metamaterial technology has been proposed as a technology for artificially controlling the dispersion relation of electromagnetic waves propagating in the structure.
- a composite right-handed / left-handed (CRLH) line capable of downsizing an antenna is known.
- the dispersion relationship of the CRLH line is classified into a frequency band (right-handed band) indicating electromagnetic wave transmission characteristics of a right-handed medium and a frequency band (left-handed band) indicating transmission characteristics of a left-handed medium.
- Patent Document 1 discloses an antenna having a configuration in which unit cells including conductor planes, conductor patches, and conductor vias are periodically arranged.
- the antenna disclosed in Patent Document 1 has a structure in which unit cells are periodically arranged, and operates as a CRLH line. Further, the antenna disclosed in Patent Document 1 is configured using line length resonance in the left-handed frequency region of the CRLH line.
- the normal medium is a right-handed medium.
- the right-handed medium has a longer wavelength as the frequency of the electromagnetic wave propagating through the medium is lower. Therefore, an antenna using a normal medium becomes larger as the operating frequency becomes lower.
- the wavelength of the electromagnetic wave becomes shorter as the frequency of the electromagnetic wave propagating in the medium is lower.
- the antenna disclosed in Patent Document 1 includes a conductor element between a conductor plane and a conductor patch. As a result, the antenna disclosed in Patent Document 1 can increase the capacitance between adjacent conductor patches, and can lower the operating frequency band. Further, the antenna disclosed in Patent Document 1 includes a slit in the vicinity of a connection portion between a conductor plane and a conductor via to form a coplanar line. Thereby, the antenna disclosed in Patent Document 1 can increase the inductance between the conductor plane and the conductor patch, and can lower the operating frequency band.
- EBG structure Electromagnetic BandGap
- the EBG structure functions as a magnetic wall that reflects incident electromagnetic waves in phase near the band gap.
- EBG structure is installed on the back side of the antenna, it is possible to reduce the height of the antenna without reducing the radiation efficiency. It is also possible to take measures against noise due to electromagnetic waves using the EBG structure.
- the CRLH line disclosed in Patent Document 1 has a problem that a simple configuration cannot be obtained because it is necessary to provide a conductor via in order to connect the conductor plane and the conductor patch.
- the CRLH line is a left-handed medium or EBG structure, which is an effective structure for miniaturization of electronic devices and noise countermeasures.
- EBG structure is required to have a simple and reliable configuration in order to reduce the size of the electronic device.
- the present invention has been made in view of the above circumstances, and has a simple structure that functions as a CRLH line, a low-cost and highly reliable printed circuit board, an antenna, a transmission line waveguide converter, an array antenna, An object is to provide an electronic device.
- the structure according to the first aspect of the present invention provides: A capacitance between at least one first conductor element, a conductor pattern having at least one second conductor element facing the first conductor element, and the first conductor element and the second conductor element.
- a first medium for generating The first conductor element and the conductor pattern are opposed to each other through the first medium
- the second conductor element includes a line portion having an open end, and has an opening that partially surrounds the line portion, The line portion is continuous with the second conductor element, The opening is surrounded by the second conductor element;
- the first conductor element and the line portion constitute a microstrip line. It is characterized by that.
- an antenna comprising a structure and a power feeding unit,
- the structure is A capacitance between at least one first conductor element, a conductor pattern having at least one second conductor element facing the first conductor element, and the first conductor element and the second conductor element.
- a first medium for generating The first conductor element and the conductor pattern are opposed to each other through the first medium
- the second conductor element includes a line portion having an open end, and has an opening that partially surrounds the line portion, The line portion is continuous with the second conductor element, The opening is surrounded by the second conductor element;
- the power feeding portion is electrically connected to the first conductor element or the conductor pattern of the structure. It is characterized by that.
- a printed circuit board includes: A printed circuit board comprising a structure, The structure is A capacitance between at least one first conductor element, a conductor pattern having at least one second conductor element facing the first conductor element, and the first conductor element and the second conductor element.
- a first medium for generating The first conductor element and the conductor pattern are opposed to each other through the first medium
- the second conductor element includes a line portion having an open end, and has an opening that partially surrounds the line portion, The line portion is continuous with the second conductor element, The opening is surrounded by the second conductor element;
- the first conductor element and the line portion constitute a microstrip line. It is characterized by that.
- a transmission line waveguide converter comprising a structure,
- the structure is A capacitance between at least one first conductor element, a conductor pattern having at least one second conductor element facing the first conductor element, and the first conductor element and the second conductor element.
- a first medium for generating The first conductor element and the conductor pattern are opposed to each other through the first medium
- the second conductor element includes a line portion having an open end, and has an opening that partially surrounds the line portion, The line portion is continuous with the second conductor element, The opening is surrounded by the second conductor element;
- the first conductor element and the line portion constitute a microstrip line. It is characterized by that.
- an array antenna configured by arranging a plurality of array elements on the same plane as an array element including an antenna including a structure and a power feeding unit,
- the structure is A capacitance between at least one first conductor element, a conductor pattern having at least one second conductor element facing the first conductor element, and the first conductor element and the second conductor element.
- a first medium for generating The first conductor element and the conductor pattern are opposed to each other through the first medium,
- the second conductor element includes a line portion having an open end, and has an opening that partially surrounds the line portion, The line portion is continuous with the second conductor element, The opening is surrounded by the second conductor element;
- the power feeding portion is electrically connected to the first conductor element or the conductor pattern of the structure. It is characterized by that.
- an electronic device having a structure and a power feeding unit, and at least one of a transmitter and a receiver connected to the antenna,
- the structure is A capacitance between at least one first conductor element, a conductor pattern having at least one second conductor element facing the first conductor element, and the first conductor element and the second conductor element.
- a first medium for generating The first conductor element and the conductor pattern are opposed to each other through the first medium,
- the second conductor element includes a line portion having an open end, and has an opening that partially surrounds the line portion, The line portion is continuous with the second conductor element, The opening is surrounded by the second conductor element;
- the power feeding portion is electrically connected to the first conductor element or the conductor pattern of the structure. It is characterized by that.
- an electronic device includes: The structure according to the first aspect of the present invention, the antenna according to the second aspect of the present invention, the printed circuit board according to the third aspect of the present invention, and the fourth aspect of the present invention. At least one of the transmission line waveguide converter according to the present invention and the array antenna according to the fifth aspect of the present invention.
- the present invention it is possible to provide a structure having a simple configuration that functions as a CRLH line, a low-cost and highly reliable printed circuit board, an antenna, a transmission line waveguide converter, an array antenna, and an electronic device. .
- FIG. 1st Embodiment is a perspective view
- (b) is a top view
- (c) is sectional drawing. It is a top view of the unit cell arranged one-dimensionally.
- FIG. 6 is an equivalent circuit diagram of unit cells arranged one-dimensionally.
- FIG. 3 is a plan view of a unit cell at a position different from that in FIG. 2.
- FIG. 3 is an equivalent circuit diagram of a unit cell at a position different from that in FIG. 2. It is a graph which shows the dispersion
- (A) of the structure of 4th Embodiment is a top view, (b) is sectional drawing.
- (A) of the structure of 4th Embodiment is a top view of an auxiliary patch, (b) is a top view of a conductor patch, (c) is a top view of a conductor pattern.
- (A) of the antenna of 5th Embodiment is a perspective view, (b) is a top view, (c) is sectional drawing. It is a graph which shows the dispersion
- (A) of the other antenna of 5th Embodiment is a top view
- (b) is sectional drawing.
- (A) of the other antenna of 5th Embodiment is a perspective view
- (b) is a top view. It is a top view of the other antenna of 5th Embodiment. It is a perspective view of the other antenna of 5th Embodiment. It is a top view of the other antenna of 5th Embodiment.
- (A) of the printed circuit board of 7th Embodiment is a top view
- (b) is sectional drawing.
- (A) of the transmission line waveguide converter of 8th Embodiment is sectional drawing
- (b) is a top view. It is a conceptual diagram of the array antenna of 9th Embodiment.
- the structure 1 includes a conductor plane 11 as a first conductor element and a conductor pattern 19 that faces the conductor plane 11.
- the conductor pattern 19 is disposed away from the conductor plane 11 and overlaps the conductor plane 11 in the separated direction.
- the conductor pattern 19 includes a conductor patch 12 as a second conductor element and a wiring 14 as a line portion.
- the conductor plane 11 and the conductor patch 12 are made of, for example, a conductor thin plate or a conductor thin film.
- the conductor plane 11 is provided on one surface of the dielectric substrate 10, for example, and the conductor patch 12 is provided on the other surface of the dielectric substrate 10, for example.
- the dielectric substrate 10 is, for example, an epoxy resin substrate or a ceramic substrate.
- the conductor pattern 19 includes a plurality of conductor patches 12.
- Each conductor patch 12 has an opening 13 and includes a wiring 14.
- the conductor patches 12 are arranged at substantially equal pitches along the x direction and y direction, and are arranged at substantially equal pitches in the y direction.
- Each conductor patch 12 is disposed so as to face the conductor plane 11.
- the plurality of conductor patches 12 are spaced apart from each other.
- the planar shape of the conductor patch 12 is not particularly limited, but is, for example, a substantially frame shape whose outer shape is a substantially square shape.
- the wiring 14 has one or more open ends 141, is continuous with the conductor patch 12 at the connection portion 142, and is arranged to extend inside the frame shape of the conductor patch 12.
- the planar shape of the wiring 14 is not particularly limited, but is, for example, a substantially straight belt shape.
- the width of the wiring 14 is substantially uniform.
- the wiring 14 is formed integrally with the conductor patch 12, but is not limited thereto, and may be formed independently of the conductor patch 12. Further, as shown in FIG. 1C, the wiring 14 and the portion of the conductor plane 11 that faces the wiring 14 constitute a microstrip line 16.
- An opening 13 is provided between the conductor patch 12 and the wiring 14.
- the opening 13 surrounds the wiring 14 except for the connection portion 142. That is, the conductor patch 12 has a structure in which the opening 13 is provided and the wiring 14 is provided inside the opening 13.
- the conductor patch 12, the opening 13, and the wiring 14 are formed on the same plane.
- the planar shape of the opening 13 is not particularly limited, but is substantially square, for example, similarly to the shape of the periphery on the conductor patch 12 side (hereinafter referred to as the outer periphery of the opening).
- the wiring 14 is made of the same material as the conductor patch 12. For example, a thin conductor plate is used as a base material, and a substantially U-shaped opening 13 is formed in the base material. As a result, the wiring 14 is integrated with the conductor patch 12. If the wiring 14 is formed integrally with the conductor patch 12, the number of man-hours is reduced as compared with the case where the conductor patch 12 and the wiring 14 are formed independently. Further, by integrating the wiring 14 and the conductor patch 12, the contact resistance between the wiring 14 and the conductor patch 12 can be eliminated.
- the structure 1 includes a plurality of unit cells 15.
- the unit cell 15 is a part having a region partitioned with the same pitch as the conductor patch 12. For example, if the pitch in the x direction of the conductor patch 12 is Pa and the pitch in the y direction of the conductor patch 12 is Pa, the unit cell 15 has a dimension in the x direction as Pa and a dimension in the y direction as Pa. Has a square area.
- the unit cell 15 includes one conductor patch 12, a portion of the conductor plane 11 that faces the conductor patch 12, and a wiring 14 that is electrically connected to the conductor patch 12.
- the structure 1 has a configuration in which unit cells 15 are two-dimensionally arranged. Each of the unit cells 15 has substantially the same size and shape as the conductor patch 12, the opening 13, and the wiring 14 included in the unit cell 15. Thus, the design of the structure 1 is facilitated by aligning the shapes and dimensions of the constituent elements in the plurality of unit cells 15.
- the unit cells 15 are configured as shown in FIG. 2 when arranged in a unified manner. At this time, an equivalent circuit of one unit cell 15 is a circuit as shown in FIG. In the equivalent circuit diagram per unit cell 15 when the unit cells 15 are two-dimensionally arranged, the unit cells 15 are arranged one-dimensionally when focusing on the circuit configuration in one direction in which the unit cells 15 are arranged. It is the same as the equivalent circuit diagram per unit cell 15 in the case of
- the capacitance C R denotes a capacitance per unit cell 15 produced between the conductor patch 12 and the conductor plane 11, the inductance L R is generated between the conductor patch 12 and conductive plane 11 It means the inductance per unit cell 15.
- Capacitance C L denotes the capacitance between two adjacent conductor patches 12.
- the microstrip line 16 is shunt in parallel with the capacitor C R is meant that the wire 14 is continuous with the conductor patches 12 in only a part (connection part 142). Since the wiring 14 includes the open end 141, the termination of the microstrip line 16 is open. As described above, if the width of the wiring 14 is substantially uniform, the distribution of inductance and capacitance for each portion of the wiring 14 is uniform in the wiring 14, and the characteristics of the EBG structure described later and the left-handed medium are obtained. The characteristics are improved.
- the equivalent circuit of the unit cell 15b which is the region as shown in FIG. 4 is a circuit as shown in FIG.
- the unit cell 15 shown in FIG. 2 is a region centered on the wiring 14, whereas the unit cell 15b shown in FIG. 4 is a region having the wiring 14 at the end.
- the position of the unit cell 15b is shifted from the position of the unit 15 in the x direction.
- the equivalent circuit shown in FIG. 3 is compared with the equivalent circuit shown in FIG. 5, the equivalent circuit per unit cell differs due to the difference in the unit cell layout.
- the characteristics of the electromagnetic wave propagating in the surface direction of the structure 1 do not depend on how to take the unit cells. That is, the characteristics of the electromagnetic wave propagating through the structure 1 are determined by the frequency characteristics of the impedance Z and the admittance Y in the equivalent circuit diagram shown in FIG.
- the electromagnetic wave propagation characteristics of the structure 1 are represented by a graph as shown in FIG.
- the vertical axis represents the frequency f
- the solid line represents the dispersion relationship (dispersion curve) of this embodiment when it is assumed that the unit cells 15 are periodically arranged in the structure 1.
- An alternate long and two short dashes line is a dispersion relationship of the comparative example, in which the conductor plane 11 is arranged in place of the conductor patch 12 and the wiring 14, that is, a parallel plate waveguide in which two conductor plates are arranged in parallel to each other. Represents.
- the wave number ⁇ and the frequency f have a proportional relation.
- a medium exhibiting a dispersion relation in which the frequency f increases as the wave number ⁇ increases is called a right-handed medium.
- a medium showing a dispersion relation in which the frequency f decreases as the wave number ⁇ increases is called a left-handed medium.
- the dispersion characteristic of the structure 1 indicated by a solid line includes a right-handed band in which the frequency f increases as the wave number ⁇ increases, and a left-handed band in which the frequency f decreases as the wave number ⁇ increases. Between the right-handed band and the left-handed band, there is a band gap in which propagation of electromagnetic waves is prohibited.
- the resonator can be made smaller, for example, the resonator antenna can be made smaller. That is, the resonator can be miniaturized by satisfying the condition that the wave number ⁇ with respect to the frequency f is larger than that of the comparative example.
- the structure of an Example becomes a magnetic wall which reflects the electromagnetic wave of the frequency band corresponding to a band gap in the same phase, for example, can also function as a reflecting plate which reflects a predetermined electromagnetic wave.
- the left-handed band is a frequency band in which the impedance Z shown in FIG. 5 is capacitive (the imaginary part of the impedance Z is negative) and the admittance Y is inductive (the imaginary part of the admittance Y is negative).
- Admittance Y is an input admittance of the microstrip line 16, is determined by the capacitance C R.
- the input admittance of the microstrip line 16 is determined by the line length and effective dielectric constant of the microstrip line 16.
- the input admittance of the microstrip line 16 at a certain frequency is capacitive or inductive depending on the line length and the effective dielectric constant.
- the effective dielectric constant of the microstrip line 16 is determined by a material that fills between the conductor plane 11 and the wiring 14, for example, the material of the dielectric substrate 10.
- the line length of the microstrip line 16 is determined by the shape and dimensions of the wiring 14, so that the numerical range that can be selected as the line length of the microstrip line 16 is remarkably wide. Since the design freedom of the line length of the microstrip line 16 is high, the design freedom of the admittance Y is also high, and the dispersion relation of the structures can be easily controlled. Thereby, for example, it becomes easy to set the band gap to a desired frequency band, and it becomes easy to operate the structure 1 as an EBG structure or a left-handed medium in a desired band.
- the structure 1 according to the present invention can realize a CRLH line with a conductor two-layer structure including a conductor layer including the conductor plane 11 and a conductor layer including the conductor pattern 19. Therefore, it is not necessary to provide a conductor via for conducting the conductor plane 11 and the conductor pattern 19, and a CRLH line having a simple configuration can be obtained. Furthermore, the manufacturing cost of the structure 1 can be reduced by not providing the conductor via. Further, by not providing the conductor via, it is possible to avoid a change in characteristics of the structure 1 due to a decrease in reliability due to poor connection of the conductor via or a change in connection resistance of the conductor via due to deterioration over time.
- the band gap is lowered as the line length of the microstrip line 16 is increased. Since it is easy to increase the line length, the band gap can be easily lowered in frequency. Therefore, the necessity for increasing the effective dielectric constant of the microstrip line 16 is reduced from the viewpoint of lowering the band gap. For this reason, the freedom degree of selection of the substance satisfy
- a transmission line (microstrip line) is constituted by the first conductor element and the line portion, and one end portion of the transmission line is an open end, so that the other It functions as a CRLH line in a frequency band where the input impedance when viewed from the end of the line indicates that the behavior is inductive.
- the band in which the input impedance of the transmission line having an open end exhibits inductivity depends on the line length of the line portion and the material between the first conductor element and the conductor pattern, but the line length of the line portion and the first conductor element.
- the characteristics of the CRLH line can be designed by adjusting the line length of the line part according to the dielectric constant of the material between the conductor pattern and the conductor pattern. Therefore, the degree of freedom of selection of the material between the first conductor element and the conductor pattern is increased, and a structure that acts as a left-handed medium or EBG structure having desired characteristics can be realized at low cost.
- a conductor via for conducting the first conductor element and the conductor pattern is unnecessary, and the configuration can be simplified by omitting the conductor via.
- the structure 1 ⁇ / b> B includes a plurality of conductor patches 12, and wiring is provided for each conductor patch 12.
- the plurality of wirings 14, 14b, 14c, and 14d are different from each other in shape and extending direction.
- the plurality of wirings 14, 14 b, 14 c, and 14 d have substantially the same line length, and the connection portions with the corresponding conductor patch 12 are periodically arranged at a pitch Pa.
- the equivalent circuit corresponding to this configuration is equivalent to that shown in FIG. 3 or FIG. It becomes the same as the circuit. That is, if the line lengths of the wiring are equal, the shape hardly affects the electromagnetic wave propagation characteristics.
- the planar shape of the wiring may be a polygonal line shape, a curved line shape, or a combination of these in addition to the substantially linear shape. However, from the viewpoint of improving the characteristics as the EBG structure or the left-handed medium, it is preferable to make the width of the wiring substantially uniform in the direction in which the wiring extends.
- a meander-shaped wiring 14e may be employed as in the structure 1C shown in FIG.
- a loop-shaped wiring 14f may be employed as in the structure 1D shown in FIG.
- a spiral wiring 14g may be employed.
- the input admittance of the microstrip line 16 in the equivalent circuit diagram can be adjusted by adjusting the line length.
- the line length is increased, the frequency at which the input admittance of the microstrip line 16 changes from inductive to capacitive can be lowered, and the upper limit frequency of the left-handed band can be lowered. That is, by designing the line length of the wiring, a left-handed band can be designed, for example, the frequency of the left-handed band can be lowered.
- the unbranched wiring 14 is used as the line portion, but a wiring 14h including a plurality of branch lines may be employed as the line portion as in the structure 1F shown in FIG.
- the wiring 14 h is continuous with the conductor patch 12 and the connection portion 145, and is separated from the inner periphery of the conductor patch 12 at a portion other than the connection portion 145.
- the wiring 14h includes a branch portion 146, and further includes branch lines 143 and 144 starting from the branch portion 146. In the branch lines 143 and 144, the end part on the opposite side to the branch part 146 is an open end, respectively.
- the length from the branch part 146 to the open end of the branch line 143 along the branch line 143, that is, the line length of the branch line 143 is different from the line length of the branch line 144. In this way, if a line portion including branch lines having different line lengths is configured, the frequency at which the admittance Y of the microstrip line 16 changes from capacitive to inductive can be adjusted, and a highly flexible band design can be achieved. It becomes possible.
- a line portion including a plurality of wirings 14i and 14j independent of each other may be provided as in the structure 1G shown in FIG.
- the wiring 14 i is continuous with the conductor patch 12 at the connection portion 145.
- the wiring 14 j is continuous with the conductor patch 12 at a connection portion 147 at a position different from that of the connection portion 145.
- the line length of the wiring 14i is different from the line length of the wiring 14j. Even if such a configuration is adopted, it is possible to design a band with a high degree of freedom.
- the example in which the conductor patches 12 having a substantially square outer shape are two-dimensionally arranged in a square lattice pattern in two directions orthogonal to each other has been described.
- the shape and arrangement of the conductor patches 12 can be appropriately changed. is there.
- the outer peripheral shape of the opening 13 can be changed as appropriate.
- the outer shape of the conductor patch 12b may be substantially rectangular and the outer peripheral shape of the opening 13b may be substantially rectangular.
- the outer shape of the conductor patch 12c may be a substantially regular hexagon, and the outer peripheral shape of the opening 13c may be a substantially regular hexagon.
- the outer shape of the conductor patch and the outer peripheral shape of the opening may be a polygon such as a substantially triangle or a substantially regular hexagon, or may be a circle, an ellipse, a polygon with rounded corners, or the like.
- shapes that can be laid infinitely in a plane and periodically, such as regular triangles, rectangles, and regular hexagons have a wasteful area when laid periodically, such as circles and ellipses. This is advantageous in increasing the degree of integration of unit cells, compared to the increased number of shapes.
- the arrangement of the conductor patches and openings may be a square lattice or a triangular lattice.
- the material between the conductor plane 11 and the conductor patch 12 may be any material that generates a capacity between the conductor plane 11 and the conductor patch 12, and may be, for example, a gas such as air or a liquid material.
- a gas such as air or a liquid material.
- the conductor plane 11 is provided on the surface of the first substrate, and the conductor patch 12 is provided on the surface of the second substrate.
- the first substrate and the second substrate are fixed to face each other with a gap so that the conductor plane 11 and the conductor patch 12 face each other. Then, an atmosphere gas, an appropriately selected gas, a liquid material, or the like may be filled between the first substrate and the second substrate.
- the conductor plane 11 may be attached to the second substrate so that the conductor plane 11 has a gap with respect to the conductor patch 12 provided on the second substrate.
- the conductor plane 11 may be bonded to the second substrate with a dielectric adhesive or the like via a conductor pattern and a spacer provided on the second substrate.
- Various functional films and various substrates such as a dielectric film covering the conductor plane 11 or the conductor patch 12 on the opposite side of the direction in which the conductor plane 11 and the conductor patch 12 face each other, that is, outside the conductor plane 11 and the conductor patch 12. It may be provided.
- the structure 1 can be formed by applying a semiconductor technology or the like on a base body using a glass substrate or a silicon substrate.
- the structure 1 can be manufactured by sequentially forming the conductor plane 11, the dielectric film, and the conductor pattern 19 on the base.
- the structure 1 may be configured such that the conductor pattern 19, the dielectric film, and the conductor plane 11 are sequentially formed on the base, and the conductor pattern 19 is disposed on the base (base) side.
- various film formation methods, photolithography methods, etching methods, and the like can be used as appropriate.
- a metal such as copper or aluminum can be used as the conductive material.
- the dielectric film for example, a silicon oxide film can be used.
- the structure 2 includes a conductor plane 21 as a conductor pattern and a conductor patch 22 as a first conductor element.
- the plurality of conductor patches 22 are provided to face the conductor plane 21.
- the conductor plane 21 is disposed to face the plurality of conductor patches 22 with the dielectric substrate 20 in between, for example. As shown in FIG. 15B, the conductor plane 21 has an opening 23 and is provided with a wiring 24 as a line portion.
- the conductor patches 22 are arranged in a square lattice shape with a pitch in the x direction of Pa and a pitch in the y direction of Pa.
- the plurality of conductor patches 22 are spaced apart from each other.
- the wiring 24 is provided for each portion of the conductor plane 21 that faces the conductor patch 22.
- the portion outside the opening 23 corresponds to the second conductor element in the portion of the conductor plane 21 facing the conductor patch 22. That is, the structure 2 according to the second embodiment has a structure in which adjacent second conductor elements are continuously integrated as shown in FIG.
- the opening 23 surrounds the wiring 24 except for the starting point of the wiring 24 (a part of the wiring 24). That is, the conductor plane 21 has an opening 23 and the wiring 24 is provided inside the opening 23.
- the conductor plane 21, the opening 23, and the wiring 24 are formed on the same plane.
- the wiring 24 is made of the same material as that of the conductor plane 21 other than the wiring 24 and is integral with the conductor plane 21.
- the conductor plane 21 integrated with the wiring 24 is formed by periodically forming the plurality of openings 23 in the conductor thin plate.
- the microstrip line 26 includes a wiring 24 and a conductor patch 22 at a portion facing the wiring 24.
- the structure 2 has a configuration in which a unit cell 25 is a portion having a square region whose dimension in the x direction is Pa and whose dimension in the y direction is Pa, and the unit cells 25 are periodically two-dimensionally arranged. As described in the first embodiment, the unit cell 25 can be arbitrarily positioned.
- the unit cell 25 has one conductor patch 22, a conductor plane 21, an opening 23, and a wiring 24 at a portion facing the conductor patch 22.
- the equivalent circuit diagram per unit cell 25 of the structure 2 is the same as that of the structure 1 of the first embodiment shown in FIG.
- the characteristics of the electromagnetic wave propagating between the conductor plane 21 and the conductor patch 22 of the structure 2 are the same as the electromagnetic wave propagation characteristics of the structure 1 shown in FIG.
- the line length of the microstrip line 26 is determined by the shape and dimensions of the wiring 24. Since the degree of freedom in designing the line length of the microstrip line 26 is high, the dispersion relation of the structures can be easily controlled. Thereby, for example, it becomes easy to set the band gap to a desired frequency band, and it becomes easy to operate the structure 2 as an EBG structure or a left-handed medium in a desired band.
- the structure 2 configured as described above can realize a CRLH line with a conductor layer including a conductor plane 21 and a conductor layer composed of a plurality of conductor patches 22. . Therefore, it is not necessary to provide a conductor via for conducting the conductor plane 21 and the conductor patch 22, and a CRLH line having a simple configuration can be obtained. Thereby, the structure 2 becomes low-cost and highly reliable.
- the band gap is lowered as the line length of the microstrip line 26 is increased. Since it is easy to increase the line length, the band gap can be easily lowered in frequency. Therefore, from the viewpoint of lowering the band gap frequency, the necessity to widen the opening 23 and the necessity to increase the effective dielectric constant of the microstrip line 26 are reduced. In addition, since the structure 2 has a low need for widening the opening 23, the unit cell can be reduced in area. In addition, since the structure 2 has a low need for increasing the effective dielectric constant of the microstrip line 26, the degree of freedom in selecting a material that fills between the conductor patch 22 and the wiring 24 is increased, and the cost can be reduced. It becomes possible.
- the structure 2 can easily control the band gap, it is possible to easily control the band that behaves as a magnetic wall that reflects electromagnetic waves in phase and the band that acts as a left-handed medium. Thereby, the structure 2 can be used as a reflector or a resonator of an antenna in a desired frequency band.
- the structure 2B includes a conductor plane 21 as a conductor pattern.
- Each conductor plane 21 has an opening 23.
- the line portion is provided for each opening 23.
- the wirings 24, 24b, 24c, and 24d are provided as line portions, and are different in shape and extending direction but have substantially the same line length.
- the starting points (connection portions) of the wirings 24, 24b, 24c, and 24d are periodically arranged at a pitch Pa.
- the equivalent circuit corresponding to this configuration is equivalent to that shown in FIG. 3 or FIG. It becomes the same as the circuit. That is, if the line lengths of the wiring are equal, the shape hardly affects the electromagnetic wave propagation characteristics.
- the planar shape of the wiring may be a polygonal line shape, a curved line shape, or a combination of these in addition to the substantially linear shape.
- a wiring 24e including a plurality of branch lines may be adopted as the line portion.
- the wiring 24 e extends from the connection portion 241 to a portion surrounded by the opening 23.
- the wiring 24e includes a branch portion 242 and further includes branch lines 243 and 244 starting from the branch portion 242.
- the ends of the branch lines 243 and 244 opposite to the branch portion 242 are open ends.
- the length from the branch part 242 to the open end of the branch line 243 along the branch line 243, that is, the line length of the branch line 243 is different from the line length of the branch line 244.
- the line portion is configured to include branch lines having different line lengths, the frequency at which the admittance Y of the microstrip line 26 changes from capacitive to inductive can be adjusted, and a highly flexible band design. Is possible.
- a line portion including a plurality of wirings 24i and 24g independent from each other may be provided as in the structure 2D shown in FIG.
- the wiring 24i starts from the connection portion 245.
- the wiring 24g starts from the connection portion 246 at a position different from the connection portion 245.
- the line length of the wiring 24i is different from the line length of the wiring 24g. Even if such a configuration is adopted, it is possible to design a band with a high degree of freedom.
- the meander shape, loop shape, spiral shape, etc. are adopted as the shape of the line portion. Good.
- the frequency characteristics of the admittance Y in the equivalent circuit diagram shown in FIG. 3 or FIG. 5 can be adjusted, and the frequency of the left-handed band can be lowered.
- the planar shape of the conductor patch 22 and the outer peripheral shape of the opening 23 may be any of a polygon, such as a triangle, a rectangle, and a hexagon, a circle, an ellipse, or a combination thereof, in addition to a square.
- the unit cell array may be either a one-dimensional periodic array or a two-dimensional periodic array. When a two-dimensional periodic array is employed, a triangular lattice-shaped array, a square lattice-shaped array, or the like can be appropriately selected and employed. It is.
- the conductor patch 22 may be opposed to the conductor plane 21 with the dielectric substrate 20 interposed therebetween, or may be opposed to the conductor patch 22 with a gas, liquid, adhesive, or the like interposed therebetween as described in the first embodiment. Good.
- various functional films such as a dielectric film or the like covering the conductor plane 21 or the conductor patch 22 on the opposite side of the direction in which the conductor plane 21 and the conductor patch 22 face each other, that is, outside the conductor plane 21 and the conductor patch 22.
- a substrate may be provided.
- the structure 2 can be formed by applying a semiconductor technology or the like on a substrate using a glass substrate or a silicon substrate as a substrate.
- the structure 2 can be manufactured by sequentially forming the conductor plane 21, the dielectric film, and the conductor patch 22 on the base.
- the structure 2 may be configured such that the conductor patch 22, the dielectric film, and the conductor plane 21 are sequentially formed on the base, and the conductor patch 22 is disposed on the base.
- various film formation methods, photolithography methods, etching methods, and the like can be used as appropriate.
- a metal such as copper or aluminum can be used as the conductive material.
- the dielectric film for example, a silicon oxide film can be used.
- the structure of the third embodiment is different from that of the first embodiment in that a third conductor element is provided across two or more adjacent second conductor elements and facing the second conductor elements. It is a point.
- the structure 3 includes a conductor plane 31 as a first conductor element, a conductor patch 32 as a second conductor element, an opening 33, and a wiring 34 as a line portion.
- the conductor pattern 35 includes a conductor patch 32, an opening 33, and a wiring 34.
- the conductor pattern 35 is disposed to face the conductor plane 31 with the dielectric substrate 30 interposed therebetween.
- the auxiliary conductor patch 38 is provided as a third conductor element on the opposite side of the conductor plane 31 with respect to the conductor patch 32.
- the auxiliary conductor patch 38 is disposed so as to overlap two or more conductor patches 32 adjacent to each other.
- the auxiliary conductor patch 38 is disposed so as to face the conductor patch 32 with the dielectric layer 37 interposed therebetween, for example.
- the auxiliary conductor patch 38 is provided over the two conductor patches 32 adjacent in the x direction, and is provided over the two conductor patches 32 adjacent in the y direction.
- the planar shape of the auxiliary conductor patch 38 is a substantially rectangular shape having a short side in the direction in which the conductor patches 32 are separated from each other.
- the auxiliary conductor patch 38 generates a capacity between each of the two conductor patches 32 overlapping the auxiliary conductor patch 38, and a capacity portion 39 is formed in the vicinity of the conductor patch 32.
- the capacitor 39 conceptually includes a capacitor C 1 between the conductor patches 32, a capacitor C 2 between one of the two adjacent conductor patches 32 and the auxiliary conductor patch 38, and two adjacent A capacitance C 3 between the other of the two conductor patches 32 and the auxiliary conductor patch 38.
- the capacitor C 2 is connected in series with the capacitor C 3, and the capacitance generated when the capacitors C 2 and C 3 are connected in series is connected in parallel with the capacitor C 1 .
- the capacitance C L is compared with the first embodiment, increased by the amount of capacitance formed by the capacitor C 2, C 3 to be connected in series.
- the resonance frequency f se of the series resonant circuit consisting of capacitance C L and the inductance L R, corresponding to either the lower or upper end of the band gap of the dispersion curve shown in FIG. 6 To do.
- the resonance frequency fse may be lowered.
- the resonance frequency f se may close the upper end of the band gap at the lower end with a lower resonant frequency f se.
- the resonance frequency f se may be lowered so that the upper and lower frequencies of the band gap are the same.
- the capacitance C L or inductance L R it is preferable to increase the capacitance C L or inductance L R.
- an auxiliary conductor patch 38 it is possible to increase the value of the capacitance C L without changing the conductor patch 32, aperture 33, the size of the wire 34.
- the values of the capacitances C 2 and C 3 can be adjusted. L can be easily adjusted.
- the structure 3 having the above-described structure does not require a conductor via for conducting the conductor plane 31 and the conductor pattern 35, and has an EBG structure while having a simple structure. Or a CRLH line acting as a left-handed medium.
- the structures 3, the conductor patch 32, aperture 33, without increasing the size of the wire 34 it is possible to increase the value of the capacitance C L. Therefore, the band gap can be lowered, narrowed, or eliminated without increasing the size of the unit cell. Therefore, the unit cells can be highly integrated, and the structure 3 can be easily functioned as a CRLH line having desired characteristics.
- the structure 3 can easily increase the line length of the microstrip line, the band gap can be easily reduced in frequency. Therefore, from the viewpoint of lowering the band gap frequency, the necessity to widen the opening 33 and the necessity to increase the effective dielectric constant of the microstrip line are reduced. As a result, the structure 3 can be highly integrated in unit cells and can be reduced in cost.
- the structure 3 can easily control the band gap, the band that behaves as a magnetic wall that reflects electromagnetic waves in the same phase and the band that acts as a left-handed medium can be easily controlled.
- the structure 3 can be used as a reflector or an antenna resonator in a desired frequency band.
- the structure 3 may cover the conductor plane 31 and the auxiliary conductor patch 38 and include a dielectric film, a protective film, various substrates, and the like.
- the arrangement and shape of the third conductor elements can be appropriately determined as in a modification described below, for example.
- the structure 3B differs from the structure 3 of the third embodiment in that the auxiliary conductor patch 38 is disposed on the same side as the conductor plane 31 with respect to the conductor patch 32.
- the auxiliary conductor patch 38 is disposed to face the conductor plane 31 with the dielectric substrate 30 interposed therebetween.
- the dielectric layer 37 is provided on the side opposite to the conductor plane 31 with respect to the auxiliary conductor patch 38.
- the conductor pattern 35 is disposed with the conductor plane 31, the dielectric substrate 30, and the dielectric layer 37 interposed therebetween. Even with such a configuration, structure 3B is an auxiliary conductor patch 38 can adjust the value of the capacitance C L easily and high degree of freedom.
- the third conductor element may be provided on the same side as the conductor plane 31 and on the opposite side with respect to the conductor patch 32. Further, a dielectric film, a protective film, various substrates, etc. may be provided so as to cover the conductor pattern 35.
- the planar shape of the auxiliary conductor patch 38 is a rectangle, but is not particularly limited. What is important in designing the auxiliary conductor patch 38 is the area of the portion of the auxiliary conductor patch 38 facing the conductor patch 32, and the planar shape of the auxiliary conductor patch 38 can be changed as appropriate.
- the planar shape of the auxiliary conductor patch 38b may be a rhombus.
- the auxiliary conductor patch 38 is arranged so as to overlap with the two adjacent conductor patches 32, but the number of the conductor patches 32 overlapping with the auxiliary conductor patch 38 may be plural, and is 3 or more. There may be.
- the auxiliary conductor patch 38c may overlap the four conductor patches 32 in two columns and two rows in the two-dimensionally arranged conductor patches 32.
- the outer shape of the conductor patch 32b is a substantially regular hexagon, and the outer peripheral shape of the opening 33 is a substantially regular hexagon.
- the conductor patches 32b are arranged in a triangular lattice shape.
- the external shape of the auxiliary conductor patch 38d is not particularly limited, for example, the external shape is a substantially regular hexagon.
- the auxiliary conductor patch 38d is arranged near the position where the apexes of three adjacent conductor patches 32b gather, and is arranged so as to overlap with these three conductor patches 32b.
- the auxiliary conductor patch 38 is disposed between the conductor patch 32 in the x direction and between the conductor patch 32 in the y direction.
- the conductor patch 32 in the x direction and the conductor patch 32 in the y direction may be adopted.
- the dispersion relationship of the CRLH transmission line exhibits anisotropy in the x direction and the y direction. That is, the unit structures are arranged symmetrically in the x direction and the y direction, but the frequencies at which half-wave resonance occurs in the x direction and the y direction are different.
- the first auxiliary conductor patch is disposed between the conductor patches 32 in the x direction
- the second auxiliary conductor patch is disposed between the conductor patches 32 in the y direction, so that the area of the portion overlapping the conductor patch is first
- Different configurations may be used for the second auxiliary conductor patch. Even in this configuration, the dispersion relationship of the CRLH transmission line exhibits anisotropy in the x direction and the y direction.
- the structure 3 can be formed by applying a semiconductor technology or the like on a substrate using a glass substrate or a silicon substrate as a substrate.
- the structure 3 is manufactured by sequentially forming the conductor plane 31, the first dielectric film, the conductor patch 32, the second dielectric film (dielectric layer 37), and the auxiliary conductor patch 38 on the base. It is also possible to do.
- various film formation methods, photolithography methods, etching methods, and the like can be used as appropriate.
- a metal such as copper or aluminum can be used as the conductive material.
- a silicon oxide film can be used as the first and second dielectric films.
- the structure of the fourth embodiment is different from the structure of the third embodiment in that a third conductor element is provided for the structure of the second embodiment.
- the structure 4 includes a conductor plane 41 as a conductor pattern and a conductor patch 42 as a first conductor element.
- a plurality of conductor patches 42 are provided to face the conductor plane 41.
- the conductor patch 42 is disposed to face the conductor plane 41 with the dielectric substrate 40 interposed therebetween, for example.
- the conductor plane 41 has an opening 43 and includes a wiring 44 as a line portion.
- the wiring 44 is provided for each portion of the conductor plane 41 that faces the conductor patch 42.
- the auxiliary conductor patch 48 is provided as a third conductor element on the opposite side of the conductor plane 41 with respect to the conductor patch 42.
- the auxiliary conductor patch 48 is disposed so as to overlap two or more conductor patches 42 adjacent to each other.
- the auxiliary conductor patch 48 is disposed so as to face the conductor patch 42 with the dielectric layer 47 and the like interposed therebetween, for example.
- the structure 4 having the above-described structure does not require a conductor via for conducting the conductor plane 41 and the conductor patch 42, and has an EBG structure while having a simple structure. Or a CRLH line acting as a left-handed medium.
- the structure 4 can adjust the capacity
- the unit cells can be highly integrated, and the structure 4 can easily function as a CRLH line having desired characteristics.
- the structure 4 can easily increase the line length of the microstrip line, the band gap can be easily reduced in frequency. Therefore, from the viewpoint of lowering the band gap frequency, the necessity of widening the opening 43 and the necessity of increasing the effective dielectric constant of the microstrip line are reduced. As a result, the structure 4 can be highly integrated in unit cells and can be reduced in cost.
- the structure 4 can easily control the band gap, the band that behaves as a magnetic wall that reflects electromagnetic waves in the same phase and the band that acts as a left-handed medium can be easily controlled. Thereby, the structure 4 can be utilized in a desired frequency band as a reflector of a reflector or an antenna.
- the structure 4 can be modified and changed in the same manner as in the third embodiment.
- the auxiliary conductor patch 48 may be provided on the same side as the conductor plane 41 with respect to the conductor patch 42.
- the third conductor element may be provided on the same side as the conductor plane 41 and on the opposite side with respect to the conductor patch 42.
- the planar shape of the auxiliary conductor patch 48 may be any of a polygon such as a rhombus or a hexagon, a circle or an ellipse, or a combination of these.
- the auxiliary conductor patch 48 such that the capacitance C L between the conductor patch 42 has anisotropy, x-direction may be made different arrangement in the y direction, may have different shapes or the like.
- the structure 4 may cover the conductor plane 41 or the auxiliary conductor patch 48 and provide a dielectric film, a protective film, various substrates, and the like.
- the structure 4 can be formed by applying a semiconductor technology or the like on a substrate using a glass substrate or a silicon substrate as a substrate.
- the structure 4 is produced by sequentially forming the conductor plane 41, the first dielectric film, the conductor patch 42, the second dielectric film (dielectric layer 47), and the auxiliary conductor patch 48 on the base. It is also possible to do.
- various film formation methods, photolithography methods, etching methods, and the like can be used as appropriate.
- a metal such as copper or aluminum can be used as the conductive material.
- a silicon oxide film can be used as the first and second dielectric films.
- the antenna of the present invention includes the structure according to the present invention.
- the antenna 5 includes a structure 55 and a power feeding unit 56 according to the present invention.
- the structure 55 includes a conductor plane 51 as a first conductor element and a conductor pattern 59.
- the conductor pattern 59 is disposed to face the conductor plane 51 with the dielectric substrate 50 interposed therebetween, for example.
- the conductor pattern 59 includes a conductor patch 52 as a second conductor element, an opening 53, and a wiring 54 as a line portion having an open end 541.
- the conductor pattern 59 includes a plurality of conductor patches 52.
- the opening 53 and the wiring 54 are provided for each conductor patch 52.
- the structure 55 constitutes a resonator in the antenna 5. Based on the design value of the operating frequency of the antenna 5, the dispersion relationship of the structures 55 is designed so that the structure 55 behaves as a left-handed medium with respect to the electromagnetic wave of the design value.
- the power feeding unit 56 is connected to one of the conductor patches 52.
- the structure 55 includes nine unit cells in which three unit cells are two-dimensionally arranged in the x direction and the y direction. Assuming that the unit cell pitch is Pa, the planar shape of the resonator is a substantially square shape with the dimension in the x direction being 3 Pa and the dimension in the y direction being 3 Pa.
- a resonator having a side length of N ⁇ Pa is formed by two-dimensionally arranging N ⁇ N unit cells having a lattice constant (pitch) Pa, the wave number on the dispersion curve
- the dispersion relationship between the resonance frequency of the antenna 5 and the electromagnetic wave propagation has a correspondence relationship as shown in FIG.
- the solid line is the dispersion relationship of Example 2, and means the dispersion relationship (dispersion curve) in the structure 55.
- a chain line is a dispersion relationship of Comparative Example 2, and means a dispersion relationship in which a square conductor is arranged instead of the conductor patch 52 and the wiring 54, that is, a parallel plate in which two conductor plates are arranged in parallel to each other.
- the half-wave resonance frequency f 0 C in the resonator of Comparative Example 2 is larger than the half-wave resonance frequency f 0 M in the resonator of Example 2.
- the size (length of one side) of the resonator in order to set the half-wave resonance frequency to f 0 M, the size (length of one side) of the resonator must be f 0 C / f 0 M times.
- the resonator constituted by the structure according to the present invention can have a resonator size of f 0 M / f 0 C compared to the conventional type, and can be significantly reduced in size.
- the Bloch impedance of the CRLH line has a steep frequency dependence when a band gap exists in the dispersion relation of the CRLH line. Therefore, when the CRLH line has a band gap, it may be difficult to achieve broadband impedance matching with the power feeding unit.
- the CRLH line operated as an antenna resonator is designed so that the admittance Y and the impedance Z have the same resonance frequency so that the band gap disappears. In order to adjust the resonance frequency, it is particularly effective to provide the third conductor element described in the third and fourth embodiments.
- the antenna 5 configured as described above constitutes a resonator by the structure 55 that behaves as a left-handed medium. Therefore, the antenna 5 can be made much smaller in size than a conventional type resonator made of a right-handed medium, and the entire antenna can be made much smaller. Further, since the antenna 5 includes the resonator formed by the structure 55 according to the present invention, the configuration of the resonator is simplified, and the cost can be reduced and the reliability can be increased.
- the resonator of the antenna 5 may employ any of the structures of the first to fourth embodiments and the structure of the modification.
- a structure in which unit cells are arranged in a two-dimensional periodic array may be adopted, or a structure in which unit cells are arranged in a one-dimensional periodic arrangement (see FIG. 2, see FIG. 18).
- FIGS. 1B and 15B a structure in which unit cells are arranged in a two-dimensional periodic array
- FIG. 2 see FIG. 18
- a modified antenna 6 as shown in FIGS. 33A and 33B may be employed.
- the antenna 6 is different from the antenna 5 of the fifth embodiment in that a resonator is constituted by one unit cell.
- the antenna 6 includes a structure 65 and a power feeding unit 66.
- the structure 65 includes a conductor plane 61 as a first conductor element, a conductor patch 62 as a second conductor element, an opening 63, and a wiring 64 as a line portion.
- the conductor pattern including the conductor patch 62, the opening 63, and the wiring 64 is disposed to face the conductor plane 61 with the dielectric substrate 60 interposed therebetween.
- a modified antenna 7 as shown in FIGS. 34A and 34B may be adopted.
- the antenna 7 is different from the antenna 5 of the fifth embodiment in that the first conductor element and the power feeding unit are electrically connected.
- the antenna 7 includes a structure 75 and a power feeding unit 76.
- the structure 75 includes a conductor plane 71 as a first conductor element, a conductor patch 72 as a second conductor element, an opening 73, and a wiring 74 as a line portion.
- the power feeding unit 76 is electrically connected to the conductor plane 71.
- a conductor pattern including the conductor patch 72, the opening 73, and the wiring 74 is disposed to face the conductor plane 71.
- This conductor pattern uses, for example, a conductor thin plate as a base material, and grooves are formed in the x direction and the y direction of the base material, respectively, and a portion surrounded by the grooves is a conductor patch 72.
- the wiring 74 integral with the conductor patch 72 is formed by forming the opening 73 by the same process as the groove formation or by another process.
- a power feeding method such as a known microstrip antenna can be appropriately selected.
- a modified antenna 7B as shown in FIG. 35 may be adopted.
- the antenna 7B includes a structure 75B and a power feeding unit 76.
- the structure 75B includes eight unit cells.
- the structure 75B has a configuration in which a unit cell is not arranged at one of eight lattice points on the outer peripheral portion excluding the central portion with respect to a 3 ⁇ 3 square lattice arrangement.
- the power feeding portion 76 extends to a portion where the unit cell is not disposed, and is electrically connected to the conductor patch 72 of the unit cell disposed at the center portion.
- the antenna 7B having such a configuration can bring the characteristic impedance of the microstrip line close to the input impedance of the antenna 7B, and as a result, the radiation efficiency can be improved.
- the antenna 7C includes a structure 55 and a coaxial cable 77 as a power feeding unit.
- the coaxial cable 77 includes a signal line (for example, an inner conductor) and a ground line (an outer conductor).
- the signal line is electrically connected to one of the conductor patches 72 and, for example, a conductor via.
- the ground line is electrically connected to the conductor plane 71.
- the antenna 7 ⁇ / b> C having such a configuration includes a conductor via for feeding, a conductor via for connecting the conductor plane 71 and the conductor patch 72 is not necessary.
- the antenna 7C needs to have a conductor via for each conductor patch. As the number of unit cells increases, the manufacturing cost increases and connection reliability increases. It causes inconvenience such as lowering. Since the antenna 7C uses the structure according to the present invention, such inconvenience can be avoided.
- the antenna 7D includes a structure 75D and a power feeding unit 76.
- the structure 75D includes nine unit cells arranged in a 3 ⁇ 3 square lattice.
- the power feeding unit 76 feeds power to the unit cell by capacitive coupling with the unit cells arranged on the outer periphery.
- the power feeding unit 76 is substantially T-shaped, and includes a tip portion that approaches the unit cell in a non-contact manner and a wiring portion that is continuous with the tip portion.
- the distal end portion is provided along one unit cell arranged at the center of the outer periphery of the structure.
- the conductor patch 72 and the tip of the unit cell are coupled via a capacitor, and power can be supplied to the unit cell.
- an antenna according to a sixth embodiment will be described.
- the antenna of the sixth embodiment is different from the fifth embodiment in that the structure according to the present invention is adopted as a reflector.
- a configuration example in which the structure according to the present invention is applied to an inverted L-shaped antenna will be described.
- the same components as those in the above-described embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.
- the antenna 8 includes the structure 1 according to the first embodiment as a structure according to the present invention, a coaxial cable 81, and an antenna element 82.
- the antenna 8 is composed mainly of a substantially plate-shaped dielectric substrate 10.
- the conductor pattern 19 is provided on one surface of the dielectric substrate 10, and the conductor plane 11 is provided on the other surface.
- the structure 1 of the present invention includes a conductor plane 11 and a conductor pattern 19. The dispersion relationship of the structures 1 is designed so that the entire frequency band corresponding to the use frequency of the antenna 8 is included in the band gap.
- the antenna element 82 protrudes from one surface of the dielectric substrate 10 in the normal direction of the surface, bends away from the substrate, and extends in the surface direction of the substrate.
- the bent portion includes a radio wave radiation surface and is disposed close to the conductor pattern 19.
- the coaxial cable 81 includes a signal line and a ground line.
- the coaxial cable 81 is connected to one surface of the dielectric substrate 10.
- the ground line of the coaxial cable 81 is electrically connected to the conductor plane 11.
- the signal line of the coaxial cable 81 passes through the dielectric substrate 10 and is electrically connected to the antenna element 82.
- the structure 1 according to the present invention functions as an EBG structure, that is, a magnetic wall. Accordingly, the reflector that reflects the electromagnetic wave radiated from the antenna element 82 in the same phase is constituted by the structure 1. Since this reflecting plate reflects the electromagnetic wave in phase, the antenna element 82 can be disposed close to the reflecting plate. As a result, it is possible to realize the antenna 8 that is significantly thinner than the conventional one. Moreover, since the reflecting plate is comprised by the structure which concerns on this invention, it can be set as the low-cost and highly reliable antenna 8. FIG.
- the antenna using the structure according to the present invention has been described.
- a transmitter and a receiver connected to the antenna according to the present invention a communication device, etc.
- the electronic device according to the present invention can be configured.
- the printed circuit board 9 includes a substrate 90, devices 91 and 92, and a structure 93 disposed between the devices 91 and 92.
- the substrate 90 includes a ground pattern 94 and a dielectric layer provided on the ground pattern 94.
- the ground pattern 94 is electrically connected to the first conductor element (here, a conductor plane) of the structure 93.
- the planes of the devices 91 and 92 are provided on the surface layer of the dielectric layer and are electrically connected to the ground pattern 94.
- the device 91 is a device that becomes a noise source
- the device 92 is a device that is easily affected by noise.
- the printed circuit board 9 has a structure 93 disposed so as to block a portion that can be a noise propagation path between the devices 91 and 92.
- the structure 93 is continuously arranged in a strip shape from one end to the other end of the printed circuit board 9 in a direction intersecting with the direction from the device 91 to the device 92.
- the structure 93 is constituted by the structure of the present invention, and includes a band gap in the dispersion relation.
- the band gap is set to a frequency band including a frequency band of noise generated in the device 91.
- the printed circuit board 9 having such a configuration, noise generated in the device 91 is blocked by the structure 93. Therefore, the printed circuit board 9 is remarkably reduced in that noise reaches the device 92, and malfunction of the device 92 can be suppressed. Since the structure 93 is the one to which the present invention is applied, the printed circuit board 9 can be made low cost and highly reliable. Moreover, since the printed circuit board 9 can control the band gap of the structure 93 easily, it can respond to the noise of a wide frequency band.
- the configuration including the belt-like structure 93 is illustrated.
- the structure 93 only needs to be arranged so as to block the noise propagation path. Can be appropriately modified.
- a structure may be provided so as to surround the device 92 that is susceptible to noise.
- the configuration in which the structure according to the present invention is mounted on a printed board is illustrated, but the effect of the present invention is also achieved when the structure according to the present invention is mounted on an electronic component other than the printed board.
- Obtainable For example, it is naturally possible to provide the structure according to the present invention on a device package substrate or the like, or to provide the structure of the present invention on a semiconductor device such as silicon using a fine wiring process.
- noise propagation suppression between devices has been described as an example here, for example, when unnecessary coupling between antennas installed close to each other is suppressed, the present invention is exactly the same as in the case of the device. Structures can be used.
- the transmission line waveguide converter 1000 includes a structure 1010 as a reflector, a transmission line 1020, and a waveguide 1030.
- the band gap of the structure 1010 is designed so as to correspond to the frequency band of the electromagnetic wave to be transmitted.
- the transmission line waveguide converter 1000 having such a configuration, since the electromagnetic wave is reflected in the same phase by the structure 1010, the transmission line 1020 can be disposed close to the surface of the structure 1010. As a result, a thin transmission line waveguide converter 1000 can be realized. Further, since the structure 1010 is the one to which the present invention is applied, the transmission line waveguide converter 1000 can be made low-cost and highly reliable.
- the array antenna of the ninth embodiment has a configuration in which a plurality of array elements 1110 are arranged on a printed circuit board 1100 using the antenna according to the present invention as an array element 1110.
- the array element 1110 includes a structure 1120 according to the present invention.
- the antenna described in the fifth embodiment is adopted as the array element 1110, and the four array elements 1110 are arranged one-dimensionally.
- the array elements 1110 are connected in parallel by a microstrip line 1130.
- the array antenna according to the ninth embodiment has a beam-like directivity, and can increase the antenna gain in the beam direction.
- the antenna of another embodiment of the present invention can be used as the array element 1110. Further, by increasing the number of array elements 1110, the beam can be made sharper and the gain in the beam direction can be increased.
Landscapes
- Waveguide Aerials (AREA)
- Structure Of Printed Boards (AREA)
- Aerials With Secondary Devices (AREA)
Abstract
Description
少なくとも一つ以上の第1導体エレメントと、前記第1導体エレメントに対向する少なくとも一つ以上の第2導体エレメントを有する導体パターンと、前記第1導体エレメントと前記第2導体エレメントとの間に容量を生じさせる第1媒体と、を備え、
前記第1導体エレメントと前記導体パターンは、前記第1媒体を介して対向し、
前記第2導体エレメントは、開放端を有する線路部を備え、前記線路部を部分的に囲む開口を有し、
前記線路部は、前記第2導体エレメントと連続しており、
前記開口は、前記第2導体エレメントに包囲されており、
前記第1導体エレメントと前記線路部は、マイクロストリップラインを構成する、
ことを特徴とする。
構造体と、給電部と、を備えるアンテナであって、
前記構造体は、
少なくとも一つ以上の第1導体エレメントと、前記第1導体エレメントに対向する少なくとも一つ以上の第2導体エレメントを有する導体パターンと、前記第1導体エレメントと前記第2導体エレメントとの間に容量を生じさせる第1媒体と、を備え、
前記第1導体エレメントと前記導体パターンは、前記第1媒体を介して対向し、
前記第2導体エレメントは、開放端を有する線路部を備え、前記線路部を部分的に囲む開口を有し、
前記線路部は、前記第2導体エレメントと連続しており、
前記開口は、前記第2導体エレメントに包囲されており、
前記給電部は、該構造体の前記第1導体エレメント又は前記導体パターンと電気的に接続する、
ことを特徴とする。
構造体を備えるプリント基板であって、
前記構造体は、
少なくとも一つ以上の第1導体エレメントと、前記第1導体エレメントに対向する少なくとも一つ以上の第2導体エレメントを有する導体パターンと、前記第1導体エレメントと前記第2導体エレメントとの間に容量を生じさせる第1媒体と、を備え、
前記第1導体エレメントと前記導体パターンは、前記第1媒体を介して対向し、
前記第2導体エレメントは、開放端を有する線路部を備え、前記線路部を部分的に囲む開口を有し、
前記線路部は、前記第2導体エレメントと連続しており、
前記開口は、前記第2導体エレメントに包囲されており、
前記第1導体エレメントと前記線路部は、マイクロストリップラインを構成する、
ことを特徴とする。
構造体を備える伝送線路導波管変換器であって、
前記構造体は、
少なくとも一つ以上の第1導体エレメントと、前記第1導体エレメントに対向する少なくとも一つ以上の第2導体エレメントを有する導体パターンと、前記第1導体エレメントと前記第2導体エレメントとの間に容量を生じさせる第1媒体と、を備え、
前記第1導体エレメントと前記導体パターンは、前記第1媒体を介して対向し、
前記第2導体エレメントは、開放端を有する線路部を備え、前記線路部を部分的に囲む開口を有し、
前記線路部は、前記第2導体エレメントと連続しており、
前記開口は、前記第2導体エレメントに包囲されており、
前記第1導体エレメントと前記線路部は、マイクロストリップラインを構成する、
ことを特徴とする。
構造体と、給電部と、を備えるアンテナをアレイ要素として、複数のアレイ要素を同一平面に配置して構成されるアレイアンテナであって、
前記構造体は、
少なくとも一つ以上の第1導体エレメントと、前記第1導体エレメントに対向する少なくとも一つ以上の第2導体エレメントを有する導体パターンと、前記第1導体エレメントと前記第2導体エレメントとの間に容量を生じさせる第1媒体と、を備え、
前記第1導体エレメントと前記導体パターンは、前記第1媒体を介して対向し、
前記第2導体エレメントは、開放端を有する線路部を備え、前記線路部を部分的に囲む開口を有し、
前記線路部は、前記第2導体エレメントと連続しており、
前記開口は、前記第2導体エレメントに包囲されており、
前記給電部は、該構造体の前記第1導体エレメント又は前記導体パターンと電気的に接続する、
ことを特徴とする。
構造体と給電部とを有するアンテナと、該アンテナと接続する送信機又は受信機の少なくとも一方と、を備え、
前記構造体は、
少なくとも一つ以上の第1導体エレメントと、前記第1導体エレメントに対向する少なくとも一つ以上の第2導体エレメントを有する導体パターンと、前記第1導体エレメントと前記第2導体エレメントとの間に容量を生じさせる第1媒体と、を備え、
前記第1導体エレメントと前記導体パターンは、前記第1媒体を介して対向し、
前記第2導体エレメントは、開放端を有する線路部を備え、前記線路部を部分的に囲む開口を有し、
前記線路部は、前記第2導体エレメントと連続しており、
前記開口は、前記第2導体エレメントに包囲されており、
前記給電部は、該構造体の前記第1導体エレメント又は前記導体パターンと電気的に接続する、
ことを特徴とする。
前記の本発明の第1の観点に係る構造体、前記の本発明の第2の観点に係るアンテナ、前記の本発明の第3の観点に係るプリント基板、前記の本発明の第4の観点に係る伝送線路導波管変換器、及び前記の本発明の第5の観点に係るアレイアンテナの少なくとも1つを備えることを特徴とする。
まず、第1実施形態に係る構造体1について説明する。図1(a)に示すように、構造体1は、第1導体エレメントとしての導体プレーン11と、導体プレーン11に対向する導体パターン19とを備える。導体パターン19は、導体プレーン11から離間して配置されており、離間した方向に導体プレーン11と重なり合っている。
f/β=c/(2π・(εr・μr)1/2) ・・・(1)
このように波数βが大きくなるにつれて周波数fが高くなる分散関係を示す媒質は、右手系媒質と呼ばれる。一方、波数βが大きくなるにつれて周波数fが低くなる分散関係を示す媒質は、左手系媒質と呼ばれる。
また、本実施形態のようにすれば、第1導体エレメントと線路部から伝送線路(マイクロストリップ線路)が構成され、かつこの伝送線路の一方の端部が開放端をなしているため、もう一方の端部から見たときの入力インピーダンスが誘導性の振る舞いと示す周波数帯域においてCRLH線路として機能する。
開放端を有する伝送線路の入力インピーダンスが誘導性を示す帯域は、線路部の線路長と第1導体エレメントと導体パターンとの間の物質に依存するが、線路部の線路長と第1導体エレメントと導体パターンとの間の物質の誘電率に応じて線路部の線路長を調整することにより、CRLH線路の特性を設計可能である。したがって、第1導体エレメントと導体パターンとの間の物質の選択自由度が高くなり、所望の特性の左手系媒質あるいはEBG構造として振舞う構造体を低コストで実現することができる。
第1導体エレメントと導体パターンとを導通させる導体ビアが不要であり、導体ビアを省く分だけ構成をシンプルにすることができる。
なお、本発明の技術範囲は第1実施形態に限定されるものではない。本発明の構造体は、発明の主旨を逸脱しない範囲内で多様な変形が可能である。以下、本発明の構造体の変形例について説明する。
次に、第2実施形態に係る構造体2について説明する。図15(a)に示すように、構造体2は、導体パターンとしての導体プレーン21と、第1導体エレメントとしての導体パッチ22とを備える。複数の導体パッチ22は、導体プレーン21に対向して設けられている。
なお、第2実施形態の構造体2に対しても第1実施形態と同様に、各種変形が可能である。
次に、第3実施形態に係る構造体を説明する。第3実施形態の構造体が第1実施形態と異なる点は、隣り合う2以上の第2導体エレメントにわたり、これら第2導体エレメントと対向して第3導体エレメント(third conductor element)が設けられている点である。
なお、構造体3は、第1、第2実施形態の構造体、あるいは変形例の構造体のいずれであっても、第3導体エレメントを備えることにより容量CLの値を大きくすることができ、電磁波伝播特性を容易に調整することができる。構造体3は、導体プレーン31や補助導体パッチ38を覆って、誘電体膜や保護膜、各種基板等を備えてもよい。第3導体エレメントの配置や形状は、例えば次に説明する変形例のように、適宜可能である。
次に、第4実施形態に係る構造体を説明する。第4実施形態の構造体が第3実施形態と異なる点は、第2実施形態の構造体に対して第3導体エレメントを設ける点である。
なお、構造体4も、第3実施形態と同様の変形や変更が可能である。例えば、補助導体パッチ48は、導体パッチ42に対して導体プレーン41と同じ側に設けられていてもよい。また、第3導体エレメントは、導体パッチ42に対して導体プレーン41と同じ側及び反対側にそれぞれ設けられていてもよい。
次に、第5実施形態に係るアンテナを説明する。本発明のアンテナは、本発明に係る構造体を備えて構成されている。
なお、アンテナ5の共振器は、第1~第4実施形態の構造体、変形例の構造体のいずれを採用してもよい。例えば、単位セルが二次元周期配列されている構造体(図1(b)、図15(b)参照)を採用してもよいし、単位セルが一次元周期配列されている構造体(図2、図18参照)を採用してもよい。以下、いくつかの変形例のアンテナについて説明する。
次に、第6実施形態に係るアンテナについて説明する。第6実施形態のアンテナが第5実施形態と異なる点は、本発明に係る構造体を反射板として採用している点である。ここでは、本発明に係る構造体を逆L字型のアンテナに適用した構成例について説明する。なお、本実施形態において、上述の実施形態と同様の構成要素については同じ符号を付して示し、その詳細な説明を省略する。
次に、第7実施形態に係るプリント基板について説明する。図39(a)、(b)に示すように、プリント基板9は、基板90と、デバイス91、92と、デバイス91、92の間に配置された構造体93とを備える。基板90は、グランドパターン94と、グランドパターン94上に設けられた誘電体層を含んでいる。グランドパターン94は、構造体93の第1導体エレメント(ここでは、導体プレーン)と電気的に接続している。デバイス91、92プレーンは、誘電体層の表層に設けられており、グランドパターン94と電気的に接続している。デバイス91はノイズ源となるデバイスであり、デバイス92はノイズの影響を受けやすいデバイスである。
次に、本発明の第8実施形態に係る伝送線路導波管変換器について説明する。図40(a)、(b)に示すように、伝送線路導波管変換器1000は、反射板としての構造体1010、伝送線路1020、及び導波管1030を備える。構造体1010のバンドギャップは、伝送する電磁波の周波数帯に対応させて設計されている。
次に、本発明の第9実施形態に係るアレイアンテナについて説明する。図41に示すように、第9実施形態のアレイアンテナは、本発明に係るアンテナをアレイ要素1110として、プリント基板1100に複数のアレイ要素1110が配列された構成を有する。アレイ要素1110は、本発明に係る構造体1120を備えている。ここでは、アレイ要素1110として第5実施形態で説明したアンテナを採用しており、4つのアレイ要素1110が1次元的に配列されている。アレイ要素1110は、マイクロストリップライン1130により並列に接続している。
5~7、7B、7C、8 アンテナ
9 プリント基板
10、20、30、40、50、60 誘電体基板(第1媒体)
11、31、51、61、71 導体プレーン(第1導体エレメント)
12、12b、12c、32、32b、52、62、72 導体パッチ(第2導体エレメント)
13、13b、13c、23、33、43、53、63、73 開口
14、14b~14j、24、24b~24g、24i、34、44、54、64、74 配線(線路部)
15、15b、25 単位セル
16、26 マイクロストリップ線路
19、35、59 導体パターン
21、41 導体プレーン(第2導体エレメント)
22、42 導体パッチ(第1導体エレメント)
37、47 誘電体層(第2媒体)
38、38b~38d、48 補助導体パッチ(第3導体エレメント)
39 容量部
56、66、76 給電部
77、81 同軸ケーブル(給電部)
82 アンテナエレメント
90 基板
91、92 デバイス
94 グランドパターン
141 開放端
142、145、147、241、245、246 接続部
143、144、243、244 分岐線
146、242 分岐部
1100 プリント基板
1110 アレイ要素
Pa ピッチ(格子定数)
C1、C2、C3、CL、CR 容量
f 周波数
f0C、f0M 半波長共振周波数
fse 共振周波数
LR インダクタンス
Y アドミタンス
Z インピーダンス
β 波数
λ 波長
Claims (26)
- 少なくとも一つ以上の第1導体エレメントと、前記第1導体エレメントに対向する少なくとも一つ以上の第2導体エレメントを有する導体パターンと、前記第1導体エレメントと前記第2導体エレメントとの間に容量を生じさせる第1媒体と、を備え、
前記第1導体エレメントと前記導体パターンは、前記第1媒体を介して対向し、
前記第2導体エレメントは、開放端を有する線路部を備え、前記線路部を部分的に囲む開口を有し、
前記線路部は、前記第2導体エレメントと連続しており、
前記開口は、前記第2導体エレメントに包囲されており、
前記第1導体エレメントと前記線路部は、マイクロストリップラインを構成する、
ことを特徴とする構造体。 - 前記導体パターンは、周期的に配置された複数の前記第2導体エレメントを有し、
前記第1導体エレメントは、それぞれ隣り合う前記第1導体エレメントと連続して配置され、
前記第2導体エレメントは、それぞれ隣り合う前記第2導体エレメントと離間して配置され、前記開口と前記線路部を前記第1導体エレメントに対応して備える、
ことを特徴とする請求項1に記載の構造体。 - 前記導体パターンは、周期的に配置された複数の前記第2導体エレメントを有し、
前記第1導体エレメントは、それぞれ隣り合う前記第1導体エレメントと離間して配置され、
前記第2導体エレメントは、それぞれ隣り合う前記第2導体エレメントと連続しており、前記開口と前記線路部を前記第1導体エレメントに対応して備える、
ことを特徴とする請求項1に記載の構造体。 - 少なくとも一つ以上の第3導体エレメントと、前記第2導体エレメントと前記第3導体エレメントとの間に容量を生じさせる第2媒体と、を更に備え、
前記第3導体エレメントは、前記第2媒体を介し、少なくとも2以上の前記第2導体エレメントにわたって対向する、
ことを特徴とする請求項2に記載の構造体。 - 少なくとも一つ以上の第3導体エレメントと、前記第1導体エレメントと前記第3導体エレメントとの間に容量を生じさせる第3媒体と、を更に備え、
前記第3導体エレメントは、前記第3媒体を介し、少なくとも2以上の前記第1導体エレメントにわたって対向する、
ことを特徴とする請求項3に記載の構造体。 - 前記線路部と、前記開口と、前記第2導体エレメントと、該線路部又は該第2導体エレメントと対向する部分の前記第1導体エレメントとを有する単位セルが、一次元配列されている、
ことを特徴とする請求項2乃至5のいずれか1項に記載の構造体。 - 前記線路部と、前記開口と、前記第2導体エレメントと、該線路部又は該第2導体エレメントと対向する部分の前記第1導体エレメントとを有する単位セルが、二次元配列されている、
ことを特徴とする請求項2乃至5のいずれか1項に記載の構造体。 - 前記線路部の線路長が、複数の前記線路部で略同一である、
ことを特徴とする請求項2乃至7のいずれか1項に記載の構造体。 - 前記線路部が前記第2導体エレメントと接続する接続部は、前記導体パターンにおいて周期的に配置されている、
ことを特徴とする請求項2乃至8のいずれか1項に記載の構造体。 - 前記線路部の形状及び寸法が複数の前記線路部で略同一であり、前記開口の形状及び寸法が前記導体パターン内で略同一である
ことを特徴とする請求項2乃至9のいずれか1項に記載の構造体。 - 前記線路部が、前記第2導体エレメントと同一材料からなり、該第2導体エレメントと一体のものである、
ことを特徴とする請求項1乃至10のいずれか1項に記載の構造体。 - 前記線路部は、幅が略均一な帯形状である、
ことを特徴とする請求項1乃至11のいずれか1項に記載の構造体。 - 前記線路部の形状が、略直線形状である、
ことを特徴とする請求項1乃至12のいずれか1項に記載の構造体。 - 前記線路部の形状が、略折れ線形状である、
ことを特徴とする請求項1乃至12のいずれか1項に記載の構造体。 - 前記線路部の形状が、ミアンダ形状、ループ形状、又はスパイラル形状である、
ことを特徴とする請求項1乃至12のいずれか1項に記載の構造体。 - 前記線路部は、互いに長さが異なる複数の分岐線を含む、
ことを特徴とする請求項1乃至12のいずれか1項に記載の構造体。 - 前記開口における前記第2導体エレメント側の周形状が略多角形である、
ことを特徴とする請求項1乃至16のいずれか1項に記載の構造体。 - 構造体と、給電部と、を備えるアンテナであって、
前記構造体は、
少なくとも一つ以上の第1導体エレメントと、前記第1導体エレメントに対向する少なくとも一つ以上の第2導体エレメントを有する導体パターンと、前記第1導体エレメントと前記第2導体エレメントとの間に容量を生じさせる第1媒体と、を備え、
前記第1導体エレメントと前記導体パターンは、前記第1媒体を介して対向し、
前記第2導体エレメントは、開放端を有する線路部を備え、前記線路部を部分的に囲む開口を有し、
前記線路部は、前記第2導体エレメントと連続しており、
前記開口は、前記第2導体エレメントに包囲されており、
前記給電部は、該構造体の前記第1導体エレメント又は前記導体パターンと電気的に接続する、
ことを特徴とするアンテナ。 - 前記構造体の前記第1導体エレメント又は前記導体パターンに近接し対向して配置された電磁波放射面を有するアンテナエレメントと、
前記アンテナエレメントと電気的に接続する給電部と、を更に備え、
前記構造体により反射板が構成されている、
ことを特徴とする請求項18に記載のアンテナ。 - 構造体を備えるプリント基板であって、
前記構造体は、
少なくとも一つ以上の第1導体エレメントと、前記第1導体エレメントに対向する少なくとも一つ以上の第2導体エレメントを有する導体パターンと、前記第1導体エレメントと前記第2導体エレメントとの間に容量を生じさせる第1媒体と、を備え、
前記第1導体エレメントと前記導体パターンは、前記第1媒体を介して対向し、
前記第2導体エレメントは、開放端を有する線路部を備え、前記線路部を部分的に囲む開口を有し、
前記線路部は、前記第2導体エレメントと連続しており、
前記開口は、前記第2導体エレメントに包囲されており、
前記第1導体エレメントと前記線路部は、マイクロストリップラインを構成する、
ことを特徴とするプリント基板。 - 前記構造体により反射板が構成される、
ことを特徴とする請求項20に記載のプリント基板。 - 前記プリント基板に複数のデバイスが設けられており、前記デバイス間における電磁波の伝播経路の少なくとも1つを遮って、前記構造体が設けられている、
ことを特徴とする請求項21に記載のプリント基板。 - 構造体を備える伝送線路導波管変換器であって、
前記構造体は、
少なくとも一つ以上の第1導体エレメントと、前記第1導体エレメントに対向する少なくとも一つ以上の第2導体エレメントを有する導体パターンと、前記第1導体エレメントと前記第2導体エレメントとの間に容量を生じさせる第1媒体と、を備え、
前記第1導体エレメントと前記導体パターンは、前記第1媒体を介して対向し、
前記第2導体エレメントは、開放端を有する線路部を備え、前記線路部を部分的に囲む開口を有し、
前記線路部は、前記第2導体エレメントと連続しており、
前記開口は、前記第2導体エレメントに包囲されており、
前記第1導体エレメントと前記線路部は、マイクロストリップラインを構成する、
ことを特徴とする伝送線路導波管変換器。 - 構造体と、給電部と、を備えるアンテナをアレイ要素として、複数のアレイ要素を同一平面に配置して構成されるアレイアンテナであって、
前記構造体は、
少なくとも一つ以上の第1導体エレメントと、前記第1導体エレメントに対向する少なくとも一つ以上の第2導体エレメントを有する導体パターンと、前記第1導体エレメントと前記第2導体エレメントとの間に容量を生じさせる第1媒体と、を備え、
前記第1導体エレメントと前記導体パターンは、前記第1媒体を介して対向し、
前記第2導体エレメントは、開放端を有する線路部を備え、前記線路部を部分的に囲む開口を有し、
前記線路部は、前記第2導体エレメントと連続しており、
前記開口は、前記第2導体エレメントに包囲されており、
前記給電部は、該構造体の前記第1導体エレメント又は前記導体パターンと電気的に接続する、
ことを特徴とするアレイアンテナ。 - 構造体と給電部とを有するアンテナと、該アンテナと接続する送信機又は受信機の少なくとも一方と、を備え、
前記構造体は、
少なくとも一つ以上の第1導体エレメントと、前記第1導体エレメントに対向する少なくとも一つ以上の第2導体エレメントを有する導体パターンと、前記第1導体エレメントと前記第2導体エレメントとの間に容量を生じさせる第1媒体と、を備え、
前記第1導体エレメントと前記導体パターンは、前記第1媒体を介して対向し、
前記第2導体エレメントは、開放端を有する線路部を備え、前記線路部を部分的に囲む開口を有し、
前記線路部は、前記第2導体エレメントと連続しており、
前記開口は、前記第2導体エレメントに包囲されており、
前記給電部は、該構造体の前記第1導体エレメント又は前記導体パターンと電気的に接続する、
ことを特徴とする電子装置。 - 請求項1~17のいずれか一項に記載の構造体、請求項18又は19に記載のアンテナ、請求項20~22のいずれか一項に記載のプリント基板、請求項23に記載の伝送線路導波管変換器、及び請求項24に記載のアレイアンテナの少なくとも1つを備えることを特徴とする電子装置。
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